CN107801363A - 一种电磁屏蔽柔性板 - Google Patents
一种电磁屏蔽柔性板 Download PDFInfo
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- CN107801363A CN107801363A CN201610743539.5A CN201610743539A CN107801363A CN 107801363 A CN107801363 A CN 107801363A CN 201610743539 A CN201610743539 A CN 201610743539A CN 107801363 A CN107801363 A CN 107801363A
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- layer
- flexible board
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
本申请公开了一种电磁屏蔽柔性板,其包括:基材主体;设置于基材主体的铜箔层;覆盖于铜箔层的盖膜层;以及设置于盖膜层的屏蔽膜层,屏蔽膜层两端利用钢片压合至盖膜层;以及插扣屏蔽膜层两端的有机玻璃;其中,屏蔽膜层包括离型膜、金属薄膜、绝缘薄膜、保护膜、以及设置于离型膜与金属薄膜之间的导电胶,导电胶粘合离型膜与金属薄膜。本发明结构简单,利用屏蔽膜层配合柔性板实现屏蔽干扰功能;同时利用钢片稳定加固,加强机械强度,有机玻璃也可以保护柔性板两端。
Description
技术领域
本申请属于柔性电路板技术领域,具体地说,涉及一种电磁屏蔽柔性板。
背景技术
目前柔性电路板 (Flexible Printed Circuit,FPC) 多采用以下三种方式达到屏蔽电磁干扰的目的:银浆印刷、真空镀电磁屏蔽膜和外层压合单面覆铜箔的结构方式。电磁屏蔽膜,简称电磁膜,是一种防电磁干扰的屏蔽材料,对于 FPC 有很强的保护作用,具有高易曲性、高耐旱性、电磁屏蔽性。在弯曲半径要求极为严格的条件下能发挥卓越的特性,适用于数码相机模块,液晶驱动电路的FPC和COF(Chip On Film,覆晶薄膜 ) 产品。传统电磁屏蔽膜贴覆在柔性电路板上时,由于柔性电路板本身空间较小,与电磁屏蔽膜相粘容易脱落,且两者配合起来,机械强度大大下降,容易损坏,另外柔性板两端排线处通常在包装时容易磨损。
发明内容
有鉴于此,本申请所要解决的技术问题是提供了一种电磁屏蔽柔性板,通过利用钢片压合屏蔽膜层,加强柔性板的机械强度,避免信号干扰的问题。
为了解决上述技术问题,本申请公开了一种电磁屏蔽柔性板,其包括:基材主体;设置于基材主体的铜箔层;覆盖于铜箔层的盖膜层;以及设置于盖膜层的屏蔽膜层,屏蔽膜层两端利用钢片压合至盖膜层;以及插扣屏蔽膜层两端的有机玻璃;其中,屏蔽膜层包括离型膜、金属薄膜、绝缘薄膜、保护膜、以及设置于离型膜与金属薄膜之间的导电胶,导电胶粘合离型膜与金属薄膜。
根据本发明的一实施方式,还包括设置于铜箔层的镍镀层与金镀层。
根据本发明的一实施方式,其中上述镍镀层厚度为2~5微米,金镀层厚度大于0.03微米。
根据本发明的一实施方式,其中上述基材主体厚度为3~30微米。
与现有技术相比,本申请可以获得包括以下技术效果:
1)结构简单,利用屏蔽膜层配合柔性板实现屏蔽干扰功能。
2)利用钢片稳定加固,加强机械强度,同时有机玻璃可以保护柔性板两端。
当然,实施本申请的任一产品必不一定需要同时达到以上所述的所有技术效果。
附图说明
此处所说明的附图用来提供对本申请的进一步理解,构成本申请的一部分,本申请的示意性实施例及其说明用于解释本申请,并不构成对本申请的不当限定。在附图中:
图1是本申请实施例的电磁屏蔽柔性板的示意图;
图2是图1的屏蔽膜层示意图。
附图标记
基材主体10,铜箔层20,盖膜层30,屏蔽膜层40,离型膜41,金属薄膜42,绝缘薄膜43,保护膜44,导电胶45,钢片50,有机玻璃60,镍镀层70,金镀层80。
具体实施方式
以下将配合附图及实施例来详细说明本申请的实施方式,藉此对本申请如何应用技术手段来解决技术问题并达成技术功效的实现过程能充分理解并据以实施。
请一并参考图1与图2,图1是本申请实施例的电磁屏蔽柔性板示意图;图2是图1的屏蔽膜层40示意图。如图所示,一种电磁屏蔽柔性板包括基材主体10;设置于基材主体10的铜箔层20;覆盖于铜箔层20的盖膜层30;以及设置于盖膜层30的屏蔽膜层40,屏蔽膜层40两端利用钢片50压合至盖膜层30;以及插扣屏蔽膜层40两端的有机玻璃60;其中,屏蔽膜层40包括离型膜41、金属薄膜42、绝缘薄膜43、保护膜44、以及设置于离型膜41与金属薄膜42之间的导电胶45,导电胶45粘合离型膜41与金属薄膜42。在本发明一实施方式中,通过设置屏蔽膜层40不仅可以有效防止电磁信号干扰,保证柔性板的正常使用;而且由于柔性电路板本身空间较小,与屏蔽膜层40相粘容易脱落,且两者配合起来,机械强度大大下降,容易损坏,因此,使用钢片50压合,达到补强作用,既保证了屏蔽膜层40的稳固粘结,又适当加强了基材主体10的机械强度,增加使用寿命。此外利用有机玻璃60插扣于柔性板两端,大大实现端部的有效保护。
请继续参考图1,本发明还包括设置于铜箔层20的镍镀层70与金镀层80,是以防止氧化,提高使用寿命,防止损坏。值得一提的是,本发明经过试验得到,将镍镀层70厚度设置为2~5微米,金镀层80厚度大于0.03微米,不仅保证了柔性板的轻柔,而且起到的防氧化作用也较为优秀。另外,基材主体10厚度为3~30微米保证客户需求,达到电子元件使用强度,适用范围广。
上述说明示出并描述了本发明的若干优选实施例,但如前所述,应当理解本发明并非局限于本文所披露的形式,不应看作是对其他实施例的排除,而可用于各种其他组合、修改和环境,并能够在本文所述发明构想范围内,通过上述教导或相关领域的技术或知识进行改动。而本领域人员所进行的改动和变化不脱离本发明的精神和范围,则都应在发明所附权利要求的保护范围内。
Claims (4)
1.一种电磁屏蔽柔性板,其特征在于,包括:
基材主体;
设置于所述基材主体的铜箔层;
覆盖于所述铜箔层的盖膜层;
设置于所述盖膜层的屏蔽膜层,所述屏蔽膜层两端利用钢片压合至所述盖膜层;以及
插扣所述屏蔽膜层两端的有机玻璃;
其中,所述屏蔽膜层包括离型膜、金属薄膜、绝缘薄膜、保护膜、以及设置于所述离型膜与所述金属薄膜之间的导电胶,所述导电胶粘合所述离型膜与所述金属薄膜。
2.根据权利要求1所述的电磁屏蔽柔性板,其特征在于,还包括设置于所述铜箔层的镍镀层与金镀层。
3.根据权利要求2所述的电磁屏蔽柔性板,其特征在于,其中所述镍镀层厚度为2~5微米,所述金镀层厚度大于0.03微米。
4.根据权利要求1所述的电磁屏蔽柔性板,其特征在于,其中所述基材主体厚度为3~30微米。
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Cited By (1)
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CN108377609A (zh) * | 2018-04-25 | 2018-08-07 | 维沃移动通信有限公司 | 一种屏蔽膜、柔性电路板组件及移动终端 |
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CN108377609A (zh) * | 2018-04-25 | 2018-08-07 | 维沃移动通信有限公司 | 一种屏蔽膜、柔性电路板组件及移动终端 |
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