CN107785505A - Display panel and its manufacture method, display device - Google Patents
Display panel and its manufacture method, display device Download PDFInfo
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- CN107785505A CN107785505A CN201711041657.2A CN201711041657A CN107785505A CN 107785505 A CN107785505 A CN 107785505A CN 201711041657 A CN201711041657 A CN 201711041657A CN 107785505 A CN107785505 A CN 107785505A
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- 238000000034 method Methods 0.000 title claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 162
- 238000005520 cutting process Methods 0.000 claims abstract description 74
- 238000005538 encapsulation Methods 0.000 claims abstract description 51
- 239000010410 layer Substances 0.000 claims description 266
- 239000012044 organic layer Substances 0.000 claims description 46
- 238000000926 separation method Methods 0.000 claims description 30
- 230000008569 process Effects 0.000 claims description 23
- 238000002955 isolation Methods 0.000 claims description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 11
- 238000007641 inkjet printing Methods 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 8
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 238000003698 laser cutting Methods 0.000 claims description 5
- 239000002096 quantum dot Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 13
- 238000004806 packaging method and process Methods 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 229910004205 SiNX Inorganic materials 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention discloses a kind of display panel and its manufacture method, display device, belongs to display technology field.This method includes：Encapsulating structure layer is formed on display master blank, obtains panel motherboard, encapsulating structure layer includes at least one encapsulation film layer, the surface of at least one encapsulation film layer covering display master blank；Along the line of cut of panel motherboard cutting groove is formed on encapsulating structure layer；Isolated material is filled in cutting groove, the flexibility of isolated material is more than the flexibility of the encapsulation film layer contacted with isolated material；Along line of cut, counter plate motherboard is cut from isolated material, obtains display panel.The present invention helps to solve the problems, such as that the packaging effect of encapsulating structure is poor, improves the packaging effect of encapsulating structure.The present invention is used for display panel and manufactured.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of display panel and its manufacture method, display device.
Background technology
Organic Light Emitting Diode (English：Organic Light-Emitting Diode；Referred to as：OLED) display panel has
Have the advantages that high brightness, high-contrast, full visual angle and can Flexible Displays, be widely used in show industry.OLED display panel bag
Display base plate and the encapsulating structure being arranged on display base plate are included, encapsulating structure is used to enter the OLED on display base plate
Row encapsulation, the composition in air is avoided to corrode OLED.
OLED display panel be by oled panel motherboard carry out cut formation display panel, oled panel motherboard bag
The encapsulating structure layer for including display master blank and being arranged on display master blank, display master blank have multiple viewing areas, each display
Be provided with OLED in region, encapsulating structure layer include with multiple viewing areas multiple encapsulating structures correspondingly, each
Encapsulating structure is used to be packaged the OLED in corresponding viewing area, and each encapsulating structure includes what superposition was set
Inorganic layer, organic layer and inorganic layer.
But because the outermost film layer of encapsulating structure is inorganic layer, the quality of inorganic layer is more crisp, female to oled panel
During plate is cut and carried the OLED display panel that cutting is formed, easily cracked on inorganic layer, and crackle
Extended readily along a direction so that encapsulating structure is difficult to the effective encapsulation of OLED, therefore, the encapsulation effect of encapsulating structure
Fruit is poor.
The content of the invention
The present invention provides a kind of display panel and its manufacture method, display device, can solve the encapsulation effect of encapsulating structure
The problem of fruit is poor.Technical scheme is as follows：
First aspect, there is provided a kind of manufacture method of display panel, methods described include：
Encapsulating structure layer is formed on display master blank, obtains panel motherboard, the encapsulating structure layer includes at least one envelope
Film layer is filled, at least one encapsulation film layer covers the surface of the display master blank；
Along the line of cut of the panel motherboard cutting groove is formed on the encapsulating structure layer；
Isolated material is filled in the cutting groove, the flexibility of the isolated material is more than what is contacted with the isolated material
Encapsulate the flexibility of film layer；
The panel motherboard is cut from the isolated material along the line of cut, obtains display panel.
Alternatively, encapsulating structure layer is formed on display master blank, after obtaining panel motherboard, methods described also includes：
Form protection seam on the encapsulating structure layer, the protection seam positioned at the panel motherboard viewing area and the line of cut it
Between, and the depth direction of the protection seam is vertical with the surface of the encapsulating structure layer.
Alternatively, formed on the encapsulating structure layer after protection seam, methods described also includes：In the protection seam
Fill isolated material.
Alternatively, the line of cut along the panel motherboard forms cutting groove on the encapsulating structure layer, including：Adopt
With line of cut of the etching technics along the panel motherboard cutting groove is formed on the encapsulating structure layer；
Described formed on the encapsulating structure layer protects seam, including：Using etching technics on the encapsulating structure layer
Form protection seam.
Alternatively, it is described to fill isolated material in the cutting groove, including：Using isolated material in the panel motherboard
Upper formation separation layer, to fill the isolated material in the cutting groove.
Alternatively, the isolated material is polyimide material or acrylic material.
Alternatively, the panel motherboard has non-display area and the viewing area,
The isolated material is polyimide material, and the separation layer includes the isolation being covered on the non-display area
Region；
The isolated material is acrylic material, and the separation layer includes the isolated area being covered on the non-display area
Domain, or, the separation layer covers the surface of the panel motherboard.
Alternatively, it is described that the panel motherboard is cut from the isolated material along the line of cut, including：Adopt
From the isolated material panel motherboard is cut along the line of cut with laser cutting parameter.
Alternatively, at least one encapsulation film layer includes the inorganic layer, organic layer and the inorganic layer that are sequentially overlapped, it is described
Encapsulating structure layer is formed on display master blank, including：
Inorganic layer is formed on the display master blank using chemical vapor deposition method；
Using InkJet printing processes organic layer is formed on the display master blank formed with the inorganic layer；
Inorganic layer is formed on the display master blank formed with the organic layer using chemical vapor deposition method, obtained described
Encapsulating structure layer.
Second aspect, there is provided what a kind of method using described in any optional mode of first aspect or first aspect manufactured
Display panel, the display panel include encapsulating structure, and the encapsulating structure includes at least one encapsulation film layer, and described at least one
The outside of individual encapsulation film layer has isolated material, and the flexibility of the isolated material is more than the encapsulating film contacted with the isolated material
The flexibility of layer.
Alternatively, the neighboring area of the encapsulating structure be provided with protection seam, it is described protection seam depth direction with it is described
The surface of encapsulating structure is vertical, and the orthographic projection of the neighboring area of the encapsulating structure on said display panel is located at the display
In the non-display area of panel.
Alternatively, it is filled with isolated material in the protection seam.
Alternatively, the display panel also includes display base plate, and display device, the envelope are provided with the display base plate
Assembling structure is used to be packaged the display device.
Alternatively, the display device is organic light emitting diode device or light emitting diode with quantum dots device.
The third aspect, there is provided a kind of display device, the display device include：Second aspect or any of second aspect can
Select the display panel that mode is provided.
The beneficial effect that technical scheme provided by the invention is brought is：
Display panel provided by the invention and its manufacture method, display device, tied along the line of cut of panel motherboard in encapsulation
Cutting groove is formed on structure layer, and isolated material is filled in cutting groove, counter plate motherboard is carried out from isolated material along line of cut
Cutting obtains display panel, because the flexibility of isolated material is more than the flexibility of the encapsulation film layer contacted with isolated material, the isolation
Material can avoid during cutting panel motherboard, and carrying display panel, encapsulating and cracking in film layer, therefore,
Help to solve the problems, such as that the packaging effect of encapsulating structure is poor, improve packaging effect.
It should be appreciated that the general description and following detailed description of the above are only exemplary, this can not be limited
Invention.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
Fig. 1 is a kind of method flow diagram of the manufacture method of display panel provided in an embodiment of the present invention；
Fig. 2 is the method flow diagram of the manufacture method of another display panel provided in an embodiment of the present invention；
Fig. 3 is a kind of top view of display master blank provided in an embodiment of the present invention；
Fig. 4 is a kind of profile of display master blank provided in an embodiment of the present invention；
Fig. 5 is a kind of method flow diagram that encapsulating structure layer is formed on display master blank provided in an embodiment of the present invention；
Fig. 6 is a kind of top view formed on display master blank after inorganic layer provided in an embodiment of the present invention；
Fig. 7 is a kind of profile formed on display master blank after inorganic layer provided in an embodiment of the present invention；
Fig. 8 is a kind of bowing after formation organic layer on the display master blank for forming inorganic layer provided in an embodiment of the present invention
View；
Fig. 9 is a kind of cuing open after formation organic layer on the display master blank for forming inorganic layer provided in an embodiment of the present invention
Face figure；
Figure 10 be it is provided in an embodiment of the present invention it is a kind of on the display master blank formed with organic layer formed inorganic layer after
Top view；
Figure 11 be it is provided in an embodiment of the present invention it is a kind of on the display master blank formed with organic layer formed inorganic layer after
Profile；
Figure 12 is a kind of top view formed on encapsulating structure layer after cutting groove provided in an embodiment of the present invention；
Figure 13 is a kind of profile formed on encapsulating structure layer after cutting groove provided in an embodiment of the present invention；
Figure 14 is a kind of top view formed on encapsulating structure layer after protection seam provided in an embodiment of the present invention；
Figure 15 is a kind of profile formed on encapsulating structure layer after protection seam provided in an embodiment of the present invention；
Figure 16 is a kind of top view in cutting groove after filling isolated material provided in an embodiment of the present invention；
Figure 17 is a kind of profile in cutting groove after filling isolated material provided in an embodiment of the present invention；
Figure 18 is a kind of top view after isolated material is filled during protection is stitched provided in an embodiment of the present invention；
Figure 19 is a kind of profile after isolated material is filled during protection is stitched provided in an embodiment of the present invention；
Figure 20 is a kind of top view formed on panel motherboard after separation layer provided in an embodiment of the present invention；
Figure 21 is a kind of profile formed on panel motherboard after separation layer provided in an embodiment of the present invention；
Figure 22 is another top view formed on panel motherboard after separation layer provided in an embodiment of the present invention；
Figure 23 is another profile formed on panel motherboard after separation layer provided in an embodiment of the present invention；
Figure 24 is a kind of structural representation of display panel provided in an embodiment of the present invention；
Figure 25 is the structural representation of another display panel provided in an embodiment of the present invention；
Figure 26 is the structural representation of another display panel provided in an embodiment of the present invention.
Accompanying drawing herein is merged in specification and forms the part of this specification, shows the implementation for meeting the present invention
Example, and for explaining principle of the invention together with specification.
Embodiment
In order that the object, technical solutions and advantages of the present invention are clearer, the present invention is made below in conjunction with accompanying drawing into
One step it is described in detail, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole implementation
Example.Based on the embodiment in the present invention, what those of ordinary skill in the art were obtained under the premise of creative work is not made
All other embodiment, belongs to the scope of protection of the invention.
OLED display panel be by oled panel motherboard carry out cut formation display panel, oled panel motherboard bag
The encapsulating structure layer for including display master blank and being arranged on display master blank, display master blank have multiple viewing areas, each display
Be provided with OLED in region, encapsulating structure layer include with multiple viewing areas multiple encapsulating structures correspondingly, each
Encapsulating structure is used to be packaged the OLED in corresponding viewing area, and each encapsulating structure includes what superposition was set
Inorganic layer, organic layer and inorganic layer.
At present, in the manufacturing process of OLED display panel, first using chemical vapor deposition (English：Chemical
Vapor Deposition；Referred to as：CVD) technique is formed and each viewing area in multiple viewing areas on display master blank
Corresponding inorganic layer, make in the OLED that inorganic layer corresponding with each viewing area is covered in each viewing area,
Then using inkjet printing (English：Ink-Jet Printing；Referred to as：IJP) technique is forming the display master blank of inorganic layer
Upper formation organic layer, finally formed again using CVD techniques on the display master blank formed with organic layer and each viewing area pair
The inorganic layer answered, inorganic layer corresponding with each viewing area is set to be covered in corresponding to each viewing area on organic layer, from
And encapsulating structure layer is formed, oled panel motherboard is obtained, then oled panel motherboard is cut to obtain OLED display panel.
Wherein, when forming inorganic layer using CVD techniques, mask plate (English can be set on display master blank：Mask), mask plate is made
Open area and the viewing area of display master blank correspond, inorganic material then is deposited from the upper direction display master blank of mask plate
Material, inorganic material are deposited in the OLED of each viewing area by the open area of mask plate and form inorganic layer.
But in such scheme, on the one hand, the outermost film layer of encapsulating structure layer is inorganic layer, to oled panel
During motherboard is cut and carried the OLED display panel that cutting is formed, cutting tool and manipulator may touch
Encounter inorganic layer, because the quality of inorganic layer is more crisp, therefore touching easily causes to crack on inorganic layer, causes encapsulating structure
Package failure；On the other hand, during inorganic layer is formed using CVD techniques, by mask plate precision and vapor deposition accuracy
Influence, it is necessary to blanked in advance at the edge of each viewing area (English：Margin) region compensates evaporation deviation and evaporation
Shade (English：Shadow), cause the OLED display panel frame that is finally cut to create wider, it is difficult to realize that narrow frame is shown,
And Mask cost is high, and manufacturing the OLED display panel of different size needs to use different Mask, causes OLED display surfaces
The manufacturing cost of plate is higher.
Display panel provided in an embodiment of the present invention and its manufacture method, display device, the system of display panel can be reduced
This is caused, improves the packaging effect of encapsulating structure.The detailed protocol of the present invention refer to the description of following each embodiments.
Fig. 1 is refer to, it illustrates a kind of method flow of the manufacture method of display panel provided in an embodiment of the present invention
Figure, the manufacture method of the display panel can be used for manufacturing OLED display panel or light emitting diode with quantum dots (English：
Quantum Dot Light Emitting Diodes；Referred to as：QLED) display panel.Referring to Fig. 1, the manufacture of the display panel
Method includes：
Step 101, encapsulating structure layer is formed on display master blank, obtain panel motherboard, encapsulating structure layer includes at least one
Individual encapsulation film layer, the surface of at least one encapsulation film layer covering display master blank.
Step 102, along the line of cut of panel motherboard form cutting groove on encapsulating structure layer.
Step 103, isolated material is filled in cutting groove, the flexibility of isolated material is more than the encapsulation contacted with isolated material
The flexibility of film layer.
Step 104, along line of cut, counter plate motherboard is cut from isolated material, obtains display panel.
In summary, display panel manufacture method provided in an embodiment of the present invention, encapsulated along the line of cut of panel motherboard
Cutting groove is formed on structure sheaf, and isolated material is filled in cutting groove, counter plate motherboard enters from isolated material along line of cut
Row cutting obtains display panel, because the flexibility of isolated material is more than the flexibility of encapsulation film layer contact with isolated material, this every
Encapsulation film layer isolation can be avoided cutting and handling process from causing to crack in encapsulation film layer, help to solve from material
The problem of certainly packaging effect of encapsulating structure is poor, improve the packaging effect of encapsulating structure.Further, since encapsulation film layer covering is aobvious
Show the surface of motherboard, therefore the forming process for encapsulating film layer, without reserving white space, is easy to reality without using mask plate
The narrow frame of existing display panel is shown, and reduces the manufacturing cost of display panel.
Alternatively, after step 101, this method also includes：
Protection seam is formed on encapsulating structure layer, protection is stitched between the viewing area of panel motherboard and line of cut, and
Protect the depth direction of seam vertical with the surface of encapsulating structure layer.
Alternatively, formed on encapsulating structure layer after protection seam, this method also includes：
Isolated material is filled in protection is stitched.
Alternatively, cutting groove is formed on encapsulating structure layer along the line of cut of panel motherboard, including：
Cutting groove is formed on encapsulating structure layer using line of cut of the etching technics along panel motherboard；
Protection seam is formed on encapsulating structure layer, including：
Protection seam is formed on encapsulating structure layer using etching technics.
Alternatively, isolated material is filled in cutting groove, including：
Separation layer is formed on panel motherboard using isolated material, to fill isolated material in cutting groove.
Alternatively, isolated material is polyimide material or acrylic material.
Alternatively, panel motherboard has non-display area and viewing area,
Isolated material is polyimide material, and separation layer includes the area of isolation being covered on non-display area；
Isolated material is acrylic material, and separation layer includes the area of isolation being covered on non-display area, or, isolation
The surface of layer cover plate motherboard.
Alternatively, step 104 can include：Using laser cutting parameter along line of cut the counter plate motherboard from isolated material
Cut.
Alternatively, at least one encapsulation film layer includes inorganic layer, organic layer and the inorganic layer being sequentially overlapped, and step 101 can
With including：
Inorganic layer is formed on display master blank using chemical vapor deposition method；
Using InkJet printing processes organic layer is formed on the display master blank for forming inorganic layer；
Inorganic layer is formed on the display master blank formed with organic layer using chemical vapor deposition method, obtains encapsulating structure
Layer.
Above-mentioned all optional technical schemes, any combination can be used to form the alternative embodiment of the present invention, herein no longer
Repeat one by one.
In summary, display panel manufacture method provided in an embodiment of the present invention, encapsulated along the line of cut of panel motherboard
Cutting groove is formed on structure sheaf, and isolated material is filled in cutting groove, counter plate motherboard enters from isolated material along line of cut
Row cutting obtains display panel, because the flexibility of isolated material is more than the flexibility of encapsulation film layer contact with isolated material, this every
Encapsulation film layer isolation can be avoided cutting and handling process from causing to crack in encapsulation film layer, help to solve from material
The problem of certainly packaging effect of encapsulating structure is poor, improve the packaging effect of encapsulating structure.Further, since encapsulation film layer covering is aobvious
Show the surface of motherboard, therefore the forming process for encapsulating film layer, without reserving white space, is easy to reality without using mask plate
The narrow frame of existing display panel is shown, and reduces the manufacturing cost of display panel.
Fig. 2 is refer to, it illustrates the method stream of the manufacture method of another display panel provided in an embodiment of the present invention
Cheng Tu, the manufacture method of the display panel can be used for manufacturing OLED display panel QLED display panels.Referring to Fig. 2, the display
The manufacture method of panel includes：
Step 201, encapsulating structure layer is formed on display master blank, obtain panel motherboard, encapsulating structure layer includes at least one
Individual encapsulation film layer, the surface of at least one encapsulation film layer covering display master blank.
Fig. 3 is a kind of top view of display master blank 01 provided in an embodiment of the present invention, and Fig. 4 is the display master blank shown in Fig. 3
The profile at 01 A-A positions, referring to Fig. 3 and Fig. 4, display master blank 01 has non-display area F and multiple viewing area (Fig. 3
With 4 in do not mark), be provided with display device 02 in each viewing area, the display device 02 can be OLED or
Also there is line of cut a, the line of cut a of display master blank 01 to be located on non-display area F for QLED devices, display master blank 01.Need
Bright, in practical application, display master blank 01 can include underlay substrate (being not shown in Fig. 3 and Fig. 4) and be arranged on lining
Barrier layer (English on substrate：It is not shown in barrier layer, Fig. 3 and Fig. 4), underlay substrate can be using glass
Glass, quartz or transparent resin etc. have rigid transparent substrate made of the leaded light of certain robustness and nonmetallic materials, or, lining
Substrate can be using polyimides (English：polyimide；Referred to as：) etc. PI the flexible base board that material makes.
In embodiments of the present invention, at least one encapsulation film layer of encapsulating structure layer can be inorganic including being sequentially overlapped
Layer, organic layer and inorganic layer, and inorganic layer can cover the surface of display master blank.Fig. 5 is refer to, it illustrates the present invention to implement
A kind of method flow diagram that encapsulating structure layer is formed on display master blank that example provides, referring to Fig. 5, this method includes：
Step 2011, inorganic layer is formed on display master blank using CVD techniques, inorganic layer covers the surface of display master blank.
Fig. 6 be it is provided in an embodiment of the present invention it is a kind of on display master blank 01 formed inorganic layer 031 after top view, Fig. 7
It is the profile at Fig. 6 A-A positions, referring to Fig. 6 and Fig. 7, inorganic layer 031 is covered in display master blank 01 and is provided with display device 02
Surface on, and inorganic layer 031 is structure as a whole.In other words, 031 whole face of inorganic layer be covered in display master blank 01 be provided with it is aobvious
On the surface for showing device 02.Wherein, the inorganic layer 031 can use SiNx (Chinese：Silicon nitride) or SiNO (Chinese：Nitrogen oxygen
SiClx) etc. inorganic material formed.It is alternatively possible to inorganic layer 031 is formed on display master blank 01 using CVD techniques, the present invention
In embodiment, CVD techniques for example can be plasma enhanced chemical vapor deposition method (English：Plasma Enhanced
Chemical Vapor Deposition；Referred to as：PECVD) technique.Illustratively, display master blank 01 can be arranged on deposit cavity
Room, then inputs SiNx gases to deposition chamber, and the SiNx gases spread in deposition chamber and are deposited on display master blank 01
Non-display area F on and display device 02 on formed inorganic layer 031.
Step 2012, using InkJet printing processes formed inorganic layer display master blank on form organic layer.
Fig. 8 be it is provided in an embodiment of the present invention it is a kind of formed inorganic layer 031 display master blank 01 on form organic layer
Top view after 032, Fig. 9 are the profiles at Fig. 8 A-A positions, and referring to Fig. 8 and Fig. 9, organic layer 032 is located at inorganic layer 031
On, and organic layer 032 is including multiple organic layer regions (are not marked in Fig. 8 and Fig. 9 correspondingly with multiple display devices 02
Go out), with each display device 02 corresponding to orthographic projection of the organic layer region on display master blank 01 by corresponding display device 02
Covering.Wherein, the organic layer 032 can be formed using acrylic material.It is alternatively possible to ink is formed using acrylic material
Juice, the prepared Chinese ink is then sprayed on inorganic layer 031 using InkJet printing processes, the prepared Chinese ink forms organic layer on inorganic layer 031
032。
Step 2013, inorganic layer is formed on the display master blank formed with organic layer using CVD techniques, inorganic layer covering should
Film layer below inorganic layer, obtain encapsulating structure layer.
Figure 10 is provided in an embodiment of the present invention a kind of to form inorganic layer on the display master blank 01 formed with organic layer 032
Top view after 033, Figure 11 are the profiles at Figure 10 A-A positions, referring to Figure 10 and Figure 11, the film layer of the lower section of inorganic layer 033
Including inorganic layer 031 and organic layer 032, inorganic layer 033 covers inorganic layer 031 and organic layer 032.In the embodiment of the present invention,
After forming inorganic layer 031, organic layer 032 and inorganic layer 033, encapsulating structure layer 03 is just obtained, has been formed on display master blank 01
After encapsulating structure layer 03, panel motherboard 0 has just been obtained.The forming process of the inorganic layer 033 may be referred to the formation of inorganic layer 031
Process, the embodiment of the present invention will not be repeated here.
It should be noted that the embodiment of the present invention is to include inorganic layer 031, organic layer 032 and nothing with encapsulating structure layer 03
Being illustrated exemplified by machine layer 033, in practical application, encapsulating structure layer can include multiple inorganic layers and multiple organic layers, and
Inorganic layer and organic layer are alternately superimposed, in encapsulating structure layer apart from display master blank recently and farthest film layer can be inorganic
Layer, the embodiment of the present invention are not construed as limiting to this.
It should also be noted that, in the embodiment of the present invention, because the inorganic layer of encapsulating structure layer 03 covers display master blank 01
Surface, so, the use of mask plate can be avoided, the edge without each viewing area in display master blank 01 is reserved
Margin regions, the narrow frame for the display panel for being easy to ultimately form are shown, and reduce the manufacturing cost of display panel, are improved
The reliability of display panel.
Step 202, along the line of cut of panel motherboard form cutting groove on encapsulating structure layer.
Figure 12 is that a kind of line of cut along panel motherboard 0 provided in an embodiment of the present invention is formed on encapsulating structure layer 03 and cut
The top view after groove G is cut, Figure 13 is the profile at Figure 12 A-A positions, in embodiments of the present invention, the cutting of panel motherboard 0
Line can be conllinear with the line of cut a of display master blank 01, therefore the line of cut a of the display master blank 01 that is to say cutting for panel motherboard 0
Secant, referring to Figure 12 and Figure 13, line of cut as of the cutting groove G along panel motherboard 0 is set.In embodiments of the present invention, cutting groove G
Encapsulating structure layer 03 can be penetrated, encapsulating structure layer 03 can not also be penetrated, the Figure 12 and Figure 13 penetrate encapsulation knot with cutting groove G
Illustrated exemplified by structure layer 03, in the Figure 12 and Figure 13, cutting groove G insertion inorganic layers 031 and inorganic layer 033, practical application
In, when the area of organic layer 032 is larger, cutting groove G can also penetrate organic layer 032.In embodiments of the present invention, can adopt
Cutting groove G is formed on encapsulating structure layer 03 with line of cut a of the etching technics along panel motherboard 0.It is alternatively possible to tied in encapsulation
One layer of photoresist is coated on structure layer 03, then photoresist is exposed using mask plate, photoresist is formed complete exposure region
And non-exposed area, complete exposure region is corresponding with the region of cutting groove G to be formed on encapsulating structure layer 03, and non-exposed area is tied with encapsulation
Other regions of structure layer 03 are corresponding, are handled afterwards using developing process, are removed the photoresist of complete exposure region, non-exposure
The photoresist in light area retains, and corresponding region of the complete exposure region on encapsulating structure layer 03 is performed etching afterwards to form cutting
Groove G, it is finally peeled away the photoresist of non-exposed area.In embodiments of the present invention, can according to actual conditions using dry etching or
Wet etching performs etching to encapsulating structure layer 03.In addition, the embodiment of the present invention is entered so that photoresist is positive photoresist as an example
Row explanation, in practical application, photoresist can also be negative photoresist, and the embodiment of the present invention will not be repeated here.
Step 203, protection seam is formed on encapsulating structure layer, protection seam is positioned at the viewing area of panel motherboard and line of cut
Between, and protect the depth direction of seam vertical with the surface of encapsulating structure layer.
Figure 14 is a kind of top view formed on encapsulating structure layer 03 after protection seam H provided in an embodiment of the present invention, is schemed
15 be the profile at Figure 14 A-A positions, and referring to Figure 14 and Figure 15, protection seam H is located at viewing area (Figure 14 of panel motherboard 0
And Figure 15 is not marked) between the line of cut a of panel motherboard 0, and (Figure 14 and Figure 15 are not marked protection seam H depth direction
Go out) it is vertical with the surface (Figure 14 and Figure 15 are not marked) of encapsulating structure layer 03.In embodiments of the present invention, protection seam H can be with
Encapsulating structure layer 03 is penetrated, for example, as shown in Figure 14 and Figure 15, protection seam H insertion inorganic layers 031 and inorganic layer 033, reality should
In, when the area of organic layer 032 is larger, protection seam H can also penetrate organic layer 032.In embodiments of the present invention, can be with
Protection seam H is formed on encapsulating structure layer 03 using etching technics.Detailed implementation process and above-mentioned formation cutting groove G process
Similar, the embodiment of the present invention will not be repeated here.
It should be noted that it is separate that the embodiment of the present invention, which is the process for stitching H with formation protection to form cutting groove G,
Process exemplified by illustrate, in practical application, cutting groove G and protection seam H can be formed simultaneously, be that is to say, can be passed through
Etching technics forms cutting groove G and protection seam H simultaneously, so as to which above-mentioned steps 202 and step 203 can be merged into a step
Suddenly, the embodiment of the present invention is not construed as limiting to this.
Step 204, isolated material is filled in cutting groove, the flexibility of isolated material is more than the encapsulation contacted with isolated material
The flexibility of film layer.
Figure 16 be it is provided in an embodiment of the present invention it is a kind of in cutting groove G fill isolated material 041 after top view, Figure 17
It is the profile at Figure 16 A-A positions, referring to Figure 16 and Figure 17, isolated material 041 is filled with cutting groove G, the isolated material
The 041 flexible flexibility that can be more than the encapsulation film layer contacted with the isolated material 041, as shown in Figure 16 and Figure 17, with isolating
The encapsulation film layer that material 041 contacts is inorganic layer 031 and inorganic layer 033, therefore the flexibility of the isolated material 041 is more than inorganic layer
031 flexibility, and more than the flexibility of inorganic layer 033.In embodiments of the present invention, the isolated material 041 can be PI materials or
Acrylic material.It is alternatively possible to isolated material 041 is filled in cutting groove G using InkJet printing processes.It is of course also possible to
Isolated material 041 is filled in cutting groove G using other techniques, the embodiment of the present invention is not construed as limiting to this.
Step 205, fill isolated material in protection is stitched.
Figure 18 be it is provided in an embodiment of the present invention it is a kind of protection stitch H in fill isolated material 042 after top view, Figure 19
It is the profile at Figure 18 A-A positions, referring to Figure 18 and Figure 19, isolated material 042 is filled with protection seam H.Of the invention real
Apply in example, isolated material 042 can be PI materials or acrylic material, and isolated material 042 can be with identical with isolated material 041
It is or different.It is alternatively possible to fill isolated material 042 in H is stitched in protection using InkJet printing processes.It is of course also possible to use
Other techniques fill isolated material 042 in H is stitched in protection, and the embodiment of the present invention is not construed as limiting to this.
It should be noted that the embodiment of the present invention is with the filling isolated material 041 in cutting groove G and in H is stitched in protection
The process of filling isolated material 042 is to illustrate exemplified by separate process, in practical application, when isolated material 041
With the phase of isolated material 042 it is also possible to fill isolated material in cutting groove G and protection seam H simultaneously, that is to say, above-mentioned step
Rapid 204 and step 205 can be merged into a step.
Alternatively, when above-mentioned steps 204 and step 205 merge into a step, isolated material is filled in cutting groove G
It can include：Separation layer is formed on panel motherboard 0 using isolated material, to fill isolated material in cutting groove G.Wherein,
During filling isolated material in cutting groove G, it can also be stitched to protection in H and fill isolated material.In embodiments of the present invention,
Isolated material can be PI materials or acrylic material, and panel motherboard 0 has non-display area and viewing area, panel motherboard 0
Viewing area it is corresponding with the viewing area of display master blank 01, the non-display area of panel motherboard 0 on display master blank 0 except display
Region outside region.When isolated material is PI materials, because PI materials are non-transparent material, therefore in order to avoid separation layer
To the influence for going out optical property of the display panel ultimately formed, separation layer can include open area and area of isolation, open region
Domain is corresponding with the viewing area of panel motherboard 0, and area of isolation is covered on the non-display area of panel motherboard 0.Work as isolated material
For acrylic material when, separation layer can include open area and area of isolation, open area and the viewing area of panel motherboard 0
Corresponding, area of isolation is covered on the non-display area of panel motherboard 0, or, the surface of separation layer cover plate motherboard 0, change
For word, separation layer is covered with the viewing area of panel motherboard 0 and non-display area.
Figure 20 be it is provided in an embodiment of the present invention it is a kind of on panel motherboard 0 formed separation layer 04 after top view, Figure 21
It is the profile at Figure 20 A-A positions, referring to Figure 20 and Figure 21, separation layer 04 includes open area (in Figure 20 and Figure 21 not
Mark) and area of isolation (not marked in Figure 20 and Figure 21), open area is corresponding with the viewing area of panel motherboard 0, isolation
Region overlay is filled with isolated material 041 on the non-display area of panel motherboard 0 in cutting groove G, filled in protection seam H
There is isolated material 042.Wherein, in Figure 20 and Figure 21, the formation material of separation layer 04 can be PI materials, or Ya Ke
Dead-wood material, and InkJet printing processes can be used to form separation layer 04.
Figure 22 is another top view formed on panel motherboard 0 after separation layer 04 provided in an embodiment of the present invention, is schemed
23 be the profile at Figure 22 A-A positions, referring to Figure 22 and Figure 23, the surface of the cover plate motherboard 0 of separation layer 04, and cutting groove
Isolated material 041 is filled with G, isolated material 042 is filled with protection seam H.In other words, 04 whole face of separation layer is covered in face
It on plate motherboard 0, that is to say, on the viewing area of panel motherboard 0 and be covered with separation layer 04 on non-display area.Wherein, exist
In the Figure 22 and Figure 23, the formation material of separation layer 04 is acrylic material.
Step 206, along line of cut, counter plate motherboard is cut from isolated material, obtains display panel.
In embodiments of the present invention, line of cut of the laser cutting parameter along display master blank can be used right from isolated material
Panel motherboard is cut to obtain display panel, and the cutting tool commonly used in laser cutting parameter is laser.Alternatively, laser
Device can be CO2(carbon dioxide) laser, solid-state laser or excimer laser etc..
Figure 24 is the structural representation that obtained display panel is cut to the display master blank 0 shown in Figure 19, Tu25Shi
The structural representation of obtained display panel is cut to the display master blank 0 shown in Figure 21, Figure 26 is to aobvious shown in Figure 23
Show the structural representation for the display panel that motherboard 0, which is cut, to be obtained, any referring to Figure 24 to Figure 26, display panel includes：It is aobvious
Show substrate 011, the display device being arranged on display base plate 011 02, and be coated on the encapsulating structure in the outside of display device 02
(Figure 24 is not marked into Figure 26), encapsulating structure is used to be packaged display device 02, as shown in Figure 24 to Figure 26 is any,
The encapsulating structure includes at least one encapsulation film layer, and at least one encapsulation film layer includes inorganic layer 0311, organic layer 0321
With inorganic layer 0331, the outside of inorganic layer 0311 and inorganic layer 0331 has isolated material 041, and the neighboring area of encapsulating structure
It is provided with protection seam (Figure 24 is not marked into Figure 26), the orthographic projection position of the neighboring area of the encapsulating structure on a display panel
In in the non-display area of display panel, protecting, the depth direction of seam is vertical with the surface of encapsulating structure, and protects in seam and fill
There is isolated material 042.It should be noted that display base plate 011 is the part cut down from display master blank 01, inorganic layer
0311 is the part that is cut down from inorganic layer 031, and organic layer 0321 is the part cut down from organic layer 032, nothing
Machine layer 0331 is the part cut down from inorganic layer 033.
In the embodiment of the present invention, due to being filled with isolated material 041 in cutting groove, the isolated material 041 will can be cut
Instrument is isolated with inorganic layer, avoids cutting process from forming crackle on inorganic layer；Also, appoint in Figure 24 to Figure 26 that cutting is formed
In display panel shown in one, the edge of display panel is isolated from the outside by isolated material 041, avoids carrying the mistake of display panel
The inorganic layer of encapsulating structure is touched in journey to be caused to crack on inorganic layer, in addition, even if being cracked on inorganic layer, protection seam
Crackle can also be stopped, Crack prevention to close to display device 02 Directional Extension, also, protect seam in be filled with every
From material 042, the isolated material 042 can strengthen the mechanical strength of encapsulating structure.
It should be noted that the embodiment of the present invention figure 6 illustrates display device 02, and is being schemed for the ease of observation
8th, display device 02 and organic layer 032 are shown in Figure 10, Figure 12, Figure 14, Figure 16, Figure 18 and Figure 20, in practical application, by
It is covered in inorganic layer 031 on display device 02, and inorganic layer 033 is covered on organic layer 032, therefore, being in figure 6 can not
It was observed that display device 02, display can not be observed in Fig. 8, Figure 10, Figure 12, Figure 14, Figure 16, Figure 18 and Figure 20
Part 02 and organic layer 032.
It should also be noted that, the sequencing of the manufacture method step of display panel provided in an embodiment of the present invention can be with
Suitably adjusted, step according to circumstances can also accordingly be increased and decreased, for example, above-mentioned steps 202 and step 203 can merge
For a step, above-mentioned steps 204 and step 205 can be merged into a step；Or above-mentioned steps 203 and step 204
Order can overturn, any one skilled in the art the invention discloses technical scope in, can readily occur in
It the method for change, should all be included within the scope of the present invention, therefore repeat no more.
In summary, display panel manufacture method provided in an embodiment of the present invention, encapsulated along the line of cut of panel motherboard
Cutting groove is formed on structure sheaf, and isolated material is filled in cutting groove, counter plate motherboard enters from isolated material along line of cut
Row cutting obtains display panel, because the flexibility of isolated material is more than the flexibility of encapsulation film layer contact with isolated material, this every
Encapsulation film layer isolation can be avoided cutting and handling process from causing to crack in encapsulation film layer, help to solve from material
The problem of certainly packaging effect of encapsulating structure is poor, improve the packaging effect of encapsulating structure.Further, since encapsulation film layer covering is aobvious
Show the surface of motherboard, therefore the forming process for encapsulating film layer, without reserving white space, is easy to reality without using mask plate
The narrow frame of existing display panel is shown, and reduces the manufacturing cost of display panel.
The embodiment of the present invention additionally provides the display panel that a kind of method using shown in Fig. 1 or Fig. 2 manufactures, the display surface
Plate can include encapsulating structure, and encapsulating structure includes at least one encapsulation film layer, the outside of at least one encapsulation film layer have every
From material, the flexibility of the isolated material is more than the flexibility of the encapsulation film layer contacted with the isolated material.
Alternatively, the neighboring area of the encapsulating structure is provided with protection seam, protects the depth direction and encapsulating structure of seam
Surface is vertical, and protects in seam and be filled with isolated material, the orthographic projection of the neighboring area of the encapsulating structure on a display panel
In the non-display area of display panel.
In embodiments of the present invention, the display panel can be the display panel shown in Figure 24 to Figure 26 any.Referring to figure
24 to Figure 26 is any, and at least one encapsulation film layer of encapsulating structure includes the inorganic layer 0311, the and of organic layer 0321 that are sequentially overlapped
The outside of inorganic layer 0331, inorganic layer 0311 and inorganic layer 0331 all has isolated material 041, the flexibility of the isolated material 041
The flexibility of inorganic layer 0311 can be more than, and more than the flexibility of inorganic layer 0331, the neighboring area of encapsulating structure is provided with protection
Stitch (Figure 24 is not marked into Figure 26), isolated material 042 is filled with protection seam.
Further, as shown in Figure 24 to Figure 26 is any, the display panel also includes display base plate 011, display base plate 011
On be provided with display device 02, encapsulating structure is used to be packaged display device 02.In embodiments of the present invention, the display
Part 02 can be OLED or QLED devices, and when display device 02 is OLED, the display panel is that OLED is shown
Panel, for example, the display panel active matrix organic electroluminescence diode (English：Active Matrix Organic
Light Emitting Diode；Referred to as：AMOLED) display panel, when display device 02 is QLED devices, the display panel
For QLED display panels.
It should also be noted that, the embodiment of the present application is only that the structure of display panel is briefly described, show
The detailed construction of panel may be referred to the embodiment of the manufacture method of foregoing display panel, and the embodiment of the present invention is no longer superfluous herein
State.
The embodiment of the present invention additionally provides a kind of display device, and the display device can include display panel, the display surface
Plate can be the display panel shown in Figure 24 to Figure 26 any.Wherein, the display device can be mobile phone, tablet personal computer, TV
Any product or part with display function such as machine, display, notebook computer, DPF or navigator.
One of ordinary skill in the art will appreciate that hardware can be passed through by realizing all or part of step of above-described embodiment
To complete, by program the hardware of correlation can also be instructed to complete, described program can be stored in a kind of computer-readable
In storage medium, storage medium mentioned above can be read-only storage, disk or CD etc..
The foregoing is only the present invention alternative embodiment, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.
Claims (15)
1. a kind of manufacture method of display panel, it is characterised in that methods described includes：
Encapsulating structure layer is formed on display master blank, obtains panel motherboard, the encapsulating structure layer includes at least one encapsulating film
Layer, at least one encapsulation film layer cover the surface of the display master blank；
Along the line of cut of the panel motherboard cutting groove is formed on the encapsulating structure layer；
Isolated material is filled in the cutting groove, the flexibility of the isolated material is more than the encapsulation contacted with the isolated material
The flexibility of film layer；
The panel motherboard is cut from the isolated material along the line of cut, obtains display panel.
2. according to the method for claim 1, it is characterised in that encapsulating structure layer is formed on display master blank, obtains panel
After motherboard, methods described also includes：Protection seam is formed on the encapsulating structure layer, the protection seam is female positioned at the panel
Between the viewing area of plate and the line of cut, and the surface of the depth direction and the encapsulating structure layer of the protection seam is hung down
Directly.
3. according to the method for claim 2, it is characterised in that formed on the encapsulating structure layer after protection seam, institute
Stating method also includes：Isolated material is filled in the protection seam.
4. according to the method for claim 2, it is characterised in that
The line of cut along the panel motherboard forms cutting groove on the encapsulating structure layer, including：
Cutting groove is formed on the encapsulating structure layer using line of cut of the etching technics along the panel motherboard；
Described formed on the encapsulating structure layer protects seam, including：
Protection seam is formed on the encapsulating structure layer using etching technics.
5. method according to any one of claims 1 to 4, it is characterised in that the filling isolation material in the cutting groove
Material, including：Separation layer is formed on the panel motherboard using isolated material, to fill the isolation material in the cutting groove
Material.
6. according to the method for claim 5, it is characterised in that the isolated material is polyimide material or acrylic material
Material.
7. according to the method for claim 6, it is characterised in that the panel motherboard has non-display area and the display
Region,
The isolated material is polyimide material, and the separation layer includes the isolated area being covered on the non-display area
Domain；
The isolated material is acrylic material, and the separation layer includes the area of isolation being covered on the non-display area,
Or the separation layer covers the surface of the panel motherboard.
8. method according to any one of claims 1 to 4, it is characterised in that described along the line of cut from the isolation material
The panel motherboard is cut on material, including：Using laser cutting parameter along the line of cut from the isolated material
The panel motherboard is cut.
9. method according to any one of claims 1 to 4, it is characterised in that at least one encapsulation film layer is included successively
Inorganic layer, organic layer and the inorganic layer of superposition, the formation encapsulating structure layer on display master blank, including：
Inorganic layer is formed on the display master blank using chemical vapor deposition method；
Using InkJet printing processes organic layer is formed on the display master blank formed with the inorganic layer；
Inorganic layer is formed on the display master blank formed with the organic layer using chemical vapor deposition method, obtains the encapsulation
Structure sheaf.
A kind of 10. display panel manufactured using any described method of claim 1 to 9, it is characterised in that the display surface
Plate includes encapsulating structure, and the encapsulating structure includes at least one encapsulation film layer, the outside tool of at least one encapsulation film layer
There is isolated material, the flexibility of the isolated material is more than the flexibility of the encapsulation film layer contacted with the isolated material.
11. display panel according to claim 10, it is characterised in that the neighboring area of the encapsulating structure is provided with guarantor
Shield seam, the depth direction of the protection seam is vertical with the surface of the encapsulating structure, and the neighboring area of the encapsulating structure is in institute
The orthographic projection stated on display panel is located in the non-display area of the display panel.
12. display panel according to claim 11, it is characterised in that be filled with isolated material in the protection seam.
13. according to any described display panel of claim 10 to 12, it is characterised in that the display panel also includes display
Substrate, display device is provided with the display base plate, and the encapsulating structure is used to be packaged the display device.
14. display panel according to claim 13, it is characterised in that the display device is Organic Light Emitting Diode device
Part or light emitting diode with quantum dots device.
15. a kind of display device, it is characterised in that the display device includes：Any described display of claim 10 to 14
Panel.
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| CN201711041657.2A CN107785505B (en) | 2017-10-31 | 2017-10-31 | Display panel and its manufacturing method, display device |
| US16/033,640 US10510987B2 (en) | 2017-10-31 | 2018-07-12 | Display panel and manufacturing method therefor, and display device |
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| CN201711041657.2A CN107785505B (en) | 2017-10-31 | 2017-10-31 | Display panel and its manufacturing method, display device |
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| CN107785505B (en) | 2019-08-02 |
| US20190131569A1 (en) | 2019-05-02 |
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