CN107785505A - Display panel, manufacturing method of display panel and display device - Google Patents

Display panel, manufacturing method of display panel and display device Download PDF

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Publication number
CN107785505A
CN107785505A CN201711041657.2A CN201711041657A CN107785505A CN 107785505 A CN107785505 A CN 107785505A CN 201711041657 A CN201711041657 A CN 201711041657A CN 107785505 A CN107785505 A CN 107785505A
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layer
display
panel
package
material
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CN201711041657.2A
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CN107785505B (en
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马国强
王杨
孙阔
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/5253Protective coatings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3241Matrix-type displays
    • H01L27/3244Active matrix displays
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/5253Protective coatings
    • H01L51/5256Protective coatings having repetitive multilayer structures
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2251/00Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
    • H01L2251/50Organic light emitting devices
    • H01L2251/56Processes specially adapted for the manufacture or treatment of OLED
    • H01L2251/566Division of substrate, e.g. for manufacturing of OLED dsiplays

Abstract

The invention discloses a display panel, a manufacturing method of the display panel and a display device, and belongs to the technical field of display. The method comprises the steps that a packaging structure layer is formed on a display mother board to obtain a panel mother board, wherein the packaging structure layer comprises at least one packaging film layer, and the at least one packagingfilm layer covers the surface of the display mother board; a cutting groove is formed in the packaging structure layer along a cutting line of the panel mother board; the cutting groove is filled withan isolation material, wherein the flexibility of the isolation material is larger than that of the packaging film layer in contact with the isolation material; the panel mother board is cut from theisolation material along the cutting line to obtain the display panel. The problem that the packaging effect of a packaging structure is poor is solved, and the packaging effect of the packaging structure is improved. The method is used for manufacturing the display panel.

Description

显7F面板及其制造方法、显不装置 7F significantly panel and manufacturing method, means not significant

技术领域 FIELD

[0001]本发明涉及显示技术领域,特别涉及一种显示面板及其制造方法、显示装置。 [0001] The present invention relates to display technology, and particularly relates to a method of manufacturing a display panel and a display device.

背景技术 Background technique

[0002] 有机发光二极管(英文:〇rganic Light-Emitting Diode;简称:〇LED)显示面板具有高亮度、高对比度、全视角和可柔性显示等优点,广泛应用于显示行业。 [0002] The organic light emitting diode (English: 〇rganic Light-Emitting Diode; abbreviation: 〇LED) display panel has the advantages of high brightness, high contrast, and wide viewing angle display can be flexible, widely used in the display industry. 0LED显示面板包括显示基板以及设置在显示基板上的封装结构,封装结构用于对显示基板上的0LED器件进行封装,避免空气中的成分侵蚀0LED器件。 0LED includes a display substrate and a display panel disposed on the display package substrate, the package structure for a display device on the substrate 0LED package, avoiding air erosion 0LED device component.

[0003] 0LED显示面板是通过对0LED面板母板进行切割形成的显示面板,〇leD面板母板包括显示母板以及设置在显示母板上的封装结构层,显示母板具有多个显示区域,每个显示区域中设置有0LED器件,封装结构层包括与多个显示区域一一对应的多个封装结构,每个封装结构用于对相应的显示区域中的0LED器件进行封装,且每个封装结构包括叠加设置的无机层、有机层和无机层。 [0003] 0LED display panel is a display panel formed by cutting 0LED mother panel, 〇leD motherboard includes a display panel and a mother board provided in the display packaging structure layer motherboard, the motherboard having a plurality of display areas displayed, each display area is provided 0LED device package structure layer comprises a plurality of display areas correspond to the plurality of package, the package structure for each corresponding display region 0LED encapsulated device, and each package structure comprises an inorganic layer, an organic layer and an inorganic layer disposed superposed.

[0004]但是,由于封装结构最外侧的膜层为无机层,无机层的质地较脆,在对0LED面板母板进行切割以及搬运切割形成的0LED显示面板的过程中,无机层上容易产生裂纹,且裂纹容易沿着某一方向扩展,使得封装结构难以对0LED器件有效封装,因此,封装结构的封装效果较差。 [0004] However, because the process of the outermost layer is an inorganic layer package structure, the inorganic layer is brittle texture, of the display panel 0LED 0LED mother panel is cut, and the cut is formed in the transport, cracks easily occur on the inorganic layer and crack easily extended along a certain direction, so that the device package structure 0LED difficult to effectively package, therefore, the effect of encapsulation package poor.

发明内容 SUMMARY

[0005] 本发明提供一种显示面板及其制造方法、显示装置,可以解决封装结构的封装效果较差的问题。 [0005] The present invention provides a display panel and a manufacturing method for a display device, it can solve the poor effect package packaging problem. 本发明的技术方案如下: Aspect of the present invention is as follows:

[0006] 第一方面,提供一种显示面板的制造方法,所述方法包括: [0006] In a first aspect, there is provided a method of manufacturing a display panel, the method comprising:

[0007]在显示母板上形成封装结构层,得到面板母板,所述封装结构层包括至少一个封装膜层,所述至少一个封装膜层覆盖所述显示母板的表面; [0007] The mother board is formed in the display packaging structure layer, to obtain mother panel, the encapsulation structure comprises at least one layer of the film package, said at least one package layer covering the display surface of the master;

[0008]沿所述面板母板的切割线在所述封装结构层上形成切割槽; [0008] The dicing grooves formed on the package structure of the panel along the cutting line layer motherboard;

[0009]在所述切割槽中充填隔离材料,所述隔离材料的柔性大于与所述隔离材料接触的封装膜层的柔性; [0009] In the cut trench filling insulation material, said flexible insulation material is greater than the isolation layer flexible packaging material in contact;

[0010]沿所述切割线从所述隔离材料上对所述面板母板进行切割,得到显示面板。 [0010] performed along the cutting line from said insulating material cutting the mother panel, to obtain a display panel.

[0011]可选地,在显示母板上形成封装结构层,得到面板母板之后,所述方法还包括:在所述封装结构层上形成保护缝,所述保护缝位于所述面板母板的显示区域与所述切割线之间,且所述保护缝的深度方向与所述封装结构层的表面垂直。 [0011] Alternatively, forming an encapsulation layer on the display motherboard structure, obtained after the mother panel, said method further comprising: forming a slit in the protective layer on the package structure, the protective panel is in the motherboard slit between the display area and the cut line, and a depth direction perpendicular to the surface of the protective structure layer of the package seam.

[0012]可选地,在所述封装结构层上形成保护缝之后,所述方法还包括:在所述保护缝中填充隔离材料。 After [0012] Alternatively, the seam forming a protective layer on the package structure, the method further comprising: filling the cracks in the protective insulating material.

[0013]可选地,所述沿所述面板母板的切割线在所述封装结构层上形成切割槽,包括:采用刻蚀工艺沿所述面板母板的切割线在所述封装结构层上形成切割槽; [0013] Alternatively, the mother panel along said cut line cutting grooves are formed on the package layer structure, comprising: a layer in the packaging structure using an etching process along a cut line of the mother panel cutting groove is formed;

[0014]所述在所述封装结构层上形成保护缝,包括:采用刻蚀工艺在所述封装结构层上形成保护缝。 [0014] The slit is formed is protected, comprising a layer structure on the package: sewn using an etching process to form a protective layer on the package structure.

[0015] 可选地,所述在所述切割槽中充填隔离材料,包括:采用隔离材料在所述面板母板上形成隔离层,以在所述切割槽中填充所述隔离材料。 [0015] Optionally, the filler in the cut trench isolation material, comprising: forming an isolation layer of insulating material employed in the motherboard panel to fill the insulation material in the cut trench.

[0016] 可选地,所述隔离材料为聚酰亚胺材料或亚克力材料。 [0016] Alternatively, the insulating material is a polyimide material or an acrylic material.

[0017] 可选地,所述面板母板具有非显示区域和所述显示区域, [0017] Alternatively, the mother panel having a non-display area and the display area,

[0018] 所述隔离材料为聚酰亚胺材料,所述隔离层包括覆盖在所述非显示区域上的隔离区域; _ [0018] The insulating material is a polyimide material, overlying the isolation layer includes the non-display region on the isolation region; _

[0019] 所述隔离材料为亚克力材料,所述隔离层包括覆盖在所述非显示区域上的隔离区域,或者,所述隔离层覆盖所述面板母板的表面。 [0019] The spacer material is a acrylic material, the isolation layer includes covering the non-display region on the isolation region of the, or, the isolation layer covering the surface of the master panel.

[0020] 可选地,所述沿所述切割线从所述隔离材料上对所述面板母板进行切割,包括:采用激光切割工艺沿所述切割线从所述隔离材料上对所述面板母板进行切割。 [0020] Alternatively, the cutting of the panel from the mother insulating material along the cutting line, comprising: a laser cutting process along the cutting line from said material of said spacer panel Motherboard cut.

[0021] 可选地,所述至少一个封装膜层包括依次叠加的无机层、有机层和无机层,所述在显示母板上形成封装结构层,包括: [0021] Alternatively, the encapsulation layer comprises at least one inorganic layer are sequentially superposed, organic and inorganic layers, the packaging structure is formed on the display layer on the motherboard, comprising:

[0022] 采用化学气相沉积工艺在所述显示母板上形成无机层; [0022] The chemical vapor deposition process for forming an inorganic layer on the display motherboard;

[0023] 采用喷墨打印工艺在形成有所述无机层的显示母板上形成有机层; [0023] The organic layer is formed using an inkjet printing process on the inorganic layer is formed with a display of a motherboard;

[0024] 采用化学气相沉积工艺在形成有所述有机层的显示母板上形成无机层,得到所述封装结构层。 [0024] The chemical vapor deposition process for forming an inorganic layer on the organic layer formed with the display on the motherboard, to obtain the encapsulation layer structure.

[0025] 第二方面,提供一种采用第一方面或第一方面的任一可选方式所述的方法制造的显示面板,所述显示面板包括封装结构,所述封装结构包括至少一个封装膜层,所述至少一个封装膜层的外侧具有隔离材料,所述隔离材料的柔性大于与所述隔离材料接触的封装膜层的柔性。 [0025] a second aspect, there is provided a use of a display panel of the first aspect or any embodiment of the method of producing an alternative to the first aspect, the display panel comprises a package, said package comprising at least one package film layer, said at least one outer package film having insulating material, the flexible material is greater than the spacer layer in contact with the packaging material is a flexible spacer.

[0026]可选地,所述封装结构的周边区域设置有保护缝,所述保护缝的深度方向与所述封装结构的表面垂直,所述封装结构的周边区域在所述显示面板上的正投影位于所述显示面板的非显示区域内。 [0026] Alternatively, the peripheral area of ​​the package is provided with a protective seam depth direction perpendicular to the surface of the protective seam of the package structure, a peripheral region of the packaging structure of the display panel on the positive the projection display located within the non-display area of ​​the panel.

[0027] 可选地,所述保护缝中填充有隔离材料。 [0027] Alternatively, the seam is filled with a protective insulating material.

[0028]可选地,所述显示面板还包括显示基板,所述显示基板上设置有显示器件,所述封装结构用于对所述显示器件进行封装。 [0028] Alternatively, the display panel further includes a display substrate, the display is provided with a display device on a substrate, the encapsulation structure for said display device is encapsulated.

[0029]可选地,所述显示器件为有机发光二极管器件或者量子点发光二极管器件。 [0029] Alternatively, the display device is an organic light emitting diode device or a quantum dot light emitting diode device.

[0030]第三方面,提供一种显示装置,所述显示装置包括:第二方面或第二方面的任一可选方式所提供的显示面板。 [0030] a third aspect, there is provided a display device, said display device comprising: a display panel according the second aspect or the second aspect is provided an alternative embodiment.

[0031] 本发明提供的技术方案带来的有益效果是: [0031] The technical solution of the present invention to provide beneficial effects are:

[0032]本发明提供的显示面板及其制造方法、显示装置,沿面板母板的切割线在封装结构层上形成切割槽,并在切割槽中充填隔离材料,沿切割线从隔离材料上对面板母板进行切割得到显示面板,由于隔离材料的柔性大于与隔离材料接触的封装膜层的柔性,该隔离材料可以避免在切割面板母板,以及搬运显示面板的过程中,封装膜层上产生裂纹,因此, 有助于解决封装结构的封装效果较差的问题,提高封装效果。 [0032] The present invention provides a display panel and a manufacturing method for a display device, the panel along the cut line mother cutting grooves are formed on the package structure layer, and filling the cut trench isolation material, along the cutting line from the spacer material mother panel is cut to obtain a display panel, since the flexible barrier material is greater than the flexible packaging film in contact with the insulating material, the insulating material can be avoided during the cutting mother panel, and carrying a display panel, the package generating layer crack, therefore, help solve the problem of poor encapsulation package structure effects, improved packaging effect.

[0033]应当理解的是,以上的一般描述和后文的细节描述仅是示例性的,并不能限制本发明。 [0033] It should be understood that both the foregoing general description and the details described hereinafter are merely exemplary, and not intended to limit the present invention.

附图说明 BRIEF DESCRIPTION

[0034] 为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。 [0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, as briefly described in the introduction to the accompanying drawings required for use in describing the embodiments. Apparently, the drawings in the following description are only some of the present invention. embodiments, those of ordinary skill in the art is concerned, without creative efforts, can derive from these drawings other drawings.

[0035] 图1是本发明实施例提供的一种显示面板的制造方法的方法流程图; [0035] FIG. 1 is a flowchart of a method embodiment of the present invention is a method for producing a panel provided by the embodiment;

[0036] 图2是本发明实施例提供的另一种显示面板的制造方法的方法流程图; [0036] FIG. 2 is an embodiment of the present invention provides methods for producing another flowchart of a display panel;

[0037] 图3是本发明实施例提供的一种显示母板的俯视图; [0037] FIG. 3 is an example embodiment of the present invention show a plan view of the motherboard;

[0038] 图4是本发明实施例提供的一种显示母板的剖面图; [0038] FIG. 4 is an example embodiment of the present invention show a sectional view of a motherboard;

[0039] 图5是本发明实施例提供的一种在显示母板上形成封装结构层的方法流程图; [0039] FIG. 5 is a flowchart of a method of forming a layer package display one kind of the mother board according to an embodiment of the present invention;

[0040] 图6是本发明实施例提供的一种在显示母板上形成无机层后的俯视图; [0040] FIG. 6 is a top plan view of forming an inorganic layer on the motherboard one kind of display according to an embodiment of the present invention;

[0041] 图7是本发明实施例提供的一种在显示母板上形成无机层后的剖面图; [0041] FIG. 7 is a cross-sectional view after formation of an inorganic layer on the motherboard one kind of display according to an embodiment of the present invention;

[0042] 图8是本发明实施例提供的一种在形成有无机层的显示母板上形成有机层后的俯视图; [0042] FIG 8 is a plan view of the display is formed in the organic layer with an inorganic layer mother board provided in one embodiment of the present invention;

[0043] 图9是本发明实施例提供的一种在形成有无机层的显示母板上形成有机层后的剖面图; [0043] FIG 9 is provided in the present invention provides a cross-sectional view of the display is formed in the organic layer with an inorganic layer on the motherboard;

[0044] 图1〇是本发明实施例提供的一种在形成有有机层的显示母板上形成无机层后的俯视图; [0044] FIG 1〇 embodiment of the present invention is one kind of embodiment there is provided a top view of the formation of an inorganic layer exhibits a mother board forming an organic layer;

[0045] 图11是本发明实施例提供的一种在形成有有机层的显示母板上形成无机层后的剖面图; [0045] FIG. 11 is an embodiment of the present invention, one kind of embodiment there is provided a cross sectional view after forming the inorganic layer exhibits a mother board forming an organic layer;

[0046] 图12是本发明实施例提供的一种在封装结构层上形成切割槽后的俯视图; [0046] FIG. 12 is a top view of an embodiment of the present invention provides a cutting groove formed on the package structure layer;

[0047] 图13是本发明实施例提供的一种在封装结构层上形成切割槽后的剖面图; [0047] FIG. 13 is a sectional view of an embodiment of the present invention provides a cutting groove formed on the package structure layer;

[0048] 图14是本发明实施例提供的一种在封装结构层上形成保护缝后的俯视图; [0048] FIG. 14 is an embodiment provided by the present invention provides a top view of the seam protection layer formed on the package structure;

[0049] 图15是本发明实施例提供的一种在封装结构层上形成保护缝后的剖面图; [0049] FIG. 15 is one kind of embodiment of the present invention provides a cross-sectional view of the seam protection layer formed on the package structure;

[0050]图16是本发明实施例提供的一种在切割槽中充填隔离材料后的俯视图; [0050] FIG. 16 is a plan view provided in the cut trench filling insulation material embodiment of the present invention;

[0051]图17是本发明实施例提供的一种在切割槽中充填隔离材料后的剖面图; [0051] FIG. 17 is a sectional view provided in the cut trench filling insulation material embodiment of the present invention;

[0052]图18是本发明实施例提供的一种在保护缝中填充隔离材料后的俯视图; [0052] FIG. 18 is a plan view provided by filling cracks in the protective insulation material embodiment of the present invention;

[0053]图19是本发明实施例提供的一种在保护缝中填充隔离材料后的剖面图; [0053] FIG. 19 is an embodiment of the present invention is provided in cross-sectional view of protecting the insulation material filling the cracks;

[0054]图20是本发明实施例提供的一种在面板母板上形成隔离层后的俯视图; [0054] FIG. 20 is a plan view of an embodiment of the present invention provides an isolation layer is formed on the mother board panel;

[0055]图21是本发明实施例提供的一种在面板母板上形成隔离层后的剖面图; [0055] FIG. 21 is a cross-sectional view after the formation of isolation layer motherboard one kind of panel according to an embodiment of the present invention;

[0056]图22是本发明实施例提供的另一种在面板母板上形成隔离层后的俯视图; [0056] FIG. 22 is a further embodiment of the present invention is formed after the spacer layer is a plan view of the panel provided by the motherboard;

[0057]图23是本发明实施例提供的另一种在面板母板上形成隔离层后的剖面图; [0057] FIG. 23 is a further embodiment of the present invention is formed of a cross-sectional view of an isolation layer provided on the motherboard of the panel;

[0058]图24是本发明实施例提供的一种显示面板的结构示意图; [0058] FIG. 24 is a schematic structural diagram of embodiment of the present invention provides a panel of a display;

[0059]图25是本发明实施例提供的另一种显示面板的结构示意图; [0059] FIG. 25 is a schematic view of another embodiment of a display panel provided in the embodiment of the present invention;

[0060]图26是本发明实施例提供的再一种显示面板的结构示意图。 [0060] FIG. 26 is a schematic structural diagram of a further embodiment provides a display panel of the embodiment of the present invention.

[0061]此处的附图被并入说明书中并构成本说明书的一部分,示出了符合本发明的实施例,并与说明书一起用于解释本发明的原理。 [0061] The accompanying drawings, which are incorporated herein and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description serve to explain the principles of the invention.

具体实施方式 Detailed ways

[0062]为了使本发明的目的、技术方案和优点更加清楚,下面将结合附图对本发明作进一步地详细描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。 [0062] To make the objectives, technical solutions, and advantages of the present invention will become more apparent below in conjunction with the accompanying drawings of the present invention will be further described in detail, obviously, the described embodiments are merely part of embodiments of the present invention, but not all embodiments example. 基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。 Based on the embodiments of the present invention, all other embodiments of ordinary skill in the art without any creative effort shall fall within the scope of the present invention.

[0063] 0LED显示面板是通过对0LED面板母板进行切割形成的显示面板,0LED面板母板包括显示母板以及设置在显示母板上的封装结构层,显示母板具有多个显示区域,每个显示区域中设置有0LED器件,封装结构层包括与多个显示区域一一对应的多个封装结构,每个封装结构用于对相应的显示区域中的0LED器件进行封装,且每个封装结构包括叠加设置的无机层、有机层和无机层。 [0063] 0LED display panel is a display panel formed by cutting 0LED mother panel, 0LED motherboard includes a display panel and a motherboard disposed in the display packaging structure layer motherboard, the motherboard having a plurality of display areas displayed, each a display region provided 0LED device package structure layer comprises a plurality of display areas correspond to the plurality of package, the package structure for each corresponding display region 0LED encapsulated device, and each package comprising an inorganic layer, an organic layer and an inorganic layer disposed superposed.

[0064]目前,在0LED显示面板的制造过程中,首先采用化学气相沉积(英文:Chemical Vapor Deposition;简称:CVD)工艺在显示母板上形成与多个显示区域中的每个显示区域对应的无机层,使与每个显示区域对应的无机层覆盖在该每个显示区域中的0LED器件上, 然后米用喷墨打印(英文:Ink-Jet Printing;简称:IJP)工艺在形成有无机层的显示母板上形成有机层,最后再采用CVD工艺在形成有有机层的显示母板上形成与每个显示区域对应的无机层,使与每个显示区域对应的无机层覆盖在该每个显示区域对应的有机层上,从而形成封装结构层,得到0LED面板母板,然后对0LED面板母板进行切割得到0LED显示面板。 [0064] Currently, the manufacturing process of the display panel 0LED, first using a chemical vapor deposition (English: Chemical Vapor Deposition; abbreviation: CVD) process with the mother board is formed in the display area of ​​each display a plurality of display areas corresponding to inorganic layer, so that each display region corresponding to the inorganic layer covering the device on the 0LED each display area, and then printing with an inkjet rice (English: Ink-Jet printing; abbreviation: IJP) process is formed on the inorganic layer display motherboard organic layer is formed, and finally is formed using a CVD process with a display mother board forming an organic layer and an inorganic layer region corresponding to each of the display, so that the inorganic layer and each display area corresponding to each of the covers corresponding to the display region on the organic layer, thereby forming a package structure layer to obtain 0LED mother panel, and then cut to obtain 0LED 0LED mother panel display panel. 其中,在采用CVD工艺形成无机层时,可以在显示母板上设置掩膜版(英文:Mask),使掩膜版的开口区域与显示母板的显示区域--对应,然后从掩膜版的上方向显示母板蒸镀无机材料,无机材料通过掩膜版的开口区域沉积在每个显示区域的0LED器件上形成无机层。 Wherein, when the inorganic layer is formed by a CVD process, the mask may be provided on the display motherboard (English: Mask), the display area of ​​the display area of ​​the opening mask of the motherboard - corresponding to and from the mask the direction of the display motherboard vapor deposition of an inorganic material, an inorganic material is deposited through the open area of ​​the inorganic mask layer is formed on each of the display device 0LED region.

[0065]但是,在上述方案中,一方面,封装结构层最外侧的膜层为无机层,在对〇LED面板母板进行切割以及搬运切割形成的0LED显示面板的过程中,切割工具以及机械手可能会触碰到无机层,由于无机层的质地较脆,因此触碰容易导致无机层上产生裂纹,造成封装结构的封装失效;另一方面,在采用CVD工艺形成无机层的过程中,受掩膜版精度以及蒸镀精度的影响,需要在每个显不区域的边缘预留空白(英文:Margin)区域来补偿蒸镀偏差和蒸镀阴影(英文:Shadow),导致最终切割形成的0LED显示面板边框较宽,难以实现窄边框显示, 并且Mask的成本尚,制造不同规格的0LED显不面板需要采用不同的Mask,导致0LED显示面板的制造成本较高。 [0065] However, in the above embodiment, in one aspect, the outermost layer is an inorganic film layer package structure, in 0LED of 〇LED mother panel is cut, and cut to form a display process of conveying panel, the cutting tool and the robot It may touch the inorganic layer, the inorganic layer due to the more brittle texture, and therefore easily lead to cracks touch on the inorganic layer, resulting in failure of the encapsulation package; on the other hand, in the process of forming the inorganic layer using the CVD process, the subject Effect mask accuracy and the precision of deposition, it is necessary to reserve at the edge of each blank region is not significant (English: Margin) region and to compensate for deviations vapor deposition shadow (English: shadow), resulting in final cut is formed 0LED wide display panel frame, it is difficult to narrow the frame displayed, and the cost is still Mask, producing different specifications 0LED not significantly different panels require Mask, resulting in higher manufacturing costs 0LED display panel.

[0066]本发明实施例提供的显示面板及其制造方法、显示装置,可以降低显示面板的制造成本,提高封装结构的封装效果。 The display panel and a manufacturing method according to an embodiment of the [0066] present invention, the display apparatus can reduce the manufacturing cost of the display panel, to improve the sealing effectiveness of the packaging structure. 本发明的详细方案请参考下述各个实施例的描述。 Details of the present invention refer to the following description of the various embodiments.

[0067]请参考图1,其示出了本发明实施例提供的一种显示面板的制造方法的方法流程图,该显示面板的制造方法可以用于制造0LED显示面板或量子点发光二极管(英文: Quantum Dot Light Emitting Diodes;简称:QLED)显示面板。 [0067] Please refer to FIG 1, which illustrates a flowchart of a method embodiment of the present invention provides a method for manufacturing a display panel of the embodiment, a method of manufacturing the display panel may be used for manufacturing a display panel or 0LED quantum dot light emitting diodes (English : Quantum Dot Light Emitting Diodes; abbreviation: QLED) display panel. 参见图1,该显示面板的制造方法包括: Referring to Figure 1, the display panel manufacturing method comprising:

[0068]步骤101、在显示母板上形成封装结构层,得到面板母板,封装结构层包括至少一个封装膜层,至少一个封装膜层覆盖显示母板的表面。 [0068] Step 101, the display is formed in the mother board packaging structure layer, to obtain mother panel, package film layer comprises at least one package, at least one film layer covers the surface of the display package of the motherboard.

[0069]步骤102、沿面板母板的切割线在封装结构层上形成切割槽。 [0069] Step 102, the panel along the cut line mother cutting grooves are formed on the package structure layer.

[0070]步骤1〇3、在切割槽中充填隔离材料,隔离材料的柔性大于与隔离材料接触的封装膜层的柔性。 [0070] Step 1〇3, in the cut trench filling insulation material, flexible insulation material is greater than the flexible packaging film in contact with the insulating material.

[0071]步骤104、沿切割线从隔离材料上对面板母板进行切割,得到显示面板。 [0071] Step 104, be cut along the cutting line from the mother panel spacer material to obtain the display panel.

[0072]综上所述,本发明实施例提供的显示面板制造方法,沿面板母板的切割线在封装结构层上形成切割槽,并在切割槽中充填隔离材料,沿切割线从隔离材料上对面板母板进行切割得到显示面板,由于隔离材料的柔性大于与隔离材料接触的封装膜层的柔性,该隔离材料可以将封装膜层隔离,避免切割以及搬运过程导致封装膜层上产生裂纹,有助于解决封装结构的封装效果较差的问题,提高封装结构的封装效果。 [0072] In summary, a method of manufacturing a display panel according to an embodiment of the present invention, the panel along the cut line mother cutting grooves are formed on the package structure layer, and filling the cut trench isolation material, along the cutting line from the insulation material the mother panel is cut to obtain a display panel, since the flexible insulation material is greater than the flexible encapsulating film in contact with the insulating material, the isolation layer isolating material may be encapsulated to avoid the handling and cutting process results in cracks on the package film , help solve the problem of poor encapsulation package structure effect, the effect to improve the packaging of the packaging structure. 此外,由于封装膜层覆盖显示母板的表面,因此封装膜层的形成过程无需使用掩膜版,从而无需预留空白区域,便于实现显示面板的窄边框显示,且降低显示面板的制造成本。 Further, since the film covering the surface of the display package of the motherboard, so the formation of the package without the use of the mask layer, thus eliminating the need to reserve a blank area, the display is easy to realize a narrow frame of the display panel, and reduce the manufacturing cost of the display panel.

[0073]可选地,在步骤101之后,该方法还包括: [0073] Alternatively, after step 101, the method further comprising:

[0074]在封装结构层上形成保护缝,保护缝位于面板母板的显示区域与切割线之间,且保护缝的深度方向与封装结构层的表面垂直。 [0074] The slit is formed on the protection layer package, the cut between the protection and the display region of the panel seam motherboard, and a depth direction perpendicular to the surface of the protective layer of the package seam.

[0075]可选地,在封装结构层上形成保护缝之后,该方法还包括: After [0075] Alternatively, the seam forming a protective layer on the package structure, the method further comprising:

[0076]在保护缝中填充隔离材料。 [0076] insulating material is filled in the gap of the protection.

[0077]可选地,沿面板母板的切割线在封装结构层上形成切割槽,包括: [0077] Alternatively, the panel along the cut line mother cutting grooves formed on the layer package structure, comprising:

[0078]采用刻蚀工艺沿面板母板的切割线在封装结构层上形成切割槽; [0078] The etching process in the mother panel cutting line cutting grooves are formed on the package structure layer;

[0079]在封装结构层上形成保护缝,包括: [0079] forming a protective seam, comprising a layer structure on a package:

[0080]采用刻蚀工艺在封装结构层上形成保护缝。 [0080] The etching process of forming a protective layer seam on the package structure.

[0081] 可选地,在切割槽中充填隔离材料,包括: [0081] Alternatively, in the cut trench filling insulation material, comprising:

[0082] 采用隔离材料在面板母板上形成隔离层,以在切割槽中填充隔离材料。 [0082] The spacer material creates a barrier panel motherboard, to fill in the cut trench isolation material.

[0083]可选地,隔离材料为聚酰亚胺材料或亚克力材料。 [0083] Alternatively, the insulating material is a polyimide material or an acrylic material.

[0084] 可选地,面板母板具有非显示区域和显示区域, [0084] Alternatively, mother panel having a display region and a non-display region,

[0085]隔离材料为聚酰亚胺材料,隔离层包括覆盖在非显示区域上的隔离区域; [0085] The spacer material is a polyimide material, the isolation layer covering the isolation region comprises a non-display area;

[0086]隔离材料为亚克力材料,隔离层包括覆盖在非显示区域上的隔离区域,或者,隔离层覆盖面板母板的表面。 [0086] insulating material is acrylic material, the isolation layer covering the isolation region comprises a non-display area, or the surface of the mother panel spacer layer.

[0087]可选地,步骤104可以包括:采用激光切割工艺沿切割线从隔离材料上对面板母板进行切割。 [0087] Alternatively, step 104 may include: a laser cutting process of cutting along the cutting line from the mother panel insulating material.

[0088]可选地,至少一个封装膜层包括依次叠加的无机层、有机层和无机层,步骤101可以包括: [0088] Alternatively, at least one inorganic encapsulating layer comprises a layer superposed sequentially, the organic layer and the inorganic layer 101 may include the step of:

[0089] 采用化学气相沉积工艺在显示母板上形成无机层; [0089] The chemical vapor deposition process for forming an inorganic layer on the display motherboard;

[0090]采用喷墨打印工艺在形成有无机层的显示母板上形成有机层; [0090] The inkjet printing process is formed on the inorganic layer mother board display forming an organic layer;

[0091] 采用化学气相沉积工艺在形成有有机层的显示母板上形成无机层,得到封装结构层。 [0091] The chemical vapor deposition process for forming an inorganic layer formed on the organic motherboard display layer, to obtain a package structure layer.

[0092] 上述所有可选技术方案,可以采用任意结合形成本发明的可选实施例,在此不再一一赘述。 [0092] All of the above alternative technical solutions can be employed in conjunction with any alternative form of embodiment of the present invention, which is not detailed herein.

[0093]综上所述,本发明实施例提供的显示面板制造方法,沿面板母板的切割线在封装结构层上形成切割槽,并在切割槽中充填隔离材料,沿切割线从隔离材料上对面板母板进行切割得到显示面板,由于隔离材料的柔性大于与隔离材料接触的封装膜层的柔性,该隔离材料可以将封装膜层隔离,避免切割以及搬运过程导致封装膜层上产生裂纹,有助于解决封装结构的封装效果较差的问题,提高封装结构的封装效果。 [0093] In summary, a method of manufacturing a display panel according to an embodiment of the present invention, the panel along the cut line mother cutting grooves are formed on the package structure layer, and filling the cut trench isolation material, along the cutting line from the insulation material the mother panel is cut to obtain a display panel, since the flexible insulation material is greater than the flexible encapsulating film in contact with the insulating material, the isolation layer isolating material may be encapsulated to avoid the handling and cutting process results in cracks on the package film , help solve the problem of poor encapsulation package structure effect, the effect to improve the packaging of the packaging structure. 此外,由于封装膜层覆盖显示母板的表面,因此封装膜层的形成过程无需使用掩膜版,从而无需预留空白区域,便于实现显示面板的窄边框显示,且降低显示面板的制造成本。 Further, since the film covering the surface of the display package of the motherboard, so the formation of the package without the use of the mask layer, thus eliminating the need to reserve a blank area, the display is easy to realize a narrow frame of the display panel, and reduce the manufacturing cost of the display panel.

[0094] 请参考图2,其示出了本发明实施例提供的另一种显示面板的制造方法的方法流程图,该显示面板的制造方法可以用于制造OLED显示面板QLED显示面板。 [0094] Please refer to FIG 2, which illustrates a method of the present invention provides another method of manufacturing a flow chart illustrating a display panel, the display panel manufacturing method of manufacturing an OLED display panel may be used QLED display panel. 参见图2,该显示面板的制造方法包括: Referring to Figure 2, the display panel manufacturing method comprising:

[0095] 步骤201、在显示母板上形成封装结构层,得到面板母板,封装结构层包括至少一个封装膜层,至少一个封装膜层覆盖显示母板的表面。 [0095] Step 201, the display is formed in the mother board packaging structure layer, to obtain mother panel, package film layer comprises at least one package, at least one film layer covers the surface of the display package of the motherboard.

[0096]图3是本发明实施例提供的一种显示母板01的俯视图,图4是图3所示的显示母板01的AA部位的剖面图,参见图3和图4,显示母板01具有非显示区域F和多个显示区域(图3 和4中均未标出),每个显示区域中设置有显示器件02,该显示器件02可以为0LED器件或QLED器件,显示母板01还具有切割线a,显示母板01的切割线a位于非显示区域F上。 [0096] FIG. 3 is an embodiment of present invention provides a display provided in a top view of a motherboard 01, FIG. 4 is a sectional view AA of the display portion of the motherboard 01 shown in FIG. 3, see FIG. 3 and FIG. 4, a motherboard 01 F and a non-display area having a plurality of display areas (FIGS. 3 and 4 were not marked), each display area 02 is provided with a display device, the display device 02 may be a device or 0LED QLED device, display motherboard 01 further having a cut line a, a motherboard 01 show a cutting line F is located on the non-display region. 需要说明的是,实际应用中,显示母板01可以包括衬底基板(图3和图4中均未示出)以及设置在衬底基板上的阻挡层(英文Carrier layer,图3和图4中均未示出),衬底基板可以为采用玻璃、石英或透明树脂等具有一定坚固性的导光且非金属材料制成的刚性透明基板,或者,衬底基板可以为采用聚酰亚胺(英文:P〇lyimide;简称:PI)等材料制作的柔性基板。 Incidentally, the practical application, the display 01 may include a base substrate motherboard (FIG. 3 and FIG. 4 not shown) is provided on the base substrate, and a barrier layer (English Carrier layer, FIG. 3 and FIG. 4 are not shown), the base substrate may be employed as the light guide and the transparent substrate made of a rigid non-metallic material having a certain robustness of glass, quartz, or transparent resin or the like, or, the base substrate may be a polyimide (English: P〇lyimide; abbreviation: the PI) and the like of the flexible substrate material.

[0097]在本发明实施例中,封装结构层的至少一个封装膜层可以包括依次叠加的无机层、有机层和无机层,且无机层可以覆盖显示母板的表面。 [0097] In an embodiment of the present invention, a package structure layer is at least one package layer may include an inorganic layer, an organic layer and an inorganic layer are superimposed, and the inorganic layer may cover the surface of the display motherboard. 请参考图5,其示出了本发明实施例提供的一种在显示母板上形成封装结构层的方法流程图,参见图5,该方法包括: Please refer to FIG. 5, which shows one kind of embodiment of the present invention to provide a package structure of the embodiment is formed in the display layer is a flowchart of a method motherboard, see Figure 5, the method comprising:

[0098] 步骤2011、采用CVD工艺在显示母板上形成无机层,无机层覆盖显示母板的表面。 [0098] Step 2011, using a CVD process for forming an inorganic layer on a mother board display, an inorganic layer covering the display surface of the motherboard.

[0099] 图6是本发明实施例提供的一种在显示母板〇1上形成无机层031后的俯视图,图7 是图6的AA部位的剖面图,参见图6和图7,无机层031覆盖在显示母板01设置有显示器件02 的表面上,且无机层031为一体结构。 [0099] FIG. 6 is a top plan view of an embodiment of the present invention, an inorganic layer 031 is formed on the motherboard 〇1 display, FIG 7 is a sectional view of the portion AA of FIG. 6, see FIG. 6 and FIG. 7, the inorganic layer 031 overlaid on the mother board 01 is provided with a display surface of the display device 02, and the inorganic layer 031 is a unitary structure. 换句话说,无机层031整面覆盖在显示母板01设置有显示器件02的表面上。 In other words, the inorganic layer 031 covers the entire surface of the mother board 01 is provided on a display surface of the display device 02. 其中,该无机层031可以采用SiNx (中文:氮化桂)或者SiNO (中文:氮氧化娃)等无机材料形成。 Wherein, the inorganic layer 031 may be employed an SiNx (Chinese: Gui nitride), or a SiNO (Chinese: Wa oxynitride) an inorganic material. 可选地,可以采用CVD工艺在显示母板01上形成无机层031,本发明实施例中,CVD工艺例如可以为等离子体增强化学气相沉积法(英文:Plasma Enhanced Chemical Vapor Deposition;简称:PECVD)工艺。 Alternatively, the CVD process may be employed to form the inorganic layer 031 on the mother board display 01, an embodiment of the present invention, for example, a CVD process may be a plasma enhanced chemical vapor deposition (English: Plasma Enhanced Chemical Vapor Deposition; abbreviation: PECVD) process. 不例地,可以将显不母板〇1设置在沉积fe 室,然后向沉积腔室内输入SiNx气体,该SiNx气体在沉积腔室内扩散并沉积在显示母板〇1 的非显示区域F上和显示器件02上形成无机层031。 No cases, the mother may not be explicitly provided 〇1 fe deposition chamber, and gas chamber to enter the SiNx deposition chamber, and the gas diffusion SiNx is deposited on the mother board 〇1 display non-display region F in the deposition chamber, and forming an inorganic layer 031 on the display device 02.

[0100] 步骤2012、采用喷墨打印工艺在形成有无机层的显示母板上形成有机层。 [0100] Step 2012, ink-jet printing process using a display mother board is formed of an inorganic layer to form an organic layer.

[0101] 图8是本发明实施例提供的一种在形成有无机层〇31的显示母板〇1上形成有机层032后的俯视图,图9是图8的AA部位的剖面图,参见图8和图9,有机层032位于无机层031 上,且有机层032包括与多个显示器件02——对应的多个有机层区域(图8和图9中均未标出),与每个显示器件02对应的有机层区域在显示母板上的正投影将相应的显示器件02 覆盖。 [0101] FIG. 8 is an embodiment of the present invention is provided a plan view of the organic layer 032 is formed on the inorganic layer 〇31 〇1 master display is formed, FIG. 9 is a sectional view of the portion AA of FIG. 8, see FIG. 8 and FIG. 9, the organic layer 032 positioned on the inorganic layer 031, and the organic layer 032 comprises a plurality of organic layers and regions corresponding to the plurality of display devices 02-- (FIGS. 8 and 9 were not labeled), with each the display device 02 corresponding to the orthogonal projection of the organic layer in the display area of ​​the corresponding mother board 02 to cover the display device. 其中,该有机层032可以采用亚克力材料形成。 Wherein the organic layer 032 may be formed using acrylic materials. 可选地,可以采用亚克力材料形成墨汁,然后采用喷墨打印工艺在无机层〇31上喷洒该墨汁,该墨汁在无机层〇31上形成有机层032〇 Alternatively, ink may be formed of acrylic materials employed, then use of the ink jet printing process is sprayed on the inorganic layer 〇31, the organic layer was 032〇 the ink layer formed on the inorganic 〇31

[0102] 步骤2013、采用CVD工艺在形成有有机层的显示母板上形成无机层,无机层覆盖该无机层下方的膜层,得到封装结构层。 [0102] Step 2013, using a CVD process for forming an inorganic layer formed in the display motherboard organic layer, an inorganic layer below the layer covers the inorganic layer to give a layer package.

[0103]图10是本发明实施例提供的一种在形成有有机层032的显示母板〇1上形成无机层033后的俯视图,图11是图10的AA部位的剖面图,参见图10和图11,无机层033下方的膜层包括无机层031和有机层032,无机层033将无机层031和有机层032覆盖。 [0103] FIG. 10 is an embodiment of the present invention, one kind of embodiment there is provided a top view of an inorganic layer 033 is formed on the master display 032 〇1 organic layer is formed, FIG. 11 is a sectional view of the portion AA of FIG. 10, see FIG. 10 and FIG. 11, the inorganic layer 033 below layer 031 includes an inorganic layer and an organic layer 032, the inorganic layer 033 and the inorganic layer 031 covers the organic layer 032. 本发明实施例中, 形成无机层031、有机层032和无机层033后,就得到了封装结构层03,在显示母板01上形成封装结构层03后,就得到了面板母板0。 Embodiments of the present invention, the inorganic layer 031 is formed, the organic layer 032 and an inorganic layer 033, to obtain a packaging structure layer 03, the layer 03 is formed on the package structure display motherboard 01, a mother panel 0 is obtained. 该无机层033的形成过程可以参考无机层031的形成过程,本发明实施例在此不再赘述。 The process of forming the inorganic layer 033 may refer to the inorganic layer forming process 031, the embodiment of the present invention are not repeated here.

[0104]需要说明的是,本发明实施例是以封装结构层03包括无机层031、有机层032和无机层033为例进行说明的,实际应用中,封装结构层可以包括多个无机层和多个有机层,且无机层和有机层交替叠加,封装结构层中距离显示母板最近和最远的膜层均可以为无机层,本发明实施例对此不作限定。 [0104] Incidentally, embodiments of the present invention is a packaging structure layer 03 includes an inorganic layer 031, an organic layer 032 and an inorganic layer 033 as an example, the practical application, the encapsulation layer may comprise a plurality of structural layers and inorganic a plurality of organic layers and inorganic and organic layers are alternately superimposed, package layers nearest and farthest from the master display layer that may be an inorganic layer, embodiments of the present invention is not limited to this embodiment.

[0105] 还需要说明的是,本发明实施例中,由于封装结构层03的无机层覆盖显示母板01 的表面,这样一来,可以避免掩膜版的使用,无需在显示母板01的每个显示区域的边缘预留Margin区域,便于最终形成的显示面板的窄边框显示,且降低了显示面板的制造成本,提高显示面板的可靠性。 [0105] Note also, in the embodiment, since the package structure of the inorganic layer 03 to cover the display surface of the motherboard 01, so that, to avoid using the mask of the present invention embodiment, without the display of the motherboard 01 the edge region of each display area reserved Margin, the narrow border of the display panel to facilitate formation of the final display, and reduces the manufacturing cost of the panel, to improve the reliability of the display panel.

[0106] 步骤202、沿面板母板的切割线在封装结构层上形成切割槽。 [0106] Step 202, the panel along the cut line mother cutting grooves are formed on the package structure layer.

[0107]图12是本发明实施例提供的一种沿面板母板0的切割线在封装结构层03上形成切割槽G后的俯视图,图13是图12的AA部位的剖面图,在本发明实施例中,面板母板0的切割线可以与显示母板01的切割线a共线,因此该显示母板01的切割线a也即是面板母板0的切割线,参见图12和图13,切割槽G沿面板母板0的切割线a设置。 [0107] FIG. 12 is a top view of the embodiment of the present invention to provide a cutting line along which a panel in 0 mother cutting grooves G formed on the package layer 03, FIG. 13 is a sectional view of the portion AA of FIG. 12, in the present Inventive embodiments, 0 mother panel cutting line with the cutting line can display a collinear motherboard 01, the motherboard 01 so that the display of a cut line that is, mother panel cut line 0, see FIG. 12 and 13, cutting grooves along the cutting line G 0 is a mother panel settings. 在本发明实施例中,切割槽G 可以贯通封装结构层03,也可以不贯通封装结构层03,该图12和图13以切割槽G贯通封装结构层03为例进行说明,在该图12和图13中,切割槽G贯通无机层031和无机层033,实际应用中,当有机层032的面积较大时,切割槽G也可以贯通有机层032。 In an embodiment of the present invention, the cutting groove G through the packaging structure layer 03 may, or may not penetrating packaging structure layer 03, FIG. 12 and FIG. 13 to cut through the groove G package layer 03 as an example, in FIG. 12 and FIG. 13, the cutting groove G through the inorganic layer 031 and an inorganic layer 033, an actual application, the organic layer 032 when the area is large, the groove G can be cut through the organic layer 032. 在本发明实施例中,可以采用刻蚀工艺沿面板母板0的切割线a在封装结构层03上形成切割槽G。 In an embodiment of the present invention, the etching process along cutting line 0 of a mother panel cut groove formed on the package structure layer 03 may be employed G. 可选地,可以在封装结构层03上涂覆一层光刻胶,然后采用掩膜版对光刻胶进行曝光,使光刻胶形成完全曝光区和非曝光区,完全曝光区与封装结构层03上待形成切割槽G的区域对应,非曝光区与封装结构层03的其他区域对应,之后采用显影工艺进行处理,使完全曝光区的光刻胶被去除,非曝光区的光刻胶保留,之后对完全曝光区在封装结构层03上的对应区域进行刻蚀以形成切割槽G,最后剥离非曝光区的光刻胶。 Alternatively, the encapsulation structure 03 coated with a photoresist layer, using the mask and then exposing the photoresist, the photoresist is formed fully exposed and non-exposed areas, and the package is completely exposed region region corresponding to the non-exposed areas of the package structure layer to be formed on the groove G cut the other layer 03 corresponding to the region 03, and thereafter treated using a developing process, the photoresist completely exposed regions are removed, the non-exposed areas of the photoresist retention, after exposure to the region corresponding to the region on the full package structure layer 03 is etched to form the cutting grooves G, the last non-exposed areas of the resist is released. 在本发明实施例中,可以根据实际情况采用干法刻蚀或湿法刻蚀对封装结构层03进行刻蚀。 In an embodiment of the present invention, etching the encapsulation layer structure 03 according to the actual situation by dry etching or wet etching. 此外,本发明实施例是以光刻胶为正性光刻胶为例进行说明的,实际应用中,光刻胶还可以为负性光刻胶,本发明实施例在此不再赘述。 Further, embodiments of the present invention is based photoresist is a positive photoresist will be described as an example, the practical application, the photoresist may also be a negative photoresist, embodiments of the present invention are not repeated here.

[0108]步骤203、在封装结构层上形成保护缝,保护缝位于面板母板的显示区域与切割线之间,且保护缝的深度方向与封装结构层的表面垂直。 [0108] Step 203, forming a protective layer seam on the package, protecting the display region between the seam and cutting the motherboard of the panel, and a depth direction perpendicular to the surface of the protective layer of the package seam.

[0109]图14是本发明实施例提供的一种在封装结构层03上形成保护缝H后的俯视图,图15是图14的AA部位的剖面图,参见图14和图15,保护缝H位于面板母板〇的显示区域(图14 和图15均未标出)与面板母板〇的切割线a之间,且保护缝H的深度方向(图14和图15均未标出)与封装结构层03的表面(图14和图15均未标出)垂直。 [0109] FIG. 14 is a plan view of an example embodiment of the present invention forms a protective seam H over the package structure layer 03, FIG. 15 is a sectional view AA part of FIG. 14, see FIG. 14 and FIG. 15, the protective seam H Motherboard square of the panel display area (FIGS. 14 and 15 were not marked) between the motherboard and the square panel cut line a, and protects the slit in the depth direction of H (FIGS. 14 and 15 were not labeled) and surface of the package layer 03 (FIGS. 14 and 15 were not shown) vertically. 在本发明实施例中,保护缝H可以贯通封装结构层03,例如,如图14和图15所示,保护缝H贯通无机层031和无机层033,实际应用中,当有机层032的面积较大时,保护缝H也可以贯通有机层032。 In an embodiment of the present invention, the protective package through the slits H layer 03 can be, e.g., FIG. 14 and FIG. 15, the inorganic protective layer 031 through the slits H and an inorganic layer 033, an actual application, when the area of ​​the organic layer 032 large, H may be protected through the slit organic layer 032. 在本发明实施例中,可以采用刻蚀工艺在封装结构层03上形成保护缝H。 In an embodiment of the present invention, the slit may be formed on the protective layer of the package structure 03 using an etching process H. 详细的实现过程与上述形成切割槽G的过程类似,本发明实施例在此不再赘述。 Detailed implementation process is the process of cutting the groove G is formed similar to the above, embodiments of the present invention are not repeated here.

[0110] 需要说明的是,本发明实施例是以形成切割槽G和形成保护缝H的过程为相互独立的过程为例进行说明的,实际应用中,切割槽G和保护缝H可以同时形成,也即是,可以通过一次刻蚀工艺同时形成切割槽G和保护缝H,从而上述步骤202和步骤2〇3可以合并为一个步骤,本发明实施例对此不作限定。 [0110] Incidentally, embodiments of the present invention is a process of forming a cut groove G and H are formed as a slit protection independent process will be described as an example of practical application, cutting grooves G and H can be formed at the same time protect the seams , that is, the groove G can be formed and cut protection by a seam H simultaneously etching process, whereby the above-described steps 202 and 2〇3 be combined into one step embodiment of the present invention is not limited to this embodiment.

[0111] 步骤204、在切割槽中充填隔离材料,隔离材料的柔性大于与隔离材料接触的封装膜层的柔性。 [0111] Step 204, in the cut trench filling insulation material, flexible insulation material is greater than the flexible packaging film in contact with the insulating material.

[0112] 图16是本发明实施例提供的一种在切割槽G中充填隔离材料041后的俯视图,图17 是图16的AA部位的剖面图,参见图I6和图17,切割槽G中充填有隔离材料041,该隔离材料041的柔性可以大于与该隔离材料041接触的封装膜层的柔性,如图16和图17所示,与隔离材料041接触的封装膜层为无机层031和无机层033,因此该隔离材料041的柔性大于无机层031的柔性,且大于无机层033的柔性。 [0112] FIG. 16 is an example embodiment of the present invention is filled a top view of the insulating material 041 in the cutting groove G in FIG. 17 is a sectional view AA part of FIG. 16, see FIGS I6 and 17, cutting grooves G, 041 filled with insulating material, the insulating material 041 may be greater than the flexibility of the flexible packaging film in contact with the insulation material 041, as shown in FIGS. 16 and 17, the package film 041 in contact with the insulating material layer 031 and inorganic the inorganic layer 033, thus the isolation material 041 is greater than the flexibility of the inorganic layer 031 is flexible, the flexible inorganic layer and larger than 033. 在本发明实施例中,该隔离材料041可以为PI材料或亚克力材料。 In an embodiment of the present invention, the insulating material 041 may be a PI material or acrylic material. 可选地,可以采用喷墨打印工艺在切割槽G中充填隔离材料041。 Alternatively, the ink jet printing process may be employed insulating material 041 filling in the groove G of the cut. 当然,也可以采用其他工艺在切割槽G中充填隔离材料041,本发明实施例对此不作限定。 Of course, other processes may be used insulating material 041 filling in the groove G cut, the embodiments of the present invention is not limited to this embodiment.

[0113] 步骤205、在保护缝中填充隔离材料。 [0113] Step 205, the protective insulating material filling the cracks.

[0114] 图18是本发明实施例提供的一种在保护缝H中填充隔离材料042后的俯视图,图19 是图18的AA部位的剖面图,参见图18和图19,保护缝H中充填有隔离材料042。 [0114] FIG. 18 is an embodiment of the present invention, one kind provided in the protective slit H is a plan view of the filled insulating material 042, FIG. 19 is a sectional view AA part of FIG. 18, see FIGS. 18 and 19, the protective seam in H filled with isolation material 042. 在本发明实施例中,隔离材料042可以为PI材料或亚克力材料,且隔离材料042与隔离材料041可以相同或不同。 In an embodiment of the present invention, the insulating material 042 may be a PI material or acrylic material, and the insulating material 042 and insulating material 041 may be the same or different. 可选地,可以采用喷墨打印工艺在保护缝H中充填隔离材料042。 Alternatively, the ink jet printing process may be employed insulating material 042 is filled in the protection of the H slit. 当然,也可以采用其他工艺在保护缝H中充填隔离材料042,本发明实施例对此不作限定。 Of course, other processes may also be employed in the protection of filling insulating material 042 in the seam H, embodiments of the present invention is not limited to this embodiment.

[0115]需要说明的是,本发明实施例是以在切割槽G中充填隔离材料041和在保护缝H中充填隔离材料042的过程为相互独立的过程为例进行说明的,实际应用中,当隔离材料041 与隔离材料042相同时,也可以同时在切割槽G和保护缝H中充填隔离材料,也即是,上述步骤204和步骤205可以合并为一个步骤。 [0115] Incidentally, embodiments of the present invention is independent of the process described as an example in the process of filling the insulation material 041 and the cutting grooves G in the protective insulating material is filled in the slit 042 H, the practical application, when the insulating material 041 and insulating material 042 are the same, it may be simultaneously filled in the cut groove G and H in the insulating material protect the joints, that is, the above step 204 and step 205 may be combined into one step.

[0116]可选地,当上述步骤204和步骤205合并为一个步骤时,在切割槽G中充填隔离材料可以包括:采用隔离材料在面板母板0上形成隔离层,以在切割槽G中填充隔离材料。 [0116] Alternatively, when the above-described step 204 and step 205 merge into a single step, cutting the groove G is filled in the insulating material may include: an isolation layer formed on the mother panel using 0 spacer material to the cutting of the groove G filling insulating material. 其中, 在切割槽G中填充隔离材料的过程中,也会向保护缝H中充填隔离材料。 Wherein the process of filling the insulating material, the insulating material is also filled in the protective slits H G of the groove cutting. 在本发明实施例中, 隔离材料可以为PI材料或亚克力材料,面板母板0具有非显示区域和显示区域,面板母板0 的显示区域与显示母板01的显示区域对应,面板母板0的非显示区域为显示母板0上除显示区域之外的区域。 In an embodiment of the present invention, the insulating material may be a material or an acrylic material, PI, mother panel 0 having a non-display region and the region corresponding to the display region, the display region of the display panel mother master 01 0 0 mother panel non-display region other than the display region of the display area on the motherboard 0. 当隔离材料为PI材料时,由于PI材料为非透明材料,因此为了避免隔离层对最终形成的显示面板的出光性能的影响,隔离层可以包括开口区域和隔离区域,开口区域与面板母板0的显示区域对应,隔离区域覆盖在面板母板0的非显示区域上。 When the spacer material is a material PI, since PI material is non-transparent material, so to avoid the influence of the optical properties of the display panel final isolation layer formed of an isolation layer may include an open region and isolation region, the opening region of the mother panel 0 corresponding to a display region, an isolation region overlying the non-display area of ​​the panel 0 motherboard. 当隔离材料为亚克力材料时,隔离层可以包括开口区域和隔离区域,开口区域与面板母板0的显示区域对应,隔离区域覆盖在面板母板0的非显示区域上,或者,隔离层覆盖面板母板0的表面,换句话来讲,面板母板0的显示区域和非显示区域上都覆盖有隔离层。 When the spacer material is a acrylic material, the isolation layer may include an open region and isolation region, the opening region of the mother panel corresponding to the display region, the isolation region overlying 0 non 0 mother panel display region, or the isolation layer cover panel 0 surface of the master, in other words in terms of the display region and a non-0 mother panel display region is covered with a release layer.

[0117]图20是本发明实施例提供的一种在面板母板〇上形成隔离层04后的俯视图,图21 是图2〇的AA部位的剖面图,参见图20和图21,隔离层04包括开口区域(图20和图21中均未标出)和隔离区域(图20和图21中均未标出),开口区域与面板母板〇的显示区域对应,隔离区域覆盖在面板母板0的非显示区域上,且切割槽G中充填有隔离材料041,保护缝H中充填有隔离材料042。 [0117] FIG. 20 is an embodiment of the present invention is provided in view of forming a top isolation layer 04 on the motherboard square panel, FIG. 21 is a sectional view of the portion AA of FIG 2〇, see FIGS. 20 and 21, the isolation layer 04 includes an opening region (FIGS. 20 and 21 were not labeled) and the isolation region (FIGS. 20 and 21 were not shown), corresponding to the display region, isolation region and the opening region of the cover panel mother panel parent billion 0 plate on the non-display area, and the cutting groove G is filled with insulating material 041, is filled with the protective seam H insulation material 042. 其中,在图20和图21中,隔离层04的形成材料可以为PI材料,也可以为亚克力材料,且可以采用喷墨打印工艺形成隔离层04。 Wherein, in FIG. 20 and FIG. 21, spacer material layer 04 may be formed as a PI materials, acrylic materials may also, and isolation layer 04 may be formed using an inkjet printing process.

[0118]图22是本发明实施例提供的另一种在面板母板0上形成隔离层04后的俯视图,图23是图22的AA部位的剖面图,参见图22和图23,隔离层04覆盖面板母板〇的表面,且切割槽G中充填有隔离材料041,保护缝H中充填有隔离材料042。 [0118] FIG. 22 is a embodiment of the present invention provides a plan view of another form the isolation layer 04 on the mother panel 0, FIG. 23 is a sectional view of the portion AA of FIG. 22, see FIG. 22 and FIG. 23, the isolation layer covering the surface of the mother panel 04 billion, and cutting the groove G is filled with insulating material 041, is filled with the protective seam H insulation material 042. 换句话说,隔离层〇4整面覆盖在面板母板0上,也即是,面板母板0的显示区域上和非显示区域上都覆盖有隔离层04。 In other words, the isolation layer covering the entire surface 〇4 mother panel 0, that is, the display area of ​​panel 0 on motherboard and the non-display area is covered with a release layer 04. 其中,在该图22和图23中,隔离层04的形成材料为亚克力材料。 Wherein, in the FIG. 22 and FIG. 23, the isolation layer 04 is formed of a material is acrylic material.

[0119] 步骤206、沿切割线从隔离材料上对面板母板进行切割,得到显示面板。 [0119] Step 206, be cut along the cutting line from the mother panel spacer material to obtain the display panel.

[0120]在本发明实施例中,可以采用激光切割工艺沿显示母板的切割线从隔离材料上对面板母板进行切割得到显示面板,激光切割工艺中常用的切割工具为激光器。 [0120] In an embodiment of the present invention may be employed in the laser cutting process of cutting line from the master display isolation material mother panel is cut to obtain a display panel, a laser cutting process commonly used in the cutting tool is a laser. 可选地,激光器可以为C〇2 (二氧化碳)激光器、固态激光器或准分子激光器等。 Alternatively, the laser may be C〇2 (carbon dioxide) laser, solid state laser, or an excimer laser.

[0121] 图24是对图19所示的显示母板0进行切割得到的显示面板的结构示意图,图25是对图21所示的显示母板0进行切割得到的显示面板的结构示意图,图26是对图23所示的显示母板0进行切割得到的显示面板的结构示意图,参见图24至图26任一,显示面板包括:显示基板011、设置在显示基板011上的显示器件02,以及包覆在显示器件02外侧的封装结构(图24至图26中均未标出),封装结构用于对显示器件02进行封装,如图24至图26任一所示, 该封装结构包括至少一个封装膜层,且该至少一个封装膜层包括无机层0311、有机层0321 和无机层0331,无机层0311和无机层0331的外侧具有隔离材料041,且封装结构的周边区域设置有保护缝(图24至图26中均未标出),该封装结构的周边区域在显示面板上的正投影位于显示面板的非显示区域内,保护缝的深度方向与封装结构的表面垂直, [0121] FIG. 24 is a schematic view of a display panel obtained by cutting the motherboard to the display shown in FIG. 19 for 0, FIG. 25 is a schematic view of a display panel obtained by cutting the motherboard to the display shown in FIG. 21 for 0, FIG. 26 is a schematic view of a display panel obtained by cutting the motherboard 0 display shown in FIG. 23, see FIGS. 24 to 26 of any of the display panel comprising: a display substrate 011, a display device provided on the display 011 on a substrate 02, and a coating on the outside of the display device 02 of the encapsulating structure (FIGS. 24 to 26 were not shown), package 02 for encapsulating a display device, as shown in FIGS. 24 to 26 shown in any of the package structure comprising at least one package layer, and the at least one package layer comprises an inorganic layer 0311, an organic insulating material layer 0321 having the inorganic layer 041 and the outer 0331, 0311 an inorganic layer and an inorganic layer 0331, and the peripheral region of the package structure is provided with a protective seam (FIGS. 24 to 26 were not shown), the peripheral area of ​​the orthogonal projection of the packaging structure on a display panel located on the non-display area of ​​the display panel, the protective depth direction perpendicular to the surface of the package structure of the joints, 保护缝内充填有隔离材料042。 The slit is filled with a protective insulating material 042. 需要说明的是,显示基板011为从显示母板01上切割下来的部分,无机层0311为从无机层031上切割下来的部分,有机层0321为从有机层032上切割下来的部分,无机层0331为从无机层033上切割下来的部分。 Note that, as part of the display substrate 011, the organic layer was cut from a portion of motherboard 01, 0311 to the inorganic layer on the inorganic layer 031 cut from 0321 down to cut down from the upper portion of the organic layer 032 from the display, the inorganic layer 0331 is cut off from the upper portion of the inorganic layer 033.

[0122] 本发明实施例中,由于切割槽中充填有隔离材料041,该隔离材料041可以将切割工具与无机层隔离,避免切割过程在无机层上形成裂纹;并且,在切割形成的图24至图26任一所示的显示面板中,隔离材料041将显示面板的边缘与外界隔离,避免搬运显示面板的过程中触碰封装结构的无机层导致无机层上产生裂纹,此外,即使无机层上产生裂纹,保护缝也可以对裂纹进行阻挡,避免裂纹向靠近显示器件02的方向扩展,并且,保护缝中充填有隔离材料042,该隔离材料042可以增强封装结构的机械强度。 [0122] embodiment of the present invention, since the cut trench is filled with insulating material 041, the spacer material 041 may be isolated from the cutting tool and the inorganic layer to prevent cracks in the cutting process is formed on the inorganic layer; and, in the cut 24 formed in FIG. a display panel according to FIG. 26, the insulating material 041 to the edge of the display panel from the outside world, to avoid handling the display process of the inorganic layer package structure of the touch panel resulting in cracks on the inorganic layer, in addition, even if the inorganic layer the crack, the crack can be protected slits be blocked to avoid cracks near the extended direction of the display device 02, and the protective cracks filled with insulation material 042, the spacer material 042 can enhance the mechanical strength of the package.

[0123] 需要说明的是,本发明实施例为了便于观察,在图6中示出了显示器件02,且在图8、图10、图12、图14、图16、图18以及图20中示出了显示器件02和有机层032,实际应用中,由于无机层031覆盖在显示器件02上,且无机层033覆盖在有机层032上,因此,在图6中是无法观察到显示器件02的,在图8、图10、图12、图14、图16、图18以及图20中均无法观察到显示器件02和有机层032。 [0123] Incidentally, embodiments of the present invention, for ease of viewing in FIG. 6 shows a display device 02, and in FIG. 8, FIG 10, FIG 12, FIG 14, FIG 16, FIG 18 and FIG. 20 It shows a display device 02 and an organic layer 032, the practical application, since the inorganic layer 031 overlaid on the display device 02, and the inorganic layer 033 covers the organic layer 032, therefore, not be observed to the display device 02 in FIG. 6 in FIG. 8, FIG 10, FIG 12, FIG 14, FIG 16, FIG 18 and FIG 20 are not observed in the organic layer 02 and the display device 032.

[0124]还需要说明的是,本发明实施例提供的显示面板的制造方法步骤的先后顺序可以进行适当调整,步骤也可以根据情况进行相应增减,例如,上述步骤2〇2和步骤2〇3可以合并为一个步骤,上述步骤204和步骤205可以合并为一个步骤;或者,上述步骤2〇3和步骤204的顺序可以颠倒,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化的方法,都应涵盖在本发明的保护范围之内,因此不再赘述。 [0124] It is further noted that the sequence of steps of the method of manufacturing a display panel according to an embodiment of the present invention may be appropriately adjusted, corresponding steps may be increased or decreased according, for example, the above-described steps 2〇2 step 2〇 3 may be combined into one step, the above-described step 204 and step 205 may be combined into one step; or order of the above steps 2〇3 step 204 may be reversed, any skilled in the art in the art disclosed in the art within the scope of the present invention, the method can be easily thought of the changes, shall fall within the protection scope of the present invention, it is omitted. LJ好、上所还,不友明头施例提供的显示面板制造方法,沿面板母板的切割线在封装结构层上形成巧割槽,并在切割槽中充填隔离材料,沿切割线从隔离材料上对面板母板进行切割得到显示面板,由于隔离材料的柔性大于与隔离材料接触的封装膜层的柔性,该隔离材料可以将封装膜层隔离,避免切割以及搬运过程导致封装膜层上产生裂纹,有助于解f封装结构的封装效果较差的问题,提高封装结构的封装效果。 LJ is good, but also on the display panel manufacturing method does not provide a Friends of the first embodiment, the mother panel along cut line formed on the package Qiao undercut structural layer, and filling the cut trench isolation material, along the cutting line from the barrier material is cut to obtain mother panel display panel, since the flexible insulation material is greater than the flexible encapsulating film in contact with the insulating material, the isolation layer isolating material may be encapsulated to avoid the handling and cutting process causes the film on the package cracks, contribute to the problem of poor encapsulation package structure effect solution f, to improve sealing effectiveness package structure. 此外,由于封装膜层覆盖显示母^的表面,因此封装膜层的形成过程无需使用掩膜版,从而无需预留空白区域,便于实现显示面板的窄边框显示,且降低显示面板的制造成本。 Further, since the encapsulating film layer covering the display surface of the mother ^, so the formation of the package without the use of the mask layer, thus eliminating the need to reserve a blank area, the display is easy to realize a narrow frame of the display panel, and reduce the manufacturing cost of the display panel.

[0126]本发明实施例还提供了一种采用图1或图2所示的方法制造的显示面板,该显示面板可以包括封装结构,封装结构包括至少一个封装膜层,至少一个封装膜层的外侧具有隔离材料,该隔离材料的柔性大于与该隔离材料接触的封装膜层的柔性。 [0126] Embodiments of the present invention further provides a manufacturing method shown in FIG. 1 or FIG. 2 is a display panel, the display panel may include a package, the package comprises at least one encapsulating layer, of at least one package layer insulating material having outer side, is greater than the flexibility of the flexible packaging insulation material film in contact with the insulation material.

[0127]可选地,该封装结构的周边区域设置有保护缝,保护缝的深度方向与封装结构的表面垂直,并且保护缝中填充有隔离材料,该封装结构的周边区域在显示面板上的正投影位于显示面板的非显示区域内。 [0127] Alternatively, the peripheral area of ​​the package is provided with a protective seam depth direction perpendicular to the surface of the protective package seams and crevices filled with a protective insulating material, the peripheral region of the package structure on a display panel orthographic display panel located within the non-display area.

[0128]在本发明实施例中,该显示面板可以为图24至图26任一所示的显示面板。 [0128] In an embodiment of the present invention, the display panel may be a display panel shown in any of FIGS. 24 to 26. 参见图24至图26任一,封装结构的至少一个封装膜层包括依次叠加的无机层〇311、有机层0321和无机层0331,无机层0311和无机层0331的外侧都具有隔离材料041,该隔离材料041的柔性可以大于无机层0311的柔性,且大于无机层0331的柔性,封装结构的周边区域设置有保护缝(图24至图26中均未标出),保护缝内充填有隔离材料042。 Referring to any one 24 to 26, at least one package layer packaging structure comprises an inorganic layer sequentially superposed 〇311, 0321 outer organic layer and the inorganic layer 0331, 0311 of the inorganic layer and the inorganic layer 0331 have the insulating material 041, which insulating material 041 may be greater than the flexibility of the flexible inorganic layer 0311, and the inorganic layer 0331 is greater than the flexibility of the peripheral area of ​​the package is provided with a protective seam (FIGS. 24 to 26 were not shown), is filled with a protective insulating material inseam 042.

[0129] 进一步地,如图24至图26任一所示,该显示面板还包括显示基板011,显示基板011 上设置有显示器件02,封装结构用于对显示器件02进行封装。 [0129] Further, as shown in FIGS. 24 to 26 shown in any one of, the display panel further includes a display substrate 011, a display 011 is provided with a display device on a substrate 02, a package structure for a display device 02 for encapsulation. 在本发明实施例中,该显示器件02可以为0LED器件或者QLED器件,当显示器件02为OLK)器件时,该显示面板为OLED显示面板,例如,该显不面板有源矩阵有机电致发光二极管(英文:Active Matrix Organic Light Emitting Diode;简称:AM0LED)显示面板,当显示器件02为QLED器件时,该显示面板为QLED显示面板。 In an embodiment of the present invention, the display device 02 may be a device or a QLED 0LED device, when the display device 02 of OLK) device, the display panel is an OLED display panel, e.g., an active matrix panel which does not significantly organic electroluminescent diode (English: Active Matrix Organic Light Emitting diode; abbreviation: AM0LED) display panel, when the display device is QLED device 02, the display panel is a display panel QLED.

[0130]还需要说明的是,本申请实施例仅仅是对显示面板的结构进行了简单说明,显示面板的详细结构可以参考前述显示面板的制造方法的实施例,本发明实施例在此不再赘述。 [0130] It is further noted that the present embodiment is merely the application display panel structure has been briefly described, the detailed structure of the display panel may Reference Example aforementioned method of manufacturing a display panel, embodiments of the invention which is not repeat.

[0131] 本发明实施例还提供了一种显示装置,该显示装置可以包括显示面板,该显示面板可以为图24至图26任一所示的显示面板。 [0131] Embodiments of the present invention further provides a display apparatus, the display device may include a display panel, the display panel may be a panel is shown in any of FIGS. 24 to 26. 其中,该显示装置可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框或导航仪等任何具有显示功能的产品或部件。 Wherein, the display device may be a mobile phone, a tablet computer, a television, monitors, notebook computers, digital photo frame or any other product or navigation means having a display function.

[0132] 本领域普通技术人员可以理解实现上述实施例的全部或部分步骤可以通过硬件来完成,也可以通过程序来指令相关的硬件完成,所述的程序可以存储于一种计算机可读存储介质中,上述提到的存储介质可以是只读存储器,磁盘或光盘等。 [0132] Those of ordinary skill in the art may understand that the above embodiments all or part of the steps may be implemented by hardware, by a program instruction may be relevant hardware, the program may be stored in a computer-readable storage medium in the above-mentioned storage medium may be a read-only memory, magnetic or optical disk.

[0133] 以上所述仅为本发明的可选实施例,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。 [0133] The alternative embodiment described above are only embodiments of the present invention, not intended to limit the present invention, any modifications within the spirit and principle of the present invention, the, equivalent replacement, or improvement, should be included in the present within the scope of the invention.

Claims (15)

1. 一种显示面板的制造方法,其特征在于,所述方法包括: 在显示母板上形成封装结构层,得到面板母板,所述封装结构层包括至少一个封装膜层,所述至少一个封装膜层覆盖所述显示母板的表面; 沿所述面板母板的切割线在所述封装结构层上形成切割槽; 在所述切割槽中充填隔离材料,所述隔离材料的柔性大于与所述隔离材料接触的封装膜层的柔性; 沿所述切割线从所述隔离材料上对所述面板母板进行切割,得到显示面板。 1. A method of manufacturing a display panel, wherein, said method comprising: forming an encapsulation layer on the display motherboard structure, to give mother panel, the encapsulation structure comprises at least one layer of the film package, said at least one encapsulating film layer covering the display surface of the master; cutting grooves formed on the package structure of the panel along the cutting line layer motherboard; in the cut trench filling insulation material, the insulation material is greater than the flexible the isolation layer of flexible packaging material in contact; the mother panel is cut from the spacer material along the cutting lines to obtain a display panel.
2. 根据权利要求1所述的方法,其特征在于,在显示母板上形成封装结构层,得到面板母板之后,所述方法还包括:在所述封装结构层上形成保护缝,所述保护缝位于所述面板母板的显示区域与所述切割线之间,且所述保护缝的深度方向与所述封装结构层的表面垂直。 2. The method according to claim 1, wherein the packaging structure is formed in the display layer motherboard, after obtaining mother panel, said method further comprising: forming a slit in the protective layer on the package structure, the slit located between the protective panel display area and the motherboard cut line, and a depth direction perpendicular to the surface of the protective structure layer of the package seam.
3. 根据权利要求2所述的方法,其特征在于,在所述封装结构层上形成保护缝之后,所述方法还包括:在所述保护缝中填充隔离材料。 3. The method according to claim 2, characterized in that, after the slit forming a protective layer on the package structure, the method further comprising: filling the cracks in the protective insulating material.
4. 根据权利要求2所述的方法,其特征在于, 所述沿所述面板母板的切割线在所述封装结构层上形成切割槽,包括: 采用刻蚀工艺沿所述面板母板的切割线在所述封装结构层上形成切割槽; 所述在所述封装结构层上形成保护缝,包括: 采用刻蚀工艺在所述封装结构层上形成保护缝。 4. The method according to claim 2, characterized in that, the mother panel cut line cutting grooves are formed on the package in the layer structure, comprising: using an etching process along the panel motherboard cutting grooves in the cutting line is formed on the package structure layer; forming the protective seam, comprising a structural layer on the package: sewn using an etching process to form a protective layer on the package structure.
5. 根据权利要求1至4任一所述的方法,其特征在于,所述在所述切割槽中充填隔离材料,包括:采用隔离材料在所述面板母板上形成隔离层,以在所述切割槽中填充所述隔离材料。 The method according to any one of claim 1 to claim 4, wherein, in said cut trench filling insulation material, comprising: forming an isolation layer of insulating material employed in the mother board panel, in order that cutting said insulating material filling the groove.
6. 根据权利要求5所述的方法,其特征在于,所述隔离材料为聚酰亚胺材料或亚克力材料。 6. The method according to claim 5, wherein said insulating material is a polyimide material or an acrylic material.
7. 根据权利要求6所述的方法,其特征在于,所述面板母板具有非显示区域和所述显示区域, 所述隔离材料为聚酰亚胺材料,所述隔离层包括覆盖在所述非显示区域上的隔离区域; 所述隔离材料为亚克力材料,所述隔离层包括覆盖在所述非显示区域上的隔离区域, 或者,所述隔离层覆盖所述面板母板的表面。 7. The method according to claim 6, characterized in that, the mother panel having a non-display area and the display area, the insulating material is a polyimide material, the isolation layer includes covering the the non-display region on the isolation region; the isolation material is a acrylic material, the isolation layer includes covering the non-display region on the isolation region of the, or, the isolation layer covering the surface of the master panel.
8. 根据权利要求1至4任一所述的方法,其特征在于,所述沿所述切割线从所述隔离材料上对所述面板母板进行切割,包括:采用激光切割工艺沿所述切割线从所述隔离材料上对所述面板母板进行切割。 The method according to any one of claim 1 to claim 4, wherein the panel is cut from the mother material of the spacer along the cutting line, comprising: a laser cutting process in the cutting the cutting line from the mother panel spacer material.
9. 根据权利要求1至4任一所述的方法,其特征在于,所述至少一个封装膜层包括依次叠加的无机层、有机层和无机层,所述在显示母板上形成封装结构层,包括: 采用化学气相沉积工艺在所述显示母板上形成无机层; 采用喷墨打印工艺在形成有所述无机层的显示母板上形成有机层; 采用化学气相沉积工艺在形成有所述有机层的显示母板上形成无机层,得到所述封装结构层。 9. The method according to any of claims 1 to 4, characterized in that said at least one package layer comprises sequentially laminating an inorganic layer, an organic layer and an inorganic layer, the layer is formed in the display packaging structure motherboard , comprising: a chemical vapor deposition process for forming an inorganic layer on the display motherboard; inkjet printing processes are formed on the mother board display inorganic layer forming an organic layer; chemical vapor deposition process employed in the formed the organic layer is displayed on the motherboard forming the inorganic layer, to obtain the encapsulation layer structure.
10. —种采用权利要求1至9任一所述的方法制造的显示面板,其特征在于,所述显示面板包括封装结构,所述封装结构包括至少一个封装膜层,所述至少一个封装膜层的外侧具有隔离材料,所述隔离材料的柔性大于与所述隔离材料接触的封装膜层的柔性。 10. - species using a display panel manufacturing method according to any one of claims 1 to 9, wherein the display panel comprises a package, the package comprises at least one encapsulating layer, the at least one package film the outer layer having a insulating material, the flexible material is greater than the spacer layer in contact with the packaging material is a flexible spacer.
11. 根据权利要求10所述的显示面板,其特征在于,所述封装结构的周边区域设置有保护缝,所述保护缝的深度方向与所述封装结构的表面垂直,所述封装结构的周边区域在所述显示面板上的正投影位于所述显示面板的非显示区域内。 11. The display panel of claim 10, wherein the peripheral region of the packaging structure is provided with a protective seam depth direction perpendicular to the surface of the protective seam of the package structure, the peripheral structure of the package orthogonal projection area of ​​the display panel is located on the non-display region of the display panel.
12. 根据权利要求11所述的显示面板,其特征在于,所述保护缝中填充有隔离材料。 12. The display panel of claim 11, wherein said protective insulating material is filled with a seam.
13. 根据权利要求10至12任一所述的显示面板,其特征在于,所述显示面板还包括显示基板,所述显示基板上设置有显示器件,所述封装结构用于对所述显示器件进行封装。 The display panel 10 to 1 according to any of claim 12, wherein the display panel further includes a display substrate, the display is provided with a display device on a substrate, the encapsulation structure for said display device encapsulation.
14. 根据权利要求13所述的显示面板,其特征在于,所述显示器件为有机发光二极管器件或者量子点发光二极管器件。 14. The display panel of claim 13, wherein said display device is an organic light emitting diode device or a quantum dot light emitting diode device.
15. —种显示装置,其特征在于,所述显示装置包括:权利要求10至14任一所述的显示面板。 15. - kind of display device, wherein, said display device comprising: a display panel 14 10-1 claims.
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