CN112306272A - Touch mother board, touch panel and touch display device - Google Patents
Touch mother board, touch panel and touch display device Download PDFInfo
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- CN112306272A CN112306272A CN201910677811.8A CN201910677811A CN112306272A CN 112306272 A CN112306272 A CN 112306272A CN 201910677811 A CN201910677811 A CN 201910677811A CN 112306272 A CN112306272 A CN 112306272A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
Abstract
The invention provides a touch mother board, a touch panel and a touch display device, wherein the touch mother board comprises a display mother board, a plurality of touch panels on one side of the display mother board and a first cutting area between any two adjacent touch panels; the touch panel comprises a first induction electrode layer, a dielectric layer, a second induction electrode layer and an insulating protection layer; the first cutting region comprises a patterned region formed by at least one patterned organic thin film layer and/or one patterned inorganic thin film layer, and the organic thin film layer or the inorganic thin film layer is any one layer or any combination of multiple layers in the touch panel. The touch mother board is patterned in the first cutting area, so that the edge stress can be buffered, the flexibility can be improved, the generation of cracks can be reduced, the yield of the touch panel in the cutting process can be improved, and the risk of the cracks generated on the edges of the display panel and the touch panel in the subsequent manufacturing process and the use after cutting can be reduced.
Description
Technical Field
The invention relates to the field of display devices, in particular to a touch mother board, a touch panel and a touch display device.
Background
With the continuous development of society, mobile phones, computers and televisions all need to use visual screens, and the demand of people on the display screens is higher and higher. An organic electroluminescent display panel is a display screen made of organic electroluminescent diodes. The organic electroluminescent display has the excellent characteristics of self-luminous organic electroluminescent diode, no need of backlight source, high contrast, thin thickness, wide viewing angle, high reaction speed, wide use temperature range, simple structure and manufacture process and the like, and is considered as a new application technology of the next generation of flat panel display.
In the process of manufacturing the organic electroluminescent display panel, in order to improve the production efficiency and reduce the production cost, a single organic electroluminescent display panel is generally obtained by cutting after being integrally manufactured on a mother board. Taking the manufacturing of a display panel motherboard packaged by a flexible substrate film as an example, a plurality of display unit structures are simultaneously manufactured on the display panel motherboard in a high-utilization-rate arrangement mode (usually an array), after the manufactured display unit structures are subjected to film layer packaging, cutting and separating are carried out in a spacing area between two adjacent display units, and then other subsequent processes are respectively carried out on a plurality of independent flexible display panels. However, the encapsulation layer with a thin overall coverage in the process of preparing the motherboard is generally an inorganic insulating layer (SiNx, SiOx, etc.), when these brittle inorganic insulating layers are cut, edge cracks (Crack) may be generated, especially in some flexible display panels that can be bent, the bending easily causes the edge cracks to extend from the cut to the display panel region, thereby causing the encapsulation layer with waterproof oxygen to fail or causing functional devices in the display panel to break, finally causing the functional failure of the display panel, and greatly affecting the service life of the display panel.
At present, a touch panel and a display panel are integrated together through a panel process by a new technology, so that the whole thickness of the display panel can be reduced, and a narrow frame can be displayed. In the preparation process of the touch mother board, the touch panel including the display panel is obtained by cutting the mother board because the touch mother board is integrally prepared on the display mother board, and the touch panel prepared by cutting has the risk of cracking of the inorganic film layer in the subsequent process due to the edge cutting path.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present invention and therefore may include information that does not constitute prior art known to a person of ordinary skill in the art.
Disclosure of Invention
In view of the problems in the prior art, an object of the present invention is to provide a touch mother board, a touch panel and a touch display device, in which the touch mother board is patterned in a cutting region to control the extension of cracks generated by cutting to the touch panel region, thereby improving the life of the touch panel.
The embodiment of the invention provides a touch mother board, which comprises a display mother board, a plurality of touch panels on one side of the display mother board and a first cutting area between any two adjacent touch panels;
the display mother board comprises a substrate, a plurality of display panels and a second cutting area between any two adjacent display panels; the display panel comprises a thin film array transistor layer, a light-emitting device layer and a thin film packaging layer;
each touch panel corresponds to each display panel one to one;
the touch panels and the first cutting areas cover the light emitting side of the display mother board; the touch panel comprises a first induction electrode layer, a dielectric layer, a second induction electrode layer and an insulating protection layer;
the first cutting region comprises a patterned region formed by at least one patterned organic thin film layer and/or one patterned inorganic thin film layer, and the organic thin film layer or the inorganic thin film layer is any one layer or any combination of multiple layers in the touch panel.
According to an example of the present invention, the first cutting region further includes a scribe line, and the patterned region is located between the scribe line and an adjacent touch panel.
According to an example of the present invention, the organic thin film layer and the inorganic thin film layer of the patterned region are alternately stacked in a direction perpendicular to the substrate.
According to an example of the present invention, the pattern of the organic thin film layer and the pattern of the inorganic thin film layer overlap in a direction perpendicular to the substrate.
According to an example of the present invention, the organic thin film layer and the inorganic thin film layer of the patterned region alternate in a direction parallel to the substrate.
According to an example of the present invention, the pattern is a protrusion layer on a cross section perpendicular to a plane of the substrate, and a shape of the protrusion layer includes a circular arc shape, a polygonal shape, and/or a continuous wavy shape.
According to an example of the present invention, the polygon includes one of a triangle, a trapezoid, a rectangle, or any combination thereof.
According to an example of the present invention, when the organic thin film layer and the inorganic thin film layer of the patterned region alternate in a direction parallel to the substrate, the pattern of the pattern on a cross section parallel to a plane of the substrate is one of a stripe line, an arc line or a polygon, or any combination thereof.
According to an example of the invention, the pattern extends in the cutting direction.
According to an example of the present invention, the patterned organic thin film layer is obtained by one or more of a thermal evaporation method, a spin coating method, a spray coating method, a screen printing method, and an inkjet printing method; the patterned inorganic thin film layer is obtained by one or more of sputtering, vacuum deposition, electron beam evaporation, atomic layer deposition, chemical vapor deposition, plasma-enhanced chemical vapor deposition, high-density plasma chemical vapor deposition, inductively coupled plasma chemical vapor deposition, capacitively coupled plasma-enhanced chemical vapor deposition, surface wave plasma chemical vapor deposition or ion beam assisted deposition.
The embodiment of the invention also provides a touch panel obtained by cutting the first cut area of the touch motherboard.
The embodiment of the invention also provides a touch display device which comprises the touch panel.
The touch mother board is patterned in the first cutting area, the patterned material is selected from one layer or any combination of multiple layers of film layers included in the touch panel, the original preparation process is compatible, edge stress can be buffered, flexibility can be improved, generation of cracks and extension of the cracks to the touch panel area can be reduced, and the service life of the touch panel is prolonged.
Drawings
Other features, objects, and advantages of the invention will be apparent from the following detailed description of non-limiting embodiments, which proceeds with reference to the accompanying drawings and which is incorporated in and constitutes a part of this specification, illustrating embodiments consistent with the present application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic cross-sectional view of a touch motherboard according to an embodiment of the invention;
fig. 2 is a top view of a touch motherboard according to an embodiment of the invention;
fig. 3 is a schematic cross-sectional view of a touch motherboard according to another embodiment of the invention;
fig. 4 to 8 are top views of organic thin film layers and/or inorganic thin film layers patterned according to an embodiment of the present invention.
Reference numerals
S1 touch panel
S2 first cutting region
S3 shows
S4 second cutting area
100 substrate
110 backboard waterproof oxygen film layer
120 thin film transistor array layer
130 light emitting device layer
140 thin film packaging structure
510 first sensing electrode layer
520 dielectric layer
530 second sensing electrode layer
540 insulating protective layer
600 polarizer layer
700 optical adhesive glue layer
800 cutting channel
900 patterning regions
910 organic thin film layer
920 inorganic film layer
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted. Some of the block diagrams shown in the figures are functional entities and do not necessarily correspond to physically or logically separate entities.
Fig. 1 is a schematic cross-sectional view of a touch motherboard according to an embodiment of the invention. Specifically, the display device comprises a display mother board, a plurality of touch panels S1 on one side of the display mother board, and a first cutting area S2 between any two adjacent touch panels;
the display mother board comprises a substrate 100, a plurality of display panels S3 and a second cutting area S4 between any two adjacent display panels; the display panel S3 includes a thin film array transistor layer 120, a light emitting device layer 130, and a thin film encapsulation layer 140;
the substrate 100 may be a rigid substrate or a flexible substrate, the rigid substrate may be a glass substrate, the flexible substrate may have a single-layer or multi-layer flexible substrate film, the flexible substrate film may be made of a flexible substrate material such as Polyimide (PI), polyethylene terephthalate (PET), polybutylene naphthalate (PBN), or polycarbonate, or may be a metal foil. In the present embodiment, a single layer PI film is used for the flexible substrate. In other embodiments of the present invention, the flexible substrate may be a multilayer PI film, or a multilayer PET film, or have a multilayer film structure in which PI films and PET are alternately laminated.
The x-axis and y-axis in fig. 1 are defined as the plane parallel to the substrate and the z-axis is perpendicular to the substrate plane. The display panel S3 includes:
and a thin film transistor array layer 120 on one side of the substrate 100, wherein the thin film transistor array layer 120 includes a gate layer, a gate insulating layer, an active layer, a source layer, a drain layer, and the like.
A light emitting device layer 130 located on a side of the thin film transistor array layer 120 away from the substrate, the light emitting device layer including an anode layer, a light emitting functional layer, and a cathode layer; the light emitting function Layer may further include a Transport Layer stacked between the anode Layer and the cathode Layer, where the Transport Layer includes one or more of an Electron Injection Layer (EIL), an Electron Transport Layer (ETL), a Hole Transport Layer (HTL), a Hole Injection Layer (HIL), an insulating Layer between the Transport Layer and the anode Layer or between the Transport Layer and the cathode Layer, or any combination thereof (not shown in the drawings). The light-emitting functional layer of the present invention can be selectively designed according to the actual requirements of each product on the light-emitting brightness and the light-emitting efficiency.
A thin film encapsulation structure 140 covering a surface of the light emitting device layer away from the substrate 100; the thin film encapsulation structure 140 directly covers the light emitting device layer 130. In practice, to better perform the function of preventing water and oxygen, the thin film encapsulation structure 140 may include a plurality of encapsulation layers, and the properties of each encapsulation layer may have a certain complementary effect. The inorganic packaging layer has higher compactness and is mainly used for blocking the invasion of water and oxygen, but the inorganic packaging layer has lower elasticity and larger internal stress and is easier to crack or peel under the action of internal force or external force; and the organic packaging layer has strong flexibility and can be used for reducing the stress of the thin film packaging structure. In an embodiment of the present invention, the thin film encapsulation structure 140 may be an alternating stacked structure of at least an inorganic encapsulation layer and an organic encapsulation layer.
The thin film transistor array layer 120 includes a gate layer, a gate insulating layer, an active layer, a source layer, a drain layer, and the like.
The anode layer and the cathode layer of the light emitting device layer 130 may be patterned or continuous conductive thin films, respectively.
The light emitting functional layer of the light emitting device layer 130 may be an organic electron transport material such as a compound containing pyridine, quinoline, imidazole, thiazole, pyrimidine, and triazine, AlQ3, BPhen, BCP, and some derivatives of anthracene, and the like.
Each touch panel S1 corresponds to each display panel S3 one by one, that is, the first cut region S2 corresponds to the second cut region S4 one by one, and the plurality of touch panels S1 and the first cut region S2 cover the light-emitting side of the display motherboard; the touch panel S1 includes a first sensing electrode layer 510, a dielectric layer 520, a second sensing electrode layer 530 and an insulating protection layer 540.
The first sensing electrode layer 510 includes a plurality of first sensing electrodes, which may extend along a first direction, and the second sensing electrode layer 530 includes a plurality of second sensing electrodes, which extend along a second direction, the first direction and the second direction being staggered; the first sensing electrode and the second sensing electrode are separated at the crossing by a dielectric layer 520, and the dielectric layer 520 may be an inorganic material having an insulating property or an organic material having an insulating property. And forming a capacitor at the crossed and overlapped part of the first sensing electrode and the second sensing electrode for sensing the touch position of a user.
The first induction electrodes (or the second induction electrodes) are connected at staggered positions through a bridging structure, and the second induction electrodes or the first induction electrodes form a connecting part through materials on the same layer, so that the structure is called a single-layer structure; the first sensing electrodes form a connecting part at the staggered position through the same layer of materials, and the structure is called as a double-layer structure.
Specifically, the materials of the first and second sensing electrode layers 510 and 530 include a thin film of a simple substance of metal elements of aluminum (Al), magnesium (Mg), calcium (Ca), sodium (Na), gold (Au), silver (Ag), copper (Cu), chromium (Cr), platinum (Pt), nickel (Ni), or an alloy thereof; or oxides such as Indium Tin Oxide (ITO), indium zinc oxide (InZnO), zinc oxide (ZnO), and the like; or silver nanowires (AgWN), Metal Mesh (Metal Mesh), graphene, carbon nanowires, and the like. But not limited thereto, thinner materials may also be used. The thickness of the first sensing electrode layer 510 and the second sensing electrode layer 530 ranges from 0.001um to 0.5um, but not limited thereto.
Such as indium tin oxide ITO. Alternatively, the first sensing electrode layer 510 is made of a low resistance metal electrode such as a metal mesh to reduce a touch line load of the first sensing electrode layer 510 closer to the cathode of the display panel S3. Optionally, the second sensing electrode layer 530 is made of a low-reflection material such as a transparent conductive material to achieve a better optical effect, and the area of each second sensing electrode of the second sensing electrode layer 530 can be increased to increase the amount of signals received by the second touch electrode.
The insulating protection layer 540 is disposed on a side of the insulating medium layer 30 away from the display module 20, and the insulating protection layer 540 is used to prevent the first sensing electrode layer 510 and the second sensing electrode layer 530 from being scratched and from being corroded by water and oxygen in the environment, so as to prolong the service life of the device. The insulating protective layer 540 may be made of hard materials such as glass and quartz, or soft materials such as plastic, silicon nitride, silicon carbide, and metal oxide, so as to realize flexible display function; the organic material can also be adopted, so that the effects of reducing invasion and scratches of water and oxygen in the external environment and the like can be realized, and the effect of surface planarization can be realized.
The first cut region S2 includes at least one patterned organic thin film layer and/or a patterned inorganic thin film layer 900, and the organic thin film layer 910 or the inorganic thin film layer 920 is any one layer or any combination of layers of the touch layer. The touch panels S1 are stacked and interconnected in a direction perpendicular to the substrate surface to form a three-dimensional package structure.
The top view of the touch panel mother panel in fig. 2 only shows the first cut region S2 between two touch panels S1. The first cutting region S2 may further include a scribe lane 800 for cutting, if the middle line of any two adjacent touch panels is regarded as a cutting line, see the middle dotted line of fig. 2, the scribe lane 800 may be located on both sides of the dotted line, and the region between the scribe lane 800 and the touch panels on both sides is the patterned region 900 in the present invention. The scribe line 800 may have the same multi-layer structure as the patterned region 900, or may be the substrate 100 where the organic layer and the inorganic layer are removed by etching or the like in the region above the substrate 100. When the touch panels are cut and separated along the scribe line 800, the patterned regions on both sides of the scribe line 800 may serve as buffer regions for cutting stress. As shown in fig. 2, the patterned region may include a plurality of gaps, and the plurality of gaps extend along the direction of the scribe line 800, i.e., along the y-axis, and are aligned along the direction perpendicular to the scribe line 800, i.e., along the x-axis, so as to buffer the stress transferred to the left and right sides of the scribe line 800 during the cutting.
In the embodiment of the invention, the periphery of each touch panel S1 has a patterned region 900, which is patterned into a protrusion layer on a cross section (x-axis and z-axis planes) perpendicular to the plane of the substrate, and the shape of the protrusion layer includes circular arc, polygon and/or continuous wave. The polygon comprises one of a triangle, a trapezoid, a rectangle, or any combination thereof.
In the embodiment of fig. 1, the cross-sectional view of the patterned protrusion layer in the plane perpendicular to the substrate, i.e., the x-axis and z-axis planes thereof, is rectangular, and when the organic thin film layers 910 and the inorganic thin film layers 920 of the patterned region 900 are alternately stacked in the direction perpendicular to the substrate (z-axis direction), the cross-sectional view thereof shows the superposition of the organic protrusion layers and the inorganic protrusion layers, in fig. 1, the widths of the patterns of the organic thin film layers 910 and the inorganic thin film layers 920 are the same, i.e., the patterns of the organic thin film layers and the inorganic thin film layers overlap in the direction perpendicular to the substrate. In practice, the number of layers of the organic thin film layer 910 and the inorganic thin film layer 920 alternately stacked is not limited, and it is preferable that the patterned region 900 be formed to have a thickness of 0um to 500 um. Also, the width of the pattern of each layer may be different.
In the present invention, the patterned organic thin film layer 910 is obtained by one or more of thermal evaporation, spin coating, spraying, screen printing, and inkjet printing; the patterned inorganic thin film layer 920 is obtained by one or more of sputtering, vacuum deposition, electron beam evaporation, atomic layer deposition, chemical vapor deposition, plasma-enhanced chemical vapor deposition, high-density plasma chemical vapor deposition, inductively coupled plasma chemical vapor deposition, capacitively coupled plasma-enhanced chemical vapor deposition, surface wave plasma chemical vapor deposition, or ion beam assisted deposition.
The organic thin film layers 910 and the inorganic thin film layers 920 of the patterned region 900 may be alternately stacked in the z-axis direction, or may be alternately stacked in a direction parallel to the substrate, that is, the organic thin film layers 910 and the inorganic thin film layers 920 are in the same plane parallel to the substrate, as shown in fig. 3. As shown in the direction of fig. 2, in view of the cutting direction being the direction of the y-axis, it is preferable that the organic thin film layers 910 and the inorganic thin film layers 920 alternate in the direction of the x-axis. Fig. 4 to 8 are top views of organic thin film layers and/or inorganic thin film layers patterned according to an embodiment of the present invention. As can be seen from the top views, the pattern of the organic thin film layer 910 or the inorganic thin film layer 920 is preferably one or any combination of a stripe line, an arc line (as shown in fig. 4 or fig. 5) or a polygon in a cross section (x-axis and y-axis planes) parallel to the plane of the substrate, and the pattern extends along the cutting direction (y-axis).
The film layers patterned alternately in the x-axis direction are not limited to the alternation of the organic thin film layers 910 and the inorganic thin film layers 920, and may be the alternation of the organic thin film layers 910 and the inorganic thin film layers 910 (as shown in fig. 6), or the patterning of one organic thin film layer near the scribe line 800 and the patterning of the other organic thin film layer near the edge of the touch panel, as shown in fig. 2.
The material of the patterned region 900 in the present invention can be selected from any one layer or any combination of multiple layers required for preparing the touch panel S1. Thus, different patterned region 900 materials may be selected according to the needs of different touch panels. The organic material has strong flexibility, and the patterned organic thin film layer extending along the y-axis direction can control the microcracks extending along the x-axis direction to further extend towards the inside of the touch panel. Meanwhile, in order to reduce the damage to the patterned region 900 itself in the subsequent motherboard cutting process, the patterned region 900 may also be designed as shown in fig. 7, that is, the pattern extends in the x-axis direction, and the extending pattern in the x-axis direction may further enhance the stress action in the x-axis direction. Or as shown in fig. 5 and 8, the patterned region 900 is a grid structure, and the hatched portions and the blank portions in fig. 5 and 8 may be provided with an organic thin film layer (inorganic thin film layer) only in the hatched portions (blank portions), or any combination of different organic thin film layers and no thin film layer. In fig. 4 to 8, the organic thin film layer 910 and the inorganic thin film layer 920 may be replaced with each other.
In the embodiment of the invention, the touch mother board further includes one or any combination of a plurality of layers of the backplane waterproof oxygen film layer 110, the polarizer layer 600 or the optical adhesive layer 700.
The embodiment of the invention also provides a touch panel which is obtained by cutting the touch motherboard, and the first cutting area of the touch motherboard can be cut by methods such as laser cutting; or the same cutting as that of the display panel below, such as knife wheel cutting or laser cutting, or a combination of the two ways.
The embodiment of the invention also provides a touch display device which comprises the touch panel. In specific implementation, the touch display device provided in the embodiments of the present disclosure may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a media player, a watch device, a pendant device, an earphone or a headphone device, a navigation device, a wearable or miniature device, an embedded device of a system in which an electronic device having a display is installed in a self-service terminal or an automobile, and the like.
In summary, the present invention provides a touch mother board, a touch panel and a touch display device, wherein the first cut region of the touch mother board has a patterned organic thin film layer and/or inorganic thin film layer, and the material of the organic thin film layer and/or inorganic thin film layer is selected from any one layer or any combination of multiple layers required for preparing the touch panel. The preparation process of the first cutting area is compatible with the original touch mother board process, the cost is saved, meanwhile, the flexibility of the touch mother board is increased through edge patterning, the mother board is prevented from being damaged and destroyed by cutting on each functional film layer part of the touch panel in the subsequent cutting process, the probability that microcracks extend into the touch panel is controlled, the yield is improved, and the service life of the touch panel is prolonged.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned. Furthermore, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. A plurality of units or means recited in the apparatus claims may also be implemented by one unit or means in software or hardware. It is to be understood that the terms "lower" or "upper", "downward" or "upward" and the like are used to describe features of the exemplary embodiments with reference to the positions of such features as displayed in the figures; the terms first, second, etc. are used to denote names, but not any particular order.
Claims (12)
1. A touch mother board is characterized by comprising a display mother board, a plurality of touch panels on one side of the display mother board and a first cutting area between any two adjacent touch panels;
the display mother board comprises a substrate, a plurality of display panels and a second cutting area between any two adjacent display panels; the display panel comprises a thin film array transistor layer, a light-emitting device layer and a thin film packaging layer;
each touch panel corresponds to each display panel one to one;
the touch panels and the first cutting areas cover the light emitting side of the display mother board; the touch panel comprises a first induction electrode layer, a dielectric layer, a second induction electrode layer and an insulating protection layer;
the first cutting region comprises a patterned region formed by at least one patterned organic thin film layer and/or one patterned inorganic thin film layer, and the organic thin film layer or the inorganic thin film layer is any one layer or any combination of multiple layers in the touch panel.
2. The touch motherboard of claim 1, wherein: the first cutting region further comprises a cutting channel, and the patterned region is located between the cutting channel and an adjacent touch panel.
3. The touch mother panel according to claim 1, wherein the organic thin film layers and the inorganic thin film layers of the patterned region are alternately stacked in a direction perpendicular to the substrate.
4. The touch mother panel according to claim 3, wherein the pattern of the organic thin film layer and the pattern of the inorganic thin film layer overlap in a direction perpendicular to the substrate.
5. The touch motherboard of claim 1, wherein the organic thin film layers and inorganic thin film layers of the patterned region alternate in a direction parallel to the substrate.
6. The touch mother panel according to claim 1, wherein the pattern is a protrusion layer on a cross section perpendicular to a plane of the substrate, and a shape of the protrusion layer includes a circular arc shape, a polygonal shape, and/or a continuous wavy shape.
7. The touch motherboard of claim 6, wherein the polygon comprises one of a triangle, a trapezoid, a rectangle, or any combination thereof.
8. The touch mother board according to claim 1, wherein when the organic thin film layer and the inorganic thin film layer in the patterned region alternate in a direction parallel to the substrate, the pattern of the pattern is one of a stripe line, an arc line or a polygon or any combination thereof on a section parallel to a plane of the substrate.
9. The touch motherboard of claim 8, wherein the pattern extends in a dicing direction.
10. The touch mother board according to claim 1, wherein the patterned organic thin film layer is obtained by one or more of a thermal evaporation method, a spin coating method, a spray coating method, a screen printing method, and an inkjet printing method; the patterned inorganic thin film layer is obtained by one or more of sputtering, vacuum deposition, electron beam evaporation, atomic layer deposition, chemical vapor deposition, plasma-enhanced chemical vapor deposition, high-density plasma chemical vapor deposition, inductively coupled plasma chemical vapor deposition, capacitively coupled plasma-enhanced chemical vapor deposition, surface wave plasma chemical vapor deposition or ion beam assisted deposition.
11. A touch panel obtained by cutting the first cut region of the touch mother substrate according to any one of claims 1 to 10.
12. A touch display device comprising the touch panel according to claim 11.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113221753A (en) * | 2021-05-14 | 2021-08-06 | 业泓科技(成都)有限公司 | Manufacturing method of touch sensing module and mother board of touch sensing module |
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