CN110676393B - Manufacturing method of flexible OLED - Google Patents
Manufacturing method of flexible OLED Download PDFInfo
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- CN110676393B CN110676393B CN201810719262.1A CN201810719262A CN110676393B CN 110676393 B CN110676393 B CN 110676393B CN 201810719262 A CN201810719262 A CN 201810719262A CN 110676393 B CN110676393 B CN 110676393B
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- oled
- flexible substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The embodiment of the invention discloses a manufacturing method of a flexible OLED, which comprises the following steps: and determining alignment buffer areas of the display panels in the flexible substrate, etching the inorganic layers in the alignment buffer areas, and filling organic glue materials in the alignment buffer areas to the height flush with the packaging layer after the evaporation process in the flexible substrate is completed. Considering that the cracks caused by the film alignment tolerance are mainly generated in the exposed inorganic layer around the effective display area, in the embodiment of the invention, the alignment buffer area can be arranged around the effective display area of the display panel, the inorganic layer in the alignment buffer area is etched before the evaporation process is carried out on the flexible substrate, and after the evaporation process is finished, the alignment buffer area is filled with the organic glue material to be flush with the packaging layer, so that the stress in the bending process is effectively buffered, and the problem that the cracks are generated at the exposed inorganic layer around the effective display area due to the sudden change of the stress and the failure of the OLED (organic light emitting diode) caused by the existence of the film alignment tolerance is solved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a manufacturing method of a flexible OLED.
Background
In the manufacturing process of the flexible OLED, after the OLED evaporation and packaging processes in the OLED display panel are completed, films such as a polarizer, a touch screen and the like are attached to the display panel. However, due to the existence of the alignment deviation of the adhesive film, when the flexible screen body is bent, cracks (as shown in fig. 1) are generated at positions where no adhesive film is attached due to sudden change of stress, and the cracks are transmitted to the effective display area in the bending process of the OLED display panel, thereby causing the screen body to fail.
Therefore, there is a need for a method for manufacturing a flexible OLED, so as to solve the technical problem of OLED failure caused by cracks generated by film alignment tolerance in the prior art.
Disclosure of Invention
The invention provides a manufacturing method of a flexible OLED, which is used for solving the technical problem that in the prior art, the OLED fails due to cracks generated by film pasting alignment tolerance.
The manufacturing method of the flexible OLED provided by the embodiment of the invention comprises the following steps:
determining an alignment buffer area of each display panel in the flexible substrate, wherein the alignment buffer area of any display panel is arranged around the effective display area of any display panel;
etching off the inorganic layer in the para-position buffer region;
and after the evaporation process of the OLED in the flexible substrate is finished, filling an organic glue material in the alignment buffer zone to a height flush with the packaging layer of the OLED.
Optionally, before filling the alignment buffer region with an organic glue material to a height flush with the encapsulation layer of the OLED, the method further includes:
and finishing the packaging process of the OLED in the flexible substrate.
Optionally, the young's modulus of the organic glue material is less than 70 Gpa.
Optionally, the organic glue material is filled by any one of the following processes: screen printing and mask exposure.
Optionally, before performing an evaporation process of the OLED in the flexible substrate, the method further includes:
and etching the inorganic layer in each cutting path in the flexible substrate.
Optionally, after the process of encapsulating the OLED in the flexible substrate is completed and the alignment buffer area is filled with an organic glue material to a height flush with the encapsulation layer of the OLED, the method further includes:
and cutting the flexible substrate into the plurality of display panels along each cutting path of the flexible substrate.
Considering that cracks caused by the alignment tolerance of the film are mainly generated in the exposed inorganic layer around the effective display area, the embodiment of the invention can arrange the alignment buffer area around the effective display area of the display panel. Before the flexible substrate is subjected to the evaporation process of the OLED, the inorganic layer in the alignment buffer area is etched, after the evaporation process of the OLED is completed on the flexible substrate, the alignment buffer area is filled with an organic glue material to be flush with the packaging layer, so that the stress in the bending process of the OLED display panel can be effectively buffered, the stress mutation is avoided, and the problem of OLED failure caused by the fact that the inorganic layer exposed around the effective display area cracks due to stress protrusion in the existence of film lamination alignment tolerance is solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 illustrates a crack in an edge of a flexible substrate caused by a film alignment tolerance according to the prior art;
fig. 2 is a schematic structural diagram of a flexible substrate according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 4 is a schematic flow chart corresponding to a manufacturing method of a flexible OLED according to an embodiment of the present invention;
fig. 5a and 5b are schematic cross-sectional views of a display panel provided in an embodiment of the present invention after an evaporation and encapsulation process of an OLED is completed;
FIG. 6a is a schematic cross-sectional view of a front display panel with inorganic layers etched in alignment buffer according to an embodiment of the present invention;
fig. 6b is a schematic cross-sectional view of the display panel after the alignment buffer area is filled with the organic glue according to the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The embodiments of the present invention will be described in further detail with reference to the drawings attached hereto.
In an embodiment of the present invention, the flexible substrate is a flexible substrate that is used for manufacturing a flexible Organic Light-Emitting Diode (OLED), and is bendable and non-damaged, and the flexible substrate may be made of Polyimide (PI) material, and may also be referred to as a half-cut substrate.
Fig. 2 schematically illustrates a structural diagram of a flexible substrate according to an embodiment of the present invention, as shown in fig. 2, the flexible substrate may include a plurality of dicing channels, and the dicing channels divide the flexible substrate into a plurality of display panels, where each display panel is used for evaporating an organic light emitting layer in an OLED manufacturing process to form an OLED device.
Generally, the size of the display panel is different according to the specification of the OLED display product, and in the embodiment of the present invention, the size and the number of each display panel in the flexible substrate and the width of each scribe line may be set by a person skilled in the art, which is not limited in the present invention.
Fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the present invention, and as shown in fig. 3, any display panel may include an effective display area and an alignment buffer area disposed around the effective display area. In the process of carrying out evaporation and packaging processes of the OLED on the flexible substrate, the driving circuit is only manufactured on the effective display area, the organic light emitting layer is evaporated, and packaging is carried out, so that the alignment buffer area is not processed.
Fig. 4 shows a schematic flow chart corresponding to a method for manufacturing a flexible OLED provided in an embodiment of the present invention, and as shown in fig. 4, the method includes:
step S401, determining an alignment buffer area of each display panel in the flexible substrate, wherein the alignment buffer area of any display panel is arranged around an effective display area of any display panel;
step S402, etching off the inorganic layer in the para-position buffer area;
and S403, after the evaporation process of the OLED in the flexible substrate is finished, filling an organic glue material in the alignment buffer zone to a height flush with the packaging layer of the OLED.
It should be noted that, in the manufacturing process of the flexible OLED, the steps S401 and S402 are array segment (also called back plate segment) processes, while the evaporation and encapsulation processes of the OLED belong to front plate segment processes in the manufacturing process of the OLED, and the front plate segment processes are executed after the array segment processes are finished.
In steps S401 and S402, after determining the alignment buffer of each display panel in the substrate and etching away the inorganic layer in the alignment buffer, the flexible substrate may be subjected to an evaporation process of the OLED.
Specifically, in the embodiment of the present invention, the inorganic layer in the alignment buffer may be etched by using laser, and of course, the inorganic layer may also be etched by using other processes, which is not limited in the present invention.
Optionally, in the embodiment of the present invention, the inorganic layer in the scribe line between the display panels may be etched while the inorganic layer in the alignment buffer in each display panel is etched, and after the processes of packaging the OLED and filling the organic glue material in the flexible substrate are completed, the flexible substrate may be cut into a plurality of display panels.
In step 403, after completing the evaporation process of the OLED in the flexible substrate, filling an organic glue material in each alignment buffer area to a height flush with the encapsulation layer of the active display area.
Considering that cracks caused by the alignment tolerance of the film are mainly generated in the exposed inorganic layer around the effective display area, the embodiment of the invention can arrange the alignment buffer area around the effective display area of the display panel. Before the flexible substrate is subjected to the evaporation process of the OLED, the inorganic layer in the alignment buffer zone is etched, after the evaporation process of the OLED is completed on the flexible substrate, the alignment buffer zone is filled with an organic glue material to be flush with the packaging layer, so that the stress of the OLED display panel in the bending process can be effectively buffered, the stress mutation is avoided, and the problem that the OLED fails due to the fact that the inorganic layer exposed around the effective display zone cracks due to stress protrusion due to the existence of film pasting alignment tolerance is solved.
In the embodiment of the present invention, the young's modulus of the organic adhesive material may be less than 70Gpa, and the organic adhesive material may be filled by a process such as screen printing, mask exposure, and the like, which is not particularly limited in the present invention.
In the embodiment of the invention, an inorganic layer is arranged on the flexible substrate, and the inorganic layer can comprise a silicon oxide film layer and a silicon nitride film layer. Fig. 5a and 5b schematically illustrate cross-sectional views of a display panel provided by an embodiment of the present invention after completing an evaporation and encapsulation process of an OLED.
As shown in fig. 5a, before step S401 is performed, an inorganic layer is disposed on the entire flexible substrate, and the inorganic layer disposed at the position of the scribe line is etched away before evaporation of the OLED. Therefore, after the flexible substrate is subjected to evaporation of the OLED, the flexible substrate will be included at the position of the dicing street. And the flexible substrate also comprises an array layer, a light-emitting layer and an encapsulation layer which are further manufactured and formed on the basis of the inorganic layer at the position of the effective display area of the display panel. As shown in fig. 5b, the array layer includes an inorganic layer and a planarization layer, wherein a Low Temperature Poly-silicon (LTPS) driving circuit is fabricated in the inorganic layer. The light-emitting layer comprises a pixel defining layer and an isolation column structure, wherein the pixel defining layer comprises a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer and other multi-layer organic materials.
Fig. 6a and 6b are schematic cross-sectional views of the display panel before and after filling the organic glue material on the alignment buffer area according to the embodiment of the present invention. In the process of fabricating the OLED, the driving circuit is fabricated only in the effective display area of the display panel, and the organic layer is evaporated and encapsulated only on the effective display area, so that before the inorganic layer is etched, as shown in fig. 6a, the position of the alignment buffer area on the flexible substrate includes only one inorganic layer, and after the inorganic layer is etched and the alignment buffer area is filled with the organic glue material, as shown in fig. 6b, the position of the alignment buffer area on the flexible substrate includes the filled organic glue material, and the organic glue material is flush with the encapsulation layer in the effective display area. That is, the height of the organic glue material filled in the alignment buffer region is the same as the height of the encapsulation layer in the effective display region, and the height of the organic glue material is equal to the sum of the heights of the inorganic layer, the flat layer, the anode, the pixel definition layer, the isolation column and the encapsulation layer in the effective display region. Generally, the height of the filled organic glue material can be 5 um.
Optionally, as shown in fig. 6b, in the embodiment of the present invention, organic glue materials may be filled in the positions of the alignment buffer area and the scribe line on the flexible substrate, so that the glue material filling process is effectively simplified.
It should be noted that, in the embodiment of the present invention, the filling of the organic glue material may be performed after the packaging process of the OLED in the flexible substrate is completed, or the filling of the organic glue material may be performed after the evaporation of the organic layer in the effective display area is completed and before the device is packaged, which is not particularly limited in this respect.
Considering that cracks caused by the alignment tolerance of the film are mainly generated in the exposed inorganic layer around the effective display area, the embodiment of the invention can arrange the alignment buffer area around the effective display area of the display panel. Before the flexible substrate is subjected to the evaporation process of the OLED, the inorganic layer in the alignment buffer zone is etched, and after the evaporation process of the OLED is completed on the flexible substrate, the alignment buffer zone is filled with an organic glue material to be flush with the packaging layer, so that the stress of the OLED display panel in the bending process can be effectively buffered, the stress mutation is avoided, and the problem of OLED failure caused by cracks generated at the exposed inorganic layer due to the stress mutation due to the existence of film alignment tolerance is solved.
Similar to the alignment buffer, before etching the inorganic layer in the scribe line, as shown in fig. 6a, the flexible substrate will only include one inorganic layer at the position of the scribe line, and after etching the inorganic layer and filling the organic glue material in the alignment buffer and the scribe line, as shown in fig. 6b, the flexible substrate and the filled organic glue material can be included at the position of the scribe line.
Considering that the cracks caused by cutting are mainly cracks generated in the inorganic layer on the flexible substrate, in the embodiment of the invention, the cut inorganic layer can be etched before the evaporation process of the OLED is carried out on the flexible substrate, so that the inorganic layer cracks generated in the process of cutting the flexible substrate into a plurality of display panels after the evaporation and packaging processes of the OLED are completed can be effectively avoided, and the failure of the OLED is avoided.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart block or blocks and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While alternative embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following appended claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. A method for manufacturing a flexible OLED is characterized by comprising the following steps:
determining an alignment buffer area of each display panel in the flexible substrate, wherein the alignment buffer area of any display panel is arranged around the effective display area of any display panel;
etching the inorganic layer in the alignment buffer zone before the evaporation process of the OLED in the flexible substrate is carried out;
carrying out an evaporation process of the OLED on an effective display area of the display panel;
and after the evaporation process of the OLED in the flexible substrate is finished, filling an organic glue material in the alignment buffer zone to a height flush with the packaging layer of the OLED.
2. The method according to claim 1, wherein before filling the alignment buffer with an organic glue to a level flush with the encapsulation layer of the OLED, the method further comprises:
and finishing the packaging process of the OLED in the flexible substrate.
3. The method according to claim 1 or 2, wherein the organic glue material has a young's modulus of less than 70 Gpa.
4. The method according to claim 3, wherein the organic glue is filled by any one of the following processes: screen printing or mask exposure.
5. The method of claim 4, wherein prior to performing the evaporation process of the OLED in the flexible substrate, the method further comprises:
and etching the inorganic layer in each cutting path in the flexible substrate.
6. The method according to claim 5, wherein after completing the packaging process of the OLED in the flexible substrate and filling the alignment buffer region with an organic glue to a level flush with the packaging layer of the OLED, the method further comprises:
and cutting the flexible substrate into a plurality of display panels along each cutting path of the flexible substrate.
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| CN201810719262.1A CN110676393B (en) | 2018-07-03 | 2018-07-03 | Manufacturing method of flexible OLED |
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| CN201810719262.1A CN110676393B (en) | 2018-07-03 | 2018-07-03 | Manufacturing method of flexible OLED |
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| CN111294434A (en) * | 2020-02-17 | 2020-06-16 | Oppo广东移动通信有限公司 | Folding screen module, mobile terminal and laminating method of folding screen module |
| CN111739922B (en) * | 2020-07-03 | 2022-06-14 | 武汉天马微电子有限公司 | Display panel and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485344A (en) * | 2014-12-08 | 2015-04-01 | 信利（惠州）智能显示有限公司 | Preparation method for flexible display |
| CN107785505A (en) * | 2017-10-31 | 2018-03-09 | 京东方科技集团股份有限公司 | Display panel and its manufacture method, display device |
| CN108022878A (en) * | 2017-11-30 | 2018-05-11 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
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| KR102000043B1 (en) * | 2012-10-31 | 2019-07-15 | 엘지디스플레이 주식회사 | Organic light emitting display device and method of fabricating thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485344A (en) * | 2014-12-08 | 2015-04-01 | 信利（惠州）智能显示有限公司 | Preparation method for flexible display |
| CN107785505A (en) * | 2017-10-31 | 2018-03-09 | 京东方科技集团股份有限公司 | Display panel and its manufacture method, display device |
| CN108022878A (en) * | 2017-11-30 | 2018-05-11 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
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