CN109192881B - Organic light emitting diode display panel and cutting method thereof - Google Patents
Organic light emitting diode display panel and cutting method thereof Download PDFInfo
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- CN109192881B CN109192881B CN201811107910.4A CN201811107910A CN109192881B CN 109192881 B CN109192881 B CN 109192881B CN 201811107910 A CN201811107910 A CN 201811107910A CN 109192881 B CN109192881 B CN 109192881B
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Abstract
The invention provides an organic light-emitting diode display panel, which comprises a glass substrate, a flexible substrate, an organic light-emitting diode layer, a thin film packaging layer and a protective film. The flexible substrate is disposed on the glass substrate. The organic light emitting diode layer is arranged on the flexible substrate. The thin film encapsulation layer is disposed on the organic light emitting diode layer. The protective film is arranged on the film packaging layer, wherein the protective film is made of polyethylene terephthalate, an annular cutting channel is formed on the protective film adjacent to the periphery, and a plurality of cutting through holes are formed in the cutting channel in a penetrating mode. The protective film with the cutting through holes can reduce the times of alternate use of the laser used for cutting the display panel, thereby simplifying the cutting process and improving the yield of the display panel.
Description
Technical Field
The present invention relates to an Organic Light-emitting Diode (OLED) display panel, and more particularly, to an OLED display panel and a cutting method thereof, which can reduce the number of times of alternately using a laser for cutting the display panel, simplify a process of cutting the laser, reduce the cost and complexity of a cutting process, and improve the yield of the OLED display panel.
Background
The Organic Light-emitting Diode (OLED) display technology has the advantages of self-luminescence, wide viewing angle, fast response, high brightness, low voltage, low power consumption, and the like, and is therefore a mainstream technology adopted in the display panel manufacturing industry in recent years.
In the process of cutting a large OLED display panel mother board into a plurality of small panels, the laser cutting process is very important. The efficiency of laser cutting, the cutting quality and the product thickness have a close relationship, and the structure of the OLED display panel at present mainly includes a flexible substrate (Polyimide), an OLED layer, a Thin Film Encapsulation (TFE) layer, and a Polyethylene Terephthalate (PET) protective Film, which are sequentially stacked on a glass substrate. The thickness of the PET protective film is about 150 um. In the cutting process of the OLED display panel, the thickness of the PET protective film on the OLED display panel is about 1/2 of the cutting thickness required for the whole product, and therefore the thickness of the PET protective film directly affects the cutting efficiency and the cutting quality.
In the current mass production process of the OLED display panel, in order to improve the cutting efficiency of the laser to the panel and increase the production speed of the product, the mainstream method is to cut each layer of the OLED display panel by using various different high-power lasers. The cutting method comprises the following steps: with carbon dioxide (CO)2) Cutting the PET protective film by a laser (also called a CO2 laser, and the laser absorptivity of PET to the laser is high); cutting the PI layer by using an ultraviolet laser; cutting the glass substrate by using a CO2 laser; and (4) splitting. In the cutting method, since the OLED display panel requires a plurality of cutting lasers to complete the cutting process for cutting different films, the equipment cost is high and the manufacturing process is complicated.
Therefore, it is necessary to provide an oled display panel capable of improving laser cutting efficiency to solve the problems in the prior art.
Disclosure of Invention
The present invention provides an Organic Light-emitting Diode (OLED) display panel and a cutting method thereof, which overcome the disadvantages and shortcomings of the conventional OLED display panel due to the high cost and complexity of the cutting process.
The present invention is directed to an organic light emitting diode display panel, which can reduce the number of times of laser cutting is performed on the display panel, and simplify the process of laser cutting, thereby reducing the cost and complexity of the cutting process and improving the yield of the organic light emitting diode display panel.
To achieve the above object, the organic light emitting diode display panel of the present invention comprises:
a glass substrate;
the flexible substrate is arranged on the glass substrate;
the organic light-emitting diode layer is arranged on the flexible substrate;
the thin film packaging layer is arranged on the organic light-emitting diode layer; and
and the protective film is arranged on the thin film packaging layer, the protective film is made of polyethylene terephthalate, an annular cutting channel is formed on the protective film adjacent to the periphery, and a plurality of cutting through holes are formed in the cutting channel in a penetrating mode.
In an embodiment of the invention, the cutting street is rectangular.
In one embodiment of the present invention, each of the cutting perforations is circular.
In one embodiment of the present invention, each of the cutting perforations is oval.
In an embodiment of the present invention, the plurality of cutting perforations are arranged in a mutually spaced manner.
In an embodiment of the invention, the flexible substrate is Polyimide (PI).
Another object of the present invention is to provide a method for cutting an organic light emitting diode display panel, which includes:
a providing step, comprising providing an organic light emitting diode display panel, wherein the organic light emitting diode display panel comprises:
a glass substrate;
the flexible substrate is arranged on the glass substrate, wherein the flexible substrate is polyimide;
the organic light-emitting diode layer is arranged on the flexible substrate;
the thin film packaging layer is arranged on the organic light-emitting diode layer; and
a protective film disposed on the thin film encapsulation layer, wherein the protective film is made of polyethylene terephthalate, an annular cutting channel is formed on the protective film adjacent to the periphery, and a plurality of cutting through holes are formed in the cutting channel;
a step of cutting the protection film, which comprises cutting the protection film along the cutting path of the protection film by a first laser;
a flexible substrate cutting step, including cutting the flexible substrate along the cutting path with the first laser;
a glass substrate cutting step, including cutting the glass substrate along the cutting path by a second laser; and
and the splitting step comprises the step of splitting the organic light-emitting diode display panel.
In an embodiment of the invention, the first laser in the step of cutting the protective film and the step of cutting the flexible substrate are emitted by an ultraviolet laser, and the second laser in the step of cutting the glass substrate is emitted by a carbon dioxide laser.
In an embodiment of the present invention, the first laser in the step of cutting the protective film is emitted by an ultraviolet laser, the first laser in the step of cutting the flexible substrate is emitted by another ultraviolet laser, and the second laser in the step of cutting the glass substrate is emitted by a carbon dioxide laser.
In an embodiment of the invention, the cutting thickness of the protective film is one half of the total cutting thickness of the protective film, the flexible substrate and the glass substrate.
Compared with the prior art, the organic light-emitting diode display panel and the manufacturing method thereof have the following advantages:
1. according to the invention, the cutting channels of the protective film made of Polyethylene Terephthalate (PET) are provided with a plurality of cutting through holes, so that the amount of PET which needs to be cut by a laser can be greatly reduced, the laser can be changed from an original CO2 laser with better PET absorptivity into a UV laser with poorer PET absorptivity, the cutting of the PET protective film can be completed, the subsequent Polyimide (PI) flexible substrate cutting step also adopts the UV laser, and finally the CO2 laser is used for cutting when the glass substrate is cut, so that the cutting process for cutting the organic light-emitting diode display panel can be simplified, and the problem that the process efficiency is reduced due to frequent replacement of the laser is avoided.
2. The invention can greatly reduce the PET amount which needs to be cut by the laser by forming a plurality of cutting through holes on the cutting path of the protective film made of PET, greatly reduce the ash generated during cutting, avoid the problem that the ash is remained on the organic light-emitting diode display panel to influence the subsequent processing of the display panel, and further improve the cutting quality.
3. Because the PET protection film is all cut with the UV laser with PI flexible substrate, compare the replacement that has the technology once reduced different lasers and used, can avoid the laser instrument to frequently start and close and cause the laser instrument to damage.
In order to make the aforementioned and other objects of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below:
drawings
Fig. 1 is a side sectional view of an organic light emitting diode display panel according to the present invention.
Fig. 2 is a top view of an organic light emitting diode display panel according to the present invention.
FIG. 3 is a flowchart illustrating steps of a method for fabricating an OLED display panel according to the present invention.
Detailed Description
Referring to fig. 1 and 2, an Organic Light-emitting Diode (OLED) display panel of the present invention includes: a glass substrate 10, a flexible substrate 20, an organic light emitting diode layer 30, a Thin Film Encapsulation (TFE) layer 40, and a protective Film 50.
The flexible substrate 20 is disposed on the glass substrate 10. Preferably, the flexible substrate 20 may be Polyimide (PI).
The organic light emitting diode layer 30 is disposed on the flexible substrate 20.
The thin film encapsulation layer 40 is disposed on the organic light emitting diode layer 30.
The protective film 50 is disposed on the film encapsulation layer 40, wherein the protective film 50 is made of polyethylene terephthalate (PET), an annular cutting channel 52 is formed on the protective film 50 adjacent to the periphery, and a plurality of cutting through holes 53 are formed through the cutting channel 52. Preferably, the cutting street 52 is rectangular. Preferably, each cutting perforation 53 is circular or oval. Preferably, the plurality of cutting perforations 53 are arranged in a spaced apart manner from each other.
In a detailed embodiment of the present invention, the width of the scribe line 52 is a, the diameter of each scribe hole 53 is b, the distance between adjacent scribe holes is c, the product width d, the length of the protective film 50 is e, the thickness of the protective film 50 is f, and the number m of the scribe holes 53 on the scribe line 52 is calculated as (2 × (e + d))/c + 1. The dicing perforations 53 in the dicing streets 52 of the protective film 50 occupy a volume V, V ═ 3.14 [ ((2 × (e + d))/c +1) [ ((b/2) ]2*f。
Referring to fig. 3, the method for cutting an organic light emitting diode display panel of the present invention includes: a providing step S01, a protective film cutting step S02, a flexible substrate cutting step S03, a glass substrate cutting step S04, and a breaking step S05.
The providing step S01 includes providing an organic light emitting diode display panel as described above.
The protective film cutting step S02 includes cutting the protective film 50 along the scribe line 52 of the protective film 50 with a first laser.
The flexible substrate cutting step S03 includes cutting the flexible substrate 20 along the dicing streets 52 with the first laser.
The glass substrate cutting step S04 includes cutting the glass substrate 10 along the scribe line 52 with a second laser.
The splitting step S05 includes splitting the organic light emitting diode display panel.
Preferably, the first laser of the protective film cutting step S02 and the flexible substrate cutting step S03 is emitted by an ultraviolet laser, and the second laser of the glass substrate cutting step S04 is emitted by a carbon dioxide laser. Alternatively, it is preferable that the first laser of the protective film cutting step S02 is emitted from an ultraviolet laser, the first laser of the flexible substrate cutting step S03 is emitted from another ultraviolet laser, and the second laser of the glass substrate cutting step S04 is emitted from a carbon dioxide laser.
Preferably, the cutting thickness of the protective film 50 is one half of the total cutting thickness of the protective film 50, the flexible substrate 20, and the glass substrate 10.
Compared with the prior art, the organic light-emitting diode display panel and the manufacturing method thereof have the following advantages:
1. in the present invention, the plurality of cutting holes 53 are formed in the cutting lane 52 of the protective film 50 made of Polyethylene Terephthalate (PET), so that the amount of PET that must be cut by the laser can be greatly reduced, and therefore, the laser can be changed from an original CO2 laser having a better PET absorption rate to a UV laser having a poorer PET absorption rate, and the cutting of the PET protective film 50 can be completed, and the subsequent Polyimide (PI) flexible substrate cutting step S03 also employs the UV laser, and finally the CO2 laser is used for cutting when the glass substrate 10 is cut, so that the cutting process for cutting the organic light emitting diode display panel can be simplified, and the problem of reduction in process efficiency due to frequent replacement of the laser can be avoided.
2. The invention can greatly reduce the amount of PET which needs to be cut by a laser by forming a plurality of cutting through holes 53 on the cutting channel 52 of the protective film 50 made of PET, greatly reduce the ash generated during cutting, avoid the problem that the ash remains on the OLED display panel to influence the subsequent processing of the display panel, and further improve the cutting quality.
3. Because the PET protection film 50 is cut by the UV laser through the PI flexible substrate 20, compared with the prior art, the replacement of different lasers is reduced, and the laser damage caused by frequent startup and shutdown of the lasers can be avoided.
Claims (4)
1. A method for cutting an organic light emitting diode display panel is characterized by comprising the following steps:
a providing step, comprising providing an organic light emitting diode display panel, wherein the organic light emitting diode display panel comprises:
a glass substrate;
the flexible substrate is arranged on the glass substrate, wherein the flexible substrate is polyimide;
the organic light-emitting diode layer is arranged on the flexible substrate;
the thin film packaging layer is arranged on the organic light-emitting diode layer; and
a protective film disposed on the thin film encapsulation layer, wherein the protective film is made of polyethylene terephthalate, an annular cutting channel is formed on the protective film adjacent to the periphery, and a plurality of cutting through holes are formed in the cutting channel;
a step of cutting the protection film, which comprises cutting the protection film along the cutting path of the protection film by a first laser;
a flexible substrate cutting step, including cutting the flexible substrate along the cutting path with the first laser;
a glass substrate cutting step, including cutting the glass substrate along the cutting path by a second laser; and
and the splitting step comprises the step of splitting the organic light-emitting diode display panel.
2. The method of claim 1, wherein: the first laser in the protective film cutting step and the first laser in the flexible substrate cutting step are emitted by an ultraviolet laser, and the second laser in the glass substrate cutting step is emitted by a carbon dioxide laser.
3. The method of claim 1, wherein: the first laser of protection film cutting step is sent by an ultraviolet laser, the first laser of flexible substrate cutting step is sent by another ultraviolet laser, the second laser of glass substrate cutting step is sent by a carbon dioxide laser.
4. The method of claim 1, wherein: the cutting thickness of the protective film is one half of the total cutting thickness of the protective film, the flexible substrate, and the glass substrate.
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| CN201811107910.4A CN109192881B (en) | 2018-09-21 | 2018-09-21 | Organic light emitting diode display panel and cutting method thereof |
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| CN201811107910.4A CN109192881B (en) | 2018-09-21 | 2018-09-21 | Organic light emitting diode display panel and cutting method thereof |
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| CN110143025B (en) * | 2019-04-02 | 2024-04-12 | 福建华佳彩有限公司 | Backboard structure of glass substrate |
| CN110491908A (en) * | 2019-07-26 | 2019-11-22 | 武汉华星光电半导体显示技术有限公司 | Display panel and its cutting method |
| CN111007686A (en) * | 2019-11-14 | 2020-04-14 | Tcl华星光电技术有限公司 | Array substrate, display panel and preparation method |
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