CN109192881A - Organic LED display panel and its cutting method - Google Patents
Organic LED display panel and its cutting method Download PDFInfo
- Publication number
- CN109192881A CN109192881A CN201811107910.4A CN201811107910A CN109192881A CN 109192881 A CN109192881 A CN 109192881A CN 201811107910 A CN201811107910 A CN 201811107910A CN 109192881 A CN109192881 A CN 109192881A
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- Prior art keywords
- cutting
- laser
- protective film
- display panel
- base board
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of organic LED display panel, and it includes a glass substrate, a flexible base board, an Organic Light Emitting Diode layer, a thin-film encapsulation layer and a protective films.The flexible base board is arranged on the glass substrate.The Organic Light Emitting Diode layer is arranged on the flexible base board.The thin-film encapsulation layer is arranged on the Organic Light Emitting Diode layer.The protective film is arranged in the thin-film encapsulation layer, wherein the protective film is made with polyethylene terephthalate, neighbouring peripheral region forms the Cutting Road of an annular on the protective film, and multiple cutting perforation are formed there through in the Cutting Road.Protective film with cutting perforation, which can be reduced, is used alternatingly number for the laser for cutting the display panel, and then simplifies cutting technique, promotes display panel yield.
Description
Technical field
It is aobvious that the invention relates to a kind of Organic Light Emitting Diode (Organic Light-emitting Diode, OLED)
Show panel, especially with regard to a kind of organic LED display panel and its cutting method, can reduce described for cutting
Number is used alternatingly in the laser of display panel, and simplifies the process of laser cutting, and then reduces the cost of cutting processing procedure
And complexity, and then promote the yield of organic LED display panel.
Background technique
Organic Light Emitting Diode (Organic Light-emitting Diode, OLED) display technology have self-luminous,
The advantages that wide viewing angle, reaction be fast, high brightness, low-voltage, low-power consumption, therefore be main used by recent display panel manufacturing industry
Flow Technique.
It is cut into the processing procedure of multiple small panels by a large-scale OLED display panel motherboard, laser cutting program is extremely heavy
It wants.The efficiency and cutting quality and product thickness of laser cutting have substantial connection, and the structure of OLED display panel is mainly at present
On a glass substrate sequentially stack setting flexible base board (polyimides (Polyimide))), oled layer, thin-film package (Thin
Film Encapsulation, TFE) layer and polyethylene terephthalate (Polyethylene Terephthalate,
PET) protective film.The PET protection film thickness about 150um.In OLED display panel cutting processing procedure, in OLED display panel
PET protection film thickness accounts for about 1/2 that entire product needs cutting thickness, therefore the thickness of PET protection film will have a direct impact on and cut
The efficiency and cutting quality cut.
At present in the volume production processing procedure of OLED display panel, in order to improve laser to the cutting efficiency of panel, it is raw to promote product
Speed is produced, main stream approach is to cut using a variety of different superpower lasers to each layer of OLED display panel.Institute
Cutting method is stated the following steps are included: with carbon dioxide (CO2) (also known as CO2 laser, PET is to the laser for laser
Laser absorption rate is high) cutting PET protection film；PI layers of cutting is carried out with ultraviolet laser；Glass-cutting is carried out with CO2 laser
Substrate；Sliver.In the cutting method, since OLED display panel needs multiple cutting lasers to complete to cut different film layers
Cutting technique, therefore cause equipment cost high and processing procedure is complicated.
Therefore, it is necessary to a kind of organic LED display panel that laser cutting efficiency can be improved is provided, it is existing to solve
There is the problems of technology.
Summary of the invention
The present inventor is aobvious in view of existing Organic Light Emitting Diode (Organic Light-emitting Diode, OLED)
Show the costly and complicated disadvantage of panel cutting processing procedure, improves its insufficient and missing, and then invent a kind of organic light-emitting diodes
Pipe display panel and its cutting method.
The main purpose of the present invention is to provide a kind of machine LED display panel, can reduce described for cutting
Number is used alternatingly in the laser of display panel, and simplifies the process of laser cutting, and then reduces the cost of cutting processing procedure
And complexity, and then promote the yield of organic LED display panel.
In order to achieve the above object, organic LED display panel of the present invention includes:
One glass substrate；
One flexible base board is arranged on the glass substrate；
One Organic Light Emitting Diode layer is arranged on the flexible base board；
One thin-film encapsulation layer is arranged on the Organic Light Emitting Diode layer；And
One protective film is arranged in the thin-film encapsulation layer, wherein the protective film is with polyethylene terephthalate system
At neighbouring peripheral region forms the Cutting Road of an annular on the protective film, and multiple cut through is formed there through in the Cutting Road
Hole.
In an embodiment of the present invention, the Cutting Road is in rectangle.
In an embodiment of the present invention, each cutting perforation is circle.
In an embodiment of the present invention, each cutting perforation is ellipse.
In an embodiment of the present invention, the multiple cutting perforation is arranged in a manner of being spaced apart from each other.
In an embodiment of the present invention, the flexible base board is polyimides (Polyimide, PI).
Another object of the present invention is to provide a kind of organic LED display panel cutting method comprising:
One provides step, including provides an organic LED display panel, wherein the Organic Light Emitting Diode is aobvious
Show that panel includes:
One glass substrate；
One flexible base board is arranged on the glass substrate, wherein the flexible base board is polyimides；
One Organic Light Emitting Diode layer is arranged on the flexible base board；
One thin-film encapsulation layer is arranged on the Organic Light Emitting Diode layer；And
One protective film is arranged in the thin-film encapsulation layer, wherein the protective film is with polyethylene terephthalate system
It makes, neighbouring peripheral region forms the Cutting Road of an annular on the protective film, and multiple cut through is formed there through in the Cutting Road
Hole；
One protective film cutting step, including cutting the protection along the Cutting Road of the protective film with a first laser
Film；
One flexible base board cutting step, including the flexible base board is cut along the Cutting Road with the first laser；
One glass substrate cutting step, including the glass substrate is cut along the Cutting Road with a second laser；With
And
One sliver step, including sliver is carried out to the Organic Light Emitting Diode.
In one embodiment of this invention, described the of the protective film cutting step and the flexible base board cutting step
One laser is issued by a ultraviolet laser, and the second laser of the glass substrate cutting step is by a titanium dioxide
Carbon laser is issued.
In one embodiment of this invention, the first laser of the protective film cutting step is by a ultraviolet laser
Device is issued, and the first laser of the flexible base board cutting step is issued by another ultraviolet laser, the glass
The second laser of glass substrate cut step is issued by a carbon dioxide laser.
In one embodiment of this invention, the cutting thickness of the protective film is to account for the protective film, the flexible base board
And the half of total cutting thickness of the glass substrate.
Compared with prior art, machine LED display panel of the invention and machine LED display panel system
The method of making has the advantage that
1. the present invention by it is described with polyethylene terephthalate (Polyethylene Terephthalate,
PET) Cutting Road of the protective film manufactured forms multiple cutting perforation, and the PET amount that laser must be cut can be greatly decreased, because
This laser can be changed to the poor UV laser of PET absorptivity by the preferable CO2 laser of PET absorptivity of script, can be complete
At the cutting of PET protection film, and subsequent polyimides (Polyimide, PI) flexible base board cutting step is equally swashed using UV
Light device is finally just changed in glass-cutting substrate and is cut with CO2 laser, therefore can simplify cutting organic light-emitting diodes
The cutting technique of pipe display panel avoids the problem that laser is frequently replaced and reduces process efficiency.
2. the present invention is perforated by forming multiple cuttings in the Cutting Road of the protective film with PET manufacture, can substantially subtract
The PET amount that few laser must be cut, the ashes that when cutting generates can also be greatly decreased, and ashes is avoided to remain in organic light emission
Diode display panel and the problem of influence display panel follow-up process, and then promote cutting quality.
3. the technology of having compared reduces once since PET protection film is cut with PI flexible base board with UV laser
Various lasers are replaced, and can avoid laser frequent starting and close and laser is caused to damage.
For above content of the invention can be clearer and more comprehensible, preferred embodiment is cited below particularly, Bing cooperates institute's accompanying drawings, makees
Detailed description are as follows:
Detailed description of the invention
Fig. 1 is the side sectional view of organic LED display panel of the present invention.
Fig. 2 is the top view of organic LED display panel of the present invention.
Fig. 3 is the step flow chart of organic LED display panel manufacturing method of the present invention.
Specific embodiment
Please refer to Fig. 1 and Fig. 2, Organic Light Emitting Diode of the present invention (Organic Light-emitting Diode,
OLED) display panel includes: a glass substrate 10, a flexible base board 20, an Organic Light Emitting Diode layer 30, a thin-film package
(Thin Film Encapsulation, TFE) layer 40 and a protective film 50.
The flexible base board 20 is arranged on the glass substrate 10.Preferably, the flexible base board 20 can be sub- for polyamides
Amine (Polyimide, PI).
The Organic Light Emitting Diode layer 30 is arranged on the flexible base board 20.
The thin-film encapsulation layer 40 is arranged on the Organic Light Emitting Diode layer 30.
The protective film 50 is arranged in the thin-film encapsulation layer 40, wherein the protective film 50 is with poly terephthalic acid second
Diester (polyethylene terephthalate, PET) is made, and neighbouring peripheral region forms an annular on the protective film 50
Cutting Road 52 is formed there through multiple cutting perforation 53 in the Cutting Road 52.Preferably, the Cutting Road 52 is in rectangle.It is excellent
Selection of land, each cutting perforation 53 is round or ellipse.Preferably, the multiple cutting perforation 53 is arranged in a manner of being spaced apart from each other
Column.
In specific embodiment of the present invention, 52 width of Cutting Road is a, and 53 diameters of each cutting perforation are b, adjacent cutting
The spacing in hole is c, and product width d, 50 length of protective film is e, and the protective film 50 can be calculated Cutting Road with a thickness of f
Quantity m=(2* (e+d))/c+1 of cutting perforation 53 on 52.53 institutes of cutting perforation on the Cutting Road 52 of the protective film 50
Account for volume V, V=3.14* ((2* (e+d))/c+1) * (b/2)2*f。
Referring to figure 3., organic LED display panel cutting method of the present invention includes: an offer step S01, a guarantor
Cuticula cutting step S02, a flexible base board cutting step S03, a glass substrate cutting step S04 and a sliver step
S05。
The offer step S01 includes providing an organic LED display panel as described above.
The protective film cutting step S02 includes cutting institute along the Cutting Road 52 of the protective film 50 with a first laser
State protective film 50.
The flexible base board cutting step S03 includes cutting the flexibility along the Cutting Road 52 with the first laser
Substrate 20.
The glass substrate cutting step S04 includes cutting the glass base along the Cutting Road 52 with a second laser
Plate 10.
The sliver step S05 includes carrying out sliver to the Organic Light Emitting Diode.
Preferably, the first laser of the protective film cutting step S02 and the flexible base board cutting step S03 are
It is issued by a ultraviolet laser, the second laser of the glass substrate cutting step S04 is swashed by a carbon dioxide
Light device is issued.Or, it is preferable that the first laser of the protective film cutting step S02 is by a ultraviolet laser
It is issued, the first laser of the flexible base board cutting step S03 is issued by another ultraviolet laser, the glass
The second laser of glass substrate cut step S04 is issued by a carbon dioxide laser.
Preferably, the cutting thickness of the protective film 50 is to account for the protective film 50, the flexible base board 20 and described
The half of total cutting thickness of the glass substrate 10.
Compared with prior art, machine LED display panel of the invention and machine LED display panel system
The method of making has the advantage that
1. the present invention by it is described with polyethylene terephthalate (Polyethylene Terephthalate,
PET) Cutting Road 52 of the protective film 50 manufactured forms multiple cutting perforation 53, can be greatly decreased what laser must be cut
PET amount, therefore laser can be changed to the poor UV laser of PET absorptivity by the preferable CO2 laser of PET absorptivity of script
Device can complete the cutting of PET protection film 50, and subsequent polyimides (Polyimide, PI) flexible base board cutting step
S03 equally uses UV laser, finally just changes in glass-cutting substrate 10 and is cut with CO2 laser, therefore being capable of letter
The cutting technique for changing cutting organic LED display panel, avoids laser from frequently replacing and reduces asking for process efficiency
Topic.
2. the present invention, can by forming multiple cutting perforation 53 in the Cutting Road 52 of the protective film 50 with PET manufacture
It is greatly decreased the PET amount that laser must be cut, the ashes that when cutting generates can also be greatly decreased, and avoiding ashes from remaining in has
Machine LED display panel and the problem of influence display panel follow-up process, and then promote cutting quality.
3. the technology of having compared reduces since PET protection film 50 is cut with PI flexible base board 20 with UV laser
Various lasers are replaced, and can avoid laser frequent starting and close and laser is caused to damage.
Claims (10)
1. a kind of organic LED display panel, which is characterized in that the organic LED display panel includes:
One glass substrate；
One flexible base board is arranged on the glass substrate；
One Organic Light Emitting Diode layer is arranged on the flexible base board；
One thin-film encapsulation layer is arranged on the Organic Light Emitting Diode layer；And
One protective film is arranged in the thin-film encapsulation layer, wherein the protective film is made with polyethylene terephthalate, institute
The Cutting Road that neighbouring peripheral region on protective film forms an annular is stated, multiple cutting perforation are formed there through in the Cutting Road.
2. organic LED display panel as described in claim 1, it is characterised in that: the Cutting Road is in rectangle.
3. organic LED display panel as described in claim 1, it is characterised in that: each cutting perforation is circle
Shape.
4. organic LED display panel as described in claim 1, it is characterised in that: each cutting perforation is ellipse
Shape.
5. organic LED display panel as described in claim 1, it is characterised in that: the multiple cutting perforation is with phase
Mutual intermittent fashion.
6. organic LED display panel as described in claim 1, it is characterised in that: the flexible base board is that polyamides is sub-
Amine.
7. a kind of organic LED display panel cutting method, which is characterized in that the described method includes:
One provides step, including provides an organic LED display panel, wherein the organic light-emitting diode display face
Plate includes:
One glass substrate；
One flexible base board is arranged on the glass substrate, wherein the flexible base board is polyimides；
One Organic Light Emitting Diode layer is arranged on the flexible base board；
One thin-film encapsulation layer is arranged on the Organic Light Emitting Diode layer；And
One protective film is arranged in the thin-film encapsulation layer, wherein the protective film is manufactured with polyethylene terephthalate, institute
The Cutting Road that neighbouring peripheral region on protective film forms an annular is stated, multiple cutting perforation are formed there through in the Cutting Road；
One protective film cutting step, including cutting the protective film along the Cutting Road of the protective film with a first laser；
One flexible base board cutting step, including the flexible base board is cut along the Cutting Road with the first laser；
One glass substrate cutting step, including the glass substrate is cut along the Cutting Road with a second laser；And
One sliver step, including sliver is carried out to the Organic Light Emitting Diode.
8. the method for claim 7, it is characterised in that: the protective film cutting step and flexible base board cutting step
The rapid first laser is issued by a ultraviolet laser, and the second laser of the glass substrate cutting step is
It is issued by a carbon dioxide laser.
9. the method for claim 7, it is characterised in that: the first laser of the protective film cutting step is by one
Ultraviolet laser is issued, and the first laser of the flexible base board cutting step is sent out by another ultraviolet laser
Out, the second laser of the glass substrate cutting step is issued by a carbon dioxide laser.
10. the method for claim 7, it is characterised in that:, the cutting thickness of the protective film be account for the protective film,
The half of total cutting thickness of the flexible base board and the glass substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811107910.4A CN109192881B (en) | 2018-09-21 | 2018-09-21 | Organic light emitting diode display panel and cutting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811107910.4A CN109192881B (en) | 2018-09-21 | 2018-09-21 | Organic light emitting diode display panel and cutting method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN109192881A true CN109192881A (en) | 2019-01-11 |
| CN109192881B CN109192881B (en) | 2021-02-23 |
Family
ID=64909411
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| CN201811107910.4A Active CN109192881B (en) | 2018-09-21 | 2018-09-21 | Organic light emitting diode display panel and cutting method thereof |
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Cited By (3)
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| CN110143025A (en) * | 2019-04-02 | 2019-08-20 | 福建华佳彩有限公司 | A kind of back board structure of novel glass substrate |
| CN110491908A (en) * | 2019-07-26 | 2019-11-22 | 武汉华星光电半导体显示技术有限公司 | Display panel and its cutting method |
| CN111007686A (en) * | 2019-11-14 | 2020-04-14 | Tcl华星光电技术有限公司 | Array substrate, display panel and preparation method |
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| CN111007686A (en) * | 2019-11-14 | 2020-04-14 | Tcl华星光电技术有限公司 | Array substrate, display panel and preparation method |
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|---|---|
| CN109192881B (en) | 2021-02-23 |
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