CN107779644A - A kind of copper alloy for electronic material - Google Patents
A kind of copper alloy for electronic material Download PDFInfo
- Publication number
- CN107779644A CN107779644A CN201610738541.3A CN201610738541A CN107779644A CN 107779644 A CN107779644 A CN 107779644A CN 201610738541 A CN201610738541 A CN 201610738541A CN 107779644 A CN107779644 A CN 107779644A
- Authority
- CN
- China
- Prior art keywords
- parts
- copper alloy
- mass fraction
- electronic material
- magnesium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0089—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with other, not previously mentioned inorganic compounds as the main non-metallic constituent, e.g. sulfides, glass
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Abstract
The invention discloses a kind of copper alloy for electronic material.Include the chemical element of following parts by weight：1 25 parts of magnesium, 13 parts of silicon, 1 10 parts of silver, 23 parts of magnesium phosphide, 13 parts of titanium oxide, remaining is made up of Cu and inevitable impurity.Copper alloy electronic material proposed by the invention, have between excellent mechanical strength, electric conductivity, meanwhile, significant raising is there has also been in terms of the intensity, bending resistance in material, also, yield strength is big, improves service life, meets the requirement of electronics processing.
Description
Technical field
The present invention relates to technical field of electronic materials, and in particular to a kind of copper alloy for electronic material.
Background technology
Electronic material refers to the material used in electronic technology and microelectric technique, including dielectric material, semiconductor material
Material, piezoelectricity and ferroelectric material, conducting metal and its alloy material, magnetic material, photoelectron material, electromagnetic shielding material and
Other associated materials.Electronic material is the material base of modern electronics industry and scientific technological advance, while is sciemtifec and technical sphere again
Middle technology-intensive subject.It is related to the multi-subject knowledges such as electronic technology, physical chemistry, solid state physics and Process ba- sis.
With the development of electronic utility and the raising of electrical apparatus technology, along with the miniaturization, lightweight, Gao Gong of electronic equipment
Energyization, high-density installation, to the characteristic project more and more higher required by electronic equipment material, for example (,) it is electrical conductivity, intensity, anti-
The mechanical performances such as corrosivity, fatigue durability, hardness, bendability have higher requirement.In recent years, the electricity as balancing performance
Sub- material copper alloy, turn into trend instead of conventional phosphor bronze, brass etc. for the solution strengthening type copper alloy of representative.
The content of the invention
The purpose of the present invention is exactly to overcome prior art defect, there is provided a kind of copper alloy for electronic material.
The technical solution adopted for the present invention to solve the technical problems is：A kind of copper alloy for electronic material.It is characterized in that：
Include the chemical element of following parts by weight：Magnesium 1-25 parts, silicon 1-3 parts, silver-colored 1-10 parts, magnesium phosphide 2-3 parts, titanium oxide 1-
3 parts, remaining is made up of Cu and inevitable impurity.
Further, in addition to the Ni of mass fraction 5-15 parts, the Al of mass fraction 1-5 parts, mass fraction 1-5 parts
Cr, the Co of mass fraction 2-3 parts.
Further, in addition to the Al of mass fraction 1-5 parts, the Sn of mass fraction 1-2 parts, mass fraction 0.5-1 parts
Li。
Further, in addition to the Fe of mass fraction 1.5-3.5 parts, the titanium oxide and mass fraction of mass fraction 2-3 parts
The silica of 1-3 parts.
The beneficial effects of the invention are as follows：Copper alloy electronic material proposed by the invention, there is excellent mechanical strength, lead
Between electrical property, meanwhile, significant raising is there has also been in terms of the intensity, bending resistance in material, also, yield strength is big, carries
High service life, meets the requirement of electronics processing.
Embodiment
The present invention is described in further detail with reference to specific embodiment.
Embodiment 1：A kind of copper alloy for electronic material.Including following parts by weight element：1 part of magnesium, 1 part of silicon, 1 part of silver,
2 parts of magnesium phosphide, 1 part of titanium oxide, remaining is made up of Cu and inevitable impurity.
Embodiment 2：A kind of copper alloy for electronic material.Including following parts by weight element：10 parts of magnesium, 2 parts of silicon, 3 parts of silver,
2 parts of magnesium phosphide, 2 parts of titanium oxide, remaining is made up of Cu and inevitable impurity.
Embodiment 3：A kind of copper alloy for electronic material.Including following parts by weight element：15 parts of magnesium, 2 parts of silicon, 5 parts of silver,
2 parts of magnesium phosphide, 2 parts of titanium oxide, remaining is made up of Cu and inevitable impurity.
Embodiment 4：A kind of copper alloy for electronic material.Including following parts by weight element：20 parts of magnesium, 3 parts of silicon, 8 parts of silver,
3 parts of magnesium phosphide, 3 parts of titanium oxide, remaining is made up of Cu and inevitable impurity.
Embodiment 5：A kind of copper alloy for electronic material.Including following parts by weight element：25 parts of magnesium, 3 parts of silicon, silver 10
Part, 3 parts of magnesium phosphide, 3 parts of titanium oxide, remaining is made up of Cu and inevitable impurity.
Obviously, above-described embodiment is only intended to clearly illustrate example, and is not the restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (4)
- A kind of 1. copper alloy for electronic material.It is characterized in that：Include the chemical element of following parts by weight：Magnesium 1-25 parts, silicon 1-3 Part, silver-colored 1-10 parts, magnesium phosphide 2-3 parts, titanium oxide 1-3 parts, remaining is made up of Cu and inevitable impurity.
- A kind of 2. copper alloy for electronic material according to claim 1, it is characterised in that：Also include mass fraction 5-15 parts N i, A l of mass fraction 1-5 parts, the Cr of mass fraction 1-5 parts, the Co of mass fraction 2-3 parts.
- A kind of 3. copper alloy for electronic material according to claim 1, it is characterised in that：Also include mass fraction 1-5 parts A l, the Sn, the Li of mass fraction 0.5-1 parts of mass fraction 1-2 parts.
- A kind of 4. copper alloy for electronic material according to claim 1, it is characterised in that：Also include mass fraction 1.5- 3.5 parts of Fe, the titanium oxide of mass fraction 2-3 parts and mass fraction 1-3 parts silica.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610738541.3A CN107779644A (en) | 2016-08-26 | 2016-08-26 | A kind of copper alloy for electronic material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610738541.3A CN107779644A (en) | 2016-08-26 | 2016-08-26 | A kind of copper alloy for electronic material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107779644A true CN107779644A (en) | 2018-03-09 |
Family
ID=61439490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610738541.3A Pending CN107779644A (en) | 2016-08-26 | 2016-08-26 | A kind of copper alloy for electronic material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107779644A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111057930A (en) * | 2019-12-25 | 2020-04-24 | 广东禾木科技有限公司 | High-purity micro-alloy copper alloy electronic material and preparation method thereof |
-
2016
- 2016-08-26 CN CN201610738541.3A patent/CN107779644A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111057930A (en) * | 2019-12-25 | 2020-04-24 | 广东禾木科技有限公司 | High-purity micro-alloy copper alloy electronic material and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180309 |