CN105441770A - Copper alloy for electronic material - Google Patents

Abstract

The invention provides a copper alloy for an electronic material. The copper alloy for the electronic material is characterized by containing, by weight, 15-45 parts of iron, 8-20 parts of magnesium, 0.3-10 parts of silver, 5-50 parts of silicon, 0.5-10 parts of nickel, 0.5-10 parts of boron, 0-10 parts of phosphorus and 10-90 parts of copper. The copper alloy electronic material is excellent in mechanical strength and electrical conductivity and high in yield strength; meanwhile, the abrasion resistance, corrosion resistance, fatigue resistance and other properties of the material are improved; the strength and bending resistance of the material are also remarkably improved; the service life of the material is prolonged; the requirement for electronic processing is met.

Description

A kind of copper alloy for electronic material

Technical field

The present invention relates to technical field of electronic materials, be specifically related to a kind of copper alloy for electronic material.

Background technology

Electronic material refers to the material used in electronic technology and microelectronics, comprises dielectric materials, semiconductor material, piezoelectricity and ferroelectric material, conducting metal and alloy material, magneticsubstance, photoelectron material, electromagnetic shielding material and other associated materials.Electronic material is the basic substance of modern electronics industry and scientific technological advance, is again technology-intensive subject in sciemtifec and technical sphere simultaneously.It relates to the multi-subject knowledges such as electronic technology, physical chemistry, solid state physics and Process ba-sis.According to the chemical property of material, metal electron material can be divided into, electronic ceramics, polymer electronics, glass dielectric, mica, gas-insulated medium material, inducer, insulating material, magneticsubstance, electronics handware, electrotechnical ceramics material, shielding material, piezoelectric crystal material, fine Electronic chemical materials, electronics gently build woven material, electronics tinsolder material, PCB make material, other electronic material.

For the copper alloy for electronic material of the balancing performance for lead frame, terminal, connector etc., as the fundamental characteristics of goods, require that high intensity and high electroconductibility or thermal conductivity have both.And more require the miniaturization of electron device, highly integrated in recent years, therefore require raw-material thin plate, in lead frame, terminal, connector, increase, the narrow space lengthization of pin count etc. develop.Require the complicated of device shape further and improve the reliability in aggregate erection, therefore for the material used, except physical strength and excellent conductivity, also requiring good bendability.In recent years, as the copper alloy for electronic material of balancing performance, replacement phosphor bronze, brass etc. are in the past the solution strengthening type copper alloy of representative, and from the view point of high strength and high conductivity, the usage quantity of time hardening copper alloy increases

Add, time hardening copper alloy carries out ageing treatment by the supersaturated solid solution of solution treatment, and tiny precipitate is disperseed equably, while putting forward heavy alloyed intensity, reduce the solid solution element amount in copper, thus electroconductibility improves.Therefore, as the good mechanical performance such as intensity, elasticity, and the materials'use that electroconductibility, thermal conductivity are good.And, along with the development of electronic utility and the raising of electrical apparatus technology, along with the miniaturization of electronics, lightweight, multifunction, high-density installation, more and more higher to the characteristic project required by electronics material, the mechanical propertys such as such as specific conductivity, intensity, erosion resistance, resistance to fatigue, hardness, bendability have higher requirement.

Therefore, for the problems referred to above, the present invention proposes a kind of new technical scheme.

Summary of the invention

The object of this invention is to provide a kind of good combination property, there is excellent physical strength and the copper alloy for electronic material of conductive capability.

The present invention is achieved through the following technical solutions:

A kind of copper alloy for electronic material, is characterized in that: the chemical element composition comprising following parts by weight:

Iron 15 ~ 45 parts;

8 ~ 20 parts, magnesium;

Silver 0.3 ~ 10 part;

Silicon 5 ~ 50 parts;

0.5 ~ 10 part, nickel;

Boron 0.5 ~ 10 part;

0 ~ 10 part, phosphorus;

Copper 10 ~ 90 parts.

Further, a kind of copper alloy for electronic material, comprises the chemical element composition of following parts by weight:

Iron 15 ~ 40 parts;

8 ~ 16 parts, magnesium;

Silver 0.3 ~ 5 part;

Silicon 6 ~ 45 parts;

0.5 ~ 4 part, nickel;

Boron 0.5 ~ 5 part;

0 ~ 3 part, phosphorus;

Copper 15 ~ 90 parts.

Further, the tantalum that mass fraction is 0.6 ~ 0.8 part is also comprised.

Further, the titanium that mass fraction is 1 ~ 3 part is also comprised.

The invention has the beneficial effects as follows: copper alloy electronic material proposed by the invention, have between excellent physical strength, conductivity, simultaneously, improve the performances such as it is wear-resistant, anticorrosion, resistance to fatigue, and there has also been significant raising in the intensity, resistance to bending of material, and yield strength is large, improve work-ing life, meet the requirement of electronics processing.

Embodiment

Below in conjunction with embodiment, the present invention is described further.

Embodiment 1

A kind of copper alloy for electronic material, comprises the chemical element composition of following parts by weight:

Iron 15 parts;

8 parts, magnesium;

Silver 0.3 part;

Silicon 6 parts;

0.5 part, nickel;

Boron 0.5 part;

0.1 part, phosphorus;

Tantalum 0.6 part;

Titanium 1 part;

Copper 15 parts.

Embodiment 2

A kind of copper alloy for electronic material, comprises the chemical element composition of following parts by weight:

Iron 25 parts;

10 parts, magnesium;

Silver 2 parts;

Silicon 25 parts;

1.8 parts, nickel;

Boron 2.6 parts;

1.5 parts, phosphorus;

Tantalum 0.7 part;

Titanium 2 parts;

Copper 40 parts.

Embodiment 3

A kind of copper alloy for electronic material, comprises the chemical element composition of following parts by weight:

Iron 40 parts;

16 parts, magnesium;

Silver 5 parts;

Silicon 45 parts;

4 parts, nickel;

Boron 5 parts;

3 parts, phosphorus;

Tantalum 0.8 part;

Titanium 3 parts;

Copper 90 parts.

Copper alloy electronic material proposed by the invention, have between excellent physical strength, conductivity, simultaneously, improve the performances such as it is wear-resistant, anticorrosion, resistance to fatigue, and there has also been significant raising in the intensity, resistance to bending of material, and yield strength is large, improve work-ing life, meet the requirement of electronics processing.

The above is only embodiments of the invention, is not restriction the present invention being made to any other form, and any amendment done according to embodiment proposed by the invention or equivalent variations, still belong to the present invention's scope required for protection.

Claims (4)

1. a copper alloy for electronic material, is characterized in that: the chemical element composition comprising following parts by weight:

Iron 15 ~ 45 parts;

8 ~ 20 parts, magnesium;

Silver 0.3 ~ 10 part;

Silicon 5 ~ 50 parts;

0.5 ~ 10 part, nickel;

Boron 0.5 ~ 10 part;

0 ~ 10 part, phosphorus;

Copper 10 ~ 90 parts.

2. a kind of copper alloy for electronic material according to claim 1, is characterized in that: the chemical element composition comprising following parts by weight:

Iron 15 ~ 40 parts;

8 ~ 16 parts, magnesium;

Silver 0.3 ~ 5 part;

Silicon 6 ~ 45 parts;

0.5 ~ 4 part, nickel;

Boron 0.5 ~ 5 part;

0 ~ 3 part, phosphorus;

Copper 15 ~ 90 parts.

3. a kind of copper alloy for electronic material according to claim 1, is characterized in that: also comprise the tantalum that mass fraction is 0.6 ~ 0.8 part.

4. a kind of copper alloy for electronic material according to claim 1, is characterized in that: also comprise the titanium that mass fraction is 1 ~ 3 part.