JP6162817B2 - Silver coating material and method for producing the same - Google Patents
Silver coating material and method for producing the same Download PDFInfo
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- JP6162817B2 JP6162817B2 JP2015546713A JP2015546713A JP6162817B2 JP 6162817 B2 JP6162817 B2 JP 6162817B2 JP 2015546713 A JP2015546713 A JP 2015546713A JP 2015546713 A JP2015546713 A JP 2015546713A JP 6162817 B2 JP6162817 B2 JP 6162817B2
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- 229910052709 silver Inorganic materials 0.000 title claims description 98
- 239000004332 silver Substances 0.000 title claims description 98
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims description 97
- 239000000463 material Substances 0.000 title claims description 43
- 239000011248 coating agent Substances 0.000 title claims description 39
- 238000000576 coating method Methods 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000010410 layer Substances 0.000 claims description 62
- 238000007747 plating Methods 0.000 claims description 43
- 238000010438 heat treatment Methods 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 29
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 28
- 238000012360 testing method Methods 0.000 claims description 26
- 239000013078 crystal Substances 0.000 claims description 21
- 238000005299 abrasion Methods 0.000 claims description 20
- 239000011247 coating layer Substances 0.000 claims description 8
- 229910001651 emery Inorganic materials 0.000 claims description 4
- 238000007790 scraping Methods 0.000 claims description 4
- 150000003378 silver Chemical class 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 229910000906 Bronze Inorganic materials 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- 239000010974 bronze Substances 0.000 description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000640 Fe alloy Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910017980 Ag—Sn Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001370 Se alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZUPBPXNOBDEWQT-UHFFFAOYSA-N [Si].[Ni].[Cu] Chemical compound [Si].[Ni].[Cu] ZUPBPXNOBDEWQT-UHFFFAOYSA-N 0.000 description 1
- -1 and further Chemical compound 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical group 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- FDDDEECHVMSUSB-UHFFFAOYSA-N sulfanilamide Chemical compound NC1=CC=C(S(N)(=O)=O)C=C1 FDDDEECHVMSUSB-UHFFFAOYSA-N 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/025—Composite material having copper as the basic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
- H01H2011/046—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion by plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Contacts (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacture Of Switches (AREA)
Description
本発明は、銀被覆材及びその製造方法に関し、詳しくは、コネクタ、スイッチ、端子及び電子部品接点部品として好適な銀被覆材に関する。 The present invention relates to a silver coating material and a method for producing the same, and more particularly to a silver coating material suitable as a connector, a switch, a terminal, and an electronic component contact part.
電子機器用接続部品であるコネクタやスイッチには、黄銅やリン青銅の表面に銅やニッケルの下地めっきを施し、さらにその上に銀めっきを施した材料が多く使用される。銀は電気および熱の良導体であるために、銀は上記のようにコネクタやスイッチまたはリードフレームなどのめっきとして用いられる。 For connectors and switches that are connection parts for electronic devices, a material is often used in which a base plate of copper or nickel is applied to the surface of brass or phosphor bronze, and further, silver is applied thereon. Since silver is a good conductor of electricity and heat, silver is used as a plating for connectors, switches or lead frames as described above.
近年、携帯電話やリモコンに用いられているスイッチは、繰り返しのスイッチング動作の回数が多く、短期間に多くのスイッチング動作を繰り返すことにより、銀めっきが削れて接触抵抗が上がることが知られている。
このような現象を防止するために、従来は、銀めっきの膜厚を厚くすることで対応していたが、電子部品へのコストダウンの要求は年々厳しくなっており、銀めっきを薄膜化した製品仕様が増加している。そこで、銀めっきの耐摩耗性向上の検討が急務となっている。
一般的に、被膜の硬度を上げることが、耐摩耗性向上に有効であり、銀にSb等の硬化剤を添加して、被膜硬度を上げる試みが行われているが、逆に被膜が脆くなり、耐摩耗性が劣化する。In recent years, switches used in mobile phones and remote controls have a large number of repeated switching operations, and it is known that silver plating is scraped and contact resistance increases by repeating many switching operations in a short time. .
In order to prevent such a phenomenon, the conventional method has been to increase the film thickness of silver plating, but the demand for cost reduction of electronic parts has become stricter year by year. Product specifications are increasing. Thus, there is an urgent need to examine the improvement in wear resistance of silver plating.
In general, increasing the hardness of the coating is effective for improving the wear resistance, and attempts have been made to increase the coating hardness by adding a curing agent such as Sb to silver. However, the coating is brittle. As a result, the wear resistance deteriorates.
また、特許文献1には、銅もしくは銅合金、または鉄もしくは鉄合金からなる導電性基材上に、ニッケル、ニッケル合金、コバルト、コバルト合金のいずれかからなる下地層、銅もしくは銅合金、スズもしくはスズ合金のいずれかからなる中間層、および銀もしくは銀合金からなる最表層を順に積層し、前記中間層と最表層の間に、第2の中間層として中間酸化物層が存在する可動接点部品用銀被覆材が開示されている。中間酸化物層は中間層の金属酸化物の層であり、前記中間層と最表層の間に中間酸化物層を存在させることで、中間層成分が表面に拡散し表面層中で酸化物になるのを阻止し、接触抵抗の上昇を防ぐ効果があり、更に表面の銀層の剥離を抑制する効果があるとしている。前記中間酸化物層は、最表層を形成した後、温度250℃の大気中で5〜60分加熱することにより形成している。 Patent Document 1 discloses that a conductive base material made of copper or copper alloy, or iron or iron alloy, an underlayer made of nickel, nickel alloy, cobalt, or cobalt alloy, copper or copper alloy, tin Alternatively, a movable contact in which an intermediate layer made of either tin alloy and an outermost layer made of silver or a silver alloy are sequentially laminated, and an intermediate oxide layer exists as a second intermediate layer between the intermediate layer and the outermost layer. A silver coating for parts is disclosed. The intermediate oxide layer is a metal oxide layer of the intermediate layer. By the presence of the intermediate oxide layer between the intermediate layer and the outermost layer, the intermediate layer component diffuses to the surface and becomes an oxide in the surface layer. It is said that it has the effect of preventing the increase in contact resistance and the increase in contact resistance, and further has the effect of suppressing the peeling of the silver layer on the surface. The intermediate oxide layer is formed by heating in the atmosphere at a temperature of 250 ° C. for 5 to 60 minutes after forming the outermost layer.
本発明は、例えば、スイッチングが繰り返し行われる条件下で長期間使用されるスイッチの可動接点及び/又は固定接点として用いても、表面の銀又は銀合金層が削れることがなく、更に接触抵抗が上昇することがない、耐摩耗性に優れた銀被覆材を提供することを目的とする。 Even if the present invention is used, for example, as a movable contact and / or a fixed contact of a switch that is used for a long time under a condition where switching is repeatedly performed, the surface silver or silver alloy layer is not scraped and the contact resistance is further reduced It aims at providing the silver coating material excellent in abrasion resistance which does not rise.
本発明者らは鋭意検討を行った結果、導電性基材上に、少なくとも銀もしくは銀合金からなる層を最表層としてめっきにより形成し、特定の加熱条件で加熱処理することにより上記課題が解決されることを見い出し、本発明に至った。 As a result of intensive studies, the present inventors have solved the above problem by forming a layer made of at least silver or a silver alloy on the conductive substrate by plating as the outermost layer and performing heat treatment under specific heating conditions. As a result, the present invention has been achieved.
即ち、本発明は以下のとおりである。
(1)導電性基材上に、下地層を介し又は介さずに銀被覆層を有し、該銀被覆層は銀もしくは銀合金からなる最表層である銀被覆材であって、該銀もしくは銀合金からなる層に、銀もしくは銀合金からなる平均結晶粒径が0.2μm以上0.5μm以下の柱状構造結晶が含まれ、耐摩耗試験における被膜削れ量が40mg未満であり、かつ初期の接触抵抗、及び下記条件で摺動摩耗試験を行った後の接触抵抗が10mΩ未満であることを特徴とする銀被覆材。
摺動摩耗試験条件:
〔荷重〕 1.6N
〔摺動範囲〕0.2mm
〔摺動速度〕1mm/s
〔回数〕 5万回
(2)前記耐摩耗試験における被膜削れ量が30mg未満であることを特徴とする前記(1)に記載の銀被覆材。
(3)前記耐摩耗試験が、JIS H 8682に準拠し、荷重500gf(削れ面積12mm×31mm)、#1500エメリー研磨紙、200往復の条件で行ったことを特徴とする前記(1)又は(2)に記載の銀被覆材。
(4)スイッチの可動接点及び/又は固定接点として、前記(1)〜(3)のいずれか一項に記載の銀被覆材を用いたことを特徴とするスイッチ。
(5)前記(1)〜(3)のいずれか一項に記載の、導電性基材上に、下地層を介し又は介さずに銀被覆層を有し、該銀被覆層は銀もしくは銀合金からなる最表層である銀被覆材の製造方法であって、前記銀もしくは銀合金からなる層をめっきにより形成し、200〜500℃で1〜299秒間熱処理する工程を有することを特徴とする銀被覆材の製造方法。
(6)前記熱処理が250〜450℃で1〜59秒間であることを特徴とする前記(5)に記載の銀被覆材の製造方法。
(7)前記熱処理が270〜450℃で1〜30秒間であることを特徴とする前記(5)に記載の銀被覆材の製造方法。
(8)前記熱処理が300〜450℃で1〜10秒間であることを特徴とする前記(5)に記載の銀被覆材の製造方法。
That is, the present invention is as follows.
(1) On a conductive substrate, a silver coating layer is provided with or without an underlying layer, and the silver coating layer is a silver coating material that is the outermost layer made of silver or a silver alloy, The layer made of a silver alloy contains columnar structure crystals having an average crystal grain size of 0.2 μm or more and 0.5 μm or less made of silver or a silver alloy, and the amount of film scraping in the wear resistance test is less than 40 mg, and the initial A silver coating material characterized by having a contact resistance and a contact resistance of less than 10 mΩ after a sliding wear test under the following conditions.
Sliding wear test conditions:
[Load] 1.6N
[Sliding range] 0.2mm
[Sliding speed] 1mm / s
[Number of times] 50,000 times (2) The silver coating material as described in (1) above, wherein the amount of film abrasion in the abrasion resistance test is less than 30 mg.
(3) The wear resistance test was performed in accordance with JIS H 8682, under the conditions of a load of 500 gf (scraped area 12 mm × 31 mm), # 1500 emery abrasive paper, and 200 reciprocating conditions. Silver covering material as described in 2).
( 4 ) A switch using the silver coating material according to any one of (1) to ( 3 ) as a movable contact and / or a fixed contact of the switch.
( 5 ) The conductive coating according to any one of (1) to ( 3 ) above has a silver coating layer on or without a base layer, and the silver coating layer is silver or silver. A method for producing a silver coating material which is an outermost layer made of an alloy, the method comprising the step of forming the layer made of silver or a silver alloy by plating and heat-treating at 200 to 500 ° C. for 1 to 299 seconds A method for producing a silver coating material.
( 6 ) The method for producing a silver coating material according to ( 5 ), wherein the heat treatment is performed at 250 to 450 ° C. for 1 to 59 seconds.
( 7 ) The method for producing a silver coating material according to ( 5 ), wherein the heat treatment is performed at 270 to 450 ° C for 1 to 30 seconds.
( 8 ) The method for producing a silver coating material according to ( 5 ), wherein the heat treatment is performed at 300 to 450 ° C for 1 to 10 seconds.
本発明によると、例えば、スイッチングが繰り返し行われる条件下で長期間使用されるスイッチの可動接点及び/又は固定接点として用いても、表面の銀又は銀合金層が削れることがなく、更に接触抵抗が上昇することがない、耐摩耗性に優れた銀被覆材を提供することができる。 According to the present invention, for example, even when used as a movable contact and / or a fixed contact of a switch that is used for a long time under a condition in which switching is repeatedly performed, the surface silver or silver alloy layer is not scraped, and contact resistance is further improved. It is possible to provide a silver coating material excellent in wear resistance, in which no increase occurs.
本発明の銀被覆材は、導電性基材上に、少なくとも銀もしくは銀合金からなる層を最表層として有する銀被覆材であって、耐摩耗試験における被膜削れ量が40mg未満であり、かつ初期の接触抵抗、及び下記条件で摺動摩耗試験を行った後の接触抵抗が10mΩ未満であることを特徴とする。
摺動摩耗試験条件:
〔荷重〕 1.6N
〔摺動範囲〕0.2mm
〔摺動速度〕1mm/s
〔回数〕 5万回
また、本発明の銀被覆材は、導電性基材上に、少なくとも銀もしくは銀合金からなる層を最表層として有する銀被覆材であって、前記銀もしくは銀合金からなる層がめっきにより形成され、200〜500℃で1〜299秒間熱処理されてなることを特徴とする。The silver coating material of the present invention is a silver coating material having, as an outermost layer, a layer made of at least silver or a silver alloy on a conductive substrate, and the amount of film abrasion in an abrasion resistance test is less than 40 mg, and the initial value And a contact resistance after a sliding wear test under the following conditions is less than 10 mΩ.
Sliding wear test conditions:
[Load] 1.6N
[Sliding range] 0.2mm
[Sliding speed] 1mm / s
[Number of times] 50,000 times In addition, the silver coating material of the present invention is a silver coating material having a layer made of at least silver or a silver alloy as an outermost layer on a conductive substrate, and made of the silver or silver alloy The layer is formed by plating and heat-treated at 200 to 500 ° C. for 1 to 299 seconds.
前記導電性基材としては、導電性、ばね特性、耐久性等を有する材料であり、本発明においては銅または銅合金、鉄または鉄合金からなることが好ましい。好ましく用いられる銅合金としては、青銅、リン青銅、黄銅、チタン銅、銅ニッケルシリコン(コルソン)合金、ベリリウム銅等が挙げられる。好ましく用いられる鉄合金としては、ステンレス鋼(SUS)、42アロイ等が挙げられる。 The conductive substrate is a material having conductivity, spring characteristics, durability, and the like, and in the present invention, it is preferably made of copper or a copper alloy, iron or an iron alloy. Preferred copper alloys include bronze, phosphor bronze, brass, titanium copper, copper nickel silicon (Corson) alloy, and beryllium copper. Examples of iron alloys that are preferably used include stainless steel (SUS) and 42 alloy.
前記銀もしくは銀合金からなる最表層における銀合金としては、Ag−Sn合金、Ag−Cu合金、Ag−In合金、Ag−Se合金等が接点特性として良好であり、好適に用いることが出来る。銀合金は銀の含有量が50質量%を超えるものが好ましい。
前記銀もしくは銀合金からなる最表層は、公知の銀めっき液又は銀合金めっき液を用いてめっきにより形成される。めっき液としては、特に制限はないが、シアンを錯体としためっき液が好ましい。前記シアンを錯体としためっき液を用いためっきの前に銀ストライクめっきを行ってもよい。銀もしくは銀合金からなる最表層をめっきにより形成することにより低コストで簡便に形成することができる。
最表層の厚さは0.05〜5μmが好ましく、より好ましくは0.1〜2μm、さらに好ましくは0.2〜2μmである。As the silver alloy in the outermost layer made of silver or a silver alloy, an Ag—Sn alloy, an Ag—Cu alloy, an Ag—In alloy, an Ag—Se alloy, or the like has good contact characteristics and can be suitably used. The silver alloy preferably has a silver content exceeding 50% by mass.
The outermost layer made of silver or a silver alloy is formed by plating using a known silver plating solution or silver alloy plating solution. The plating solution is not particularly limited, but a plating solution containing cyan as a complex is preferable. Silver strike plating may be performed before plating using the plating solution containing cyan as a complex. By forming the outermost layer made of silver or a silver alloy by plating, it can be easily formed at low cost.
The thickness of the outermost layer is preferably 0.05 to 5 μm, more preferably 0.1 to 2 μm, and still more preferably 0.2 to 2 μm.
本発明の銀被覆材は、基材と、銀もしくは銀合金からなる最表層の間に、下地層を有していても良い。下地層としては、Niめっき層、銅めっき層、コバルトめっき層が挙げられる。これらは公知のめっき液、及びめっき条件にて形成することができる。
下地Niめっき層を形成するめっき液としては、スルファミン浴が好ましい。
下地銅めっき層を形成するめっき液としては、シアン銅浴が好ましい。
本発明の銀被覆材は、導電性基材上に銀もしくは銀合金からなる最表層を有しているもの、及び導電性基材と、銀もしくは銀合金からなる最表層の間に、下地層として銅めっき層またはNiめっき層を有しているものが好ましい。The silver coating material of this invention may have a base layer between a base material and the outermost layer which consists of silver or a silver alloy. Examples of the base layer include a Ni plating layer, a copper plating layer, and a cobalt plating layer. These can be formed by a known plating solution and plating conditions.
As a plating solution for forming the underlying Ni plating layer, a sulfamine bath is preferable.
As a plating solution for forming the base copper plating layer, a cyan copper bath is preferable.
The silver coating material of the present invention has an undercoat layer between the conductive base material and the outermost layer made of silver or a silver alloy. It is preferable to have a copper plating layer or a Ni plating layer.
本発明の銀被覆材は、最表層が形成された後、200〜500℃で1〜299秒間熱処理されてなる。上記温度範囲の低い温度では処理時間を長くし、高い温度では処理時間を短くすることが好ましい。生産性の観点から、250〜450℃で1〜59秒間熱処理されてなることが好ましく、270〜450℃で1〜30秒間熱処理されることがより好ましく、300〜450℃で1〜10秒間熱処理されることが特に好ましい。 The silver coating material of the present invention is heat-treated at 200 to 500 ° C. for 1 to 299 seconds after the outermost layer is formed. It is preferable to lengthen the treatment time at a low temperature in the above temperature range and shorten the treatment time at a high temperature. From the viewpoint of productivity, heat treatment is preferably performed at 250 to 450 ° C. for 1 to 59 seconds, more preferably heat treatment at 270 to 450 ° C. for 1 to 30 seconds, and heat treatment at 300 to 450 ° C. for 1 to 10 seconds. It is particularly preferred that
本条件範囲で熱処理を行うと、最表層の球状の銀もしくは銀合金の結晶粒子が成長し平均結晶粒径が0.2μm以上に大きくなり、かつめっき厚さ方向に柱状になることにより、最表層が銀もしくは銀合金からなる柱状構造結晶を含む。その結果、表面の耐摩耗性が大きく向上することが判った。前記最表層は平均結晶粒径が0.2μm以上0.5μm以下であり、且つ柱状構造結晶を含むことがより好ましい。本条件より、温度が低い場合及び/または時間が短い場合は、結晶が成長せず、耐摩耗性の向上はみられなかった。逆に、本条件より、温度が高い場合及び/または時間が長い場合は、結晶は成長するので耐摩耗性の向上はみられるが、平均結晶粒径が0.5μmを超え、めっき厚さ方向に対して横長となり層状となると、めっき厚さ方向に柱状の柱状構造結晶を含む場合ほど顕著な耐摩耗性の向上はみられなかった。上記結晶粒子の形状は、熱処理しためっき基板をFIB(集束イオンビーム)加工した後、めっき厚さ方向の断面SIM像により観察した。 When heat treatment is performed within this range of conditions, the outermost spherical silver or silver alloy crystal grains grow to have an average crystal grain size of 0.2 μm or more and become columnar in the plating thickness direction. The surface layer includes columnar structure crystals made of silver or a silver alloy. As a result, it was found that the wear resistance of the surface was greatly improved. More preferably, the outermost layer has an average crystal grain size of 0.2 μm or more and 0.5 μm or less and includes a columnar structure crystal. Under these conditions, when the temperature was low and / or when the time was short, crystals did not grow and no improvement in wear resistance was observed. On the contrary, if the temperature is higher and / or the time is longer than this condition, the crystal grows, so that the wear resistance is improved, but the average crystal grain size exceeds 0.5 μm, and the plating thickness direction On the other hand, when the film was horizontally long and formed into a layer, the wear resistance was not significantly improved as compared with the case where the columnar structure crystals were included in the plating thickness direction. The shape of the crystal particles was observed by a cross-sectional SIM image in the plating thickness direction after the heat-treated plated substrate was subjected to FIB (focused ion beam) processing.
また、銀は酸化し難いことから、本条件範囲の熱処理では接触抵抗が上昇することは無いが、本条件より、熱処理の温度が高い場合及び/または熱処理時間が長い場合は、表面酸化により初期接触抵抗が上昇する。
前記熱処理は、最表層の銀の結晶粒子を成長させ、柱状とすることを目的としており、酸化物層の形成を目的とするものではないので、不活性ガス雰囲気中で熱処理をしてもよい。しかし、大気中で熱処理することが容易であり、好ましい。
熱処理するための加熱方法としては、特に限定されるものではなく、例えば、ホットプレートまたは熱風循環式オーブンなどを用いて行うことができる。Further, since silver is difficult to oxidize, the contact resistance does not increase in the heat treatment in this condition range. However, if the heat treatment temperature is higher and / or the heat treatment time is longer than this condition, the initial oxidation is caused by surface oxidation. Contact resistance increases.
The heat treatment is intended to grow the outermost silver crystal grains into a columnar shape and is not intended to form an oxide layer. Therefore, the heat treatment may be performed in an inert gas atmosphere. . However, heat treatment in the atmosphere is easy and preferable.
The heating method for the heat treatment is not particularly limited, and can be performed using, for example, a hot plate or a hot air circulation oven.
従って、上記銀もしくは銀合金からなる層を最表層として有する銀被覆材は、前記熱処理により、耐摩耗試験における被膜削れ量が40mg未満であり、かつ初期の接触抵抗、及び下記条件で摺動摩耗試験を行った後の接触抵抗が10mΩ未満となる。
摺動摩耗試験条件:
〔荷重〕 1.6N
〔摺動範囲〕0.2mm
〔摺動速度〕1mm/s
〔回数〕 5万回
前記耐摩耗試験における被膜削れ量は30mg未満であることがより好ましい。前記被膜削れ量は、熱処理条件により30mg未満とすることができる。
前記耐摩耗試験は、JIS H 8682に準拠し、荷重500gf(削れ面積12mm×31mm)、#1500エメリー研磨紙、200往復の条件で行った。Therefore, the silver coating material having the layer made of silver or a silver alloy as the outermost layer has a film abrasion amount of less than 40 mg in the wear resistance test by the heat treatment, and an initial contact resistance and sliding wear under the following conditions. The contact resistance after the test is less than 10 mΩ.
Sliding wear test conditions:
[Load] 1.6N
[Sliding range] 0.2mm
[Sliding speed] 1mm / s
[Number of times] 50,000 times It is more preferable that the film scraping amount in the abrasion resistance test is less than 30 mg. The film scraping amount can be less than 30 mg depending on heat treatment conditions.
The abrasion resistance test was performed in accordance with JIS H 8682, under the conditions of a load of 500 gf (scraped area 12 mm × 31 mm), # 1500 emery abrasive paper, and 200 reciprocations.
本発明の銀被覆材は、上述のように耐剥離性、耐摩耗性に優れ、接触抵抗は上昇しないので、電子機器用接続部品であるコネクタやスイッチに好適に用いることができる。特に、携帯電話やリモコンスイッチに用いられているスイッチの可動接点及び/又は固定接点として、例えばタクタイルスイッチとして好適に用いることができ、スイッチングが繰り返し行われる条件下で長期間使用されても、表面の銀又は銀合金層が削れることがなく、また接触抵抗が上昇することがない。 Since the silver coating material of the present invention is excellent in peel resistance and wear resistance as described above and does not increase contact resistance, it can be suitably used for connectors and switches that are connecting parts for electronic devices. In particular, it can be suitably used as a movable contact and / or a fixed contact of a switch used in a mobile phone or a remote control switch, for example, as a tactile switch. The silver or silver alloy layer is not scraped and the contact resistance is not increased.
次に、実施例に基づいて本発明をさらに詳細に説明するが、本発明はこれに制限されるものではない。 Next, the present invention will be described in more detail based on examples, but the present invention is not limited thereto.
実施例1
リン青銅(C5210,25mm×20mm×0.2mmt)に、銀ストライクめっきを0.05μm、高シアン銀浴による銀めっきを0.4μm順に行なっためっき基板を供試材とした。
上記めっき基板を表1の実施例1の条件で、大気中でホットプレートを用い熱処理した。熱処理温度は、ホットプレート上に設置しためっき基板の温度を熱電対で計測した温度である。Example 1
A plated substrate in which phosphor bronze (C5210, 25 mm × 20 mm × 0.2 mmt) was subjected to 0.05 μm silver strike plating and 0.4 μm silver plating using a high cyan silver bath was used as a test material.
The plated substrate was heat-treated in the atmosphere using a hot plate under the conditions of Example 1 in Table 1. The heat treatment temperature is a temperature obtained by measuring the temperature of the plating substrate placed on the hot plate with a thermocouple.
実施例2および実施例3
リン青銅(C5210,25mm×20mm×0.2mmt)に、シアン銅浴による銅めっきを3μm、銀ストライクめっきを0.05μm、高シアン銀浴による銀めっきを0.4μm順に行なっためっき基板を供試材とした。
上記めっき基板を表1の実施例2および実施例3の条件で、大気中でホットプレートを用い熱処理した。Example 2 and Example 3
A phosphor bronze (C5210, 25 mm × 20 mm × 0.2 mmt) is provided with a plated substrate in which copper plating using a cyan copper bath is performed 3 μm, silver strike plating is 0.05 μm, and silver plating using a high cyan silver bath is performed in order of 0.4 μm. Samples were used.
The plated substrate was heat-treated in the atmosphere using a hot plate under the conditions of Example 2 and Example 3 in Table 1.
実施例4
リン青銅(C5210,25mm×20mm×0.2mmt)に、スルファミン酸浴によるニッケルめっきを3μm、銀ストライクめっきを0.05μm、高シアン銀浴による銀めっきを0.4μm順に行なっためっき基板を供試材とした。
上記めっき基板を表1の実施例4の条件で、大気中でホットプレートを用い熱処理した。Example 4
A plated substrate in which phosphor bronze (C5210, 25 mm × 20 mm × 0.2 mmt) is subjected to nickel plating with a sulfamic acid bath at 3 μm, silver strike plating at 0.05 μm, and silver plating at a high cyan silver bath in order of 0.4 μm is provided. Samples were used.
The plated substrate was heat-treated in the atmosphere using a hot plate under the conditions of Example 4 in Table 1.
実施例5
実施例2において、熱処理条件を表1に記載の条件に変更し、窒素雰囲気中(酸素濃度<1%)で加熱した以外は、実施例2と同様にして熱処理しためっき基板を得た。Example 5
In Example 2, the heat treatment conditions were changed to the conditions shown in Table 1, and a heat-treated plated substrate was obtained in the same manner as in Example 2 except that heating was performed in a nitrogen atmosphere (oxygen concentration <1%).
実施例6
実施例4において、熱処理条件を表1に記載の条件に変更した以外は、実施例4と同様にして熱処理しためっき基板を得た。Example 6
In Example 4, except that the heat treatment conditions were changed to the conditions shown in Table 1, a plated substrate that was heat treated in the same manner as in Example 4 was obtained.
実施例7
実施例2において、熱処理条件を表1に記載の条件に変更した以外は、実施例2と同様にして熱処理しためっき基板を得た。Example 7
In Example 2, a heat treated plated substrate was obtained in the same manner as in Example 2 except that the heat treatment conditions were changed to those shown in Table 1.
実施例8
実施例4において、熱処理条件を表1に記載の条件に変更した以外は、実施例4と同様にして熱処理しためっき基板を得た。Example 8
In Example 4, except that the heat treatment conditions were changed to the conditions shown in Table 1, a plated substrate that was heat treated in the same manner as in Example 4 was obtained.
比較例1
実施例4において、熱処理を行わなかった以外は実施例4と同様にしてめっき基板を得た。Comparative Example 1
In Example 4, a plated substrate was obtained in the same manner as in Example 4 except that the heat treatment was not performed.
比較例2
実施例2において、熱処理条件を表1に記載の条件に変更した以外は、実施例2と同様にして熱処理しためっき基板を得た。Comparative Example 2
In Example 2, a heat treated plated substrate was obtained in the same manner as in Example 2 except that the heat treatment conditions were changed to those shown in Table 1.
比較例3
実施例1において、熱処理条件を表1に記載の条件に変更した以外は、実施例1と同様にして熱処理しためっき基板を得た。Comparative Example 3
A heat-treated plated substrate was obtained in the same manner as in Example 1 except that the heat treatment conditions in Example 1 were changed to those shown in Table 1.
比較例4〜比較例6
実施例4において、熱処理条件を表1に記載の条件に変更した以外は、実施例4と同様にして熱処理しためっき基板を得た。Comparative Example 4 to Comparative Example 6
In Example 4, except that the heat treatment conditions were changed to the conditions shown in Table 1, a plated substrate that was heat treated in the same manner as in Example 4 was obtained.
熱処理しためっき基板に対し、耐摩耗試験を行った。耐摩耗試験はJIS H 8682記載の方法に準拠し、スガ摩耗試験機(NUS−IS03)を用い、荷重500gf(削れ面積 12mm×31mm)、#1500エメリー研磨紙、200往復の条件で実施した。
評価基準:
○:耐摩耗試験での被膜削れ量が30mg未満
△:耐摩耗試験での被膜削れ量が30mg以上40mg未満
×:耐摩耗試験での被膜削れ量が40mg以上A wear resistance test was performed on the heat-treated plated substrate. The abrasion resistance test was performed according to the method described in JIS H 8682, using a Suga abrasion tester (NUS-IS03) under a load of 500 gf (scraped area 12 mm × 31 mm), # 1500 emery abrasive paper, 200 reciprocating conditions.
Evaluation criteria:
○: Film abrasion amount in the abrasion resistance test is less than 30 mg. Δ: Film abrasion amount in the abrasion resistance test is 30 mg or more and less than 40 mg. X: Film abrasion amount in the abrasion resistance test is 40 mg or more.
熱処理しためっき基板をFIB加工した後、断面SIM像で平均結晶粒径と結晶の形状を確認した(SIIナノテクロロジーズ製SMI3050SEを使用)。
平均結晶粒径の測定は、JIS H 0501に準じて、上記断面SIM像から切断法により算出した。
評価基準:
小: 平均結晶粒径 < 0.2μm
中: 0.2μm ≦ 平均結晶粒径 ≦ 0.5μm
大: 平均結晶粒径 > 0.5μm
上記実施例1、比較例1、及び比較例3のめっき基板の断面SIM像をそれぞれ図1〜図3に示す。
実施例1のめっき基板は、図1に示すように、銀めっき層は銀の柱状構造結晶を含んでいる。このような形状を「柱状」とした。比較例1のめっき基板は、図2に示すように銀めっき層の銀粒子は丸くなっている。このような形状を「丸」とした。また、比較例3のめっき基板は、図3に示すように銀の結晶は横長となっている。このような形状を「横長」とした。After subjecting the heat-treated plated substrate to FIB processing, the average crystal grain size and the crystal shape were confirmed by a cross-sectional SIM image (using SMI3050SE manufactured by SII Nanotechnologies).
Measurement of the average crystal grain size was calculated by the cutting method from the cross-sectional SIM image according to JIS H 0501.
Evaluation criteria:
Small: Average grain size <0.2μm
Medium: 0.2 μm ≦ average grain size ≦ 0.5 μm
Large: Average crystal grain size> 0.5μm
Cross-sectional SIM images of the plated substrates of Example 1, Comparative Example 1, and Comparative Example 3 are shown in FIGS.
As shown in FIG. 1, in the plated substrate of Example 1, the silver plating layer includes silver columnar structure crystals. Such a shape was defined as “columnar”. In the plated substrate of Comparative Example 1, the silver particles of the silver plating layer are round as shown in FIG. Such a shape was defined as “circle”. Further, in the plated substrate of Comparative Example 3, the silver crystals are horizontally long as shown in FIG. Such a shape was defined as “landscape”.
熱処理しためっき基板に対し、初期の接触抵抗、及び以下の条件で摺動摩耗試験を行った後の接触抵抗を測定した。
接触抵抗測定条件:
装置:山崎式接点シミュレータCRS−1
条件:接点荷重10g(Auプローブ)、摺動距離1mm
摺動摩耗試験条件:
装置:山崎精機研究所製CRS−G2050−JNS
条件:〔荷重〕1.6N
〔摺動範囲〕0.2mm
〔摺動速度〕1mm/s
〔回数〕5万回The initial contact resistance and the contact resistance after performing a sliding wear test under the following conditions were measured on the heat-treated plated substrate.
Contact resistance measurement conditions:
Equipment: Yamazaki contact simulator CRS-1
Conditions: Contact load 10g (Au probe), sliding distance 1mm
Sliding wear test conditions:
Equipment: CRS-G2050-JNS manufactured by Yamazaki Seiki Laboratory
Condition: [Load] 1.6N
[Sliding range] 0.2mm
[Sliding speed] 1mm / s
[Number of times] 50,000 times
Claims (8)
摺動摩耗試験条件:
〔荷重〕 1.6N
〔摺動範囲〕0.2mm
〔摺動速度〕1mm/s
〔回数〕 5万回 On a conductive substrate, a silver coating layer is provided with or without an underlying layer, and the silver coating layer is a silver coating material that is an outermost layer made of silver or a silver alloy, and is made of the silver or silver alloy. The layer comprises a columnar structure crystal having an average crystal grain size of 0.2 μm or more and 0.5 μm or less made of silver or a silver alloy, and the amount of film abrasion in the abrasion resistance test is less than 40 mg, and the initial contact resistance, And a silver coating material having a contact resistance of less than 10 mΩ after a sliding wear test under the following conditions.
Sliding wear test conditions:
[Load] 1.6N
[Sliding range] 0.2mm
[Sliding speed] 1mm / s
[Number of times] 50,000 times
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JP2915623B2 (en) * | 1991-06-25 | 1999-07-05 | 古河電気工業株式会社 | Electrical contact material and its manufacturing method |
JP3874621B2 (en) * | 2001-03-30 | 2007-01-31 | 株式会社神戸製鋼所 | Sn-plated copper alloy material for mating type connection terminals and mating type connection terminals |
JP3772240B2 (en) * | 2003-06-11 | 2006-05-10 | 東洋精箔株式会社 | Spring material for electric contact used for push button switch and method for manufacturing the same |
JP4728571B2 (en) * | 2003-10-31 | 2011-07-20 | 古河電気工業株式会社 | Manufacturing method of silver-coated stainless steel strip for movable contacts |
JP4367457B2 (en) * | 2006-07-06 | 2009-11-18 | パナソニック電工株式会社 | Silver film, silver film manufacturing method, LED mounting substrate, and LED mounting substrate manufacturing method |
JP5705738B2 (en) * | 2010-02-12 | 2015-04-22 | 古河電気工業株式会社 | Silver-coated composite material for movable contact parts, manufacturing method thereof, and movable contact parts |
JP2012049041A (en) | 2010-08-27 | 2012-03-08 | Furukawa Electric Co Ltd:The | Silver coating material for movable contact component and method for manufacturing the same |
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2014
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KR20160007650A (en) | 2016-01-20 |
EP3070726A1 (en) | 2016-09-21 |
CN105247642A (en) | 2016-01-13 |
KR101751167B1 (en) | 2017-06-27 |
WO2015068835A1 (en) | 2015-05-14 |
MY178336A (en) | 2020-10-08 |
TW201523668A (en) | 2015-06-16 |
EP3070726A4 (en) | 2017-08-02 |
EP3070726B1 (en) | 2019-05-15 |
JPWO2015068835A1 (en) | 2017-03-09 |
CN105247642B (en) | 2017-08-18 |
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