CN106191620A - A kind of electronic material novel alloy - Google Patents
A kind of electronic material novel alloy Download PDFInfo
- Publication number
- CN106191620A CN106191620A CN201610650390.6A CN201610650390A CN106191620A CN 106191620 A CN106191620 A CN 106191620A CN 201610650390 A CN201610650390 A CN 201610650390A CN 106191620 A CN106191620 A CN 106191620A
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- mass fraction
- parts
- electronic material
- alloy
- novel alloy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/002—Ferrous alloys, e.g. steel alloys containing In, Mg, or other elements not provided for in one single group C22C38/001 - C22C38/60
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/02—Ferrous alloys, e.g. steel alloys containing silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/06—Ferrous alloys, e.g. steel alloys containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/08—Ferrous alloys, e.g. steel alloys containing nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/14—Ferrous alloys, e.g. steel alloys containing titanium or zirconium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
A kind of electronic material novel alloy, it comprises the MnO of mass fraction 5 10 parts2, the Si of mass fraction 5 10 parts, the Al of mass fraction 36 parts, the P of mass fraction 0.1 1 parts, the Ti of mass fraction 15 parts, the Ni of mass fraction 15 parts, the Cr of mass fraction 7 10 parts, the Fe of mass fraction 15 20 parts；Remaining is made up of inevitable impurity.By technique scheme, the equilibrium of the intensity of electronic material, electric conductivity and bending machining performance prepared by the alloy using the present invention to propose is significantly improved, and the yield strength of material is big simultaneously, improves service life, meets the requirement of electronics processing.
Description
Technical field
The invention belongs to technical field of electronic materials, be specifically related to a kind of electronic material novel alloy.
Background technology
Electronic material refers to the material used in electronic technology and microelectric technique, including dielectric material, quasiconductor material
Material, piezoelectricity and ferroelectric material, conducting metal and alloy material thereof, magnetic material, photoelectron material, electromagnetic shielding material and
Other associated materials.Electronic material is the material base of modern electronics industry and scientific technological advance.
For the electronic material alloy for the balancing performance of lead frame, terminal, connector etc., as goods
Fundamental characteristics, it is desirable to high intensity and excellent electric conductivity or heat conductivity have both.And the most more require electronic device
Miniaturization, highly integrated, thus raw-material thin plate, in lead frame, terminal, connector, the increase of pin count etc.,
Narrow space lengthization is the most fast-developing.Simultaneously in addition to mechanical strength and excellent electric conductivity, also require good bending machining
Property.But it is currently used for preparing the mechanical strength of the alloy of electronic material, electric conductivity, yield strength the most all not reach and want
Asking, prepared electronic material is short for service life.
In view of this, present inventors have proposed a kind of electronic material novel alloy.
Summary of the invention
It is an object of the invention to propose a kind of good combination property and have mechanical strength and the electricity of conductive capability of excellence concurrently
Sub-material novel alloy.
It is an object of the invention to realize by the following technical solutions.A kind of electronic material proposed according to the present invention is used new
Type alloy, it comprises the MnO of mass fraction 5-10 part2, the Si of mass fraction 5-10 part, the Al of mass fraction 3-6 part, mass parts
The number P of 0.1-1 part, the Ti of mass fraction 1-5 part, the Ni of mass fraction 1-5 part, the Cr of mass fraction 7-10 part, mass fraction
The Fe of 15-20 part；Remaining is made up of inevitable impurity.
By technique scheme, the intensity of electronic material prepared by the alloy using the present invention to propose, electric conductivity and
The equilibrium of bending machining performance is significantly improved, and the yield strength of material is big simultaneously, improves service life, meets electronics and add
The requirement of work.
Described above is only the general introduction of technical solution of the present invention, in order to be able to better understand the technological means of the present invention, and
Can be practiced according to the content of description, and be to allow the above and other objects, features and advantages of the present invention can be brighter
Aobvious understandable, describe in detail especially exemplified by preferred embodiment below.
Detailed description of the invention
By further illustrating the technological means and effect that the present invention taked by reaching predetermined goal of the invention, below in conjunction with
Preferred embodiment, to according to the present invention propose a kind of its detailed description of the invention of electronic material novel alloy, structure, feature and
Its effect, after describing in detail such as.
Embodiment one
A kind of electronic material novel alloy, it comprises the MnO of mass fraction 5 parts2, the Si of mass fraction 5 parts, mass parts
The Al of several 3 parts, the P of mass fraction 0.1 part, the Ti of mass fraction 1 part, the Ni of mass fraction 1 part, the Cr of mass fraction 7 parts, matter
The Fe of amount number 15 parts；Remaining is made up of inevitable impurity.
Embodiment two
A kind of electronic material novel alloy, it comprises the MnO of mass fraction 7 parts2, the Si of mass fraction 7 parts, mass parts
The Al of several 4 parts, the P of mass fraction 0.4 part, the Ti of mass fraction 3 parts, the Ni of mass fraction 2 parts, the Cr of mass fraction 8 parts, matter
The Fe of amount number 17 parts；Remaining is made up of inevitable impurity.
Embodiment three
A kind of electronic material novel alloy, it comprises the MnO of mass fraction 9 parts2, the Si of mass fraction 9 parts, mass parts
The Al of several 5 parts, the P of mass fraction 0.6 part, the Ti of mass fraction 4 parts, the Ni of mass fraction 4 parts, the Cr of mass fraction 9 parts, matter
The Fe of amount number 19 parts；Remaining is made up of inevitable impurity.
Embodiment four
A kind of electronic material novel alloy, it comprises the MnO of mass fraction 10 parts2, the Si of mass fraction 10 parts, quality
Al that number is 6 parts, the P of mass fraction 0.8 part, the Ti of mass fraction 5 parts, the Ni of mass fraction 5 parts, mass fraction 10 parts
Cr, the Fe of mass fraction 20 parts；Remaining is made up of inevitable impurity.
The above, be only presently preferred embodiments of the present invention, and the present invention not does any pro forma restriction, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any technology people being familiar with this specialty
Member, in the range of without departing from technical solution of the present invention, when the technology contents of available the disclosure above makes a little change or modification
For the Equivalent embodiments of equivalent variations, as long as being the content without departing from technical solution of the present invention, the technical spirit of the foundation present invention
To any simple modification made for any of the above embodiments, equivalent variations and modification, all still fall within the range of technical solution of the present invention.
Claims (1)
1. an electronic material novel alloy, it is characterised in that: it comprises the MnO of mass fraction 5-10 part2, mass fraction 5-
The Si of 10 parts, the Al of mass fraction 3-6 part, the P of mass fraction 0.1-1 part, the Ti of mass fraction 1-5 part, mass fraction 1-5 part
Ni, the Cr of mass fraction 7-10 part, the Fe of mass fraction 15-20 part；Remaining is made up of inevitable impurity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610650390.6A CN106191620A (en) | 2016-08-09 | 2016-08-09 | A kind of electronic material novel alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610650390.6A CN106191620A (en) | 2016-08-09 | 2016-08-09 | A kind of electronic material novel alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106191620A true CN106191620A (en) | 2016-12-07 |
Family
ID=57514890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610650390.6A Pending CN106191620A (en) | 2016-08-09 | 2016-08-09 | A kind of electronic material novel alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106191620A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108149121A (en) * | 2017-12-27 | 2018-06-12 | 洛阳神佳窑业有限公司 | A kind of alloy |
| CN113862545A (en) * | 2021-12-03 | 2021-12-31 | 西安稀有金属材料研究院有限公司 | High-entropy alloy wave-absorbing material with reflection loss reaching-60.9 dB and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012111972A (en) * | 2010-11-19 | 2012-06-14 | Shin Zu Shing Co Ltd | Hinge element and electronic device using the same |
| WO2014158336A1 (en) * | 2013-03-12 | 2014-10-02 | Baker Hughes Incorporated | Ferrous disintegrable powder compact, method of making and article of same |
| CN104266004A (en) * | 2014-08-14 | 2015-01-07 | 无锡阁特精密冷拔管有限公司 | Threaded connection strengthened seamless steel pipe and production technique thereof |
| CN104451432A (en) * | 2014-12-25 | 2015-03-25 | 春焱电子科技（苏州）有限公司 | Stainless steel alloy for electronic material |
-
2016
- 2016-08-09 CN CN201610650390.6A patent/CN106191620A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012111972A (en) * | 2010-11-19 | 2012-06-14 | Shin Zu Shing Co Ltd | Hinge element and electronic device using the same |
| WO2014158336A1 (en) * | 2013-03-12 | 2014-10-02 | Baker Hughes Incorporated | Ferrous disintegrable powder compact, method of making and article of same |
| CN104266004A (en) * | 2014-08-14 | 2015-01-07 | 无锡阁特精密冷拔管有限公司 | Threaded connection strengthened seamless steel pipe and production technique thereof |
| CN104451432A (en) * | 2014-12-25 | 2015-03-25 | 春焱电子科技（苏州）有限公司 | Stainless steel alloy for electronic material |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108149121A (en) * | 2017-12-27 | 2018-06-12 | 洛阳神佳窑业有限公司 | A kind of alloy |
| CN113862545A (en) * | 2021-12-03 | 2021-12-31 | 西安稀有金属材料研究院有限公司 | High-entropy alloy wave-absorbing material with reflection loss reaching-60.9 dB and preparation method thereof |
| CN113862545B (en) * | 2021-12-03 | 2022-02-15 | 西安稀有金属材料研究院有限公司 | High-entropy alloy wave-absorbing material with reflection loss reaching-60.9 dB and preparation method thereof |
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Application publication date: 20161207 |