CN106191618A - A kind of alloy for preparing electronic material - Google Patents
A kind of alloy for preparing electronic material Download PDFInfo
- Publication number
- CN106191618A CN106191618A CN201610647163.8A CN201610647163A CN106191618A CN 106191618 A CN106191618 A CN 106191618A CN 201610647163 A CN201610647163 A CN 201610647163A CN 106191618 A CN106191618 A CN 106191618A
- Authority
- CN
- China
- Prior art keywords
- mass fraction
- parts
- alloy
- electronic material
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C23/00—Alloys based on magnesium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0036—Matrix based on Al, Mg, Be or alloys thereof
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
A kind of alloy for preparing electronic material, it comprises the Ni of mass fraction 5 10 parts, the Si of mass fraction 5 10 parts, the Mg of mass fraction 10 15 parts, the Al of mass fraction 5 10 parts2O3, the MnO of mass fraction 25 parts2, the TiO of mass fraction 25 parts2；Remaining is made up of inevitable impurity.By technique scheme, the equilibrium of the intensity of electronic material, electric conductivity and bending machining performance prepared by the alloy using the present invention to propose is significantly improved, and the yield strength of material is big simultaneously, improves service life, meets the requirement of electronics processing.
Description
Technical field
The invention belongs to technical field of electronic materials, be specifically related to a kind of alloy for preparing electronic material.
Background technology
Electronic material refers to the material used in electronic technology and microelectric technique, including dielectric material, quasiconductor material
Material, piezoelectricity and ferroelectric material, conducting metal and alloy material thereof, magnetic material, photoelectron material, electromagnetic shielding material and
Other associated materials.Electronic material is the material base of modern electronics industry and scientific technological advance.
For the electronic material alloy for the balancing performance of lead frame, terminal, connector etc., as goods
Fundamental characteristics, it is desirable to high intensity and excellent electric conductivity or heat conductivity have both.And the most more require electronic device
Miniaturization, highly integrated, thus raw-material thin plate, in lead frame, terminal, connector, the increase of pin count etc.,
Narrow space lengthization is the most fast-developing.Simultaneously in addition to mechanical strength and excellent electric conductivity, also require good bending machining
Property.But it is currently used for preparing the mechanical strength of the alloy of electronic material, electric conductivity, yield strength the most all not reach and want
Asking, prepared electronic material is short for service life.
In view of this, present inventors have proposed a kind of alloy for preparing electronic material.
Summary of the invention
It is an object of the invention to propose a kind of good combination property and have mechanical strength and the conjunction of conductive capability of excellence concurrently
Gold.
It is an object of the invention to realize by the following technical solutions.The one proposed according to the present invention is used for preparing electronics
The alloy of material, it comprises the Ni of mass fraction 5-10 part, the Si of mass fraction 5-10 part, the Mg of mass fraction 10-15 part, matter
The Al of amount number 5-10 part2O3, the MnO of mass fraction 2-5 part2, the TiO of mass fraction 2-5 part2；Remaining is by the most miscellaneous
Matter is constituted.
By technique scheme, the intensity of electronic material prepared by the alloy using the present invention to propose, electric conductivity and
The equilibrium of bending machining performance is significantly improved, and the yield strength of material is big simultaneously, improves service life, meets electronics and add
The requirement of work.
Described above is only the general introduction of technical solution of the present invention, in order to be able to better understand the technological means of the present invention, and
Can be practiced according to the content of description, and be to allow the above and other objects, features and advantages of the present invention can be brighter
Aobvious understandable, describe in detail especially exemplified by preferred embodiment below.
Detailed description of the invention
By further illustrating the technological means and effect that the present invention taked by reaching predetermined goal of the invention, below in conjunction with
Preferred embodiment, to a kind of its detailed description of the invention of the alloy for preparing electronic material proposed according to the present invention, structure, spy
Levy and effect, after describing in detail such as.
Embodiment one
A kind of alloy for preparing electronic material, it comprises the Ni of mass fraction 5 parts, the Si of mass fraction 5 parts, quality
Mg, the Al of mass fraction 5 parts that number is 10 parts2O3, the MnO of mass fraction 2 parts2, the TiO of mass fraction 2 parts2；Remaining is by can not
The impurity avoided is constituted.
Embodiment two
A kind of alloy for preparing electronic material, it comprises the Ni of mass fraction 7 parts, the Si of mass fraction 6 parts, quality
Mg, the Al of mass fraction 7 parts that number is 12 parts2O3, the MnO of mass fraction 3 parts2, the TiO of mass fraction 3 parts2；Remaining is by can not
The impurity avoided is constituted.
Embodiment three
A kind of alloy for preparing electronic material, it comprises the Ni of mass fraction 9 parts, the Si of mass fraction 8 parts, quality
Mg, the Al of mass fraction 9 parts that number is 14 parts2O3, the MnO of mass fraction 4 parts2, the TiO of mass fraction 4 parts2；Remaining is by can not
The impurity avoided is constituted.
Embodiment four
A kind of alloy for preparing electronic material, it comprises the Ni of mass fraction 10 parts, the Si of mass fraction 10 parts, matter
The amount Mg of number 15 parts, the Al of mass fraction 10 parts2O3, the MnO of mass fraction 5 parts2, the TiO of mass fraction 5 parts2；Remaining by
Inevitably impurity is constituted.
The above, be only presently preferred embodiments of the present invention, and the present invention not does any pro forma restriction, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any technology people being familiar with this specialty
Member, in the range of without departing from technical solution of the present invention, when the technology contents of available the disclosure above makes a little change or modification
For the Equivalent embodiments of equivalent variations, as long as being the content without departing from technical solution of the present invention, the technical spirit of the foundation present invention
To any simple modification made for any of the above embodiments, equivalent variations and modification, all still fall within the range of technical solution of the present invention.
Claims (1)
1. the alloy being used for preparing electronic material, it is characterised in that: it comprises the Ni of mass fraction 5-10 part, mass fraction
The Si of 5-10 part, the Mg of mass fraction 10-15 part, the Al of mass fraction 5-10 part2O3, the MnO of mass fraction 2-5 part2, quality
The TiO of number 2-5 part2；Remaining is made up of inevitable impurity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610647163.8A CN106191618A (en) | 2016-08-09 | 2016-08-09 | A kind of alloy for preparing electronic material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610647163.8A CN106191618A (en) | 2016-08-09 | 2016-08-09 | A kind of alloy for preparing electronic material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106191618A true CN106191618A (en) | 2016-12-07 |
Family
ID=57513851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610647163.8A Pending CN106191618A (en) | 2016-08-09 | 2016-08-09 | A kind of alloy for preparing electronic material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106191618A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101096731A (en) * | 2006-06-28 | 2008-01-02 | 宝山钢铁股份有限公司 | Nickel magnesium alloy and smelting method thereof |
| CN104404328A (en) * | 2014-12-25 | 2015-03-11 | 春焱电子科技（苏州）有限公司 | Magnesium alloy for electronic material |
| CN104946919A (en) * | 2015-06-25 | 2015-09-30 | 苏州洋杰电子有限公司 | Metal composite material for electronic device and preparation method thereof |
| CN105525184A (en) * | 2015-12-29 | 2016-04-27 | 常熟市良益金属材料有限公司 | High-nickel alloy ultrasonic flaw detection tube |
-
2016
- 2016-08-09 CN CN201610647163.8A patent/CN106191618A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101096731A (en) * | 2006-06-28 | 2008-01-02 | 宝山钢铁股份有限公司 | Nickel magnesium alloy and smelting method thereof |
| CN104404328A (en) * | 2014-12-25 | 2015-03-11 | 春焱电子科技（苏州）有限公司 | Magnesium alloy for electronic material |
| CN104946919A (en) * | 2015-06-25 | 2015-09-30 | 苏州洋杰电子有限公司 | Metal composite material for electronic device and preparation method thereof |
| CN105525184A (en) * | 2015-12-29 | 2016-04-27 | 常熟市良益金属材料有限公司 | High-nickel alloy ultrasonic flaw detection tube |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161207 |
|
| WD01 | Invention patent application deemed withdrawn after publication |