CN107778745A - 一种基于黑磷烯的半导体复合材料及其制备方法与应用 - Google Patents
一种基于黑磷烯的半导体复合材料及其制备方法与应用 Download PDFInfo
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- -1 black phosphorus alkene Chemical class 0.000 title claims abstract description 50
- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 239000002131 composite material Substances 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 229920000767 polyaniline Polymers 0.000 claims abstract description 24
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 23
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 9
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- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000003960 organic solvent Substances 0.000 claims abstract description 6
- 150000001875 compounds Chemical class 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims abstract description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 7
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 6
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 5
- 239000007800 oxidant agent Substances 0.000 claims description 5
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 claims description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 235000006666 potassium iodate Nutrition 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 3
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 3
- RCEAADKTGXTDOA-UHFFFAOYSA-N OS(O)(=O)=O.CCCCCCCCCCCC[Na] Chemical group OS(O)(=O)=O.CCCCCCCCCCCC[Na] RCEAADKTGXTDOA-UHFFFAOYSA-N 0.000 claims description 3
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- 238000006243 chemical reaction Methods 0.000 claims description 3
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
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- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
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- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 claims description 3
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 claims description 3
- 239000001230 potassium iodate Substances 0.000 claims description 3
- 229940093930 potassium iodate Drugs 0.000 claims description 3
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical group [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 3
- 235000019394 potassium persulphate Nutrition 0.000 claims description 3
- BTURAGWYSMTVOW-UHFFFAOYSA-M sodium dodecanoate Chemical compound [Na+].CCCCCCCCCCCC([O-])=O BTURAGWYSMTVOW-UHFFFAOYSA-M 0.000 claims description 3
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- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
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- 239000004115 Sodium Silicate Substances 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- CRBREIOFEDVXGE-UHFFFAOYSA-N dodecoxybenzene Chemical class CCCCCCCCCCCCOC1=CC=CC=C1 CRBREIOFEDVXGE-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
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- 229920000915 polyvinyl chloride Polymers 0.000 claims 1
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- 239000011734 sodium Substances 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 235000019795 sodium metasilicate Nutrition 0.000 claims 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims 1
- 229910052911 sodium silicate Inorganic materials 0.000 claims 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
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- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000005411 Van der Waals force Methods 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 125000004437 phosphorous atom Chemical group 0.000 description 2
- AEUZJPHUNWZRCJ-UHFFFAOYSA-N 1-butyl-2-propan-2-ylbenzene Chemical compound CCCCC1=CC=CC=C1C(C)C AEUZJPHUNWZRCJ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
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- 240000007594 Oryza sativa Species 0.000 description 1
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- 238000005984 hydrogenation reaction Methods 0.000 description 1
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- 239000011229 interlayer Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000002060 nanoflake Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001596 poly (chlorostyrenes) Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/026—Wholly aromatic polyamines
- C08G73/0266—Polyanilines or derivatives thereof
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0853—Vinylacetate
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/16—Homopolymers or copolymers or vinylidene fluoride
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Abstract
本发明涉及一种基于黑磷烯的半导体复合材料及其制备方法与应用，其原料组分如下：黑磷烯‑聚苯胺复合物10～20份，成膜基底50～60份，填料0～15份，交联剂1～5份，有机溶剂200～250份。相对于现有技术，本发明以黑磷烯‑聚苯胺为半导体介质，其特殊的二维纳米结构，使得在不添加导电粉体情况下，在20℃的体积电阻率在6～11Ω·cm，应用前景广泛；且黑磷烯二维纳米结构与苯胺形成共轭结构，聚合后的聚苯胺与黑磷复合均匀，使得材料性能更加稳定。
Description
技术领域
本发明涉及一种基于黑磷烯的半导体复合材料及其制备方法与应用，属于半导体复合材料领域。
技术背景
聚合物半导电材料具有广阔的应用前景，以电气领域为例，在电缆中聚合物半导电材料主要用于中高压电缆的绞线导体以及绝缘的屏蔽。除了结构型导电聚合物外，其他的导电聚合物都是通过往聚合物中添加导电填料来制备导电材料。其中，主要使用的填料是导电炭黑，往往需要添加大量的炭黑(质量分数30％-50％)，但是过高的炭黑含量会影响材料的机械性能。石墨烯是一种具有二维结构的碳质纳米新材料，石墨烯中，相邻碳原子以共价键结合，每个碳原子p轨道上的电子能够在大π键中自由移动，因此具有优异的导电性能，其电导率能高达106s/cm，以石墨烯作为填料可大大改善聚合物的导电性能。
但是，由于石墨烯的比表面积非常大，片层之间的范德华力使得其极容易团聚。因此，在聚合物中添加石墨烯，因石墨烯与聚合物间的界面作用差，往往极易发生团聚现象，使得石墨烯很难在聚合物中分散开来。通过对石墨烯化学改性能有效提高石墨烯在聚合物中的分散性，但是这样却破坏了石墨烯完整的共轭结构，导致石墨烯性能下降，从而影响了石墨烯的实际应用。
黑磷是一种类似于石墨的波形层状结构晶体，其原子层间通过范德华力结合，易于被剥离成单层或少层的纳米薄片。在单原子层中，每个磷原子与相邻的3个磷原子形成具有共价键的褶状蜂窝结构，黑磷烯是天然的p型半导体，价带电子跃迁至导带时，为竖直跃迁，电子波矢不变，因此其具有直接带隙，且无论剥到多少层皆是直接带隙，带隙可由层数在0.3eV～1.5eV范围调控,并且其具有明显的各向异性，在X方向上的弹性模量较小，且晶体电子的有效质量仅为0.1～0.2m0，这决定了黑磷烯具有较高的电子迁移率，单层黑磷烯电子迁移率可达10000cm2/(V·s)。但是关于黑磷烯在半导体复合材料领域的应用较少。
发明内容
为克服现有技术的缺点和不足，本发明的目的旨在提供一种基于黑磷烯的半导体复合材料。
本发明的另一目的在于提高所述的基于黑磷烯的半导体复合材料的制备方法。
本发明的再一目的在于提高所述的基于黑磷烯的半导体复合材料在照相器材、光学仪器、IC产品、半导体产品、光电产品领域的应用。
一种基于黑磷烯的半导体复合材料，按重量份计，其原料组分如下：黑磷烯-聚苯胺复合物10～20份，成膜基底50～60份，填料0～15份，交联剂1～5份，有机溶剂200～250份。
所述的成膜基底为乙烯-醋酸乙烯共聚物、聚偏氟乙烯、聚甲基丙烯酸甲酯、聚氯乙烯中的至少一种。
所述的填料为高岭土、膨润土、滑石粉、云母粉中的至少一种。
所述的交联剂为过氧化二异丙苯、过氧化苯甲酰、1,4-双叔丁基过氧异丙基苯、叔丁基过氧化碳酸脂、叔丁基异丙苯基过氧化物、过氧化异氯丙苯中的至少一种。
所述的有机溶剂为石油醚、甲苯、二甲苯、三甲苯、D40溶剂中的至少一种。D40溶剂油是以馏份油为原料，经过130kPa高压加氢精制后分馏而成，可在市面上购得。
所述的黑磷烯-聚苯胺复合物得制备方法为：通氮气条件下，控制温度在-2～10℃，将3～6份黑磷烯、0.1～0.5份表面活性剂、4～12份经减压蒸馏的苯胺、0.2～2份0.5～2mol/L盐酸、50～70份水加入到反应器中，高速搅拌分散均匀，然后加入含有6～20份氧化剂，-2～10℃继续反应6～12h，然后过滤，干燥，即得黑磷烯-聚苯胺复合物；其中所述的表面活性剂为十二烷基硫酸钠、十二烷基苯磺酸钠、双十二烷基苯基醚二磺酸钠、硬脂酸钠、月桂酸钠中的至少一种；所述氧化剂为过硫酸钾、过硫酸铵、重铬酸钾、碘酸钾、三氯化铁、双氧水中的至少一种。
所述的基于黑磷烯的半导体复合材料的制备方法为：首先将成膜基底溶于有机溶剂中，然后再依次加入黑磷烯-聚苯胺复合物、交联剂，充分混合均匀，最后加热至120～180℃除去溶剂加压即得所述半导体复合材料。
相对于现有技术，本发明具有以下优点或有益结果：(1)首次公开黑磷烯-聚苯胺为半导体介质，由于黑磷烯特殊的二维纳米结构，使得在不添加导电粉体情况下，所述半导体复合材料在20℃的体积电阻率在6～11Ω·cm，应用前景广泛；(2)所述的黑磷烯二维纳米结构与苯胺形成共轭结构，聚合后的聚苯胺与黑磷复合均匀，所述的材料性能更加稳定。
具体实施方式
实施例1
一种基于黑磷烯的半导体复合材料，其原料组分如下：聚甲基丙烯酸甲酯50份，黑磷烯-聚苯胺复合物18份，过氧化二异丙苯2份，二甲苯200份。
所述的基于黑磷烯的半导体复合材料的制备方法为：首先将成膜基底溶于有机溶剂中，然后再依次加入黑磷烯-聚苯胺复合物、交联剂，充分混合均匀，最后加热至140℃除去溶剂加压即得所述半导体复合材料。
所述的黑磷烯-聚苯胺复合物得制备方法为：通氮气条件下，控制温度在6℃，将3份黑磷烯、0.4份双十二烷基苯基醚二磺酸钠、9份经减压蒸馏的苯胺、1.2份1mol/L盐酸、65份水加入到反应器中，高速搅拌分散均匀，然后加入含有12份过硫酸铵，6℃继续反应8h，然后过滤，干燥，即得黑磷烯-聚苯胺复合物。
对比例1：将本实施例中的黑磷烯换为石墨烯，按照相同的工艺制得石墨烯半导体复合材料即为对比例1。
实施例2
一种基于黑磷烯的半导体复合材料，其原料组分如下：乙烯-醋酸乙烯共聚物60份，黑磷烯-聚苯胺复合物15份，高岭土15份，1,4-双叔丁基过氧异丙基苯3份，甲苯250份。
所述的基于黑磷烯的半导体复合材料的制备方法为：首先将成膜基底溶于有机溶剂中，然后再依次加入黑磷烯-聚苯胺复合物、交联剂，充分混合均匀，最后加热至180℃除去溶剂加压即得所述半导体复合材料。
所述的黑磷烯-聚苯胺复合物得制备方法为：通氮气条件下，控制温度在10℃，将5份黑磷烯、0.5份硬脂酸钠、4份经减压蒸馏的苯胺、1份2mol/L盐酸、62份水加入到反应器中，高速搅拌分散均匀，然后加入含有14份重铬酸钾，10℃继续反应9h，然后过滤，干燥，即得黑磷烯-聚苯胺复合物。
对比例2：将本实施例中的黑磷烯换为石墨烯，按照相同的工艺制得石墨烯半导体复合材料即为对比例2。
实施例3
一种基于黑磷烯的半导体复合材料，其原料组分如下：聚偏氟乙烯58份，黑磷烯-聚苯胺复合物18份，膨润土3份，过氧化苯甲酰1.5份，石油醚240份。
所述的基于黑磷烯的半导体复合材料的制备方法为：首先将成膜基底溶于有机溶剂中，然后再依次加入黑磷烯-聚苯胺复合物、交联剂，充分混合均匀，最后加热至120℃除去溶剂加压即得所述半导体复合材料。
所述的黑磷烯-聚苯胺复合物得制备方法为：通氮气条件下，控制温度在3℃，将5份黑磷烯、0.1份月桂酸钠、11份经减压蒸馏的苯胺、0.8份1.3mol/L盐酸、55份水加入到反应器中，高速搅拌分散均匀，然后加入含有20份碘酸钾，3℃继续反应12h，然后过滤，干燥，即得黑磷烯-聚苯胺复合物。
对比例3：将本实施例中的黑磷烯换为石墨烯，按照相同的工艺制得石墨烯半导体复合材料即为对比例3。
实施例和对比例中半导体复合材料相同条件下的测试数据如下表所示，由数据对比可以看出，实施例与对比例在20℃体积电阻率相近，但强度和韧性更高。
Claims (10)
1.一种基于黑磷烯的半导体复合材料，其特征在于，其原料组分如下：黑磷烯-聚苯胺复合物10～20份，成膜基底50～60份，填料0～15份，交联剂1～5份，有机溶剂200～250份。
2.根据如权利要求1所述的一种基于黑磷烯的半导体复合材料，其特征在于，所述的成膜基底为乙烯-醋酸乙烯共聚物、聚偏氟乙烯、聚甲基丙烯酸甲酯、聚氯乙烯中的至少一种。
3.根据权利要求1所述的一种基于黑磷烯的半导体复合材料，其特征在于：所述的填料为高岭土、膨润土、滑石粉、云母粉中的至少一种。
4.根据权利要求1所述的一种基于黑磷烯的半导体复合材料，其特征在于：所述的交联剂为过氧化二异丙苯、过氧化苯甲酰、1,4-双叔丁基过氧异丙基苯、叔丁基过氧化碳酸脂、叔丁基异丙苯基过氧化物、过氧化异氯丙苯中的至少一种。
5.根据权利要求1所述的一种基于黑磷烯的半导体复合材料，其特征在于：所述的有机溶剂为石油醚、甲苯、二甲苯、三甲苯、D40溶剂中的至少一种。
6.根据权利要求1所述的一种基于黑磷烯的半导体复合材料，其特征在于：在通氮气条件下，控制温度在-2～10℃，将3～6份黑磷烯、0.1～0.5份表面活性剂、4～12份经减压蒸馏的苯胺、0.2～2份0.5～2mol/L盐酸、50～70份水加入到反应器中，高速搅拌分散均匀，然后加入6～20份氧化剂，-2～10℃继续反应6～12h，然后过滤，干燥，即得所述的黑磷烯-聚苯胺复合物。
7.根据权利要求6所述的一种基于黑磷烯的半导体复合材料，其特征在于：所述的表面活性剂为十二烷基硫酸钠、十二烷基苯磺酸钠、双十二烷基苯基醚二磺酸钠、硬脂酸钠、月桂酸钠中的至少一种；所述氧化剂为过硫酸钾、过硫酸铵、重铬酸钾、碘酸钾、三氯化铁、双氧水中的至少一种。
8.一种如权利要求1所述的基于黑磷烯的半导体复合材料制备方法，其特征在于，制备的步骤如下：首先将成膜基底溶于有机溶剂中，然后再依次加入黑磷烯-聚苯胺复合物、交联剂，充分混合均匀，最后加热至120～180℃除去溶剂加压即得所述半导体复合材料。
9.一种如权利要求1或8所述的基于黑磷烯的半导体复合材料应用方法，其特征在于，所述的半导体复合材料作为导电性能优良的材料，广泛应用于照相器材、光学仪器、IC产品、半导体产品、光电产品领域。
10.一种黑磷烯-聚苯胺复合物的制备方法，其特征在于，在通氮气条件下，控制温度在-2～10℃，将黑磷烯、表面活性剂、苯胺、盐酸、水加入到反应器中，高速搅拌分散均匀，然后加入氧化剂继续反应6～12h，再经过滤、干燥所得所述的黑磷烯-聚苯胺复合物；
其中，所述的表面活性剂为十二烷基硫酸钠、十二烷基苯磺酸钠、双十二烷基苯基醚二磺酸钠、硬脂酸钠、月桂酸钠中的至少一种；所述氧化剂为过硫酸钾、过硫酸铵、重铬酸钾、碘酸钾、三氯化铁、双氧水中的至少一种。
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