CN107768431A - 分立双方筒形栅内嵌u形沟道晶体管及其制造方法 - Google Patents
分立双方筒形栅内嵌u形沟道晶体管及其制造方法 Download PDFInfo
- Publication number
- CN107768431A CN107768431A CN201711050837.7A CN201711050837A CN107768431A CN 107768431 A CN107768431 A CN 107768431A CN 201711050837 A CN201711050837 A CN 201711050837A CN 107768431 A CN107768431 A CN 107768431A
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- monocrystalline silicon
- shaped
- square tube
- gate electrode
- tube shape
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 119
- 230000005669 field effect Effects 0.000 claims abstract description 12
- 239000012212 insulator Substances 0.000 claims description 45
- 230000004888 barrier function Effects 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 13
- 229920005591 polysilicon Polymers 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 10
- 238000001259 photo etching Methods 0.000 claims description 9
- 238000002955 isolation Methods 0.000 claims description 8
- 230000009471 action Effects 0.000 claims description 6
- 238000009825 accumulation Methods 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 5
- 239000002210 silicon-based material Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000002019 doping agent Substances 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 26
- 230000010354 integration Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000010181 polygamy Effects 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7831—Field effect transistors with field effect produced by an insulated gate with multiple gate structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
- H01L29/1037—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure and non-planar channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66484—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with multiple gate, at least one gate being an insulated gate
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711050837.7A CN107768431B (zh) | 2017-10-31 | 2017-10-31 | 分立双方筒形栅内嵌u形沟道晶体管及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711050837.7A CN107768431B (zh) | 2017-10-31 | 2017-10-31 | 分立双方筒形栅内嵌u形沟道晶体管及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107768431A true CN107768431A (zh) | 2018-03-06 |
CN107768431B CN107768431B (zh) | 2020-08-07 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711050837.7A Expired - Fee Related CN107768431B (zh) | 2017-10-31 | 2017-10-31 | 分立双方筒形栅内嵌u形沟道晶体管及其制造方法 |
Country Status (1)
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CN (1) | CN107768431B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113838909A (zh) * | 2021-08-19 | 2021-12-24 | 深圳深爱半导体股份有限公司 | 沟槽型原胞结构及制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103500762A (zh) * | 2013-10-12 | 2014-01-08 | 沈阳工业大学 | 具有u形管状沟道的无pn结晶体管及其制造方法 |
FR2995140A1 (fr) * | 2012-09-04 | 2014-03-07 | St Microelectronics Sa | Transistor mos a grille flottante |
CN104282753A (zh) * | 2013-11-20 | 2015-01-14 | 沈阳工业大学 | 高集成度日形源漏栅辅控u形沟道高迁移率无结晶体管 |
US20160079230A1 (en) * | 2014-09-15 | 2016-03-17 | Fairchild Semiconductor Corporation | Fast and stable ultra low drop-out (ldo) voltage clamp device |
-
2017
- 2017-10-31 CN CN201711050837.7A patent/CN107768431B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2995140A1 (fr) * | 2012-09-04 | 2014-03-07 | St Microelectronics Sa | Transistor mos a grille flottante |
CN103500762A (zh) * | 2013-10-12 | 2014-01-08 | 沈阳工业大学 | 具有u形管状沟道的无pn结晶体管及其制造方法 |
CN104282753A (zh) * | 2013-11-20 | 2015-01-14 | 沈阳工业大学 | 高集成度日形源漏栅辅控u形沟道高迁移率无结晶体管 |
US20160079230A1 (en) * | 2014-09-15 | 2016-03-17 | Fairchild Semiconductor Corporation | Fast and stable ultra low drop-out (ldo) voltage clamp device |
Non-Patent Citations (2)
Title |
---|
刘溪等: ""具有辅助栅的新型低泄漏U沟道无结场效应晶体管"", 《科技创新导报》 * |
靳晓诗等: ""硅纳米线不同的掺杂浓度对无结场效应晶体管性能的影响"", 《科技创新导报》 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113838909A (zh) * | 2021-08-19 | 2021-12-24 | 深圳深爱半导体股份有限公司 | 沟槽型原胞结构及制备方法 |
Also Published As
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CN107768431B (zh) | 2020-08-07 |
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Effective date of registration: 20201230 Address after: 233000 No.10, building 32, Zone 8, Guangcai market, bengshan District, Bengbu City, Anhui Province Patentee after: Bengbu Hongjing Technology Co.,Ltd. Address before: 110870 No. 111 Shenyang West Road, Shenyang economic and Technological Development Zone, Liaoning Patentee before: SHENYANG University OF TECHNOLOGY |
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Effective date of registration: 20210430 Address after: 102200 423, 4 / F, block a, Xinhua future city building, 175 Litang Road, Changping District, Beijing Patentee after: Li Qiannan Address before: 233000 No.10, building 32, Zone 8, Guangcai market, bengshan District, Bengbu City, Anhui Province Patentee before: Bengbu Hongjing Technology Co.,Ltd. |
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Effective date of registration: 20210715 Address after: 518129 room 605, development building, 133 Xuegang Road North, Bantian street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Baolihua Technology Co.,Ltd. Address before: 102200 423, 4 / F, block a, Xinhua future city building, 175 Litang Road, Changping District, Beijing Patentee before: Li Qiannan |
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Effective date of registration: 20220506 Address after: 252000 building B9, Jiangbei Luxi environmental protection technology city, No. 1, Shanghai Road, Jiuzhou street, high tech Zone, Liaocheng City, Shandong Province Patentee after: Shandong Guangyue Jiuzhou Semiconductor Technology Co.,Ltd. Address before: 518129 room 605, development building, 133 Xuegang Road North, Bantian street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Baolihua Technology Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20200807 Termination date: 20211031 |