CN107734870A - 一种刚挠结合板除钻污的方法 - Google Patents
一种刚挠结合板除钻污的方法 Download PDFInfo
- Publication number
- CN107734870A CN107734870A CN201710884960.2A CN201710884960A CN107734870A CN 107734870 A CN107734870 A CN 107734870A CN 201710884960 A CN201710884960 A CN 201710884960A CN 107734870 A CN107734870 A CN 107734870A
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- CN
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- Prior art keywords
- rigid
- combined board
- flex combined
- except
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710884960.2A CN107734870A (zh) | 2017-09-26 | 2017-09-26 | 一种刚挠结合板除钻污的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710884960.2A CN107734870A (zh) | 2017-09-26 | 2017-09-26 | 一种刚挠结合板除钻污的方法 |
Publications (1)
Publication Number | Publication Date |
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CN107734870A true CN107734870A (zh) | 2018-02-23 |
Family
ID=61207427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710884960.2A Pending CN107734870A (zh) | 2017-09-26 | 2017-09-26 | 一种刚挠结合板除钻污的方法 |
Country Status (1)
Country | Link |
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CN (1) | CN107734870A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112672522A (zh) * | 2021-01-27 | 2021-04-16 | 东莞市若美电子科技有限公司 | 一种刚挠结合板过孔金属化的制作方法 |
CN112867276A (zh) * | 2020-12-31 | 2021-05-28 | 南通赛可特电子有限公司 | 一种印刷电路板水平除胶工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5710239A (en) * | 1980-06-20 | 1982-01-19 | Hitachi Ltd | Washing method and apparatus thereof |
CN102438405A (zh) * | 2011-11-29 | 2012-05-02 | 电子科技大学 | 一种刚挠结合印制电路板通孔钻污的清洗方法 |
WO2015003369A1 (zh) * | 2013-07-11 | 2015-01-15 | 深圳崇达多层线路板有限公司 | 一种印制电路板制备方法及印制电路板 |
CN105813390A (zh) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | 一种高tg印刷电路板除胶工艺 |
-
2017
- 2017-09-26 CN CN201710884960.2A patent/CN107734870A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5710239A (en) * | 1980-06-20 | 1982-01-19 | Hitachi Ltd | Washing method and apparatus thereof |
CN102438405A (zh) * | 2011-11-29 | 2012-05-02 | 电子科技大学 | 一种刚挠结合印制电路板通孔钻污的清洗方法 |
WO2015003369A1 (zh) * | 2013-07-11 | 2015-01-15 | 深圳崇达多层线路板有限公司 | 一种印制电路板制备方法及印制电路板 |
CN105813390A (zh) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | 一种高tg印刷电路板除胶工艺 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112867276A (zh) * | 2020-12-31 | 2021-05-28 | 南通赛可特电子有限公司 | 一种印刷电路板水平除胶工艺 |
CN112672522A (zh) * | 2021-01-27 | 2021-04-16 | 东莞市若美电子科技有限公司 | 一种刚挠结合板过孔金属化的制作方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Sun Qishuang Inventor after: Sun Wenbing Inventor before: Sun Qishuang |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20181107 Address after: 332000 Jiangxi Jiujiang economic and Technological Development Zone Chengxi port area Hong Kong Avenue Applicant after: JIUJIANG MINGYANG CIRCUIT TECHNOLOGY CO., LTD. Address before: 518125 B, 32 South Ring Road, Second Star Industrial Zone, Baoan District Xinqiao street, Shenzhen, Guangdong. Applicant before: Shenzhen Mingyang circuit Polytron Technologies Inc |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180223 |