CN107734851A - A kind of method for adding copper foil automatically under crystal oscillator - Google Patents
A kind of method for adding copper foil automatically under crystal oscillator Download PDFInfo
- Publication number
- CN107734851A CN107734851A CN201710861690.3A CN201710861690A CN107734851A CN 107734851 A CN107734851 A CN 107734851A CN 201710861690 A CN201710861690 A CN 201710861690A CN 107734851 A CN107734851 A CN 107734851A
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- China
- Prior art keywords
- crystal oscillator
- angle
- cabling
- copper foil
- information
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10075—Non-printed oscillator
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The present invention provides a kind of method for adding copper foil automatically under crystal oscillator, obtains the number of plies and each layer of section information of the lamination of default pcb board；The positional information of crystal oscillator element is obtained in default pcb board；On the lamination that crystal oscillator element is covered, the copper foil of GND attributes is added.By automatically under crystal oscillator add GND attributes copper foil program, can automatically under crystal oscillator add GND attributes copper foil；Solve the in the past artificial copper foil searched crystal oscillator, and add GND attributes in all signal lead aspects manually, to reduce EMI, improve design efficiency, reduce the manually operated workload of engineer.
Description
Technical field
The present invention relates to server board field, more particularly to a kind of method for adding copper foil automatically under crystal oscillator.
Background technology
Server board is stuck in PCB design, and crystal oscillator needs to provide reference frequency to each several part of the boards such as network interface card, mainboard,
It is the important component in clock circuit.Clock source caused by crystal oscillator is typically EMI radiation source in system.
To reduce EMI, except aspect is with the cabling bags of GND attributes where crystal oscillator part, it is also necessary in other aspects
Cabling parcel GND attributes copper foil.Artificial lookup crystal oscillator is usually required in PCB design, and manually in all signal leads
Aspect adds the copper foil of GND attributes, causes that engineer's workload is larger, and design efficiency is relatively low.
The content of the invention
In order to overcome above-mentioned deficiency of the prior art, the present invention provides a kind of side for adding copper foil automatically under crystal oscillator
Method, method include：
Obtain the number of plies and each layer of section information of the lamination of default pcb board；
The positional information of crystal oscillator element is obtained in default pcb board；
On the lamination that crystal oscillator element is covered, the copper foil of GND attributes is added.
Preferably, method includes：
Obtain the length information and width information of crystal oscillator body；
The length that the copper foil of GND attributes is added on the lamination that crystal oscillator element is covered is crystal oscillator body length
15mil to 25mil；
The width that the copper foil of GND attributes is added on the lamination that crystal oscillator element is covered is crystal oscillator body width
15mil to 25mil.
Preferably, method includes：
The section information of default pcb board lamination includes：Top layer face, power supply aspect, insulate aspect, stratal surface, conductive layer, bottom
Aspect.
Preferably, method includes：
Detection coordinates are established in default pcb board；
Position number is set to each crystal oscillator in detection coordinates system, coding is set to each layer；
The co-ordinate position information of each crystal oscillator element is obtained based on detection coordinates.
Preferably, method includes：
The co-ordinate position information of each crystal oscillator body pin is obtained in default pcb board and is connected with crystal oscillator body pin
Cabling co-ordinate position information；
When the cabling being connected with crystal oscillator body pin is a plurality of cabling, the angle angle between cabling and cabling is obtained；
Judge that angle angle between cabling and cabling is whether≤90 °；
When 90 ° of angle angle=between cabling and cabling, the position of the angle is obtained, and by≤90 ° of angle
The angle quantity and location inventory of≤90 ° of generation.
Preferably, method includes：
Angle angle adjustment control instruction is obtained, angle angle adjustment control instruction includes：Need the crystal oscillator body adjusted
The co-ordinate position information of pin, angle co-ordinate position information between the cabling and cabling that are connected with the crystal oscillator body pin and
The angle information of adjustment；
According to the angle angle adjustment control instruction of acquisition, the cabling and cabling being connected with the crystal oscillator body pin are adjusted
Between angle angle.
Preferably, method includes：
The co-ordinate position information for the via being connected with crystal oscillator body pin is obtained in default pcb board；
When the cabling being connected with via is a plurality of cabling, the angle angle between cabling and cabling is obtained；
By the co-ordinate position information of each via, the cabling co-ordinate position information being connected with via, between cabling and cabling
Angle angle information generation via information inventory；
Judge that angle angle between cabling and cabling is whether≤90 °；
When 90 ° of angle angle=between cabling and cabling, the position of the angle is obtained, and by≤90 ° of angle
The angle quantity and location inventory of≤90 ° of generation.
As can be seen from the above technical solutions, the present invention has advantages below：
Obtain the number of plies and each layer of section information of the lamination of default pcb board；Crystal oscillator member is obtained in default pcb board
The positional information of part；On the lamination that crystal oscillator element is covered, the copper foil of GND attributes is added.By being added automatically under crystal oscillator
The program of the copper foil of GND attributes, the copper foil of GND attributes can be added under crystal oscillator automatically；Solve artificial lookup crystal oscillator in the past, and
Manually in the copper foil of all signal lead aspects addition GND attributes, to reduce EMI, design efficiency is improved, it is manual to reduce engineer
The workload of operation.
Brief description of the drawings
In order to illustrate more clearly of technical scheme, the required accompanying drawing used in description will be made below simple
Ground introduction, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ordinary skill
For personnel, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the method flow diagram for adding copper foil automatically under crystal oscillator；
Fig. 2 is the schematic diagram of crystal oscillator element in pcb board；
Fig. 3 is the schematic diagram of the pcb board of addition GND attribute copper foil layers.
Embodiment
To enable goal of the invention, feature, the advantage of the present invention more obvious and understandable, will use below specific
Embodiment and accompanying drawing, the technical scheme protected to the present invention are clearly and completely described, it is clear that implementation disclosed below
Example is only part of the embodiment of the present invention, and not all embodiment.Based on the embodiment in this patent, the common skill in this area
All other embodiment that art personnel are obtained under the premise of creative work is not made, belong to the model of this patent protection
Enclose.
The present embodiment provides a kind of method for adding copper foil automatically under crystal oscillator, as shown in figure 1, method includes：
S11, obtain the number of plies and each layer of section information of the lamination of default pcb board；
Pcb board typically has many levels, the superposed substrate for being combined into pcb board of each aspect.Default pcb board lamination
Section information include：Top layer face, power supply aspect, insulate aspect, stratal surface, conductive layer, round floor etc..
Here the number of plies of the lamination of pcb board is first obtained, then obtains each layer of section information, that is, obtains that layer to be
Power supply aspect, that layer are insulation aspects, stratal surface, conductive layer etc..
S12, the positional information of crystal oscillator element is obtained in default pcb board；
The positional information of crystal oscillator element is obtained in default pcb board, if multiple crystal oscillator elements then obtain multiple crystal oscillators
The positional information of element, and arranged, form inventory.
S13, on the lamination that crystal oscillator element is covered, add the copper foil of GND attributes.
Because crystal oscillator element is arranged on default pcb board, a certain size pcb board is covered.
Server board is stuck in PCB design, and crystal oscillator needs to provide reference frequency to each several part of the boards such as network interface card, mainboard,
It is the important component in clock circuit.Clock source caused by crystal oscillator is typically EMI radiation source in system.For reduce EMI, except
Aspect where crystal oscillator part is with the cabling bags of GND attributes, it is also necessary to wraps up the copper foil of GND attributes in the cabling of other aspects.
The positional information of crystal oscillator element is so obtained, the area information that crystal oscillator element is covered is got, is covered in crystal oscillator element
Area under automatic addition GND attributes copper foil.
If there are multiple crystal oscillator elements in default pcb board, crystal oscillator element can be covered successively according to the inventory of arrangement
Lamination on, add GND attributes copper foil.Artificial inspection crystal oscillator element one by one is avoided, so can be automatically in crystal oscillator element institute
On the lamination of covering, the copper foil of GND attributes is added, improves design efficiency.Specific addition manner can be edited by research staff to be added
Add pre-set programs to complete.
In the present embodiment, in order to reduce EMI radiation as far as possible, the length information and width information of crystal oscillator body are obtained；
The length that the copper foil of GND attributes is added on the lamination that crystal oscillator element is covered is crystal oscillator body length
15mil to 25mil；
The width that the copper foil of GND attributes is added on the lamination that crystal oscillator element is covered is crystal oscillator body width
15mil to 25mil.
, can be with if crystal oscillator body shape is irregular it is understood that crystal oscillator body is a rectangle, or square
Do approximate rectangular configuration.The length and width of crystal oscillator body in pcb board can be first preset with research staff.So in order to the greatest extent
Amount reduces EMI radiation, avoids influencing each other between every aspect.GND attributes are added on the lamination that crystal oscillator element is covered
Copper foil length be crystal oscillator body length 15mil to 25mil；Preferably added on the lamination that crystal oscillator element is covered
The length of the copper foil of GND attributes is the 20mil of crystal oscillator body length.GND category is added on the lamination that crystal oscillator element is covered
Property copper foil width be crystal oscillator body width 15mil to 25mil.Preferably added on the lamination that crystal oscillator element is covered
The width for adding the copper foil of GND attributes is the 20mil of crystal oscillator body width.
In the present embodiment, detection coordinates are established in default pcb board；Position is set to each crystal oscillator in detection coordinates system
Number, to each layer, coding is set；The co-ordinate position information of each crystal oscillator element is obtained based on detection coordinates.
Default pcb board is a detection coordinates system, each point in detection zone, every line, each element
There is specific coordinate.Every cabling is encoded in detection zone；Certainly also to each hole, each crystal oscillator element, often
The pin of individual crystal oscillator element is numbered.So allow users to be quickly found out corresponding crystal oscillator element, hole, cabling can be with
To element, hole, the position of cabling is judged.
In the present embodiment, the program of the copper foil by adding GND attributes under crystal oscillator automatically, added automatically under crystal oscillator
The copper foil of GND attributes；Solves the in the past artificial copper searched crystal oscillator, and add GND attributes in all signal lead aspects manually
Paper tinsel, to reduce EMI, design efficiency is improved, reduce the manually operated workload of engineer.
All crystal oscillators in system automatic identification pcb board, that is, it is that Y* (refers to crystal oscillator, * to encapsulate Reference Designator
Refer to numeral), obtain 1) in crystal oscillator length and width data, such as Fig. 2, this data be present in crystal oscillator 1 PCB encapsulation in；Read pcb board
Laminated information, obtain all cabling aspects in lamination, by taking 8 laminates as an example, add GND attributes copper foil layer 2 as shown in Figure 3
And addition GND attributes copper foil layer 3.
In the present embodiment, the co-ordinate position information and and crystal oscillator of each crystal oscillator body pin are obtained in default pcb board
The cabling co-ordinate position information of body pin connection；
When the cabling being connected with crystal oscillator body pin is a plurality of cabling, the angle angle between cabling and cabling is obtained；
Judge that angle angle between cabling and cabling is whether≤90 °；
When 90 ° of angle angle=between cabling and cabling, the position of the angle is obtained, and by≤90 ° of angle
The angle quantity and location inventory of≤90 ° of generation.
Angle angle adjustment control instruction is obtained, angle angle adjustment control instruction includes：Need the crystal oscillator body adjusted
The co-ordinate position information of pin, angle co-ordinate position information between the cabling and cabling that are connected with the crystal oscillator body pin and
The angle information of adjustment；
According to the angle angle adjustment control instruction of acquisition, the cabling and cabling being connected with the crystal oscillator body pin are adjusted
Between angle angle.
In the present embodiment, the co-ordinate position information for the via being connected with crystal oscillator body pin is obtained in default pcb board；
When the cabling being connected with via is a plurality of cabling, the angle angle between cabling and cabling is obtained；
By the co-ordinate position information of each via, the cabling co-ordinate position information being connected with via, between cabling and cabling
Angle angle information generation via information inventory；
Judge that angle angle between cabling and cabling is whether≤90 °；
When 90 ° of angle angle=between cabling and cabling, the position of the angle is obtained, and by≤90 ° of angle
The angle quantity and location inventory of≤90 ° of generation.
Server board is stuck in PCB design phase, when same layer cabling is acute angle, is unfavorable for signal transmission, to signal matter
Amount has damage.To ensure signal quality, the angle of cabling is preferably obtuse angle；High speed signal requires special, it is sometimes desirable to which circular arc is walked
Line.
In the present embodiment, crystal oscillator element downward cabling and via and the program for hollowing out internal layer are checked by writing, then should
Skill programs are put into Skill menus, perform the Skill programs just can a key check crystal oscillator element downward cabling and via,
Automatically avoid the cabling of different electric attributes and via and hollow out internal layer under inductance.
Can solve to whether there is cabling or via under conventional hand inspection crystal oscillator element, manual modification is simultaneously hollowed out under inductance
Layer, to meet design requirement.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (7)
- A kind of 1. method for adding copper foil automatically under crystal oscillator, it is characterised in that method includes：Obtain the number of plies and each layer of section information of the lamination of default pcb board；The positional information of crystal oscillator element is obtained in default pcb board；On the lamination that crystal oscillator element is covered, the copper foil of GND attributes is added.
- 2. the method according to claim 1 for adding copper foil automatically under crystal oscillator, it is characterised in that method includes：Obtain the length information and width information of crystal oscillator body；Added on the lamination that crystal oscillator element is covered the length of the copper foil of GND attributes for crystal oscillator body length 15mil extremely 25mil；Added on the lamination that crystal oscillator element is covered the width of the copper foil of GND attributes for crystal oscillator body width 15mil extremely 25mil。
- 3. the method according to claim 1 for adding copper foil automatically under crystal oscillator, it is characterised in that method includes：The section information of default pcb board lamination includes：Top layer face, power supply aspect, insulate aspect, stratal surface, conductive layer, bottom Face.
- 4. the method according to claim 1 or 2 for adding copper foil automatically under crystal oscillator, it is characterised in that method includes：Detection coordinates are established in default pcb board；Position number is set to each crystal oscillator in detection coordinates system, coding is set to each layer；The co-ordinate position information of each crystal oscillator element is obtained based on detection coordinates.
- 5. the method according to claim 1 for adding copper foil automatically under crystal oscillator, it is characterised in that method includes：The co-ordinate position information of each crystal oscillator body pin is obtained in default pcb board and is walked with what crystal oscillator body pin was connected Line coordinates positional information；When the cabling being connected with crystal oscillator body pin is a plurality of cabling, the angle angle between cabling and cabling is obtained；Judge that angle angle between cabling and cabling is whether≤90 °；When 90 ° of angle angle=between cabling and cabling, the position of the angle is obtained, and≤90 ° of angle is generated ≤ 90 ° of angle quantity and location inventory.
- 6. the method according to claim 5 for adding copper foil automatically under crystal oscillator, it is characterised in that method includes：Angle angle adjustment control instruction is obtained, angle angle adjustment control instruction includes：Need the crystal oscillator body pin adjusted Co-ordinate position information, angle co-ordinate position information and adjustment between the cabling and cabling that are connected with the crystal oscillator body pin Angle information；According to the angle angle adjustment control instruction of acquisition, between the cabling and cabling of adjustment and crystal oscillator body pin connection Angle angle.
- 7. the method according to claim 1 for adding copper foil automatically under crystal oscillator, it is characterised in that method includes：The co-ordinate position information for the via being connected with crystal oscillator body pin is obtained in default pcb board；When the cabling being connected with via is a plurality of cabling, the angle angle between cabling and cabling is obtained；By the co-ordinate position information of each via, the cabling co-ordinate position information being connected with via, the folder between cabling and cabling Angle angle information generation via information inventory；Judge that angle angle between cabling and cabling is whether≤90 °；When 90 ° of angle angle=between cabling and cabling, the position of the angle is obtained, and≤90 ° of angle is generated ≤ 90 ° of angle quantity and location inventory.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710861690.3A CN107734851A (en) | 2017-09-21 | 2017-09-21 | A kind of method for adding copper foil automatically under crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710861690.3A CN107734851A (en) | 2017-09-21 | 2017-09-21 | A kind of method for adding copper foil automatically under crystal oscillator |
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| CN107734851A true CN107734851A (en) | 2018-02-23 |
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| CN201710861690.3A Pending CN107734851A (en) | 2017-09-21 | 2017-09-21 | A kind of method for adding copper foil automatically under crystal oscillator |
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| CN200969707Y (en) * | 2006-03-07 | 2007-10-31 | 英华达(上海)电子有限公司 | Structure for improving signal line impedance matching and electromagnetic interference in handset circuit |
| CN101198217A (en) * | 2006-12-08 | 2008-06-11 | 英业达股份有限公司 | Parts wiring system and method |
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Application publication date: 20180223 |