CN106407610A - Method for automatically adding copper shield in PCB - Google Patents
Method for automatically adding copper shield in PCB Download PDFInfo
- Publication number
- CN106407610A CN106407610A CN201610956219.8A CN201610956219A CN106407610A CN 106407610 A CN106407610 A CN 106407610A CN 201610956219 A CN201610956219 A CN 201610956219A CN 106407610 A CN106407610 A CN 106407610A
- Authority
- CN
- China
- Prior art keywords
- pcb
- shielding copper
- copper
- shielding
- copper shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Architecture (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a method for automatically adding copper shield in a PCB, and belongs to the technical field of electronic design automation. The method for automatically adding the copper shield in the PCB comprises the following steps: firstly determining the position where the copper shield needs to be spread on the PCB, setting a sheet frame of the shape of the copper shield on the position where the copper shield needs to be spread to determine the shape of the copper shield, calling a Skill program based on the position of the set sheet frame, spreading the necessary copper shield, setting through hole distances on the copper shield, and drilling through holes. The method for automatically adding the copper shield in the PCB disclosed by the invention is simple and convenient to operate, the time of operators can be saved, the working efficiency is improved, and the signal transmission quality of the PCB can be optimized, and thus the method has very good promotion and application values.
Description
Technical field
The present invention relates to EDA Technique field, specifically provide the side automatically adding shielding copper in a kind of PCB
Method.
Background technology
With the continuous improvement of people's living standard, social economy's level develops rapidly, brings social advanced skill therewith
The progress of art, electronic information technology fast development is come.Developing rapidly with electronic information technology, various high performance electronics
Product is quickly dissolved in the routine work and learning life of people.Meanwhile, the fast development of science and technology, promotes electronics to produce again
The update of product.With the development of integrated circuit densification, lifting is with electronic design automation（Electronic
Design Automation）Design software carries out the demand of PCB layout.PCB（Printed Circuit Board）Chinese name
Referred to as printed circuit board, also known as printed substrate, is the carrier of electronic devices and components electrical connection, lays a lot of power supplys on PCB
, in transmitting different signal process, there is very big interference, the Transfer Quality of signal had adverse effect on, shadow in line
Ring the quality of PCB.
Content of the invention
The technical assignment of the present invention is for above-mentioned problem, provides a kind of simple to operation, can save operation
Personnel time, improves work efficiency, and can optimize the method automatically adding shielding copper in the PCB of PCB signal transmission quality.
For achieving the above object, the invention provides following technical scheme：
Automatically a kind of method adding shielding copper in PCB, the method that this automatic interpolation shields copper determines first to be needed on PCB to lay
The position of shielding copper, the sheet frame laying the position setting shielding copper profile of shielding copper in need to determine the shape of shielding copper, to set
On the basis of the sheet frame position put, by calling Skill program, the shielding copper required for laying, shielding copper sets between through hole
Away from and get through hole, specifically include following steps：
S1：Open Skill program；
S2：Determine the position needing to lay shielding copper on PCB；
S3：PCB needs lay the sheet frame of the position setting shielding copper profile of shielding copper；
S4：On the basis of the position of the sheet frame of the shielding copper profile of setting, call Skill program that shielding copper is laid on PCB；
S5：Shielding copper sets through-hole spacing and gets through hole, complete to shield the laying of copper.
Determine the position that shielded signal is needed on PCB, and then determine the position that laying shielding copper is needed on PCB.Needing
The position of laying shielding copper sets the shape to determine shielding copper for the sheet frame shielding copper profile.The position of the sheet frame to set
On the basis of, call Skill program that PCB is laid with shielding copper.Shielding copper sets through-hole spacing and gets through hole, complete to shield
The laying of copper, Skill program command terminates, and exports Done order.
Preferably, Skill programming described in step S4 is in Cadence software, this Skill program is put into
In Skill menu, execute this Skill program one key and add shielding copper.
Automatically the method adding shielding copper in this PCB passes through to write the partial profiles of setting Cadence software, write
Automatically add the Skill program of shielding copper, this Skill program is written in Skill menu, when screen laid on PCB by needs
When covering copper, execute this Skill program and just can add required shielding copper by a key.
Preferably, setting the through-hole spacing on shielding copper according to the size of PCB in step S5.The effect of described through hole is
Connect ground for shielding copper.
In actual use, the size of PCB is diversified, when shielding copper is laid for various sizes of PCB,
To set the through-hole spacing on shielding copper according to the size of PCB, to reach the effect that can be good at shielded signal interference, and
The safety of pcb board can be kept.
Compared with prior art, the method automatically adding shielding copper in the PCB of the present invention has beneficial effect following outstanding
Really：Automatically the method adding shielding copper in PCB of the present invention, it is first determined need on PCB to lay the position of shielding copper, at this
The sheet frame of setting shielding copper profile at position, then on the basis of the sheet frame position of setting, by calling the Skill journey writing
Sequence, a key adds shielding copper, according to the actual size of PCB, sets the through-hole spacing on shielding copper, and gets logical on shielding copper
Hole, completes to shield the laying of copper on PCB, simple to operation, improves the work efficiency of laying shielding copper on PCB, optimizes PCB letter
Number Transfer Quality.
Brief description
Fig. 1 is the schematic flow sheet of the method automatically adding shielding copper in PCB of the present invention.
Specific embodiment
Below in conjunction with drawings and Examples, the method automatically adding shielding copper is made detailed further in the PCB of the present invention
Describe in detail bright.
Embodiment
As shown in figure 1, the method automatically adding shielding copper in the PCB of the present invention, it is first determined laying shielding is needed on PCB
The position of copper, the sheet frame laying the position setting shielding copper profile of shielding copper in need to determine the shape of shielding copper, with setting
On the basis of sheet frame position, by calling Skill program, the shielding copper required for laying, shielding copper sets through-hole spacing simultaneously
Get through hole.Specifically include following steps：
S1：Open Skill program.
By writing the partial profiles of setting Cadence software, the Skill program of shielding copper is added in write automatically,
This Skill program is written in Skill menu, when needing laying shielding copper on PCB, opens this Skill program and hold
Row just can add required shielding copper by a key.
S2：Determine the position needing to lay shielding copper on PCB.
Determine the position that shielded signal is needed on PCB first, and then determine the position that laying shielding copper is needed on PCB.
S3：PCB needs lay the sheet frame of the position setting shielding copper profile of shielding copper.
S4：On the basis of the position of the sheet frame of the shielding copper profile of setting, call Skill program that shielding is laid on PCB
Copper.
S5：Shielding copper sets through-hole spacing and gets through hole, complete to shield the laying of copper.
The effect of through hole is to connect ground for shielding copper.
The size of PCB is varied, and when laying shielding copper for various sizes of PCB, the size according to PCB to set screen
Cover the through-hole spacing on copper, Skill program gets through hole according to the through-hole spacing setting, and reaches and can be good at shielded signal
The effect of interference, can keep the safety of pcb board again.
During laying shielding copper, the Skill program operation code being punched according to the through-hole spacing setting is as follows：
prog((x x1 x2 y y1 y2 xx yy)
outport = outfile("boundary.log")
x1=caar(axlExtentLayout())
x2=caadr(axlExtentLayout())
y1=cadar(axlExtentLayout())
y2=cadadr(axlExtentLayout())
xx=x2-x1
yy=y2-y1
x=xx/39.37
y=yy/39.37.
Being embodied as meaning is：Operation program requires through-hole spacing to insert Skill program, according to institute's fill request
Skill Automatic Program calculates through-hole spacing and carries out punch operation.
In PCB of the present invention, the process of the method for interpolation shielding copper is automatically：Open Skill program, according to need on PCB
The position wanting shielded signal determines the position needing laying shielding copper, lays the position setting shielding copper profile of shielding copper in need
Sheet frame shields the shape of copper to determine, on the basis of the sheet frame position of setting, by calling Skill program, required for laying
Shielding copper, and get through hole according to the through-hole spacing setting on shielding copper it is ensured that the shielding copper of laying connects ground.
Embodiment described above, the simply present invention more preferably specific embodiment, those skilled in the art is at this
The usual variations and alternatives carrying out in the range of inventive technique scheme all should comprise within the scope of the present invention.
Claims (3)
1. in a kind of PCB, automatically add the method for shielding copper it is characterised in that：The method that this automatic interpolation shields copper determines first
Need on PCB to lay the position of shielding copper, the sheet frame laying the position setting shielding copper profile of shielding copper in need to determine shielding
The shape of copper, on the basis of the sheet frame position of setting, by calling Skill program, the shielding copper required for laying, in shielding copper
Upper setting through-hole spacing simultaneously gets through hole, specifically includes following steps：
S1：Open Skill program；
S2：Determine the position needing to lay shielding copper on PCB；
S3：PCB needs lay the sheet frame of the position setting shielding copper profile of shielding copper；
S4：On the basis of the position of the sheet frame of the shielding copper profile of setting, call Skill program that shielding copper is laid on PCB；
S5：Shielding copper sets through-hole spacing and gets through hole, complete to shield the laying of copper.
2. in PCB according to claim 1, automatically add the method for shielding copper it is characterised in that：Skill described in step S4
Programming in Cadence software, put in Skill menu by this Skill program, executes this Skill program one key and adds
Shielding copper.
3. in PCB according to claim 1 and 2, automatically add the method for shielding copper it is characterised in that：Foundation in step S5
The size of PCB sets the through-hole spacing on shielding copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610956219.8A CN106407610A (en) | 2016-10-27 | 2016-10-27 | Method for automatically adding copper shield in PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610956219.8A CN106407610A (en) | 2016-10-27 | 2016-10-27 | Method for automatically adding copper shield in PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106407610A true CN106407610A (en) | 2017-02-15 |
Family
ID=58015156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610956219.8A Pending CN106407610A (en) | 2016-10-27 | 2016-10-27 | Method for automatically adding copper shield in PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106407610A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734851A (en) * | 2017-09-21 | 2018-02-23 | 郑州云海信息技术有限公司 | A kind of method for adding copper foil automatically under crystal oscillator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105653807A (en) * | 2016-01-06 | 2016-06-08 | 浪潮集团有限公司 | Automatic alignment method based on Cadence Via |
| CN105677970A (en) * | 2016-01-07 | 2016-06-15 | 浪潮集团有限公司 | Copper-deficiency automatic supplementing method with no need of repeatedly avoiding copper |
-
2016
- 2016-10-27 CN CN201610956219.8A patent/CN106407610A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105653807A (en) * | 2016-01-06 | 2016-06-08 | 浪潮集团有限公司 | Automatic alignment method based on Cadence Via |
| CN105677970A (en) * | 2016-01-07 | 2016-06-15 | 浪潮集团有限公司 | Copper-deficiency automatic supplementing method with no need of repeatedly avoiding copper |
Non-Patent Citations (2)
| Title |
|---|
| 石军: "用Protel99绘制印制板图-特殊布线技巧篇", 《电子世界》 * |
| 苏宏锋 等: "FPGA核心控制板的PCB散热设计", 《电子世界》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734851A (en) * | 2017-09-21 | 2018-02-23 | 郑州云海信息技术有限公司 | A kind of method for adding copper foil automatically under crystal oscillator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170215 |
|
| RJ01 | Rejection of invention patent application after publication |