CN107665873B - 集成电路芯片及包括其的显示设备 - Google Patents

集成电路芯片及包括其的显示设备 Download PDF

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Publication number
CN107665873B
CN107665873B CN201710627881.3A CN201710627881A CN107665873B CN 107665873 B CN107665873 B CN 107665873B CN 201710627881 A CN201710627881 A CN 201710627881A CN 107665873 B CN107665873 B CN 107665873B
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electrode
bump
bump structure
circuit chip
integrated circuit
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CN107665873A (zh
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梁正道
黃晸護
宋常铉
赵正然
河承和
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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Abstract

示例性实施方式提供了一种集成电路芯片和显示设备，该集成电路芯片包括：基板、设置在基板上的端子电极、以及设置在端子电极上的电极焊盘，其中，电极焊盘包括：凸块结构，其从基板突出以包括短边和长边；以及凸块电极，其设置在所述凸块结构上并且在所述凸块结构的短边缘部分附近与端子电极连接，其中，凸块电极被设置成不覆盖凸块结构的长边缘部分的至少一部分。

Description

集成电路芯片及包括其的显示设备
相关申请的交叉引用
本申请要求于2016年7月29日提交韩国知识产权局的第10-2016-0097038号韩国专利申请的优先权和权益，该专利申请的全部内容以引用方式并入本文。
技术领域
本公开涉及集成电路芯片和包括该集成电路芯片的显示设备。
背景技术
诸如有机发光设备和液晶显示器的显示设备包括其中设置有用于显示图像的像素的显示面板。用于输入或输出信号的焊盘部分设置在显示面板中以控制显示面板的操作，并且集成电路芯片或其中安装有集成电路芯片的柔性印刷电路接合在焊盘部分中。
各向异性导电层(ACF)用于电连接和物理连接连接构件和焊盘部分。各向异性导电层(作为其中导电颗粒布置在由树脂材料等制成的绝缘层中的膜)在其厚度方向上具有导电性，并且在表面方向上具有绝缘性。
各向异性导电层包括导电颗粒，并且在使焊盘部分的焊盘和连接构件的凸块接触以使它们电连接时，导电颗粒位于焊盘部分的焊盘和连接构件的凸块之间。此外，随着显示设备分辨率的提高，导电颗粒的尺寸减小，并且需要增加导电颗粒的数量以抑制焊盘和凸块之间的电阻增加。然而，增加导电颗粒的数量可能导致由导电颗粒积聚引起的短路故障。此外，电阻偏差可能根据位于焊盘和凸块之间的导电颗粒的数量而增加。
本背景技术部分中公开的上述信息仅用于增强对背景的理解，并且因此其可以含有不形成在本国中本领域普通技术人员已知的现有技术的信息。
发明内容
示例性实施方式已被做出以提供能够提高可靠性的集成电路芯片和包括该集成电路芯片的显示设备。
示例性实施方式提供了一种驱动电路芯片，该驱动电路芯片包括：基板、设置在基板上的端子电极、以及设置在端子电极上的电极焊盘，其中，电极焊盘包括：凸块结构，其从基板突出以包括短边和长边；以及凸块电极，其设置在凸块结构上并且在所述凸块结构的短边缘部分附近与端子电极连接，其中，凸块电极被设置成不覆盖凸块结构的长边缘部分的至少一部分。
凸块电极可以设置成不覆盖与凸块结构的短边缘部分相邻的长边缘部分。
凸块结构可以具有基本上矩形的平面形状和基本上半圆形的短边方向横截面。
集成电路芯片还可以包括设置在端子电极和电极焊盘之间的绝缘层，并且凸块结构可以不接触端子电极。
凸块电极可以具有沿凸块结构的长边方向在凸块结构的相对侧处与绝缘层接触的部分。
集成电路芯片还可以包括设置在端子电极和电极焊盘之间的绝缘层，并且凸块结构可以接触端子电极。
凸块电极可以具有沿凸块结构的长边方向在凸块结构的相对侧处与端子电极接触的部分。
凸块结构可以与绝缘层一体地设置。
凸块结构可以与端子电极重叠，并且端子电极的平坦表面区域可以比凸块结构的平坦表面区域宽。
凸块电极可以设置成不完全覆盖凸块结构的长边缘部分。
示例性实施方式提供了一种显示设备，该显示设备包括：显示面板，其包括焊盘部分；以及集成电路芯片，其接合到该焊盘部分。
根据示例性实施方式，可以通过减小施加到驱动电路芯片的凸块电极的边缘部分的应力来防止裂纹产生，并且可以防止可能在长边缘部分中产生的裂纹在短边方向上扩展。因此，可以提高驱动电路芯片的连接可靠性。
附图说明
图1是示意性地示出根据示例性实施方式的显示设备的俯视平面图。
图2是示意性地示出图1所示的显示设备中的驱动电路芯片的俯视平面图。
图3是示出根据示例性实施方式的驱动电路芯片的一个电极焊盘的立体图。
图4是图3中所示的电极焊盘的俯视平面图。
图5示出了根据示例性实施方式的沿图4的线A-B、线B-C和线C-D截取的剖视图。
图6示出了根据示例性实施方式的沿图4的线E-F截取的剖视图。
图7示出了根据示例性实施方式的沿图4的线A-B、线B-C和线C-D截取的剖视图。
图8示出了根据示例性实施方式的沿图4的线A-B、线B-C和线C-D截取的剖视图。
图9是示出根据示例性实施方式的用于形成电极焊盘的掩模的俯视平面图。
图10是示出根据示例性实施方式的驱动电路芯片的一个电极焊盘的立体图。
图11是示出根据示例性实施方式的驱动电路芯片的一个电极焊盘的立体图。
图12示出了根据示例的电极焊盘的应力模拟结果。
图13示出了根据比较示例的电极焊盘的应力模拟结果。
图14是与图1的显示设备中的一个电极焊盘和一个焊盘区对应的剖视图。
具体实施方式
将在下文中参考附图更全面地描述本发明构思，附图中示出了本发明构思的示例性实施方式。如本领域技术人员将认识到的，在全部不脱离本发明构思的精神或范围的情况下，所描述的实施方式可以以各种不同的方式进行修改。
为了清楚地描述实施方式，省略了与描述无关的部分，并且在整个说明书中，相同的附图标记表示相同或相似的组成元件。
在附图中，为了易于描述，每个元件的尺寸和厚度被随意地示出，并且本公开不一定限于在附图中示出的元件的尺寸和厚度。在附图中，为了清楚起见，层、膜、面板、区等的厚度被夸大。在附图中，为了更好地理解和易于描述，一些层和区域的厚度被夸大。
应当理解，当元件(诸如层、膜、区或基板)被称为在另一元件“上”时，该元件可以直接在另一元件上，或者也可以存在中间元件。相反，当元件被称为“直接”在另一元件“上”时，不存在中间元件。此外，在说明书中，词语“在……上”或“在……上方”表示位于物体部分上或上方，并且不一定表示基于重力方向位于物体部分的上侧上。
此外，除非明确描述为相反的意思，否则词语“包括”及诸如“包括(comprises)”或“包括有(comprising)”的变型将被理解为隐含包括所陈述的元件但不排除任何其他元件。
此外，在整个说明书中，短语“在平面图中”是指从顶部观看目标部分，并且短语“在剖视图中”是指观看通过从侧部垂直切割目标部分而形成的横截面。
现将参考附图详细描述根据示例性实施方式的显示设备。
图1是示意性地示出根据示例性实施方式的显示设备的俯视平面图。
参照图1，根据示例性实施方式的显示设备包括显示面板10和与显示面板10连接的柔性印刷电路50。显示面板10可以是有机发光设备面板或液晶面板，但不限于此。
显示面板10包括用于显示图像的显示区域DA和在显示区域DA外侧的非显示区域NA，在非显示区域NA中设置有用于生成和/或传送施加到显示区域DA和/或布线的各种信号的元件和布线。在图1中，虽然显示面板10的仅一个侧边缘区(例如，下部区)被示出为非显示区域NA，但是显示面板10的其他侧边缘区(例如，左边缘和右边缘和/或上边缘)也可以是非显示区域NA。显示区域DA被示出为四边形的，但其可以是圆形的、椭圆形的或多边形的。
像素PX例如以矩阵形式设置在显示面板10的显示区域DA中。此外，诸如栅极线(未示出)、数据线(未示出)等的信号线设置在显示区域DA中。栅极线基本上在第一方向D1(例如，行方向)上延伸，并且数据线基本上在与第一方向D1交叉的第二方向D2(例如，列方向)上延伸。每个像素PX可以连接到栅极线和数据线以从这些线接收栅极信号和数据信号。在有机发光设备的情况下，驱动电压线(未示出)可以设置在显示区域DA中，其中，驱动电压线例如基本上在第二方向D2上延伸以将驱动电压传送至像素PX。
用于接收外部信号的焊盘部分PP1设置在显示面板10的非显示区域NA中。柔性印刷电路50的一端连接至焊盘部分PP1。柔性印刷电路50的另一端可以连接至例如外部印刷电路板(PCB)，以传送传输至其的诸如图像数据信号或控制信号的信号。
用于生成和/或处理用于驱动显示面板10的各种信号的驱动器可以设置在显示面板10的非显示区域NA、柔性印刷电路50或外部印刷电路板(PCB)中。驱动器可以包括用于向数据线施加数据信号的数据驱动器、用于向栅极线施加栅极信号的栅极驱动器、以及用于控制数据驱动器和栅极驱动器的信号控制器。
在所示出的示例性实施方式中，作为集成电路芯片(例如，驱动电路芯片)400的形式的数据驱动器安装在焊盘部分PP2上，该焊盘部分PP2设置在显示区域DA和焊盘部分PP1之间。包含粘合剂的非导电膜(NCF)(未示出)可以设置在焊盘部分PP2和集成电路芯片400之间，以将集成电路芯片400接合至焊盘部分PP2。在这种情况下，集成电路芯片400的电极焊盘(未示出)接触焊盘部分PP2的焊盘(未示出)并与其电连接。与所示出的不同，数据驱动器可以以集成电路芯片的形式安装在柔性印刷电路50上来以带载封装(TCP)形式连接到焊盘部分PP1。栅极驱动器可以集成在显示面板10的左边缘和/或右边缘的非显示区域(未示出)中，或者可以被提供为集成电路芯片。信号控制器可以形成为集成电路芯片400(例如，数据驱动器)，或者可以被提供为单独的集成电路芯片。
已经描述了显示设备的整体配置。在下文中，将参照图2至图6详细描述接合至焊盘部分PP2的驱动电路芯片400。图1也可以被参照来描述与显示面板10的关系，并且所有先前参照的附图可以被再次参照，而不进行任何特定的描述。
图2是示意性地示出图1所示的显示设备中的驱动电路芯片的俯视平面图，图3是示出根据示例性实施方式的驱动电路芯片的一个电极焊盘的立体图，图4是图3中所示的电极焊盘的俯视平面图，图5示出了根据示例性实施方式的沿图4的线A-B、线B-C和线C-D截取的剖视图，以及图6示出了根据示例性实施方式的沿图4的线E-F截取的剖视图。
参照图2，驱动电路芯片400包括基板410和设置在基板410上的电极焊盘EP。电极焊盘EP独立地形成。每个电极焊盘EP具有基本上为矩形的平面形状。每个电极焊盘EP具有长边和短边，并且附接到显示面板10的电极焊盘EP的长边方向可以与第二方向D2基本上平行。与所示出的示例性实施方式不同，每个电极焊盘EP可以具有另一平面形状，例如，平行四边形，并且长边方向可以相对于第二方向D2倾斜一定程度。在每个电极焊盘EP中，长边可以与短边基本上相同，并且平面形状可以以各种方式修改。
将参照图3至图6描述每个电极焊盘EP的详细结构。每个电极焊盘EP包括凸块结构440和凸块电极450，其中，凸块结构440从基板410突出，凸块电极450形成为包围凸块结构440，同时在上方接触凸块结构440，但暴露凸块结构440的拐角。端子电极420和保护层430设置在基板410和电极焊盘EP之间。
基板410可以是由晶片形成的硅基板。端子电极420可以是集成电路的输出电极或输入电极。端子电极420可以由诸如铝(Al)、钛(Ti)、金(Au)、钨(W)、铜(Cu)、银(Ag)的金属或它们的合金形成。端子电极420可以形成为单层或多层。例如，端子电极420可以形成为包含铝的单层，并且可以形成为包括包含钛的下部层和包含金的上部层的双层。端子电极420可以具有基本上为包括短边和长边的矩形的平面形状。如图5所示，端子电极420的平坦表面区域比凸块结构440的平坦表面区域宽。
设置在端子电极420上的保护层430可以包含无机绝缘材料，例如，氮化硅(SiNx)或氧化硅(SiOx)。保护层430可以形成为完全覆盖基板410和端子电极420，除了与凸块电极450接触的接触孔435。
电极焊盘EP的凸块结构440设置在保护层430上。凸块结构440以预定高度从基板410突出。每个凸块结构440可以具有如图4中由虚线所示的基本上为包括短边和长边的矩形的平面形状。凸块结构440可以具有为如图5所示的基本上半圆形的短边(x)方向横截面，并且可以具有为如图6所示的基本上梯形的长边(y)方向横截面。因此，每个凸块结构440可以具有与隧道相似的形状，但不限于此。凸块结构440可以具有各种3D形状。凸块结构440针对每个电极焊盘EP独立地形成。
凸块结构440可以具有弯曲表面，除了接触保护层430的下表面。在本说明书中，凸块结构440的弯曲表面的一部分被称为边缘部分。因此，凸块结构440包括与短边(x)方向平行的两个边缘部分(下文称为短边缘部分)和与长边(y)方向平行的两个边缘部分(下文称为长边缘部分)。
凸块结构440可以由具有适当弹性模量、弹性形变和回弹性的有机材料或无机材料形成，并且可以包含诸如树脂的聚合物。凸块结构440可以包含导电聚合物。
凸块电极450可以设置在凸块结构440上。当集成电路芯片400接合至显示面板10的焊盘部分PP2时，凸块电极450接触焊盘部分PP2的焊盘，以将集成电路芯片400电连接到显示面板10。凸块电极450通过形成在保护层430中的接触孔435与端子电极420连接，接触孔435设置在凸块结构440的长边(y)方向上的相对侧处(因此，与凸块结构440的短边缘部分相邻)。接触孔435的数量和位置可以被多样地改变。
凸块电极450可以是包括种层(seed layer)452和金属层451的多层。种层452用作用于通过例如镀覆(例如，电镀或无电镀)来生长凸块电极450的基础层。种层452可以包含诸如钛、钨、铬和金的金属，并且金属层451可以包含诸如金、铜、银、铂、钯、镍和铝的金属。与所示出的示例性实施方式不同，凸块电极450可以是单层，并且可以通过利用溅射在凸块结构440上沉积金属来形成。
凸块电极450通过包围凸块结构440而完全覆盖凸块结构440。凸块电极450可以形成为通常比凸块结构440更宽，并且凸块电极450的不与凸块结构440重叠的边缘部分可以接触保护层430，除了接触端子电极420的部分。例如，如图5的左侧中所示，凸块电极450的沿长边(y)方向的边缘部分可以接触保护层430。因此，当凸块电极450被形成为在覆盖凸块结构440的同时与保护层430接触时，可以防止凸块电极450被拉出或脱落。例如，当制造集成电路芯片400时，为了减小基板410的厚度，可以执行研磨基板410的背表面的背面研磨工艺，其中，研磨基板410的背表面是在通过将电极焊盘EP附接至粘合带而将集成电路芯片400固定的状态下进行的。当在研磨基板410的背表面之后剥离粘合带时，凸块电极450可能通过粘合带的粘性分离。根据本示例性实施方式，由于凸块电极450的边缘部分形成为在短边(x)方向以及长边(y)方向上接触保护层430，所以可以增大凸块电极450的固定力(附接强度)以防止凸块电极450与保护层430分离。
凸块电极450完全覆盖凸块结构440，但不覆盖凸块结构440的外周表面的一部分，具体地，不覆盖凸块结构440的与凸块结构440的短边缘部分相邻的长边缘部分。因此，凸块电极450具有用于暴露凸块结构440的长边缘部分的开口455。开口455的距保护层430的表面的高度h2可以基本上为凸块结构440的高度h1的2/3或更少、1/2或更少、或1/3或更少，但是实施方式不限于此。高度h2可以被多样地设计。
在将集成电路芯片400接合到显示面板10的焊盘部分PP2的操作中，集成电路芯片400被压缩。在这种情况下，凸块结构440在横向方向(例如，在与推挤方向交叉的方向)上被推挤并因弹性而扩展，并且包围凸块结构440的凸块电极450也在横向方向上扩展。由于凸块结构440的3D形状，由凸块电极450的设置为包围凸块结构440的长边缘部分的第一部分(下文称为凸块电极450的长边缘部分)的扩展引起的应力比由凸块电极450的设置为包围凸块结构440的短边缘部分的第二部分(下文称为凸块电极450的短边缘部分)的扩展引起的应力更强。因此，凸块电极450的长边缘部分比凸块电极450的短边缘部分更易产生裂纹或破裂。
在凸块电极450的长边缘部分的一部分处产生的裂纹可能扩展至短边缘部分，而不是局限于该部分。当裂纹扩展至短边缘部分时，凸块电极450和端子电极420之间的连接可能被切断，或者连接的电阻可能增加。根据本示例性实施方式，凸块电极450的开口455形成在凸块电极450的与凸块电极450的短边缘部分相邻的长边缘部分处，并因此可以阻止裂纹从长边缘部分扩展至短边缘部分。此外，可以通过在与短边缘部分相邻的部分处形成开口455，而不是在长边缘部分处完全形成开口455，来通过与保护层430接触的长边缘部分保持固定力。同时，当凸块结构440被逐渐形成时，例如凸块结构440的长边缘部分被形成为较低的高度时，可以减少凸块电极450的长边缘部分处的裂纹产生。
在下文中，将参照图7和图8，基于一些其他示例性实施方式与前述示例性实施方式的差异来描述根据该一些其他示例性实施方式的电极焊盘EP。
图7和图8示出了根据示例性实施方式的沿图4的线A-B、线B-C和线C-D截取的剖视图。
参照图7，在本示例性实施方式中，保护层430不设置在端子电极420和凸块结构440之间，这不同于图3至图6的前述示例性实施方式，在前述示例性实施方式中，保护层430覆盖端子电极420，除了接触孔435。因此，凸块结构440的下表面接触端子电极420。保护层430不设置在凸块电极450的长边缘部分与端子电极420重叠的区中。因此，凸块电极450的长边缘部分接触端子电极420。
根据本示例性实施方式，由于凸块电极450与端子电极420接触的面积增大，所以可以改善接触电阻。如在前述示例性实施方式中，开口455形成在与短边缘部分相邻的部分处，以阻止在凸块电极450的长边缘部分处产生的裂纹扩展至短边缘部分。此外，可以通过凸块电极450的与端子电极420接触的长边缘部分来保持分离强度。
参照图8，在本示例性实施方式中，保护层430和凸块结构440一体地形成并且是整体的，这不同于图3至图6的前述示例性实施方式，在前述示例性实施方式中保护层430和凸块结构440单独形成。具体地，保护层430和凸块结构440可以可用在不分层的情况下由相同的材料形成。例如，保护层430和凸块结构440可以通过以下方式来形成：通过在基板410和端子电极420上厚层涂覆有机材料(例如，光致抗蚀剂)以及使用双色调掩模(例如，狭缝掩模或半色调掩模)，通过光刻法来使与保护层430对应的区相对较薄。所采用的有机材料的示例可以包括聚合物材料，例如，基于聚酰亚胺的材料、基于聚苯并噁唑的材料，基于丙烯酸的材料、基于苯酚的材料、基于硅的材料、基于硅改性的聚酰亚胺的材料、基于环氧树脂的材料等。保护层430和凸块结构440可以通过施加热或照射UV来固化。在这种情况下，凸块结构440的表面可以被弯曲地形成。
根据本示例性实施方式，保护层430和凸块结构440可以通过使用一个掩模来一起形成，从而减少工艺并实现成本效率。如在前述示例性实施方式中，开口455可以在与凸块电极450的短边缘部分相邻的部分处开口，并且可以通过凸块电极450的与保护层430接触的长边缘部分来保持分离强度。
图9是示出根据示例性实施方式的用于形成电极焊盘的掩模的俯视平面图。
图9中所示的掩模M可以用于通过如在前述示例性实施方式中那样进行镀覆来形成具有开口455的凸块电极450。例如，当通过使用正性光致抗蚀剂形成凸块电极450时，掩模M包括与图4所示的凸块电极450的平面形状对应的透射区TR。透射区TR以与待形成的电极焊盘EP的距离对应的距离设置。非透射区NR被定位成围绕透射区TR。因此，可以通过以下方式来形成在与短边缘部分相邻的长边缘部分处具有开口455的凸块电极450：去除与凸块电极450的形状相对应的光致抗蚀剂，以及使凸块电极450(具体地为设置在种层452上的金属层451)生长。当采用负光致抗蚀剂时，掩模M的透射区TR和非透射区NR的位置彼此相反。
图10和图11是示出根据示例性实施方式的驱动电路芯片的一个电极焊盘的立体图。
参照图10，开口455完全形成在凸块电极450的长边缘部分处。在图3的示例性实施方式中，开口455形成在凸块电极450的长边缘部分的相对端处。然而，在本示例性实施方式中，开口455被连接以构成一个开口455。在这种情况下，凸块电极450的长边缘部分不与保护层430或端子电极420接触，并因此分离强度可能变差，但可以防止长边缘部分产生裂纹或破裂。
参照图11，开口455分离地形成在凸块电极450的长边缘部分处。与图3的示例性实施方式相比，至少一个开口455形成在形成于凸块电极450的长边缘部分的相对端处的开口455之间。在这种情况下，可以保持固定力，同时减小凸块电极450的长边缘部分的可能产生裂纹的区。
图10和图11的示例性实施方式与前述示例性实施方式的相同之处在于凸块电极450不覆盖与凸块结构440的短边缘部分相邻的长边缘部分。因此，可以防止裂纹扩展至短边缘部分。
图12示出了根据示例的电极焊盘的应力模拟结果，并且图13示出了根据比较示例的电极焊盘的应力模拟结果。
图12示出了如在示例性实施方式中的其中凸块电极450被形成为不覆盖与凸块结构440的短边缘部分相邻的长边缘部分的情况，并且图13示出了其中凸块电极450被形成为完全覆盖凸块结构440的长边缘部分(即，凸块电极450不具有开口)的情况。在分析模型形状的情况下，凸块结构440的半径为3μm，并且凸块电极450的厚度为700nm。当对凸块电极450施加预定压力时，在图13的比较示例中，分别在作为凸块电极450的短边中心的点1和作为长边端部的点2处测量的应力为1360MPa和3630MPa。然而，在图12的示例中，分别在点1和点2处测量的应力分别减小至1020MPa和653MPa。因此，根据示例性实施方式，凸块电极450的短边处的应力被减小，并由此可以降低裂纹产生的可能性。
已经描述了集成电路芯片400。在下文中，将描述其中集成电路芯片400接合至显示面板10的焊盘部分PP2的状态。
图14是与图1的显示设备中的一个电极焊盘和一个焊盘区对应的剖视图。
将通过使用电极焊盘EP作为示例来描述接合至与显示面板10接合的焊盘部分PP2的电极焊盘EP。
焊盘部分PP2包括焊盘P。焊盘P可以以预定间隔布置在例如第一方向D1上，并且可以布置在单行或多行中。
焊盘P设置在由玻璃或塑胶形成的基板110上，并且每个焊盘P包括第一焊盘电极210和第二焊盘电极220。第一焊盘电极210的第一端可以与显示面板10的信号线(例如，数据线)连接。保护层140设置在基板110和焊盘P之间。保护层140可以是用于防止湿气渗透的阻挡层、缓冲层、用于使半导体与栅电极绝缘的栅绝缘层、或其中堆积有这些层的多层。层间绝缘层160设置在第一焊盘电极210和第二焊盘电极220之间。第二焊盘电极220通过形成在层间绝缘层160中的接触孔与第一焊盘电极210连接。
电极焊盘EP设置成与焊盘P重叠，并且从基板410朝向焊盘P向下突出。凸块电极450与对应于每个焊盘P的上部层的第二焊盘电极220接触，以将集成电路芯片400的端子电极420电连接至显示面板10的焊盘P。因此，从集成电路芯片400的端子电极420输出的信号可以通过凸块电极450和焊盘P传送至显示面板10的信号线，反之亦然。
集成电路芯片400和焊盘部分PP2之间的大部分空间填充有不导电的粘合层20，并因此集成电路芯片400通过粘合层20接合至焊盘部分PP2。集成电路芯片400可以接合至凸块结构440，并且可以在凸块电极450被稍微压缩的状态下接合至焊盘部分PP2。在这种情况下，例如，在接合后经过一段时间之后，即使当集成电路芯片400和焊盘部分PP2之间的间隙增大时，也可以通过凸块结构440的弹性恢复力来保持凸块电极450和焊盘P之间的接触。在将集成电路芯片400接合到焊盘部分PP2的操作中，集成电路芯片400被压缩。在这种情况下，凸块电极450的长边缘部分可能产生裂纹。示例性实施方式提供了能够防止裂纹扩展至短边缘部分的电极焊盘EP的结构。
虽然已经结合当前被认为是实用的示例性实施方式描述了本发明构思，但是应当理解，本发明构思不限于所公开的实施方式，而是相反，旨在涵盖包括在所附权利要求书的精神和范围内的各种修改和等效布置。

Claims (9)

1.一种集成电路芯片，包括：
基板；
端子电极，设置在所述基板上；以及
电极焊盘，
其中，所述电极焊盘包括：
凸块结构，设置在所述端子电极上并与所述端子电极重叠，并且从所述基板突出以包括短边和长边；以及
凸块电极，设置在所述凸块结构上，并且沿所述凸块结构的长边方向在所述凸块结构的短边缘部分的相对侧处与所述端子电极连接，
其中，所述凸块电极设置成不覆盖所述凸块结构的长边缘部分的一部分，以及
其中，所述集成电路芯片还包括设置在所述端子电极和所述电极焊盘之间的绝缘层，所述凸块电极具有沿所述凸块结构的所述长边方向和短边方向在所述凸块结构的相对侧处与所述绝缘层接触的部分。
2.根据权利要求1所述的集成电路芯片，其中，所述凸块电极被设置成不覆盖与所述凸块结构的所述短边缘部分相邻的所述长边缘部分。
3.根据权利要求2所述的集成电路芯片，其中，所述凸块结构具有矩形的平面形状和半圆形的短边方向横截面。
4.根据权利要求2所述的集成电路芯片，其中，所述凸块结构不接触所述端子电极。
5.根据权利要求2所述的集成电路芯片，其中，所述凸块结构接触所述端子电极。
6.根据权利要求5所述的集成电路芯片，其中，所述凸块电极具有沿所述凸块结构的长边方向在所述凸块结构的相对侧处与所述端子电极接触的部分。
7.根据权利要求5所述的集成电路芯片，其中，所述凸块结构与所述绝缘层一体形成。
8.根据权利要求1所述的集成电路芯片，其中，所述端子电极的平坦表面区域比所述凸块结构的平坦表面区域宽。
9.一种显示设备，包括：
显示面板，包括焊盘部分；以及
集成电路芯片，接合至所述焊盘部分，
其中，所述集成电路芯片包括：
基板；
端子电极，设置在所述基板上；以及
电极焊盘，
其中，所述电极焊盘包括：
凸块结构，设置在所述端子电极上并与所述端子电极重叠，并且从所述基板突出以包括短边和长边；以及
凸块电极，设置在所述凸块结构上并且沿所述凸块结构的长边方向在所述凸块结构的短边缘部分的相对侧处与所述端子电极连接，
其中，所述凸块电极设置成不覆盖所述凸块结构的长边缘部分的一部分，以及
其中，所述集成电路芯片还包括设置在所述端子电极和所述电极焊盘之间的绝缘层，所述凸块电极具有沿所述凸块结构的所述长边方向和短边方向在所述凸块结构的相对侧处与所述绝缘层接触的部分。
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