CN107663441A - 一种ic卡封装热熔胶 - Google Patents

一种ic卡封装热熔胶 Download PDF

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CN107663441A
CN107663441A CN201711142709.5A CN201711142709A CN107663441A CN 107663441 A CN107663441 A CN 107663441A CN 201711142709 A CN201711142709 A CN 201711142709A CN 107663441 A CN107663441 A CN 107663441A
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parts
pur
organophosphor
tackifier
card
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刘瑛
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Dongguan Chengxin Xing Smart Card Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Sealing Material Composition (AREA)
  • Epoxy Resins (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

本发明公开了一种IC卡封装热熔胶。该IC卡封装热熔胶的构成原料及重量配比为:聚酰胺树脂80‑85份;石蜡2‑4份;氢化松香甘油脂2‑4份;有机硅树脂2‑5份;硝酸盐0.2‑0.4份;环氧树脂3‑4份;增粘剂1‑2份;防老剂1‑2份;煅烧高岭土4‑6份;有机磷0.2‑0.4份;止流剂0.4‑0.8份。固化速度快,有较好的粘接强度和柔韧性。热熔胶能够在几十分之一秒至几秒钟内固化粘接,具有加热则熔、冷却则粘的特性,本发明还通过增加环氧树脂、增粘剂以增强粘接强度,且通过增加煅烧高岭土、有机磷、止流剂、防老剂以起到填充、阻燃、防止流挂、延缓材料老化的功效,这使包装商使用热熔胶能够采用更高速度的生产线,并在减少次品的同时增加产量,便于连续化、自动化高速作业,且成本较低。

Description

一种IC卡封装热熔胶
技术领域:
本发明属于高分子材料领域,特指一种IC卡封装热熔胶。
背景技术:
热熔胶是一种在熔融条件下进行涂布,经硬化或结晶产生强度的胶黏剂。热熔胶的涂布不需要溶剂,热熔胶的市场需求量在不断增加。
现有的热溶胶存在以下不足:
1、固化速度慢,粘接强度不佳和柔韧性不佳,次品多,产量低,成本较高。
2、热熔胶的粘结力不稳定,受工作环境中早晚温度及湿度变化的影响,这就不能保证粘接牢度,且存在包装机械固有的粘接剥露问题。
针对于此,于是本发明人设计出本发明。
发明内容:
本发明的目的在于克服上述所存在的不足,提供一种固化速度快、粘结力稳定的热熔胶。
本发明实现其目的采用的技术方案是:该IC卡封装热熔胶的构成原料及重量配比为:聚酰胺树脂80-85份;石蜡2-4份;氢化松香甘油脂2-4份;有机硅树脂2-5份;硝酸盐0.2-0.4份;环氧树脂 3-4份;增粘剂1-2份;防老剂1-2份;煅烧高岭土4-6份;有机磷 0.2-0.4份;止流剂0.4-0.8份。
进一步而言,上述技术方案中,所述热熔胶的构成原料及重量配比为:聚酰胺树脂80份;石蜡2份;氢化松香甘油脂3份;有机硅树脂3份;硝酸盐0.3份;环氧树脂4份;增粘剂2份;防老剂1份;煅烧高岭土4份;有机磷0.3份;止流剂0.4份。
进一步而言,上述技术方案中,所述热熔胶的构成原料及重量配比为:聚酰胺树脂82份;石蜡2份;氢化松香甘油脂2份;有机硅树脂2份;硝酸盐0.2份;环氧树脂4份;增粘剂2份;防老剂1份;煅烧高岭土4份;有机磷0.4份;止流剂0.4份。
采用上述技术方案后,本实用新型与现有技术相比较具有如下有益效果:
1、固化速度快,有较好的粘接强度和柔韧性。热熔胶能够在几十分之一秒至几秒钟内固化粘接,具有加热则熔、冷却则粘的特性,本发明还通过增加环氧树脂、增粘剂以增强粘接强度,且通过增加煅烧高岭土、有机磷、止流剂、防老剂以起到填充、阻燃、防止流挂、延缓材料老化的功效,这使包装商使用热熔胶能够采用更高速度的生产线,并在减少次品的同时增加产量,便于连续化、自动化高速作业,且成本较低。
2、热熔胶的粘结力很稳定,不受工作环境中早晚温度及湿度变化的影响,这就保证了粘接牢度,且消除了包装机械固有的粘接剥露问题。
具体实施方式:
下面结合具体实施例对本发明进一步说明。
本发明为一种IC卡封装热熔胶,该IC卡封装热熔胶的构成原料及重量配比为:聚酰胺树脂80-85份;石蜡2-4份;氢化松香甘油脂 2-4份;有机硅树脂2-5份;硝酸盐0.2-0.4份;环氧树脂3-4份;增粘剂1-2份;防老剂1-2份;煅烧高岭土4-6份;有机磷0.2-0.4 份;止流剂0.4-0.8份。
实施例一:
所述热熔胶的构成原料及重量配比为:聚酰胺树脂80kg;石蜡 2kg;氢化松香甘油脂3kg;有机硅树脂3kg;硝酸盐0.3kg;环氧树脂4kg;增粘剂2kg;防老剂1kg;煅烧高岭土4kg;有机磷0.3kg;止流剂0.4kg。
实施例二:
所述热熔胶的构成原料及重量配比为:聚酰胺树脂82kg;石蜡 2kg;氢化松香甘油脂2kg;有机硅树脂2kg;硝酸盐0.2kg;环氧树脂4kg;增粘剂2kg;防老剂1kg;煅烧高岭土4kg;有机磷0.4kg;止流剂0.4kg。
本发明具有以下优点:
1、固化速度快,有较好的粘接强度和柔韧性。热熔胶能够在几十分之一秒至几秒钟内固化粘接,具有加热则熔、冷却则粘的特性,本发明还通过增加环氧树脂、增粘剂以增强粘接强度,且通过增加煅烧高岭土、有机磷、止流剂、防老剂以起到填充、阻燃、防止流挂、延缓材料老化的功效,这使包装商使用热熔胶能够采用更高速度的生产线,并在减少次品的同时增加产量,便于连续化、自动化高速作业,且成本较低。
2、热熔胶的粘结力很稳定,不受工作环境中早晚温度及湿度变化的影响,这就保证了粘接牢度,且消除了包装机械固有的粘接剥露问题。
当然,以上所述仅为本发明 的具体实施例而已,并非来限制本发明 实施范围,凡依本发明 申请专利范围所述构造、特征及原理所做的等效变化或修饰,均应包括于本发明申请专利范围内。

Claims (3)

1.一种IC卡封装热熔胶,其特征在于:该IC卡封装热熔胶的构成原料及重量配比为:聚酰胺树脂80-85份;石蜡2-4份;氢化松香甘油脂2-4份;有机硅树脂2-5份;硝酸盐0.2-0.4份;环氧树脂3-4份;增粘剂1-2份;防老剂1-2份;煅烧高岭土4-6份;有机磷0.2-0.4份;止流剂0.4-0.8份。
2.根据权利要求1所述的热熔胶,其特征在于:所述IC卡封装热熔胶的构成原料及重量配比为:聚酰胺树脂80份;石蜡2份;氢化松香甘油脂3份;有机硅树脂3份;硝酸盐0.3份;环氧树脂4份;增粘剂2份;防老剂1份;煅烧高岭土4份;有机磷0.3份;止流剂0.4份。
3.根据权利要求1所述的热熔胶,其特征在于:所述IC卡封装热熔胶的构成原料及重量配比为:聚酰胺树脂82份;石蜡2份;氢化松香甘油脂2份;有机硅树脂2份;硝酸盐0.2份;环氧树脂4份;增粘剂2份;防老剂1份;煅烧高岭土4份;有机磷0.4份;止流剂0.4份。
CN201711142709.5A 2017-11-17 2017-11-17 一种ic卡封装热熔胶 Pending CN107663441A (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108865031A (zh) * 2018-06-11 2018-11-23 南京夜视丽精细化工有限责任公司 制卡专用胶粘剂及其制备方法
CN108922738A (zh) * 2018-07-02 2018-11-30 张家港鑫峰机电有限公司 一种电感及其绕制工艺
CN114507481A (zh) * 2022-02-21 2022-05-17 江苏耀鸿电子有限公司 一种阻燃隔热的环氧基ic封装载板及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1592767A (zh) * 2001-11-30 2005-03-09 东亚合成株式会社 用于ic卡的热塑性树脂组合物
CN103396755A (zh) * 2013-06-28 2013-11-20 东莞市实创五金电子有限公司 热熔胶
CN104017517A (zh) * 2014-06-20 2014-09-03 合肥长城制冷科技有限公司 一种用于板式蒸发器贴管的热熔胶

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1592767A (zh) * 2001-11-30 2005-03-09 东亚合成株式会社 用于ic卡的热塑性树脂组合物
CN103396755A (zh) * 2013-06-28 2013-11-20 东莞市实创五金电子有限公司 热熔胶
CN104017517A (zh) * 2014-06-20 2014-09-03 合肥长城制冷科技有限公司 一种用于板式蒸发器贴管的热熔胶

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108865031A (zh) * 2018-06-11 2018-11-23 南京夜视丽精细化工有限责任公司 制卡专用胶粘剂及其制备方法
CN108922738A (zh) * 2018-07-02 2018-11-30 张家港鑫峰机电有限公司 一种电感及其绕制工艺
CN108922738B (zh) * 2018-07-02 2020-01-17 张家港鑫峰机电有限公司 一种电感及其绕制工艺
CN114507481A (zh) * 2022-02-21 2022-05-17 江苏耀鸿电子有限公司 一种阻燃隔热的环氧基ic封装载板及其制备方法

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