CN107631516A - A kind of semiconductor temperature module for monochromatic light module - Google Patents
A kind of semiconductor temperature module for monochromatic light module Download PDFInfo
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- CN107631516A CN107631516A CN201710868033.1A CN201710868033A CN107631516A CN 107631516 A CN107631516 A CN 107631516A CN 201710868033 A CN201710868033 A CN 201710868033A CN 107631516 A CN107631516 A CN 107631516A
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- monochromatic light
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000003287 optical effect Effects 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000004512 die casting Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000009740 moulding (composite fabrication) Methods 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000012546 transfer Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of semiconductor temperature module for monochromatic light module, including hot junction heat conductive pad, semiconductor chilling plate, buckle, substrate, cold end conduction cooling pad, case fixing screws, thermistor, connector, buckle fixing screws, case, product label, hot junction heat conductive pad is arranged at the hot junction top of semiconductor chilling plate, cold end contacts fixation with the groove of substrate, and cold end conduction cooling pad is arranged at below substrate；Substrate is provided with locating slot and positions thermistor wherein, and the thermistor connects a connector, and connector is arranged on semiconductor chilling plate and thermistor lead；The buckle is fixed and is connected to substrate by the buckle fixing screws, and further the semiconductor temperature module is fastened on optical module mouse cage.It is big in caloric value and need to control to the temperature control problem under environment temperature that the present invention solves monochromatic light module, active cooling is carried out by semiconductor refrigerating technology, so as to realize the temperature control to monochromatic light module.
Description
Technical field
The present invention relates to technical field of refrigeration equipment, more particularly to a kind of semiconductor temperature module for monochromatic light module.
Background technology
With the fast development of communications industry, the degree of integration and packing density of communication apparatus improve constantly, strong providing
While ambassador's function, sharply increasing for equipment power dissipation and caloric value is also resulted in.And in all components, optical module
Temperature specification is relatively low, and usual technical grade optical module requires that shell temperature is limited within 65 DEG C, and actual environment temperature is up to 70 DEG C,
The deflation in space, the requirement of pluggable property and low temperature specification bring challenge for the radiating of optical module, or even as whole product
The bottleneck of development.
Traditional approach uses Natural Heat Convection, i.e., arranges a Section Bar Heat Sinks, optical module on optical module mouse cage top
Opened a window at the top of mouse cage, radiator bottom boss is directly contacted with optical module, and heat is distributed by radiation and free convection.It is but this
Mode can not increasingly meet the demand for development of communications industry, and the integrated level more and more higher of optical module, caloric value is increasingly
Greatly, temperature control require it is more and more lower, the temperature of optical module can not be down under environment temperature by traditional free convection, 4G and
5G release proposes higher requirement to optical module radiating.
The release of monochromatic light module semiconductor temperature control module solves the problems, such as high-power, highly integrated optical module caloric value, uses
Semiconductor active refrigeration technology, the temperature of optical module can be reduced to below environment temperature.
The content of the invention
The present invention provides the scheme that a kind of monochromatic light module carries out temperature control using semiconductor refrigerating technology, solves traditional use
The drawbacks of passive radiating can not be by under optical module temperature control to environment temperature, the present invention is carried out using semiconductor refrigerating technology
Active cooling, so as to realize the temperature control to optical module.
To reach above-mentioned purpose, the technical solution adopted by the present invention is as follows：
The content of the invention：A kind of semiconductor temperature module for monochromatic light module, including hot junction heat conductive pad, semiconductor chilling plate, card
Button, substrate, cold end conduction cooling pad, case fixing screws, thermistor, connector, buckle fixing screws, case, product label, institute
State semiconductor chilling plate upper end be hot junction, lower end be cold end, hot junction heat conductive pad is arranged at hot junction top, and cold end is opened with surface
Some groove contacts are fixed, and the cold end conduction cooling pad is arranged at below substrate；The substrate be also provided with locating slot and by temperature-sensitive electricity
Resistance is positioned in locating slot, and the thermistor connects a connector, and connector is arranged at semiconductor chilling plate and thermistor
On lead, the case is arranged at thermistor and surface, and product label is arranged on case, the case fixing screws
Case is fixed on substrate；
The buckle is fixed and is connected to substrate by the buckle fixing screws, and further fastens the semiconductor temperature module
On optical module mouse cage.
Preferably, described semiconductor chilling plate and the groove of substrate are adhesively fixed using heat-conducting glue, heat-conducting glue is recessed
Groove hot setting.Heat-conducting glue and its hot setting make semiconductor chilling plate fix with groove bonding and reduce thermal resistance, and conduction is cold
Amount is more rapid efficient.
Preferably, described buckle is stainless steel, using 0.4mm SUS301-H punch formings, both sides have button
Point, snap surface carry out Nickel Plating Treatment, buckle fixing screws（9）Buckle fixation is connected on substrate by detaining point.Card
Button, detain point and its wear the mode of connecing, ensure the close contact of semiconductor temperature module and optical module mouse cage, avoid caused by vibration etc.
Semiconductor temperature module comes off, nickel plating energy anticorrosion.
Further, described thermistor is using in heat-conducting glue embedment locating slot.Heat-conducting glue embedment locating slot makes its bonding
Fix and reducing thermal contact resistance makes cold quantity transmission smooth.
Further, described hot junction heat conductive pad and cold end conduction cooling pad are brought into close contact are provided with depth in hot junction and base plate bottom respectively
0.3mm kerve, described hot junction heat conduction mat thickness is 1.5mm, conducts heat to radiator, and described cold end conduction cooling pad is thick
Spend for 0.5mm, be pasted into exposed 0.2mm after kerve.Hot junction heat conductive pad and the mode of cold end conduction cooling pad fitting reduce its thermal contact resistance,
Improve heat transfer efficiency；Its thickness ensure that the fairness and space obstacle of heat transfer, and cold end conduction cooling mat thickness is slightly larger than kerve
Also for the fairness of cold conduction.
Preferably, being printed with product information and Quick Response Code on described product label, it is adhesive sticker material, is pasted on cover
Shell upper surface.Printed product information and Quick Response Code are easy to recognize and operate disparate modules product, to realize automatic operating.
Preferably, described connector is 4pin, comprising plastic casing and terminal, 2pin supplies to semiconductor chilling plate
Electricity, another 2pin connections thermistor collecting temperature, and removably to inserting control panel port by way of inserting.Connector
Pin is set and the characteristic of convenient plug makes temperature control module convenient use of the invention, and it is easy to operate.
Preferably, described substrate is aluminium and its alloy material, substrate length and width are consistent with optical module mouse cage, use
ADC12 die casting or AL6063-T5 are machined into, and the deep grooves of 0.5mm, length direction are being opened with semiconductor chilling plate contact surface
More than semiconductor chilling plate 0.6mm, width is more than semiconductor chilling plate 0.6mm.Aluminum substrate conducts heat, is light, opens
Depth of groove and width optical module have correspondence with mouse cage, and edge is slightly wider than semiconductor chilling plate with easy disassembly and painting
Glue.
Compared to the prior art, the beneficial effects of the present invention are：A kind of semiconductor for monochromatic light module of the present invention
Temperature control module, it is simple in construction, heat-transfer effect is notable.Buckle, detain point and its wear the mode of connecing, ensure semiconductor temperature module and optical mode
The close contact of block mouse cage；Hot junction heat conductive pad and the mode of cold end conduction cooling pad fitting reduce its thermal contact resistance, improve heat transfer efficiency；
The pin of connector is set and the characteristic of convenient plug makes temperature control module convenient use of the invention；Depth of groove that substrate is opened and
Width optical module has correspondence with mouse cage, and edge is slightly wider than semiconductor chilling plate with easy disassembly and gluing.The present invention
It is big in caloric value and need to control to the temperature control problem under environment temperature to solve monochromatic light module, passes through semiconductor refrigerating technology
Active cooling is carried out, so as to realize the temperature control to monochromatic light module.Avoid high temperature from influenceing the service life of optical module, improve
The reliability of optical module, reduce fault rate.
Brief description of the drawings
Fig. 1 is the detailed assembling level structural representation of the embodiment of the present invention.
In figure：1- hot junctions heat conductive pad, 2- semiconductor chilling plates, 21- hot junctions, 22- cold ends, 3- buckles, 4- substrates, 41- are recessed
Groove, 42- locating slots, 5- cold end conduction cooling pads, 6- case fixing screws, 7- thermistors, 8- connectors, 9- buckle fixing screws,
10- cases, 11- product label.
Embodiment
In order to illustrate more clearly of the embodiment of the present application or technical scheme of the prior art, letter will be made to embodiment below
Single introduction.
Such as Fig. 1, a kind of semiconductor temperature module for monochromatic light module, including hot junction heat conductive pad 1, semiconductor chilling plate 2,
Buckle 3, substrate 4, cold end conduction cooling pad 5, case fixing screws 6, thermistor 7, connector 8, buckle fixing screws 9, case 10,
Product label 11, the upper end of semiconductor chilling plate 2 is hot junction 21, lower end is cold end 22, and the thickness of hot junction heat conductive pad 1 is 1.5mm,
It is brought into close contact in the top of hot junction 21, the heat in hot junction 21 is conducted to radiator；
Described substrate 4 is aluminum or aluminum alloy material, and the length and width of substrate 4 are consistent with optical module mouse cage, using ADC12 die casting or
AL6063-T5 is machined into, and the deep grooves 41 of 0.5mm, length direction are opened in the contact surface of cold end 22 with semiconductor chilling plate 2
It is 0.6mm more than semiconductor chilling plate 2, width is 0.6mm more than semiconductor chilling plate 2；Cold end 22 uses with groove 41
Heat-conducting glue is adhesively fixed, and in the hot setting of groove 41, the cold end conduction cooling pad 5 is brought into close contact to be opened heat-conducting glue in the bottom of substrate 4
There is deep 0.3mm kerve（It is invisible in figure below substrate 4）, it is 0.5mm that cold end conduction cooling, which pads 5 thickness, is pasted into exposed after kerve
0.2mm；
The substrate 4 is also provided with locating slot 42 and thermistor 7 is embedded in locating slot 42 using heat-conducting glue, the thermistor
7 connection a connector 8, connector 8 are arranged on the lead of semiconductor chilling plate 2 and thermistor 7, and the case 10 is arranged at
Thermistor 7 and the top of substrate 4, product label 11 are arranged on case 10, and case 10 is fixed on by the case fixing screws 6
On substrate 4, product information and Quick Response Code are printed with described product label 11, is adhesive sticker material, is pasted on case 10
Surface；
Described connector 8 is 4pin, and comprising plastic casing and terminal, 2pin powers to semiconductor chilling plate 2, another 2pin connections
The collecting temperature of thermistor 7, and removably to inserting control panel port by way of inserting；
Described buckle 3 is stainless steel, and using 0.4mm SUS301-H punch formings, both sides have button point, the surface of buckle 3
Nickel Plating Treatment is carried out, the buckle 3 fixation is connected on substrate 4 by buckle fixing screws 9 by detaining point, and further by described in
Semiconductor temperature module is fastened on optical module mouse cage.
Finally, it is to be noted that, term " comprising ", "comprising" or its any other variant be intended to it is non-exclusive
Property includes, so that process, method, article or equipment including a series of elements not only include those key elements, and
Also include the other element that is not expressly set out, or also include for this process, method, article or equipment inherently
Key element.
Claims (8)
1. a kind of semiconductor temperature module for monochromatic light module, it is characterised in that including hot junction heat conductive pad（1）, semiconductor system
Cold（2）, buckle（3）, substrate（4）, cold end conduction cooling pad（5）, case fixing screws（6）, thermistor（7）, connector（8）、
Buckle fixing screws（9）, case（10）, product label（11）, the semiconductor chilling plate（2）Upper end is hot junction（21）, lower end
For cold end（22）, hot junction heat conductive pad（1）It is arranged at hot junction top, cold end（22）With substrate（4）The groove that top is provided with（41）Connect
Touch and fix, the cold end conduction cooling pad（5）It is arranged at below substrate；The substrate（4）Also it is provided with locating slot（42）It is and temperature-sensitive is electric
Resistance（7）It is positioned at locating slot（42）It is interior, the thermistor（7）Connect a connector（8）, connector（8）It is arranged at semiconductor
Cooling piece（2）And thermistor（7）On lead, the case（10）It is arranged at thermistor（7）And substrate（4）Top, nameplate
Label（11）It is arranged at case（10）On, the case fixing screws（6）By case（10）It is fixed on substrate（4）On；
The buckle fixing screws（9）By the buckle（3）Fixation is connected to substrate（4）, and further by the semiconductor control
Warm module is fastened on optical module mouse cage.
A kind of 2. semiconductor temperature module for monochromatic light module according to claim 1, it is characterised in that described half
Conductor cooling piece（2）With substrate（4）Groove（41）It is adhesively fixed using heat-conducting glue, heat-conducting glue is in groove（41）Consolidated with high temperature
Change.
3. a kind of semiconductor temperature module for monochromatic light module according to claim 1, it is characterised in that described
Buckle（3）For stainless steel, using 0.4mm SUS301-H punch formings, both sides have button point, and snap surface carries out nickel plating
Processing, buckle fixing screws（9）By detaining point by the buckle（3）Fixation is connected to substrate（4）On.
A kind of 4. semiconductor temperature module for monochromatic light module according to claim 1, it is characterised in that described heat
Quick resistance（7）Locating slot is embedded to using heat-conducting glue（42）It is interior.
A kind of 5. semiconductor temperature module for monochromatic light module according to claim 1, it is characterised in that described heat
Hold heat conductive pad（1）And cold end conduction cooling pad（5）It is brought into close contact respectively in hot junction（21）And substrate（4）Bottom is provided with deep 0.3mm bottom
Groove, described hot junction heat conductive pad（1）Thickness is 1.5mm, conducts heat to radiator, described cold end conduction cooling pad（5）Thickness
For 0.5mm, exposed 0.2mm after kerve is pasted into.
A kind of 6. semiconductor temperature module for monochromatic light module according to claim 1, it is characterised in that described inscription
Board label（11）On be printed with product information and Quick Response Code, be adhesive sticker material, be pasted on case（10）Upper surface.
A kind of 7. semiconductor temperature module for monochromatic light module according to claim 1, it is characterised in that described company
Connect device（8）For 4pin, comprising plastic casing and terminal, 2pin is to semiconductor chilling plate（2）Power supply, another 2pin connections thermistor
（7）Collecting temperature, and removably to inserting control panel port by way of inserting.
A kind of 8. semiconductor temperature module for monochromatic light module according to claim 1, it is characterised in that described base
Plate（4）For aluminium and its alloy material, substrate（4）Length and width are consistent with optical module mouse cage, using ADC12 die casting or AL6063-T5 machines
Be process, with semiconductor chilling plate（2）Contact surface opens the deep grooves of 0.5mm（41）, length direction is more than semiconductor refrigerating
Piece 0.6mm, width are more than semiconductor chilling plate 0.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710868033.1A CN107631516A (en) | 2017-09-22 | 2017-09-22 | A kind of semiconductor temperature module for monochromatic light module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710868033.1A CN107631516A (en) | 2017-09-22 | 2017-09-22 | A kind of semiconductor temperature module for monochromatic light module |
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| Publication Number | Publication Date |
|---|---|
| CN107631516A true CN107631516A (en) | 2018-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710868033.1A Pending CN107631516A (en) | 2017-09-22 | 2017-09-22 | A kind of semiconductor temperature module for monochromatic light module |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203203290U (en) * | 2013-02-27 | 2013-09-18 | 宝鸡兴业空调设备（集团）有限公司 | Semiconductor refrigeration module |
| CN103591730A (en) * | 2013-12-02 | 2014-02-19 | 广东富信科技股份有限公司 | Integrated semiconductor refrigeration system |
| CN105007122A (en) * | 2015-07-17 | 2015-10-28 | 博为科技有限公司 | Optical transceiving device based on Peltier refrigerating and heating effect |
| CN205755218U (en) * | 2016-05-10 | 2016-11-30 | 中兴通讯股份有限公司 | Communication equipment and metal guide rail |
| CN106764975A (en) * | 2017-02-14 | 2017-05-31 | 苏州黑盾环境股份有限公司 | For the semiconductor air conditioner of optical module radiating |
| CN207318799U (en) * | 2017-09-22 | 2018-05-04 | 比赫电气（太仓）有限公司 | A kind of monochromatic light modular high-performance active cooling temperature control module |
-
2017
- 2017-09-22 CN CN201710868033.1A patent/CN107631516A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203203290U (en) * | 2013-02-27 | 2013-09-18 | 宝鸡兴业空调设备（集团）有限公司 | Semiconductor refrigeration module |
| CN103591730A (en) * | 2013-12-02 | 2014-02-19 | 广东富信科技股份有限公司 | Integrated semiconductor refrigeration system |
| CN105007122A (en) * | 2015-07-17 | 2015-10-28 | 博为科技有限公司 | Optical transceiving device based on Peltier refrigerating and heating effect |
| CN205755218U (en) * | 2016-05-10 | 2016-11-30 | 中兴通讯股份有限公司 | Communication equipment and metal guide rail |
| CN106764975A (en) * | 2017-02-14 | 2017-05-31 | 苏州黑盾环境股份有限公司 | For the semiconductor air conditioner of optical module radiating |
| CN207318799U (en) * | 2017-09-22 | 2018-05-04 | 比赫电气（太仓）有限公司 | A kind of monochromatic light modular high-performance active cooling temperature control module |
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Application publication date: 20180126 |