CN101123227A - Luminescent and heat radiation device and its encapsulation making method - Google Patents
Luminescent and heat radiation device and its encapsulation making method Download PDFInfo
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- CN101123227A CN101123227A CN 200610110094 CN200610110094A CN101123227A CN 101123227 A CN101123227 A CN 101123227A CN 200610110094 CN200610110094 CN 200610110094 CN 200610110094 A CN200610110094 A CN 200610110094A CN 101123227 A CN101123227 A CN 101123227A
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- heat
- circuit board
- groove
- luminescent
- radiation device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
A luminescent heat abstractor comprises at least a luminescent chip and a circuit board which is provided with at least a groove and a heat conducting component positioned in the groove. The luminescent chip is directly positioned on the heat conducting component and is connected with the contact pad of the circuit board. The contact pad is connected with the circuit arrangement in the circuit board. Besides, the luminescent chip is encapsulated and covered on the circuit board through filling materials. The invention also discloses the method of the encapsulation and manufacturing of the luminescent heat abstractor.
Description
Technical field
The present invention is about a kind of luminescent and heat radiation device and encapsulation making method thereof, especially in regard to a kind of luminescent and heat radiation device and encapsulation making method thereof that utilizes heat pipe (Heat Pipe) heat radiation.
Background technology
Because the progress of science and technology, various electronic products are increasing for the demand of function, except the speed of desktop PC is constantly upgraded, Portable electronic apparatus for example personalized products such as notebook, mobile phone, mini CD, palmtop computer also becomes important development trend.Yet along with properties of product are more and more stronger, the integrated level of employed electronic building brick (integration) is high more, causes caloric value to improve, so heat dissipation directly influences the reliability and the useful life of electronic building brick.
With light-emitting diode (Light Emitting Diode, LED) package module is an example, please refer to shown in Figure 1, a kind of traditional LED encapsulation module 1 comprises a packaging body 11, a light-emitting diode chip for backlight unit 12 and a lead frame 13 (Lead Frame), this light-emitting diode chip for backlight unit 12 utilizes the cross-over connection of routing mode to this lead frame 13, and be packaged in this packaging body 11, and the end of this lead frame 13 exposes to this packaging body 11.When using this LED encapsulation module 1, the thermal source that this light-emitting diode chip for backlight unit 12 is produced via these lead frame 13 heat radiations, is about 0.1 watt LED encapsulation module so be only applicable to power.Yet when long-time this LED encapsulation module 1 of use, this lead frame 13 can't efficiently radiates heat, and the thermal source of accumulation directly influences the usefulness of this light-emitting diode chip for backlight unit 12.
Please refer to shown in Figure 2, the structure that another kind of traditional LED encapsulation module 2 is a LED encapsulation module 1 is as shown in Figure 1 added a radiating block (slug) 21, this radiating block 21 is arranged on the bottom surface of this light-emitting diode chip for backlight unit 12, and make the bottom surface of surface exposed this packaging body 11 of this radiating block 21, so that this light-emitting diode chip for backlight unit 12 is simultaneously via this radiating block 21 and 13 heat radiations of this lead frame, and this radiating block 21 is with a transcalent metal, for example copper or aluminium are made, and this kind mode is applied to the LED encapsulation module that power is about 1 watt more.
Because this radiating block 21 can only dispel the heat downwards, so when this LED encapsulation module 2 is arranged on a circuit board (figure does not show) when going up, then contact with this circuit board because of this radiating block 21, make the thermal source of this LED encapsulation module 2 effectively to shed, be sent on the contrary on this circuit board.If during long-time the use, then the thermal source that distributes of this light-emitting diode chip for backlight unit 12 not only makes this LED encapsulation module 2 poor heat radiation, more because of thermal source is all conducted on this circuit board, and causes the damage of this LED encapsulation module 2 and this circuit board simultaneously.
Therefore, how to provide a kind of can quick conductive and the luminescent and heat radiation device and the manufacture method thereof of heat radiation effectively, real is one of important topic.
Summary of the invention
Because above-mentioned problem, purpose of the present invention for provide a kind of can quick heat radiating and good luminescent and heat radiation device and the encapsulation making method thereof of uniform temperature.
So,, comprise an at least one luminescence chip and a circuit board according to a kind of luminescent and heat radiation device of the present invention for reaching above-mentioned purpose.This substrate has at least one groove and at least one heat-conductive assembly that is arranged in this groove, and this luminescence chip is arranged on this heat-conductive assembly and directly is packaged on this circuit board, and this luminescence chip is by the packaged protection of a filler; Wherein this heat-conductive assembly is preferably a heat pipe.In addition, at least a portion of this recess sidewall more can form the reflector, increases the light extraction efficiency of light source.
For reaching above-mentioned purpose, comprise the following steps: to provide a circuit board with at least one groove according to the encapsulation making method of a kind of luminescent and heat radiation device of the present invention, the surface of this circuit board has a plurality of contact mats (Contact Pad) and links with configuration in this circuit board; At least one heat-conductive assembly group is located in this groove; At least one luminescence chip is arranged on this heat-conductive assembly, and utilizes the described contact mat on routing mode and this circuit board to link, in order to the configuration electrically connect of this circuit board; And this luminescence chip of packaging protection.Wherein this heat-conductive assembly is preferably a heat pipe.Certainly, also can before the step of this luminescence chip of encapsulation, form a reflector to increase the light extraction efficiency of light source at least a portion of this recess sidewall.
For reaching above-mentioned purpose, comprise at least one luminescence chip, a circuit board and a loading plate according to another kind of luminescent and heat radiation device of the present invention.This circuit board has at least one slotted eye; One surface of this loading plate has at least one groove and at least one heat-conductive assembly that is arranged on this groove, wherein this circuit board is arranged on this loading plate, and this slotted eye correspondence is arranged on this groove, so that this heat-conductive assembly is arranged in this slotted eye, this luminescence chip is arranged on this heat-conductive assembly and by a filler and directly is packaged on this circuit board.
For reaching above-mentioned purpose, comprise the following steps: to provide a loading plate with at least one groove according to the encapsulation making method of another kind of luminescent and heat radiation device of the present invention, wherein this groove is formed on a surface of this loading plate; At least one heat-conductive assembly group is located at this groove; One circuit board with at least one slotted eye is arranged on this loading plate, and wherein this slotted eye correspondence is arranged on this groove, so that this heat-conductive assembly is arranged in this slotted eye; At least one luminescence chip is arranged on this heat-conductive assembly, and with this circuit board electrically connect; And utilize a filler that this luminescence chip encapsulation is coated.
From the above, compare with conventional art, the present invention directly contacts this luminescence chip with this heat-conductive assembly, so when long-time the use, the thermal source that single or multiple luminescence chip distributes can be sent to the cold junction heat radiation with same direction simultaneously, fast and equably via this heat-conductive assembly from the hot junction of this heat-conductive assembly, this kind mode not only can reach the effect of heat radiation fast in the short time, and makes this circuit board integral body have uniform temperature, promotes the reliability and the heat dissipation of this luminescent and heat radiation device.In addition, when this circuit board is arranged on this loading plate, then more can reaches heat radiation and reduce fast the temperature of this circuit board and this luminescence chip, also and then promote heat radiation function by this loading plate.
Description of drawings
Fig. 1 is a kind of schematic diagram of traditional LED encapsulation module;
Fig. 2 is the schematic diagram of the traditional LED encapsulation module of another kind;
Fig. 3 is the schematic diagram of a kind of luminescent and heat radiation device of the preferred embodiment of the present invention;
Fig. 4 is the profile of Fig. 3 along A-A ' line segment;
Fig. 5 is the profile of another embodiment;
Fig. 6 is the flow chart of encapsulation making method of the luminescent and heat radiation device of the preferred embodiment of the present invention;
Fig. 7 A to Fig. 7 C is the implementation step schematic diagram of the encapsulation making method of Fig. 6;
Fig. 8 is the schematic diagram of a kind of luminescent and heat radiation device of the another preferred embodiment of the present invention;
Fig. 9 is the profile of Fig. 8 along B-B ' line segment;
Figure 10 is the flow chart of encapsulation making method of the luminescent and heat radiation device of Fig. 8; And
Figure 11 A to Figure 11 C is the implementation step schematic diagram of the encapsulation making method of Figure 10.
The element numbers explanation:
1,2 LED encapsulation modules, 11 packaging bodies
12 light-emitting diode chip for backlight unit, 13 lead frames
21 radiating blocks, 4,5 luminescent and heat radiation devices
40,51 circuit boards, 41,521 grooves
411 first grooves, 412 second grooves
42,53 heat-conductive assemblies, 43,512 contact mats
44 radiating subassemblies, 45,54 fillers
511 slotted eyes, 52 loading plates
L luminescence chip R reflector
The S connecting line
S01～S04, S11～S15 process step
Embodiment
Hereinafter with reference to relevant drawings, a kind of luminescent and heat radiation device and encapsulation making method thereof according to the preferred embodiment of the present invention are described, wherein identical assembly will be illustrated with identical reference marks.
Please refer to Fig. 3 to shown in Figure 4, a kind of luminescent and heat radiation device 4 of the preferred embodiment of the present invention comprises a circuit board 40 and at least one luminescence chip L that directly is encapsulated on this circuit board 40.This circuit board 40 has at least one groove 41 and at least one heat-conductive assembly 42, and this heat-conductive assembly 42 is arranged in this groove 41.And this luminescence chip L is arranged on this heat-conductive assembly 42.In the present embodiment, this circuit board 40 has a plurality of heat-conductive assemblies 42, and each heat-conductive assembly 42 is provided with a plurality of luminescence chip L.
This circuit board 40 is also unrestricted, can be general employed printed circuit board (PCB) (PCB) or a LTCC (LTCC) circuit board, wherein expose a plurality of contact mats 43 (Contact Pad), as the binding of this luminescence chip L and this circuit board 40 configurations in the surface of this circuit board 40; This luminescence chip L is a light-emitting diode chip for backlight unit, for example High Power LED (High Power LED, HPLED), light emitting diode matrix (LED Array), Organic Light Emitting Diode (OLED) or organic LED array (OLED Array); This heat-conductive assembly 42 is preferably a heat pipe, for example a pulsating heat pipe (Pulsating Heat Pipe) or a loop heat pipe (Loop Heat Pipe), and its conductive coefficient is about 6000W/m ° more than the K.This luminescence chip L can be arranged on the heat-conductive assembly 42 by welding manner, and utilizes the mode of routing (Wire Bonding) and the contact mat 43 of this circuit board 40 to link.
Because being a kind of utilize in the phase transition process, heat pipe absorbs or the character of distribute heat is carried out cooling technology; In detail, this heat pipe is a vacuum body, and fills being easy to evaporated liquid (evaporating temperature and ambient temperature are close) in right amount, and is sealed.Wherein, this heat pipe one end is an evaporation section, the other end is a condensation segment, when this heat pipe one end is heated, and this liquid evaporation vaporization, steam flows to the other end and emits heat and condense into this liquid under small pressure reduction, this liquid flows back to evaporation section by capillarity again, so just forms a loop of going round and beginning again, and reaches the purpose that continues heat radiation, so be applicable to the heat radiation of this luminescence chip L of any power, be particularly useful for the heat radiation of high-power luminescence chip.
With present embodiment, this groove 41 more can be divided into one first groove 411 and one second groove 412; This second groove 412 is formed on the surface of this circuit board 40, and this first groove 411 is connected with this second groove 412 and more gos deep into this circuit board 40 inside.The size of this first groove 411 just can ccontaining this heat-conductive assembly 42, and it is a strip structure for a present embodiment; And this heat-conductive assembly 42 is to bury, adhere or mode such as welding with edge, is embedded in this first groove 411.43 basal surfaces that are formed on this second groove 412 of the contact mat of this circuit board 40, this luminescence chip L then utilizes the routing mode to form connecting line S, with these contact mat 43 bindings of this circuit board 40, to transmit as electrical; Configuration in this circuit board 40, each luminescence chip L can be in parallel, series connection or and any-mode such as series connection utilization simultaneously link together, owing to the layout of circuit is a conventional art in the affiliated field, also non-emphasis of the present invention is not so give unnecessary details.
For increasing the source reflection effect, more can on the sidewall of this second groove 412, form a reflector R.Certainly, also can be formed in the top surface of this circuit board 40 with the contact mat 43 of this luminescence chip L electrically connect, as shown in Figure 5.At last, this groove 41 is by filler 45 encapsulation this luminescence chip L of an encapsulation usefulness and this connecting line S that links with this contact mat 43, exposes to avoid it.This filler 45 is also unrestricted, can be plastics or resin, for example epoxy resin (epoxy resin) or silica gel (Silica gel).
Referring again to shown in Figure 3, in the present embodiment, an end of this heat-conductive assembly 42 more extends this circuit board 40 and connects a radiating subassembly 44; This radiating subassembly 44 is also unrestricted, can be a radiator with a plurality of radiating fins.This radiating subassembly 44 is in order to shedding from the thermal source that this heat-conductive assembly 42 is imported; This radiating subassembly 44 more can brush by the air-flow that a fan (figure does not show) is produced, and promotes heat radiation function.When 4 runnings of this luminescent and heat radiation device, this luminescence chip thermal source that L produces can be via this heat-conductive assembly 42 with this thermal source from this luminescence chip L derivation and be sent to this radiating subassembly 44, so that thermal source is shed.Because this luminescent and heat radiation device 4 is the thermals source that this luminescence chip L produced via this heat-conductive assembly 42, derive with same direction, promptly be sent to the other end (cold junction) of this heat-conductive assembly 42 from this heat-conductive assembly 42 and the contacted end of this luminescence chip L (hot junction), transmit thermal source again to this radiating subassembly 44, so that thermal source is shed.Utilize this mode to dispel the heat, no matter use single or multiple luminescence chip L, all can make the thermal source heat radiation simultaneously, evenly and fast of each luminescence chip L, and make these circuit board 40 integral body have uniform temperature, reach the reliability and the heat dissipation that promote this luminescent and heat radiation device 4.
Please refer to shown in Figure 6ly, the encapsulation making method of this luminescent and heat radiation device 4 of the foregoing description comprises that step S01 is to step S04.Please be simultaneously with reference to shown in Fig. 7 A, step S01 provides a circuit board 40 with at least one groove 41.The configuration that the surface of this circuit board 40 has the inside of a plurality of contact mats 43 and this circuit board 40 links.This groove 41 more can be divided into one first groove 411 and one second groove 412, and this second groove 412 is formed on the surface of this circuit board 40, and this first groove 411 is connected with this second groove 412 and more gos deep into this circuit board 40 inside.Wherein more can form a reflector R at the sidewall of this second groove 412.
Referring again to Fig. 7 B, step S02 is located at this groove 41 with 42 groups of heat-conductive assemblies, with present embodiment, is arranged in this first groove 411.Step S03 is arranged at least one luminescence chip L on this heat-conductive assembly 42, and utilizes contact mat 43 electrically connects on routing mode and this circuit board 40; With present embodiment, this luminescence chip L can be arranged on this heat-conductive assembly 42 by welding manner.
Referring again to Fig. 7 C, step S04 utilizes this luminescence chip of a filler 45 packaging protections L.This luminescence chip L after the encapsulation can avoid outside aqueous vapor or dust to invade in this groove 41, and damages this luminescence chip L and connecting line S thereof, to promote the reliability of this luminescent and heat radiation device 4 and this circuit board 40.In addition, before these circuit board 40 encapsulation or after the encapsulation, the end of a radiating subassembly 44 with this heat-conductive assembly 42 can be connected (as shown in Figure 3), so that this circuit board 40 further promotes heat dissipation.
Please be simultaneously with reference to Fig. 8 and shown in Figure 9, the another kind of luminescent and heat radiation device 5 of the preferred embodiment of the present invention comprises at least one luminescence chip L, a circuit board 51 and a loading plate 52.
This circuit board 51 has a slotted eye 511, and a surface of this loading plate 52 has at least one groove 521 and at least one heat-conductive assembly 53 that is arranged on this groove 521, and this loading plate 52 has a groove 521 and a heat-conductive assembly 53 in the present embodiment.This circuit board 51 is arranged on this loading plate 52, and these slotted eye 511 correspondences are arranged on this groove 521, so that this heat-conductive assembly 53 also is arranged in this slotted eye 511, and this luminescence chip L is arranged on this heat-conductive assembly 53, and directly is packaged on this circuit board 51.
This luminescence chip L of present embodiment and this heat-conductive assembly 53 have identical formation, feature and effect with this luminescence chip L and this heat-conductive assembly 42 of the foregoing description (as shown in Figure 3 and Figure 4), so do not repeat them here.
This circuit board 51 can be the printed circuit board (PCB) or a LTCC circuit board of general use, and this circuit board 51 has configuration (figure show), and this configuration is also unrestricted, can be serial or parallel connection; And on this circuit board 51, have a plurality of contact mats 512, and linking with this configuration, this luminescence chip L is by the routing mode, links with connecting line S and this contact mat 512.So as to filler 54 this luminescence chip of encapsulation L, this contact mat 512 and this connecting line S of an encapsulation usefulness, expose at last to avoid it.
In addition, this loading plate 52 in the present embodiment, its material is also unrestricted, can be heat radiation material, for example a metal or a macromolecule material.In the present embodiment, this filler 54, this connecting line S and this contact mat 512 have identical material, feature and effect with this filler 45, this connecting line S and this contact mat 43 of the foregoing description (as shown in Figure 3 and Figure 4), so do not repeat them here.
Because this luminescent and heat radiation device 5 is to be arranged in this groove 521 of this loading plate 52 by this heat-conductive assembly 53, so when producing thermal source when this luminescence chip L use a period of time, can this thermal source be directed in this loading plate 52 by this heat-conductive assembly 53, and this loading plate 52 is because of being arranged on this circuit board 51 times, so not only can be in the short time, fast this thermal source is left, more can reduce the temperature of this luminescence chip L and this circuit board 51 simultaneously, to promote the effect of heat radiation.
Please refer to shown in Figure 10ly, the encapsulation making method of this luminescent and heat radiation device 5 of the foregoing description comprises that step S11 is to step S15.Please be simultaneously with reference to shown in Figure 10 and Figure 11 A, step S11 provides a loading plate 52 with at least one groove 521, and wherein this groove 521 is formed on a surface of this loading plate 52.Step S12 establishes and exposes to this groove 521 with 53 groups of at least one heat-conductive assemblies.
Please refer to shown in Figure 11 B, step S13 is arranged on a circuit board 51 with at least one slotted eye 511 on this loading plate 52, wherein these slotted eye 511 correspondences are arranged on this groove 521, so that this heat-conductive assembly 53 is arranged in this slotted eye 511, this circuit board 51 is general printed circuit board (PCB) or the LTCC circuit board that uses, and has a plurality of contact mats 512 and be connected with configuration in it.
Please refer to shown in Figure 11 C, step S14 is arranged at least one luminescence chip L on this heat-conductive assembly 53, and with these circuit board 51 electrically connects, wherein this luminescence chip L links with connecting line S and this contact mat 512 by the routing mode.Step S15 utilizes a filler 54 that this luminescence chip L encapsulation is coated, and invades to prevent water gas or dust, promotes the reliability of this luminescent and heat radiation device 5.
In sum, compare with conventional art, the present invention is sent to cold junction with thermal source by the hot junction of this heat-conductive assembly with same direction by this heat-conductive assembly, and thermal source shed, this kind mode is except can more effectively distributing the thermal source of this luminescence chip, more make this circuit board integral body have uniform temperature, and promote the reliability and the heat dissipation of this luminescent and heat radiation device.In addition, when a circuit board is arranged on the loading plate, then more can reduces the thickness of this circuit board and reduce manufacturing cost.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be included among the present invention its equivalent modifications of carrying out or change.
Claims (19)
1. luminescent and heat radiation device comprises:
At least one luminescence chip;
One circuit board, it has at least one groove; And
At least one heat-conductive assembly that is arranged in this groove, wherein this luminescence chip is arranged on this heat-conductive assembly and directly is packaged on this circuit board by a filler.
2. luminescent and heat radiation device comprises:
At least one luminescence chip;
One circuit board has at least one slotted eye;
One loading plate has at least one groove; And
At least one heat-conductive assembly that is arranged on this groove, wherein this circuit board is arranged on this loading plate, and this slotted eye correspondence is arranged on this groove, so that this heat-conductive assembly is arranged in this slotted eye, this luminescence chip is arranged on this heat-conductive assembly and by a filler and directly is packaged on this circuit board.
3. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, this heat-conductive assembly is a heat pipe, a pulsating heat pipe or a loop heat pipe.
4. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, the conductive coefficient of this heat-conductive assembly is 6000W/m ° more than the K.
5. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, this heat-conductive assembly be with edge bury, adhesion or welding manner be arranged in this groove.
6. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, an end of this heat-conductive assembly is to extend this circuit board and link a radiating subassembly.
7. luminescent and heat radiation device according to claim 6 is characterized in that, this radiating subassembly is one to have the radiator of a plurality of radiating fins.
8. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, this luminescence chip is to be arranged on this heat-conductive assembly with welding manner.
9. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, this luminescence chip is a light-emitting diode, a High Power LED, a light emitting diode matrix, an Organic Light Emitting Diode or an organic LED array.
10. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, this circuit board is a printed circuit board (PCB) or LTCC (LTCC) circuit board.
11. luminescent and heat radiation device according to claim 1, it is characterized in that, this groove area is divided into one first groove and one second groove, and this second groove is formed on the surface of this circuit board, and this first groove is connected with this second groove and more gos deep into this circuit board inside.
12. luminescent and heat radiation device according to claim 11 is characterized in that, this heat-conductive assembly is to be embedded in this first groove.
13. luminescent and heat radiation device according to claim 11 is characterized in that, forms a reflector in the sidewall of this second groove.
14. luminescent and heat radiation device according to claim 11 is characterized in that, this circuit board has configuration and has a plurality of contact mats and the binding of this configuration, and this luminescence chip is to link by routing mode and this contact mat.
15. luminescent and heat radiation device according to claim 14 is characterized in that, this contact mat is formed on the surface of this circuit board or the basal surface of this second groove.
16. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, this filler is plastics, resin, epoxy resin or silica gel.
17. luminescent and heat radiation device according to claim 2 is characterized in that, the material of this loading plate is metal, macromolecule or heat-conducting.
18. the encapsulation making method of a luminescent and heat radiation device comprises the following steps:
One circuit board with at least one groove is provided;
At least one heat-conductive assembly group is located in this groove;
At least one luminescence chip is arranged on this heat-conductive assembly, and with this circuit board electrically connect; And
Utilize a filler that this luminescence chip encapsulation is coated.
19. the encapsulation making method of a luminescent and heat radiation device comprises the following steps:
One loading plate with at least one groove is provided;
At least one heat-conductive assembly group is located in this groove;
One circuit board with at least one slotted eye is arranged on this loading plate, and wherein this slotted eye correspondence is arranged on this groove, so that this heat-conductive assembly is arranged in this slotted eye;
At least one luminescence chip is arranged on this heat-conductive assembly, and with this circuit board electrically connect; And
Utilize a filler that this luminescence chip encapsulation is coated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610110094 CN101123227A (en) | 2006-08-08 | 2006-08-08 | Luminescent and heat radiation device and its encapsulation making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610110094 CN101123227A (en) | 2006-08-08 | 2006-08-08 | Luminescent and heat radiation device and its encapsulation making method |
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| CN101123227A true CN101123227A (en) | 2008-02-13 |
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| CN 200610110094 Pending CN101123227A (en) | 2006-08-08 | 2006-08-08 | Luminescent and heat radiation device and its encapsulation making method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368529A (en) * | 2011-06-03 | 2012-03-07 | 王双喜 | Packaging structure of light source of high power LED |
| CN102867788A (en) * | 2012-09-29 | 2013-01-09 | 江苏宏微科技股份有限公司 | Power module based on novel metal-coated ceramic substrate |
| CN102881663A (en) * | 2012-09-29 | 2013-01-16 | 江苏宏微科技股份有限公司 | Metal-coated ceramic substrate with radiating function |
| CN105428250A (en) * | 2015-11-25 | 2016-03-23 | 中国电子科技集团公司第二十九研究所 | LTCC substrate surface cavity planarization processing method |
| CN113126406A (en) * | 2019-12-30 | 2021-07-16 | 无锡视美乐激光显示科技有限公司 | Light source module, projection system and lighting equipment |
-
2006
- 2006-08-08 CN CN 200610110094 patent/CN101123227A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368529A (en) * | 2011-06-03 | 2012-03-07 | 王双喜 | Packaging structure of light source of high power LED |
| CN102867788A (en) * | 2012-09-29 | 2013-01-09 | 江苏宏微科技股份有限公司 | Power module based on novel metal-coated ceramic substrate |
| CN102881663A (en) * | 2012-09-29 | 2013-01-16 | 江苏宏微科技股份有限公司 | Metal-coated ceramic substrate with radiating function |
| CN105428250A (en) * | 2015-11-25 | 2016-03-23 | 中国电子科技集团公司第二十九研究所 | LTCC substrate surface cavity planarization processing method |
| CN105428250B (en) * | 2015-11-25 | 2017-12-26 | 中国电子科技集团公司第二十九研究所 | A kind of method of ltcc substrate surface cavity planarization process |
| CN113126406A (en) * | 2019-12-30 | 2021-07-16 | 无锡视美乐激光显示科技有限公司 | Light source module, projection system and lighting equipment |
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