CN101123226A - Luminescent and heat radiation device and its making method - Google Patents
Luminescent and heat radiation device and its making method Download PDFInfo
- Publication number
- CN101123226A CN101123226A CN 200610110093 CN200610110093A CN101123226A CN 101123226 A CN101123226 A CN 101123226A CN 200610110093 CN200610110093 CN 200610110093 CN 200610110093 A CN200610110093 A CN 200610110093A CN 101123226 A CN101123226 A CN 101123226A
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- heat
- luminescent
- conductive assembly
- package module
- radiation device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
A luminescent heat abstractor comprises at least a luminescent encapsulation module, which produces thermal resources, and a circuit board which comprises at least a groove and a heat conducting component in the groove. The luminescent encapsulation module is directly positioned on the heat conducting component and has an electrical connection with the circuits of the circuit board through a welding spot. The invention also discloses a method for manufacturing luminescent heat abstractors.
Description
Technical field
The present invention is about a kind of luminescent and heat radiation device and manufacture method thereof, especially in regard to a kind of luminescent and heat radiation device and manufacture method thereof of utilizing heat pipe (Heat Pipe) heat radiation.
Background technology
Because the progress of science and technology, various electronic products are increasing for the demand of function, except the speed of desktop PC is constantly upgraded, Portable electronic apparatus for example personalized products such as notebook, mobile phone, mini CD, palmtop computer also becomes important development trend.Yet along with properties of product are more and more stronger, the integrated level of employed electronic building brick (integration) is high more, causes caloric value to improve, so heat dissipation directly influences the reliability and the useful life of electronic building brick.
With light-emitting diode (Light Emitting Diode, LED) package module is an example, please refer to shown in Figure 1, a kind of traditional LED encapsulation module 1 comprises a packaging body 11, a light-emitting diode chip for backlight unit 12 and a lead frame 13 (Lead Frame), this light-emitting diode chip for backlight unit 12 utilizes the cross-over connection of routing mode to this lead frame 13, and be packaged in this packaging body 11, and the end of this lead frame 13 exposes to this packaging body 11.When using this LED encapsulation module 1, the thermal source that this light-emitting diode chip for backlight unit 12 is produced via these lead frame 13 heat radiations, is about 0.1 watt LED encapsulation module so be only applicable to power.Yet when long-time this LED encapsulation module 1 of use, this lead frame 13 can't efficiently radiates heat, and the thermal source of accumulation directly influences the usefulness of this light-emitting diode chip for backlight unit 12.
Please refer to shown in Figure 2, the structure that another kind of traditional LED encapsulation module 2 is a LED encapsulation module 1 is as shown in Figure 1 added a radiating block (slug) 21, this radiating block 21 is arranged on the bottom surface of this light-emitting diode chip for backlight unit 12, and make the bottom surface of surface exposed this packaging body 11 of this radiating block 21, so that this light-emitting diode 12 is simultaneously via this radiating block 21 and 13 heat radiations of this lead frame, and this radiating block 21 is with a transcalent metal, for example copper or aluminium are made, and this kind mode is applied to power more and is about LED encapsulation module more than 1 watt.
Because this radiating block 21 can only dispel the heat downwards, so when this LED encapsulation module 2 is arranged on a circuit board (figure does not show) when going up, then contact with this circuit board because of this radiating block 21, make the thermal source of this LED encapsulation module 2 effectively to shed, be sent on the contrary on this circuit board.If during long-time the use, then this light-emitting diode 12 heat of distributing not only makes this LED encapsulation module 2 poor heat radiation, more because of heat can't export in the environment, and causes the damage of this LED encapsulation module 2 and this circuit board simultaneously.
The whence is because of in this, how to provide a kind of can quick conductive and the luminescent and heat radiation device and the manufacture method thereof of heat radiation effectively, reality is one of important topic.
Summary of the invention
Because above-mentioned problem, purpose of the present invention for provide a kind of can quick heat radiating and good luminescent and heat radiation device and the manufacture method thereof of uniform temperature.
So,, comprise an at least one luminous package module and a circuit board according to a kind of luminescent and heat radiation device of the present invention for reaching above-mentioned purpose.This circuit board has at least one groove and is arranged on the interior at least one heat-conductive assembly of this groove, and this luminous package module is arranged on this heat-conductive assembly.Wherein this heat-conductive assembly is preferably a heat pipe, and this luminous package module is preferably a LED encapsulation module.
For reaching above-mentioned purpose, comprise the following steps according to a kind of manufacturing luminescent heat abstractors of the present invention; One circuit board with at least one groove is provided, and wherein this groove is formed on a surface of this circuit board; At least one heat-conductive assembly group is located at this groove; And the luminous package module that will at least for a moment produce thermal source is arranged on this heat-conductive assembly.Wherein this heat-conductive assembly is preferably a heat pipe, and this luminous package module is preferably a LED encapsulation module.
For reaching above-mentioned purpose, comprise at least one luminous package module, a circuit board and a loading plate according to another kind of luminescent and heat radiation device of the present invention.One surface of this loading plate has at least one groove and at least one setting and exposes to the heat-conductive assembly of this groove, and wherein this circuit board is arranged on this loading plate.This circuit board then has a slotted eye, and this slotted eye correspondence is provided with on this groove and this heat-conductive assembly is arranged in this slotted eye, and this luminous package module is arranged on this heat-conductive assembly.
For reaching above-mentioned purpose, comprise the following steps: to provide a loading plate with at least one groove according to another kind of manufacturing luminescent heat abstractors of the present invention, wherein this groove is formed on a surface of this loading plate; At least one heat-conductive assembly group is located in this groove; One circuit board with at least one slotted eye is arranged on this loading plate, and wherein corresponding this groove of this slotted eye makes this heat-conductive assembly be arranged in this slotted eye; And at least one luminous package module is arranged on this heat-conductive assembly.
In sum, compare with conventional art, the present invention is sent to cold junction with thermal source by the hot junction of this heat-conductive assembly by this heat-conductive assembly, and thermal source shed, except the thermal source that can distribute this luminous package module, the bulk temperature that more makes this luminescent and heat radiation device is homogeneous roughly, the brightness of luminous package module and color is reached evenly, and promote the reliability and the heat dissipation of this luminescent and heat radiation device.
Description of drawings
Fig. 1 is a kind of schematic diagram of traditional LED encapsulation module;
Fig. 2 is the schematic diagram of the traditional LED encapsulation module of another kind;
Fig. 3 is the schematic diagram according to a kind of luminescent and heat radiation device of the preferred embodiment of the present invention;
Fig. 4 is the profile of Fig. 3 along A-A ' line segment;
Fig. 5 is the luminescent and heat radiation device profile according to another preferred embodiment of the present invention, and wherein radiating subassembly is arranged on the circuit board below;
Fig. 6 is the flow chart according to the manufacture method of a kind of circuit board of the preferred embodiment of the present invention;
Fig. 7 is the schematic diagram according to the implementation step of the manufacture method of the circuit board of the preferred embodiment of the present invention;
Fig. 8 is the schematic diagram according to a kind of luminescent and heat radiation device of the another preferred embodiment of the present invention;
Fig. 9 is the profile of Fig. 8 along B-B ' line segment;
Figure 10 is the manufacture method flow chart of Fig. 8; And
Figure 11 A to Figure 11 C is the schematic diagram according to the implementation step of the manufacturing luminescent heat abstractors of the preferred embodiment of the present invention.
The element numbers explanation:
1,2 LED encapsulation modules, 11 packaging bodies
12 light-emitting diode chip for backlight unit, 13 lead frames
21 radiating blocks, 4,5 luminescent and heat radiation devices
40,51 substrates, 41,521 grooves
42,53 heat-conductive assemblies, 43,512 solder joints
44 radiating subassemblies, 511 slotted eyes
The luminous package module of 52 loading plate L
The S conducting objects
S01～S03, S11S14 process step
Embodiment
Hereinafter with reference to relevant drawings, a kind of luminescent and heat radiation device and manufacture method thereof according to the preferred embodiment of the present invention are described, wherein identical assembly will be illustrated with identical reference marks.
Please refer to Fig. 3 and shown in Figure 4, a kind of luminescent and heat radiation device 4 of the preferred embodiment of the present invention comprises an at least one luminous package module L and a substrate 40.This substrate 40 has at least one groove 41 and at least one heat-conductive assembly 42, and this heat-conductive assembly 42 is arranged in this groove 41.And this at least one luminous package module L is arranged on this heat-conductive assembly 42.In the present embodiment, this substrate 40 has a plurality of heat-conductive assemblies 42, and each heat-conductive assembly 42 is provided with a plurality of luminous package module L.
This substrate 40 is also unrestricted, can be the printed circuit board (PCB) (PCB) or a LTCC (LTCC) circuit board of general use, and this substrate 40 has configuration, wherein expose a plurality of solder joints 43, as the binding of this luminous package module L and this substrate 40 configurations on the surface of this substrate 40; This luminous package module L is a LED encapsulation module, for example High Power LED (HighPower LED, HP LED) package module, light emitting diode matrix (LED Array) package module, Organic Light Emitting Diode (OLED) module or organic LED array (OLED Array) package module etc.; This heat-conductive assembly 42 is also unrestricted, is preferably a heat pipe (Heat Pipe), for example a pulsating heat pipe (Pulsating Heat Pipe) or a loop heat pipe (Loop Heat Pipe), and its conductive coefficient is about 6000W/m ° more than the K.
Because being a kind of utilize in the phase transition process, heat pipe absorbs or the character of distribute heat is carried out cooling technology; In detail, this heat pipe is a vacuum body, and fills being easy to evaporated liquid (evaporating temperature and ambient temperature are close) in right amount, and is sealed.Wherein, this heat pipe one end is an evaporation section, the other end is a condensation segment, when this heat pipe one end is heated, and this liquid evaporation vaporization, steam flows to the other end and emits heat and condense into this liquid under small pressure reduction, this liquid flows back to evaporation section by capillarity again, so just forms a loop of going round and beginning again, and reaches the purpose that continues heat radiation, so be applicable to the heat radiation of this luminous package module L of any power, be particularly useful for the heat radiation of high-power luminous package module.
In more detail, this luminous package module L that is arranged on this heat-conductive assembly 42 utilizes surface mounting technology (SMT) or plug-in unit mode, and with these solder joint 43 bindings of this substrate 40, this solder joint 43 is made electrically connect with the circuit of this substrate 40.In the present embodiment, this luminous package module L is with surface mounting technology, and by a conducting objects S, for example tin ball or tin cream and this solder joint 43 electrically connect.By the configuration of this substrate 40, each luminous package module L can be in parallel, series connection or and any-mode such as series connection utilization simultaneously link together, owing to configuration is a conventional art in the affiliated field, also non-emphasis of the present invention is not so give unnecessary details.
This heat-conductive assembly 42 in the present embodiment, it is shaped as strip, can inlay bury, adhesion or welding manner be arranged in the groove 41 of this substrate 40, and the end face of this heat-conductive assembly 42 can be higher than, be lower than or copline in the end face of this substrate 40, present embodiment is that the end face with this heat-conductive assembly 42 and this substrate 40 is that copline is an example.
In addition, an end of this heat-conductive assembly 42 also extends this substrate 40 and connects a radiating subassembly 44.Certainly, the position of this radiating subassembly 44 is also unrestricted, except the end that can be connected this heat-conductive assembly 42 (as shown in Figure 3) on the implementation, also can be connected (as shown in Figure 5) with the basal surface of this heat-conductive assembly 42 and this substrate 40.This radiating subassembly 44 is also unrestricted, and present embodiment comprises that one has the radiator of a plurality of radiating fins, and this radiating subassembly 44 is in order to shedding from the thermal source that this heat-conductive assembly 42 is imported; This radiating subassembly 44 can comprise that also the air-flow that a fan (figure does not show) is produced brushes this radiator, promotes heat radiation function.
When 4 runnings of this luminescent and heat radiation device, this luminous package module thermal source that L produces can be via this heat-conductive assembly 42 with this thermal source from this luminous package module L derivation and be sent to this radiating subassembly 44, so that thermal source is shed.Because the thermal source that this luminescent and heat radiation device 4 will this luminous package module L be produced via this heat-conductive assembly 42, derive in the single direction mode, promptly be sent to the other end (cold junction) of this heat-conductive assembly 42 from this heat-conductive assembly 42 and this contacted end of luminous package module L (hot junction), transmit thermal source again to this radiating subassembly 44, so that thermal source is shed.Utilize this mode to dispel the heat, no matter use single or multiple luminous package module L, all can make the thermal source heat radiation simultaneously, evenly and fast of each luminous package module L, and make these substrate 40 integral body have uniform temperature, and the brightness of all luminous package module L and color are reached evenly, and promote the reliability and the heat dissipation of this luminescent and heat radiation device 4.
Please refer to shown in Figure 6ly, the manufacture method of this luminescent and heat radiation device 4 of the foregoing description comprises that step S01 is to step S03.Please be simultaneously with reference to shown in Figure 7, step S01 provides a substrate 40 with at least one groove 41.The surface of this substrate 40 has a plurality of solder joints 43, and the surface of this substrate 40 or inside then have configuration.Step S02 is located at this groove 41 with 42 groups of at least one heat-conductive assemblies.Step S03 is arranged at least one luminous package module L on this heat-conductive assembly 42, and wherein this solder joint 43 of this luminous package module L and this substrate 40 electrically connects; This luminous package module L that is arranged on this heat-conductive assembly 42 utilizes this solder joint 43 of surface mounting technology (SMT) or plug-in unit mode and this substrate 40 to link; Certainly, also the end of a radiator 44 with this heat-conductive assembly 42 can be linked simultaneously.
Please be simultaneously with reference to Fig. 8 and shown in Figure 9, the another kind of luminescent and heat radiation device 5 of the preferred embodiment of the present invention comprises at least one luminous package module L, a substrate 51 and a loading plate 52 and at least one heat-conductive assembly 53.
In the present embodiment, this substrate 51 has a slotted eye 511, and this substrate 51 can be the printed circuit board (PCB) or a LTCC circuit board of general use on the implementation, so this substrate 51 has configuration (figure does not show), and its surface has a plurality of solder joints 512, and described solder joint 512 is in order to electrically connect with this substrate 51 surfaces and interior configuration thereof.
In the present embodiment, a surface of this loading plate 52 has at least one groove 521, and this heat-conductive assembly 53 is arranged in this groove 521.The material of this loading plate 52 is also unrestricted, and for example metal or macromolecule material are good with the heat conduction or the good material of dispelling the heat so.
This substrate 51 is arranged on this loading plate 52, and these slotted eye 511 correspondences are provided with the heat-conductive assembly 53 of this groove 521, so that this heat-conductive assembly 53 is arranged in this slotted eye 511 simultaneously; The end face of this heat-conductive assembly 53 can be higher or lower than the top surface of this substrate 51, also can with the top surface copline of this substrate 51; Present embodiment is that the top surface copline with this heat-conductive assembly 53 and this substrate 51 is an example.
This luminous package module L is arranged on this heat-conductive assembly 53, and electrically connects by described solder joint 512 and this substrate 51 simultaneously, and in addition, this luminous package module L also can link by a conducting objects S and described solder joint 512; The connected mode of the luminous package module L of this in the present embodiment and this substrate 51 is also unrestricted, on the implementation can surface mounting technology or plug-in unit mode, and be to be example with the surface mounting technology at this.
In addition, the luminous package module L of this in the present embodiment and this heat-conductive assembly 53 have identical formation, feature and effect with this luminous package module L and this heat-conductive assembly 42 (as shown in Figure 3 and Figure 4) in the previous embodiment, so do not repeat them here.
Because this luminescent and heat radiation device 5 is to be arranged in this groove 521 of this loading plate 52 by this heat-conductive assembly 53, so when producing thermal source when this luminous package module L use a period of time, can this thermal source be directed in this loading plate 52 by this heat-conductive assembly 53, and this loading plate 52 is because of being arranged on this substrate 51 times, so not only can be in the short time, fast this thermal source is left, more can reduce the temperature of this luminous package module L and this substrate 51 simultaneously, to promote the effect of heat radiation.
Please refer to shown in Figure 10ly, the manufacture method of this luminescent and heat radiation device 5 of the foregoing description comprises that step S11 is to step S14.Please be simultaneously with reference to shown in Figure 10 and Figure 11 A, step S11 provides a loading plate 52 with at least one groove 521, and wherein this groove 521 is formed on a surface of this loading plate 52.Step S12 is located at 53 groups of at least one heat-conductive assemblies in this groove 521.
Please refer to shown in Figure 11 B, step S13 is arranged on a substrate 51 with at least one slotted eye 511 on this loading plate 52, these slotted eye 511 corresponding these grooves 521 wherein, this heat-conductive assembly 53 is arranged in this slotted eye 511, this substrate 51 in the present embodiment is a general printed circuit board (PCB) or a LTCC circuit board that uses on the implementation, and surface or inside have configuration (figure does not show), and the surface of this substrate 51 has a plurality of solder joints 512 and links with this configuration.This heat-conductive assembly 53 in the present embodiment can be higher or lower than this substrate 51 in implement going up, also can with this surface copline of this substrate 51, be that this surface copline with this heat-conductive assembly 53 and this substrate 51 is an example at this.
Please refer to shown in Figure 11 C, step S14 is arranged at least one luminous package module L on this heat-conductive assembly 53, and while and these substrate 51 electrically connects, wherein the mode of connection of this luminous package module L and this substrate 51 is also unrestricted, can surface mounting technology or the plug-in unit mode link, and be that to do to link with surface mounting technology and described solder joint 512 be example at this; This luminous package module L more is connected by a conducting objects S and this solder joint 512.
In sum, compare with conventional art, the present invention by this heat-conductive assembly with single direction, thermal source is sent to cold junction by the hot junction of this heat-conductive assembly, and thermal source shed, this kind mode more makes this luminescent and heat radiation device integral body have uniform temperature except can more effectively distributing the thermal source of this luminous package module, the brightness and the color of luminous package module are reached evenly, and promote the reliability and the heat dissipation of this luminescent and heat radiation device.In addition, when a circuit board is arranged on the loading plate, then more can reduces the thickness of this circuit board and reduce manufacturing cost.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be included in claims its equivalent modifications of carrying out or change.
Claims (16)
1. luminescent and heat radiation device comprises:
At least one luminous package module;
One substrate, surface thereof have at least one groove; And
At least one heat-conductive assembly that is arranged in this groove, wherein this luminous package module is arranged on this heat-conductive assembly.
2. luminescent and heat radiation device comprises:
At least one luminous package module;
One substrate has a slotted eye;
One loading plate, surface thereof have at least one groove; And
At least one heat-conductive assembly that is arranged on this groove, wherein this substrate is arranged on this loading plate, and this slotted eye is arranged in this slotted eye this heat-conductive assembly corresponding to this groove, and this luminous package module is arranged on this heat-conductive assembly.
3. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, an end face of this heat-conductive assembly be higher than, be lower than or copline in this surface of this substrate.
4. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, this heat-conductive assembly is a heat pipe, a pulsating heat pipe or a loop heat pipe.
5. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, the conductive coefficient of this heat-conductive assembly is 6000W/m ° more than the K.
6. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, this heat-conductive assembly be with edge bury, adhesion or welding manner be arranged in this groove.
7. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, an end of this heat-conductive assembly extends this substrate and links a radiating subassembly.
8. luminescent and heat radiation device according to claim 7 is characterized in that, this radiating subassembly comprises that one has the radiator of a plurality of radiating fins.
9. luminescent and heat radiation device according to claim 8 is characterized in that this radiating subassembly also comprises a fan, with the heat dissipation that accumulates on this radiator.
10. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, this luminous package module is a light-emitting diode (LED) package module.
11. luminescent and heat radiation device according to claim 10, it is characterized in that this LED encapsulation module is a High Power LED package module, a light emitting diode matrix package module, an Organic Light Emitting Diode package module or an organic LED array package module.
12. luminescent and heat radiation device according to claim 1 and 2 is characterized in that, this substrate is a printed circuit board (PCB) or LTCC (LTCC) circuit board.
13. luminescent and heat radiation device according to claim 1 and 2, it is characterized in that, this substrate has configuration and its surface has a plurality of solder joints, and this luminous package module is to link with surface mounting technology (SMT) or the plug-in unit mode configuration by described solder joint and this substrate.
14. luminescent and heat radiation device according to claim 2 is characterized in that, the material of this loading plate is metal, macromolecule or heat-conducting.
15. a manufacturing luminescent heat abstractors comprises the following steps:
One substrate with at least one groove is provided, and wherein this groove is formed on a surface of this substrate;
At least one heat-conductive assembly group is located in this groove; And
At least one luminous package module is arranged on this heat-conductive assembly.
16. a manufacturing luminescent heat abstractors comprises the following steps:
One loading plate with at least one groove is provided;
At least one heat-conductive assembly group is located in this groove;
One substrate with at least one slotted eye is arranged on this loading plate, and wherein corresponding this groove of this slotted eye is arranged in this slotted eye this heat-conductive assembly; And
At least one luminous package module is arranged on this heat-conductive assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610110093 CN101123226A (en) | 2006-08-08 | 2006-08-08 | Luminescent and heat radiation device and its making method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610110093 CN101123226A (en) | 2006-08-08 | 2006-08-08 | Luminescent and heat radiation device and its making method |
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| CN101123226A true CN101123226A (en) | 2008-02-13 |
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| CN 200610110093 Pending CN101123226A (en) | 2006-08-08 | 2006-08-08 | Luminescent and heat radiation device and its making method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103629641A (en) * | 2013-11-20 | 2014-03-12 | 南京第壹有机光电有限公司 | Connecting method of OLED illumination module |
| CN103796446A (en) * | 2012-11-01 | 2014-05-14 | 上海品奇数码科技有限公司 | High-efficiency manufacturing method of large-scale array type photoelectric transmit-receive sensor |
| CN101776248B (en) * | 2009-01-09 | 2014-06-25 | 台达电子工业股份有限公司 | Lamp and illumination device thereof |
| CN105338792A (en) * | 2015-11-16 | 2016-02-17 | 余原生 | Heat conducting structure of heat pipe and preparation process thereof |
| CN106439505A (en) * | 2015-08-05 | 2017-02-22 | 扬明光学股份有限公司 | Light emitting device |
| CN108156752A (en) * | 2018-02-11 | 2018-06-12 | 维沃移动通信有限公司 | A kind of manufacturing method of circuit board, mobile terminal and circuit board |
-
2006
- 2006-08-08 CN CN 200610110093 patent/CN101123226A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101776248B (en) * | 2009-01-09 | 2014-06-25 | 台达电子工业股份有限公司 | Lamp and illumination device thereof |
| CN103796446A (en) * | 2012-11-01 | 2014-05-14 | 上海品奇数码科技有限公司 | High-efficiency manufacturing method of large-scale array type photoelectric transmit-receive sensor |
| CN103796446B (en) * | 2012-11-01 | 2016-12-21 | 上海品奇数码科技有限公司 | The manufacture method of large scale array formula photoelectric sending and receiving sensor |
| CN103629641A (en) * | 2013-11-20 | 2014-03-12 | 南京第壹有机光电有限公司 | Connecting method of OLED illumination module |
| CN106439505A (en) * | 2015-08-05 | 2017-02-22 | 扬明光学股份有限公司 | Light emitting device |
| CN106439505B (en) * | 2015-08-05 | 2021-06-25 | 扬明光学股份有限公司 | Light emitting device |
| CN105338792A (en) * | 2015-11-16 | 2016-02-17 | 余原生 | Heat conducting structure of heat pipe and preparation process thereof |
| CN108156752A (en) * | 2018-02-11 | 2018-06-12 | 维沃移动通信有限公司 | A kind of manufacturing method of circuit board, mobile terminal and circuit board |
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