CN103629641A - Connecting method of OLED illumination module - Google Patents
Connecting method of OLED illumination module Download PDFInfo
- Publication number
- CN103629641A CN103629641A CN201310584361.0A CN201310584361A CN103629641A CN 103629641 A CN103629641 A CN 103629641A CN 201310584361 A CN201310584361 A CN 201310584361A CN 103629641 A CN103629641 A CN 103629641A
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- China
- Prior art keywords
- oled
- light emitting
- emitting module
- pcb board
- tin cream
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
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- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a connecting method of an OLED illumination module. The OLED illumination module comprises an OLED light emitting module and a PCB, and the OLED light emitting module and the PCB are connected through solder paste soldering. According to the connecting method of the OLED illumination module, the OLED light emitting module and the PCB are connected by adopting the solder paste soldering mode, solder paste and brazing needles are combined creatively, the solder paste is melted by adopting a brazing needle soldering mode to form stable connection, the method is simple, easy to achieve, low in cost, and suitable for large-scale production, the manufactured OLED illumination module is a simple lamp itself, the connection among multiple OLED illumination modules is facilitated, and good market application prospects are provided for OLED illumination devices.
Description
Technical field
The present invention relates to a kind of method of attachment of OLED lighting module, belong to luminous lighting technical field.
Background technology
OLED light emitting module is when being made into OLED lighting module, need to consider how to be connected with external circuit, it is at the OLED light emitting module back side, to increase pcb board that current OLED lighting module connects, and has made the contact being connected with external circuit on pcb board, facilitates circuit access.Prior art OLED lighting module design, the OLED light emitting module mode that employing conducting resinl combines with copper cash that is connected with PCB, utilizes the good effect of leading of conducting resinl and copper bar, and electric current is imported.
In existing scheme, adopt conducting resinl and copper cash that light emitting module is connected with PCB, realize complex process, copper cash requirement on machining accuracy is very high, and cost is higher, is not easy to large-scale production.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art part, a kind of method of attachment of OLED lighting module is provided.
The method of attachment of OLED lighting module of the present invention, described OLED lighting module comprises OLED light emitting module and pcb board, between described OLED light emitting module and pcb board, by tin cream, is welded to connect.
The method of described tin cream welding is as follows: with point gum machine by tin cream point in the gap between OLED light emitting module and pcb board, then with capillary, tin cream is melted, thereby OLED light emitting module and pcb board is coupled together.
The edge electrodes nation of described OLED light emitting module has FPC(Flexible Printed Circuit, flexible PCB surely), described FPC is provided with pad.On described pcb board, be provided with pad, the access point being connected with external circuit in addition, the pad on described PCB is corresponding with the pad locations on FPC.
The method of described tin cream welding is as follows: with point gum machine by tin cream point in the pad locations of OLED light emitting module and pcb board, then with capillary, tin cream is melted, thereby OLED light emitting module and pcb board is coupled together.
The present invention adopts the mode of tin cream welding that OLED light emitting module and PCB are coupled together, creationary tin cream and capillary are combined, adopt the mode of capillary welding that tin cream is melted, form firm connection, simple easily realization, cost is lower, be applicable to scale of mass production, the OLED lighting module of making itself is exactly a simple light fixture, facilitates the connection between a plurality of OLED illuminating devices, for OLED lighting device provides good market application foreground.
Accompanying drawing explanation
Fig. 1 is the connection of OLED lighting module of the present invention tin cream schematic diagram.
Fig. 2 is the connection procedure schematic diagram of OLED lighting module of the present invention.
Wherein, 1 is OLED light emitting module, and 2 is pcb board, and 3 is tin cream, and 4 is capillary.
The specific embodiment
As shown in Figure 1, the method of attachment of OLED lighting module of the present invention, described OLED lighting module comprises OLED light emitting module 1 and pcb board 2, between described OLED light emitting module and pcb board, by tin cream 3, be welded to connect, the method of tin cream welding is as follows: with point gum machine by tin cream point in the gap between OLED light emitting module and pcb board, then with capillary 4, tin cream is melted, thereby OLED light emitting module and pcb board are coupled together.
The method of attachment of OLED lighting module of the present invention, described OLED lighting module comprises OLED light emitting module 1 and pcb board 2, and the edge electrodes nation of OLED light emitting module has FPC surely, and described FPC is provided with pad.Described pcb board is also provided with pad, the access point being connected with external circuit in addition, pad on PCB is corresponding with the pad locations on FPC, the method of tin cream welding is as follows: with point gum machine by tin cream point in the pad locations of OLED light emitting module and pcb board, then with capillary 4, tin cream is melted, thereby OLED light emitting module and pcb board are coupled together.
Claims (4)
1. a method of attachment for OLED lighting module, is characterized in that, described OLED lighting module comprises OLED light emitting module and pcb board, between described OLED light emitting module and pcb board, by tin cream, is welded to connect.
2. the method for attachment of OLED lighting module according to claim 1, it is characterized in that, the method of described tin cream welding is as follows: with point gum machine by tin cream point in the gap between OLED light emitting module and pcb board, then with capillary, tin cream is melted, thereby OLED light emitting module and pcb board are coupled together.
3. the method for attachment of OLED lighting module according to claim 1, it is characterized in that, the edge electrodes nation of described OLED light emitting module has FPC surely, described FPC is provided with pad, on described pcb board, be also provided with pad, the access point being connected with external circuit in addition, the pad on described PCB is corresponding with the pad locations on FPC.
4. the method for attachment of OLED lighting module according to claim 3, it is characterized in that, the method of described tin cream welding is as follows: with point gum machine by tin cream point in the pad locations of OLED light emitting module and pcb board, then with capillary, tin cream is melted, thereby OLED light emitting module and pcb board are coupled together.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310584361.0A CN103629641A (en) | 2013-11-20 | 2013-11-20 | Connecting method of OLED illumination module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310584361.0A CN103629641A (en) | 2013-11-20 | 2013-11-20 | Connecting method of OLED illumination module |
Publications (1)
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CN103629641A true CN103629641A (en) | 2014-03-12 |
Family
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Family Applications (1)
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CN201310584361.0A Pending CN103629641A (en) | 2013-11-20 | 2013-11-20 | Connecting method of OLED illumination module |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101123226A (en) * | 2006-08-08 | 2008-02-13 | 台达电子工业股份有限公司 | Luminescent and heat radiation device and its making method |
CN101751979A (en) * | 2008-12-12 | 2010-06-23 | 赖振楠 | Mobile memory card with luminous body and manufacturing method thereof |
CN102231193A (en) * | 2011-07-06 | 2011-11-02 | 黄艳 | Double-interface smart card |
-
2013
- 2013-11-20 CN CN201310584361.0A patent/CN103629641A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101123226A (en) * | 2006-08-08 | 2008-02-13 | 台达电子工业股份有限公司 | Luminescent and heat radiation device and its making method |
CN101751979A (en) * | 2008-12-12 | 2010-06-23 | 赖振楠 | Mobile memory card with luminous body and manufacturing method thereof |
CN102231193A (en) * | 2011-07-06 | 2011-11-02 | 黄艳 | Double-interface smart card |
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Application publication date: 20140312 |
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