CN107630209A - The preparation method of heavy copper B liquid and the electroless copper plating method of pcb board - Google Patents
The preparation method of heavy copper B liquid and the electroless copper plating method of pcb board Download PDFInfo
- Publication number
- CN107630209A CN107630209A CN201710712975.0A CN201710712975A CN107630209A CN 107630209 A CN107630209 A CN 107630209A CN 201710712975 A CN201710712975 A CN 201710712975A CN 107630209 A CN107630209 A CN 107630209A
- Authority
- CN
- China
- Prior art keywords
- liquid
- heavy copper
- copper
- heavy
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The present invention provides a kind of preparation method of heavy copper B liquid, changes the dosage and adaptation step of each component in the conventional heavy copper B liquid；Invention also provides a kind of electroless copper plating method of pcb board, and the electroless copper plating method of the pcb board adds above-mentioned heavy copper B liquid.Compared with correlation technique, the preparation method of heavy copper B liquid provided by the invention, by changing the dosage and adaptation step of each component in the conventional heavy copper B liquid, to improve the performance of the heavy copper B liquid；The heavy copper B liquid is added in the electroless copper plating method of pcb board provided by the invention, makes heavy copper improved efficiency, and copper is slow on cell wall, pcb board face is not in copper particle.
Description
Technical field
The present invention relates to heavy copper technology field, more particularly to the electroless copper plating of a kind of preparation method of heavy copper B liquid and pcb board
Method.
Background technology
Electroless copper plating is electroless copper, and its principle is exactly to allow copper ion to be combined with activator, restores copper ion attached
In non-conductive plate face, the effect of electroless copper plating is to deposit one layer of copper on electrical insulator (insulator) surface, in ensuring
Layer conductor and circuit are reliably connected.
In related chemistry sinks process for copper, heavy copper principle be represented by the chemical formula for：CuSO4+2HCHO+4NaOH→Cu+
NaSO4+2HCOONa+2H2O+H2 ↑, wherein controlling deposition rate by complexing agent, the stabilization of chemical bronze plating liquid is controlled by stabilizer
Property, for the heavy copper reaction speed of winding level, improve chemical copper activity, would generally be used during electroless copper plating and increase complexing agent
The method of input ratio and the input ratio of reduction stabilizer, this is easy for causing, and copper is fast on cell wall and pcb board face is easy
There is the problems such as copper particle.
Therefore, it is necessary to provide a kind of new heavy copper B liquid preparation method and pcb board electroless copper plating method to solve on
State problem.
The content of the invention
Present invention solves the technical problem that it is to provide a kind of preparation method of heavy copper B liquid and the electroless copper plating method of pcb board,
Make heavy copper speed faster, be not likely to produce copper particle.
In order to solve the above technical problems, the present invention provides a kind of preparation method of heavy copper B liquid, the heavy copper B liquid include water,
Sodium hydroxide, complexing agent, stabilizer and pH stabilizers, the component of the heavy copper B liquid be sunk described in per 1L copper B liquid contain it is described
Sodium hydroxide 135g, the complexing agent 120g, the stabilizer 40ppm and the pH stabilizers 100g, the preparation method bag
Include following steps：
60L pure water is injected in toward container and continues to stir；
Sodium hydroxide described in 13.5Kg is added toward the container；
Reduce the temperature of the solution in the container；
Complexing agent described in 12Kg is added in toward the container；
The pH value of the solution in the container is adjusted, it is 11~13 to make the pH value；
Stabilizer described in 4g is added after the solution is limpid；
Supplement pure water is to fixed liquid level and stirs.
Preferably, agitating mode is that air-blowing is stirred in the lasting whipping step.
Preferably, in the temperature step for reducing the solution in the container, solution temperature is down to 30 degrees Celsius.
Preferably, the complexing agent is EDTP.
Preferably, in the pH value step of the solution in the regulation container, by adding pH stabilizers described in 10Kg
Realize the regulation of the pH value.
Preferably, for the supplement pure water into fixed liquid level and the step that stirs, the fixed liquid level is 100L.
The present invention also provides a kind of electroless copper plating method of pcb board, and this method comprises the following steps：
Heavy copper B liquid is added into heavy copper A liquid, reduces copper ion in the heavy copper A liquid, obtains heavy copper combination liquid, its
In, the heavy copper A liquid is conventional heavy copper A liquid, and the heavy copper B liquid is above-mentioned heavy copper B liquid；
The substrate level for treating copper-coating is immersed in the heavy copper combination liquid and carries out copper-coating, obtains the pcb board.
Compared with correlation technique, the preparation method of heavy copper B liquid provided by the invention, by changing the conventional heavy copper B
The dosage and adaptation step of each component in liquid, improve the performance of the heavy copper B liquid, the electroless copper plating of pcb board provided by the invention
The heavy copper B liquid is added in method, makes heavy copper improved efficiency, and copper is slow on cell wall, the plate face of pcb board is not in copper particle
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment
Accompanying drawing is briefly described, and drawings in the following description are only some embodiments of the present invention, common for this area
For technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings, its
In：
Fig. 1 is the flow chart of the preparation method of the heavy copper B liquid of the present invention.
Embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only the part of the embodiment of the present invention, rather than whole embodiments.It is common based on the embodiment in the present invention, this area
All other embodiment that technical staff is obtained under the premise of creative work is not made, belong to the model that the present invention protects
Enclose.
A kind of preparation method of heavy copper B liquid, the heavy copper B liquid include water, sodium hydroxide, complexing agent, stabilizer and pH
Stabilizer, the component of the heavy copper B liquid be sunk described in per 1L copper B liquid contain the sodium hydroxide 135g, the complexing agent 120g,
The stabilizer 40ppm and the pH stabilizers 100g, the preparation method comprise the following steps：
Step S1, toward injection 60L pure water in container and continue to stir.
Specifically, the agitating mode of this step stirs for air-blowing, and continue stirring until the heavy copper B liquid and prepare completion.
Step S2, sodium hydroxide described in 13.5Kg is added toward the container.
Step S3, the temperature of the solution in the container is reduced.
Specifically, in this step, solution temperature is down to 30 degrees Celsius.
Step S4, toward complexing agent described in addition 12Kg in the container.
Step S5, the pH value of the solution in the container is adjusted, it is 11~13 to make the pH value.
Specifically, in this step, pH stabilizers described in 10Kg are added, to adjust the pH value of the solution in the container.
Step S6, stabilizer described in 4g is added after the solution is limpid.
Step S7, pure water is supplemented to fixed liquid level and is stirred.
Specifically, it is 100L that pure water to fixed liquid level is supplemented in this step
In addition to the above steps, also include in the present embodiment, step S8, assay, barrelling after adjustment.
Specifically, this step is used to ensure that the heavy copper B liquid is qualified.
The complexing agent is EDTP.
The present invention also provides a kind of electroless copper plating method of pcb board, and this method comprises the following steps：
Heavy copper B liquid is added into heavy copper A liquid, obtains heavy copper combination liquid, wherein, the heavy copper A liquid is conventional heavy copper A
Liquid, the heavy copper B liquid are above-mentioned heavy copper B liquid；
The substrate level for treating copper-coating is immersed in the heavy copper combination liquid and carries out copper-coating, makes the heavy copper combination
Copper ion in liquid reduces and is attached to the substrate, obtains the pcb board.
The heavy copper A liquid is CuSO4.5H2O.
The present invention provides a kind of preparation method of heavy copper B liquid, changes the dosage and tune of each component in the conventional heavy copper B liquid
With step；Invention also provides a kind of electroless copper plating method of pcb board, and the electroless copper plating method of the pcb board adds above-mentioned heavy copper B
Liquid.Compared with correlation technique, the preparation method of heavy copper B liquid provided by the invention is each in the conventional heavy copper B liquid by changing
The dosage and adaptation step of component, to improve the performance of the heavy copper B liquid；The electroless copper plating method of pcb board provided by the invention
It is middle to add the heavy copper B liquid, make heavy copper improved efficiency, and copper is slow on cell wall, the plate face of pcb board is not in copper particle.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (7)
1. a kind of preparation method of heavy copper B liquid, it is characterised in that the heavy copper B liquid includes water, sodium hydroxide, complexing agent, stably
Agent and pH stabilizers, the component of the heavy copper B liquid is that heavy copper B liquid contains the sodium hydroxide 135g, the network described in per 1L
Mixture 120g, the stabilizer 40ppm and the pH stabilizers 100g, the preparation method comprise the following steps：
60L pure water is injected in toward container and continues to stir；
Sodium hydroxide described in 13.5Kg is added toward the container；
Reduce the temperature of the solution in the container；
Complexing agent described in 12Kg is added in toward the container；
The pH value of the solution in the container is adjusted, it is 11~13 to make the pH value；
Stabilizer described in 4g is added after the solution is limpid；
Supplement pure water is to fixed liquid level and stirs.
2. the concocting method of heavy copper B liquid according to claim 1, it is characterised in that described to continue to stir in whipping step
Mode stirs for air-blowing.
3. the concocting method of heavy copper B liquid according to claim 1, it is characterised in that molten in the reduction container
In the temperature step of liquid, solution temperature is down to 30 degrees Celsius.
4. the concocting method of heavy copper B liquid according to claim 1, it is characterised in that the complexing agent is EDTP.
5. the concocting method of heavy copper B liquid according to claim 1, it is characterised in that molten in the regulation container
In the pH value step of liquid, the regulation of the pH value is realized by adding pH stabilizers described in 10Kg.
6. the concocting method of heavy copper B liquid according to claim 1, it is characterised in that the supplement pure water to fixed liquid level
And in the step that stirs, the fixed liquid level is 100L.
7. a kind of electroless copper plating method of pcb board, it is characterised in that this method comprises the following steps：
Heavy copper B liquid is added into heavy copper A liquid, reduces copper ion in the heavy copper A liquid, obtains heavy copper combination liquid, wherein, institute
It is the heavy copper B liquid as described in claim 1~6 any one that heavy copper A liquid, which is stated, as conventional heavy copper A liquid, the heavy copper B liquid；
The substrate level for treating copper-coating is immersed in the heavy copper combination liquid and carries out copper-coating, obtains the pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710712975.0A CN107630209A (en) | 2017-08-18 | 2017-08-18 | The preparation method of heavy copper B liquid and the electroless copper plating method of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710712975.0A CN107630209A (en) | 2017-08-18 | 2017-08-18 | The preparation method of heavy copper B liquid and the electroless copper plating method of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107630209A true CN107630209A (en) | 2018-01-26 |
Family
ID=61100611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710712975.0A Pending CN107630209A (en) | 2017-08-18 | 2017-08-18 | The preparation method of heavy copper B liquid and the electroless copper plating method of pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107630209A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102051607A (en) * | 2009-10-29 | 2011-05-11 | 比亚迪股份有限公司 | Electroless copper plating solution |
| CN102877046A (en) * | 2011-07-13 | 2013-01-16 | 比亚迪股份有限公司 | Chemical copper plating liquid and chemical copper plating method |
| CN105648426A (en) * | 2016-03-23 | 2016-06-08 | 深圳市松柏实业发展有限公司 | Copper-deposition combined liquor |
-
2017
- 2017-08-18 CN CN201710712975.0A patent/CN107630209A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102051607A (en) * | 2009-10-29 | 2011-05-11 | 比亚迪股份有限公司 | Electroless copper plating solution |
| CN102877046A (en) * | 2011-07-13 | 2013-01-16 | 比亚迪股份有限公司 | Chemical copper plating liquid and chemical copper plating method |
| CN105648426A (en) * | 2016-03-23 | 2016-06-08 | 深圳市松柏实业发展有限公司 | Copper-deposition combined liquor |
Non-Patent Citations (1)
| Title |
|---|
| 严钦元: "《塑料电镀》", 30 July 1987, 重庆出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Chen et al. | Effects of supporting electrolytes on copper electroplating for filling through-hole | |
| CN105200467B (en) | A kind of Gravure hard copper additive and plating solution | |
| CN101270490B (en) | Dissipated metal indium chloride/chloridization 1-methyl-3-butyl imidazole system plating solution | |
| CN108251869B (en) | Tin plating electrolyte and the preparation method and application thereof | |
| WO2012174732A1 (en) | Methods and apparatus for uniformly metallization on substrates | |
| EP2852696B1 (en) | Copper plating solution and method for preparing the same | |
| CN108396346B (en) | Preparation method and application of graphene copper/steel composite material | |
| CN102787316A (en) | Micro-etching solution for PCB (printed circuit board) electroplating and preparation method of micro-etching solution | |
| CN109666954A (en) | A kind of tin plating additive and preparation method thereof | |
| TWI506727B (en) | Semiconductor components High aspect ratio (HAR) hole or trough of the nickel-tungsten alloy filling plating solution and filling process | |
| CN104746057B (en) | A kind of chemical tin plating liquor and preparation method thereof and a kind of chemical plating stannum method | |
| CN109055921A (en) | A kind of electroless plated tin liquor and preparation method thereof | |
| CN111424296A (en) | Electroplating copper solution for filling through holes of IC carrier plate and electroplating method | |
| CN102601381B (en) | Preparation method of copper nano powder | |
| CN104141120B (en) | Cuprous chemical copper plating solution | |
| KR102381835B1 (en) | Anode for electrolytic copper plating and electrolytic copper plating apparatus using same | |
| CN107630209A (en) | The preparation method of heavy copper B liquid and the electroless copper plating method of pcb board | |
| CN107604361A (en) | A kind of acidic etching liquid and preparation method thereof | |
| JP2016079460A (en) | Copper-nickel alloy electroplating apparatus | |
| CN109056038A (en) | Electroplanting device and its electro-plating method | |
| CN109609983A (en) | A kind of plating copper additives and preparation method thereof | |
| CN105603472B (en) | Acid copper-plating series additive | |
| CN104087984A (en) | Tinning electrolyte of tinned copper wire for electronic component lead wires | |
| CN105369304A (en) | A tin-copper-nickel alloy electroplating solution and an electroplating method thereof | |
| CN104213170A (en) | Copper plating method for high-order high-density circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180126 |