CN109666954A - A kind of tin plating additive and preparation method thereof - Google Patents
A kind of tin plating additive and preparation method thereof Download PDFInfo
- Publication number
- CN109666954A CN109666954A CN201910163700.5A CN201910163700A CN109666954A CN 109666954 A CN109666954 A CN 109666954A CN 201910163700 A CN201910163700 A CN 201910163700A CN 109666954 A CN109666954 A CN 109666954A
- Authority
- CN
- China
- Prior art keywords
- tin
- parts
- deionized water
- tin plating
- sulfonic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000007747 plating Methods 0.000 title claims abstract description 60
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 239000000654 additive Substances 0.000 title claims abstract description 29
- 230000000996 additive effect Effects 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims description 11
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 31
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000008367 deionised water Substances 0.000 claims abstract description 26
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 26
- 230000004913 activation Effects 0.000 claims abstract description 21
- 229940098779 methanesulfonic acid Drugs 0.000 claims abstract description 21
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 17
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 17
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 11
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 11
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims abstract description 8
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 150000002334 glycols Chemical class 0.000 claims abstract description 6
- 238000009713 electroplating Methods 0.000 claims description 27
- 239000000975 dye Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- AGIJRRREJXSQJR-UHFFFAOYSA-N 2h-thiazine Chemical compound N1SC=CC=C1 AGIJRRREJXSQJR-UHFFFAOYSA-N 0.000 claims description 2
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 150000001298 alcohols Chemical class 0.000 claims 1
- 239000007800 oxidant agent Substances 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000013589 supplement Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000000576 coating method Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 5
- 230000009471 action Effects 0.000 abstract description 2
- 239000007853 buffer solution Substances 0.000 abstract description 2
- IRNXOGJJKGMBOP-UHFFFAOYSA-J methanesulfonate methanesulfonic acid tin(4+) Chemical compound [Sn+4].CS(=O)(=O)[O-].CS(=O)(=O)O.CS(=O)(=O)[O-].CS(=O)(=O)[O-].CS(=O)(=O)[O-] IRNXOGJJKGMBOP-UHFFFAOYSA-J 0.000 abstract description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The present invention discloses a kind of tin plating additive, component including following volumes part: 6~10 parts of tin methane sulfonate, 27~30 parts of methane sulfonic acid, 5~10 parts of plating activation agent, 0.2~0.6 part of leveling agent, 0.5~2 part of antioxidant, 50~65 parts of deionized water, wherein, the plating activation agent is made of polyethylene glycol, methane sulfonic acid, deionized water；The leveling agent is made of dye composition and glycols；The antioxidant is made of hydroquinone, methanol, deionized water.The present invention reduces Sn using tin methane sulfonate-methane sulfonic acid as buffer system2+Activity in the solution makes it be not easy hydrolyzed and aoxidize, introduces using benzenediol as the antioxidant of action component, further make Sn2+It is less susceptible to be oxidized in the solution；The leveling agent based on dye composition is introduced, the covering power of bath solution low current density areas is maintained, cooperates the plating activation agent based on polyethylene glycol, the surface of tin plating workpiece is made to be capable of forming the tin coating of fine uniform.
Description
Technical field
The invention belongs to electroless plating techniques fields, and in particular to a kind of tin plating additive and preparation method thereof.
Background technique
Tin coating has been widely used in electronics industry due to its excellent corrosion stability and solderability as electronics member device
The protectiveness and solderable coating of part, wire rod, printed wiring board and integrated circuit block.And tin coating mainly passes through electroless plating
Mode completes the process in electroplating bath, and the electroplate liquid for chemical plating stannum is generally acid solution, and tin is in electroplate liquid with Sn2+'s
Form exists, and can have part Sn in the plating process2+It is oxidized to Sn4+Or tin oxide, so that plating solution is unstable, formation
Not bright, inadequate enough the dense uniform of tin coating, it is neck that the composition proportion for how regulating and controlling plating solution, which makes to form the tin coating of bright densification,
The place that domain domestic demand constantly improves.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of low stress, low foam, unleaded and good tin plating effect tin plating
Additive and preparation method thereof.
The technical scheme adopted by the invention to achieve the purpose is as follows:
A kind of tin plating additive, the component including following volumes part:
6~10 parts of tin methane sulfonate, 27~30 parts of methane sulfonic acid, 5~10 parts of plating activation agent, leveling agent 0.2~0.6
Part, 0.5~2 part of antioxidant, 50~65 parts of deionized water.
Wherein, the plating activation agent is made of polyethylene glycol, methane sulfonic acid, deionized water；The leveling agent is by dyestuff
Compound and glycols composition；The antioxidant is made of hydroquinone, methanol, deionized water；The tin methane sulfonate it is dense
Degree is 300g/L, and the concentration of the methane sulfonic acid is 945g/L.
Specifically, the weight ratio of polyethylene glycol in the plating activation agent, methane sulfonic acid, deionized water is (1~5):
(0.5~1): (95~99).
Specifically, the weight ratio of dye composition and glycols is 1:99 in the leveling agent.
Specifically, the weight ratio of benzenediol in the antioxidant, methanol, deionized water is (3~5): (1~5):
(90~96).
Specifically, the dye composition is one of azophenlyene class dye composition and thiazin dyes compound.
Specifically, the glycols is ethylene glycol, one of propylene glycol, butanediol or compound.
A kind of preparation method of tin plating additive is implemented before the electroplating work procedure in electroplating technology, including following implementation step
It is rapid:
(1) after electroplating bath cleans up, after the deionized water that electroplating bath is added 50%, circulating filtration is opened；
(2) opening temperature control device makes that 25-35 DEG C of tank liquid holding is electroplated；
(3) methane sulfonic acid needed for being added in electroplating bath by formula rate according to electroplating bath volume, temperature meeting after addition
It increases, needs to cool down；
(4) 35 DEG C are down to hereinafter, required tin methane sulfonate is added by formula rate in electroplating bath to fluid temperature；
(5) required plating activation agent, leveling agent, antioxidant are sequentially added by formula rate in electroplating bath, finally
With deionized water replenisher position to normal volume；
(6) it is put into false plating plate to be electrolysed, 2h is electrolysed with 20ASF, obtains tin plating additive.
Specifically, tin plating additive in electroplating bath can be used directly to start electroplating work procedure after the completion of the step (6).
Compared with prior art, the beneficial effects of the present invention are:
1. the present invention using tin methane sulfonate-methane sulfonic acid as buffer system, reduces Sn2+Activity in the solution makes it not
Easily hydrolyzed and oxidation, introduces using benzenediol as the antioxidant of action component, further makes Sn2+It is less susceptible in the solution by oxygen
Change；Introduce leveling agent based on dye composition, maintain the covering power of bath solution low current density areas, cooperation with
Plating activation agent based on polyethylene glycol, makes the surface of tin plating workpiece be capable of forming the tin coating of fine uniform.
2. being electroplated by using the present invention, the low foam of electroplate liquid is unleaded, and the tin coating of formation is large scale (diameter 4-
5 microns) polygon crystalline texture, it is in the appearance of uniform satin shape dumb light, has the characteristics that low stress, scolding tin effect are good,
Specific embodiment
In order to further understand the content, features and effects of the present invention, hereby enumerating following embodiment explanation.
Embodiment 1
A kind of tin plating additive, each component are matched in the ratio of following volumes part:
It 8 parts of tin methane sulfonate, 28 parts of methane sulfonic acid, 6 parts of plating activation agent, 0.4 part of leveling agent, 1.2 parts of antioxidant, goes
56.4 parts of ionized water.
Wherein, polyethylene glycol in plating activation agent, methane sulfonic acid, deionized water weight ratio be 3:0.6:96.4.Antioxygen
Benzenediol in agent, methanol, deionized water weight ratio be 4:3:93.
Above-mentioned tin plating additive the preparation method is as follows:
(1) after electroplating bath cleans up, after the deionized water that electroplating bath is added 50%, circulating filtration is opened；
(2) opening temperature control device makes that 25-35 DEG C of tank liquid holding is electroplated；
(3) methane sulfonic acid needed for being added in electroplating bath by formula rate according to electroplating bath volume, temperature meeting after addition
It increases, needs to cool down；
(4) 35 DEG C are down to hereinafter, required tin methane sulfonate is added by formula rate in electroplating bath to fluid temperature；
(5) required plating activation agent, leveling agent, antioxidant are sequentially added by formula rate in electroplating bath, finally
With deionized water replenisher position to normal volume；
(6) it is put into false plating plate to be electrolysed, 2h is electrolysed with 20ASF, obtains tin plating additive.
Embodiment 2
A kind of tin plating additive, each component are matched in the ratio of following volumes part:
It 8 parts of tin methane sulfonate, 28 parts of methane sulfonic acid, 6 parts of plating activation agent, 0.4 part of leveling agent, 1.2 parts of antioxidant, goes
56.4 parts of ionized water.
Wherein, polyethylene glycol in plating activation agent, methane sulfonic acid, deionized water weight ratio be 2:0.8:97.2.Antioxygen
Benzenediol in agent, methanol, deionized water weight ratio be 3:2:95.
The preparation method of above-mentioned tin plating additive is same as Example 1.
Embodiment 3
A kind of tin plating additive, each component are matched in the ratio of following volumes part:
It 9 parts of tin methane sulfonate, 29 parts of methane sulfonic acid, 8 parts of plating activation agent, 0.6 part of leveling agent, 1.8 parts of antioxidant, goes
51.6 parts of ionized water.
Wherein, polyethylene glycol in plating activation agent, methane sulfonic acid, deionized water weight ratio be 4:0.8:95.2.Antioxygen
Benzenediol in agent, methanol, deionized water weight ratio be 5:3:92.
The preparation method of above-mentioned tin plating additive is same as Example 1.
Embodiment 4
A kind of tin plating additive, each component are matched in the ratio of following volumes part:
10 parts of tin methane sulfonate, 28 parts of methane sulfonic acid, 9 parts of plating activation agent, 0.8 part of leveling agent, 1.8 parts of antioxidant,
50.4 parts of deionized water.
Wherein, polyethylene glycol in plating activation agent, methane sulfonic acid, deionized water weight ratio be 5:1:94.In antioxidant
Benzenediol, methanol, deionized water weight ratio be 5:3:92.
The preparation method of above-mentioned tin plating additive is same as Example 1.
Tin plating additive application is when electronic component electrotinning process obtained by embodiment 1-4, in the equal energy of electronical elements surface
Form the pure tin coating of depositing homogeneous, polygon big crystal grain.
The above is only the preferred embodiments of the present invention, and is not intended to limit the present invention in any form,
Any simple modification made to the above embodiment according to the technical essence of the invention, equivalent variations and modification, belong to
The range of technical solution of the present invention.
Claims (8)
1. a kind of tin plating additive, which is characterized in that the component including following volumes part:
6~10 parts of tin methane sulfonate, 27~30 parts of methane sulfonic acid, 5~10 parts of plating activation agent, 0.2~0.6 part of leveling agent, resist
0.5~2 part of oxidant, 50~65 parts of deionized water.
Wherein, the plating activation agent is made of polyethylene glycol, methane sulfonic acid, deionized water；The leveling agent is by dyestuff chemical combination
Object and glycols composition；The antioxidant is made of hydroquinone, methanol, deionized water；The concentration of the tin methane sulfonate is
300g/L, the concentration of the methane sulfonic acid are 945g/L.
2. a kind of tin plating additive according to claim 1, it is characterised in that: polyethylene glycol in the plating activation agent,
Methane sulfonic acid, deionized water weight ratio be (1~5): (0.5~1): (95~99).
3. a kind of tin plating additive according to claim 1, it is characterised in that: dye composition and two in the leveling agent
The weight ratio of alcohols is 1:99.
4. a kind of tin plating additive according to claim 1, it is characterised in that: benzenediol in the antioxidant, is gone methanol
The weight ratio of ionized water is (3~5): (1~5): (90~96).
5. a kind of tin plating additive according to claim 1 or 3, it is characterised in that: the dye composition is azophenlyene class
One of dye composition and thiazin dyes compound.
6. a kind of tin plating additive according to claim 1 or 3, it is characterised in that: the glycols is ethylene glycol, the third two
One of alcohol, butanediol or compound.
7. a kind of preparation method of tin plating additive as claimed in any one of claims 1 to 6, it is characterised in that: in electroplating technology
In electroplating work procedure before implement, including following implementation steps:
(1) after electroplating bath cleans up, after the deionized water that electroplating bath is added 50%, circulating filtration is opened；
(2) opening temperature control device makes that 25-35 DEG C of tank liquid holding is electroplated；
(3) methane sulfonic acid needed for being added in electroplating bath by formula rate according to electroplating bath volume, temperature can increase after addition,
It needs to cool down；
(4) 35 DEG C are down to hereinafter, required tin methane sulfonate is added by formula rate in electroplating bath to fluid temperature；
(5) required plating activation agent, leveling agent, antioxidant are sequentially added by formula rate in electroplating bath, finally spent
Ionized water supplements liquid level to normal volume；
(6) it is put into false plating plate to be electrolysed, 2h is electrolysed with 20ASF, obtains tin plating additive.
8. a kind of preparation method of tin plating additive according to claim 7, it is characterised in that: complete in the step (6)
Tin plating additive in electroplating bath can be used directly to start electroplating work procedure at rear.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910163700.5A CN109666954A (en) | 2019-03-05 | 2019-03-05 | A kind of tin plating additive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910163700.5A CN109666954A (en) | 2019-03-05 | 2019-03-05 | A kind of tin plating additive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109666954A true CN109666954A (en) | 2019-04-23 |
Family
ID=66151498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910163700.5A Pending CN109666954A (en) | 2019-03-05 | 2019-03-05 | A kind of tin plating additive and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108977856A (en) * | 2018-09-11 | 2018-12-11 | 中国科学院金属研究所 | A kind of method that through-hole electro-deposition prepares stannum nanowire |
| CN111647917A (en) * | 2020-05-22 | 2020-09-11 | 成都宏明双新科技股份有限公司 | Process for preventing tin-plated product from discoloring in high-temperature test |
| CN112111763A (en) * | 2020-09-30 | 2020-12-22 | 首钢集团有限公司 | Preparation method of tin plate with high tin plating amount and product thereof |
| CN114517313A (en) * | 2022-03-04 | 2022-05-20 | 东莞市斯坦得电子材料有限公司 | Tin methane sulfonate tinning additive for printed circuit board and preparation method thereof |
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| CN108977856A (en) * | 2018-09-11 | 2018-12-11 | 中国科学院金属研究所 | A kind of method that through-hole electro-deposition prepares stannum nanowire |
| CN111647917A (en) * | 2020-05-22 | 2020-09-11 | 成都宏明双新科技股份有限公司 | Process for preventing tin-plated product from discoloring in high-temperature test |
| CN112111763A (en) * | 2020-09-30 | 2020-12-22 | 首钢集团有限公司 | Preparation method of tin plate with high tin plating amount and product thereof |
| CN114517313A (en) * | 2022-03-04 | 2022-05-20 | 东莞市斯坦得电子材料有限公司 | Tin methane sulfonate tinning additive for printed circuit board and preparation method thereof |
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