CN109666954A - A kind of tin plating additive and preparation method thereof - Google Patents
A kind of tin plating additive and preparation method thereof Download PDFInfo
- Publication number
- CN109666954A CN109666954A CN201910163700.5A CN201910163700A CN109666954A CN 109666954 A CN109666954 A CN 109666954A CN 201910163700 A CN201910163700 A CN 201910163700A CN 109666954 A CN109666954 A CN 109666954A
- Authority
- CN
- China
- Prior art keywords
- tin
- parts
- deionized water
- tin plating
- sulfonic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
Abstract
The present invention discloses a kind of tin plating additive, component including following volumes part: 6~10 parts of tin methane sulfonate, 27~30 parts of methane sulfonic acid, 5~10 parts of plating activation agent, 0.2~0.6 part of leveling agent, 0.5~2 part of antioxidant, 50~65 parts of deionized water, wherein, the plating activation agent is made of polyethylene glycol, methane sulfonic acid, deionized water；The leveling agent is made of dye composition and glycols；The antioxidant is made of hydroquinone, methanol, deionized water.The present invention reduces Sn using tin methane sulfonate-methane sulfonic acid as buffer system2+Activity in the solution makes it be not easy hydrolyzed and aoxidize, introduces using benzenediol as the antioxidant of action component, further make Sn2+It is less susceptible to be oxidized in the solution；The leveling agent based on dye composition is introduced, the covering power of bath solution low current density areas is maintained, cooperates the plating activation agent based on polyethylene glycol, the surface of tin plating workpiece is made to be capable of forming the tin coating of fine uniform.
Description
Technical field
The invention belongs to electroless plating techniques fields, and in particular to a kind of tin plating additive and preparation method thereof.
Background technique
Tin coating has been widely used in electronics industry due to its excellent corrosion stability and solderability as electronics member device
The protectiveness and solderable coating of part, wire rod, printed wiring board and integrated circuit block.And tin coating mainly passes through electroless plating
Mode completes the process in electroplating bath, and the electroplate liquid for chemical plating stannum is generally acid solution, and tin is in electroplate liquid with Sn2+'s
Form exists, and can have part Sn in the plating process2+It is oxidized to Sn4+Or tin oxide, so that plating solution is unstable, formation
Not bright, inadequate enough the dense uniform of tin coating, it is neck that the composition proportion for how regulating and controlling plating solution, which makes to form the tin coating of bright densification,
The place that domain domestic demand constantly improves.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of low stress, low foam, unleaded and good tin plating effect tin plating
Additive and preparation method thereof.
The technical scheme adopted by the invention to achieve the purpose is as follows:
A kind of tin plating additive, the component including following volumes part:
6~10 parts of tin methane sulfonate, 27~30 parts of methane sulfonic acid, 5~10 parts of plating activation agent, leveling agent 0.2~0.6
Part, 0.5~2 part of antioxidant, 50~65 parts of deionized water.
Wherein, the plating activation agent is made of polyethylene glycol, methane sulfonic acid, deionized water；The leveling agent is by dyestuff
Compound and glycols composition；The antioxidant is made of hydroquinone, methanol, deionized water；The tin methane sulfonate it is dense
Degree is 300g/L, and the concentration of the methane sulfonic acid is 945g/L.
Specifically, the weight ratio of polyethylene glycol in the plating activation agent, methane sulfonic acid, deionized water is (1~5):
(0.5~1): (95~99).
Specifically, the weight ratio of dye composition and glycols is 1:99 in the leveling agent.
Specifically, the weight ratio of benzenediol in the antioxidant, methanol, deionized water is (3~5): (1~5):
(90~96).
Specifically, the dye composition is one of azophenlyene class dye composition and thiazin dyes compound.
Specifically, the glycols is ethylene glycol, one of propylene glycol, butanediol or compound.
A kind of preparation method of tin plating additive is implemented before the electroplating work procedure in electroplating technology, including following implementation step
It is rapid:
(1) after electroplating bath cleans up, after the deionized water that electroplating bath is added 50%, circulating filtration is opened；
(2) opening temperature control device makes that 25-35 DEG C of tank liquid holding is electroplated；
(3) methane sulfonic acid needed for being added in electroplating bath by formula rate according to electroplating bath volume, temperature meeting after addition
It increases, needs to cool down；
(4) 35 DEG C are down to hereinafter, required tin methane sulfonate is added by formula rate in electroplating bath to fluid temperature；
(5) required plating activation agent, leveling agent, antioxidant are sequentially added by formula rate in electroplating bath, finally
With deionized water replenisher position to normal volume；
(6) it is put into false plating plate to be electrolysed, 2h is electrolysed with 20ASF, obtains tin plating additive.
Specifically, tin plating additive in electroplating bath can be used directly to start electroplating work procedure after the completion of the step (6).
Compared with prior art, the beneficial effects of the present invention are:
1. the present invention using tin methane sulfonate-methane sulfonic acid as buffer system, reduces Sn2+Activity in the solution makes it not
Easily hydrolyzed and oxidation, introduces using benzenediol as the antioxidant of action component, further makes Sn2+It is less susceptible in the solution by oxygen
Change；Introduce leveling agent based on dye composition, maintain the covering power of bath solution low current density areas, cooperation with
Plating activation agent based on polyethylene glycol, makes the surface of tin plating workpiece be capable of forming the tin coating of fine uniform.
2. being electroplated by using the present invention, the low foam of electroplate liquid is unleaded, and the tin coating of formation is large scale (diameter 4-
5 microns) polygon crystalline texture, it is in the appearance of uniform satin shape dumb light, has the characteristics that low stress, scolding tin effect are good,
Specific embodiment
In order to further understand the content, features and effects of the present invention, hereby enumerating following embodiment explanation.
Embodiment 1
A kind of tin plating additive, each component are matched in the ratio of following volumes part:
It 8 parts of tin methane sulfonate, 28 parts of methane sulfonic acid, 6 parts of plating activation agent, 0.4 part of leveling agent, 1.2 parts of antioxidant, goes
56.4 parts of ionized water.
Wherein, polyethylene glycol in plating activation agent, methane sulfonic acid, deionized water weight ratio be 3:0.6:96.4.Antioxygen
Benzenediol in agent, methanol, deionized water weight ratio be 4:3:93.
Above-mentioned tin plating additive the preparation method is as follows:
(1) after electroplating bath cleans up, after the deionized water that electroplating bath is added 50%, circulating filtration is opened；
(2) opening temperature control device makes that 25-35 DEG C of tank liquid holding is electroplated；
(3) methane sulfonic acid needed for being added in electroplating bath by formula rate according to electroplating bath volume, temperature meeting after addition
It increases, needs to cool down；
(4) 35 DEG C are down to hereinafter, required tin methane sulfonate is added by formula rate in electroplating bath to fluid temperature；
(5) required plating activation agent, leveling agent, antioxidant are sequentially added by formula rate in electroplating bath, finally
With deionized water replenisher position to normal volume；
(6) it is put into false plating plate to be electrolysed, 2h is electrolysed with 20ASF, obtains tin plating additive.
Embodiment 2
A kind of tin plating additive, each component are matched in the ratio of following volumes part:
It 8 parts of tin methane sulfonate, 28 parts of methane sulfonic acid, 6 parts of plating activation agent, 0.4 part of leveling agent, 1.2 parts of antioxidant, goes
56.4 parts of ionized water.
Wherein, polyethylene glycol in plating activation agent, methane sulfonic acid, deionized water weight ratio be 2:0.8:97.2.Antioxygen
Benzenediol in agent, methanol, deionized water weight ratio be 3:2:95.
The preparation method of above-mentioned tin plating additive is same as Example 1.
Embodiment 3
A kind of tin plating additive, each component are matched in the ratio of following volumes part:
It 9 parts of tin methane sulfonate, 29 parts of methane sulfonic acid, 8 parts of plating activation agent, 0.6 part of leveling agent, 1.8 parts of antioxidant, goes
51.6 parts of ionized water.
Wherein, polyethylene glycol in plating activation agent, methane sulfonic acid, deionized water weight ratio be 4:0.8:95.2.Antioxygen
Benzenediol in agent, methanol, deionized water weight ratio be 5:3:92.
The preparation method of above-mentioned tin plating additive is same as Example 1.
Embodiment 4
A kind of tin plating additive, each component are matched in the ratio of following volumes part:
10 parts of tin methane sulfonate, 28 parts of methane sulfonic acid, 9 parts of plating activation agent, 0.8 part of leveling agent, 1.8 parts of antioxidant,
50.4 parts of deionized water.
Wherein, polyethylene glycol in plating activation agent, methane sulfonic acid, deionized water weight ratio be 5:1:94.In antioxidant
Benzenediol, methanol, deionized water weight ratio be 5:3:92.
The preparation method of above-mentioned tin plating additive is same as Example 1.
Tin plating additive application is when electronic component electrotinning process obtained by embodiment 1-4, in the equal energy of electronical elements surface
Form the pure tin coating of depositing homogeneous, polygon big crystal grain.
The above is only the preferred embodiments of the present invention, and is not intended to limit the present invention in any form,
Any simple modification made to the above embodiment according to the technical essence of the invention, equivalent variations and modification, belong to
The range of technical solution of the present invention.
Claims (8)
1. a kind of tin plating additive, which is characterized in that the component including following volumes part:
6~10 parts of tin methane sulfonate, 27~30 parts of methane sulfonic acid, 5~10 parts of plating activation agent, 0.2~0.6 part of leveling agent, resist
0.5~2 part of oxidant, 50~65 parts of deionized water.
Wherein, the plating activation agent is made of polyethylene glycol, methane sulfonic acid, deionized water；The leveling agent is by dyestuff chemical combination
Object and glycols composition；The antioxidant is made of hydroquinone, methanol, deionized water；The concentration of the tin methane sulfonate is
300g/L, the concentration of the methane sulfonic acid are 945g/L.
2. a kind of tin plating additive according to claim 1, it is characterised in that: polyethylene glycol in the plating activation agent,
Methane sulfonic acid, deionized water weight ratio be (1~5): (0.5~1): (95~99).
3. a kind of tin plating additive according to claim 1, it is characterised in that: dye composition and two in the leveling agent
The weight ratio of alcohols is 1:99.
4. a kind of tin plating additive according to claim 1, it is characterised in that: benzenediol in the antioxidant, is gone methanol
The weight ratio of ionized water is (3~5): (1~5): (90~96).
5. a kind of tin plating additive according to claim 1 or 3, it is characterised in that: the dye composition is azophenlyene class
One of dye composition and thiazin dyes compound.
6. a kind of tin plating additive according to claim 1 or 3, it is characterised in that: the glycols is ethylene glycol, the third two
One of alcohol, butanediol or compound.
7. a kind of preparation method of tin plating additive as claimed in any one of claims 1 to 6, it is characterised in that: in electroplating technology
In electroplating work procedure before implement, including following implementation steps:
(1) after electroplating bath cleans up, after the deionized water that electroplating bath is added 50%, circulating filtration is opened；
(2) opening temperature control device makes that 25-35 DEG C of tank liquid holding is electroplated；
(3) methane sulfonic acid needed for being added in electroplating bath by formula rate according to electroplating bath volume, temperature can increase after addition,
It needs to cool down；
(4) 35 DEG C are down to hereinafter, required tin methane sulfonate is added by formula rate in electroplating bath to fluid temperature；
(5) required plating activation agent, leveling agent, antioxidant are sequentially added by formula rate in electroplating bath, finally spent
Ionized water supplements liquid level to normal volume；
(6) it is put into false plating plate to be electrolysed, 2h is electrolysed with 20ASF, obtains tin plating additive.
8. a kind of preparation method of tin plating additive according to claim 7, it is characterised in that: complete in the step (6)
Tin plating additive in electroplating bath can be used directly to start electroplating work procedure at rear.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910163700.5A CN109666954A (en) | 2019-03-05 | 2019-03-05 | A kind of tin plating additive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910163700.5A CN109666954A (en) | 2019-03-05 | 2019-03-05 | A kind of tin plating additive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109666954A true CN109666954A (en) | 2019-04-23 |
Family
ID=66151498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910163700.5A Pending CN109666954A (en) | 2019-03-05 | 2019-03-05 | A kind of tin plating additive and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109666954A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108977856A (en) * | 2018-09-11 | 2018-12-11 | 中国科学院金属研究所 | A kind of method that through-hole electro-deposition prepares stannum nanowire |
| CN111647917A (en) * | 2020-05-22 | 2020-09-11 | 成都宏明双新科技股份有限公司 | Process for preventing tin-plated product from discoloring in high-temperature test |
| CN112111763A (en) * | 2020-09-30 | 2020-12-22 | 首钢集团有限公司 | Preparation method of tin plate with high tin plating amount and product thereof |
| CN114517313A (en) * | 2022-03-04 | 2022-05-20 | 东莞市斯坦得电子材料有限公司 | Tin methane sulfonate tinning additive for printed circuit board and preparation method thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030070934A1 (en) * | 2001-10-02 | 2003-04-17 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| JP2008266757A (en) * | 2007-04-24 | 2008-11-06 | Rohm & Haas Electronic Materials Llc | Tin or tin-alloy electroplating solution |
| CN101922026A (en) * | 2010-08-18 | 2010-12-22 | 济南德锡科技有限公司 | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof |
| CN101952487A (en) * | 2007-08-07 | 2011-01-19 | 摩西湖工业公司 | Electroplating aqueous solution and preparation thereof and using method |
| KR101012815B1 (en) * | 2010-07-21 | 2011-02-08 | 주식회사 에이엔씨코리아 | Tin plating solution for using in chip plating process |
| CN103422130A (en) * | 2012-05-14 | 2013-12-04 | 中国科学院金属研究所 | Plating solution and method for electroplating bright tin plating layer |
| CN104630843A (en) * | 2013-11-08 | 2015-05-20 | 无锡市雪江环境工程设备有限公司 | Plating solution for acid copper plating by phenazine dye system and electroplating method thereof |
| CN105200465A (en) * | 2014-05-27 | 2015-12-30 | 无锡韩光电器有限公司 | Thiazine dye system acidic copper electroplating solution and electroplating method |
| CN105734620A (en) * | 2016-03-11 | 2016-07-06 | 深圳市松柏实业发展有限公司 | Tin stripping and tin plating liquid, preparing method of tin stripping and tin plating liquid and cyclic regeneration method for adopting tin stripping and tin plating liquid for recycling metal tin |
| JP2017031447A (en) * | 2015-07-29 | 2017-02-09 | 石原ケミカル株式会社 | Tin and tin alloy electroplating bath, method for forming electrodeposition using plating bath, and electronic component produced by the method |
| CN106609385A (en) * | 2017-03-13 | 2017-05-03 | 广州睿邦新材料科技有限公司 | High-filling acidic copper copper-plated brightener for electrocoppering |
| CN106757194A (en) * | 2016-11-29 | 2017-05-31 | 陕西环珂生物科技有限公司 | A kind of method that PCB blind holes are filled out in utilization electro-coppering |
-
2019
- 2019-03-05 CN CN201910163700.5A patent/CN109666954A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030070934A1 (en) * | 2001-10-02 | 2003-04-17 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| JP2008266757A (en) * | 2007-04-24 | 2008-11-06 | Rohm & Haas Electronic Materials Llc | Tin or tin-alloy electroplating solution |
| CN101952487A (en) * | 2007-08-07 | 2011-01-19 | 摩西湖工业公司 | Electroplating aqueous solution and preparation thereof and using method |
| KR101012815B1 (en) * | 2010-07-21 | 2011-02-08 | 주식회사 에이엔씨코리아 | Tin plating solution for using in chip plating process |
| CN101922026A (en) * | 2010-08-18 | 2010-12-22 | 济南德锡科技有限公司 | Methanesulfonic acid-based matte pure tin electroplating solution and additive thereof |
| CN103422130A (en) * | 2012-05-14 | 2013-12-04 | 中国科学院金属研究所 | Plating solution and method for electroplating bright tin plating layer |
| CN104630843A (en) * | 2013-11-08 | 2015-05-20 | 无锡市雪江环境工程设备有限公司 | Plating solution for acid copper plating by phenazine dye system and electroplating method thereof |
| CN105200465A (en) * | 2014-05-27 | 2015-12-30 | 无锡韩光电器有限公司 | Thiazine dye system acidic copper electroplating solution and electroplating method |
| JP2017031447A (en) * | 2015-07-29 | 2017-02-09 | 石原ケミカル株式会社 | Tin and tin alloy electroplating bath, method for forming electrodeposition using plating bath, and electronic component produced by the method |
| CN105734620A (en) * | 2016-03-11 | 2016-07-06 | 深圳市松柏实业发展有限公司 | Tin stripping and tin plating liquid, preparing method of tin stripping and tin plating liquid and cyclic regeneration method for adopting tin stripping and tin plating liquid for recycling metal tin |
| CN106757194A (en) * | 2016-11-29 | 2017-05-31 | 陕西环珂生物科技有限公司 | A kind of method that PCB blind holes are filled out in utilization electro-coppering |
| CN106609385A (en) * | 2017-03-13 | 2017-05-03 | 广州睿邦新材料科技有限公司 | High-filling acidic copper copper-plated brightener for electrocoppering |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108977856A (en) * | 2018-09-11 | 2018-12-11 | 中国科学院金属研究所 | A kind of method that through-hole electro-deposition prepares stannum nanowire |
| CN111647917A (en) * | 2020-05-22 | 2020-09-11 | 成都宏明双新科技股份有限公司 | Process for preventing tin-plated product from discoloring in high-temperature test |
| CN112111763A (en) * | 2020-09-30 | 2020-12-22 | 首钢集团有限公司 | Preparation method of tin plate with high tin plating amount and product thereof |
| CN114517313A (en) * | 2022-03-04 | 2022-05-20 | 东莞市斯坦得电子材料有限公司 | Tin methane sulfonate tinning additive for printed circuit board and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109666954A (en) | A kind of tin plating additive and preparation method thereof | |
| CN102162110B (en) | Methyl sulfonate tinning electrolyte and tinning method of steel strip or steel plate | |
| CN110106535B (en) | Neutral tin plating additive | |
| CN102758228B (en) | A kind of sulfonic acid type semi-bright Pure Tin Plating Process liquid | |
| CN103572335A (en) | Copper plating solution for PCB (printed circuit board) through holes, and preparation method and plating method thereof | |
| CN108251869B (en) | Tin plating electrolyte and the preparation method and application thereof | |
| CN112064069A (en) | Environment-friendly bright tin plating treatment process method | |
| CN110205659B (en) | Electrotinning additive and preparation method thereof | |
| CN107299366A (en) | Non-cyanide plating solution for copper-plating used | |
| CN107299367A (en) | Non-cyanide bright plate silver plating solution | |
| CN109055921A (en) | A kind of electroless plated tin liquor and preparation method thereof | |
| CN113802158B (en) | Electroplating solution and application thereof, copper plating process and plated part | |
| CN111321435A (en) | Acidic tin electroplating solution and preparation method and application thereof | |
| CA2296900A1 (en) | Electroplating solution for electroplating lead and lead/tin alloys | |
| CN108570696A (en) | A kind of acidic zinc nickel plating solution of resistance to high current density and its application | |
| CN108411287A (en) | A kind of solution of low temperature acid Electroless Plating of Ni-P Alloy | |
| CN109609979B (en) | Multi-layer nickel electroplating additive for improving stability | |
| CN108950614B (en) | VCP high-efficiency copper plating brightener | |
| CN105821452A (en) | Plating solution formula for electroplating pure tin on copper wire and electroplating method | |
| CN115787007A (en) | Acidic sulfate electronic copper electroplating additive composition and application thereof | |
| CN110846693B (en) | High-dispersity alkaline cyanide-free zinc plating brightener and preparation method and application thereof | |
| CN115029742B (en) | Electroplating additive for PSA electrotinning insoluble anode system | |
| CN111621819B (en) | Cyanide-free silver plating brightener and preparation method thereof | |
| JPS5841357B2 (en) | Acidic zinc plating solutions and plating methods using ethoxylated/propoxylated polyhydric alcohols | |
| CN114525555B (en) | Acidic zinc-nickel alloy electroplating additive and electroplating solution |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |