CN107614619B - 热固化性材料及固化物 - Google Patents

热固化性材料及固化物 Download PDF

Info

Publication number
CN107614619B
CN107614619B CN201680027264.3A CN201680027264A CN107614619B CN 107614619 B CN107614619 B CN 107614619B CN 201680027264 A CN201680027264 A CN 201680027264A CN 107614619 B CN107614619 B CN 107614619B
Authority
CN
China
Prior art keywords
thermosetting
boron nitride
thermosetting material
less
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680027264.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN107614619A (zh
Inventor
石田浩也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN107614619A publication Critical patent/CN107614619A/zh
Application granted granted Critical
Publication of CN107614619B publication Critical patent/CN107614619B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN201680027264.3A 2015-11-19 2016-11-10 热固化性材料及固化物 Active CN107614619B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015226932 2015-11-19
JP2015-226932 2015-11-19
PCT/JP2016/083323 WO2017086226A1 (ja) 2015-11-19 2016-11-10 熱硬化性材料及び硬化物

Publications (2)

Publication Number Publication Date
CN107614619A CN107614619A (zh) 2018-01-19
CN107614619B true CN107614619B (zh) 2023-05-09

Family

ID=58718792

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680027264.3A Active CN107614619B (zh) 2015-11-19 2016-11-10 热固化性材料及固化物

Country Status (7)

Country Link
US (1) US11866635B2 (enExample)
EP (1) EP3378899B1 (enExample)
JP (2) JP6212660B1 (enExample)
KR (1) KR102606624B1 (enExample)
CN (1) CN107614619B (enExample)
TW (1) TWI783916B (enExample)
WO (1) WO2017086226A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102606624B1 (ko) * 2015-11-19 2023-11-27 세키스이가가쿠 고교가부시키가이샤 열경화성 재료 및 경화물
JP6560599B2 (ja) * 2015-11-19 2019-08-14 積水化学工業株式会社 熱硬化性シート、硬化物シート及び積層体
US10246623B2 (en) * 2016-09-21 2019-04-02 NAiEEL Technology Resin composition, article prepared by using the same, and method of preparing the same
TWI833828B (zh) * 2018-10-29 2024-03-01 日商積水化學工業股份有限公司 氮化硼奈米材料及樹脂組成物
JP7358883B2 (ja) * 2019-09-26 2023-10-11 日本ゼオン株式会社 熱伝導シート
WO2022124005A1 (ja) * 2020-12-11 2022-06-16 富士フイルム株式会社 硬化性組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス
JP7713308B2 (ja) * 2021-03-23 2025-07-25 デンカ株式会社 特定の窒化ホウ素粒子を含む組成物
WO2025205591A1 (ja) * 2024-03-29 2025-10-02 富士フイルム株式会社 シート及びシートの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008123326A1 (ja) * 2007-03-23 2008-10-16 Teijin Limited 熱硬化性樹脂複合組成物、樹脂成形体およびその製造方法
CN104870557A (zh) * 2012-12-12 2015-08-26 Lg伊诺特有限公司 环氧树脂组合物以及印刷电路板

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2830301B2 (ja) * 1990-02-15 1998-12-02 株式会社明電舎 アルミナ充填樹脂硬化物
US6048919A (en) * 1999-01-29 2000-04-11 Chip Coolers, Inc. Thermally conductive composite material
US20070241303A1 (en) * 1999-08-31 2007-10-18 General Electric Company Thermally conductive composition and method for preparing the same
CN1927988A (zh) * 2005-09-05 2007-03-14 鸿富锦精密工业（深圳）有限公司 热界面材料及其制备方法
JP2008258254A (ja) 2007-04-02 2008-10-23 Sumitomo Electric Ind Ltd 熱伝導性接着剤及びそれを用いた放熱モジュール、電力変換装置
JP2008258245A (ja) 2007-04-02 2008-10-23 Mitsui Chemicals Inc 有機トランジスタ
JPWO2008146400A1 (ja) * 2007-05-25 2010-08-19 帝人株式会社 樹脂組成物
JP2012025785A (ja) * 2008-10-20 2012-02-09 Teijin Ltd 熱伝導性に優れたプリプレグ、プリプレグの製造方法、および積層板
JP2011037918A (ja) * 2009-08-06 2011-02-24 Teijin Ltd 機械特性に優れたゴム組成物及びその製造方法
JP2011241279A (ja) 2010-05-17 2011-12-01 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物並びにプリプレグ、積層板及び配線板
JP2012238820A (ja) * 2011-05-13 2012-12-06 Nitto Denko Corp 熱伝導性シート、絶縁シートおよび放熱部材
US20120328811A1 (en) * 2011-06-24 2012-12-27 Air Products And Chemicals, Inc. Epoxy Resin Compositions
JP5664563B2 (ja) 2012-01-23 2015-02-04 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
US8840803B2 (en) * 2012-02-02 2014-09-23 Baker Hughes Incorporated Thermally conductive nanocomposition and method of making the same
CN104364900A (zh) * 2012-04-17 2015-02-18 莫门蒂夫性能材料股份有限公司 用于减少成型周期时间的导热聚合物组合物
US8946333B2 (en) * 2012-09-19 2015-02-03 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US20140080954A1 (en) * 2012-09-19 2014-03-20 Chandrashekar Raman Methods for making thermally conductve compositions containing boron nitride
EP2897995B1 (en) * 2012-09-19 2019-03-20 Momentive Performance Materials Inc. Masterbatch comprising boron nitride, composite powders thereof, and compositions and articles comprising such materials
JP2017510540A (ja) * 2014-01-06 2017-04-13 モーメンティブ・パフォーマンス・マテリアルズ・インク 高アスペクト窒化ホウ素、方法、およびそれを含有する組成物
WO2015167950A1 (en) * 2014-04-30 2015-11-05 Rogers Corporation Thermally conductive composites and methods of manufacture thereof, and articles containing the composites
CN103980664B (zh) * 2014-05-15 2016-01-20 西安科技大学 一种具有低介电常数和低损耗的聚合物电介质及其制备方法
KR102606624B1 (ko) * 2015-11-19 2023-11-27 세키스이가가쿠 고교가부시키가이샤 열경화성 재료 및 경화물

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008123326A1 (ja) * 2007-03-23 2008-10-16 Teijin Limited 熱硬化性樹脂複合組成物、樹脂成形体およびその製造方法
CN104870557A (zh) * 2012-12-12 2015-08-26 Lg伊诺特有限公司 环氧树脂组合物以及印刷电路板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
周文英著.《导热高分子材料》.《导热高分子材料》.国防工业出版社,2014,(第1版), *

Also Published As

Publication number Publication date
US11866635B2 (en) 2024-01-09
EP3378899A1 (en) 2018-09-26
JPWO2017086226A1 (ja) 2017-11-16
TWI783916B (zh) 2022-11-21
KR20180084631A (ko) 2018-07-25
JP6835685B2 (ja) 2021-02-24
JP2017218598A (ja) 2017-12-14
TW201728665A (zh) 2017-08-16
JP6212660B1 (ja) 2017-10-11
EP3378899A4 (en) 2019-06-26
CN107614619A (zh) 2018-01-19
US20180298263A1 (en) 2018-10-18
EP3378899B1 (en) 2021-09-29
WO2017086226A1 (ja) 2017-05-26
KR102606624B1 (ko) 2023-11-27

Similar Documents

Publication Publication Date Title
KR102606624B1 (ko) 열경화성 재료 및 경화물
CN110198990B (zh) 树脂材料和叠层体
JP6683485B2 (ja) 窒化ホウ素ナノチューブ材料及び熱硬化性材料
JP6709041B2 (ja) 熱硬化性材料
CN102113065A (zh) 绝缘片以及叠层结构体
CN109415570B (zh) 树脂材料和叠层体
JP2022048175A (ja) 樹脂材料及び積層体
JP2022180564A (ja) 熱硬化性シート及び硬化シートの製造方法
JP2013143440A (ja) 金属ベース基板
CN113059875B (zh) 叠层体
JPWO2018139642A1 (ja) 樹脂材料及び積層体
JP6560599B2 (ja) 熱硬化性シート、硬化物シート及び積層体
JP6581481B2 (ja) 窒化ホウ素ナノチューブ及び熱硬化性材料
JP6606410B2 (ja) 積層体
JP2018188350A (ja) 窒化ホウ素粒子の凝集体及び熱硬化性材料
JP6815732B2 (ja) 窒化ホウ素構造体、樹脂材料及び熱硬化性材料
JP2017095293A (ja) 窒化ホウ素ナノチューブ及び熱硬化性材料
JP2017128662A (ja) 複合フィラー及び熱硬化性材料
JP7036983B2 (ja) 樹脂材料及び積層体
JPWO2018139643A1 (ja) 樹脂材料及び積層体
JP2018082165A (ja) 硬化性材料及び積層体
JP2018082164A (ja) 硬化性材料及び積層体
JP7150598B2 (ja) 樹脂材料及び積層体
JP2018080326A (ja) 硬化性材料及び積層体

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TG01 Patent term adjustment

Free format text: NEW EXPIRY DATE: 20370629

TG01 Patent term adjustment