JP2017218598A - 熱硬化性材料及び硬化物 - Google Patents
熱硬化性材料及び硬化物 Download PDFInfo
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- JP2017218598A JP2017218598A JP2017161882A JP2017161882A JP2017218598A JP 2017218598 A JP2017218598 A JP 2017218598A JP 2017161882 A JP2017161882 A JP 2017161882A JP 2017161882 A JP2017161882 A JP 2017161882A JP 2017218598 A JP2017218598 A JP 2017218598A
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- Prior art keywords
- thermosetting
- boron nitride
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- skeleton
- thermosetting material
- Prior art date
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- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 192
- 239000000463 material Substances 0.000 title claims abstract description 97
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 94
- 239000000945 filler Substances 0.000 claims abstract description 90
- 150000001875 compounds Chemical class 0.000 claims abstract description 85
- 239000002071 nanotube Substances 0.000 claims abstract description 57
- 229910052582 BN Inorganic materials 0.000 claims abstract description 52
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 38
- 239000002245 particle Substances 0.000 claims description 25
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 8
- 239000000395 magnesium oxide Substances 0.000 claims description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 6
- 239000011787 zinc oxide Substances 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 4
- 239000001095 magnesium carbonate Substances 0.000 claims description 4
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 4
- 235000014380 magnesium carbonate Nutrition 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
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Abstract
Description
(A)熱硬化性化合物としては、スチレン化合物、フェノキシ化合物、オキセタン化合物、エポキシ化合物、エピスルフィド化合物、(メタ)アクリル化合物、フェノール化合物、アミノ化合物、不飽和ポリエステル化合物、ポリウレタン化合物、シリコーン化合物及びポリイミド化合物等が挙げられる。(A)熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。
(A1)熱硬化性化合物としては、環状エーテル基を有する熱硬化性化合物が挙げられる。上記環状エーテル基としては、エポキシ基及びオキセタニル基等が挙げられる。上記環状エーテル基を有する熱硬化性化合物は、エポキシ基又はオキセタニル基を有する熱硬化性化合物であることが好ましい。(A1)熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。
(A2)熱硬化性化合物は、分子量が10000以上である熱硬化性化合物である。(A2)熱硬化性化合物の分子量は10000以上であるので、(A2)熱硬化性化合物は一般にポリマーであり、上記分子量は、一般に重量平均分子量を意味する。
(B)熱硬化剤は特に限定されない。(B)熱硬化剤として、(A)熱硬化性化合物を硬化させることができる適宜の熱硬化剤を用いることができる。また、本明細書において、(B)熱硬化剤には、硬化触媒が含まれる。(B)熱硬化剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。
(C)窒化ホウ素ナノチューブは、ナノチューブである。(C)窒化ホウ素ナノチューブの材質は、窒化ホウ素である。(C)窒化ホウ素ナノチューブの形状は、チューブ状である。理想的な形状としては、6角網目の面がチューブ軸に平行に管を形成し、単管又は多重管になっている形状である。
(D)絶縁性フィラーは絶縁性を有する。(D)絶縁性フィラーは、有機フィラーであってもよく、無機フィラーであってもよい。放熱性を効果的に高める観点からは、(D)絶縁性フィラーは、無機フィラーであることが好ましい。放熱性を効果的に高める観点から、(D)絶縁性フィラーは、10W/m・K以上の熱伝導率を有することが好ましい。(D)絶縁性フィラーは、1種のみが用いられてもよく、2種以上が併用されてもよい。なお、絶縁性とは、フィラーの体積抵抗率が106Ω・cm以上であることを意味する。
上記熱硬化性材料は、上述した成分の他に、分散剤、キレート剤、酸化防止剤等の熱硬化性組成物及び熱硬化性シートに一般に用いられる他の成分を含んでいてもよい。
熱硬化性材料は、熱硬化性ペーストであってもよく、熱硬化性シートであってもよい。
窒化ホウ素製のるつぼに、2:1:1のモル比でホウ素、酸化マグネシウム及び酸化鉄を入れ、るつぼを高周波誘導加熱炉で1300℃に加熱した(加熱工程1)。生成物にアンモニアガスを導入して、1200℃で2時間加熱した(加熱工程2)。得られた白色固体を濃塩酸で洗浄し、イオン交換水で中性になるまで洗浄した後、乾燥させ、窒化ホウ素ナノチューブ(BNNT)(A)を得た。得られたBNNTでは、平均直径が15nm、平均長さが50μmであった。
ポリマーとしてビスフェノールA型フェノキシ樹脂50重量部と、エポキシ樹脂としてビスフェノールA型エポキシ樹脂30重量部と、硬化剤として脂環式骨格酸無水物(新日本理化社製「リカシッドMH−700」)及びジシアンジアミドとを合計で15重量部と、添加剤としてエポキシシランカップリング剤5重量部とを配合してマトリックス樹脂を作製した。マトリックス樹脂に、窒化ホウ素ナノチューブ、及び絶縁性フィラーを下記表1に示す配合比(単位は体積%)で添加し、ホモディスパー型攪拌機で混練して、ペースト(熱硬化性材料)を得た。
(1)熱伝導率の測定
熱硬化性シートを120℃のオーブン内で1時間、その後200℃のオーブン内で1時間加温処理し、熱硬化性シートを硬化させて、硬化物シートを得た。硬化物シートの熱伝導率を、京都電子工業社製熱伝導率計「迅速熱伝導率計QTM−500」を用いて測定した。また、比較例1の硬化物シートの熱伝導率を同様にして測定した。比較例1の熱伝導率を1.0として、その他の実施例及び比較例の硬化物シートの熱伝導率を比較した。各実施例及び比較例(比較例1を除く)における熱伝導率の比較例1における熱伝導率に対する比(熱伝導率比)を求めた。
熱硬化性シートを厚み1.5mmのアルミニウム板と厚み35μmの電解銅箔との間に挟み、真空プレス機で4MPaの圧力を保持しながら120℃で1時間、更に200℃で1時間、熱硬化性シートをプレス硬化させ、銅張り積層板を作製した。得られた銅張り積層板を用いて、3点支点法により曲げ試験を実施した。試験片を1秒間に1回、深さ20μm曲げる条件で1000サイクル実施し、硬化物シートが基板から剥がれているか否かを以下の基準で判定した。
○○:面積の5%未満で剥離の発生
○:面積の5%以上、10%未満で剥離の発生
△:面積の10%以上、20%未満で剥離の発生
×:面積の20%以上で剥離の発生
11…硬化物部(熱硬化性成分の硬化物部)
12…窒化ホウ素ナノチューブ
13…絶縁性フィラー
Claims (11)
- 熱硬化性化合物と、
熱硬化剤と、
窒化ホウ素ナノチューブと、
ナノチューブではない絶縁性フィラーとを含む、熱硬化性材料。 - 前記絶縁性フィラーが、10W/m・K以上の熱伝導率を有する、請求項1に記載の熱硬化性材料。
- 熱硬化性材料100体積%中、前記窒化ホウ素ナノチューブの含有量が0.1体積%以上、40体積%以下である、請求項1又は2に記載の熱硬化性材料。
- 熱硬化性材料100体積%中、前記絶縁性フィラーの含有量が25体積%以上、90体積%以下である、請求項1〜3のいずれか1項に記載の熱硬化性材料。
- 熱硬化性材料100体積%中での前記窒化ホウ素ナノチューブの含有量の、熱硬化性材料100体積%中での前記絶縁性フィラーの含有量に対する比が、0.001以上、1.6以下である、請求項1〜4のいずれか1項に記載の熱硬化性材料。
- 前記窒化ホウ素ナノチューブの平均直径が2nm以上、300nm以下であり、
前記窒化ホウ素ナノチューブの平均長さが1μm以上、200μm以下である、請求項1〜5のいずれか1項に記載の熱硬化性材料。 - 前記絶縁性フィラーの平均粒子径が1μm以上、100μm以下である、請求項1〜6のいずれか1項に記載の熱硬化性材料。
- 前記窒化ホウ素ナノチューブの平均長さの、前記絶縁性フィラーの平均粒子径に対する比が、0.01以上、200以下である、請求項1〜7のいずれか1項に記載の熱硬化性材料。
- 前記絶縁性フィラーの材質が、アルミナ、合成マグネサイト、窒化ホウ素、窒化アルミニウム、窒化ケイ素、炭化ケイ素、酸化亜鉛又は酸化マグネシウムである、請求項1〜8のいずれか1項に記載の熱硬化性材料。
- 熱硬化性シートである、請求項1〜9のいずれか1項に記載の熱硬化性材料。
- 請求項1〜10のいずれか1項に記載の熱硬化性材料の硬化物。
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KR102606624B1 (ko) * | 2015-11-19 | 2023-11-27 | 세키스이가가쿠 고교가부시키가이샤 | 열경화성 재료 및 경화물 |
JP6560599B2 (ja) * | 2015-11-19 | 2019-08-14 | 積水化学工業株式会社 | 熱硬化性シート、硬化物シート及び積層体 |
US10246623B2 (en) * | 2016-09-21 | 2019-04-02 | NAiEEL Technology | Resin composition, article prepared by using the same, and method of preparing the same |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008123326A1 (ja) * | 2007-03-23 | 2008-10-16 | Teijin Limited | 熱硬化性樹脂複合組成物、樹脂成形体およびその製造方法 |
JP2011037918A (ja) * | 2009-08-06 | 2011-02-24 | Teijin Ltd | 機械特性に優れたゴム組成物及びその製造方法 |
JP6212660B1 (ja) * | 2015-11-19 | 2017-10-11 | 積水化学工業株式会社 | 熱硬化性材料及び硬化物 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2830301B2 (ja) * | 1990-02-15 | 1998-12-02 | 株式会社明電舎 | アルミナ充填樹脂硬化物 |
US6048919A (en) * | 1999-01-29 | 2000-04-11 | Chip Coolers, Inc. | Thermally conductive composite material |
US20070241303A1 (en) * | 1999-08-31 | 2007-10-18 | General Electric Company | Thermally conductive composition and method for preparing the same |
CN1927988A (zh) * | 2005-09-05 | 2007-03-14 | 鸿富锦精密工业(深圳)有限公司 | 热界面材料及其制备方法 |
JP2008258254A (ja) | 2007-04-02 | 2008-10-23 | Sumitomo Electric Ind Ltd | 熱伝導性接着剤及びそれを用いた放熱モジュール、電力変換装置 |
JP2008258245A (ja) | 2007-04-02 | 2008-10-23 | Mitsui Chemicals Inc | 有機トランジスタ |
KR101422315B1 (ko) * | 2007-05-25 | 2014-07-22 | 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 | 수지 조성물 |
JP2012025785A (ja) * | 2008-10-20 | 2012-02-09 | Teijin Ltd | 熱伝導性に優れたプリプレグ、プリプレグの製造方法、および積層板 |
JP2011241279A (ja) | 2010-05-17 | 2011-12-01 | Shin Kobe Electric Mach Co Ltd | エポキシ樹脂組成物並びにプリプレグ、積層板及び配線板 |
JP2012238820A (ja) * | 2011-05-13 | 2012-12-06 | Nitto Denko Corp | 熱伝導性シート、絶縁シートおよび放熱部材 |
US20120328811A1 (en) * | 2011-06-24 | 2012-12-27 | Air Products And Chemicals, Inc. | Epoxy Resin Compositions |
JP5664563B2 (ja) | 2012-01-23 | 2015-02-04 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
US8840803B2 (en) * | 2012-02-02 | 2014-09-23 | Baker Hughes Incorporated | Thermally conductive nanocomposition and method of making the same |
WO2013158741A1 (en) * | 2012-04-17 | 2013-10-24 | Momentive Performance Materials Inc | Thermally conductive polymer compostions to reduce molding cycle time |
US8946333B2 (en) * | 2012-09-19 | 2015-02-03 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
US20150274930A1 (en) * | 2012-09-19 | 2015-10-01 | Momentive Performance Materials Inc. | Masterbatch comprising boron nitride, composite powders thereof, and compositions and articles comprising such materials |
US20140080954A1 (en) * | 2012-09-19 | 2014-03-20 | Chandrashekar Raman | Methods for making thermally conductve compositions containing boron nitride |
KR101984791B1 (ko) | 2012-12-12 | 2019-09-03 | 엘지이노텍 주식회사 | 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판 |
JP2017510540A (ja) * | 2014-01-06 | 2017-04-13 | モーメンティブ・パフォーマンス・マテリアルズ・インク | 高アスペクト窒化ホウ素、方法、およびそれを含有する組成物 |
KR20170002465A (ko) * | 2014-04-30 | 2017-01-06 | 로저스코포레이션 | 열전도성 복합체, 이의 제조 방법, 및 상기 복합체를 함유하는 물품 |
CN103980664B (zh) * | 2014-05-15 | 2016-01-20 | 西安科技大学 | 一种具有低介电常数和低损耗的聚合物电介质及其制备方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008123326A1 (ja) * | 2007-03-23 | 2008-10-16 | Teijin Limited | 熱硬化性樹脂複合組成物、樹脂成形体およびその製造方法 |
JP2011037918A (ja) * | 2009-08-06 | 2011-02-24 | Teijin Ltd | 機械特性に優れたゴム組成物及びその製造方法 |
JP6212660B1 (ja) * | 2015-11-19 | 2017-10-11 | 積水化学工業株式会社 | 熱硬化性材料及び硬化物 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7509293B2 (ja) | 2019-09-26 | 2024-07-02 | 日本ゼオン株式会社 | 熱伝導シート |
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