CN107574411B - 蒸镀装置及蒸发源 - Google Patents

蒸镀装置及蒸发源 Download PDF

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Publication number
CN107574411B
CN107574411B CN201710539978.9A CN201710539978A CN107574411B CN 107574411 B CN107574411 B CN 107574411B CN 201710539978 A CN201710539978 A CN 201710539978A CN 107574411 B CN107574411 B CN 107574411B
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China
Prior art keywords
container
evaporation
opening end
evaporation port
face
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CN201710539978.9A
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English (en)
Chinese (zh)
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CN107574411A (zh
Inventor
田村博之
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Canon Tokki Corp
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Canon Tokki Corp
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Priority to CN202110723236.8A priority Critical patent/CN113416930A/zh
Publication of CN107574411A publication Critical patent/CN107574411A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225—Oblique incidence of vaporised material on substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN201710539978.9A 2016-07-05 2017-07-05 蒸镀装置及蒸发源 Active CN107574411B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110723236.8A CN113416930A (zh) 2016-07-05 2017-07-05 蒸发源及成膜装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016133685A JP6641242B2 (ja) 2016-07-05 2016-07-05 蒸着装置及び蒸発源
JP2016-133685 2016-07-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202110723236.8A Division CN113416930A (zh) 2016-07-05 2017-07-05 蒸发源及成膜装置

Publications (2)

Publication Number Publication Date
CN107574411A CN107574411A (zh) 2018-01-12
CN107574411B true CN107574411B (zh) 2021-06-29

Family

ID=60948366

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202110723236.8A Pending CN113416930A (zh) 2016-07-05 2017-07-05 蒸发源及成膜装置
CN201710539978.9A Active CN107574411B (zh) 2016-07-05 2017-07-05 蒸镀装置及蒸发源

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202110723236.8A Pending CN113416930A (zh) 2016-07-05 2017-07-05 蒸发源及成膜装置

Country Status (3)

Country Link
JP (1) JP6641242B2 (enExample)
KR (3) KR102182869B1 (enExample)
CN (2) CN113416930A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6686069B2 (ja) * 2018-05-29 2020-04-22 キヤノントッキ株式会社 蒸発源装置、蒸着装置、および蒸着システム
JP7179635B2 (ja) * 2019-02-12 2022-11-29 株式会社アルバック 蒸着源、真空処理装置、及び蒸着方法
KR102696209B1 (ko) * 2019-03-20 2024-08-20 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 처리 용기, 반사체 및 반도체 장치의 제조 방법
KR102776948B1 (ko) * 2019-11-20 2025-03-05 캐논 톡키 가부시키가이샤 성막 장치, 이를 사용한 성막 방법 및 전자 디바이스 제조 방법
CN111378933B (zh) * 2020-04-27 2022-04-26 京东方科技集团股份有限公司 蒸发源、蒸发源系统
JP7242626B2 (ja) * 2020-12-10 2023-03-20 キヤノントッキ株式会社 成膜装置
KR102569078B1 (ko) 2021-07-09 2023-08-23 주식회사 엘지에너지솔루션 전극 조립체 제조 방법
KR102806817B1 (ko) 2021-07-15 2025-05-12 캐논 톡키 가부시키가이샤 성막 장치, 성막 방법 및 증발원 유닛
JP7291197B2 (ja) * 2021-07-15 2023-06-14 キヤノントッキ株式会社 成膜装置、成膜方法及び蒸発源ユニット
JP7372288B2 (ja) 2021-07-15 2023-10-31 キヤノントッキ株式会社 成膜装置、成膜方法及び蒸発源
JP7509809B2 (ja) 2022-01-28 2024-07-02 キヤノントッキ株式会社 蒸発源ユニット、成膜装置及び成膜方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004169066A (ja) * 2002-11-18 2004-06-17 Sony Corp 蒸着装置
KR100687007B1 (ko) * 2005-03-22 2007-02-26 세메스 주식회사 유기전계 발광 소자 제조에 사용되는 유기 박박 증착 장치
JP2010195034A (ja) * 2009-02-02 2010-09-09 Ricoh Co Ltd インクジェット記録装置
KR20120061394A (ko) * 2010-12-03 2012-06-13 삼성모바일디스플레이주식회사 증발원 및 유기물 증착 방법
KR20130073407A (ko) * 2011-12-23 2013-07-03 주식회사 원익아이피에스 외부 가열용기를 포함하는 고온 증발원
WO2014020914A1 (ja) * 2012-08-02 2014-02-06 パナソニック株式会社 有機ｅｌ表示パネルとその製造方法
KR102046440B1 (ko) * 2012-10-09 2019-11-20 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조방법
KR102046441B1 (ko) * 2012-10-12 2019-11-20 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조방법
CN104099570B (zh) * 2013-04-01 2016-10-05 上海和辉光电有限公司 单点线性蒸发源系统
CN104099571A (zh) * 2013-04-01 2014-10-15 上海和辉光电有限公司 蒸发源组件和薄膜沉积装置和薄膜沉积方法
KR101599505B1 (ko) * 2014-01-07 2016-03-03 주식회사 선익시스템 증착장치용 증발원
CN105177507B (zh) * 2015-09-08 2017-08-11 京东方科技集团股份有限公司 蒸镀坩埚及蒸镀设备

Also Published As

Publication number Publication date
KR20210090600A (ko) 2021-07-20
KR20180005129A (ko) 2018-01-15
KR102279411B1 (ko) 2021-07-19
CN113416930A (zh) 2021-09-21
JP6641242B2 (ja) 2020-02-05
KR20200132814A (ko) 2020-11-25
CN107574411A (zh) 2018-01-12
JP2018003122A (ja) 2018-01-11
KR102458193B1 (ko) 2022-10-25
KR102182869B1 (ko) 2020-11-25

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