CN107548346A - 通过气溶胶的飞行中固化制造三维结构 - Google Patents

通过气溶胶的飞行中固化制造三维结构 Download PDF

Info

Publication number
CN107548346A
CN107548346A CN201680020145.5A CN201680020145A CN107548346A CN 107548346 A CN107548346 A CN 107548346A CN 201680020145 A CN201680020145 A CN 201680020145A CN 107548346 A CN107548346 A CN 107548346A
Authority
CN
China
Prior art keywords
aerosol drops
aerosol
methods described
drops
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201680020145.5A
Other languages
English (en)
Other versions
CN107548346B (zh
Inventor
迈克尔·J·雷恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Optomec Inc
Original Assignee
Optomec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optomec Inc filed Critical Optomec Inc
Publication of CN107548346A publication Critical patent/CN107548346A/zh
Application granted granted Critical
Publication of CN107548346B publication Critical patent/CN107548346B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/141Processes of additive manufacturing using only solid materials
    • B29C64/153Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/159Processes of additive manufacturing using only gaseous substances, e.g. vapour deposition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/165Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/245Platforms or substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264Arrangements for irradiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • B29C64/393Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00Materials specially adapted for additive manufacturing
    • B33Y70/10Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205Means for applying layers
    • B29C64/209Heads; Nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0058Liquid or visquous
    • B29K2105/0061Gel or sol
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/16Fillers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2509/00Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
    • B29K2509/02Ceramics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling
    • B33Y40/20Post-treatment, e.g. curing, coating or polishing
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/64Nanometer sized, i.e. from 1-100 nanometer

Abstract

一种用于制造三维结构的方法。飞行中加热或UV照射在气溶胶滴被喷射到目标表面上时改变所述气溶胶滴的性质。UV光至少部分地将光聚合物滴固化,或者备选地造成基于溶剂的纳米颗粒分散体的微滴在飞行中快速地干燥,并且导致的气溶胶滴增加的粘度促进独立式三维结构的形成。该3D制造可以使用各种各样的光聚合物、纳米颗粒分散体和复合材料进行。得到的3D形状可以是独立式的,没用支撑体的情况下制造的,并且可以通过相对于目标衬底操作打印喷嘴获得任意形状。

Description

通过气溶胶的飞行中固化制造三维结构
相关申请的交叉引用
本申请要求2015年2月10日提交的名称为“微3D打印”的美国临时专利申请序列号62/114,354的优先权和提交利益,并且其说明书和权利要求通过引用并入本文。
发明背景
发明领域(技术领域)
本发明涉及通过气溶胶喷射的纳米颗粒和聚合物墨水的飞行中固化制造3D电气和机械结构、微结构和纳米结构。
背景技术
注意,以下讨论可以参考大量的出版物和参考文献。本文中这种出版物的讨论被给出用于科学原理的更完整背景,而不被解释为承认这种出版物是用于可专利性确定目的的现有技术。
三维打印是迅速进展的技术,其有希望引起增材制造革命。利用3D打印,多种结构材料如塑料盒金属可以制造成网状结构而不需要减材加工或刻蚀步骤。几乎不存在材料浪费,并且减少的加工步骤有希望使3D打印成为成本效益好的绿色技术。现今,数种3D打印技术是当前可用的,并且简要地将这些技术与本发明进行比较是有用的。
立体平版印刷术是一种增材制造工艺,其通过将紫外(UV)激光聚焦到一桶光聚合物树脂上工作。在计算机辅助制造或计算机辅助设计(CAM/CAD)软件的帮助下,使用UV激光将预先程序化的设计或形状刻画到光聚合物桶的表面上。因为光聚合物在紫外光下是光敏的,所以照射的树脂凝固并且形成单层的所需3D物体。对于设计的每层重复该过程直到3D物体完整。50-150um的层分辨率一般伴随接近10um的横向尺寸。该过程通常限于光聚合物材料,并且需要牺牲结构支撑悬伸物。
喷墨技术一般用于以2D方式打印石墨和颜料墨水。近期的材料创新使得喷墨打印机能够喷射聚合物和金属纳米颗粒墨水。通常,喷墨打印中使用的墨水必须具有较低的粘度,意味着墨水在打印后将会充分地铺展,从而限制所打印的特征的最小特征尺寸和高宽比。喷墨器不接触衬底,但是其非常接近(小于mm)。
挤出技术对于热塑性聚合物的3D打印是普遍的。在该情况下,将热塑料在喷嘴中加热至熔融点并挤出到衬底上。塑料在接触衬底时快速冷却和凝固,并且可以维持三维形状。3D部件一般逐层制造,每层都由挤出丝线的线栅图样构成。悬伸物可以通过挤出牺牲性支撑材料和之后的溶解或机械地移除支撑结构来制造。一般地,特征尺寸是几百微米,并且材料很大程度限于热塑性塑料和少数热固性聚合物以及导电浆料。nScrypt工具能够通过对喷嘴定位的自动的CAD/CAM控制来在3D表面上打印。
发明概述(发明内容)
本发明是用于在衬底上制造三维结构的方法,所述方法包括将气溶胶滴从沉积头朝向所述衬底推进,在飞行中部分地改变所述气溶胶滴的性质,以及在所述气溶胶滴已经沉积作为所述三维结构的一部分后,完全地改变所述气溶胶滴的所述性质。改变性质任选地包括使用电磁辐射固化,例如紫外(UV)光固化,或者凝固。在该实施方案中,气溶胶滴优选地包含可光固化的聚合物,并且所制造的三维结构包含固化的聚合物。所述气溶胶滴任选地包含分散于所述可光固化的聚合物中的固体颗粒,并且所制造的三维结构包含固化的聚合物,所述固化的聚合物包含包埋的固体颗粒。所述固体颗粒任选地包括陶瓷、金属、纤维或硅。在另一实施方案中,所述气溶胶滴包含溶剂,并且改变性质包括蒸发所述溶剂。这些气溶胶滴任选地包含金属纳米颗粒,在这种情况下所述方法优选地还包括用UV辐射照射所述气溶胶滴,加热所述金属纳米颗粒,以及充分加热所述气溶胶滴以至少部分地蒸发所述溶剂。所述方法优选地还包括在所述金属纳米颗粒已经沉积后继续照射所述金属纳米颗粒,由此至少部分地烧结所述金属纳米颗粒。
所述方法任选地包括使所述沉积头相对于所述衬底倾斜或平移。所述方法任选地包括在不需要牺牲性支撑体或者倾斜所述沉积头或所述衬底的情况下制造悬伸的结构。所述沉积头和所述衬底之间的相隔距离优选为至少1mm,并且更优选至少2mm。所述方法优选地包括在飞行中增加所述气溶胶滴的粘度,并且优选地包括在飞行中和在所述气溶胶滴已经沉积后用电磁辐射照射所述气溶胶滴,任选地在飞行中从多于一个方向。所述方法任选地包括在飞行中和在所述气溶胶滴已经沉积后用电磁辐射加热所述气溶胶滴。所制造的三维结构任选地包括选自由以下各项组成的组中的结构:微米尺寸表面纹理、机械插入物(mechanical interposer)、精确间隔物、包含包埋的电连接器的机械插入物、封闭的中空结构、机械支架(scaffold)和功能性电线。
本发明的目的/优点和新特征以及实用性的其他范围将结合附图在以下详细描述中部分地阐明,并且在查阅以下内容后对于本领域技术人员将部分地变得明显,或者可以通过本发明的实践学习。本发明的目的和优点可以凭借所附权利要求中具体指出的手段和组合而实现和获得。
附图简述
并入到说明书并形成说明书一部分的附图说明本发明的数个实施方案,并连同说明书用于解释本发明的原理。附图仅为了说明本发明的优选实施方案,而不解释为限制本发明。在附图中:
图1是说明利用气溶胶射流三维打印的机理的示意图。
图2A-2C是根据本发明的一个实施方案打印的聚合物柱的阵列的图像。图2D是示出柱构建速率的图表。
图3是复合材料柱的阵列的图像。
图4A和4B分别是根据本发明的一个实施方案打印的插入物的立体图和顶视图。
图5A示出使用图1中所示的偏移法打印的三维千斤顶状(jack-like)结构。图5B示出开口锥体结构。
图6A和6B示出具有沿长度的开放内部的闭合通道。图6C示出在通道的内侧流动的墨水。
图7A和7B分别示出具有L形打印柱的单个天线和天线的阵列。图7C和7D是在微芯片上打印的3D电气部件的图像。
图8A示出通过在打印期间倾斜打印头制造的独立式聚合物弹簧。图8B示出支撑质量的弹簧。
图9A是示出银纳米颗粒的光密度的图表。图9B示出利用原位照射法打印的3D银线阵列。
图10A-10F是使用UV聚合物和飞行中固化打印的多种3D形状的图像。
发明的实施方案的详述
本发明是制作三维结构如包括高高宽比特征的结构的方法,其使用气溶胶和墨水的飞行中固化和液体材料的直接打印制造三维独立式复杂结构。具体地,本发明的实施方案将获得专利的Aerosol Jet分散技术,如美国专利第7,674,671、7,938,079和7,987,813中描述的技术,与使得液滴能够在沉积在表面上前部分地凝固的飞行中材料加工机理组合。在飞行中加工后,微滴可以沉积以形成独立式结构。该方法的一部分优点包括超高分辨率三维(3D)打印,具有低至10微米的特征尺寸、达1微米的横向特征分辨率、和达100nm的垂直分辨率。独立式结构的高宽比可以大于100,并且结构可以通过操作打印头相对于那些表面的倾斜和位置打印在几乎任何表面和表面几何形状上。可以直接打印悬伸物和闭合的室,而无需使用牺牲性支撑材料。可以加工金属和绝缘材料两者,这使得用于制造电路的电子材料能够以3D的方式共沉积。此外,可以打印复合材料,这允许调整3D结构的力学和电学性质。紫外(UV)聚合物可以在它们影响目标时在飞行中固化,而且低的烧结温度使得塑料能够金属化。使用Aerosol Jet工艺,实际上可以打印任何类型的材料和/或溶剂。对于该工艺来说,与衬底大的间隔(一般几毫米)使得能够高高宽比打印而无需任何z轴移动。气溶胶射流的低于10微米聚焦使得能够建立超精细特征。
Aerosol Jet打印是非接触的基于气溶胶的喷射技术。起始墨水配制为具有低粘度(0.5至1000cP),并且在一般工艺中它们首先雾化成1-5um直径微滴的细微滴分散体。优选地,氮气带走微滴并且推进它们穿过细喷嘴(0.1-1mm内径)到用于沉积的目标衬底。同向流动,优选氮鞘气体使微滴射流聚焦低至10um直径,这允许打印该尺寸的特征。喷射技术以喷嘴和衬底之间大的相隔距离(几mm)、高分辨率(特征宽度10um)、体积分散准确度(10飞升(femptoliter))和宽范围的材料相容性而著称。由于大的相隔距离,在微滴飞行至衬底期间将微滴干燥和/或否则固化是可能的。在这样做时,微滴的粘度可以增加到远超过起始粘度。由于较高的粘度,打印的墨水是自支撑的,并且可以被构建成独立式柱和其他高高宽比特征。为了增加粘度,优选地将来自灯或UV LED的UV光施加到喷嘴出口和目标衬底之间的间隙区域,如图1中所示。如果起始墨水包含具有与UV发射光谱重叠的吸收带的光聚合物,则UV光可以在飞行中完全地或者部分地固化光聚合物滴,从而增加粘度。
图1是说明利用气溶胶射流三维打印的机理的示意图。微3D结构优选通过使用Aerosol Jet相容的低粘度可光固化树脂制造,其优选地使用Aerosol Jet技术打印。电磁辐射,在该情况下为紫外光,照射并且在飞行途中部分地固化微滴。部分固化增加微滴的粘度,这进而限制沉积物在衬底上的铺展。微滴在目标衬底上合并,然后完全固化。上示意图示出垂直堆叠的微滴。下示意图示出当衬底在打印头下方平移时构建悬伸结构的微滴。已经验证了高达45度的悬伸物,尽管可以实现甚至更大的角度。
图2A是利用Loctite 3104丙烯酸氨基甲酸酯和同时的UV LED固化打印的垂直聚合物柱的照片。入射UV功率是0.65mW,UV波长是385nm,并且体积打印速率是7.5nL/s。柱可以从目标衬底基本上延伸至气溶胶喷射喷嘴出口。图2B是柱阵列的放大图像;柱高度是1.0mm,高度变化率是1%,间隔是0.5mm,并且直径是90μm。图2C是柱阵列的上表面的图像。每个柱的顶部都具有圆形的几乎半球状的形状。图2D是示出所测量的单柱建造速率的图表。发现当打印喷嘴在给定位置固定时,柱高度与时间成比例。高度的变化率是约1%,或者备选地对于1.0mm高的柱是约10μm。
当固体颗粒如陶瓷、金属或纤维分散于光聚合物墨水中时,飞行中加工也是可能的。在该情况下,固化的光聚合物用作用于固体颗粒的3D机械支撑体。该复合材料的力学和电学性质可以通过例如提供耐磨损性以及形成3D导电体来优化。图3是复合材料柱的阵列的图像。将具有小于500nm的粒度的硅粉以7体积%的浓度分散于UV光聚合物树脂中。然后将复合分散体打印并且在飞行中固化以产生具有包埋的硅的固化的树脂的固体柱。柱直径是120μm,并且高度是1.1mm。复合材料对于优化3D结构的力学和电学性质是理想的。在该实例中,组合物材料对UV光是充分透明的,使得其甚至利用单侧UV照射也完全固化。在更大的浓度和在高吸收颗粒的情况下,复合树脂可能对入射光不透明。在该情况下,可能必须从相反的侧面照射打印区域,或者用环形灯照射沉积物。只要UV树脂在3D结构的外表面附近固化,充足的机械支撑体就会允许垂直地构建结构。可以任选地在后处理步骤中移除光聚合物,如通过将3D结构加热至超过光聚合物的蒸发或分解点。
图4示出打印的机械插入物的图像,所述机械插入物是提供两个分开的部件之间的结构支撑和精确间隔的元件。通过堆叠多层UV树脂打印插入物,如在图4A的立体图中可以看到的。图4B示出上表面网格图样。在一些实施方案中,插入物可以提供一个元件与另一个之间的电气或流体线路或到另一个的连接,在这种情况下间隙空间可以用导电材料或流体填充。
图5A示出使用图1中所示的偏移法打印的三维千斤顶状结构。下部4条腿在使打印头沿x-和y-方向平移至顶点的同时打印。有角度的柱是相对于衬底约45度角。顶部腿通过使打印头平移远离顶点打印。总体高度是4mm,并且单个柱直径是60μm。图5B示出开口锥体结构。这通过使工作台以具有增加半径的重复环形移动平移来打印。如果需要,锥体可以通过继续环形移动并且减小半径至零来闭合。
图6A和6B示出具有沿长度的开放内部的闭合通道。通道的每个侧壁都通过堆叠可光固化的聚合物的线并且循序地偏移约1/2的线宽来打印。该过程导致在偏移方向以约45度倾斜的壁。通过以相反方向偏移,壁在中点处接触。图6C描绘布置在通道入口附近的有色墨水滴,看到所述有色墨水滴被表面张力拉动穿过通道。这验证了通道沿长度是封闭的但是通道从端到端是完全开放的。
图7A示出用作电子元件的机械支撑体的光固化柱。聚合物柱使用图1中的工艺制造,并且其是大约1mm高乘以0.1mm宽。银墨水通过使打印头以相对于每个45度倾斜打印到柱和衬底的侧壁上。银墨水在打印期间具有低粘度,并且因此将在衬底上稍微铺展。通过提供机械支撑体,银墨水可以沿着支撑体的表面以三维方式打印。在打印后,将银墨水在箱式烘炉中在150℃热烧结60分钟。得到的导电图样用作独立式毫米波偶极天线。图7B示出微天线的阵列。图7C和7D是在微芯片上打印的3D电气部件的图像。本发明的方法消除了否则将不得不构建到包装中的复杂的连接和波导。该实例表明,功能装置如3D电子元件(例如加热器、天线和互相连接)可以直接打印在驱动器芯片上。
图8A示出通过在打印期间倾斜打印头制造的独立式聚合物弹簧。打印头在每个弹簧的构建期间从0°倾斜至-30°并回到0°。图8B描绘表明弹簧阵列可以支撑力学质量的验证。与前述垂直柱相比,弹簧提供在两个表面之间的挠性插入物连接。
在基于溶剂的墨水如金属纳米颗粒分散体的情况下,微滴粘度可以通过在飞行期间部分地或完全地干燥微滴而增加。由于已知金属纳米颗粒对UV光高度吸收,因此将微滴暴露于UV照射将加热纳米颗粒并加速溶剂蒸发。图9示出这种将原位固化工艺扩展至非可光固化材料。图9A是示出随着粒度减小银纳米颗粒在UV波长增加的光密度(即吸收光谱)的图表。曲线在410nm附近具有强峰,但是吸收边延伸到可见光,使得飞行中加工可能利用常用的UV LED和汞灯。包含分散于溶剂中的银纳米颗粒的墨水滴由此可以通过吸收在400nm附近波长的UV光得到加热。如果在飞行中受热,则溶剂将会大量蒸发,并且在银滴影响表面时导致高度浓缩的银滴。金属纳米颗粒滴可以保持它们的3D形状,既因为载体溶剂被蒸发,也因为颗粒被部分地烧结。现在,更高粘度的银滴可以以3D方式堆叠,类似于光聚合物的堆叠。将纳米颗粒加热到超过蒸发溶剂所需水平的打印后的进一步照射将使纳米颗粒至少部分地烧结并变得导电。图9B示出利用原位照射法打印的3D银线阵列。线宽度是40μm,并且高度是0.8mm。线由于以下事实稍微弯曲:仅使用单侧照射,这造成线在照射侧被加热得更多,导致不对称收缩。
图10A-10F是使用UV聚合物和飞行中固化打印的多种3D形状的图像。图10A示出柱状物(0.1mm间距,0.25mm高)。图10B示出扭曲的片状物(0.5mm宽,2mm高)。图10C示出箱状物(1mm长,0.25mm高,0.03mm壁)。图10D示出帽状物(0.5mm直径,0.5mm高)。图10E示出锥体(0.5mm直径,0.5mm高)。图10F示出泡状物(0.5mm直径,1mm高)。
在本发明的实施方案中,UV照射正用于在气溶胶滴被喷射到目标表面上时改变所述气溶胶滴的性质。具体地,UV光至少部分地固化光聚合物滴,并且导致的增加的粘度促进独立式结构的形成。UV光备选地造成基于溶剂的纳米颗粒分散体的微滴在飞行中快速地干燥,同样地实现3D制造。该3D制造可以使用各种各样的光聚合物、纳米颗粒分散体和复合材料进行。得到的3D形状可以是独立式的,没用支撑体,并且可以通过相对于目标衬底操作打印喷嘴获得任意形状。特征尺寸主要通过喷射工艺确定,并且可以低至10μm或甚至更低。
尽管已经具体参照所公开的实施方案详细说明了本发明,但是其他实施方案可以实现相同的结果。本发明的变化和改变对于本领域技术人员将会是明显的,并且意图涵盖全部这些改变和等同方案。以上引用的所有专利和出版物的完整公开内容都通过引用并入本文。

Claims (18)

1.一种用于在衬底上制造三维结构的方法,所述方法包括:
将气溶胶滴从沉积头朝向所述衬底推进;
在飞行中部分地改变所述气溶胶滴的性质;以及
在所述气溶胶滴已经沉积作为所述三维结构的一部分后,完全地改变所述气溶胶滴的所述性质。
2.根据权利要求1所述的方法,其中改变性质包括使用电磁辐射固化或凝固。
3.根据权利要求2所述的方法,其中固化包括紫外(UV)光固化。
4.根据权利要求2所述的方法,其中所述气溶胶滴包含可光固化的聚合物,并且所制造的三维结构包含固化的聚合物。
5.根据权利要求4所述的方法,其中所述气溶胶滴包含分散于所述可光固化的聚合物中的固体颗粒,并且所制造的三维结构包含固化的聚合物,所述固化的聚合物包含包埋的固体颗粒。
6.根据权利要求5所述的方法,其中所述固体颗粒包括陶瓷、金属、纤维或硅。
7.根据权利要求1所述的方法,其中所述气溶胶滴包含溶剂,并且改变性质包括蒸发所述溶剂。
8.根据权利要求7所述的方法,其中所述气溶胶滴包含金属纳米颗粒,所述方法还包括:
用UV辐射照射所述气溶胶滴;
加热所述金属纳米颗粒;以及
充分加热所述气溶胶滴以至少部分地蒸发所述溶剂。
9.根据权利要求8所述的方法,所述方法还包括在所述金属纳米颗粒已经沉积后继续照射所述金属纳米颗粒,由此至少部分地烧结所述金属纳米颗粒。
10.根据权利要求1所述的方法,所述方法还包括使所述沉积头相对于所述衬底倾斜或平移。
11.根据权利要求1所述的方法,所述方法包括在不需要牺牲性支撑体或者倾斜所述沉积头或所述衬底的情况下制造悬伸的结构。
12.根据权利要求1所述的方法,其中所述沉积头和所述衬底之间的相隔距离是至少1mm。
13.根据权利要求12所述的方法,其中所述沉积头和所述衬底之间的相隔距离是至少2mm。
14.根据权利要求1所述的方法,所述方法包括在飞行中增加所述气溶胶滴的粘度。
15.根据权利要求1所述的方法,所述方法包括在飞行中和在所述气溶胶滴已经沉积后用电磁辐射照射所述气溶胶滴。
16.根据权利要求15所述的方法,所述方法包括在飞行中从多于一个方向用电磁辐射照射所述气溶胶滴。
17.根据权利要求1所述的方法,所述方法包括在飞行中和在所述气溶胶滴已经沉积后用电磁辐射加热所述气溶胶滴。
18.根据权利要求1所述的方法,其中所制造的三维结构包括选自由以下各项组成的组中的结构:微米尺寸表面纹理、机械插入物、精确间隔物、包含包埋的电连接器的机械插入物、封闭的中空结构、机械支架和功能性电线。
CN201680020145.5A 2015-02-10 2016-02-10 通过气溶胶的飞行中固化制造三维结构 Active CN107548346B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562114354P 2015-02-10 2015-02-10
US62/114,354 2015-02-10
PCT/US2016/017396 WO2016130709A1 (en) 2015-02-10 2016-02-10 Fabrication of three-dimensional structures by in-flight curing of aerosols

Publications (2)

Publication Number Publication Date
CN107548346A true CN107548346A (zh) 2018-01-05
CN107548346B CN107548346B (zh) 2021-01-05

Family

ID=56565648

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680020145.5A Active CN107548346B (zh) 2015-02-10 2016-02-10 通过气溶胶的飞行中固化制造三维结构

Country Status (6)

Country Link
US (1) US10994473B2 (zh)
EP (1) EP3256308B1 (zh)
KR (1) KR102444204B1 (zh)
CN (1) CN107548346B (zh)
TW (1) TWI735425B (zh)
WO (1) WO2016130709A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113316513A (zh) * 2018-12-20 2021-08-27 捷普有限公司 使用超细喷射材料增材制造的设备、系统和方法
CN113683052A (zh) * 2021-09-14 2021-11-23 深圳清华大学研究院 一种微型块移动组件及其制作方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10500784B2 (en) 2016-01-20 2019-12-10 Palo Alto Research Center Incorporated Additive deposition system and method
US10434703B2 (en) * 2016-01-20 2019-10-08 Palo Alto Research Center Incorporated Additive deposition system and method
EP3448655B1 (en) 2016-04-28 2021-09-01 Hewlett-Packard Development Company, L.P. 3-dimensional printing method and 3-dimensional printing material set
US11465341B2 (en) 2016-04-28 2022-10-11 Hewlett-Packard Development Company, L.P. 3-dimensional printed parts
BR112018015592A2 (pt) 2016-04-28 2018-12-26 Hewlett Packard Development Co conjuntos de material fotoluminescente
CN106696275A (zh) * 2016-12-14 2017-05-24 芜湖纯元光电设备技术有限公司 一种光固化机用废气净化装置
US10493483B2 (en) 2017-07-17 2019-12-03 Palo Alto Research Center Incorporated Central fed roller for filament extension atomizer
US10919215B2 (en) 2017-08-22 2021-02-16 Palo Alto Research Center Incorporated Electrostatic polymer aerosol deposition and fusing of solid particles for three-dimensional printing
US10632746B2 (en) 2017-11-13 2020-04-28 Optomec, Inc. Shuttering of aerosol streams
KR102006451B1 (ko) * 2018-03-14 2019-08-01 포항공과대학교 산학협력단 광 유도 현상을 이용한 3차원 구조물의 제조 장치 및 방법
JP7204276B2 (ja) * 2018-12-06 2023-01-16 エルジー・ケム・リミテッド 吐出装置、成形装置、及び成形体の製造方法
JP7248972B2 (ja) * 2018-12-19 2023-03-30 武藤工業株式会社 三次元造形装置及び三次元造形方法
US11518086B2 (en) * 2020-12-08 2022-12-06 Palo Alto Research Center Incorporated Additive manufacturing systems and methods for the same
US11679556B2 (en) 2020-12-08 2023-06-20 Palo Alto Research Center Incorporated Additive manufacturing systems and methods for the same
CN113310761B (zh) * 2021-05-08 2022-08-23 中国辐射防护研究院 一种含放射性核素的标准气溶胶样品制备方法
FR3134679A1 (fr) * 2022-04-13 2023-10-20 Safran Procédé de fabrication de modules électroniques imbriqués par fabrication additive

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1921956A (zh) * 2003-09-26 2007-02-28 奥普美克设计公司 用于热敏性中等尺度沉积的激光处理

Family Cites Families (340)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474971A (en) 1967-06-14 1969-10-28 North American Rockwell Two-piece injector
US3590477A (en) 1968-12-19 1971-07-06 Ibm Method for fabricating insulated-gate field effect transistors having controlled operating characeristics
US3808550A (en) 1969-12-15 1974-04-30 Bell Telephone Labor Inc Apparatuses for trapping and accelerating neutral particles
US3642202A (en) 1970-05-13 1972-02-15 Exxon Research Engineering Co Feed system for coking unit
US3808432A (en) 1970-06-04 1974-04-30 Bell Telephone Labor Inc Neutral particle accelerator utilizing radiation pressure
US3846661A (en) 1971-04-29 1974-11-05 Ibm Technique for fabricating integrated incandescent displays
US3715785A (en) 1971-04-29 1973-02-13 Ibm Technique for fabricating integrated incandescent displays
US3777983A (en) 1971-12-16 1973-12-11 Gen Electric Gas cooled dual fuel air atomized fuel nozzle
US3816025A (en) 1973-01-18 1974-06-11 Neill W O Paint spray system
US3854321A (en) 1973-04-27 1974-12-17 B Dahneke Aerosol beam device and method
US3901798A (en) 1973-11-21 1975-08-26 Environmental Research Corp Aerosol concentrator and classifier
US4036434A (en) 1974-07-15 1977-07-19 Aerojet-General Corporation Fluid delivery nozzle with fluid purged face
US3982251A (en) 1974-08-23 1976-09-21 Ibm Corporation Method and apparatus for recording information on a recording medium
US3959798A (en) 1974-12-31 1976-05-25 International Business Machines Corporation Selective wetting using a micromist of particles
DE2517715C2 (de) 1975-04-22 1977-02-10 Hans Behr Verfahren und einrichtung zum mischen und/oder dispergieren und abstrahlen der komponenten eines fliessfaehigen materials zum beschichten von oberflaechen
US4019188A (en) 1975-05-12 1977-04-19 International Business Machines Corporation Micromist jet printer
US3974769A (en) 1975-05-27 1976-08-17 International Business Machines Corporation Method and apparatus for recording information on a recording surface through the use of mists
US4004733A (en) 1975-07-09 1977-01-25 Research Corporation Electrostatic spray nozzle system
US4016417A (en) 1976-01-08 1977-04-05 Richard Glasscock Benton Laser beam transport, and method
US4046073A (en) 1976-01-28 1977-09-06 International Business Machines Corporation Ultrasonic transfer printing with multi-copy, color and low audible noise capability
US4046074A (en) 1976-02-02 1977-09-06 International Business Machines Corporation Non-impact printing system
US4034025A (en) 1976-02-09 1977-07-05 Martner John G Ultrasonic gas stream liquid entrainment apparatus
US4092535A (en) 1977-04-22 1978-05-30 Bell Telephone Laboratories, Incorporated Damping of optically levitated particles by feedback and beam shaping
US4171096A (en) 1977-05-26 1979-10-16 John Welsh Spray gun nozzle attachment
US4112437A (en) 1977-06-27 1978-09-05 Eastman Kodak Company Electrographic mist development apparatus and method
US4235563A (en) 1977-07-11 1980-11-25 The Upjohn Company Method and apparatus for feeding powder
JPS592617B2 (ja) 1977-12-22 1984-01-19 株式会社リコー インク噴射装置
US4132894A (en) 1978-04-04 1979-01-02 The United States Of America As Represented By The United States Department Of Energy Monitor of the concentration of particles of dense radioactive materials in a stream of air
US4200669A (en) 1978-11-22 1980-04-29 The United States Of America As Represented By The Secretary Of The Navy Laser spraying
GB2052566B (en) 1979-03-30 1982-12-15 Rolls Royce Laser aplication of hard surface alloy
US4323756A (en) 1979-10-29 1982-04-06 United Technologies Corporation Method for fabricating articles by sequential layer deposition
JPS5948873B2 (ja) 1980-05-14 1984-11-29 ペルメレック電極株式会社 耐食性被覆を設けた電極基体又は電極の製造方法
US4453803A (en) 1981-06-25 1984-06-12 Agency Of Industrial Science & Technology Optical waveguide for middle infrared band
US4605574A (en) 1981-09-14 1986-08-12 Takashi Yonehara Method and apparatus for forming an extremely thin film on the surface of an object
US4485387A (en) 1982-10-26 1984-11-27 Microscience Systems Corp. Inking system for producing circuit patterns
US4685563A (en) 1983-05-16 1987-08-11 Michelman Inc. Packaging material and container having interlaminate electrostatic shield and method of making same
US4497692A (en) 1983-06-13 1985-02-05 International Business Machines Corporation Laser-enhanced jet-plating and jet-etching: high-speed maskless patterning method
US4601921A (en) 1984-12-24 1986-07-22 General Motors Corporation Method and apparatus for spraying coating material
US4694136A (en) 1986-01-23 1987-09-15 Westinghouse Electric Corp. Laser welding of a sleeve within a tube
US4689052A (en) 1986-02-19 1987-08-25 Washington Research Foundation Virtual impactor
US4823009A (en) 1986-04-14 1989-04-18 Massachusetts Institute Of Technology Ir compatible deposition surface for liquid chromatography
US4670135A (en) 1986-06-27 1987-06-02 Regents Of The University Of Minnesota High volume virtual impactor
JPS6359195A (ja) 1986-08-29 1988-03-15 Hitachi Ltd 磁気記録再生装置
DE3686161D1 (de) 1986-09-25 1992-08-27 Lucien Diego Laude Vorrichtung zur laserunterstuetzten, elektrolytischen metallabscheidung.
US4733018A (en) 1986-10-02 1988-03-22 Rca Corporation Thick film copper conductor inks
US4927992A (en) 1987-03-04 1990-05-22 Westinghouse Electric Corp. Energy beam casting of metal articles
US4724299A (en) 1987-04-15 1988-02-09 Quantum Laser Corporation Laser spray nozzle and method
US4904621A (en) 1987-07-16 1990-02-27 Texas Instruments Incorporated Remote plasma generation process using a two-stage showerhead
US4893886A (en) 1987-09-17 1990-01-16 American Telephone And Telegraph Company Non-destructive optical trap for biological particles and method of doing same
US4997809A (en) 1987-11-18 1991-03-05 International Business Machines Corporation Fabrication of patterned lines of high Tc superconductors
US4920254A (en) 1988-02-22 1990-04-24 Sierracin Corporation Electrically conductive window and a method for its manufacture
JPH0621335B2 (ja) 1988-02-24 1994-03-23 工業技術院長 レ−ザ溶射法
US4895735A (en) 1988-03-01 1990-01-23 Texas Instruments Incorporated Radiation induced pattern deposition
US4917830A (en) 1988-09-19 1990-04-17 The United States Of America As Represented By The United States Department Of Energy Monodisperse aerosol generator
US4971251A (en) 1988-11-28 1990-11-20 Minnesota Mining And Manufacturing Company Spray gun with disposable liquid handling portion
US5614252A (en) 1988-12-27 1997-03-25 Symetrix Corporation Method of fabricating barium strontium titanate
US6056994A (en) 1988-12-27 2000-05-02 Symetrix Corporation Liquid deposition methods of fabricating layered superlattice materials
US4911365A (en) 1989-01-26 1990-03-27 James E. Hynds Spray gun having a fanning air turbine mechanism
US5038014A (en) 1989-02-08 1991-08-06 General Electric Company Fabrication of components by layered deposition
US5043548A (en) 1989-02-08 1991-08-27 General Electric Company Axial flow laser plasma spraying
US5064685A (en) 1989-08-23 1991-11-12 At&T Laboratories Electrical conductor deposition method
US5017317A (en) 1989-12-04 1991-05-21 Board Of Regents, The Uni. Of Texas System Gas phase selective beam deposition
US5032850A (en) 1989-12-18 1991-07-16 Tokyo Electric Co., Ltd. Method and apparatus for vapor jet printing
US4978067A (en) 1989-12-22 1990-12-18 Sono-Tek Corporation Unitary axial flow tube ultrasonic atomizer with enhanced sealing
DE4000690A1 (de) 1990-01-12 1991-07-18 Philips Patentverwaltung Verfahren zum herstellen von ultrafeinen partikeln und deren verwendung
DE69130184T2 (de) 1990-02-23 1999-02-11 Fuji Photo Film Co Ltd Verfahren zur Herstellung mehrschichtiger Beschichtungen
DE4006511A1 (de) 1990-03-02 1991-09-05 Krupp Gmbh Einrichtung zum zufuehren pulverfoermiger zusatzwerkstoffe in den bereich einer schweissstelle
US5176328A (en) 1990-03-13 1993-01-05 The Board Of Regents Of The University Of Nebraska Apparatus for forming fin particles
US5126102A (en) 1990-03-15 1992-06-30 Kabushiki Kaisha Toshiba Fabricating method of composite material
CN2078199U (zh) 1990-06-15 1991-06-05 蒋隽 多用途便携式超声雾化器
US5152462A (en) * 1990-08-10 1992-10-06 Roussel Uclaf Spray system
JPH04120259A (ja) 1990-09-10 1992-04-21 Agency Of Ind Science & Technol レーザ溶射法による機器・部材の製造方法および装置
FR2667811B1 (fr) 1990-10-10 1992-12-04 Snecma Dispositif d'apport de poudre pour revetement par traitement au faisceau laser.
US5245404A (en) 1990-10-18 1993-09-14 Physical Optics Corportion Raman sensor
US5170890A (en) 1990-12-05 1992-12-15 Wilson Steven D Particle trap
US5634093A (en) 1991-01-30 1997-05-27 Kabushiki Kaisha Toshiba Method and CAD system for designing wiring patterns using predetermined rules
US6175422B1 (en) 1991-01-31 2001-01-16 Texas Instruments Incorporated Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data
ATE117027T1 (de) 1991-02-02 1995-01-15 Theysohn Friedrich Fa Verfahren zur erzeugung einer verschleissmindernden schicht.
CA2061069C (en) 1991-02-27 1999-06-29 Toshio Kubota Method of electrostatically spray-coating a workpiece with paint
US5292418A (en) 1991-03-08 1994-03-08 Mitsubishi Denki Kabushiki Kaisha Local laser plating apparatus
WO1992018323A1 (en) 1991-04-09 1992-10-29 Haber Michael B Computerised macro-assembly manufacture
US5173220A (en) 1991-04-26 1992-12-22 Motorola, Inc. Method of manufacturing a three-dimensional plastic article
US5176744A (en) 1991-08-09 1993-01-05 Microelectronics Computer & Technology Corp. Solution for direct copper writing
US5164535A (en) 1991-09-05 1992-11-17 Silent Options, Inc. Gun silencer
US5314003A (en) 1991-12-24 1994-05-24 Microelectronics And Computer Technology Corporation Three-dimensional metal fabrication using a laser
FR2685922B1 (fr) 1992-01-07 1995-03-24 Strasbourg Elec Buse coaxiale de traitement superficiel sous irradiation laser, avec apport de materiaux sous forme de poudre.
US5495105A (en) 1992-02-20 1996-02-27 Canon Kabushiki Kaisha Method and apparatus for particle manipulation, and measuring apparatus utilizing the same
US5194297A (en) 1992-03-04 1993-03-16 Vlsi Standards, Inc. System and method for accurately depositing particles on a surface
US5378508A (en) 1992-04-01 1995-01-03 Akzo Nobel N.V. Laser direct writing
JPH05283708A (ja) 1992-04-02 1993-10-29 Mitsubishi Electric Corp 不揮発性半導体記憶装置,その製造方法および試験方法
JPH05318748A (ja) 1992-05-21 1993-12-03 Brother Ind Ltd 液滴噴射装置用駆動電極の形成方法
AU4668393A (en) 1992-07-08 1994-01-31 Nordson Corporation Apparatus and methods for applying discrete foam coatings
US5335000A (en) 1992-08-04 1994-08-02 Calcomp Inc. Ink vapor aerosol pen for pen plotters
US5294459A (en) 1992-08-27 1994-03-15 Nordson Corporation Air assisted apparatus and method for selective coating
IL107120A (en) * 1992-09-29 1997-09-30 Boehringer Ingelheim Int Atomising nozzle and filter and spray generating device
US5344676A (en) 1992-10-23 1994-09-06 The Board Of Trustees Of The University Of Illinois Method and apparatus for producing nanodrops and nanoparticles and thin film deposits therefrom
US5322221A (en) 1992-11-09 1994-06-21 Graco Inc. Air nozzle
JPH08156106A (ja) * 1992-11-13 1996-06-18 Japan Atom Energy Res Inst 3次元物体製作法
US5775402A (en) 1995-10-31 1998-07-07 Massachusetts Institute Of Technology Enhancement of thermal properties of tooling made by solid free form fabrication techniques
US5449536A (en) 1992-12-18 1995-09-12 United Technologies Corporation Method for the application of coatings of oxide dispersion strengthened metals by laser powder injection
US5529634A (en) 1992-12-28 1996-06-25 Kabushiki Kaisha Toshiba Apparatus and method of manufacturing semiconductor device
US5359172A (en) 1992-12-30 1994-10-25 Westinghouse Electric Corporation Direct tube repair by laser welding
US5270542A (en) 1992-12-31 1993-12-14 Regents Of The University Of Minnesota Apparatus and method for shaping and detecting a particle beam
US5366559A (en) 1993-05-27 1994-11-22 Research Triangle Institute Method for protecting a substrate surface from contamination using the photophoretic effect
US5733609A (en) 1993-06-01 1998-03-31 Wang; Liang Ceramic coatings synthesized by chemical reactions energized by laser plasmas
IL106803A (en) 1993-08-25 1998-02-08 Scitex Corp Ltd Printable inkjet head
US5398193B1 (en) 1993-08-20 1997-09-16 Alfredo O Deangelis Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor
US5491317A (en) 1993-09-13 1996-02-13 Westinghouse Electric Corporation System and method for laser welding an inner surface of a tubular member
US5403617A (en) 1993-09-15 1995-04-04 Mobium Enterprises Corporation Hybrid pulsed valve for thin film coating and method
US5736195A (en) 1993-09-15 1998-04-07 Mobium Enterprises Corporation Method of coating a thin film on a substrate
US5518680A (en) 1993-10-18 1996-05-21 Massachusetts Institute Of Technology Tissue regeneration matrices by solid free form fabrication techniques
US5554415A (en) 1994-01-18 1996-09-10 Qqc, Inc. Substrate coating techniques, including fabricating materials on a surface of a substrate
US5477026A (en) 1994-01-27 1995-12-19 Chromalloy Gas Turbine Corporation Laser/powdered metal cladding nozzle
US5512745A (en) 1994-03-09 1996-04-30 Board Of Trustees Of The Leland Stanford Jr. University Optical trap system and method
EP0705483B1 (en) 1994-04-25 1999-11-24 Koninklijke Philips Electronics N.V. Method of curing a film
US5609921A (en) 1994-08-26 1997-03-11 Universite De Sherbrooke Suspension plasma spray
FR2724853B1 (fr) 1994-09-27 1996-12-20 Saint Gobain Vitrage Dispositif de distribution de solides pulverulents a la surface d'un substrat en vue d'y deposer un revetement
US5732885A (en) 1994-10-07 1998-03-31 Spraying Systems Co. Internal mix air atomizing spray nozzle
US5486676A (en) 1994-11-14 1996-01-23 General Electric Company Coaxial single point powder feed nozzle
US5541006A (en) 1994-12-23 1996-07-30 Kennametal Inc. Method of making composite cermet articles and the articles
US5861136A (en) 1995-01-10 1999-01-19 E. I. Du Pont De Nemours And Company Method for making copper I oxide powders by aerosol decomposition
US5770272A (en) 1995-04-28 1998-06-23 Massachusetts Institute Of Technology Matrix-bearing targets for maldi mass spectrometry and methods of production thereof
US5814152A (en) 1995-05-23 1998-09-29 Mcdonnell Douglas Corporation Apparatus for coating a substrate
US5612099A (en) 1995-05-23 1997-03-18 Mcdonnell Douglas Corporation Method and apparatus for coating a substrate
TW284907B (en) 1995-06-07 1996-09-01 Cauldron Lp Removal of material by polarized irradiation and back side application for radiation
US5882722A (en) 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
GB9515439D0 (en) 1995-07-27 1995-09-27 Isis Innovation Method of producing metal quantum dots
US5779833A (en) 1995-08-04 1998-07-14 Case Western Reserve University Method for constructing three dimensional bodies from laminations
US5997956A (en) 1995-08-04 1999-12-07 Microcoating Technologies Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions
US5837960A (en) 1995-08-14 1998-11-17 The Regents Of The University Of California Laser production of articles from powders
US5746844A (en) 1995-09-08 1998-05-05 Aeroquip Corporation Method and apparatus for creating a free-form three-dimensional article using a layer-by-layer deposition of molten metal and using a stress-reducing annealing process on the deposited metal
US5607730A (en) 1995-09-11 1997-03-04 Clover Industries, Inc. Method and apparatus for laser coating
US5653925A (en) 1995-09-26 1997-08-05 Stratasys, Inc. Method for controlled porosity three-dimensional modeling
ATE219165T1 (de) 1995-12-14 2002-06-15 Imperial College Film- oder schicht-abscheidung und pulver herstellung
US6015083A (en) 1995-12-29 2000-01-18 Microfab Technologies, Inc. Direct solder bumping of hard to solder substrate
US5772106A (en) 1995-12-29 1998-06-30 Microfab Technologies, Inc. Printhead for liquid metals and method of use
US5993549A (en) 1996-01-19 1999-11-30 Deutsche Forschungsanstalt Fuer Luft- Und Raumfahrt E.V. Powder coating apparatus
US5676719A (en) 1996-02-01 1997-10-14 Engineering Resources, Inc. Universal insert for use with radiator steam traps
US5772964A (en) 1996-02-08 1998-06-30 Lab Connections, Inc. Nozzle arrangement for collecting components from a fluid for analysis
CN1093783C (zh) 1996-02-21 2002-11-06 松下电器产业株式会社 液体喷涂喷嘴和液体喷涂喷嘴的制造方法
US5705117A (en) 1996-03-01 1998-01-06 Delco Electronics Corporaiton Method of combining metal and ceramic inserts into stereolithography components
JP4346684B2 (ja) * 1996-04-17 2009-10-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 基板上への焼結体の製造方法
CN1137285C (zh) 1997-04-30 2004-02-04 高松研究所 金属糊和金属膜的制造方法
US5844192A (en) 1996-05-09 1998-12-01 United Technologies Corporation Thermal spray coating method and apparatus
US6116184A (en) 1996-05-21 2000-09-12 Symetrix Corporation Method and apparatus for misted liquid source deposition of thin film with reduced mist particle size
US5854311A (en) 1996-06-24 1998-12-29 Richart; Douglas S. Process and apparatus for the preparation of fine powders
US6046426A (en) 1996-07-08 2000-04-04 Sandia Corporation Method and system for producing complex-shape objects
CN1226960A (zh) 1996-07-08 1999-08-25 康宁股份有限公司 气体助推式雾化装置
US5772963A (en) 1996-07-30 1998-06-30 Bayer Corporation Analytical instrument having a control area network and distributed logic nodes
US6544599B1 (en) 1996-07-31 2003-04-08 Univ Arkansas Process and apparatus for applying charged particles to a substrate, process for forming a layer on a substrate, products made therefrom
US5707715A (en) 1996-08-29 1998-01-13 L. Pierre deRochemont Metal ceramic composites with improved interfacial properties and methods to make such composites
JP3867176B2 (ja) 1996-09-24 2007-01-10 アール・アイ・ディー株式会社 粉体質量流量測定装置、およびこれを適用した静電粉体塗装装置
US6143116A (en) 1996-09-26 2000-11-07 Kyocera Corporation Process for producing a multi-layer wiring board
US5742050A (en) 1996-09-30 1998-04-21 Aviv Amirav Method and apparatus for sample introduction into a mass spectrometer for improving a sample analysis
US6144008A (en) 1996-11-22 2000-11-07 Rabinovich; Joshua E. Rapid manufacturing system for metal, metal matrix composite materials and ceramics
US5578227A (en) 1996-11-22 1996-11-26 Rabinovich; Joshua E. Rapid prototyping system
CA2276018C (en) 1997-01-03 2004-11-23 Mds Inc. Spray chamber with dryer
US5969352A (en) * 1997-01-03 1999-10-19 Mds Inc. Spray chamber with dryer
US6379745B1 (en) 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
US6699304B1 (en) 1997-02-24 2004-03-02 Superior Micropowders, Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
US5936627A (en) 1997-02-28 1999-08-10 International Business Machines Corporation Method and system for performing perspective divide operations on three-dimensional graphical object data within a computer system
US5894403A (en) 1997-05-01 1999-04-13 Wilson Greatbatch Ltd. Ultrasonically coated substrate for use in a capacitor
US5849238A (en) 1997-06-26 1998-12-15 Ut Automotive Dearborn, Inc. Helical conformal channels for solid freeform fabrication and tooling applications
US7164818B2 (en) 2001-05-03 2007-01-16 Neophontonics Corporation Integrated gradient index lenses
US6890624B1 (en) 2000-04-25 2005-05-10 Nanogram Corporation Self-assembled structures
US6391494B2 (en) 1999-05-13 2002-05-21 Nanogram Corporation Metal vanadium oxide particles
US6952504B2 (en) 2001-12-21 2005-10-04 Neophotonics Corporation Three dimensional engineering of planar optical structures
US5847357A (en) 1997-08-25 1998-12-08 General Electric Company Laser-assisted material spray processing
US6021776A (en) 1997-09-09 2000-02-08 Intertex Research, Inc. Disposable atomizer device with trigger valve system
US6548122B1 (en) 1997-09-16 2003-04-15 Sri International Method of producing and depositing a metal film
US5980998A (en) 1997-09-16 1999-11-09 Sri International Deposition of substances on a surface
WO1999019900A2 (en) 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
US6007631A (en) 1997-11-10 1999-12-28 Speedline Technologies, Inc. Multiple head dispensing system and method
US5993416A (en) 1998-01-15 1999-11-30 Medtronic Ave, Inc. Method and apparatus for regulating the fluid flow rate to and preventing over-pressurization of a balloon catheter
US5993554A (en) 1998-01-22 1999-11-30 Optemec Design Company Multiple beams and nozzles to increase deposition rate
US6967183B2 (en) 1998-08-27 2005-11-22 Cabot Corporation Electrocatalyst powders, methods for producing powders and devices fabricated from same
US20050097987A1 (en) 1998-02-24 2005-05-12 Cabot Corporation Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same
US6349668B1 (en) 1998-04-27 2002-02-26 Msp Corporation Method and apparatus for thin film deposition on large area substrates
WO1999060397A1 (en) 1998-05-18 1999-11-25 University Of Washington Liquid analysis cartridge
DE19822674A1 (de) 1998-05-20 1999-12-09 Gsf Forschungszentrum Umwelt Gaseinlaß für eine Ionenquelle
DE19822672B4 (de) 1998-05-20 2005-11-10 GSF - Forschungszentrum für Umwelt und Gesundheit GmbH Verfahren und Vorrichtung zur Erzeugung eines gerichteten Gasstrahls
FR2780170B1 (fr) 1998-06-19 2000-08-11 Aerospatiale Dispositif autonome de limitation du debit d'un fluide dans une canalisation et circuit de carburant pour aeronef comportant un tel dispositif
US6410105B1 (en) 1998-06-30 2002-06-25 Jyoti Mazumder Production of overhang, undercut, and cavity structures using direct metal depostion
US6159749A (en) 1998-07-21 2000-12-12 Beckman Coulter, Inc. Highly sensitive bead-based multi-analyte assay system using optical tweezers
US6149076A (en) 1998-08-05 2000-11-21 Nordson Corporation Dispensing apparatus having nozzle for controlling heated liquid discharge with unheated pressurized air
KR100271208B1 (ko) 1998-08-13 2000-12-01 윤덕용 선택적 용침공정을 이용한 쾌속조형방법및 쾌속조형장치
US7347850B2 (en) 1998-08-14 2008-03-25 Incept Llc Adhesion barriers applicable by minimally invasive surgery and methods of use thereof
US6697694B2 (en) 1998-08-26 2004-02-24 Electronic Materials, L.L.C. Apparatus and method for creating flexible circuits
US7098163B2 (en) 1998-08-27 2006-08-29 Cabot Corporation Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
DE19841401C2 (de) 1998-09-10 2000-09-21 Lechler Gmbh & Co Kg Zweistoff-Flachstrahldüse
US7938079B2 (en) 1998-09-30 2011-05-10 Optomec Design Company Annular aerosol jet deposition using an extended nozzle
US7045015B2 (en) 1998-09-30 2006-05-16 Optomec Design Company Apparatuses and method for maskless mesoscale material deposition
US6291088B1 (en) 1998-09-30 2001-09-18 Xerox Corporation Inorganic overcoat for particulate transport electrode grid
US20050156991A1 (en) 1998-09-30 2005-07-21 Optomec Design Company Maskless direct write of copper using an annular aerosol jet
US7108894B2 (en) 1998-09-30 2006-09-19 Optomec Design Company Direct Write™ System
US6265050B1 (en) 1998-09-30 2001-07-24 Xerox Corporation Organic overcoat for electrode grid
US6340216B1 (en) 1998-09-30 2002-01-22 Xerox Corporation Ballistic aerosol marking apparatus for treating a substrate
US20030020768A1 (en) 1998-09-30 2003-01-30 Renn Michael J. Direct write TM system
US6290342B1 (en) 1998-09-30 2001-09-18 Xerox Corporation Particulate marking material transport apparatus utilizing traveling electrostatic waves
US6467862B1 (en) 1998-09-30 2002-10-22 Xerox Corporation Cartridge for use in a ballistic aerosol marking apparatus
US6116718A (en) 1998-09-30 2000-09-12 Xerox Corporation Print head for use in a ballistic aerosol marking apparatus
US6416156B1 (en) 1998-09-30 2002-07-09 Xerox Corporation Kinetic fusing of a marking material
US6251488B1 (en) 1999-05-05 2001-06-26 Optomec Design Company Precision spray processes for direct write electronic components
US6636676B1 (en) 1998-09-30 2003-10-21 Optomec Design Company Particle guidance system
WO2000023825A2 (en) 1998-09-30 2000-04-27 Board Of Control Of Michigan Technological University Laser-guided manipulation of non-atomic particles
US6416157B1 (en) 1998-09-30 2002-07-09 Xerox Corporation Method of marking a substrate employing a ballistic aerosol marking apparatus
US20040197493A1 (en) 1998-09-30 2004-10-07 Optomec Design Company Apparatus, methods and precision spray processes for direct write and maskless mesoscale material deposition
US7294366B2 (en) 1998-09-30 2007-11-13 Optomec Design Company Laser processing for heat-sensitive mesoscale deposition
US6454384B1 (en) 1998-09-30 2002-09-24 Xerox Corporation Method for marking with a liquid material using a ballistic aerosol marking apparatus
US6511149B1 (en) 1998-09-30 2003-01-28 Xerox Corporation Ballistic aerosol marking apparatus for marking a substrate
US8110247B2 (en) 1998-09-30 2012-02-07 Optomec Design Company Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials
US6136442A (en) 1998-09-30 2000-10-24 Xerox Corporation Multi-layer organic overcoat for particulate transport electrode grid
US6151435A (en) 1998-11-01 2000-11-21 The United States Of America As Represented By The Secretary Of The Navy Evanescent atom guiding in metal-coated hollow-core optical fibers
US6001304A (en) 1998-12-31 1999-12-14 Materials Modification, Inc. Method of bonding a particle material to near theoretical density
JP2000238270A (ja) 1998-12-22 2000-09-05 Canon Inc インクジェット記録ヘッド及びインクジェット記録ヘッドの製造方法
KR100284607B1 (ko) 1998-12-31 2001-08-07 하상채 잔류도료 회수장치를 갖춘 정전 분체 도장 시스템
US6280302B1 (en) 1999-03-24 2001-08-28 Flow International Corporation Method and apparatus for fluid jet formation
DE19913451C2 (de) 1999-03-25 2001-11-22 Gsf Forschungszentrum Umwelt Gaseinlaß zur Erzeugung eines gerichteten und gekühlten Gasstrahls
AU4856100A (en) 1999-05-17 2000-12-05 Stephen T Flock Electromagnetic energy driven separation methods
US6405095B1 (en) 1999-05-25 2002-06-11 Nanotek Instruments, Inc. Rapid prototyping and tooling system
CA2375365A1 (en) 1999-05-27 2001-02-15 Patterning Technologies Limited Method of forming a masking pattern on a surface
US20020128714A1 (en) 1999-06-04 2002-09-12 Mark Manasas Orthopedic implant and method of making metal articles
US6520996B1 (en) 1999-06-04 2003-02-18 Depuy Acromed, Incorporated Orthopedic implant
US6267301B1 (en) 1999-06-11 2001-07-31 Spraying Systems Co. Air atomizing nozzle assembly with improved air cap
US6391251B1 (en) 1999-07-07 2002-05-21 Optomec Design Company Forming structures from CAD solid models
US6811744B2 (en) * 1999-07-07 2004-11-02 Optomec Design Company Forming structures from CAD solid models
US6656409B1 (en) 1999-07-07 2003-12-02 Optomec Design Company Manufacturable geometries for thermal management of complex three-dimensional shapes
US20060003095A1 (en) 1999-07-07 2006-01-05 Optomec Design Company Greater angle and overhanging materials deposition
US6348687B1 (en) 1999-09-10 2002-02-19 Sandia Corporation Aerodynamic beam generator for large particles
US6293659B1 (en) 1999-09-30 2001-09-25 Xerox Corporation Particulate source, circulation, and valving system for ballistic aerosol marking
US6328026B1 (en) 1999-10-13 2001-12-11 The University Of Tennessee Research Corporation Method for increasing wear resistance in an engine cylinder bore and improved automotive engine
US6486432B1 (en) 1999-11-23 2002-11-26 Spirex Method and laser cladding of plasticating barrels
US6318642B1 (en) 1999-12-22 2001-11-20 Visteon Global Tech., Inc Nozzle assembly
KR20010063781A (ko) 1999-12-24 2001-07-09 박종섭 반도체소자의 제조방법
JP3736607B2 (ja) 2000-01-21 2006-01-18 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
US6423366B2 (en) 2000-02-16 2002-07-23 Roll Coater, Inc. Strip coating method
US6564038B1 (en) 2000-02-23 2003-05-13 Lucent Technologies Inc. Method and apparatus for suppressing interference using active shielding techniques
US6384365B1 (en) 2000-04-14 2002-05-07 Siemens Westinghouse Power Corporation Repair and fabrication of combustion turbine components by spark plasma sintering
AU5273401A (en) * 2000-04-18 2001-11-12 Kang-Ho Ahn Apparatus for manufacturing ultra-fine particles using electrospray device and method thereof
US20020063117A1 (en) 2000-04-19 2002-05-30 Church Kenneth H. Laser sintering of materials and a thermal barrier for protecting a substrate
US6572033B1 (en) 2000-05-15 2003-06-03 Nordson Corporation Module for dispensing controlled patterns of liquid material and a nozzle having an asymmetric liquid discharge orifice
CN100398321C (zh) 2000-05-24 2008-07-02 西尔弗布鲁克研究有限公司 具有外装喷嘴控制器的喷墨喷嘴组件
US6521297B2 (en) 2000-06-01 2003-02-18 Xerox Corporation Marking material and ballistic aerosol marking process for the use thereof
US6576861B2 (en) 2000-07-25 2003-06-10 The Research Foundation Of State University Of New York Method and apparatus for fine feature spray deposition
US20020082741A1 (en) 2000-07-27 2002-06-27 Jyoti Mazumder Fabrication of biomedical implants using direct metal deposition
US6416389B1 (en) 2000-07-28 2002-07-09 Xerox Corporation Process for roughening a surface
JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
US6781673B2 (en) 2000-08-25 2004-08-24 Asml Netherlands B.V. Mask handling apparatus, lithographic projection apparatus, device manufacturing method and device manufactured thereby
ATE525730T1 (de) 2000-10-25 2011-10-15 Harima Chemicals Inc Elektroleitfähige metallpaste und verfahren zu ihrer herstellung
EP1215705A3 (en) 2000-12-12 2003-05-21 Nisshinbo Industries, Inc. Transparent electromagnetic radiation shielding material
US6607597B2 (en) 2001-01-30 2003-08-19 Msp Corporation Method and apparatus for deposition of particles on surfaces
US6471327B2 (en) 2001-02-27 2002-10-29 Eastman Kodak Company Apparatus and method of delivering a focused beam of a thermodynamically stable/metastable mixture of a functional material in a dense fluid onto a receiver
US6780368B2 (en) 2001-04-10 2004-08-24 Nanotek Instruments, Inc. Layer manufacturing of a multi-material or multi-color 3-D object using electrostatic imaging and lamination
US6657213B2 (en) 2001-05-03 2003-12-02 Northrop Grumman Corporation High temperature EUV source nozzle
EP1258293A3 (de) 2001-05-16 2003-06-18 Roberit Ag Vorrichtung zum Spritzen einer Mehrkomponentenmischung
US6811805B2 (en) 2001-05-30 2004-11-02 Novatis Ag Method for applying a coating
NO316775B1 (no) 2001-06-11 2004-05-03 Optoplan As Fremgangsmate for belegging av en fiber med fiberoptisk Bragg-Gitter (FBG)
JP2003011100A (ja) 2001-06-27 2003-01-15 Matsushita Electric Ind Co Ltd ガス流中のナノ粒子の堆積方法、並びに表面修飾方法
US7469558B2 (en) 2001-07-10 2008-12-30 Springworks, Llc As-deposited planar optical waveguides with low scattering loss and methods for their manufacture
US6998785B1 (en) 2001-07-13 2006-02-14 University Of Central Florida Research Foundation, Inc. Liquid-jet/liquid droplet initiated plasma discharge for generating useful plasma radiation
US6706234B2 (en) 2001-08-08 2004-03-16 Nanotek Instruments, Inc. Direct write method for polarized materials
US7629017B2 (en) 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US20030108664A1 (en) 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
WO2003062796A1 (en) 2002-01-22 2003-07-31 Dakocytomation Denmark A/S Environmental containment system for a flow cytometer
US6593540B1 (en) 2002-02-08 2003-07-15 Honeywell International, Inc. Hand held powder-fed laser fusion welding torch
US20040029706A1 (en) 2002-02-14 2004-02-12 Barrera Enrique V. Fabrication of reinforced composite material comprising carbon nanotubes, fullerenes, and vapor-grown carbon fibers for thermal barrier materials, structural ceramics, and multifunctional nanocomposite ceramics
CA2374338A1 (en) 2002-03-01 2003-09-01 Ignis Innovations Inc. Fabrication method for large area mechanically flexible circuits and displays
US6705703B2 (en) 2002-04-24 2004-03-16 Hewlett-Packard Development Company, L.P. Determination of control points for construction of first color space-to-second color space look-up table
GB0212062D0 (en) * 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US7601406B2 (en) 2002-06-13 2009-10-13 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7566360B2 (en) 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7736693B2 (en) 2002-06-13 2010-06-15 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
AU2003255254A1 (en) 2002-08-08 2004-02-25 Glenn J. Leedy Vertical system integration
JP4388263B2 (ja) 2002-09-11 2009-12-24 日鉱金属株式会社 珪化鉄スパッタリングターゲット及びその製造方法
US7067867B2 (en) 2002-09-30 2006-06-27 Nanosys, Inc. Large-area nonenabled macroelectronic substrates and uses therefor
JP2004122341A (ja) 2002-10-07 2004-04-22 Fuji Photo Film Co Ltd 成膜方法
US20040080917A1 (en) 2002-10-23 2004-04-29 Steddom Clark Morrison Integrated microwave package and the process for making the same
US20040185388A1 (en) * 2003-01-29 2004-09-23 Hiroyuki Hirai Printed circuit board, method for producing same, and ink therefor
US20040151978A1 (en) 2003-01-30 2004-08-05 Huang Wen C. Method and apparatus for direct-write of functional materials with a controlled orientation
JP4244382B2 (ja) * 2003-02-26 2009-03-25 セイコーエプソン株式会社 機能性材料定着方法及びデバイス製造方法
US6921626B2 (en) 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
US7009137B2 (en) 2003-03-27 2006-03-07 Honeywell International, Inc. Laser powder fusion repair of Z-notches with nickel based superalloy powder
US7579251B2 (en) 2003-05-15 2009-08-25 Fujitsu Limited Aerosol deposition process
WO2004112151A2 (en) 2003-06-12 2004-12-23 Patterning Technologies Limited Transparent conducting structures and methods of production thereof
US6855631B2 (en) 2003-07-03 2005-02-15 Micron Technology, Inc. Methods of forming via plugs using an aerosol stream of particles to deposit conductive materials
US20050002818A1 (en) 2003-07-04 2005-01-06 Hitachi Powdered Metals Co., Ltd. Production method for sintered metal-ceramic layered compact and production method for thermal stress relief pad
KR20070019651A (ko) 2003-09-17 2007-02-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 실질적으로 균일한 두께를 구비한 코팅층을 형성하기 위한방법 및 다이 코팅기
EP1663510A1 (en) * 2003-09-17 2006-06-07 3M Innovative Properties Company Methods for forming a coating layer having substantially uniform thickness, and die coaters
JP2007507114A (ja) 2003-09-26 2007-03-22 オプトメック・デザイン・カンパニー 感熱性中規模デポジションのレーザ処理
EP1530065B1 (en) 2003-11-06 2008-09-10 Rohm and Haas Electronic Materials, L.L.C. Opticle article with conductive pattern
US20050147749A1 (en) 2004-01-05 2005-07-07 Msp Corporation High-performance vaporizer for liquid-precursor and multi-liquid-precursor vaporization in semiconductor thin film deposition
KR20060128997A (ko) 2004-02-04 2006-12-14 가부시키가이샤 에바라 세이사꾸쇼 복합형 나노입자 및 그 제조방법
US20050184328A1 (en) 2004-02-19 2005-08-25 Matsushita Electric Industrial Co., Ltd. Semiconductor device and its manufacturing method
JP4593947B2 (ja) 2004-03-19 2010-12-08 キヤノン株式会社 成膜装置および成膜方法
US20050205415A1 (en) 2004-03-19 2005-09-22 Belousov Igor V Multi-component deposition
KR101054129B1 (ko) 2004-03-31 2011-08-03 이스트맨 코닥 캄파니 균일한 미립자 물질층의 침착
US7220456B2 (en) 2004-03-31 2007-05-22 Eastman Kodak Company Process for the selective deposition of particulate material
CA2463409A1 (en) 2004-04-02 2005-10-02 Servo-Robot Inc. Intelligent laser joining head
US7736582B2 (en) 2004-06-10 2010-06-15 Allomet Corporation Method for consolidating tough coated hard powders
EP1625893A1 (en) 2004-08-10 2006-02-15 Konica Minolta Photo Imaging, Inc. Spray coating method, spray coating device and inkjet recording sheet
JP2006051413A (ja) 2004-08-10 2006-02-23 Konica Minolta Photo Imaging Inc 表面層のスプレー塗布方法、表面層塗布用のスプレー塗布装置、インクジェット記録用紙
US7129567B2 (en) 2004-08-31 2006-10-31 Micron Technology, Inc. Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
US7575999B2 (en) 2004-09-01 2009-08-18 Micron Technology, Inc. Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
US7235431B2 (en) 2004-09-02 2007-06-26 Micron Technology, Inc. Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
US20060280866A1 (en) 2004-10-13 2006-12-14 Optomec Design Company Method and apparatus for mesoscale deposition of biological materials and biomaterials
US7732349B2 (en) 2004-11-30 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of insulating film and semiconductor device
US7674671B2 (en) 2004-12-13 2010-03-09 Optomec Design Company Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
US7938341B2 (en) 2004-12-13 2011-05-10 Optomec Design Company Miniature aerosol jet and aerosol jet array
US20080013299A1 (en) 2004-12-13 2008-01-17 Optomec, Inc. Direct Patterning for EMI Shielding and Interconnects Using Miniature Aerosol Jet and Aerosol Jet Array
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
WO2006076603A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electrical conductors
US20060189113A1 (en) * 2005-01-14 2006-08-24 Cabot Corporation Metal nanoparticle compositions
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US7178380B2 (en) 2005-01-24 2007-02-20 Joseph Gerard Birmingham Virtual impactor device with reduced fouling
US7393559B2 (en) 2005-02-01 2008-07-01 The Regents Of The University Of California Methods for production of FGM net shaped body for various applications
US8715772B2 (en) 2005-04-12 2014-05-06 Air Products And Chemicals, Inc. Thermal deposition coating method
ATE443658T1 (de) 2005-11-21 2009-10-15 Mannkind Corp Pulverabgabe und -erfassungsvorrichtung und - verfahren
US20070154634A1 (en) * 2005-12-15 2007-07-05 Optomec Design Company Method and Apparatus for Low-Temperature Plasma Sintering
US20070240454A1 (en) 2006-01-30 2007-10-18 Brown David P Method and apparatus for continuous or batch optical fiber preform and optical fiber production
US7841336B2 (en) 2006-03-30 2010-11-30 Carefusion 2200, Inc. Nebulize with pressure-based fluidic control and related methods
CA2648771C (en) 2006-04-14 2010-11-09 Hitachi Metals, Ltd. Process for producing low-oxygen metal powder
KR100763837B1 (ko) 2006-07-18 2007-10-05 삼성전기주식회사 인쇄회로기판 제조방법
US20080099456A1 (en) 2006-10-25 2008-05-01 Schwenke Robert A Dispensing method for variable line volume
US20100029460A1 (en) * 2007-02-22 2010-02-04 Nippon Sheet Glass Company, Limited Glass for anodic bonding
DE102007017032B4 (de) 2007-04-11 2011-09-22 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Verfahren zur Herstellung von flächigen Größen- oder Abstandsvariationen in Mustern von Nanostrukturen auf Oberflächen
WO2009021123A1 (en) 2007-08-07 2009-02-12 Tsi Incorporated A size segregated aerosol mass concentration measurement device
TWI482662B (zh) 2007-08-30 2015-05-01 Optomec Inc 機械上一體式及緊密式耦合之列印頭以及噴霧源
TWI538737B (zh) 2007-08-31 2016-06-21 阿普托麥克股份有限公司 材料沉積總成
TW200918325A (en) 2007-08-31 2009-05-01 Optomec Inc AEROSOL JET® printing system for photovoltaic applications
US8916084B2 (en) 2008-09-04 2014-12-23 Xerox Corporation Ultra-violet curable gellant inks for three-dimensional printing and digital fabrication applications
KR101566573B1 (ko) * 2008-12-09 2015-11-05 인벤사스 코포레이션 전기 전도성 물질의 에어로졸 응용에 의해 형성된 반도체 다이 인터커넥트
DE102009007800A1 (de) 2009-02-06 2010-08-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Aerosol-Drucker, dessen Verwendung und Verfahren zur Herstellung von Linienunterbrechungen bei kontinuierlichen Aerosol-Druckverfahren
KR101982887B1 (ko) * 2011-07-13 2019-05-27 누보트로닉스, 인크. 전자 및 기계 구조체들을 제조하는 방법들
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US8919899B2 (en) * 2012-05-10 2014-12-30 Integrated Deposition Solutions Methods and apparatuses for direct deposition of features on a surface using a two-component microfluidic jet
US9694389B2 (en) * 2012-07-24 2017-07-04 Integrated Deposition Solutions, Inc. Methods for producing coaxial structures using a microfluidic jet
US10124602B2 (en) * 2014-10-31 2018-11-13 Integrated Deposition Solutions, Inc. Apparatuses and methods for stable aerosol deposition using an aerodynamic lens system
US10086432B2 (en) * 2014-12-10 2018-10-02 Washington State University Three dimensional sub-mm wavelength sub-THz frequency antennas on flexible and UV-curable dielectric using printed electronic metal traces
US9811327B2 (en) 2015-12-21 2017-11-07 Quixey, Inc. Dependency-aware transformation of multi-function applications for on-demand execution

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1921956A (zh) * 2003-09-26 2007-02-28 奥普美克设计公司 用于热敏性中等尺度沉积的激光处理

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113316513A (zh) * 2018-12-20 2021-08-27 捷普有限公司 使用超细喷射材料增材制造的设备、系统和方法
CN113683052A (zh) * 2021-09-14 2021-11-23 深圳清华大学研究院 一种微型块移动组件及其制作方法
CN113683052B (zh) * 2021-09-14 2023-09-05 深圳清华大学研究院 一种超滑石墨岛移动组件的制作及使用方法

Also Published As

Publication number Publication date
EP3256308A4 (en) 2018-10-31
KR102444204B1 (ko) 2022-09-19
KR20170117159A (ko) 2017-10-20
TWI735425B (zh) 2021-08-11
CN107548346B (zh) 2021-01-05
TW201637828A (zh) 2016-11-01
EP3256308A1 (en) 2017-12-20
EP3256308B1 (en) 2022-12-21
US20160229119A1 (en) 2016-08-11
US10994473B2 (en) 2021-05-04
WO2016130709A1 (en) 2016-08-18

Similar Documents

Publication Publication Date Title
CN107548346A (zh) 通过气溶胶的飞行中固化制造三维结构
US11148354B2 (en) Process and apparatus for fabrication of three dimensional objects
US20170348903A1 (en) Fabrication of Three-Dimensional Materials Gradient Structures by In-Flight Curing of Aerosols
Gupta et al. Aerosol Jet Printing for printed electronics rapid prototyping
CN110214075A (zh) 在增材制造设备中对材料进行预热
US20150217367A1 (en) Three-Dimensional Printing of Metallic Materials
US10730235B2 (en) Paste and method for producing three-dimensional shaped article
JP2010539704A (ja) 電子材料のレーザデカール転写
TW201622954A (zh) 產生三維物件之技術
WO2014138386A1 (en) Powder bed fusion systems, apparatus, and processes for multi-material part production
CN109661305B (zh) 用于制备固体药物给药形式的工艺
JP2017119358A (ja) 液体吐出装置および液体吐出方法
US20170216918A1 (en) Methods and systems for fabrication using multi-material and precision alloy droplet jetting
Oropeza et al. A laboratory-scale binder jet additive manufacturing testbed for process exploration and material development
EP3296901B1 (en) Three-dimensional modeling apparatus, method, and computer program
CN104781017B (zh) 形成在基材上的构造体、构造体的制造方法和线图案
Gibson et al. Direct write technologies
Hutchings et al. Introduction to inkjet printing for manufacturing
Umezu et al. Fundamental characteristics of bioprint on calcium alginate gel
WO2018031828A1 (en) Fabrication of three-dimensional materials gradient structures by in-flight curing of aerosols
Bahr et al. A fully 3d printed multi-chip module with an on-package enhanced dielectric lens for mm-wave applications using multimaterial stereo-lithography
CN110407157A (zh) 具有微结构的器件及其制作方法
Charipar et al. Hybrid Manufacturing Technologies for Electromagnetic Structures
US20210094227A1 (en) Extrusion deposition of non-polymers with laser trace
JP2017117581A (ja) 導体の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant