CN107529284B - The device and method for improving circuit board wiring density - Google Patents
The device and method for improving circuit board wiring density Download PDFInfo
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- CN107529284B CN107529284B CN201710674940.2A CN201710674940A CN107529284B CN 107529284 B CN107529284 B CN 107529284B CN 201710674940 A CN201710674940 A CN 201710674940A CN 107529284 B CN107529284 B CN 107529284B
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- circuit board
- protection sleeve
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- pipe
- pressing plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/074—Features related to the fluid pressure
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of device and method for improving circuit board wiring density; including mask plate, pressing plate, protection sleeve and movable plate; protection sleeve upper end is applied in the pressing plate bottom; the protection sleeve is spliced by several blocks of side plates; hollow cavity is equipped in the side plate; it is embedded in the hollow cavity bottom and is provided with the nozzle being emitted obliquely, the nozzle is connected to the hollow cavity, and the shape of through-hole and position correspond in the shape and position and the mask plate of the protection sleeve；Movable plate; the upper end is provided with a closed container for storing etching solution; several first pipes and second pipe are provided through on the movable plate; the first pipe upper end is connected to the closed container; the upper port of sleeve is protected described in the first pipe lower end aligned, the hollow cavity upper end is connected to by a delivery pump with the second pipe.Solves the technical issues of reducing circuit board wiring density since lateral erosion is serious.
Description
Technical field
The present invention relates to circuit board preparation technical fields, it is more particularly related to a kind of raising circuit board wiring
The device and method of density.
Background technique
It is the epoch that news pass now, quick and portably high-quality with multiplexing has been associated electrical or the most basic function of photovoltaic
It tells, therefore Related product must be towards light and short, multifunction, rapid and low price direction in design and manufacture
Development.
Based on this, function function is assembled as carrying and has the high density interconnection substrate (High of filament micro hole
Density Interconnect, HDI) it comes into being immediately, and the demand to route miniaturization technology will be increasingly urgent to, quality
Control require also can be more and more stringent, it means that when line width and line-spacing are more subtle, traditional etching method will face skill
Art limits and is difficult to continue the situation of utilization, and the promotion of etching technique has its necessity.But in the demand of high density graph thinning
Under, when line width and line-spacing are gradually reduced, production degree of difficulty will also increase therewith.
Therefore, for high density imperceptibility demand, copper etch process must do the comprehensive of wide face from entire etch systems
Inquire into, including material, mechanism of action, parameter keyholed back plate and equipment group with etc. correlative factors and level, thinking relevance therebetween
With influential effect；And then it can be under product function demand and quality franchise acceptance, by material property, equipment function and processing procedure
Technology etc. is bright to be ordered clear and does anatomy assessment, is used and is selected material appropriate and equipment, assemble optimal process technique, completes most
Good volume production, can be in increasingly keen competition environment as a result, to reach the production requirement of high yield, high-reliability and low cost
In strengthen strength and advantage, create brand-new business opportunity.
The critical processes for being etched to production metallic conduction transmission circuit of layers of copper, bond material science, materialization principle, stream
Field theory Interface Mechanism, mass-energy transmission, assembles engineering, and measures the group structure of the stage constructions interconnectivity such as inspection analysis and quality verifying
Technology, thus for etch quality requirement, except no broken string, short circuit, protrusion, recess or copper residual etc. bad phenomenons route at
Outside shape appearance and metal interlevel precisely align, it is still necessary to consider the matched electrical factor of impedance (Impedance), according to actual functional capability
Demand, material property function, interfacial structure and property, equipment precision and process parameter, and assemble engineering effort etc., reach tool
Characteristic impedance (the Characteristic of acceptable tolerance (σ of such as 10%, 5%, 2% or 1,3 σ, 6 σ)
Impedance), this is directed to copper chemical etching quality under high density graph thinning demand, therefore electroplating technology institute successively construction shape
At metal layer thickness in addition outside, the fine line circuitry of high-quality is made with etching mode, degree of difficulty is quite high.
Usually before carrying out erosion copper program, one layer of resist (Etching against corrosion can be coated with or pressed according to need in layers of copper
Resist), to protect the copper conductor part for being not intended to eating away.However etching solution is in addition to facing down and carrying out corrosion, also
The layers of copper that two sides are not protected can be attacked, i.e., so-called lateral erosion (Undercut) refers to as layers of copper tissue crystals structure and etching solution not
Make the universal phenomenon of the processing of any directional effect as a result, etching degree i.e. with the development width of resist against corrosion and layers of copper bottom
The etching line width in portion is related, and lateral erosion can generate nosing.The case where usual time of the printed board in etching solution gets over, lateral erosion is tighter
Weight.The serious lateral erosion of Jing Du ﹐ that lateral erosion will seriously affect printed conductor would be impossible to production fine wire.
Summary of the invention
It is an object of the invention to solve at least the above problems, and provide the advantages of at least will be described later.
It is a still further object of the present invention to provide a kind of device and method for improving circuit board wiring density, using protective case
Cylinder is etched liquid invasion degree to reduce conducting wire side wall, and solving reduces circuit board wiring density since lateral erosion is serious
Technical problem.
In order to realize these purposes and other advantages according to the present invention, a kind of circuit board wiring density that improves is provided
Device, comprising:
Mask plate, is movably arranged on circuit board upper end, and the mask plate offers several through-holes；
Pressing plate is movably arranged on the mask plate upper end；
Sleeve is protected, is cross section and the consistent tubular structure in through-hole cross section, the protection sleeve upper end is passed through
Be through the pressing plate bottom, the protection sleeve is spliced by several blocks of side plates, is equipped with hollow cavity in the side plate, it is described in
It is embedded in cavity bottom and is provided with the nozzle being emitted obliquely, the nozzle is connected to the hollow cavity, the protection sleeve
The shape of through-hole and position correspond on shape and position and the mask plate；
Movable plate, the upper end is provided with a closed container for storing etching solution, if being provided through on the movable plate
Dry first pipe and second pipe, the first pipe upper end are connected to the closed container, the first pipe lower end pair
The upper port of the quasi- protection sleeve, the hollow cavity upper end is connected to by a delivery pump with the second pipe.
Preferably, the side plate and pressing plate are made of the material not chemically reacting with the etching solution.
Preferably, the protection sleeve open at its lower end, it is described protection sleeve lower end open ports side wall on be provided with outward
Inclined lead angle, the nozzle are arranged in the lead angle lower end.
Preferably, nozzle lower end outside inclination around, the aperture of the nozzle are less than the thickness of the side plate.
Preferably, the pressing plate upper end is connect by elastic component with the laminating mechanism that one presses downwards.
Preferably, a hammer, the hammer vertical vibration are provided on the pressing plate.
Preferably, the side plate bottom on the outside of the lead angle is provided with a vertical cut head, the vertical cut head
Periphery area is consistent with the through-hole cross-sectional area, and vertical cut head lower end is flushed with the nozzle lower end.
Preferably, the aperture of the first pipe is less than the internal diameter of the protection sleeve.
A kind of engraving method for the method improving circuit board wiring density, comprising the following steps:
Step 1: resist coating, drying, exposure mask, exposure, development on circuit board conductive layer to be etched；
Step 2: pressing plate described in transverse shifting, a pair of by the channel one on each protection sleeve and the photoresist
Standard vertically moves the pressing plate, so that each protection sleeve is fastened in the channel；
Step 3: the mobile movable plate, so that the first pipe is directed at the protection sleeve upper port, while to the
It is passed through etching solution in one pipeline and second pipe, the conductive layer of protection sleeve region is etched；
Step 4: the discharge pressure of the delivery pump is controlled, so that being greater than from the pressure that nozzle sprays etching solution from described
Protect the pressure of sleeve open at its lower end mouth outflow etching solution；
Step 5: the hammer hammers the pressing plate in etching process, the vertical cut head is driven vertically to cut
Conducting wire side wall, until vertical cut head is contradicted to upper surface of base plate；
Step 6: the laminating mechanism provides a lower pressure to the pressing plate, until etching terminates.
Preferably, in etching process, the pressure that the laminating mechanism is applied on the pressing plate is kept constant.
The present invention is include at least the following beneficial effects:
1, protection sleeve is moved down with the increase of etch depth, effectively protects the conducting wire side wall after etching
Get up, the contact area of conducting wire side wall and etching solution is reduced, to reduce the lateral erosion degree of conducting wire side wall；
2, the wiring precision and density of circuit board are improved, so that circuit board light and shortization, route integrated level is higher；
3, side plate lower end is provided with vertical cut head, and in etching process, vertical cut head cuts conducting wire side wall, adds
Fast etching speed, and make the cutting of conducting wire side wall smooth, the fining degree of conducting wire is improved, meanwhile, it improves
The laminating degree of side plate and conducting wire side wall, is further reduced the contact area of conducting wire side wall and etching solution, mentions and doing
Precision at the time of conducting wire.
Further advantage, target and feature of the invention will be partially reflected by the following instructions, and part will also be by this
The research and practice of invention and be understood by the person skilled in the art.
Detailed description of the invention
Fig. 1 is the structural schematic diagram before movable plate and pressing plate docking；
Fig. 2 is the enlarged diagram of part A in Fig. 1；
Fig. 3 is the structural schematic diagram after movable plate and pressing plate docking；
Fig. 4 is structural schematic diagram when sleeve being protected to be inserted into photoresist channel；
After Fig. 5 is etching, protection sleeve contradicts structural schematic diagram when surface on the electrically conductive.
Specific embodiment
Present invention will be described in further detail below with reference to the accompanying drawings, to enable those skilled in the art referring to specification text
Word can be implemented accordingly.
It should be appreciated that such as " having ", "comprising" and " comprising " term used herein do not allot one or more
The presence or addition of a other elements or combinations thereof.
Embodiment one
The present invention provides a kind of device and method for improving circuit board wiring density, as shown in Figs. 1-5, including exposure mask
Version, pressing plate 100, protection sleeve 200 and movable plate 400, wherein mask plate is movably arranged on 300 upper end of circuit board to be etched,
For carrying out exposure mask for the photoresist on circuit board 300, the mask plate offers several through-holes, after exposure mask, exposure, development,
The photoresist 310 of through-hole corresponding region is removed, conductor part to be etched is exposed, is then led to what this was exposed
Body etching, the conductor of reservation is conducting wire.
Pressing plate 100 is movably arranged on the mask plate upper end, after the completion of exposure mask, mask plate can be removed, can will be covered
Film version is retained in original place.
Protecting sleeve 200 is cross section and the consistent tubular structure in through-hole cross section, and is spelled by several blocks of side plates 210
It connects, under normal circumstances, through-hole is rectangular configuration, and therefore, protection sleeve 200 is to be spliced by four blocks of side plates 210 in through-hole
Corresponding rectangular configuration, after development, each protection sleeve 200 is exactly corresponded in the channel of photoresist.The protection sleeve
200 upper ends are applied in 100 bottom of pressing plate, so that protection sleeve 200 remains vertically oriented, and sleeve 200 are protected to press
About 100 plate respectively retains a part, meanwhile, protection 200 upper and lower ends of sleeve are opened wide.Protection 200 lower end of sleeve is opened wide
It is provided with the lead angle being inclined outwardly on mouth side wall, so that open ports lower end cross section is consistent with 210 cross section of side plate.
It is equipped with hollow cavity 213 in the side plate 210,210 upper end of side plate is offered opens with what hollow cavity 213 was connected to
Mouthful, it is embedded in 213 bottom of hollow cavity and is provided with the nozzle 212 being emitted obliquely, specifically, the setting of the nozzle 212 exists
The lead angle lower end so that the tilt angle of nozzle 212 is consistent with the tilt angle of lead angle, the nozzle 212 with it is described hollow
Chamber 213 is connected to, and the shape of through-hole and position correspond in the shape and position and the mask plate of the protection sleeve 200,
Guarantee that etching solution only falls the corresponding Conductive Layer Etch of through-hole position.
400 upper end of movable plate is provided with a closed container 500 for storing etching solution, runs through on the movable plate 400 and sets
It is equipped with several first pipes 410 and second pipe 420,410 upper end of first pipe is connected to the closed container 500,
The upper port of sleeve 200 is protected described in 410 lower end aligned of first pipe, 213 upper end of hollow cavity passes through a delivery pump
430 are connected to the second pipe 420.
Etching solution is flowed into protection sleeve 200 from closed container 500 along first pipe 410, along protection sleeve 200
Cavity and under flowed out from open at its lower end mouth, influenced by lead angle is inclined outwardly, the outflow plane of structure of etching solution is long-pending with side plate 210
Cross section is consistent, that is to say consistent with through-hole cross section, is etched to conductive layer.Period, etching solution is along second pipe 420
It is flowed into hollow cavity 213, delivery pump 430 plays the role of pressurized delivered, since hollow cavity 213 is closed structure, etching solution
After inputting hollow cavity 213 by delivery pump 430, due to the effect of interior pressure, sprayed by 212 high pressure of nozzle, the ejection of nozzle 212
The direction of direction towards lead angle is downward, is injected on the side wall of conducting wire, is etched to conductive layer, meanwhile, to conductor wire
Road precisely etches, and per point space is etched downwards, protection sleeve 200 will move down corresponding distance, etching is finished
Conducting wire side wall afterwards blocks, and conducting wire side wall is avoided further to be etched and lateral erosion occurs, to refer to conductor wire
The fining degree on road, the wiring density for being is higher, and reliability is stronger.
The etching solution flowed out from protection 200 open at its lower end mouth 214 of sleeve, is influenced by lead angle is inclined outwardly, etching solution
The horizontal side plate 210 of outflow and pressing plate 100 are made of the material not chemically reacting with the etching solution, so that side plate 210
It can be chronically in etching solution with pressing plate 100 without deformation.
The nozzle 212 is arranged in the lower end of every block of side plate 210, meanwhile, 212 lower end of nozzle is outer around to be rolled
Tiltedly, it is injected on conducting wire side wall from the etching solution that nozzle 212 sprays outward, etches channel, protect sleeve 200 along erosion
The channel carved moves down, and the conducting wire sidewall-masked that will be etched avoids further occurrence lateral erosion, wherein the spray
The aperture of mouth 212 is less than the thickness of the side plate 210, and etching solution is pressurizeed ejection from nozzle.
100 upper end of pressing plate is connect by elastic component with the laminating mechanism that one presses downwards, in etching process, with
The propulsion of etching degree provides a lower pressure to pressing plate and protection sleeve 200, so that protecting by laminating mechanism and elastic component
Pretective sleeve pipe 200 can constantly move down, the conducting wire sidewall-masked that will have been etched with the intensification of etch depth,
Conducting wire side wall is avoided to contact with etching solution for a long time and increase lateral erosion degree.
In above-mentioned technical proposal, 210 bottom of the side plate on the outside of the lead angle is provided with a vertical cut head 211, institute
The periphery area for stating vertical cut head 211 is consistent with the through-hole cross-sectional area, that is to say, that the outside of vertical cut head 211
Wall is flushed with the lateral wall of side plate 210, for cutting conducting wire side wall, so that conducting wire more flushes precisely, institute
It states 211 lower end of vertical cut head to flush with 212 lower end of nozzle, the etching solution sprayed from nozzle 212, which is injected into, vertically cuts
First 211 lower end periphery is cut, the conductive layer of 211 periphery of vertical cut head is etched, after etching channel, due to vertical cut
First 211 are placed exactly in the upper end of the channel, to be cut into downwards in the channel, together under laminating mechanism under the action of pressure
When, vertical cut head 211 is modified side wall, improves the fining degree of conducting wire.
In above-mentioned technical proposal, a hammer is provided on the pressing plate 100, the hammer vertical vibration is etching
In the process, the conducting wire side wall etched be not it is smooth, laminating mechanism push during, vertical cut head 211 can
The conductive layer for cutting away protrusion can be can not be successfully, so that vertical cut head 211 and protection sleeve 200 can not move down, to understand
Certainly this problem is provided with hammer on pressing plate, and during the depression process, due to the hammering of hammer, vertical cut head 211 is suitable
The conductive layer that benefit excision protrudes protects conducting wire side wall so that protection sleeve smoothly moves down, and avoids that side occurs
Erosion, meanwhile, vertical cut head 211 can make conducting wire side wall more smooth, the fining degree of conducting wire is improved,
Effectively improve wiring density.
In above-mentioned technical proposal, the aperture of the first pipe 410 is less than the internal diameter of the protection sleeve 200, by pressing plate
It moves down, in the lower end cap people to protection sleeve of first pipe 410, etching solution, which is taken advantage of a situation, to be flowed into protection sleeve, to protection sleeve institute
Conductive layer in region is etched, since the aperture of first pipe 410 is less than the internal diameter of the protection sleeve 200, thus, it protects
Etching solution in pretective sleeve pipe 200 is overflowed by protection sleeve upper end, meanwhile, protect the etching solution inside and outside sleeve to circulate
Exchange does not influence to lose so that the etching solution inside protection sleeve 200 is supplemented, and is overflowed the impurity come is etched
Carve the concentration and etch effect of liquid.
A kind of engraving method for the method improving circuit board wiring density, comprising the following steps:
Step 1: resist coating, drying, exposure mask, exposure, development on 300 conductive layer of circuit board to be etched, show
The channel of photoresist, that is, the conductive layer etched will be needed to be exposed；
Step 2: combining each side plate 210 in advance according to the shape of through holes of mask plate and position in 100 bottom of pressing plate, making
Obtain the shape of each protection sleeve 200 and the shape of through holes and position consistency of position and mask plate, the corresponding shape of a through-hole
The identical protection sleeve 200 of shape and position；Mask plate can be removed or be retained mask plate in situ, transverse shifting institute
Pressing plate 100 is stated, each protection sleeve 200 is aligned one by one with the through-hole on mask plate, the channel on the photoresist, is indulged
To the movement pressing plate 100, so that each protection sleeve 200 is fastened in the channel, until protection sleeve lower end
Open ports contradict on the electrically conductive, at this point, side plate side wall is bonded with the photoresist side wall of channel surrounding；
Step 3: the mobile movable plate 400, so that the first pipe 410 is directed at 200 upper end of protection sleeve
Mouthful, and it is inserted into certain distance in protection sleeve, second pipe 420 is reserved with certain distance, while to first pipe 410 and the
It is passed through etching solution in two pipelines 420, the conductive layer of protection 200 region of sleeve is etched；
Step 4: the discharge pressure of the delivery pump 430 is controlled, so that being greater than from the pressure that nozzle 212 sprays etching solution
From the pressure of protection 200 open at its lower end mouth of the sleeve outflow etching solution, so that the etching solution that nozzle sprays is to conductor wire trackside
Wall is etched, and after etching space, by the lower pressure of laminating mechanism, protection sleeve is moved down in the space, with protection
Sleeve covers conducting wire side wall, effectively avoids test；
Step 5: the hammer hammers the pressing plate in etching process, drive the vertical cut head 211 vertical
Conducting wire side wall is cut, the conductive layer for protruding from conducting wire side wall is cut off, so that the folding process of protection sleeve
It is more smooth, effectively conducting wire side wall is carried out to block protection, meanwhile, pass through the cutting of vertical cut head 211, conducting wire
Side wall is more smooth fine, effectively increases the fining degree of conducting wire, improves the wiring density on circuit board, until hanging down
Straight cutting head 211, which contradicts, arrives upper surface of base plate；
Step 6: the laminating mechanism provides a lower pressure to the pressing plate, until etching terminates, be conducive to protective case
Cylinder moves down, and provides conducting wire side wall and blocks protection in real time.
Specifically, being passed through etching solution into first pipe 410 and second pipe 420 simultaneously, etching solution is under protection sleeve
It is sprayed downwards in the open ports of end, the etching solution of ejection is placed exactly on the conductive layer of photoresist trench bottom, is lost on the electrically conductive
The protection consistent groove of 200 cross-sectional area of sleeve is carved, meanwhile, in order to be protected to conducting wire side wall, second pipe 420
In etching solution pressurization be sent in hollow cavity, from the nozzle of lower end pressurize spray, to conducting wire side wall carry out the moment, together
When, vertical cut head 211 vertically cuts conducting wire side wall, cuts off, makes to the conductive layer for protruding from conducting wire side wall
The folding process of sleeve must be protected more smooth, effectively conducting wire side wall is carried out to block protection, avoid that lateral erosion occurs.Together
When, protect the etching solution in sleeve to enter inside protection sleeve 200 from upper end, it is corresponding to protection 200 interior lower end of sleeve
Conductive layer is etched, and the etching solution in sleeve 200 is protected to overflow by upper end opening, thus to the etching solution in protection sleeve
It swaps, guarantees the concentration and etch effect of protection 200 etched inside liquid of sleeve, in etching process, the laminating mechanism
There is provided a lower pressure to the pressing plate 100, as etching degree is goed deep into, laminating mechanism by each protection sleeve 200 gradually
It is pressed into duty groove, side plate will etch the sidewall-masked for the conducting wire come, and it is straight to effectively prevent conducting wire side wall
It connects and is immersed in etching solution, that is to say, that contact area and the time of contact of conducting wire side wall and etching solution are reduced, thus
Reduce lateral erosion degree.With the progress of etching, groove is deeper and deeper, synchronous, and protection 200 insert depth of sleeve is also increasingly
It is deep, synchronous, protect the etching solution inside sleeve 200 to be etched the conductive layer 320 inside protection sleeve 200, side plate will
Conducting wire side wall is completely obscured, is fully etched until by the conductive layer for needing to etch, and protection sleeve 200, which contradicts, arrives base
330 upper surfaces, in the process, due to conducting wire side wall be it is shielded, effectively reduce conducting wire side wall occur side
The degree of erosion, so as to improve the wiring precision and density of circuit board 300, so that 300 light and shortization of circuit board, integrated level
It is higher.
In above-mentioned technical proposal, in etching process, the laminating mechanism is applied to the holding of the pressure on the pressing plate 100
It is constant, and, to pressing plate and protection sleeve pressure, guarantee that protection sleeve can be same with going deep into for groove by elastic component
Step moves down, the synchronous conducting wire sidewall-masked that will be exposed.
From the above mentioned, in the present invention, protection sleeve 200 is moved down with the increase of etch depth, effectively will etching
Conducting wire side wall afterwards protects, and the contact area of conducting wire side wall and etching solution is reduced, to reduce conducting wire
The lateral erosion degree of side wall；Meanwhile the wiring precision and density of circuit board are improved, so that circuit board light and shortization, sets of lines
At Du Genggao；Further, 210 lower end of side plate is provided with vertical cut head 211, and in etching process, vertical cut head 211 is cut
Conducting wire side wall is cut, etching speed is accelerated, and makes the cutting of conducting wire side wall smooth, improves the fine of conducting wire
Change degree, meanwhile, the laminating degree of side plate 210 Yu conducting wire side wall is improved, conducting wire side wall and erosion are further reduced
The contact area for carving liquid, proposes precision at the time of doing conducting wire.
Although the embodiments of the present invention have been disclosed as above, but its is not only in the description and the implementation listed
With it can be fully applied to various fields suitable for the present invention, for those skilled in the art, can be easily
Realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is simultaneously unlimited
In specific details and legend shown and described herein.
Claims (10)
1. a kind of device for improving circuit board wiring density characterized by comprising
Mask plate, is movably arranged on circuit board upper end, and the mask plate offers several through-holes；
Pressing plate is movably arranged on the mask plate upper end；
Sleeve is protected, is cross section and the consistent tubular structure in through-hole cross section, the protection sleeve upper end is applied in
The pressing plate bottom, the protection sleeve are spliced by several blocks of side plates, and hollow cavity, the hollow cavity are equipped in the side plate
It is embedded in bottom and is provided with the nozzle being emitted obliquely, the nozzle is connected to the hollow cavity, the shape of the protection sleeve
It is corresponded with the shape of through-hole on position and the mask plate and position；
Movable plate, the upper end are provided with a closed container for storing etching solution, are provided through several on the movable plate
First pipe and second pipe, the first pipe upper end are connected to the closed container, the first pipe lower end aligned institute
The upper port of protection sleeve is stated, the hollow cavity upper end is connected to by a delivery pump with the second pipe.
2. improving the device of circuit board wiring density as described in claim 1, which is characterized in that the side plate and pressing plate by with
The material that the etching solution does not chemically react is made.
3. improving the device of circuit board wiring density as claimed in claim 2, which is characterized in that the protection sleeve lower end is spacious
It opens, is provided with the lead angle being inclined outwardly on the open ports side wall of the protection sleeve lower end, the nozzle is arranged in the lead angle
Lower end.
4. improving the device of circuit board wiring density as claimed in claim 3, which is characterized in that the nozzle lower end is around
Outside inclination, the aperture of the nozzle are less than the thickness of the side plate.
5. improving the device of circuit board wiring density as claimed in claim 4, which is characterized in that the pressing plate upper end passes through bullet
Property part is connect with the laminating mechanism that one presses downwards.
6. improving the device of circuit board wiring density as claimed in claim 5, which is characterized in that described on the outside of the lead angle
Side plate bottom is provided with a vertical cut head, and the periphery area of the vertical cut head is consistent with the through-hole cross-sectional area, institute
Vertical cut head lower end is stated to flush with the nozzle lower end.
7. improving the device of circuit board wiring density as claimed in claim 6, which is characterized in that be provided with one on the pressing plate
Hammer, the hammer vertical vibration.
8. improving the device of circuit board wiring density as claimed in claim 7, which is characterized in that the aperture of the first pipe
Less than the internal diameter of the protection sleeve.
9. a kind of engraving method for the method for improving circuit board wiring density, this method are improved using as claimed in claim 7
The device of circuit board wiring density, which comprises the following steps:
Step 1: resist coating, drying, exposure mask, exposure, development on circuit board conductive layer to be etched；
Step 2: pressing plate described in transverse shifting, each protection sleeve is aligned one by one with the channel on the photoresist, indulge
To the movement pressing plate, so that each protection sleeve is fastened in the channel；
Step 3: the mobile movable plate, so that the first pipe is directed at the protection sleeve upper port, while being managed to first
It is passed through etching solution in road and second pipe, the conductive layer of protection sleeve region is etched；
Step 4: the discharge pressure of the delivery pump is controlled, so that being greater than from the pressure that nozzle sprays etching solution from the protection
The pressure of sleeve open at its lower end mouth outflow etching solution；
Step 5: the hammer hammers the pressing plate in etching process, the vertical cut head is driven vertically to cut conduction
Route side wall, until vertical cut head is contradicted to upper surface of base plate；
Step 6: the laminating mechanism provides a lower pressure to the pressing plate, until etching terminates.
10. improving the engraving method of the device and method of circuit board wiring density as claimed in claim 7, which is characterized in that
In etching process, the pressure that the laminating mechanism is applied on the pressing plate is kept constant.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710674940.2A CN107529284B (en) | 2017-08-09 | 2017-08-09 | The device and method for improving circuit board wiring density |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710674940.2A CN107529284B (en) | 2017-08-09 | 2017-08-09 | The device and method for improving circuit board wiring density |
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| CN107529284B true CN107529284B (en) | 2019-07-09 |
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| WO2007007393A1 (en) * | 2005-07-11 | 2007-01-18 | Sony Chemicals Corporation | Etching device and etching method |
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| CN103046049A (en) * | 2011-10-11 | 2013-04-17 | 开美科技股份有限公司 | Etching method and etching device |
| CN204906874U (en) * | 2015-09-14 | 2015-12-23 | 中山市鸿博化工助剂有限公司 | Novel etching solution sprays device |
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| JP2005200684A (en) * | 2004-01-14 | 2005-07-28 | Sony Chem Corp | Etching method and etching device |
| WO2007007393A1 (en) * | 2005-07-11 | 2007-01-18 | Sony Chemicals Corporation | Etching device and etching method |
| CN103046049A (en) * | 2011-10-11 | 2013-04-17 | 开美科技股份有限公司 | Etching method and etching device |
| CN202730238U (en) * | 2012-06-08 | 2013-02-13 | 镇江华印电路板有限公司 | Novel etching machine |
| CN204906874U (en) * | 2015-09-14 | 2015-12-23 | 中山市鸿博化工助剂有限公司 | Novel etching solution sprays device |
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| CN107529284A (en) | 2017-12-29 |
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