CN109688732A - A kind of processing method ceramic circuit board hole wall surface modification and metallized - Google Patents
A kind of processing method ceramic circuit board hole wall surface modification and metallized Download PDFInfo
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- CN109688732A CN109688732A CN201811602029.1A CN201811602029A CN109688732A CN 109688732 A CN109688732 A CN 109688732A CN 201811602029 A CN201811602029 A CN 201811602029A CN 109688732 A CN109688732 A CN 109688732A
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- hole wall
- copper
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- windowing
- hole
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Abstract
The present invention provides the processing method that a kind of ceramic circuit board hole wall surface is modified and metallizes, which is characterized in that the double-surface ceramics plate includes intermediate ceramic layer and the copper clad layers that ceramic layer two sides are arranged in；The following steps are included: S1. ceramic base material prepares；S2. pre-etched opens a window before laser drill；S3. hole metallization carries out electroless copper plating after laser drill.The present invention is used as basic material to process using the high temperature sintering ceramics for covering copper, it is ensured that original base copper has good adhesive force；Suitable copper thickness can be selected according to customer requirement simultaneously, reduces subsequent electroplating time, maximized and improved electroplating efficiency.
Description
Technical field
The invention belongs to wiring board processing technique fields, and in particular to a kind of ceramic circuit board hole wall surface is modified and metal
The processing method of change.
Background technique
Ceramic base material has excellent temperature tolerance, endurance, dimensional stability and high-termal conductivity, therefore in certain special necks
Domain has irreplaceable technology status；The common ceramic base material of industry is based on aluminum oxide or aluminium nitride at present, substrate
It surface can vacuum electric copper facing after high temperature sintering copper foil or specially treated；The hardness of ceramic base material is very high, reaches 1500HV or more, surpasses
It crosses the hardness of many alloy drills, therefore hole machined is difficult to realize using conventional machine drilling mode, current industry is universal
Way is the hole metallization again that drilled using laser mode, but if ceramic substrate surface has covered copper: then copper thickness will have a direct impact on sharp
The quality in drill finish hole, therefore double-surface ceramics plate purchases pure ceramic base material (not covering copper) Lai Jiagong mostly, detailed process is as follows:
Pure ceramic base material (not covering copper) → laser drill → vacuum plating → electro-coppering thickening → pattern transfer
→ etching → conductive pattern needed.
It is processed by above-mentioned process and method, expensive vacuum plating equipment need to be used, general PCB factory does not have；Simultaneously
The copper-plated binding force of vacuum electric does not have the good of high temperature sintering, and thickness is very thin, and plating for a long time is needed to thicken afterwards, when client needs
When wanting 100-200um thickness copper, electroplating time is up to 5H or more, and inefficiency is unable to satisfy batch machining requirement, therefore is badly in need of
A kind of industrialized ceramic wafer batch processing method is developed on traditional PCB Process ba- sis.
Meanwhile according to prior art traditional ceramics plate processing method, it is mainly also faced with following technical disadvantages:
A. it needs using expensive vacuum plating equipment, general PCB factory does not have；Simultaneous processing higher cost does not have competition
Advantage；
B. the copper-plated binding force of ceramic surface vacuum electric is not good enough, good without the adhesive force of high temperature sintering copper foil；
C. the copper-plated thickness of vacuum electric is very thin, and plating for a long time is needed to thicken afterwards, when client needs 100-200um thickness copper,
Its electroplating time is up to 5H or more, and inefficiency is unable to satisfy batch machining requirement.
Summary of the invention
In view of this, the present invention provides the processing method that a kind of ceramic circuit board hole wall surface is modified and metallizes, this hair
It is bright to be used as basic material to process using the high temperature sintering ceramics for covering copper, it is ensured that original base copper has good adhesive force；It simultaneously can
Suitable copper thickness is selected according to customer requirement, reduces subsequent electroplating time, is maximized and is improved electroplating efficiency.
The technical solution of the present invention is as follows: the processing method of a kind of ceramic circuit board hole wall surface modification and metallization, special
Sign is that the double-surface ceramics plate includes intermediate ceramic layer and the copper clad layers that ceramic layer two sides are arranged in；Including following step
It is rapid:
S1. ceramic base material prepares；
S2. pre-etched opens a window before laser drill；
S3. hole metallization carries out electroless copper plating after laser drill；
The step S2 comprising the following specific steps
S21. document design designs windowing file at plated through-hole position；
S22. part windowing, first whole plate paste dry film, then with windowing file exposure, expose copper face after development；
S23. local etching etches away the copper face of windowing, exposes ceramic base material；
S24. plating thickeies, and hole copper is added the thickness requirement for being plated to client's needs by whole plate plating.
Further, in the step S21, windowing file and hole etc. are big.
Further, the intermediate ceramic layer is aluminum oxide ceramic layer.
Further, the ceramic substrate structure in step S1, top layer and bottom double-sided copper-clad, copper thickness can be according to requiring
Selection；Intermediate insulating layer is aluminum oxide ceramic substrate, and thickness can also be according to requiring to be adjusted；Using the above sintering
Ceramic structure, it can be ensured that original base copper has good adhesive force, while aluminum oxide substrate can be carried out by special method
Chemistry roughening, can be improved the reliability of the via hole.
Further, in step S3, including electroless copper plating is carried out after laser drill, specifically include:
S31. hole wall cleans: cleaning hole wall using sandblasting mode；
S32. hole wall is roughened: being roughened hole wall using NaOH lye；
S33. it metallizes: the via hole is carried out using traditional electroless copper plating mode.
The present invention also provides the processing methods that a kind of ceramic circuit board hole wall surface is modified and metallizes, which is characterized in that
The following steps are included:
A. ceramic base material prepares；
B. project file makes, and outside the conventional drilling of design, route, test and outer shape files, increases pre-etched windowing text
Part, pre-etched windowing file are design and hole on the copper face at ceramic wafer plated through-hole position in advance before laser drill
Etc. big windowing；
C. pre-etched opens a window；
D. laser drill, by MI drilling file, using laser processing mode holes drilled through；
E. hole wall is roughened；
F. it hole metallization: metallizes by traditional electroless copper plating mode to hole wall；
G. a bronze medal is electroplated: hole copper and table copper thickness are electroplated onto specified thickness requirement；
H. it outer-layer circuit: presses negative film technique and carries out pattern transfer；
I. acid etching: suitable parameter is selected according to copper thickness, the conductive pattern needed after etching；
J. postorder is processed: semi-finished product are obtained after outer layer etching, it is subsequent to finish turmeric, test, laser profile, finished product by MI requirement
Inspection.
Further, in the step A, including requiring purchase same size according to Customer Media thickness and surface copper thickness
Sintered ceramic substrate；The scantling big 12mm or more more unilateral than the finished size that client processes.
Further, in the step C, comprising the following steps:
C1. it pastes dry film: pasting photosensitive dry film in ceramic wafer upper and lower surface；
C2. pattern transfer: pattern transfer is carried out by etching windowing file, exposes copper face after development；
C3. acid etching: the copper face of windowing is etched away, and exposes ceramic base material.
Further, in the step E, comprising the following steps:
E1. hole wall cleans: cleaning hole wall using sandblasting mode；Speed 0.5-1.5m/min, pressure 4-6kg；
E2. hole wall is roughened: hole wall is roughened using NaOH lye combination ultrasonic wave, the concentration of the NaOH lye is 40-60g/L,
Processing temperature is 65-85 DEG C, handles time 10-20min.
The innovation of the invention consists in that:
1, the present invention directlys adopt the high temperature sintering ceramics (Al for covering copper as a kind of method for improving ceramic electroplating efficiency2O3)
It is processed as basic material, it is ensured that original base copper has good adhesive force；Suitable copper can be selected according to customer requirement simultaneously
Foil thickness reduces subsequent electroplating time, electroplating efficiency is greatly improved；
2, pre-etched windowing technology before laser drill, is pre-designed the windowing big with hole etc. on the copper face at plated through-hole position,
Expose ceramic base material after etching, avoiding surface from covering copper influences laser drilled via quality, reaches the processing effect the same with the drilling of naked substrate
Fruit；
3, then ceramic hole wall method of roughening is roughened hole wall with aqueous alkali cooperation ultrasonic wave, is enhanced hole wall using sandblasting precleaning
Binding force；
4, ceramic the via hole: routinely the heavy copper liquid medicine of PCB carries out electroless copper plating, realizes ceramic the via hole, thus
Replace expensive vacuum plating equipment, greatly reduction production cost, and meets mass production requirement.
The beneficial effects of the present invention are:
The high temperature sintering ceramics of copper are covered as basic material to process 1. directlying adopt, it is ensured that original base copper has good attachment
Power；Suitable copper thickness can be selected according to customer requirement simultaneously, reduces subsequent electroplating time, maximizes and improves electroplating efficiency；
2. pre-etched opens a window: before laser drill, the windowing big with hole etc. is pre-designed on the copper face at plated through-hole position, is lost
Expose ceramic base material after quarter, avoid surface cover copper influence laser drilled via quality, reach with naked substrate drilling processing effect；
3. ceramic hole wall electroless copper plating: being roughened hole wall using sandblasting+aqueous alkali cooperation ultrasonic wave, then routinely PCB sinks copper medicine
Water carries out electroless copper plating, realizes hole metallization, replaces expensive vacuum plating equipment, greatly reduction production cost, and satisfaction batch
Measure production requirement.
Detailed description of the invention
Fig. 1 is the process flow chart of the embodiment of the present invention 2.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1
A kind of processing method ceramic circuit board hole wall surface modification and metallized, which is characterized in that the double-surface ceramics plate packet
It includes intermediate ceramic layer and the copper clad layers of ceramic layer two sides is set；The following steps are included:
S1. ceramic base material prepares；
S2. pre-etched opens a window before laser drill；
S3. hole metallization carries out electroless copper plating after laser drill；
The step S2 comprising the following specific steps
S21. document design designs windowing file at plated through-hole position；
S22. part windowing, first whole plate paste dry film, then with windowing file exposure, expose copper face after development；
S23. local etching etches away the copper face of windowing, exposes ceramic base material；
S24. plating thickeies, and hole copper is added the thickness requirement for being plated to client's needs by whole plate plating.
Further, in the step S21, windowing file and hole etc. are big.
Further, the intermediate ceramic layer is aluminum oxide ceramic layer.
Further, the ceramic substrate structure in step S1, top layer and bottom double-sided copper-clad, copper thickness can be according to requiring
Selection；Intermediate insulating layer is aluminum oxide ceramic substrate, and thickness can also be according to requiring to be adjusted；Using the above sintering
Ceramic structure, it can be ensured that original base copper has good adhesive force, while aluminum oxide substrate can be carried out by special method
Chemistry roughening, can be improved the reliability of the via hole.
Further, in step S3, including electroless copper plating is carried out after laser drill, specifically include:
S31. hole wall cleans: cleaning hole wall using sandblasting mode；
S32. hole wall is roughened: being roughened hole wall using NaOH lye；
S33. it metallizes: the via hole is carried out using traditional electroless copper plating mode.
Embodiment 2
A kind of processing method ceramic circuit board hole wall surface modification and metallized, which comprises the following steps:
A. ceramic base material prepares；
B. project file makes, and outside the conventional drilling of design, route, test and outer shape files, increases pre-etched windowing text
Part, pre-etched windowing file are design and hole on the copper face at ceramic wafer plated through-hole position in advance before laser drill
Etc. big windowing；
C. pre-etched opens a window；
D. laser drill, by MI drilling file, using laser processing mode holes drilled through；
E. hole wall is roughened；
F. it hole metallization: metallizes by traditional electroless copper plating mode to hole wall；
G. a bronze medal is electroplated: hole copper and table copper thickness are electroplated onto specified thickness requirement；
H. it outer-layer circuit: presses negative film technique and carries out pattern transfer；
I. acid etching: suitable parameter is selected according to copper thickness, the conductive pattern needed after etching；
J. postorder is processed: semi-finished product are obtained after outer layer etching, it is subsequent to finish turmeric, test, laser profile, finished product by MI requirement
Inspection.
Further, in the step A, including requiring purchase same size according to Customer Media thickness and surface copper thickness
Sintered ceramic substrate；The scantling big 12mm or more more unilateral than the finished size that client processes.
Further, in the step C, comprising the following steps:
C1. it pastes dry film: pasting photosensitive dry film in ceramic wafer upper and lower surface；
C2. pattern transfer: pattern transfer is carried out by etching windowing file, exposes copper face after development；
C3. acid etching: the copper face of windowing is etched away, and exposes ceramic base material.
Further, in the step E, comprising the following steps:
E1. hole wall cleans: cleaning hole wall using sandblasting mode；Speed 1.0m/min, pressure 5kg；
E2. hole wall is roughened: being roughened hole wall using NaOH lye combination ultrasonic wave, the concentration of the NaOH lye is 50g/L, processing
Temperature is 75 DEG C, handles time 15min.
Embodiment 3
A kind of processing method ceramic circuit board hole wall surface modification and metallized, which comprises the following steps:
A. ceramic base material prepares；
B. project file makes, and outside the conventional drilling of design, route, test and outer shape files, increases pre-etched windowing text
Part, pre-etched windowing file are design and hole on the copper face at ceramic wafer plated through-hole position in advance before laser drill
Etc. big windowing；
C. pre-etched opens a window；
D. laser drill, by MI drilling file, using laser processing mode holes drilled through；
E. hole wall is roughened；
F. it hole metallization: metallizes by traditional electroless copper plating mode to hole wall；
G. a bronze medal is electroplated: hole copper and table copper thickness are electroplated onto specified thickness requirement；
H. it outer-layer circuit: presses negative film technique and carries out pattern transfer；
I. acid etching: suitable parameter is selected according to copper thickness, the conductive pattern needed after etching；
J. postorder is processed: semi-finished product are obtained after outer layer etching, it is subsequent to finish turmeric, test, laser profile, finished product by MI requirement
Inspection.
Further, in the step A, including requiring purchase same size according to Customer Media thickness and surface copper thickness
Sintered ceramic substrate；The scantling big 12mm or more more unilateral than the finished size that client processes.
Further, in the step C, comprising the following steps:
C1. it pastes dry film: pasting photosensitive dry film in ceramic wafer upper and lower surface；
C2. pattern transfer: pattern transfer is carried out by etching windowing file, exposes copper face after development；
C3. acid etching: the copper face of windowing is etched away, and exposes ceramic base material.
Further, in the step E, comprising the following steps:
E1. hole wall cleans: cleaning hole wall using sandblasting mode；Speed 0.5m/min, pressure 4kg；
E2. hole wall is roughened: being roughened hole wall using NaOH lye combination ultrasonic wave, the concentration of the NaOH lye is 40g/L, processing
Temperature is 65 DEG C, handles time 20min.
Embodiment 4
A kind of processing method ceramic circuit board hole wall surface modification and metallized, which comprises the following steps:
A. ceramic base material prepares；
B. project file makes, and outside the conventional drilling of design, route, test and outer shape files, increases pre-etched windowing text
Part, pre-etched windowing file are design and hole on the copper face at ceramic wafer plated through-hole position in advance before laser drill
Etc. big windowing；
C. pre-etched opens a window；
D. laser drill, by MI drilling file, using laser processing mode holes drilled through；
E. hole wall is roughened；
F. it hole metallization: metallizes by traditional electroless copper plating mode to hole wall；
G. a bronze medal is electroplated: hole copper and table copper thickness are electroplated onto specified thickness requirement；
H. it outer-layer circuit: presses negative film technique and carries out pattern transfer；
I. acid etching: suitable parameter is selected according to copper thickness, the conductive pattern needed after etching；
J. postorder is processed: semi-finished product are obtained after outer layer etching, it is subsequent to finish turmeric, test, laser profile, finished product by MI requirement
Inspection.
Further, in the step A, including requiring purchase same size according to Customer Media thickness and surface copper thickness
Sintered ceramic substrate；The scantling big 12mm or more more unilateral than the finished size that client processes.
Further, in the step C, comprising the following steps:
C1. it pastes dry film: pasting photosensitive dry film in ceramic wafer upper and lower surface；
C2. pattern transfer: pattern transfer is carried out by etching windowing file, exposes copper face after development；
C3. acid etching: the copper face of windowing is etched away, and exposes ceramic base material.
Further, in the step E, comprising the following steps:
E1. hole wall cleans: cleaning hole wall using sandblasting mode；Speed 1.5m/min, pressure 6kg；
E2. hole wall is roughened: being roughened hole wall using NaOH lye combination ultrasonic wave, the concentration of the NaOH lye is 60g/L, processing
Temperature is 85 DEG C, handles time 10min.
Embodiment 5
A kind of processing method ceramic circuit board hole wall surface modification and metallized, which comprises the following steps:
A. ceramic base material prepares；
B. project file makes, and outside the conventional drilling of design, route, test and outer shape files, increases pre-etched windowing text
Part, pre-etched windowing file are design and hole on the copper face at ceramic wafer plated through-hole position in advance before laser drill
Etc. big windowing；
C. pre-etched opens a window；
D. laser drill, by MI drilling file, using laser processing mode holes drilled through；
E. hole wall is roughened；
F. it hole metallization: metallizes by traditional electroless copper plating mode to hole wall；
G. a bronze medal is electroplated: hole copper and table copper thickness are electroplated onto specified thickness requirement；
H. it outer-layer circuit: presses negative film technique and carries out pattern transfer；
I. acid etching: suitable parameter is selected according to copper thickness, the conductive pattern needed after etching；
J. postorder is processed: semi-finished product are obtained after outer layer etching, it is subsequent to finish turmeric, test, laser profile, finished product by MI requirement
Inspection.
Further, in the step A, including requiring purchase same size according to Customer Media thickness and surface copper thickness
Sintered ceramic substrate；The scantling big 12mm or more more unilateral than the finished size that client processes.
Further, in the step C, comprising the following steps:
C1. it pastes dry film: pasting photosensitive dry film in ceramic wafer upper and lower surface；
C2. pattern transfer: pattern transfer is carried out by etching windowing file, exposes copper face after development；
C3. acid etching: the copper face of windowing is etched away, and exposes ceramic base material.
Further, in the step E, comprising the following steps:
E1. hole wall cleans: cleaning hole wall using sandblasting mode；Speed 0.8m/min, pressure 4.5kg；
E2. hole wall is roughened: being roughened hole wall using NaOH lye combination ultrasonic wave, the concentration of the NaOH lye is 55g/L, processing
Temperature is 70 DEG C, handles time 17min.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, it can be by appointing
One prior art is realized.
Claims (9)
1. the processing method of a kind of ceramic circuit board hole wall surface modification and metallization, which is characterized in that the double-surface ceramics plate
Including intermediate ceramic layer and the copper clad layers of ceramic layer two sides are set；The following steps are included:
S1. ceramic base material prepares；
S2. pre-etched opens a window before laser drill；
S3. hole metallization carries out electroless copper plating after laser drill；
The step S2 comprising the following specific steps
S21. document design designs windowing file at plated through-hole position；
S22. part windowing, first whole plate paste dry film, then with windowing file exposure, expose copper face after development；
S23. local etching etches away the copper face of windowing, exposes ceramic base material；
S24. plating thickeies, and hole copper is added the thickness requirement for being plated to client's needs by whole plate plating.
2. the processing method of a kind of ceramic circuit board hole wall surface modification according to claim 1 and metallization, feature
It is, further, in the step S21, windowing file and hole etc. are big.
3. the processing method of a kind of ceramic circuit board hole wall surface modification according to claim 1 and metallization, feature
It is, the intermediate ceramic layer is aluminum oxide ceramic layer.
4. the processing method of a kind of ceramic circuit board hole wall surface modification according to claim 1 and metallization, feature
It is, the ceramic substrate structure in step S1, top layer and bottom double-sided copper-clad, copper thickness can be according to requiring to select；It is intermediate exhausted
Edge layer is aluminum oxide ceramic substrate, and thickness can also be according to requiring to be adjusted.
5. the processing method of a kind of ceramic circuit board hole wall surface modification according to claim 1 and metallization, feature
It is, in step S3, including carries out electroless copper plating after laser drill, specifically include:
S31. hole wall cleans: cleaning hole wall using sandblasting mode；
S32. hole wall is roughened: being roughened hole wall using NaOH lye；
S33. it metallizes: the via hole is carried out using traditional electroless copper plating mode.
6. the processing method of a kind of ceramic circuit board hole wall surface modification and metallization, which comprises the following steps:
A. ceramic base material prepares；
B. project file makes, and outside the conventional drilling of design, route, test and outer shape files, increases pre-etched windowing text
Part, pre-etched windowing file are design and hole on the copper face at ceramic wafer plated through-hole position in advance before laser drill
Etc. big windowing；
C. pre-etched opens a window；
D. laser drill, by MI drilling file, using laser processing mode holes drilled through；
E. hole wall is roughened；
F. it hole metallization: metallizes by traditional electroless copper plating mode to hole wall；
G. a bronze medal is electroplated: hole copper and table copper thickness are electroplated onto specified thickness requirement；
H. it outer-layer circuit: presses negative film technique and carries out pattern transfer；
I. acid etching: suitable parameter is selected according to copper thickness, the conductive pattern needed after etching；
J. postorder is processed: semi-finished product are obtained after outer layer etching, it is subsequent to finish turmeric, test, laser profile, finished product by MI requirement
Inspection.
7. the processing method of a kind of ceramic circuit board hole wall surface modification according to claim 6 and metallization, feature
It is, in the step A, the sintering ceramic base including requiring purchase same size according to Customer Media thickness and surface copper thickness
Plate；The scantling big 12mm or more more unilateral than the finished size that client processes.
8. the processing method of a kind of ceramic circuit board hole wall surface modification according to claim 6 and metallization, feature
It is, in the step C, comprising the following steps:
C1. it pastes dry film: pasting photosensitive dry film in ceramic wafer upper and lower surface；
C2. pattern transfer: pattern transfer is carried out by etching windowing file, exposes copper face after development；
C3. acid etching: the copper face of windowing is etched away, and exposes ceramic base material.
9. the processing method of a kind of ceramic circuit board hole wall surface modification according to claim 6 and metallization, feature
It is, in the step E, comprising the following steps:
E1. hole wall cleans: cleaning hole wall using sandblasting mode；Speed 0.5-1.5m/min, pressure 4-6kg；
E2. hole wall is roughened: hole wall is roughened using NaOH lye combination ultrasonic wave, the concentration of the NaOH lye is 40-60g/L,
Processing temperature is 65-85 DEG C, handles time 10-20min.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110868810A (en) * | 2019-10-23 | 2020-03-06 | 广州陶积电电子科技有限公司 | High-thickness-to-diameter ratio ceramic circuit board processing method and ceramic circuit board |
| CN117528917A (en) * | 2024-01-04 | 2024-02-06 | 深圳捷多邦科技有限公司 | Circuit board and preparation method thereof |
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| CN101690435A (en) * | 2007-06-28 | 2010-03-31 | 英特尔公司 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
| CN101883473A (en) * | 2009-05-08 | 2010-11-10 | 赫克斯科技股份有限公司 | Double-faced electricity conductive composite board and manufacture method thereof |
| JP2018056456A (en) * | 2016-09-30 | 2018-04-05 | 日亜化学工業株式会社 | Printed board, light-emitting device, and methods for manufacturing the same |
| CN107022747A (en) * | 2017-04-05 | 2017-08-08 | 武汉光谷创元电子有限公司 | Microwave-medium part and its manufacture method |
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| CN117528917B (en) * | 2024-01-04 | 2024-03-22 | 深圳捷多邦科技有限公司 | Circuit board and preparation method thereof |
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