CN107475689A - 一种改善理想机台沉积ALOx膜均匀性的方法 - Google Patents

一种改善理想机台沉积ALOx膜均匀性的方法 Download PDF

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CN107475689A
CN107475689A CN201710750842.2A CN201710750842A CN107475689A CN 107475689 A CN107475689 A CN 107475689A CN 201710750842 A CN201710750842 A CN 201710750842A CN 107475689 A CN107475689 A CN 107475689A
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support plate
deposition
intracavitary
silicon chip
alox
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蔡新兴
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Changzhou EGing Photovoltaic Technology Co Ltd
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Changzhou EGing Photovoltaic Technology Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/403Oxides of aluminium, magnesium or beryllium

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Photovoltaic Devices (AREA)

Abstract

本发明涉及一种改善理想机台沉积ALOx膜均匀性的方法,具有如下步骤:a、在工艺开始时先控制机台腔内载板进行摆动1~5秒;b、工艺气体通入,载板在腔内摆动,在硅片上沉积ALOx镀膜;c、沉积完毕,停止向腔内通入工艺气体,载板继续摆动1~5秒时间;d、载板停止摆动,取出已沉积镀膜好的硅片。本发明通过改变原先工艺过程中载板摆动与工艺气体供应之间的动作顺序,解决了由于供气与载板摆动造成的片内均匀性较差问题,从而达到了提升硅片镀膜均匀性的目的,改善了片内均匀性,提高了太阳电池效率与外观均一性。

Description

一种改善理想机台沉积ALOx膜均匀性的方法
技术领域
本发明涉及一种太阳能电池片制作工艺中用于改善理想ALD机台沉积ALOx膜均匀性的方法。
背景技术
太阳能电池片制作工艺中,理想ALD机台为板式上镀膜ALD方式沉积ALOx,机台的沉积原理为:TMA先与硅基体反应后与水蒸气反应,在硅基体沉积ALOx膜;气体出气上盖板分布的出气孔以H2O—N2—TMA—N2顺序排布,通过载板在腔内摆动达到沉积ALOx的目的,工艺中先通工艺气体后工艺腔内载板开始摆动,工艺结束时载板停止摆动同时停止供气。目前这种工艺气体的进气、断气和载板摆动开始、停止之间的顺序,经常会导致镀膜存在硅片内均匀性较差的情况出现,因为在先通气后载板摆动时会出现ALOx只沉积在TMA出气孔部分,后续载板摆动时均匀沉积在整个硅片;在工艺结束时供气与载板摆动同时停止但是供气管路中会存在部分残留气体,这会导致这部分残留气体沉积在硅片特定部位影响了硅片沉积的ALOx膜的均匀性。
发明内容
本发明要解决的技术问题是:为了克服现有技术中之不足,本发明提供一种改善理想机台沉积ALOx膜均匀性的方法,以解决镀膜时由于供气与载板摆动造成的硅片内部均匀性较差的问题。
本发明解决其技术问题所采用的技术方案是:一种改善理想机台沉积ALOx膜均匀性的方法,具有如下步骤:
a、在工艺开始时先控制机台腔内载板进行摆动1~5秒;
b、工艺气体通入,载板在腔内摆动,在硅片上沉积ALOx镀膜;
c、沉积完毕,停止向腔内通入工艺气体,载板继续摆动1~5秒时间;
d、载板停止摆动后,取出已沉积镀膜好的硅片。
本发明的有益效果是:本发明通过改变原先工艺过程中载板摆动与工艺气体供应之间的动作顺序,解决了由于供气与载板摆动造成的片内均匀性较差问题,从而达到了提升硅片镀膜均匀性的目的,改善了片内均匀性,提高了太阳电池效率与外观均一性。
具体实施方式
一种改善理想机台沉积ALOx膜均匀性的方法,具有如下步骤:
a、在工艺开始时先控制机台腔内载板进行摆动5秒钟;
b、将沉积所需的工艺气体通入腔内,载板在腔内摆动,从而在硅片上沉积ALOx镀膜;
c、沉积处理先完毕,停止向腔内通入工艺气体,载板继续摆动5秒钟时间后停止;
d、载板停止摆动后,取出已沉积镀膜好的硅片。
本发明改变了原先工艺过程中载板摆动与工艺气体供应之间的动作顺序,解决了由于供气与载板摆动造成的片内均匀性较差问题,从而达到了提升硅片镀膜均匀性的目的,改善了片内均匀性,提高了太阳电池效率与外观均一性。
以上述依据本发明的理想实施例为启示,通过上述的说明内容,相关工作人员完全可以在不偏离本项发明技术思想的范围内,进行多样的变更以及修改。本项发明的技术性范围并不局限于说明书上的内容,必须要根据权利要求范围来确定其技术性范围。

Claims (1)

1.一种改善理想机台沉积ALOx膜均匀性的方法,其特征是:具有如下步骤:
a、在工艺开始时先控制机台腔内载板进行摆动1~5秒;
b、工艺气体通入,载板在腔内摆动,在硅片上沉积ALOx镀膜;
c、沉积完毕,停止向腔内通入工艺气体,载板继续摆动1~5秒时间;
d、载板停止摆动后,取出已沉积镀膜好的硅片。
CN201710750842.2A 2017-08-28 2017-08-28 一种改善理想机台沉积ALOx膜均匀性的方法 Pending CN107475689A (zh)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01247503A (ja) * 1988-03-30 1989-10-03 Tdk Corp 磁性粒子およびその製造方法
CN101415862A (zh) * 2006-03-29 2009-04-22 伊斯曼柯达公司 原子层沉积装置
CN101527254A (zh) * 2007-11-08 2009-09-09 应用材料股份有限公司 用于膜均匀性的旋转温控基板底座
CN102308381A (zh) * 2009-02-11 2012-01-04 应用材料公司 非接触性基板处理
CN102953047A (zh) * 2011-08-17 2013-03-06 东京毅力科创株式会社 成膜装置
CN104342637A (zh) * 2013-07-26 2015-02-11 北京北方微电子基地设备工艺研究中心有限责任公司 一种原子层沉积设备
CN105543792A (zh) * 2015-12-11 2016-05-04 中国电子科技集团公司第四十八研究所 磁控溅射装置及磁控溅射方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01247503A (ja) * 1988-03-30 1989-10-03 Tdk Corp 磁性粒子およびその製造方法
CN101415862A (zh) * 2006-03-29 2009-04-22 伊斯曼柯达公司 原子层沉积装置
CN101527254A (zh) * 2007-11-08 2009-09-09 应用材料股份有限公司 用于膜均匀性的旋转温控基板底座
CN102308381A (zh) * 2009-02-11 2012-01-04 应用材料公司 非接触性基板处理
CN102953047A (zh) * 2011-08-17 2013-03-06 东京毅力科创株式会社 成膜装置
CN104342637A (zh) * 2013-07-26 2015-02-11 北京北方微电子基地设备工艺研究中心有限责任公司 一种原子层沉积设备
CN105543792A (zh) * 2015-12-11 2016-05-04 中国电子科技集团公司第四十八研究所 磁控溅射装置及磁控溅射方法

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Application publication date: 20171215