CN107469246B - Nose plug type respirator - Google Patents

Nose plug type respirator Download PDF

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Publication number
CN107469246B
CN107469246B CN201610399521.8A CN201610399521A CN107469246B CN 107469246 B CN107469246 B CN 107469246B CN 201610399521 A CN201610399521 A CN 201610399521A CN 107469246 B CN107469246 B CN 107469246B
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CN
China
Prior art keywords
fluid
nasal
filter chip
substrate
respirator
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Application number
CN201610399521.8A
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Chinese (zh)
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CN107469246A (en
Inventor
杨国勇
史建伟
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Suzhou Suri Membrane Nanotechnology Co Ltd
Original Assignee
Suzhou Suro Film Nano Tech Co ltd
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Priority to CN202210478272.7A priority Critical patent/CN114796919B/en
Priority to CN202210477956.5A priority patent/CN114796918B/en
Priority to CN202210478024.2A priority patent/CN114733098B/en
Priority to CN202210477854.3A priority patent/CN114733097B/en
Priority to CN201610399521.8A priority patent/CN107469246B/en
Application filed by Suzhou Suro Film Nano Tech Co ltd filed Critical Suzhou Suro Film Nano Tech Co ltd
Priority to CN202210478025.7A priority patent/CN114733099B/en
Priority to PCT/CN2017/086780 priority patent/WO2017211215A1/en
Publication of CN107469246A publication Critical patent/CN107469246A/en
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Publication of CN107469246B publication Critical patent/CN107469246B/en
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    • AHUMAN NECESSITIES
    • A62LIFE-SAVING; FIRE-FIGHTING
    • A62BDEVICES, APPARATUS OR METHODS FOR LIFE-SAVING
    • A62B23/00Filters for breathing-protection purposes
    • A62B23/06Nose filters
    • AHUMAN NECESSITIES
    • A62LIFE-SAVING; FIRE-FIGHTING
    • A62BDEVICES, APPARATUS OR METHODS FOR LIFE-SAVING
    • A62B7/00Respiratory apparatus
    • A62B7/10Respiratory apparatus with filter elements
    • AHUMAN NECESSITIES
    • A62LIFE-SAVING; FIRE-FIGHTING
    • A62BDEVICES, APPARATUS OR METHODS FOR LIFE-SAVING
    • A62B9/00Component parts for respiratory or breathing apparatus
    • A62B9/06Mouthpieces; Nose-clips
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A50/00TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
    • Y02A50/20Air quality improvement or preservation, e.g. vehicle emission control or emission reduction by using catalytic converters
    • Y02A50/2351Atmospheric particulate matter [PM], e.g. carbon smoke microparticles, smog, aerosol particles, dust

Abstract

The invention discloses a nasal respirator, which comprises: the nasal plug comprises a nasal plug and a filter chip, at least one end part of the nasal plug can be inserted into the nasal cavity of a user, the nasal plug comprises a gas channel communicated with the nasal cavity, the filter chip is used for filtering particles which are mixed in an air flow to be treated and have the particle size larger than a set value, and the gas to be treated enters the gas channel in the nasal plug after flowing through the filter chip; and the filter chip protection structure is used for protecting the filter chip. The invention has the advantages of good filterability, convenient breathing, good comfort and the like, and is widely applied.

Description

Nose plug type respirator
Technical Field
The invention relates to a respirator, in particular to an improved nose plug type respirator.
Background
Generally, particulate pollutants such as dust are generally present in the air, and if a human body inhales the air for a long time, the respiratory system of the human body is damaged. Especially for special people, such as people allergic to pollen, etc., if the people inhale air containing these allergens, the people will have symptoms of asthma, difficulty in exhaling, etc. In order to ensure the health and safety of human body, people have been used to filter particulate pollutants in air by using masks made of cotton cloth, gauze and other materials. However, such conventional masks are only effective for particulate contaminants of relatively large size and may be contaminated after a short period of use.
In addition, considering the severe haze weather which is frequently seen at home and abroad in recent years, the large amount of PM2.5 (particles with an equivalent particle size of below 2.5 μm in the air) in the air seriously affects the human health, while the common mask has no problem of filtering effect on the PM 2.5. Masks and respirators (for example, N95 masks) comprising special filters such as electrostatic filters have been proposed, which have good filtration properties against common pollutant particles in the air, but have a large air resistance and are difficult to breathe, and also have little protective effect against haze weather.
Disclosure of Invention
The invention mainly aims to provide a nasal respirator, which overcomes the defects in the prior art.
In order to achieve the purpose, the technical scheme of the invention is as follows:
an embodiment of the present invention provides a nasal respirator, which includes:
the nasal plug comprises a nasal plug and a filter chip, at least one end part of the nasal plug can be inserted into the nasal cavity of a user, the nasal plug comprises an air channel communicated with the nasal cavity, the filter chip is used for filtering particles which are mixed in airflow to be treated and have the particle size larger than a set value, and the air to be treated flows through the filter chip and then enters the air channel in the nasal plug; and the number of the first and second groups,
and the filter chip protection structure is used for protecting the filter chip.
In some embodiments, the filter chip protective structure comprises a first fixed rigid screen and a second fixed rigid screen, and the filter chip is disposed between the first fixed rigid screen and the second fixed rigid screen.
In some embodiments, the nasal plug filter further comprises a first filter fabric and/or a second filter fabric, the first filter fabric being disposed between the nasal plugs and filter chips, the filter chips being disposed between the second filter fabric and the nasal plugs.
In some embodiments, the snuffle filter further comprises a first detachable rigid screen and/or a second detachable rigid screen, the first detachable rigid screen being fixedly connected with the first filter fabric, the second detachable rigid screen being fixedly connected with the second filter fabric.
In some embodiments, the nasal prongs are waist drum type nasal prongs; and/or the nose plug type filter also comprises a shell with openings at two ends, the nose plug is detachably arranged at one end of the shell, and the filter chip is accommodated in the shell.
In a more specific first embodiment of the present invention, the filter chip includes:
a substrate having a first fluid channel with an air inlet and an air outlet, the air inlet of the first fluid channel being distributed over a first surface of the substrate;
a plurality of convex parts which are arranged at intervals, the convex parts extend continuously on the first surface of the base body along the transverse direction, the lower parts of the convex parts are fixedly arranged on the first surface of the base body, the upper parts of the convex parts are provided with cap-shaped structures which extend continuously along the transverse direction, two opposite side parts of the cap-shaped structures extend outwards along the lateral direction, an opening part for allowing air to pass through is formed between the adjacent cap-shaped structures, the caliber of the opening part is larger than 0 but smaller than the grain diameter of selected particles mixed in the air to be processed, at least two convex parts are respectively arranged adjacent to two opposite sides of the air inlet of the first fluid channel, and at least one convex part directly passes through the air inlet of the first fluid channel, so that a second fluid channel which is communicated with the first fluid channel is formed between the plurality of cap-shaped structures, the plurality of convex parts and the base body in a matching way, and air to be treated can only enter the first fluid channel through the second fluid channel.
In this first embodiment, at least two of said bosses pass directly over the air inlet of said first fluid passageway; and/or the plurality of convex parts are distributed on the first surface of the base body in parallel.
Preferably, the cap-shaped structure is integrally provided with the protruding part.
In this first embodiment, the cap structure may have an inverted trapezoidal cross-sectional structure.
Preferably, the aperture of the opening formed between adjacent cap structures is 1nm to 50 μm.
Preferably, the height of the cap structure is 50nm to 200 μm.
Preferably, the distance between adjacent projections is 0.1 μm to 100. mu.m.
Preferably, the height of the projection is 0.1 to 400 μm, and the width is 0.1 to 100 μm.
Preferably, the first fluid channel has a pore size of 1 μm to 1 mm.
Preferably, the thickness of the substrate is 1 μm or more.
Preferably, at least one of the surface of the convex part, the surface of the cap-shaped structure and the surface of the substrate is provided with a photocatalytic functional material layer and/or an antibacterial functional material layer.
Preferably, at least part of at least one of the protrusion, the cap-shaped structure and the base is a transparent structure.
In a more specific second embodiment of the present invention, the filter chip includes:
a substrate having a first fluid channel with an air inlet and an air outlet, the air inlet of the first fluid channel being distributed over a first surface of the substrate;
the porous structure is formed by mutually crossing a plurality of line-shaped bodies and is used for being matched with the first surface of the base body to form a second fluid channel, one ends of the plurality of line-shaped bodies are fixedly connected with the base body, the diameter of a hole in the porous structure is larger than 0 but smaller than the particle size of selected particles mixed in air to be treated, and the air to be treated can only enter the first fluid channel through the second fluid channel.
Furthermore, one end of each of the plurality of linear bodies is fixedly connected with the first surface of the base body and is circumferentially distributed around the air inlet of the first fluid channel.
Preferably, the air filter chip further includes a plurality of protruding portions disposed at intervals, the protruding portions are fixedly disposed on the first surface of the base and extend continuously along the transverse direction on the first surface of the base, at least two protruding portions are disposed adjacent to two opposite sides of the air inlet of the first fluid channel, at least one protruding portion directly passes through the air inlet of the first fluid channel, and the protruding portions are fixedly connected with more than two linear bodies.
Preferably, the plurality of linear bodies connected to one of the convex portions and the plurality of linear bodies connected to the other convex portion adjacent to the one of the convex portions intersect with each other.
Preferably, the plurality of protrusions are distributed on the first surface of the substrate in parallel.
Further, the shape of the protruding portion includes an elongated shape or a sheet shape, and is not limited thereto.
Further, the plurality of protrusions are uniformly or non-uniformly distributed on the first surface of the substrate.
Preferably, the width of the projection is 0.1 to 100 μm, and the height is 0.1 to 400 μm.
Preferably, the distance between adjacent projections is 0.1 μm to 100. mu.m.
Preferably, the surface of the protruding part is further provided with a photocatalytic functional material layer and/or an antibacterial functional material layer.
Preferably, at least a part of at least one of the base, the plurality of line-shaped bodies, and the plurality of protrusions is a transparent structure.
Preferably, the diameter of the line-shaped body is 1nm to 50 μm.
More preferably, a distance between one end of any one of the line-shaped bodies and one end of another line-shaped body adjacent to the line-shaped body is 1nm to 50 μm.
Preferably, the length of the line-shaped body is 50nm to 200 μm.
Preferably, at least the surface of the linear body is distributed with a photocatalytic material or an antibacterial material.
Preferably, at least a part of at least one of the base and the plurality of line-shaped bodies is a transparent structure.
Preferably, the line-shaped body is linear.
Further, the air inlet of the first fluid passage has a regular or irregular shape, and the regular shape includes a polygon, a circle, or an ellipse.
Preferably, the first fluid channel has a pore size of 1 μm to 1 mm.
Preferably, the thickness of the substrate is 1 μm or more.
Preferably, the filter chip further includes a plurality of beams distributed in parallel on the first surface of the base, the beams continuously extend in the transverse direction on the first surface of the base, wherein at least two beams are respectively disposed adjacent to two opposite sides of the air inlet of the first fluid channel, and at least one beam directly passes through the air inlet of the first fluid channel; and a plurality of line-shaped bodies are uniformly distributed on any cross beam, one end of at least part of the line-shaped bodies is fixed on the surface of the cross beam, the other end of the line-shaped bodies extends obliquely along the direction gradually far away from any cross beam and/or continuously extends on the surface parallel to the first surface of the base body, and the line-shaped bodies are intersected with the line-shaped bodies distributed on the other cross beam adjacent to any cross beam, so that the porous structure is formed.
Preferably, at least two cross-members pass directly over the air inlet of the first fluid passageway.
Preferably, the line body comprises a carbon nanowire, a carbon nanotube, a ZnO nanowire, a GaN nanowire and TiO2Any one or a combination of two or more of nanowires, Ag nanowires, and Au nanowires, but not limited thereto.
In a more specific third embodiment of the present invention, the filter chip includes:
a substrate having a first fluid channel with an air inlet and an air outlet, the air inlet of the first fluid channel being distributed within a first area of a first surface of the substrate;
an air blocking portion having a second surface disposed opposite the first surface of the base body for blocking air to be treated from directly entering the air inlet of the first fluid passage;
the air treatment device comprises a base body, a plurality of protruding parts and an air blocking part, wherein the protruding parts are arranged on the base body at intervals, one ends of the protruding parts are fixedly arranged in a second area of a first surface of the base body, the other ends of the protruding parts are fixedly connected with a second surface of the air blocking part, the distance between every two adjacent protruding parts is larger than 0 but smaller than the particle size of selected particles mixed in air to be treated, the second area of the first surface of the base body is adjacent to the first area, therefore, the protruding parts, the air blocking part and the base body are matched to form a second fluid channel, and the air to be treated can only enter the first fluid channel through the second fluid channel.
Further, the plurality of protrusions are disposed around the air inlet of the first fluid channel.
Furthermore, a plurality of protruding parts are arranged in a third area of the first surface of the base body at intervals, and the second area is arranged between the third area and the first area.
Preferably, the first fluid channel has a pore size of 1 μm to 1 mm.
Preferably, the thickness of the substrate is 1 μm or more.
Preferably, the thickness of the air barrier is 0.5 to 200 μm.
Preferably, the surface of the protruding part is further provided with a functional material layer, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material.
Preferably, at least part of the components in the air filter chip is of a transparent structure.
Further, a third region of the first surface of the substrate is disposed around the second region.
Further, the first area and the second area of the first surface of the base body are distributed in an orthographic projection of the air blocking part on the first surface of the base body.
Preferably, the air filter chip further comprises at least one support body, one end of the support body is fixedly connected with the base body, and the other end of the support body is fixedly connected with the air blocking part.
Preferably, the plurality of protrusions distributed on the third region of the first surface of the substrate are arranged to form a micro-scale or nano-scale array structure with super-hydrophobic or super-oleophobic property.
Preferably, the air filter chip includes two or more support bodies, and the two or more support bodies are symmetrically distributed around the air inlet of the first fluid channel.
Preferably, more than one support beam is erected on the air inlet of the first fluid channel, and the support beams are fixedly connected with the air blocking part.
Further, the protrusion may be any one of a linear, columnar, sheet-like, tubular, conical, and frustum-shaped structure that is disposed in a standing manner, but is not limited thereto.
Further, the transverse cross section of the projection has a regular or irregular shape, and the regular shape includes, but is not limited to, a polygon, a circle, or an ellipse.
Further, the plurality of protrusions are uniformly or non-uniformly distributed on the first surface of the substrate.
Further, the air inlet of the first fluid channel has a regular or irregular shape, and the regular shape includes, but is not limited to, a polygon, a circle, or an ellipse.
Preferably, the protrusion is a linear protrusion, and the length-diameter ratio of the protrusion is 4: 1-200000: 1.
preferably, the ratio of the distance between adjacent protrusions to the length of the protrusions is 1: 4-1: 200000.
preferably, the protruding parts are micrometer wires or nanometer wires which are vertically arranged, the diameter of each protruding part is 1nm to 50 micrometers, the length of each protruding part is 50nm to 200 micrometers, and the distance between every two adjacent protruding parts is 1nm to 50 micrometers.
In a more specific fourth embodiment of the present invention, the filter chip includes:
a substrate having a first fluid channel with an air inlet and an air outlet, the air inlet of the first fluid channel being distributed within a first area of a first surface of the substrate;
an air blocking portion having a second surface disposed opposite the first surface of the base body for blocking air to be treated from directly entering the air inlet of the first fluid passage;
and the bulges continuously extend along the second area of the first surface of the base body along the transverse direction, grooves for allowing air to pass are formed between the adjacent bulges, the caliber of the opening part of each groove is larger than 0 but smaller than the particle size of selected particles mixed in the air to be treated, the upper ends of the bulges are hermetically connected with the first surface of the base body, and the partial area of the lower end of each groove is hermetically connected with the second surface of the air blocking part, so that more than one groove among the bulges, the air blocking part and the base body are matched to form a second fluid channel, and the air to be treated can only enter the first fluid channel through the second fluid channel.
Further, the second region of the first surface of the substrate is disposed around the first region.
Further, a local area of the second end of the protruding portion and the air inlet of the first fluid channel are distributed in an orthographic projection of the air blocking portion formed on the first surface of the base body.
Further, the shape of the protruding portion includes an elongated shape or a sheet shape, but is not limited thereto.
Further, the plurality of protrusions are uniformly or non-uniformly distributed on the first surface of the substrate.
Further, the air inlet of the first fluid passage has a regular or irregular shape, and the regular shape includes, but is not limited to, a polygon, a circle, or an ellipse.
Preferably, the width of the projection is 1nm to 50 μm, and the height is 50nm to 200 μm.
Preferably, the size of the trench opening formed between adjacent projections is 1nm to 50 μm.
Preferably, the first fluid channel has a pore size of 1 μm to 1 mm.
Preferably, the thickness of the substrate is 1 μm or more.
Preferably, the thickness of the air barrier is 0.5 to 200 μm.
Preferably, the surface of the protruding part is further provided with a functional material layer, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material.
Preferably, at least part of at least one of the base body, the air barrier and the protrusion is of a transparent structure.
In a more specific fifth embodiment of the present invention, the filter chip includes:
a substrate having a first fluid channel with an air inlet and an air outlet, the air inlet of the first fluid channel being distributed over a first surface of the substrate;
the plurality of protruding portions are fixedly arranged on the first surface of the base body and extend continuously on the first surface of the base body along the transverse direction, grooves for air to pass through are formed between the adjacent protruding portions, the opening portions of the grooves are larger than 0 and smaller than the particle size of selected particles mixed in the air to be processed, at least two protruding portions are respectively arranged adjacent to two opposite sides of the air inlet of the first fluid channel, at least one protruding portion directly passes through the air inlet of the first fluid channel, and therefore a second fluid channel communicated with the first fluid channel is formed between the plurality of protruding portions and the base body in a matched mode, and the air to be processed can only enter the first fluid channel through the second fluid channel.
Preferably, the filter chip further includes: the air blocking part is provided with a second surface opposite to the first surface of the base body, the air inlets of the first fluid channels are distributed in the orthographic projection formed by the air blocking part on the first surface of the base body, the plurality of protrusions are provided with first ends and second ends which are opposite, the first ends are connected with the first surface of the base body in a sealing mode, and the local area of the second ends is connected with the second surface of the shielding part in a sealing mode.
Preferably, the plurality of protrusions are distributed on the first surface of the substrate in parallel.
Preferably, the size of the opening of the trench formed between the adjacent projections is 1nm to 50 μm.
Preferably, the first fluid channel has a pore size of 1 μm to 1 mm.
Preferably, the thickness of the substrate is 1 μm or more.
Preferably, the surface of the protruding part is further provided with a functional material layer, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material.
Preferably, the thickness of the air barrier is 0.5 to 200 μm.
Preferably, at least part of at least one of the base body, the air barrier and the protrusion is of a transparent structure.
In a more specific sixth embodiment of the present invention, the filter chip includes:
a substrate having a fluid channel, and
a plurality of aggregates of thread-shaped bodies for treating the air mixed with the selected particles flowing through the fluid channel;
the aggregates are distributed within the fluid channel and have a porous structure with pores having a diameter greater than 0 and less than the particle size of the selected particle.
Furthermore, one end of each line-shaped body is fixedly connected with the inner wall of the fluid channel, and the other end of each line-shaped body extends along the radial direction of the fluid channel.
Further, the plurality of line-shaped bodies are crossed or interwoven with each other to form the porous structure.
Furthermore, the plurality of line-shaped bodies are arranged at intervals and are arranged in parallel to form the porous structure.
Further, the substrate has a first surface and a second surface opposite to each other, and the air inlets of the fluid channels are distributed on the first surface of the substrate.
Furthermore, a plurality of upright line-shaped bodies which are arranged at intervals are distributed on the first surface of the base body, and the upright line-shaped bodies are arranged around the fluid channel.
Further, the filter chip further comprises an air barrier, the air barrier has a third surface disposed opposite to the first surface of the substrate, and one end of each of the plurality of upright line-shaped bodies is fixedly disposed on the first surface of the substrate, and the other end of each of the plurality of upright line-shaped bodies is fixedly connected to the third surface of the air barrier, wherein the distance between adjacent upright line-shaped bodies is greater than 0 but smaller than the particle size of the selected particles.
Preferably, the first surface of the substrate is further provided with a functional material layer, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material.
Preferably, at least part of the components in the air filter chip have a transparent structure.
Further, the air inlet of the fluid passage has a regular or irregular shape, and the regular shape includes, but is not limited to, a polygon, a circle, or an ellipse.
Preferably, the aperture of the fluid channel is 1 μm to 1 mm.
Preferably, the thickness of the substrate is 1 μm or more.
Further, the air inlet of the fluid channel and the plurality of upright line-shaped bodies are distributed in the orthographic projection of the air blocking part on the first surface of the base body.
More preferably, the aspect ratio of the upright line-shaped body is 4: 1-200000: 1.
preferably, the ratio of the distance between adjacent upright line-shaped bodies to the length of the upright line-shaped body is 1: 4-1: 200000.
preferably, the diameter of the line-shaped body is 1nm to 500 μm.
Preferably, the line-shaped body is selected from a nanowire or a nanotube.
Preferably, at least the surface of the linear body is distributed with a photocatalytic material or an antibacterial material.
Preferably, the line body comprises a carbon nanowire, a carbon nanotube, a ZnO nanowire, a GaN nanowire and TiO2Any one or a combination of two or more of nanowires, Ag nanowires, and Au nanowires, but not limited thereto.
Compared with the prior art, the invention has the advantages that:
1) the nose plug type respirator provided by the invention has the advantages of good filterability, convenience in breathing, good comfort, reusability and long service life;
2) the filter chip has the characteristics of large flux, small flow resistance, capability of efficiently removing micro/nano-scale particles in air and the like, can adopt a thicker substrate, has high mechanical strength, can be cleaned (ultrasonically) and used for multiple times, has long service life, preferably has a self-cleaning function, has simple and controllable preparation process, and is suitable for large-scale and large-batch preparation.
Drawings
In order to more clearly explain the structural features and technical points of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
FIG. 1 is a schematic view of a nasal respirator according to an exemplary embodiment of the present invention;
FIG. 2 is a top view of a filter chip according to a first embodiment of the present disclosure;
FIG. 3 is a partial cross-sectional view (A-A direction) of a filter chip according to a first embodiment of the present application;
FIG. 4 is a flow chart of a process for fabricating a filter chip according to a first embodiment of the present disclosure;
FIG. 5 is a top view of a filter chip according to a second embodiment of the present application;
FIG. 6 is a partial cross-sectional view of a filter chip according to a second embodiment of the present application;
FIG. 7 is a flow chart illustrating a process for fabricating a filter chip according to a second embodiment of the present application;
FIG. 8 is a cross-sectional view of a filter chip according to a third embodiment of the present application;
FIGS. 9 a-9 e are transverse cross-sectional views of some of the lobes of the third embodiment of the present application;
FIGS. 10 a-10 c are schematic views of the arrangement of some of the protrusions in a third embodiment of the present application;
FIGS. 11 a-11 c are top views of various filter chips according to a third embodiment of the present application;
FIG. 12 is a cross-sectional view of a filter chip according to a fourth embodiment of the present application;
FIG. 13 is a cross-sectional view of a filter chip according to a fifth embodiment of the present application;
FIG. 14 is a cross-sectional view of a filter chip according to a sixth embodiment of the present application;
FIG. 15 is a cross-sectional view of a filter chip according to a seventh embodiment of the present application;
FIG. 16 is a flow chart illustrating a manufacturing process of a filter chip according to an eighth embodiment of the present application;
FIG. 17 is a flow chart illustrating a process for fabricating a filter chip according to a ninth embodiment of the present application;
FIG. 18 is a top view of a filter chip according to a tenth embodiment of the present application;
FIG. 19 is a partial cross-sectional view of a filter chip according to a tenth embodiment of the present application;
FIG. 20 is a top view of a filter chip according to an eleventh embodiment of the present application;
FIG. 21 is a partial cross-sectional view of a filter chip according to a twelfth embodiment of the present application;
FIG. 22 is a partial cross-sectional view of a filter chip according to a thirteenth embodiment of the present application;
FIG. 23 is a top view of a filter chip according to a fourteenth embodiment of the present application;
FIG. 24 is a partial cross-sectional view of a filter chip according to a fifteenth embodiment of the present application;
FIG. 25 is a flow chart of a process for fabricating a filter chip according to a sixteenth embodiment of the present application.
Detailed Description
The embodiment of the invention provides a nasal respirator, which comprises:
the nasal plug comprises a nasal plug and a filter chip, at least one end part of the nasal plug can be inserted into the nasal cavity of a user, the nasal plug comprises an air channel communicated with the nasal cavity, the filter chip is used for filtering particles which are mixed in airflow to be treated and have the particle size larger than a set value, and the air to be treated flows through the filter chip and then enters the air channel in the nasal plug; and the number of the first and second groups,
and the filter chip protection structure is used for protecting the filter chip.
In some embodiments, the filter chip protective structure comprises a first fixed rigid screen and a second fixed rigid screen, and the filter chip is disposed between the first fixed rigid screen and the second fixed rigid screen.
In some embodiments, the nasal plug filter further comprises a first filter fabric and/or a second filter fabric, the first filter fabric being disposed between the nasal plugs and filter chips, the filter chips being disposed between the second filter fabric and the nasal plugs.
In some embodiments, the snuffle filter further comprises a first detachable rigid screen and/or a second detachable rigid screen, the first detachable rigid screen being fixedly connected with the first filter fabric, the second detachable rigid screen being fixedly connected with the second filter fabric.
Preferably, the nasal plug is a waist drum type nasal plug which can be partially or wholly inserted into the nasal cavity of a human body.
Preferably, the rhinobyon type filter further comprises a shell with openings at two ends, the rhinobyon is detachably arranged at one end of the shell, and the filter chip is accommodated in the shell. The shell can further protect the filter chip on one hand, and can also accommodate the various components, so that the respirator is compact and firm in structure. The shell is preferably a rigid shell.
Referring to fig. 1, a nasal respirator according to an exemplary embodiment of the present invention may include:
the outer shell 11 of the hard shell is provided with a plurality of grooves,
the embedded hard silk screen component comprises two embedded hard silk screens 12 which are transversely and alternately arranged in the shell 11;
the filtering silk fabric sheet assembly comprises two filtering silk fabric sheets 13 transversely and alternately arranged in the shell 11, wherein the two filtering silk fabric sheets 13 are positioned between the two embedded hard silk screens 12 and are respectively and fixedly arranged on the embedded hard silk screens 12;
the fixed type hard silk screen component comprises two fixed type hard silk screens 14 which are transversely and alternately arranged in the shell 11, and the fixed type hard silk screens 14 are positioned between the two filter silk fabric sheets 13;
the filter chip is transversely arranged in the shell 11 and is positioned between the two fixed hard silk screens 14;
the waist drum type nasal plug 15 comprises a connecting sheet body 151 and two nasal plug main bodies 152 protruding outwards from one surface of the connecting sheet body 151, the waist drum type nasal plug 15 is embedded in one end of the inner cavity of the shell 11 through the connecting sheet body 151, and the nasal plug main bodies 152 are communicated with the inner cavity of the shell 11.
Preferably, both ends of the embedded hard wire mesh 12 are detachably connected with the inner cavity wall of the housing 11, respectively. Two ends of the filter silk fabric sheet 13 are respectively connected with the inner cavity wall of the shell 11, one surface of the filter silk fabric sheet is fixedly connected with the embedded hard silk screen 12, and the other surface of the filter silk fabric sheet is erected on a boss protruding from the inner cavity wall of the shell 11. Two ends of the fixed hard silk screen 14 are respectively fixed on the inner cavity wall of the shell 11. Two ends of the filter chip are respectively fixed on the inner cavity wall of the shell 11.
In the present invention, the aforementioned filter chip may be prepared by MEMS (micro electro mechanical systems) process, and thus may be named as a MEMS filter chip.
Referring to fig. 2-3, in an embodiment (named as a first embodiment) of the present invention, a filter chip includes a substrate 101, the substrate 101 has a first surface 1011 and a second surface 1012 opposite to each other, and a plurality of through holes 102 are distributed in the substrate 101 for serving as fluid channels, the first surface is provided with an array formed by a plurality of beams 103 (named as protrusions) arranged in parallel, wherein the plurality of beams 103 directly span the through holes 102 and the plurality of beams 103 are distributed on two sides of the through holes 102, wherein a cap structure 104 (abbreviated as a cap structure) is further distributed on the top of each beam 103, each cap layer also continuously extends along the transverse direction along with each beam and forms an array of cap structures, and air to be processed cannot directly enter the through holes 102 by bypassing the array of cap structures.
In particular, when the distance between the cap structures is controlled to be on the order of nanometers, extremely fine particles (particles on the order of nanometers) in the air can be removed.
The beams may be strip-shaped and have a greater width and thickness so that the beams may have greater mechanical strength to provide better support for the hat-shaped layer, while the spacing between the beams may be greater to provide greater air throughput.
The capping layer may also have a greater thickness, with lateral epitaxy on both sides, so that the spacing between adjacent capping layers may be small, for example as low as 1nm, and therefore extremely small particles mixed in the air to be treated may be trapped.
The cap layer may be integrally formed with the protruding portion, and may be directly formed on the upper portion of the protruding portion by evaporation, deposition, growth, or the like (typically, metal sputtering, MOCVD, PECVD, electrochemical deposition, or the like), and the cap structure may also extend continuously in the lateral direction along with the protruding portion, so that an opening portion continuously extending in the lateral direction is formed between adjacent cap structures, which may ensure treatment of selected particles mixed in the air to be treated, and also maintain a high flux, and reduce the processing difficulty and the cost.
The material of the cap layer can be selected from insulating dielectric materials such as silicon oxide, silicon nitride aluminum oxide, boron phosphorus silicon glass and the like, or semiconductor materials such as Si, ZnO, GaN, TiO2InN, etc., or a metal material such as Ag, Au, Al, Ni, Cr, Ti, etc., but not limited thereto.
The substrate 101 may have a large thickness, so that the substrate can support the micro/nano-sheet array well, and further enhance the mechanical strength of the filter chip, so that the filter chip is pressure-resistant, bending-resistant, collision-resistant, and impact-resistant, and thus can be applied in various environments without damage, for example, the substrate can be applied to processing high-pressure and high-speed air, which is a function that cannot be reached by existing porous membranes and the like.
The materials of the parts (101, 102, 103, 104) of the filter chip are selected from various ranges, and the parts can be inorganic materials or organic materials, such as metal, nonmetal inorganic materials, plastics, ceramics, semiconductors, glass, polymers and the like. When inorganic materials are selected for the parts, the filter chip also has the characteristic of temperature change resistance, and can process high-temperature and low-temperature air.
The filter chip adopting the design can be cleaned (ultrasonically) and used for multiple times, and still keeps good air treatment capacity.
When air is treated by the filter chip, air containing impurity particles (the air flow direction is shown by arrows with broken lines in fig. 3) enters the array of the cap structures, particles (or some liquid drops incompatible with air, such as water drops in air or water drops in oil) with the particle size larger than a certain value are blocked outside the array of the cap structures, and then the air enters the through holes 102 after reaching the inlets of the through holes 102 through the openings between the cap structures, so that the air is purified and/or the required particles (liquid drops) are enriched and recovered.
In some specific application schemes of the embodiment, the gap between the cap layers can be 1nm to 50 μm, and the height of the cap layer can be 50nm to 200 μm.
In some specific applications of this embodiment, the aperture of the through hole may be 1 μm to 1mm, and the thickness of the substrate may be >1 μm.
In some specific applications of this embodiment, the height of the beams may be 0.1 μm to 400 μm, the width may be 0.1 μm to 100 μm, and the pitch of the beams may be 0.1 μm to 100 μm.
The longitudinal cross-section of the openings formed in front of adjacent cap layers and adjacent beams may be regular or irregular, such as trapezoidal, polygonal (triangular, quadrilateral, or other), circular, elliptical, star-shaped, and so on.
The beams and the cap layer may be regularly or irregularly distributed, uniformly or non-uniformly distributed on the first surface of the substrate.
In addition, in the first embodiment, the shape of the through hole 102 may be various, and for example, may be circular, square, rectangular, or other shapes.
In other embodiments of the present application, a filter chip may have a similar structure to any of the preceding embodiments, except that: the beam, the cap-shaped layer and the surface of the substrate can be provided with a photocatalytic material layer. When the air is treated by the filter chip comprising the photocatalytic material layer, if ultraviolet light is used for assistance, some organic pollutants and the like in the air can be subjected to photocatalytic degradation, so that multiple purification of the air is realized.
Wherein, in order to facilitate the light penetration, part or all of the cap layer, the beam and the substrate can be made of transparent materials. In some embodiments of this embodiment, the cap layer and the beam may be made of transparent material, for example, light can be injected.
Among them, the typical photocatalytic material may be titanium dioxide, etc., but is not limited thereto.
In order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spray coating, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer deposition, etc.), sputtering, etc., without being limited thereto.
Wherein, the thickness of the photocatalytic material layer can be controlled at nanometer level to reduce the influence on the air flux of the filter chip.
The structures, arrangement forms, materials, and the like of the substrate, the cap layer, the beam, the through hole, and the like used in the embodiment may be the same as or similar to those described above, and thus, the description thereof is omitted.
In other embodiments of the present application, a filter chip may have a similar structure to any of the preceding embodiments, except that: the surfaces of the beam, the cap-shaped layer and the substrate can also be provided with an antibacterial material layer. When the filter chip containing the antibacterial material layer is used for treating air, bacteria, viruses and the like in the air can be synchronously killed in the air treatment process, so that multiple purification of the air is realized.
Among them, the antibacterial material may be noble metal such as Au, Ag, etc., but is not limited thereto.
In order to form the antibacterial material layer, those skilled in the art may adopt various manners known in the art, such as coating (spin coating, spray coating, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer deposition, etc.), sputtering, etc., without being limited thereto.
The thickness of the antibacterial material layer can be controlled to be in a nanometer level so as to reduce the influence of the antibacterial material layer on the air flux of the filter chip as much as possible.
The structures, arrangement forms, materials, and the like of the substrate, the cap layer, the beam, the through hole, and the like used in the embodiment may be the same as or similar to those described above, and thus, the description thereof is omitted.
The filter chip of the present application can be produced by physical or chemical methods, and for example, chemical growth methods, physical processing methods, and the like, particularly MEMS (micro electro mechanical Systems) methods, and the like.
In other embodiments of the present application, a process for preparing a filter chip may include the steps of:
s1: providing a substrate (e.g., a silicon wafer);
s2: photoetching a micro-nano scale line on one side surface (named as a first surface) of the substrate to form a graphical photoresist mask;
s3: etching (RIE, ICP, wet etching, electrochemical etching and the like) a plurality of beams with a micro-nano scale on the first surface of the substrate, and then removing the photoresist mask;
s4: arranging a photoresist etching mask on the other side surface (named as a second surface) of the substrate opposite to the first surface;
s5: etching the other side surface of the substrate until a through hole serving as a fluid channel is formed on the other side surface of the substrate;
s6: and removing the photoresist etching mask, and then evaporating or depositing or growing a cap layer structure on the surface of the side with the beam of the substrate. The phenomenon of lateral extension exists in the process of evaporation or deposition or growth technology, so that the gap of the cap layer can be reduced along with the increase of the thickness, and the minimum can reach several nanometers.
S7: dicing and packaging are performed to obtain a filter chip (this step is not shown in the figure).
The etching method adopted in the steps can also be photoetching, mechanical etching, dry etching, wet etching and the like.
For example, in the foregoing steps, a method of forming a patterned photoresist mask includes: photolithography, nanosphere masking techniques, nano (metal) particle masking techniques, and the like, without limitation.
Obviously, the preparation process of the filter chip in the first embodiment is simple and controllable, and is suitable for mass production, and the obtained filter chip has at least the following advantages: (1) the flux is large, and the flow resistance is small; (2) physical filtration can effectively remove particles larger than the nanometer gap; (3) the cross beam and the larger thickness of the substrate can ensure high mechanical strength; (5) can be cleaned (ultrasonically) and used for multiple times.
Referring to fig. 5, in a second embodiment of the present application, a filter chip includes a substrate 201, the substrate 201 has a first surface 2011 and a second surface 2012 opposite to the first surface 2011, and a plurality of through holes 204 are distributed on the substrate 201 for serving as fluid channels. The first surface 2011 is provided with a plurality of beams 203 arranged in parallel, the beams 203 continuously extend in the transverse direction on the first surface, and a plurality of the beams 203 continuously span from the through holes 204, so that the first surface can also be regarded as a cross beam 203. A plurality of nanowires 202 are distributed on any one of the beams 203, one end of each of the nanowires 202 is fixed on the surface of the beam 203, and the other end of each of the nanowires 202 extends obliquely (also referred to as laterally) in a direction gradually away from the beam 203 and intersects with the nanowires 202 distributed on the other beam adjacent to the beam 203, so as to form the porous structure 205. Referring again to fig. 5, the porous structure 205 is a grid structure that covers the through holes 204 from a top view. The diameter of the pores in the porous structure 205 is greater than 0 but smaller than the particle size of the selected particles intermixed in the fluid to be treated. Referring to fig. 5-6, it can be seen that the porous structure 205 formed by crossing the plurality of nanowires 102 and the first surface 2011 of the substrate 201 cooperate to form another fluid channel, such that the fluid 206 to be processed can only enter the through hole 204 through the another fluid channel.
The nanowires have a large height-diameter ratio (or length-diameter ratio), so that the nanowires can be densely arranged on the first surface of the substrate, particles in different particle size ranges in the fluid can be removed by adjusting the distance between the beams and the density, length, extension direction and the like of the nanowires, and particularly, when the nanowires are adopted, the pore size of the holes formed by crossing the nanowires is controlled to be nano, so that not only can extremely tiny particles in the fluid be removed, but also the resistance of the nanowires to the fluid can be controlled to be a very low level due to the extremely small diameter of the nanowires, and a very large fluid flux is formed, and the nano-wire is far superior to the existing porous membrane, filter chip based on a transverse flow channel and the like.
If a scheme known in the industry is considered, the arrangement mode of the nanowires is designed to a certain degree, and a super-hydrophobic structure and a super-oleophobic structure can be formed, so that particles in fluid can be removed, and blocked particles cannot be accumulated in a functional region (nanowire array surface) of the filter chip under the self-cleaning effect, and the filter chip is prevented from losing efficacy after being used for a long time.
Wherein the cross beams 203 may be distributed on the first surface 2011 of the base 201 at a suitable density to provide the filter chip with as high a fluid handling throughput as possible. And, the beam 203 may have a suitable width, so that the beam 203 may have sufficient mechanical strength while avoiding excessive influence on the flux of the filter chip. For example, the beams may have a height of 0.1 μm to 100 μm, a width of 0.1 μm to 400 μm, and a pitch between the beams may be 0.1 μm to 100 μm.
The substrate 201 may have a larger thickness and the beam 203 may have a larger height, so that the substrate can support the nanowire array well, and further enhance the mechanical strength of the filter chip, so that the filter chip is pressure-resistant, bending-resistant, collision-resistant, and impact-resistant, and thus can be applied in various environments without being damaged, for example, the filter chip can be applied to the treatment of high-pressure and high-speed fluids, which is a function that cannot be achieved by the existing porous membrane and the like.
The material selection range of each part (201, 202, 203) of the filter chip is various, and the filter chip can be inorganic material or organic material. When inorganic materials are selected for these parts, the filter chip also has the property of resisting temperature change, and can process high temperature and low temperature fluids.
The filter chip using the aforementioned design can be (ultrasonically) cleaned, used multiple times, and still maintain good fluid handling capabilities.
When the fluid is processed by using the filter chip, the fluid containing impurity particles enters the porous structure 205, wherein particles with a particle size larger than a certain value (or some droplets incompatible with the fluid, such as water droplets in air or water droplets in oil) are blocked outside the porous structure 205, and then the fluid enters the through hole 204 after reaching the inlet of the through hole 204 through the gaps between the nanowires, so that the purification of the fluid and/or the enrichment and recovery of the desired particles (droplets) are realized.
Referring again to FIG. 5, in some embodiments of this embodiment, the nanowires 202 can have a diameter and a pitch of 1nm to 50 μm and a length (height) of 6 nm to 200 μm. The aperture of the through hole 104 may be 1 μm to 1 mm. The thickness of the substrate may be 1 μm or more.
The lateral cross-sectional structure of the aforementioned nanowires may be regular or irregular in shape, and may be, for example, polygonal (triangular, quadrangular or otherwise), circular, elliptical, star-shaped, and the like.
The aforementioned nanowires 202 may be distributed on the first surface of the matrix 201 in a regular or irregular, uniform or non-uniform distribution.
The array formed by these nanowires 202 may have a superhydrophobic structure, thereby making the filter chip self-cleaning.
The aforementioned nanowire 202 may be preferably selected from a carbon nanowire, a carbon nanotube, a ZnO nanowire, a GaN nanowire, and TiO2Nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
The nanowires 202 can be fixed on the surface of the substrate or grown on the surface of the substrate by external transfer, in-situ growth (e.g., chemical growth, electrochemical growth), or deposition (e.g., physical, chemical vapor deposition, electrodeposition), etc.
The shape of the aforementioned through-hole 204 (particularly, the shape of the transverse cross-section) may be various, and may be, for example, a circle, a square, a rectangle, a diamond, a polygon, or other regular or irregular shape.
In some specific application schemes of this embodiment, the nanowire 202 may be formed by a photocatalytic material or a material with an antibacterial and bactericidal function, or the nanowire 202 may also be a coating layer whose surface is covered by the photocatalytic material or the material with the antibacterial and bactericidal function.
For example, the nanowire 202 may be a ZnO nanowire, a GaN nanowire, a TiO2 nanowire, or other nanowires with photocatalytic properties, and can degrade organic substances in the fluid under light-assisted irradiation.
For example, the nanowires 202 may be Ag nanowires, Au nanowires, or the like, to kill bacteria, viruses, and microorganisms in the fluid.
In some specific applications of this embodiment, a photocatalytic material layer or an antibacterial material layer is further disposed on the first surface 2011 of the substrate 201.
When the fluid is treated by the filter chip comprising the photocatalytic material layer, if ultraviolet illumination and the like are used for assistance, organic pollutants and the like in the fluid can be subjected to photocatalytic degradation, and the fluid is purified in multiple ways.
Wherein, in order to be beneficial to light penetration, part or all of the substrate, the bulge part and the nanowire can be made of transparent materials.
Among them, the typical photocatalytic material may be titanium dioxide, etc., but is not limited thereto.
In order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spray coating, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer deposition, etc.), sputtering, etc., without being limited thereto.
Wherein, the thickness of the photocatalytic material layer can be controlled at nanometer level to reduce the influence on the fluid flux of the filter chip.
When the filter chip containing the antibacterial material layer is used for treating the fluid, bacteria, viruses and the like in the fluid can be synchronously killed in the fluid treatment process, so that the multiple purification of the fluid is realized.
Among them, the antibacterial material may be noble metal such as Au, Ag, etc., but is not limited thereto.
In order to form the antibacterial material layer, those skilled in the art may adopt various manners known in the art, such as coating (spin coating, spray coating, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer deposition, etc.), sputtering, etc., without being limited thereto.
Wherein, the thickness of the antibacterial material layer can be controlled at nanometer level to reduce the influence on the fluid flux of the filter chip.
The filter chip of the present application can be produced by physical or chemical methods, and for example, chemical growth methods, physical processing methods, and the like, particularly MEMS (micro electro mechanical Systems) methods, and the like.
For example, referring to fig. 7, in this embodiment, a manufacturing process of a filter chip may include the following steps:
s1: a seed layer for nanowire growth is deposited on a first surface of a substrate (e.g., a silicon wafer).
S2: and arranging a graphical photoresist mask on the seed layer, wherein the patterned photoresist mask comprises a line with a micro-nano scale formed by photoetching.
S3: and etching the first surface of the substrate by using the photoresist mask, so that a plurality of micro-nano-scale beam structures which are arranged at intervals are formed on the first surface of the substrate, and then removing the photoresist mask.
S4: and arranging a patterned etching mask formed by photoresist on the second surface of the substrate.
S5: and etching the second surface of the substrate to the bottom of the beam, so that a groove hole used as a fluid channel is formed in the second surface of the substrate, and removing the photoresist.
S6: and growing the nanowires on the seed layer, controlling the growth conditions of the nanowires to enable the nanowires to have a certain lateral growth ratio, and forming a cross grid with a micro-nano scale.
S7: scribing and packaging to obtain the filter chip.
The etching method adopted in the above steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
For example, in the foregoing steps, a method of forming a patterned (nanopattern) photoresist mask includes: photolithography, nanosphere masking techniques, nano (metal) particle masking techniques, and the like, without limitation.
For example, in the foregoing steps, the beam 203, the via 204, and the like may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, and the like.
Obviously, the preparation process of the filter chip is simple and controllable, and is suitable for mass production.
Referring to fig. 8 and 11 a-11 b, in a third embodiment of the present application, a filter chip includes a substrate 301, the substrate 301 has a first surface 301a, a first region 3011 (the region enclosed by the dotted line in the figure) of the substrate 301 has a plurality of through holes 304 distributed therein as fluid channels, the first surface is provided with an array formed by a plurality of vertical micro/nano wires/tubes 303 (i.e., any one or a combination of micro-scale wires, micro-scale tubes, nano-wires, and nano-tubes), the top of the plurality of micro/nano-wires/tubes 303 distributed in a second region 3012 surrounding the first region 3011 is further connected to a fluid blocking portion 302, the fluid blocking portion 302 is disposed above a fluid inlet of the through holes 304, so that a fluid to be processed cannot directly enter the through holes 304 by bypassing the micro/nano-wires/tubes array, the fluid barrier 302 has a second surface 302b disposed opposite the first surface 3011. A plurality of vertical micro/nanowires/tubes 303 may also be densely distributed within the remaining area 3013 (which may be named as a third area) of the first surface 3011. In fig. 8, arrows with broken lines show the traveling direction of the fluid.
The micro/nano wires/tubes have a larger height-diameter ratio (or length-diameter ratio), so that the micro/nano wires/tubes can be densely arranged on the first surface of the substrate, particles in different particle size ranges in the fluid can be removed by adjusting the spacing of the micro/nano wires/tubes, particularly, when the nano wires/tubes are adopted, the spacing between the nano wires/tubes is controlled to be nano-scale, so that not only can extremely tiny particles in the fluid be removed, but also the resistance of the nano wires/tubes to the fluid can be controlled to be a very low level due to the extremely small diameter of the nano wires/tubes, and a very large fluid flux is formed, which is far superior to the existing porous membranes, filter chips based on transverse flow channels and the like.
If a scheme known in the art is referred, the micro/nanowire/tube array is designed to a certain extent, and a super-hydrophobic structure and a super-oleophobic structure can be formed, so that particles in fluid can be removed, and blocked particles cannot be accumulated in a functional region (the surface of the micro/nanowire/tube array) of the filter chip under the self-cleaning effect, and the filter chip is prevented from being out of service after being used for a long time.
The substrate 301 may have a large thickness, so as to form a good support for the micro/nano wire/tube array, and further enhance the mechanical strength of the filter chip, so that the filter chip is pressure-resistant, bending-resistant, collision-resistant, and impact-resistant, and thus may be applied in various environments without damage, for example, may be applied to processing high-pressure and high-speed fluids, which is a function that cannot be achieved by the existing porous membrane and the like.
The fluid blocking part can be a sheet, and the thickness of the fluid blocking part can be adjusted according to the actual application requirement.
The materials of the parts (301, 302, 303, 304) of the filter chip are selected from various ranges, and the parts can be inorganic materials or organic materials, such as metal, nonmetal inorganic materials, plastics, ceramics, semiconductors, glass, polymers and the like. When inorganic materials are selected for these parts, the filter chip also has the property of resisting temperature change, and can process high temperature and low temperature fluids.
The filter chip using the aforementioned design can be (ultrasonically) cleaned, used multiple times, and still maintain good fluid handling capabilities.
When the fluid is treated by the filter chip, the fluid containing impurity particles enters the array of micro/nano wires 303, wherein particles (or some droplets incompatible with the fluid, such as water droplets in air or water droplets in oil) with a particle size larger than a certain value are blocked outside the micro/nano wires/tubes array, and then the fluid enters the through holes 304 after reaching the inlet of the through holes 304 through the gaps between the micro/nano wires/tubes, so as to purify the fluid and/or enrich and recover the desired particles (droplets).
Referring again to FIG. 8, in some embodiments of the fourth embodiment, the diameter of the micro/nano-wire may be 1 nm-50 μm, and the length (height) h1Can be 50 nm-200 μm, and the distance between the adjacent micro/nano wires can be 1 nm-50 μm. The aperture w of the through hole 304 may be 1 μm to 1 mm. Thickness h of the substrate2It may be 1 μm or more. Thickness h of the fluid barrier3May be 0.5 μm to 200 μm.
Referring again to fig. 9 a-9 e, the lateral cross-sectional structure of the micro/nano-wires may be regular or irregular, such as polygonal (triangular, quadrilateral or other), circular, elliptical, star-shaped, etc.
Referring again to fig. 10 a-10 c, the micro/nanowires may be distributed on the first surface of the substrate in a regular or irregular, uniform or non-uniform manner. In some specific application schemes, the average spacing between adjacent micro/nanowires is between 1nm and 50 μm.
In addition, referring to fig. 11 a-11 c, in the fourth embodiment, the shapes (especially, the shapes of the transverse cross sections) of the through holes 304 and the fluid barriers 302 may be various, such as circular, square, rectangular or other shapes.
Referring to fig. 12, preferably, in a fourth embodiment of the present application, a filter chip includes a substrate 401, where the substrate 401 has a first surface and a third surface opposite to the first surface, and a plurality of through holes 404 serving as fluid channels are distributed on the substrate 401, an array formed by a plurality of vertical micro/nano wires/tubes 403 is disposed on the first surface, the tops of the plurality of micro/nano wires/tubes 403 distributed around the through holes 404 are further connected with a fluid blocking portion 402, and the fluid blocking portion 402 is disposed above a fluid inlet of the through holes 404, so that a fluid to be processed cannot bypass the micro/nano wires/tubes array and directly enter the through holes 404. And more than one, for example, four support bodies 405 are also symmetrically or asymmetrically distributed around the through hole 404, the support bodies 405 can also increase the support for the fluid blocking part 402, so as to realize a more firm and stable fit between the fluid blocking part and the base body, and effectively protect the micro/nanowire/tube array distributed between the fluid blocking part and the base body, thereby avoiding the problems of collapse, damage and the like of the micro/nanowire/tube 403 caused by the extrusion of the micro/nanowire/tube array after the fluid blocking part and/or the base body is subjected to the action of external force.
The support may have various shapes, such as a rectangular shape, a trapezoidal shape, a stepped shape in longitudinal section (the longitudinal direction here may be understood as a direction perpendicular to the first surface of the base), and the like, without being limited thereto. In some embodiments of this second embodiment, the support may be a boss or the like protruding upward from an edge of the through hole 404, and the upper end of the support is connected to the fluid barrier 402.
The number, diameter, distribution density and the like of the supporting bodies can be adjusted according to actual needs, but the space of the first surface of the base body is occupied as little as possible, so that the fluid flux of the micro/nano wires is prevented from being greatly influenced.
The structure, arrangement form, material, etc. of the substrate, the micro/nano wire/tube array, the fluid barrier, the through hole, etc. used in the second embodiment may be the same as or similar to those described above, and thus are not described herein again.
Referring to fig. 13, preferably, in a fifth embodiment of the present application, a filter chip includes a substrate 501, where the substrate 501 has a first surface and a third surface opposite to the first surface, and a plurality of through holes 504 are distributed on the substrate 501 and used as fluid channels, an array formed by a plurality of vertical micro/nano wires/tubes 503 is disposed on the first surface, the top of the plurality of micro/nano wires/tubes 503 distributed around the through holes 504 is further connected with a fluid blocking portion 502, and the fluid blocking portion 502 is disposed above a fluid inlet of the through holes 504, so that a fluid to be processed cannot bypass the micro/nano wires/tubes array and directly enter the through holes 504. Moreover, more than one supporting beams 505 are erected on the through hole 504, for example, a plurality of supporting beams 505 are symmetrically or asymmetrically arranged, and the supporting beams 505 can also increase the support for the fluid blocking part 502, so that a firmer and more stable fit between the fluid blocking part and the base body is realized, the micro/nano wire/tube array distributed between the fluid blocking part and the base body can be effectively protected, and the problems of collapse, damage and the like of the micro/nano wire/tube array caused by the extrusion of the fluid blocking part and/or the base body on the micro/nano wire/tube array after the external force is applied are avoided.
The support beam may be in various forms, such as an arch bridge shape, and the like, but is not limited thereto. And further the support beam may also be fitted with other support bodies, such as the support bodies described in the fifth embodiment.
The number, size, distribution density and the like of the support beams can be adjusted according to actual needs, but the fluid inlets of the through holes are shielded as little as possible, so that the large influence on the fluid flux of the filter chip is avoided.
The structures, arrangement forms, materials, and the like of the substrate, the micro/nano wire/tube array, the fluid barrier, the through hole, and the like used in the sixth embodiment may be the same as or similar to those described above, and thus are not described herein again.
Referring to fig. 14, preferably, in a sixth embodiment of the present application, a filter chip includes a substrate 601, where the substrate 601 has a first surface 6011 and a third surface 6012 opposite to the first surface, and a plurality of through holes 604 serving as fluid channels are distributed on the substrate 601, an array formed by a plurality of vertical nano-pillars 603 is disposed on the first surface, tops of the plurality of nano-pillars 603 distributed around the through holes 604 are further connected with a fluid blocking portion 602, and the fluid blocking portion 602 is disposed above a fluid inlet of the through holes 604, so that a fluid to be processed cannot bypass the nano-pillar array and directly enter the through holes 604. A photocatalytic material layer 605 is further provided on the surface of the nano-pillars 603 and the first surface of the base 601. When the fluid is treated by the filter chip comprising the photocatalytic material layer 605, if ultraviolet light is used for assistance, some organic pollutants and the like in the fluid can be subjected to photocatalytic degradation, so that multiple purification of the fluid is realized.
Wherein, in order to facilitate the light penetration, part or all of the fluid barrier part, the base body and the bulge part can be made of transparent materials. In some embodiments of this embodiment, the fluid barrier may be made entirely of a transparent material, such as light.
Among them, the typical photocatalytic material may be titanium dioxide, etc., but is not limited thereto.
In order to form the photocatalytic material layer 605, a person skilled in the art can use various methods known in the art, such as coating (spin coating, spray coating, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer deposition, etc.), sputtering, etc., without being limited thereto.
Wherein, the thickness of the photocatalytic material layer 605 can be controlled at nanometer level to minimize the influence on the fluid flux of the filter chip.
The structures, arrangement forms, materials, and the like of the substrate, the micro/nano wire/tube array, the fluid barrier, the through hole, and the like used in the fourth embodiment may be the same as or similar to those described above, and thus are not described herein again.
Referring to fig. 15, preferably, in a seventh embodiment of the present application, a filter chip includes a substrate 701, where the substrate 701 has a first surface 7011 and a third surface 7012 opposite to the first surface, and a plurality of through holes 704 serving as fluid channels are distributed on the substrate 701, an array formed by a plurality of vertical nano-pillars 703 is disposed on the first surface, top portions of the plurality of nano-pillars 703 distributed around the through holes 704 are further connected with a fluid blocking portion 702, and the fluid blocking portion 702 is disposed above a fluid inlet of the through holes 704, so that a fluid to be processed cannot bypass the nano-pillar array and directly enter the through holes 704. An antibacterial material layer 705 is further disposed on the surface of the nano-pillars 703 and the first surface of the substrate 701. When the fluid is treated by the filter chip comprising the antibacterial material layer 705, bacteria, viruses and the like in the fluid can be synchronously killed in the treatment process of the fluid, so that the multiple purification of the fluid is realized.
Among them, the antibacterial material may be noble metal such as Au, Ag, etc., but is not limited thereto.
In order to form the antibacterial material layer 705, a person skilled in the art may use various methods known in the art, such as coating (spin coating, spray coating, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer deposition, etc.), sputtering, etc., without being limited thereto.
Wherein, the thickness of the antibacterial material layer 705 can be controlled at nanometer level to minimize the influence on the fluid flux of the filter chip.
The structure, arrangement form, material, etc. of the substrate, the micro/nano wire/tube array, the fluid barrier, the through hole, etc. used in the fifth embodiment may be the same as or similar to those described above, and thus are not described herein again.
The filter chip of the present application can be produced by physical or chemical methods, and for example, chemical growth methods, physical processing methods, and the like, particularly MEMS (micro electro mechanical Systems) methods, and the like.
For example, referring to fig. 16, in an eighth embodiment of the present application, a manufacturing process of a filter chip may include the following steps:
s1: providing a patterned photoresist mask on one side surface (defined as a first surface a) of a substrate (e.g., a silicon wafer);
s2: etching the first surface of the substrate to form a plurality of vertical nanowires spaced apart from each other on the first surface of the substrate, and then removing the first photoresist mask;
s3: coating soluble or corrodible organic matters and/or inorganic matters on the first surface of the substrate, and enabling the organic matters and/or the inorganic matters to fill gaps among the vertical nanowires to form a sacrificial layer;
s4: arranging photoresist on the sacrificial layer, and photoetching;
s5: etching the sacrificial layer to expose the tops of the vertical nanowires distributed in the second area of the first surface of the substrate, and then removing the photoresist;
s6: arranging a photoresist mask on the first surface of the substrate, and exposing the area corresponding to the fluid barrier part on the first surface of the substrate;
s7: depositing and forming a fluid barrier in the exposed area corresponding to the fluid barrier;
s8: stripping and removing the photoresist;
s9: providing a patterned etch mask on a second surface of the substrate;
s10: etching the other side surface (defined as a third surface b) of the substrate opposite to the first surface until the sacrificial material filled between the adjacent vertical nanowires is exposed, so as to form a slot on the third surface of the substrate, wherein the slot is located at a position corresponding to the first region of the first surface of the substrate, and the second region of the first surface of the substrate is arranged around the first region;
s11: and removing the etching mask and the sacrificial material filled among the vertical nanowires to obtain the filter chip.
The etching method adopted in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
For example, in the aforementioned step S1, the method of forming the patterned (nanopattern) photoresist mask includes: photolithography, nanosphere masking techniques, nano (metal) particle masking techniques, and the like, without limitation.
For example, in the aforementioned step S2, the vertical nanowire array can be etched by a method known in the art, such as RIE, ICP, wet etching, electrochemical etching, and the like.
For example, in the aforementioned step S3, the filled soluble organic substance may be photoresist or the like or a corrodible inorganic substance such as metal, SiO2Silicon nitride, and the like.
For example, in the aforementioned step S10, the slots can be etched by a method known in the art, such as RIE, ICP, wet etching, electrochemical etching, etc.
Obviously, the preparation process of the filter chip is simple and controllable, and is suitable for mass production.
Referring to fig. 17, in a ninth embodiment of the present application, a manufacturing process of a filter chip may include the following steps:
s1: growing a plurality of vertical nanowires/tubes on a first surface of a substrate (such as a silicon wafer) and spaced from each other;
s2: coating soluble or corrodible organic matters and/or inorganic matters on the first surface of the substrate, and enabling the organic matters and/or the inorganic matters to fill gaps among the vertical nanowires/tubes to form a sacrificial layer;
s3: arranging photoresist on the sacrificial layer, and photoetching;
s4: etching the sacrificial layer to expose the tops of the vertical nanowires distributed in the second area of the first surface of the substrate, and then removing the photoresist;
s5: arranging a photoresist mask on the first surface of the substrate, and exposing the area corresponding to the fluid barrier part on the first surface of the substrate;
s6: depositing and forming a fluid barrier in the exposed area corresponding to the fluid barrier;
s7: stripping and removing the photoresist;
s8: arranging a graphical etching mask on a third surface of the substrate opposite to the first surface;
s9: etching the third surface of the substrate until the sacrificial material filled between the adjacent vertical nanowires is exposed, so that a slot is formed in the third surface of the substrate, the slot is located corresponding to the first area of the first surface of the substrate, and the second area of the first surface of the substrate is arranged around the first area;
s10: and removing the etching mask and the sacrificial material filled among the vertical nanowires to obtain the filter chip.
The method for growing the vertical nanowire/tube in the foregoing step can be selected from various methods known in the art, such as MOCVD, PECVD, electrochemical deposition, etc.
The etching method adopted in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
For example, the method of forming a patterned (nanopattern) photoresist mask in the foregoing steps includes: photolithography, nanosphere masking techniques, nano (metal) particle masking techniques, and the like, without limitation.
For example, the substrate may be etched in the preceding steps by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, and the like.
For example, in the foregoing step, the soluble organic material to be filled may be a photoresist or the like or a corrodible inorganic material such as metal, SiO2SiN, etc.
Referring to fig. 18, in a tenth embodiment of the present application, a filter chip includes a substrate 801, the substrate 801 has a first surface 18011 and a second surface 8012 opposite to each other, a plurality of through holes 804 serving as fluid channels are distributed in a first area 8013 on the substrate 801, an array formed by a plurality of micro/nano sheets 803 (micro-sheets and/or nano sheets) arranged in parallel is disposed in a second area 8014 of the first surface, a local area of tops of the plurality of micro/nano sheets 803 distributed around the through holes 804 is connected to a fluid blocking portion 802, and the fluid blocking portion 802 is disposed above a fluid inlet of the through holes 804, so that a fluid to be processed cannot directly enter the through holes 804 by bypassing the micro/nano sheet array.
Wherein, the micro/nano-sheet has a thinner thickness, so that the micro/nano-sheet can be densely arranged on the first surface of the substrate, and by adjusting the distance between the micro/nano-sheets, the groove with the opening part with the selected size (which can be called as a micro-channel) can be formed, the removal treatment of the particles with different particle size ranges in the fluid can be realized, in particular, when the nano sheets are used, not only extremely fine particles in a fluid can be removed by controlling the distance between the nano sheets to be in the nano level, and because the thickness of the nano-sheet is extremely small, the resistance of the nano-sheet to fluid can be controlled at a very low level, and forms a large fluid flux (especially when the nanosheet has a high height), which is far superior to the existing porous membrane, the filter chip based on the transverse flow channel and the like.
The substrate 801 may have a large thickness, so that the substrate can support the micro/nano-sheet array well, and further enhance the mechanical strength of the filter chip, so that the filter chip is pressure-resistant, bending-resistant, collision-resistant, and impact-resistant, and thus can be applied in various environments without damage, for example, the substrate can be applied to processing high-pressure and high-speed fluids, which is a function that cannot be reached by existing porous membranes and the like.
The materials of the parts (801, 802, 803 and 804) of the filter chip are selected from various ranges, and the parts can be inorganic materials or organic materials, such as metal, nonmetal inorganic materials, plastics, ceramics, semiconductors, glass, polymers and the like. When inorganic materials are selected for these parts, the filter chip also has the property of resisting temperature change, and can process high temperature and low temperature fluids.
The fluid blocking part can be a sheet, and the thickness of the fluid blocking part can be adjusted according to the actual application requirement.
Furthermore, in this embodiment, more than one support body may be symmetrically or asymmetrically disposed around the through hole, and the support body may further support the fluid blocking portion, so as to achieve a more firm and stable fit between the fluid blocking portion and the base body, and effectively protect the micro/nano-sheet array distributed between the fluid blocking portion and the base body, thereby avoiding the problems of collapse and damage of the micro/nano-sheet array caused by the extrusion of the micro/nano-sheet array after the fluid blocking portion and/or the base body is subjected to an external force.
The support may have various shapes, such as a rectangular shape, a trapezoidal shape, a stepped shape, and the like, without being limited thereto. In some specific embodiments of this tenth embodiment, the support body may be a boss or the like protruding upward from the edge portion of the through hole, and the upper end of the support body is connected to the fluid blocking portion.
The number, diameter, distribution density and the like of the support bodies can be adjusted according to actual needs, but the space of the first surface of the base body is occupied as little as possible, so that the fluid flux of the micro/nano sheet array is prevented from being greatly influenced.
The filter chip adopting the design can be cleaned (ultrasonically) and used for multiple times, and still maintains good fluid processing capacity.
When the fluid is treated by using the filter chip, when the fluid containing impurity particles enters the micro/nano sheet array, particles with a particle size larger than a certain value (or some droplets incompatible with the fluid, such as water droplets in air or water droplets in oil) are blocked outside the micro/nano sheet array, and then the fluid enters the through hole 104 after reaching the inlet of the through hole 104 through the grooves between the micro/nano sheets, so that purification of the fluid and/or enrichment recovery of the required particles (droplets) are realized.
Referring again to fig. 18-19, in some embodiments of the tenth embodiment, the thickness of the micro/nano-sheet may be 1 nm-50 μm, the height may be 50 nm-200 μm, and the width of the trench between adjacent micro/nano-sheets may be 1 nm-50 μm. The aperture of the through hole 804 may be 1 μm to 1 mm. The thickness of the substrate may be 1 μm or more. The fluid barrier may have a thickness of 0.5 to 200 μm.
The cross-section of the trench formed before the adjacent micro/nanosheets may be regular or irregular in shape, for example, polygonal (triangular, quadrilateral or otherwise), circular, elliptical, star-shaped, and the like.
The aforementioned micro/nanoplatelets may be regularly or irregularly, homogeneously or non-homogeneously distributed on the first surface of the substrate.
In addition, in this tenth embodiment, the shapes (particularly, the shapes of the longitudinal or transverse cross sections) of the aforementioned through hole 804 and the fluid blocking portion 802 may be various, and may be, for example, circular, square, rectangular, or other shapes.
Referring to fig. 20, in an eleventh embodiment of the present application, a filter chip includes a substrate 901, the substrate 901 has a first surface and a second surface opposite to each other, a plurality of through holes 904 serving as fluid channels are distributed on the substrate 901, an array formed by a plurality of micro/nano sheets 903 continuously extending along the transverse direction is arranged on the first surface, wherein grooves for fluid to pass are formed between the micro/nano sheets, the caliber of the opening part of the groove is more than 0 but less than the grain diameter of selected particles mixed in the fluid to be treated, wherein, a plurality of micro/nano sheets directly pass through the through hole 904, so that the micro/nano sheets and the matrix are matched to form a fluid channel communicated with the through hole 904, and the fluid to be treated can only enter the through hole 904 through the fluid channel.
Further, in this embodiment, a fluid blocking portion 902 may be further connected to the micro/nano-sheet array, and the fluid blocking portion 902 is disposed above the fluid inlet of the through hole 904, so that the fluid to be treated cannot bypass the micro/nano-sheet array and directly enter the through hole 904.
Further, one or several supports may be arranged around the through hole 904.
The structure, arrangement form, material, etc. of the substrate, the micro/nano sheet array, the fluid barrier, the through hole, the support, etc. used in the eleventh embodiment may be the same or similar to those mentioned above, and therefore, the description thereof is omitted here.
In an eleventh embodiment of the present application, the filter chip may have a structure similar to that of the first and second embodiments, except that more than one supporting beam, for example, a plurality of supporting beams arranged symmetrically or asymmetrically, may be erected on the through hole, and the supporting beams may further increase the support for the fluid blocking portion, so as to achieve a more firm and stable fit between the fluid blocking portion and the base body, and may effectively form a protection for the micro/nano sheet array distributed between the fluid blocking portion and the base body, thereby avoiding problems such as collapse and damage of the micro/nano sheet array caused by the extrusion of the fluid blocking portion and/or the base body on the micro/nano sheet array after the fluid blocking portion and/or the base body is subjected to an external force.
The support beam may be in various forms, such as an arch bridge shape, and the like, but is not limited thereto. And further the support beam may also be fitted with other support bodies, such as the support bodies described in the second embodiment.
The number, size, distribution density and the like of the support beams can be adjusted according to actual needs, but the fluid inlets of the through holes are shielded as little as possible, so that the large influence on the fluid flux of the filter chip is avoided.
The structures, arrangement forms, materials, and the like of the substrate, the micro/nano-wire array, the fluid barrier, the through hole, and the like used in the eleventh embodiment may be the same as or similar to those described above, and thus are not described herein again.
Referring to fig. 21, in a twelfth embodiment of the present application, a filter chip may have a similar structure to that of either of the tenth and eleventh embodiments, except that: a photocatalytic material layer 1105 is also provided on the surface of the nanosheet 1103 and the first surface of the substrate 1101. When the fluid is treated by the filter chip comprising the photocatalytic material layer 1105, if ultraviolet illumination is used for assistance, some organic pollutants and the like in the fluid can be subjected to photocatalytic degradation, so that multiple purification of the fluid is realized.
In order to facilitate light penetration, part or all of the fluid barrier 1102, the base body and the protrusion can be made of transparent materials. In some embodiments of this embodiment, the fluid barrier may be made entirely of a transparent material, such as light.
Among them, the typical photocatalytic material may be titanium dioxide, etc., but is not limited thereto.
To form the photocatalytic material layer 1105, a person skilled in the art can use various methods known in the art, such as coating (spin coating, spray coating, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer deposition, etc.), sputtering, etc., without being limited thereto.
Wherein, the thickness of the photocatalytic material layer 1105 can be controlled to be in nanometer order to minimize the influence on the fluid flux of the filter chip.
The structure, arrangement, material, etc. of the substrate, the micro/nano-wire array, the fluid barrier, the via, etc. used in the twelfth embodiment may be the same as or similar to those described above, and thus are not described herein again.
Referring to fig. 22, preferably, in a thirteenth embodiment of the present application, a filter chip may have a structure similar to that of any one of the tenth, eleventh, and twelfth embodiments, except that: an antibacterial material layer 1205 is further arranged on the surface of the nano sheet 1203 and the first surface of the base 1201. When the fluid is treated by the filter chip comprising the antibacterial material layer 1205, bacteria, viruses and the like in the fluid can be synchronously killed in the treatment process of the fluid, so that the multiple purification of the fluid is realized.
Among them, the antibacterial material may be noble metal such as Au, Ag, etc., but is not limited thereto.
To form the antibacterial material layer 1205, a person skilled in the art may use various methods known in the art, such as coating (spin coating, spray coating, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer deposition, etc.), sputtering, etc., without being limited thereto.
Wherein, the thickness of the antibacterial material layer 1205 can be controlled at nanometer level to minimize the influence on the fluid flux of the filter chip.
The structures, arrangement forms, materials, and the like of the substrate, the micro/nano-wire array, the fluid barrier, the through hole, and the like used in the thirteenth embodiment may be the same as or similar to those described above, and thus are not described herein again.
The filter chip of the present application can be produced by physical or chemical methods, and for example, chemical growth methods, physical processing methods, and the like, particularly MEMS (micro electro mechanical Systems) methods, and the like.
In a fourteenth embodiment of the present application, a process for manufacturing a filter chip may include the steps of:
s1: providing a patterned photoresist mask on a side surface (named first surface) of a substrate (e.g., a silicon wafer);
s2: etching the first surface of the substrate to form a plurality of laterally extending vertical nanoplates spaced apart from one another on the first surface of the substrate, followed by removal of the first photoresist mask;
s3: coating soluble or corrodible organic matters and/or inorganic matters on the first surface of the substrate, and enabling the organic matters and/or the inorganic matters to fill the grooves among the vertical nanosheets to form a sacrificial layer;
s4: arranging photoresist on the sacrificial layer, and photoetching;
s5: etching the sacrificial layer to expose the tops of the vertical nano sheets distributed in the second area of the first surface of the substrate, and then removing the photoresist;
s6: arranging a photoresist mask on the first surface of the substrate, and exposing the area corresponding to the fluid barrier part on the first surface of the substrate;
s7: depositing and forming a fluid barrier part in the exposed area corresponding to the fluid barrier part, and stripping and removing the photoresist;
s8: arranging a graphical etching mask on the other side surface (named as a third surface) of the substrate opposite to the first surface, and etching the other side surface of the substrate until the sacrificial material filled between the adjacent vertical nano sheets is exposed, so that a slot is formed in the other side surface of the substrate, the slot is located corresponding to a first area of the first surface of the substrate, and a second area of the first surface of the substrate is arranged around the first area;
s9: and removing the etching mask and the sacrificial material filled among the vertical nano sheets to obtain the filter chip.
The etching method adopted in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
For example, in the aforementioned step S1, the method of forming the patterned (nanopattern) photoresist mask includes: photolithography, nanosphere masking techniques, nano (metal) particle masking techniques, and the like, without limitation.
For example, in the aforementioned step S2, the vertical nanosheet array may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, and the like.
For example, in the aforementioned step S3, the filled soluble organic substance may be photoresist or the like or a corrodible inorganic substance such as metal, SiO2SiN, etc.
For example, in the aforementioned step S8, the slots can be etched by a method known in the art, such as RIE, ICP, wet etching, electrochemical etching, etc.
Referring to fig. 23, in a fifteenth embodiment of the present application, a filter chip is mainly used for processing a fluid mixed with selected particles, and includes a substrate 1300, where the substrate 1300 has a first surface 1301 and a second surface 1302 opposite to each other, and a plurality of through holes 1303 serving as fluid channels are distributed on the substrate 1300. Within any of the through holes 1303 are distributed several micro/nano wires/tubes 1400 (i.e., any one or more of micro wires, micro tubes, nano wires, nano tubes), especially nano wires/tubes (nano wires and/or nano tubes). One end of the micro/nano wire/tube 1400 is fixed on the hole wall of the through hole 1303, and the other end extends along the radial direction of the through hole. These micro/nanowires/tubes 2 are aggregated in an interdigitated form into a porous structure. The diameter of the pores within the porous structure is greater than 0 and less than the particle size of the selected particle.
Referring to fig. 24, the porous structure is a grid structure distributed in the through holes 1303 from a top view.
Wherein, because the micro/nano wire/tube 1400 has a larger height-diameter ratio (or length-diameter ratio), the micro/nano wire/tube 1400 can be densely arranged in the through hole, and the particles with different particle size ranges in the fluid 1500 can be removed by adjusting the distribution density, length, etc. of the micro/nano wire/tube 1400, especially, when the nano wire/tube is used, the pore size of the pores formed by crossing the nano wire/tube is controlled at nanometer level, so that not only the tiny particles in the fluid can be removed, but also the resistance to the fluid can be controlled at a very low level due to the extremely small diameter of the nano wire/tube, and a very large fluid flux is formed, which is far superior to the existing porous membrane, filter chip based on transverse flow channel, etc.
The substrate 1300 may have a relatively large thickness, so as to further enhance the mechanical strength of the filter chip, and make the filter chip withstand pressure, bending, collision, and impact, and further may be applied to various environments without damage, for example, to process high-pressure and high-speed fluid, which is a function that is not accessible to the existing porous membrane and the like.
In particular, since the micro/nano-wires/tubes 1400 are all distributed in the through holes 1303, the micro/nano-wires/tubes 1400 are actually protected by the substrate 1300, and even if the filter chip is subjected to pressure, the micro/nano-wires/tubes 1400 are not damaged.
The material selection range of each part (1301, 1302 and 1303) of the filter chip is various, and the filter chip can be inorganic material or organic material, such as metal, ceramic, polymer and the like. When inorganic materials are selected for these parts, the filter chip also has the property of resisting temperature change, and can process high temperature and low temperature fluids.
The filter chip adopting the design can be cleaned (ultrasonically) and used for multiple times, and still maintains good fluid processing capacity.
When the fluid is treated by using the filter chip, when the fluid containing impurity particles enters the porous structure, particles (or some droplets incompatible with the fluid, such as water droplets in air or water droplets in oil) with the particle size larger than a certain value are blocked outside the porous structure, and then the fluid flows out of the through holes 1303, so that purification of the fluid and/or enrichment and recovery of the required particles (droplets) are realized.
In some specific applications of this embodiment, the diameter of the micro/nano wire/tube 1400 may be 1nm to 500 μm.
In some specific applications of this embodiment, the aperture of the through hole 1303 may be 1 μm to 1 mm.
In some specific applications of this embodiment, the thickness of the substrate may be greater than or equal to 1 μm.
The lateral cross-sectional structure of the aforementioned nanowires may be regular or irregular in shape, and may be, for example, polygonal (triangular, quadrangular or otherwise), circular, elliptical, star-shaped, and the like.
The aforementioned micro/nano-wires/tubes 1400 may be distributed within the through-holes 1303, either regularly or irregularly, uniformly or non-uniformly.
The aforementioned micro/nano wire/tube 1400 may be preferably selected from a carbon nano wire, a carbon nano tube, a ZnO nano wire, a GaN nano wire, a TiO nano wire2Nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
The micro/nano wire/tube 1400 can be formed by in-situ growth on the inner wall of the through hole 1303 by external transfer, in-situ growth (e.g., chemical growth, electrochemical growth), or deposition (e.g., physical, chemical vapor deposition, electrodeposition), etc.
The shape (particularly, the shape of the transverse cross section) of the through hole 1303 may be various, and may be, for example, a circle, a square, a rectangle, a rhombus, a polygon, or other regular or irregular shape.
In some specific application schemes of this embodiment, the micro/nano-wire/tube 1400 may be formed by a photocatalytic material or a material with an antibacterial and bactericidal function, or the micro/nano-wire/tube 1400 may also be a coating layer whose surface is covered by a photocatalytic material or a material with an antibacterial and bactericidal function.
For example, the micro/nano-wire/tube 1400 may be a nano-wire having photocatalytic properties, such as a ZnO nano-wire, a GaN nano-wire, or a TiO2 nano-wire, and may degrade organic substances in the fluid under light-assisted irradiation.
For example, the micro/nano wire/tube 1400 may use Ag nano wire, Au nano wire, etc. to kill bacteria, viruses, and microorganisms in the fluid.
In some specific applications of this embodiment, a photocatalytic material layer or an antibacterial material layer may be further disposed on the surface of the substrate 1300, particularly on the first surface 1301 thereof.
When the fluid is treated by the filter chip comprising the photocatalytic material layer, if ultraviolet illumination and the like are used for assistance, organic pollutants and the like in the fluid can be subjected to photocatalytic degradation, and the fluid is purified in multiple ways.
In order to facilitate light penetration, part or all of the components in the filter chip can be made of transparent materials.
Among them, the typical photocatalytic material may be titanium dioxide, etc., but is not limited thereto.
In order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spray coating, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer deposition, etc.), sputtering, etc., without being limited thereto.
Wherein, the thickness of the photocatalytic material layer can be controlled at nanometer level to reduce the influence on the fluid flux of the filter chip.
When the filter chip containing the antibacterial material layer is used for treating the fluid, bacteria, viruses and the like in the fluid can be synchronously killed in the fluid treatment process, so that the multiple purification of the fluid is realized.
Among them, the antibacterial material may be noble metal such as Au, Ag, etc., but is not limited thereto.
In order to form the antibacterial material layer, those skilled in the art may adopt various manners known in the art, such as coating (spin coating, spray coating, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer deposition, etc.), sputtering, etc., without being limited thereto.
Wherein, the thickness of the antibacterial material layer can be controlled at nanometer level to reduce the influence on the fluid flux of the filter chip.
As one of the preferred embodiments of this embodiment, a plurality of standing nanowires spaced apart from each other may be provided on the first surface of the base, and these nanowires may be provided around the aforementioned through-hole as a fluid channel.
Preferably, the length-diameter ratio of the vertical nanowires is 4: 1-200000: 1, the ratio of the distance between adjacent vertical nanowires to the length of the vertical nanowires is 1: 4-1: 200000.
by adopting the vertical nanowires with the structure and the distribution form, a plurality of vertical nanowires can be densely arranged (the proportion of the convex part per se in unit area is small), the tiny particles in the fluid can be conveniently treated, and meanwhile, the filter chip is endowed with larger fluid flux (the pores among the vertical nanowires are larger than the size of the vertical nanowires).
Preferably, the vertical nanowires may have the same material, size, structure, etc. as the micro/nanowires/tubes 1400.
Particularly, if the arrangement density of the vertical nanowires is designed appropriately according to the scheme known in the industry, so that the nanowire array is formed, and a super-hydrophobic structure and a super-oleophobic structure can be formed, so that not only can particles in the fluid be removed, but also the blocked particles cannot be accumulated on the surface of the filter chip through the self-cleaning effect.
Wherein, the substrate can have a larger thickness, so that the vertical nanowires can obtain better support.
As one of the preferred embodiments of this embodiment, a fluid barrier may be further disposed on the aforementioned upright nanowires, the fluid barrier may have a surface (which may be named as a third surface) disposed opposite to the first surface of the substrate, and the plurality of upright nanowires may have one end fixedly disposed on the first surface of the substrate and the other end fixedly connected to the third surface of the fluid barrier, wherein the distance between adjacent upright nanowires is greater than 0 but smaller than the particle size of the selected particles.
The fluid barrier may have various forms, for example, a sheet form, a thin shell form, a rectangular form, a polyhedral form, or the like.
Preferably, the vertical nanowires, the fluid barrier and the substrate are matched to form a fluid channel, and the fluid to be treated can only enter the fluid inlets of the fluid channels (through holes 1303) distributed on the first surface of the substrate through the fluid channel to realize the first treatment of the fluid, and then enter the fluid channels distributed on the substrate, and the aggregate of the micro/nanowires/tubes 1400 is subjected to the second treatment, so that multiple treatments of the fluid can be realized.
The distance between the vertical nanowires is designed to be different from the aperture of the hole formed by the intersection of the micro/nanowire/tube 1400, especially, the distance between the vertical nanowires is larger than the aperture of the hole formed by the intersection of the micro/nanowire/tube 1400, and thus, the classification treatment of particles with different sizes in the fluid can be realized.
The fluid barrier may be disposed in various forms, for example, it may be disposed at a distance from the base as a whole, may be partially connected to the base, or may be integrally formed with the base in some cases.
The fluid inlet of the fluid channel (the through hole 1303) and the plurality of upright nanowires may be distributed in an orthographic projection of the fluid barrier on the first surface of the substrate.
The shape of the fluid barrier may be various, and may be, for example, circular, square, rectangular, or other shapes.
The material of the fluid barrier may be selected from metals, non-metals, organic materials, inorganic materials, etc., such as silicon wafers, polymers, ceramics, etc., but is not limited thereto.
Preferably, the surface of the fluid barrier may be distributed with the photocatalytic material, the sterilizing material, or the like, or the entire surface of the fluid barrier may be composed of the photocatalytic material, the sterilizing material, or the like.
Preferably, the fluid barrier may also have a partially transparent structure or be entirely transparent, for example, for light to enter.
The filter chip of the present application can be produced by physical or chemical methods, and for example, chemical growth methods, physical processing methods, and the like, particularly MEMS (micro electro mechanical Systems) methods, and the like.
For example, referring to fig. 25, in a sixteenth embodiment of the present invention, a process for manufacturing a filter chip may include the following steps:
s1: arranging a patterned photoresist mask on a first surface of a substrate (such as a silicon wafer), wherein the patterned photoresist mask comprises a line with a micro-nano scale;
s2: etching the first surface of the substrate by using the photoresist mask so as to form a plurality of through holes which penetrate through the first surface of the substrate and a second surface opposite to the first surface and are used as fluid channels;
s3: depositing a seed layer for micro/nanowire/tube growth on the inner wall of the fluid channel and the first surface of the substrate;
s4: growing a plurality of micro/nano wires/tubes on the seed layer, and controlling the growth conditions of the micro/nano wires/tubes, so that a plurality of vertical micro/nano wires/tubes which are spaced from each other are grown and formed on the first surface of the substrate, a plurality of micro/nano wires/tubes which extend along the radial direction are grown and formed in the fluid channel, and the micro/nano wires/tubes in the fluid channel are crossed with each other to form a cross grid with a micro-nano scale;
s5: removing the micro/nano wires/tubes (which may also remain) distributed at the first surface of the substrate;
s6: scribing and packaging to obtain the filter chip.
The etching method adopted in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
For example, in the foregoing steps, a method of forming a patterned (nanopattern) photoresist mask includes: photolithography, nano-bead masking, nano (metal) particle masking, and the like, without limitation.
For example, in the foregoing steps, the fluid channel and the like may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching and the like.
The above embodiments are merely illustrative of the technical concept and structural features of the present invention, and are intended to be implemented by those skilled in the art, but the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should fall within the scope of the present invention.

Claims (17)

1. A nasal respirator, characterized by comprising:
the nasal plug comprises a nasal plug and a filter chip, at least one end part of the nasal plug can be inserted into the nasal cavity of a user, the nasal plug comprises an air channel communicated with the nasal cavity, the filter chip is used for filtering particles which are mixed in airflow to be treated and have the particle size larger than a set value, and the air to be treated flows through the filter chip and then enters the air channel in the nasal plug; and the number of the first and second groups,
the filter chip protection structure is used for protecting the filter chip and comprises a first fixed hard filter screen and a second fixed hard filter screen, and the filter chip is arranged between the first fixed hard filter screen and the second fixed hard filter screen;
wherein, filter chip includes:
a substrate having a first fluid channel with an air inlet and an air outlet, the air inlet of the first fluid channel being distributed over a first surface of the substrate;
a plurality of convex parts which are arranged at intervals, the convex parts extend continuously on the first surface of the base body along the transverse direction, the lower parts of the convex parts are fixedly arranged on the first surface of the base body, the upper parts of the convex parts are provided with cap-shaped structures which extend continuously along the transverse direction, two opposite side parts of the cap-shaped structures extend outwards along the lateral direction, an opening part for allowing air to pass through is formed between the adjacent cap-shaped structures, the caliber of the opening part is larger than 0 but smaller than the grain diameter of selected particles mixed in the air to be processed, at least two convex parts are respectively arranged adjacent to two opposite sides of the air inlet of the first fluid channel, and at least one convex part directly passes through the air inlet of the first fluid channel, so that a second fluid channel which is communicated with the first fluid channel is formed between the plurality of cap-shaped structures, the plurality of convex parts and the base body in a matching way, and air to be treated can only enter the first fluid channel through the second fluid channel.
2. The nasal respirator of claim 1, wherein: the nose plug type respirator also comprises a first filtering fabric and/or a second filtering fabric, wherein the first filtering fabric is distributed between the nose plugs and the filtering chips, and the filtering chips are distributed between the second filtering fabric and the nose plugs.
3. The nasal respirator of claim 2, wherein: the nasal type respirator further comprises a first detachable hard filter screen and/or a second detachable hard filter screen, the first detachable hard filter screen is fixedly connected with the first filter fabric, and the second detachable hard filter screen is fixedly connected with the second filter fabric.
4. The nasal respirator of claim 1, wherein: the nasal plug adopts a waist drum type nasal plug.
5. The nasal respirator of claim 1, wherein: the nose plug type respirator also comprises a shell with openings at two ends, the nose plug is detachably arranged at one end of the shell, and the filter chip is accommodated in the shell.
6. The nasal respirator as claimed in claim 1, wherein the nose plug is a nose plug; at least two of said bosses pass directly over the air inlet of said first fluid passageway.
7. The nasal respirator of claim 1, wherein: the plurality of convex parts are distributed on the first surface of the base body in parallel.
8. The nasal respirator of claim 1, wherein: the cap structure is integrally provided with the boss.
9. The nasal respirator of claim 1, wherein: the cap-shaped structure has an inverted trapezoidal cross-sectional structure.
10. The nasal respirator of claim 1, wherein: the aperture of the opening formed between adjacent cap-shaped structures is 1 nm-50 mu m.
11. The nasal respirator of claim 1, wherein: the height of the cap-shaped structure is 50 nm-200 mu m.
12. The nasal respirator of claim 1, wherein: the distance between adjacent protrusions is 0.1 mu m-100 mu m.
13. The nasal respirator of claim 1, wherein: the height of the protruding part is 0.1 mu m-400 mu m, and the width of the protruding part is 0.1 mu m-100 mu m.
14. The nasal respirator of claim 1, wherein: the aperture of the first fluid channel is 1 mu m-1 mm.
15. The nasal respirator of claim 1, wherein: the thickness of the matrix is more than 1 mu m.
16. The nasal respirator of claim 1, wherein: at least the surface of any one of the convex part, the cap-shaped structure and the substrate is also provided with a photocatalytic functional material layer and/or an antibacterial functional material layer.
17. The nasal respirator of claim 1, wherein: at least part of at least one of the boss, the cap structure and the base is a transparent structure.
CN201610399521.8A 2016-06-07 2016-06-07 Nose plug type respirator Active CN107469246B (en)

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CN202210477956.5A CN114796918B (en) 2016-06-07 2016-06-07 Nasal obstruction type respirator
CN202210478024.2A CN114733098B (en) 2016-06-07 2016-06-07 Nasal obstruction type respirator
CN202210477854.3A CN114733097B (en) 2016-06-07 2016-06-07 Nasal obstruction type respirator
CN201610399521.8A CN107469246B (en) 2016-06-07 2016-06-07 Nose plug type respirator
CN202210478272.7A CN114796919B (en) 2016-06-07 2016-06-07 Nose plug type respirator
CN202210478025.7A CN114733099B (en) 2016-06-07 2016-06-07 Nasal obstruction type respirator
PCT/CN2017/086780 WO2017211215A1 (en) 2016-06-07 2017-06-01 Fluid processing device and preparation method therefor

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CN202210478024.2A Division CN114733098B (en) 2016-06-07 2016-06-07 Nasal obstruction type respirator
CN202210477956.5A Division CN114796918B (en) 2016-06-07 2016-06-07 Nasal obstruction type respirator
CN202210477854.3A Division CN114733097B (en) 2016-06-07 2016-06-07 Nasal obstruction type respirator
CN202210478025.7A Division CN114733099B (en) 2016-06-07 2016-06-07 Nasal obstruction type respirator

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CN202210478024.2A Active CN114733098B (en) 2016-06-07 2016-06-07 Nasal obstruction type respirator
CN201610399521.8A Active CN107469246B (en) 2016-06-07 2016-06-07 Nose plug type respirator
CN202210478025.7A Active CN114733099B (en) 2016-06-07 2016-06-07 Nasal obstruction type respirator
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CN111729402B (en) * 2020-05-06 2022-07-12 青岛大学 Electroactive air filtering material and preparation method thereof

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CN114796919A (en) 2022-07-29
CN114733097A (en) 2022-07-12
CN114733098B (en) 2023-06-27
CN114796918A (en) 2022-07-29
CN114733099B (en) 2023-06-23
CN114733098A (en) 2022-07-12
CN114796919B (en) 2023-04-18
CN114733099A (en) 2022-07-12
CN114796918B (en) 2023-06-27
CN114733097B (en) 2023-06-27

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