The content of the invention
It is a primary object of the present invention to provide a kind of nasal obstruction type respirator, to overcome deficiency of the prior art.
To achieve these goals, technical scheme is as follows:
The embodiments of the invention provide a kind of nasal obstruction type respirator, and it includes:
Nasal obstruction and filtrating chip, the one end of at least described nasal obstruction are inserted into the nasal cavity of user, and the nasal obstruction bag
Containing the gas passage connected with the nasal cavity, the filtrating chip to filter out mix in it is in pending air-flow, particle diameter is big
In the particle of setting value, pending gas enters the gas passage in the nasal obstruction after flowing through the filtrating chip;And
Filtrating chip safeguard structure, to protect the filtrating chip.
In some embodiments, the filtrating chip safeguard structure includes the first fixed hard filter screen and the second fixation
Formula hard filter screen, the filtrating chip are arranged between the first fixed hard filter screen and the second fixed hard filter screen.
In some embodiments, the rhinobyon type filter also includes the first filtration fabrics and/or the second filtration fabrics,
First filtration fabrics be distributed in it is described nasal obstruction filtrating chip between, the filtrating chip be distributed in the second filtration fabrics with
Between nasal obstruction.
In some embodiments, the rhinobyon type filter also includes the first detachable hard filter screen and/or second
Removable hard filter screen, the first detachable hard filter screen are fixedly connected with the first filtration fabrics, and described second is detachable
Formula hard filter screen is fixedly connected with the second filtration fabrics.
In some embodiments, the nasal obstruction is had a stuffy nose using waist-drum-shaped;And/or the rhinobyon type filter also includes
The housing of one both ends open, the nasal obstruction are mounted at the shell one end, and the filtrating chip is placed in the shell
In vivo.
In more specific first embodiment of the present invention, the filtrating chip includes:
Matrix with first fluid passage, the first fluid passage have an air intake and air outlet slit, and described
The air intake of one fluid passage is distributed in the first surface of described matrix;
The a plurality of lug bosses being intervally installed, the lug boss are transversely continuous on the first surface of described matrix
Extension, bottom are fixedly installed on the first surface of described matrix, and top is provided with the hat-shaped structure transversely continuously extended, the cap
The phase of shape structure back to both sides along epitaxial lateral overgrowth, and formed with the opening for being available for air to pass through between adjacent hat-shaped structure
Portion, the bore of the opening portion are more than 0 but less than mixing in the particle diameter of the selected particle in pending air, and wherein at least two
Individual described lug boss respectively with the phase of the air intake of the first fluid passage back to both sides be disposed adjacent, and at least
Lug boss described in one directly from the air intake of the first fluid passage by so that a plurality of hat-shaped structures,
The second fluid passage connected with the first fluid passage is cooperatively formed between a plurality of lug bosses and matrix, and it is pending
Air is only capable of entering first fluid passage by the second fluid passage.
In first embodiment, the lug boss described at least two directly enters from the air of the first fluid passage
Pass through on mouthful;And/or a plurality of lug bosses are parallel is distributed on the first surface of described matrix.
More preferable, the hat-shaped structure is wholely set with lug boss.
In first embodiment, the hat-shaped structure can have inverted trapezoidal cross section structure.
More preferable, the bore for the opening portion being formed between adjacent hat-shaped structure is 1nm~50 μm.
More preferable, the height of the hat-shaped structure is 50nm~200 μm.
More preferable, the distance between adjacent projections are 0.1 μm~100 μm.
More preferable, the height of the lug boss is 0.1 μm~400 μm, and width is 0.1 μm~100 μm.
More preferable, the aperture of the first fluid passage is 1 μm~1mm.
More preferable, the thickness of described matrix is more than 1 μm.
It is more preferable, it is additionally provided with light to the surface less than any one of the lug boss, hat-shaped structure and matrix
Catalysis material layer and/or antibiotic functional material layer.
More preferable, at least local of at least one of the lug boss, hat-shaped structure and matrix is transparent configuration.
In more specific second embodiment of the present invention, the filtrating chip includes:
Matrix with first fluid passage, the first fluid passage have an air intake and air outlet slit, and described
The air intake of one fluid passage is distributed in the first surface of described matrix;
Intersected the loose structure formed by complex root nemutogen, is cooperatively formed to the first surface with described matrix
Second fluid passage, described complex root nemutogen one end are fixedly connected with described matrix, the loose structure Hole it is straight
Footpath is more than 0 but is less than and mixes in the particle diameter of the selected particle in pending air, and pending air is only capable of by described
Second fluid passage enters first fluid passage.
Further, one end of the complex root nemutogen is fixedly connected with the first surface of described matrix, and is surround
It is distributed in around the air intake of the first fluid passage.
More preferable, described air filter chip also includes a plurality of lug bosses being intervally installed, described convex
The portion of rising is fixedly installed on the first surface of described matrix, and is transversely continuously extended on the first surface of described matrix, its
In at least two lug bosses respectively with the phase of the air intake of the first fluid passage back to both sides be disposed adjacent, at least one
Individual lug boss is directly by being fixedly connected with more than two from the air intake of the first fluid passage on the lug boss
Described nemutogen.
It is more preferable, the complex root nemutogen that is connected on a lug boss and it is connected to adjacent with the lug boss another
Complex root nemutogen on lug boss intersects.
More preferable, a plurality of lug bosses are parallel to be distributed on the first surface of described matrix.
Further, the shape of the lug boss includes strip or sheet, and not limited to this.
Further, described a plurality of lug bosses be uniformly distributed or non-uniform Distribution described matrix first surface
On.
More preferable, the width of the lug boss is 0.1 μm~100 μm, is highly 0.1 μm~400 μm.
More preferable, the distance between adjacent projections are 0.1 μm~100 μm.
More preferable, the lug boss surface is additionally provided with Photocatalysis Function Material layer and/or antibiotic functional material layer.
More preferable, at least one of described matrix, the complex root nemutogen, described a plurality of lug bosses are extremely
Few part is transparent configuration.
It is more preferable, a diameter of 1nm~50 μm of the nemutogen.
It is more preferable, between one end of one end of any of which nemutogen and another nemutogen adjacent with the nemutogen
Distance be 1nm~50 μm.
More preferable, the length of the nemutogen is 50nm~200 μm.
It is more preferable, catalysis material or anti-biotic material is also extremely distributed with less than the nemutogen surface.
More preferable, at least local of at least one of described matrix and described complex root nemutogen is transparent knot
Structure.
More preferable, the nemutogen is linear.
Further, the air intake of the first fluid passage has rule or irregular shape, the regular shape
Including polygon, circle or ellipse.
More preferable, the aperture of the first fluid passage is 1 μm~1mm.
More preferable, the thickness of described matrix is more than 1 μm.
More preferable, the filtrating chip also complex root including the parallel first surface for being distributed in described matrix is horizontal
Beam, the crossbeam transversely continuously extend in the first surface of described matrix, and wherein at least two crossbeams are respectively with described first
The phase of the air intake of fluid passage back to both sides be disposed adjacent, an at least crossbeam is directly from the first fluid passage
Pass through on air intake;And complex root nemutogen is distributed with any crossbeam, at least part in the complex root nemutogen
The beam surface is fixed in one end of nemutogen, the other end extended obliquely out along the direction for being gradually distance from any crossbeam and/or
Continuously extend on the face parallel to described matrix first surface, and with being distributed on another crossbeam adjacent to any crossbeam
Complex root nemutogen intersect, so as to form the loose structure.
More preferable, at least two crossbeams directly pass through from the air intake of the first fluid passage.
More preferable, the nemutogen includes carbon nanocoils, CNT, ZnO nano-wire, GaN nano wire, TiO2Receive
Any of rice noodles, Ag nano wires, Au nano wires or two or more combinations, but not limited to this.
In more specific 3rd embodiment of the present invention, the filtrating chip includes:
Matrix with first fluid passage, the first fluid passage have an air intake and air outlet slit, and described
The air intake of one fluid passage is distributed in the first area of the first surface of described matrix;
Gas barrier portion, the second surface that there is the first surface with described matrix to be oppositely arranged are pending for preventing
Air is directly entered the air intake of the first fluid passage;
The a plurality of lug bosses being intervally installed, described lug boss one end are fixedly installed on the first surface of described matrix
Second area in, the other end is fixedly connected with the second surface in the gas barrier portion, wherein between adjacent projections away from
From more than 0 but less than mixing in the particle diameter of the selected particle in pending air, the secondth area of the first surface of described matrix
Domain abuts with first area, so that cooperatively forming second fluid between a plurality of lug bosses, gas barrier portion and matrix
Passage, and pending air is only capable of entering first fluid passage by the second fluid passage.
Further, a plurality of lug bosses are set around the air intake of the first fluid passage.
Further, a plurality of lug bosses are also arranged at intervals with the 3rd region of the first surface of described matrix, it is described
Second area is located between the 3rd region and first area.
More preferable, the aperture of the first fluid passage is 1 μm~1mm.
More preferable, the thickness of described matrix is more than 1 μm.
More preferable, the thickness in the gas barrier portion is 0.5 μm~200 μm.
More preferable, the lug boss surface is additionally provided with function material layer, and the material of the function material layer includes
Catalysis material or anti-biotic material.
More preferable, at least local of at least part component in the air filter chip is transparent configuration.
Further, the 3rd region of the first surface of described matrix is set around the second area.
Further, the first area of the first surface of described matrix and second area be distributed in the gas barrier portion in
In orthographic projection on the first surface of described matrix.
More preferable, the air filter chip also includes at least one supporter, described supporter one end with it is described
Matrix is fixedly connected, and the other end is fixedly connected with the gas barrier portion.
More preferable, a plurality of lug bosses for being distributed in the 3rd region of the first surface of described matrix arrange to form tool
There are the micron order or nanoscale arrays structure of super-hydrophobic or superoleophobic performance.
More preferable, the air filter chip includes the supporter described in two or more, and the two or more institute
The supporter stated is symmetrically distributed in around the air intake of the first fluid passage.
More preferable, the air intake restocking of the first fluid passage is provided with a beam supported above, the support
Beam is fixedly connected with the gas barrier portion.
Further, the lug boss is in the stand wire set, column, sheet, tubulose, taper, frustum structure
Any one, and not limited to this.
Further, the lateral cross section of the lug boss has rule or irregular shape, and the regular shape includes more
Side shape, circle or ellipse, but not limited to this.
Further, described a plurality of lug bosses be uniformly distributed or non-uniform Distribution described matrix first surface
On.
Further, the air intake of the first fluid passage has rule or irregular shape, the regular shape
Including polygon, circle or ellipse, but not limited to this.
More preferable, the lug boss is that wire is raised, and its draw ratio is 4:1~200000:1.
More preferable, the ratio of the distance between adjacent projections and the length of the lug boss is 1:4~1:
200000。
Micro wire or nano wire more preferable, that the lug boss is set for setting, its a diameter of 1nm~50 μm are long
It is 1nm~50 μm to spend for the distance between 50nm~200 μm, adjacent projections.
In more specific 4th embodiment of the present invention, the filtrating chip includes:
Matrix with first fluid passage, the first fluid passage have an air intake and air outlet slit, and described
The air intake of one fluid passage is distributed in the first area of the first surface of described matrix;
Gas barrier portion, the second surface that there is the first surface with described matrix to be oppositely arranged are pending for preventing
Air is directly entered the air intake of the first fluid passage;
A plurality of lug bosses, the lug boss transversely continuously extend in the second area of the first surface of described matrix,
It is more than 0 formed with the groove for being available for air to pass through, the bore of the opening portion of the groove wherein between adjacent projections but is less than
Mix in the particle diameter of the selected particle in pending air, and the first surface of the upper end of the lug boss and described matrix
It is tightly connected, the regional area of lower end and the second surface in the gas barrier portion are tightly connected, so that described a plurality of convex
More than one groove, gas barrier portion and base mate between the portion of rising form second fluid passage, and pending air is only
First fluid passage can be entered by the second fluid passage.
Further, the second area of the first surface of described matrix is set around first area.
Further, the air intake of the regional area at the second end of the lug boss and the first fluid passage is divided equally
In the orthographic projection that cloth is formed on first surface of the gas barrier portion in described matrix.
Further, the shape of the lug boss includes strip or sheet, but not limited to this.
Further, described a plurality of lug bosses be uniformly distributed or non-uniform Distribution described matrix first surface
On.
Further, the air intake of the first fluid passage has rule or irregular shape, the regular shape
Including polygon, circle or ellipse, but not limited to this.
More preferable, the width of the lug boss is 1nm~50 μm, is highly 50nm~200 μm.
More preferable, the size in the groove opening portion being formed between adjacent projections is 1nm~50 μm.
More preferable, the aperture of the first fluid passage is 1 μm~1mm.
More preferable, the thickness of described matrix is more than 1 μm.
More preferable, the thickness in the gas barrier portion is 0.5 μm~200 μm.
More preferable, the lug boss surface is additionally provided with function material layer, and the material of the function material layer includes
Catalysis material or anti-biotic material.
More preferable, at least local of at least one of described matrix, gas barrier portion, lug boss is transparent knot
Structure.
In more specific 5th embodiment of the present invention, the filtrating chip includes:
Matrix with first fluid passage, the first fluid passage have an air intake and air outlet slit, and described
The air intake of one fluid passage is distributed in the first surface of described matrix;
The a plurality of lug bosses being intervally installed, the lug boss are fixedly installed on the first surface of described matrix,
And transversely continuously extend on the first surface of described matrix, formed with being available for what air passed through wherein between adjacent projections
Groove, the bore of the opening portion of the groove, which is more than 0 but is less than, to be mixed in the particle diameter of the selected particle in pending air, with
And wherein at least two lug boss respectively with the phase of the air intake of the first fluid passage back to both sides be disposed adjacent,
At least one lug boss directly from the air intake of the first fluid passage by so that a plurality of lug bosses with
The second fluid passage connected with the first fluid passage is cooperatively formed between matrix, and pending air is only capable of passing through institute
State second fluid passage and enter first fluid passage.
More preferable, the filtrating chip also includes:Gas barrier portion, have relative with the first surface of described matrix
The second surface of setting, the air intake of the first fluid passage are distributed in the gas barrier portion in the first of described matrix
In the orthographic projection formed on surface, a plurality of lug bosses have mutually back to first end and the second end, the first end with
The first surface of described matrix is tightly connected, and the second surface of the regional area at the second end and the occlusion part is tightly connected.
More preferable, a plurality of lug bosses are parallel to be distributed on the first surface of described matrix.
More preferable, the size of the opening portion for the groove being formed between adjacent projections is 1nm~50 μm.
More preferable, the aperture of the first fluid passage is 1 μm~1mm.
More preferable, the thickness of described matrix is more than 1 μm.
More preferable, the lug boss surface is additionally provided with function material layer, and the material of the function material layer includes
Catalysis material or anti-biotic material.
More preferable, the thickness in the gas barrier portion is 0.5 μm~200 μm.
More preferable, at least local of at least one of described matrix, gas barrier portion, lug boss is transparent knot
Structure.
In more specific 6th embodiment of the present invention, the filtrating chip includes:
Matrix with fluid passage, and
The aggregation of complex root nemutogen, to flow through the fluid passage, be contaminated with the air of selected particle and enter
Row processing;
The aggregation is distributed in the fluid passage, and has loose structure, the loose structure inside aperture it is straight
Footpath is more than 0 but less than the particle diameter of the selected particle.
Further, inwall of the described nemutogen one end with the fluid passage is fixedly connected, and the other end is along the stream
Body passage radially extends.
Further, the complex root nemutogen intersects or is interlaced with one another to form the loose structure.
Further, the complex root nemutogen is intervally installed and parallel arrangement forms the loose structure.
Further, described matrix have mutually back to first surface and second surface, the air of the fluid passage enters
Mouth is distributed in the first surface of described matrix.
Further, the first surface of described matrix is also distributed with the complex root being intervally installed and erects nemutogen, institute
State complex root and erect nemutogen around fluid passage setting.
Further, the filtrating chip also includes gas barrier portion, and the gas barrier portion has and described matrix
The 3rd surface that first surface is oppositely arranged, and the complex root erect that nemutogen one end is fixedly installed on described matrix the
One surface, the other end are fixedly connected with the 3rd surface in the gas barrier portion, wherein the distance between adjacent setting nemutogen
More than 0 but less than the particle diameter of the selected particle.
More preferable, the first surface of described matrix is additionally provided with function material layer, the material of the function material layer
Including catalysis material or anti-biotic material.
More preferable, at least part component in the air filter chip has transparent configuration.
Further, there is the air intake of the fluid passage rule or irregular shape, the regular shape to include
Polygon, circle or ellipse, but not limited to this.
More preferable, the aperture of the fluid passage is 1 μm~1mm.
More preferable, the thickness of described matrix is more than 1 μm.
Further, the air intake of the fluid passage and complex root erect nemutogen and are distributed in the gas barrier portion
In in the orthographic projection of the first surface of described matrix.
More preferable, the draw ratio for erectting nemutogen is 4:1~200000:1.
More preferable, adjacent the distance between nemutogen and the ratio of the length of the setting nemutogen erect is 1:4
~1:200000.
It is more preferable, a diameter of 1nm~500 μm of the nemutogen.
More preferable, the nemutogen is selected from nano wire or nanotube.
It is more preferable, catalysis material or anti-biotic material is also extremely distributed with less than the nemutogen surface.
More preferable, the nemutogen includes carbon nanocoils, CNT, ZnO nano-wire, GaN nano wire, TiO2Receive
Any of rice noodles, Ag nano wires, Au nano wires or two or more combinations, but not limited to this.
Than prior art, advantages of the present invention at least that:
1) nasal obstruction type respirator filterability provided by the invention is good, breathing is convenient, comfort is good, can be used for multiple times, and uses
Long lifespan;
2) filtrating chip in the present invention is at least with flux is big, flow resistance is small, energy high-efficient cleaning removes micro/nano level in air
The features such as grain, can also use thicker matrix, high mechanical strength, can (ultrasound) clean and be used for multiple times, service life is grown, and
It is preferred that there is self-cleaning function, while its preparation technology is simply controllable, is prepared on a large scale suitable for scale.
Embodiment
A kind of nasal obstruction type respirator provided in an embodiment of the present invention includes:
Nasal obstruction and filtrating chip, the one end of at least described nasal obstruction are inserted into the nasal cavity of user, and the nasal obstruction bag
Containing the gas passage connected with the nasal cavity, the filtrating chip to filter out mix in it is in pending air-flow, particle diameter is big
In the particle of setting value, pending gas enters the gas passage in the nasal obstruction after flowing through the filtrating chip;And
Filtrating chip safeguard structure, to protect the filtrating chip.
In some embodiments, the filtrating chip safeguard structure includes the first fixed hard filter screen and the second fixation
Formula hard filter screen, the filtrating chip are arranged between the first fixed hard filter screen and the second fixed hard filter screen.
In some embodiments, the rhinobyon type filter also includes the first filtration fabrics and/or the second filtration fabrics,
First filtration fabrics be distributed in it is described nasal obstruction filtrating chip between, the filtrating chip be distributed in the second filtration fabrics with
Between nasal obstruction.
In some embodiments, the rhinobyon type filter also includes the first detachable hard filter screen and/or second
Removable hard filter screen, the first detachable hard filter screen are fixedly connected with the first filtration fabrics, and described second is detachable
Formula hard filter screen is fixedly connected with the second filtration fabrics.
More preferable, the nasal obstruction is had a stuffy nose using waist-drum-shaped, and it can partly or wholly insert human nasal intracavitary.
More preferable, the rhinobyon type filter also includes the housing of a both ends open, the dismountable peace of nasal obstruction
Loaded on the shell one end, the filtrating chip is placed in the housing.On the one hand the housing can be realized to filtrating chip
Further protection, on the other hand can also house foregoing various assemblies so that the respiratory organ structure it is compact firmly.The housing
It is preferred that use hard shell.
It is a kind of nasal obstruction type respirator in an of the invention exemplary embodiments to refer to shown in Fig. 1, and it can include:
Hard shell 11,
Embedded hard silk screen component, including transverse direction, be positioned apart from the embedded hard silk screen of two panels in shell 11
12;
Filter wire piece of cloth component, including transverse direction, be positioned apart from the two panels filter wire piece of cloth 13 in shell 11, two
Piece filter wire piece of cloth 13 is located between the embedded hard silk screen 12 of two panels, and is fixedly arranged on respectively on embedded hard silk screen 12;
Fixed hard silk screen component, including transverse direction, be positioned apart from the fixed hard silk screen of two panels in shell 11
14, fixed hard silk screen 14 is located between two panels filter wire piece of cloth 13;
Filtrating chip, it is horizontally set in shell 11, and between the fixed hard silk screen 14 of two panels;
Waist-drum-shaped nasal obstruction 15, including connection lamellar body 151 and two noses of the face convex stretching by connection lamellar body 151
Fill in main body 152, one end that waist-drum-shaped nasal obstruction 15 is embedded at the inner chambers of shell 11 through connecting lamellar body 151, and have a stuffy nose main body 152 with it is outer
The intracavity inter-connection of shell 11.
Preferably, internal chamber wall of the both ends of embedded hard silk screen 12 respectively removably with shell 11 is connected.Filter wire
Internal chamber wall of the both ends of piece of cloth 13 respectively with shell 11 connects, and its one side is fixedly connected with embedded hard silk screen 12, and its is another
Simultaneously it is erected on the boss protruded out by the internal chamber wall of shell 11.The both ends of fixed hard silk screen 14 are fixedly arranged on shell respectively
On 11 internal chamber wall.The both ends of filtrating chip are fixedly arranged on the internal chamber wall of shell 11 respectively.
In the present invention, foregoing filtration chip can be prepared using MEMS (making technology of MEMS), therefore
MEMS filtrating chips can also be named as.
Refer to shown in Fig. 2-Fig. 3, in one embodiment of the invention (being named as first embodiment), a kind of filtrating chip
Including matrix 101, described matrix 101 have mutually back to first surface 1011 and second surface 1012, and in described matrix 101
Some through holes 102 as fluid passage are distributed with, the first surface is provided with multiple crossbeams 103 (can be named as lug boss)
Parallel arrangement formed array, wherein have more crossbeams 103 directly from through hole 102 across and there are more crossbeams 103 to be distributed
In the both sides of through hole 102, wherein, each top of crossbeam 103, which further averages, is furnished with hat-shaped structure 104 (abbreviation cap layers), and each cap layers are also with each
Crossbeam transversely continuously extends, and forms the array of hat-shaped structure, and pending air can not bypass foregoing hat-shaped structure
Array and be directly entered the through hole 102.
Wherein, by adjusting the spacing between foregoing each hat-shaped structure, you can forming the opening portion with selected size (can
To be referred to as fluid channel), realize and processing is purged to the particle of different-grain diameter scope in air, particularly, when by these hats
The spacing of structure is controlled in nanoscale, can remove the atomic small particle (nano level particle) in air.
Foregoing crossbeam can be strip, and have larger width and thickness so that these crossbeams can have higher machinery
Intensity, it is set to form preferable support to hat layer, and the spacing of each crossbeam can be with larger, to provide larger air flux.
Foregoing cap layers can also have larger thickness, and its both sides reaches the spacing of adjacent cap layers along epitaxial lateral overgrowth
To very little, such as can be with as little as 1nm, therefore can retain and mix in the minimum particle in pending air.
Foregoing cap layers can be wholely set with lug boss, for example, can by evaporate, deposit, grow etc. it is (typical such as gold
Category sputtering, MOCVD, PECVD, electrochemical deposition etc.) technology is formed directly into the lug boss top, and the hat-shaped structure
Also transversely can continuously extend with the lug boss, so that forming the opening transversely continuously extended between adjacent hat-shaped structure
Portion, it on the one hand can so ensure, to mixing in the processing of the selected particle in pending air, also also to keep very high and lead to
Amount, and difficulty of processing is reduced, save cost.
The material of foregoing cap layers can be selected from insulating dielectric materials such as silica, silicon nitride aluminum oxide, boron-phosphorosilicate glass etc.,
Or semi-conducting material such as Si, ZnO, GaN, TiO2, InN etc., or metal material such as Ag, Au, Al, Ni, Cr, Ti etc., it is but unlimited
In this.
Wherein, described matrix 101 can have larger thickness, it is formed preferably foregoing micro-/ nano chip arrays
Support, while the mechanical strength of the filtrating chip can be increased further, make the filtrating chip is pressure-resistant, resistant to bending, resistance to touch
Hit, impact resistance, and then it is applied and will not be damaged in a variety of environment, such as can apply to empty to high pressure, high speed
Gas is handled, and this function is that existing perforated membrane etc. can not be reached.
Wherein, the material selection range of the filtrating chip each several part (101,102,103,104) is various, Ke Yishi
Inorganic material or organic material, such as metal, non-metal inorganic material, plastics, ceramics, semiconductor, glass, polymerization
Thing etc..When these parts all select to use inorganic material, the filtrating chip also has the characteristic of resistance to temperature change, can locate
Manage high temperature and Cryogenic air.
Using previous designs filtrating chip can (ultrasound) cleaning, be used for multiple times, and remain at good air
Reason ability.
When being handled using described filtrating chip air, air (air flow such as Fig. 3 containing impurity particle
In with dotted line arrow shown in) state the array of hat-shaped structure before entry when, wherein particle diameter be more than certain numerical value particle (or
Water droplet in some drops incompatible with air, such as water droplet or oil in air) it is blocked in the battle array of foregoing hat-shaped structure
Outside row, opening portion of the air between each hat-shaped structure enters back into through hole 102 after reaching the porch of through hole 102 afterwards,
Realize the purification to air and/or the enriching and recovering to required particle (drop).
In some concrete application schemes of the embodiment, the gap of foregoing each cap layers can be 1nm~50 μm, cap layers
Height can be 50nm~200 μm.
In some concrete application schemes of the embodiment, the aperture of aforementioned through-hole can be 1 μm~1mm, aforementioned substrates
Thickness can be with>1μm.
In some concrete application schemes of the embodiment, foregoing horizontal depth of beam can be 0.1 μm~400 μm, width
Can be 0.1um~100 μm, the spacing of each crossbeam can be 0.1 μm~100 μm.
The longitudinal cross-section of opening portion before being formed at adjacent hat layer and adjacent beams can be rule or irregular shape
Shape, such as can be trapezoidal, polygon (triangle, quadrangle or other), circle, ellipse, star etc..
Foregoing crossbeam and hat layer can regular or irregular, uniform or the first table heterogeneous for being distributed in described matrix
On face.
In addition, in this first embodiment, the shape of aforementioned through-hole 102 can be various, such as can be circular, just
Square, rectangle or other shapes.
In some other embodiment of the application, a kind of filtrating chip can have and any one phase in previous embodiment
As structure, difference is:Layers of photo-catalytic material is also provided with crossbeam, hat layer and matrix surface.With comprising
When the filtrating chip of layers of photo-catalytic material is handled air, if being aided with ultraviolet lighting etc., can also have to some in air
Organic pollutants etc. carry out photocatalytic degradation, realize the multiple purifying to air.
Wherein, for the benefit of light penetrates, in the hat layer, crossbeam and matrix partly or entirely can be by transparent material
It is made.In some specific embodiments of the present embodiment, the hat layer, crossbeam can be integrally made of clear material, example
As light is injected.
Wherein, more typical catalysis material can be titanium dioxide etc., but not limited to this.
Wherein, to form the layers of photo-catalytic material, those skilled in the art can use various ways known to industry,
Such as (spin coating, spraying, printing etc.) is coated with, is physically or chemically vapor-deposited (such as MOCVD, PECVD, ald), splashes
Penetrate etc., and not limited to this.
Wherein, the thickness of the layers of photo-catalytic material can be controlled in nanoscale, to reduce it to the filtering as far as possible
The influence of the air flux of chip.
The structure of matrix, hat layer, crossbeam, through hole employed in the embodiment etc., set form, material etc. can with it is preceding
Text is addressed same or similar, so here is omitted.
In some other embodiment of the application, a kind of filtrating chip can have and any one phase in previous embodiment
As structure, difference is:Anti-biotic material layer is also provided with crossbeam, hat layer and matrix surface.With comprising anti-
When the filtrating chip of bacterium material layer is handled air, can synchronously it be killed thin in air in the processing procedure of air
Bacterium, virus etc., realize the multiple purifying to air.
Wherein, more typical anti-biotic material can be noble metals such as Au, Ag etc., but not limited to this.
Wherein, to form the anti-biotic material layer, those skilled in the art can use various ways, example known to industry
Such as it is coated with (spin coating, spraying, printing), is physically or chemically vapor-deposited (such as MOCVD, PECVD, ald), sputtering
Etc., and not limited to this.
Wherein, the thickness of the anti-biotic material layer can be controlled in nanoscale, to reduce it to the filtration core as far as possible
The influence of the air flux of piece.
The structure of matrix, hat layer, crossbeam, through hole employed in the embodiment etc., set form, material etc. can with it is preceding
Text is addressed same or similar, so here is omitted.
The filtrating chip of the application can prepare by physics, chemical method, such as can be chemically grown method, thing
Manage processing method etc., particularly MEMS (MEMS, Microelectromechanical Systems) method etc..
In other embodiments of the application, a kind of preparation technology of filtrating chip may include steps of:
S1:Substrate (such as silicon chip) is provided;
S2:Make the lines of micro-nano-scale by lithography on a side surface (being named as first surface) for substrate, that is, form figure
The photoresist mask of shape;
S3:Go out micro-nano meter ruler in the first surface etching (RIE, ICP, wet etching, electrochemical corrosion etc.) of the substrate
More crossbeams of degree, remove the photoresist mask afterwards;
S4:The substrate and first surface mutually back to another side surface (being named as second surface) on photoetching is set
Glue etching mask;
S5:Another side surface of the substrate is performed etching, until being formed in another side surface of the substrate
Through hole as fluid passage;
S6:Photoresist etching mask is removed, is deposited or deposits or grow on the surface for having crossbeam side for having substrate afterwards
Cap layer structure.The phenomenon extended laterally be present during evaporation or deposition or growth technique, cap layers gap can be made with thickness
Increase and reduce, minimum can reach several nanometers.
S7:Scribing, encapsulation, filtrating chip is made (step is not shown in figure).
The lithographic method used in These steps can also be photoetching, Mechanical lithography, dry etching, wet etching etc..
For example, in abovementioned steps, forming the method for patterned photoresist mask includes:Photoetching technique, nanometer bead
Mask technique, nanometer (metal) particle mask technology etc., and not limited to this.
Obviously, the preparation technology of filtrating chip is simple controllable in the first embodiment, is adapted to mass to give birth on a large scale
Production, and obtained filtrating chip at least has the following advantages that:(1) flux is big, and flow resistance is small;(2) physical filtering, it can effectively remove and be more than
The particle in nanometer gap;(3) great-leap-forward crossbeam and larger substrate thickness, it is ensured that high mechanical properties;(5) can (ultrasound)
Cleaning, is used for multiple times.
Refer to shown in Fig. 5, in the second embodiment of the application, a kind of filtrating chip includes matrix 201, described matrix
201 have mutually back to first surface 2011 and second surface 2012, and be distributed with some in described matrix 201 as fluids and lead to
The through hole 204 in road.More crossbeams 203 of parallel arrangement are provided with the first surface 2011, the crossbeam 203 is described
Transversely continuous extension on one surface, some crossbeams 203 therein are from the through hole 204 continuously across therefore can also be by
It is considered as great-leap-forward crossbeam 203.It is distributed with more nano wires 202 on any of which crossbeam 203, the one of the more nano wires 202
End is both secured to any surface of crossbeam 203, and the other end extends obliquely out along the direction for being gradually distance from any crossbeam 203 (also may be used
It is considered to extend laterally), and the more nano wires 202 with being distributed on another crossbeam adjacent to any crossbeam 203 are mutual
Intersect, so as to form the loose structure 205.Referring to Fig. 5, the loose structure 205 using the view of vertical view as
Cover the network of the through hole 204.The diameter of the Hole of loose structure 205 is more than 0 but is less than and mixes in pending
Fluid in selected particle particle diameter.And refer to Fig. 5-Fig. 6, it can be seen that the more nano wires 102 intersect to form more
The first surface 2011 of pore structure 205 and described matrix 201 cooperatively forms another fluid passage so that pending fluid 206
It is only capable of entering the through hole 204 by another fluid passage.
Wherein, because foregoing nano wire has larger ratio of height to diameter (or draw ratio) so that these nano wires can intensive row
The first surface of described matrix is distributed in, by adjusting the density of spacing and these nano wires between foregoing crossbeam, length, prolonging
Stretch direction etc., you can the particle of different-grain diameter scope is purged processing in convection body, and particularly, what it is when use is nano wire
When, by the hole pore size control that forms these nanowire crossbars in nanoscale, can not only remove atomic small in fluid
Particle, and because nano wire diameter itself is minimum, it is controlled in very low level, and shape for the resistance of fluid
Into very big fluid flux, far superior to existing perforated membrane, filtrating chip based on transverse flow channels etc..
Wherein, if with reference to known to industry scheme, the arrangement mode of foregoing nano wire is carried out to certain design, may be used also
Be allowed to form super-drainage structure, superoleophobic structure, can not only remove the particle in fluid, and can also by automatic cleaning action,
The particle for making to be blocked can not gather in the functional area (nano-wire array surface) of the filtrating chip, avoid the filtration core
Piece fails after long-term use.
Wherein, the crossbeam 203 can on the first surface 2011 of described matrix 201 with suitable Density Distribution, with
Make the filtrating chip that there is fluid processing flux as high as possible.And the crossbeam 203 can have suitable width, with
The crossbeam 203 is set also to avoid causing excessively the flux of the filtrating chip while with enough mechanical strengths
Influence.For example, the horizontal depth of beam can be 0.1 μm~100 μm, width can be 0.1 μm~400 μm, between crossbeam
Spacing can be 0.1 μm~100 μm.
Wherein, described matrix 201 can make with larger thickness and the crossbeam 203 with larger height
It forms preferable support to foregoing nano-wire array, while the mechanical strength of the filtrating chip can be increased further, and makes
The filtrating chip is pressure-resistant, resistant to bending, impact resistant, impact resistance, and then it is applied and will not be damaged in a variety of environment,
Such as can apply to handle high pressure, high-velocity fluid, this function is that existing perforated membrane etc. can not be reached.
Wherein, the material selection range of the filtrating chip each several part (201,202,203) is various, can be inorganic
Material or organic material.When these parts all select to use inorganic material, the filtrating chip also has resistance to temperature
The characteristic of change, high temperature and cryogen can be handled.
Using previous designs described filtrating chip can (ultrasound) cleaning, be used for multiple times, and remain on good
Fluid handling abilities.
When being handled using described filtrating chip convection body, the fluid containing impurity particle is stated porous before entry
During structure 205, wherein particle diameter is more than particle (or some drops incompatible with fluid, such as the water in air of certain numerical value
Water droplet in drop or oil) it is blocked in outside previous porous structure 205, gap of the fluid between each nano wire reaches afterwards
Through hole 204 is entered back into behind the porch of through hole 204, realizes the purification of convection body and/or the enrichment to required particle (drop)
Recovery.
Referring to shown in Fig. 5, in some concrete application schemes of the embodiment, the diameter of foregoing nano wire 202
Can be 1nm~50 μm with spacing, long 6 degree (height) can be 50nm~200 μm.The aperture of the through hole 104 can be 1 μm
~1mm.The thickness of described matrix can be more than 1 μm.
The lateral cross section structure of foregoing nano wire can be rule or irregular shape, such as can be polygon (three
Angular, quadrangle is other), circular, ellipse, star etc..
Foregoing nano wire 202 can regular or irregular, uniform or the first table heterogeneous for being distributed in described matrix 201
On face.
The array formed by these nano wires 202 can have super-drainage structure, and then the filtrating chip is had certainly
Cleaning function.
Foregoing nano wire 202 can preferably be selected from carbon nanocoils, CNT, ZnO nano-wire, GaN nano wire, TiO2Receive
Rice noodles, Ag nano wires, Au nano wires etc., and not limited to this.
Foregoing nano wire 202 can pass through external world's transfer, growth in situ (such as chemically grown, electrochemical growth) or deposition
Modes such as (such as physics, chemical vapor depositions, electro-deposition) is fixed on described matrix surface or in described matrix superficial growth
Formed.
The shape shape of lateral cross section (particularly) of aforementioned through-hole 204 can be various, such as can be circular, just
Square, rectangle, rhombus, polygon or Else Rule or irregular shape.
In some concrete application schemes of the embodiment, the nano wire 202 can be by catalysis material or with anti-
Bacterium, the material of sterilizing function are formed, or, the nano wire 202 can also be surface covered with catalysis material or with killing
The coating that bacterium, the material of antibacterial functions are formed.
For example, the nano wire 202 can use ZnO nano-wire, GaN nano wire, TiO2 nano wires etc. with light-catalysed
The nano wire of property, under light auxiliary irradiation, the organic matter in the fluid that can degrade.
For example, the nano wire 202 can use Ag nano wires, Au nano wires etc., with kill the bacterium in fluid, virus,
Microorganism.
In some concrete application schemes of the embodiment, light is additionally provided with the first surface 2011 of described matrix 201
Cati material or anti-biotic material layer etc..
When being handled with the filtrating chip convection body comprising layers of photo-catalytic material, if being aided with ultraviolet lighting etc., may be used also
Some organic pollutions in convection body etc. carry out photocatalytic degradation, realize the multiple purifying of convection body.
Wherein, for the benefit of light penetrates, in described matrix, lug boss, nano wire partly or entirely can be by transparent material
Material is made.
Wherein, more typical catalysis material can be titanium dioxide etc., but not limited to this.
Wherein, to form the layers of photo-catalytic material, those skilled in the art can use various ways known to industry,
Such as (spin coating, spraying, printing etc.) is coated with, is physically or chemically vapor-deposited (such as MOCVD, PECVD, ald), splashes
Penetrate etc., and not limited to this.
Wherein, the thickness of the layers of photo-catalytic material can be controlled in nanoscale, to reduce it to the filtering as far as possible
The influence of the fluid flux of chip.
And when being handled with the filtrating chip convection body comprising anti-biotic material layer, can be in the processing procedure of fluid
In, bacterium in fluid, virus etc. are synchronously killed, realizes the multiple purifying of convection body.
Wherein, more typical anti-biotic material can be noble metals such as Au, Ag etc., but not limited to this.
Wherein, to form the anti-biotic material layer, those skilled in the art can use various ways, example known to industry
Such as it is coated with (spin coating, spraying, printing), is physically or chemically vapor-deposited (such as MOCVD, PECVD, ald), sputtering
Etc., and not limited to this.
Wherein, the thickness of the anti-biotic material layer can be controlled in nanoscale, to reduce it to the filtration core as far as possible
The influence of the fluid flux of piece.
The filtrating chip of the application can prepare by physics, chemical method, such as can be chemically grown method, thing
Manage processing method etc., particularly MEMS (MEMS, Microelectromechanical Systems) method etc..
For example, referring to shown in Fig. 7, in this embodiment, a kind of preparation technology of filtrating chip can include following step
Suddenly:
S1:The Seed Layer for nanowire growth is deposited on the first surface of substrate (such as silicon chip).
S2:Patterned photoresist mask is set in the Seed Layer, and it includes the lines for making micro-nano-scale by lithography.
S3:The first surface of the substrate is performed etching using the photoresist mask, so as to the of the substrate
One surface forms the beam structure for more micro-nano-scales being intervally installed, and removes the photoresist mask afterwards.
S4:The patterned etching mask for setting photoresist to be formed on the second surface of the substrate.
S5:The second surface of the substrate is performed etching, and is etched to the crossbeam bottom, so as in the substrate
Second surface forms the slotted eye as fluid passage, and removes photoresist.
S6:Nano wire is grown on the seed layer, controls the growth conditions of nano wire, nano wire is had certain lateral growth
Ratio, and form the intersection grid of micro-nano-scale.
S7:Scribing, encapsulation, filtrating chip is made.
The lithographic method used in These steps can be photoetching, Mechanical lithography, dry etching, wet etching etc..
For example, in abovementioned steps, forming the method for the photoresist mask of graphical (nano graph) includes:Photoetching skill
Art, nanometer bead mask technique, nanometer (metal) particle mask technology etc., and not limited to this.
For example, in abovementioned steps, can be rotten by mode known to industry, such as RIE, ICP, wet etching, electrochemistry
Erosion etc. etches crossbeam 203, through hole 204 etc..
Obviously, the preparation technology of the application filtrating chip is simple controllable, is adapted to mass large-scale production.
Refer to shown in Fig. 8 and Figure 11 a- Figure 11 b, in the 3rd embodiment of the application, a kind of filtrating chip includes base
Body 301, described matrix 301 has first surface 301a, and (dotted line encloses in figure for the first area 3011 of described matrix 301
Region) some through holes 304 as fluid passage are distributed with, more vertical micro-/ nano line/pipes are provided with the first surface
The array that 303 (that is, any of micron-sized line, micron-sized pipe, nano wire, nanotube or a variety of combinations) are formed,
It is distributed in more micro-/ nano line/pipes 303 that the through hole 304 in the second area 3012 of first area 3011 is distributed
Top be also associated with flow impedance portion 302, the flow impedance portion 302 is arranged above the fluid intake of the through hole 304,
Pending fluid can not be bypassed foregoing micro-/ nano line/pipe array and is directly entered the through hole 304, the fluid resistance
Stopper 302 has the second surface 302b being oppositely arranged with the first surface 3011.And the first surface 3011 its
Also can the vertical micro-/ nano line/pipe 303 of more of dense distribution in remaining region 3013 (the 3rd region can be named as).In fig. 8, band
The arrow for having dotted line shows the direct of travel of fluid.
Wherein, because foregoing micro-/ nano line/pipe has larger ratio of height to diameter (or draw ratio) so that these micro-/ nanos
Line/pipe can the densely arranged first surface in described matrix, by the spacing for adjusting these micro-/ nano line/pipes, you can convection body
The particle of middle different-grain diameter scope is purged processing, particularly, when use be nano wire/pipe when, by the way that these are received
Spacing control between rice noodles/pipe can not only remove the atomic small particle in fluid in nanoscale, and because nano wire/
Pipe diameter itself is minimum, it is controlled in very low level for the resistance of fluid, and forms very big fluid flux,
Far superior to existing perforated membrane, filtrating chip based on transverse flow channels etc..
Wherein, if with reference to known to industry scheme, foregoing micro-/ nano line/pipe array is carried out to certain design, may be used also
Be allowed to form super-drainage structure, superoleophobic structure, can not only remove the particle in fluid, and can also by automatic cleaning action,
The particle for making to be blocked can not gather in the functional area (micro-/ nano line/pipe array surface) of the filtrating chip, avoid described
Filtrating chip fails after long-term use.
Wherein, described matrix 301 can have larger thickness, it is formed preferably foregoing micro-/ nano line/pipe array
Support, while the mechanical strength of the filtrating chip can be increased further, makes the filtrating chip pressure-resistant, resistant to bending, resistance to
Collision, impact resistance, and then it is applied and will not be damaged in a variety of environment, such as can apply to high pressure, high speed
Fluid is handled, and this function is that existing perforated membrane etc. can not be reached.
Wherein, the flow impedance portion can be that sheet, its thickness etc. can adjust according to practical application request.
Wherein, the material selection range of the filtrating chip each several part (301,302,303,304) is various, Ke Yishi
Inorganic material or organic material, such as metal, non-metal inorganic material, plastics, ceramics, semiconductor, glass, polymerization
Thing etc..When these parts all select to use inorganic material, the filtrating chip also has the characteristic of resistance to temperature change, can locate
Manage high temperature and cryogen.
Using previous designs described filtrating chip can (ultrasound) cleaning, be used for multiple times, and remain on good
Fluid handling abilities.
When being handled using described filtrating chip convection body, the fluid containing impurity particle state before entry it is micro-/
During the array that nano wire 303 forms, wherein particle diameter is more than particle (or some drops incompatible with fluid, the example of certain numerical value
Such as the water droplet in the water droplet or oil in air) be blocked in outside foregoing micro-/ nano line/pipe array, afterwards fluid via it is each it is micro-/
Gap between nano wire/pipe enters back into through hole 304 after reaching the porch of through hole 304, realize convection body purification and/or
To the enriching and recovering of required particle (drop).
Referring to shown in Fig. 8, in some concrete application schemes of the fourth embodiment, foregoing micro-/ nano line
Diameter can be 1nm~50 μm, length (height) h1Can be that the distance between 50nm~200 μm, adjacent micro-/ nano line can be with
For 1nm~50 μm.The aperture w of the through hole 304 can be 1 μm~1mm.The thickness h of described matrix2Can be more than 1 μm.Institute
State the thickness h in flow impedance portion3It can be 0.5 μm~200 μm.
Referring to Fig. 9 a- Fig. 9 e, the lateral cross section structure of foregoing micro-/ nano line can be rule or irregular shape
, such as can be polygon (triangle, quadrangle or other), circle, ellipse, star etc..
Referring to Figure 10 a- Figure 10 c, foregoing micro-/ nano line can be regular or irregular, uniform or heterogeneous point
Cloth is on the first surface of described matrix.In some more specific application schemes, the average headway of adjacent micro-/ nano line exists
1nm~50 μm.
In addition, refer to Figure 11 a- Figure 11 c, in the fourth embodiment, aforementioned through-hole 304 and flow impedance portion 302
Shape (the particularly shape of lateral cross section) can be various, such as can be circular, square, rectangle or other shapes
Shape.
Refer to shown in Figure 12, more preferably, in the fourth embodiment of the application, a kind of filtrating chip includes matrix
401, described matrix 401 have first surface and with the first surface mutually back to and the 3rd surface, and in described matrix 401 divide
Some through holes 404 as fluid passage are furnished with, more vertical micro-/ nano line/pipes 403 are provided with the first surface and are formed
Array, be also associated with flow impedance portion 402, institute around the top of more micro-/ nano line/pipes 403 of the through hole 404 distribution
State flow impedance portion 402 to be arranged above the fluid intake of the through hole 404, pending fluid is not bypassed foregoing
Micro-/ nano line/pipe array and be directly entered the through hole 404.Also, around the through hole 404 also symmetrically or non-symmetrically
More than one, such as four supporters 405 are distributed with, can also increase to the flow impedance portion by the supporter 405
402 support, the more cooperation of firm stable between flow impedance portion and matrix is realized, and can be effectively to being distributed in fluid resistance
Micro-/ nano line/pipe array between stopper and matrix forms protection, avoids because flow impedance portion and/or matrix are by external force
After effect, the problems such as micro-/ nano line/pipe 403 caused by the extruding of foregoing micro-/ nano line/pipe array caves in, damaged.
Wherein, the supporter can be variform, such as can have rectangle, trapezoidal, step longitudinal cross-section
(longitudinal direction herein can be regarded as perpendicular to the direction of described matrix first surface) etc., and not limited to this.In second implementation
In some specific embodiments of example, the supporter can be to project upwards the boss to be formed from the edge part of through hole 404
Deng its upper end connection flow impedance portion 402.
Wherein, the quantity of the supporter, diameter, distribution density etc. can adjust according to being actually needed, but it is few to try one's best
Occupancy described matrix first surface space, avoid its fluid flux to the micro-/ nano line from causing big influence.
The structure of matrix, micro-/ nano line/pipe array, flow impedance portion, through hole employed in the second embodiment etc.,
Setting form, material etc. can with address above it is same or similar, so here is omitted.
Refer to shown in Figure 13, more preferably, in the 5th embodiment of the application, a kind of filtrating chip includes matrix
501, described matrix 501 have first surface and with the first surface mutually back to and the 3rd surface, and in described matrix 501 divide
Some through holes 504 as fluid passage are furnished with, more vertical micro-/ nano line/pipes 503 are provided with the first surface and are formed
Array, be also associated with flow impedance portion 502, institute around the top of more micro-/ nano line/pipes 503 of the through hole 504 distribution
State flow impedance portion 502 to be arranged above the fluid intake of the through hole 504, pending fluid is not bypassed foregoing
Micro-/ nano line/pipe array and be directly entered the through hole 504.Also, also being set up on the through hole 504 has more than one,
Such as the more support beams 505 symmetrically or non-symmetrically arranged, it can also increase to the flow impedance portion by the support beam 505
502 support, the more cooperation of firm stable between flow impedance portion and matrix is realized, and can be effectively to being distributed in fluid resistance
Micro-/ nano line/pipe array between stopper and matrix forms protection, avoids because flow impedance portion and/or matrix are by external force
After effect, the problems such as micro-/ nano line/pipe 503 caused by the extruding of foregoing micro-/ nano line/pipe array caves in, damaged.
Wherein, the support beam can be variform, such as can be with arch-shaped etc., and not limited to this.And further
, the support beam can also coordinate with other supporters, such as the supporter addressed in the 5th embodiment coordinates.
Wherein, the quantity of the support beam, size, distribution density etc. can adjust according to being actually needed, but it is few to try one's best
The fluid intake for blocking the through hole, avoid its fluid flux to the filtrating chip from causing big influence.
The structure of matrix, micro-/ nano line/pipe array, flow impedance portion, through hole employed in the sixth embodiment etc.,
Setting form, material etc. can with address above it is same or similar, so here is omitted.
Refer to shown in Figure 14, more preferably, in the sixth embodiment of the application, a kind of filtrating chip includes matrix
601, described matrix 601 have first surface 6011 and with the first surface mutually back to the 3rd surface 6012, and described matrix
Some through holes 604 as fluid passage are distributed with 601, the more vertical shapes of nano-pillar 603 are provided with the first surface
Into array, be also associated with flow impedance portion 602, the stream around the top of more nano-pillars 603 of the through hole 604 distribution
Body stop part 602 is arranged above the fluid intake of the through hole 604, pending fluid can not be bypassed foregoing nano-pillar
Array and be directly entered the through hole 604.Also, on the first surface of the surface of nano-pillar 603 and described matrix 601 also
It is provided with layers of photo-catalytic material 605.When being handled with the filtrating chip convection body comprising layers of photo-catalytic material 605, if auxiliary
With ultraviolet lighting etc., some organic pollutions that can also be in convection body etc. carry out photocatalytic degradation, realize the multiple net of convection body
Change.
Wherein, for the benefit of light penetrates, in the flow impedance portion, matrix, lug boss partly or entirely can be by saturating
Bright material is made.In some specific embodiments of the present embodiment, the flow impedance portion can be integrally by transparent material system
Into, such as light injection.
Wherein, more typical catalysis material can be titanium dioxide etc., but not limited to this.
Wherein, to form the layers of photo-catalytic material 605, those skilled in the art can use a variety of sides known to industry
Formula, for example, coating (spin coating, spraying, printing etc.), physically or chemically vapour deposition (such as MOCVD, PECVD, ald),
Sputtering etc., and not limited to this.
Wherein, the thickness of the layers of photo-catalytic material 605 can be controlled in nanoscale, to reduce it to the mistake as far as possible
The influence of the fluid flux of filter element slice.
The structure of matrix, micro-/ nano line/pipe array, flow impedance portion, through hole employed in the fourth embodiment etc.,
Setting form, material etc. can with address above it is same or similar, so here is omitted.
Refer to shown in Figure 15, more preferably, in the 7th embodiment of the application, a kind of filtrating chip includes matrix
701, described matrix 701 have first surface 7011 and with the first surface mutually back to the face of the 3rd table 7012, and described matrix
Some through holes 704 as fluid passage are distributed with 701, the more vertical shapes of nano-pillar 703 are provided with the first surface
Into array, be also associated with flow impedance portion 702, the stream around the top of more nano-pillars 703 of the through hole 704 distribution
Body stop part 702 is arranged above the fluid intake of the through hole 704, pending fluid can not be bypassed foregoing nano-pillar
Array and be directly entered the through hole 704.Also, on the first surface of the surface of nano-pillar 703 and described matrix 701 also
It is provided with anti-biotic material layer 705.When being handled with the filtrating chip convection body comprising anti-biotic material layer 705, can flow
In the processing procedure of body, bacterium in fluid, virus etc. are synchronously killed, realizes the multiple purifying of convection body.
Wherein, more typical anti-biotic material can be noble metals such as Au, Ag etc., but not limited to this.
Wherein, to form the anti-biotic material layer 705, those skilled in the art can use a variety of sides known to industry
Formula, for example, coating (spin coating, spraying, printing etc.), physically or chemically vapour deposition (such as MOCVD, PECVD, ald),
Sputtering etc., and not limited to this.
Wherein, the thickness of the anti-biotic material layer 705 can be controlled in nanoscale, to reduce it to the filtering as far as possible
The influence of the fluid flux of chip.
The structure of matrix, micro-/ nano line/pipe array, flow impedance portion, through hole employed in 5th embodiment etc.,
Setting form, material etc. can with address above it is same or similar, so here is omitted.
The filtrating chip of the application can prepare by physics, chemical method, such as can be chemically grown method, thing
Manage processing method etc., particularly MEMS (MEMS, Microelectromechanical Systems) method etc..
For example, refer to shown in Figure 16, in the 8th embodiment of the application, a kind of preparation technology of filtrating chip can be with
Comprise the following steps:
S1:(it is defined as setting patterned photoresist to cover on first surface a) in a side surface of substrate (such as silicon chip)
Mould;
S2:The first surface of the substrate is performed etching, is spaced so as to be formed in the first surface of the substrate
The more vertical nano-wires set, remove the first photoresist mask afterwards;
S3:Soluble or corrodible organic matter and/or inorganic matter are coated with the first surface of the substrate, and is made organic
Gap between thing and/or inorganics filled each vertical nano-wire, form sacrifice layer;
S4:Photoresist is set on the sacrifice layer, and carries out photoetching;
S5:The sacrifice layer is performed etching, makes to be distributed in more in the second area of the first surface of the substrate
Exposed at the top of vertical nano-wire, remove photoresist afterwards;
S6:The substrate first surface set photoresist mask, and make it is on the substrate first surface, with it is described
The corresponding region in flow impedance portion exposes;
S7:Deposition forms flow impedance portion in region expose, corresponding with the flow impedance portion;
S8:Peel off and remove photoresist;
S9:Patterned etching mask is set on the second surface of the substrate;
S10:To the substrate and first surface mutually back to another side surface (be defined as the 3rd surface b) to carve
Erosion, until exposing the expendable material being filled between neighboring vertical nano wire, so as to form groove on the 3rd surface of the substrate
Hole, the slotted eye position is corresponding with the first area of the first surface of the substrate, the first surface of the substrate
Second area is set around the first area;
S11:The etching mask and the expendable material being filled between each vertical nano-wire are removed, filtrating chip is made.
The lithographic method used in These steps can be photoetching, Mechanical lithography, dry etching, wet etching etc..
For example, in abovementioned steps S1, forming the method for the photoresist mask of graphical (nano graph) includes:Photoetching skill
Art, nanometer bead mask technique, nanometer (metal) particle mask technology etc., and not limited to this.
For example, in abovementioned steps S2, mode known to industry, such as RIE, ICP, wet etching, electrochemistry can be passed through
Corrosion etc. etches vertical nanowires linear array.
For example, in abovementioned steps S3, the dissolved organic matter of filling can be photoresist etc. or corrodible inorganic matter such as
Metal, SiO2, silicon nitride etc..
For example, in abovementioned steps S10, mode known to industry, such as RIE, ICP, wet etching, electrochemistry can be passed through
Corrosion etc. etches the slotted eye.
Obviously, the preparation technology of the application filtrating chip is simple controllable, is adapted to mass large-scale production.
Refer to shown in Figure 17, in the 9th embodiment of the application, a kind of preparation technology of filtrating chip can include
Following steps:
S1:The more vertical nano wire/pipes to be formed and be intervally installed are grown in the first surface of substrate (such as silicon chip);
S2:Soluble or corrodible organic matter and/or inorganic matter are coated with the first surface of the substrate, and is made organic
Gap between thing and/or inorganics filled each vertical nano wire/pipe, forms sacrifice layer;
S3:Photoresist is set on the sacrifice layer, and carries out photoetching;
S4:The sacrifice layer is performed etching, makes to be distributed in more in the second area of the first surface of the substrate
Exposed at the top of vertical nano wire, remove photoresist afterwards;
S5:The substrate first surface set photoresist mask, and make it is on the substrate first surface, with it is described
The corresponding region in flow impedance portion exposes;
S6:Deposition forms flow impedance portion in region expose, corresponding with the flow impedance portion;
S7:Peel off and remove photoresist;
S8:The substrate and first surface mutually back to the 3rd surface on patterned etching mask is set;
S9:3rd surface of the substrate is performed etching, until expose be filled in it is sacrificial between neighboring vertical nano wire
Domestic animal material, so as to form slotted eye, the slotted eye position and the first surface of the substrate on the 3rd surface of the substrate
First area it is corresponding, the second area of the first surface of the substrate is set around the first area;
S10:The etching mask and the expendable material being filled between each vertical nano-wire are removed, filtrating chip is made.
To form the mode of vertical nano wire/pipe to grow in abovementioned steps and can be selected from MOCVD, PECVD, electrochemistry and sink
The various ways known to industry such as product.
The lithographic method used in These steps can be photoetching, Mechanical lithography, dry etching, wet etching etc..
For example, the method for the photoresist mask of graphical (nano graph) is formed in abovementioned steps to be included:Photoetching technique, receive
Nano-sphere mask technique, nanometer (metal) particle mask technology etc., and not limited to this.
For example, mode known to industry, such as RIE, ICP, wet etching, electrochemical corrosion can be passed through in abovementioned steps
Performed etching Deng to substrate.
For example, in abovementioned steps, the dissolved organic matter of filling can be photoresist etc. or corrodible inorganic matter such as gold
Category, SiO2, SiN etc..
Refer to shown in Figure 18, in the tenth embodiment of the application, a kind of filtrating chip includes matrix 801, the base
Body 801 have mutually back to first surface 18011 and second surface 8012, and the first area 8013 in described matrix 801 is divided
Some through holes 804 as fluid passage are furnished with, the second area 8014 of the first surface is provided with multiple micro-/ nano pieces
The array that 803 (micron film and/or nanometer sheet) parallel arrangements are formed, around more micro-/ nano pieces of the through hole 804 distribution
The regional area at 803 top is connected with flow impedance portion 802, and the flow impedance portion 802 is arranged at the stream of the through hole 804
Body entrance top, pending fluid can not be bypassed foregoing micro-/ nano chip arrays and is directly entered the through hole 804.
Wherein, because foregoing micro-/ nano piece micro-/ nano piece has relatively thin thickness so that these micro-/ nano piece micro-/ nanos
Piece can the densely arranged first surface in described matrix, by the spacing for adjusting these micro-/ nano pieces, you can formed have it is selected
The groove (being properly termed as fluid channel) of the opening portion of size, realize that the particle of different-grain diameter scope in convection body is purged place
Reason, particularly, when use be nanometer sheet when, by the way that the spacing control between these nanometer sheets in nanoscale, not only may be used
To remove the atomic small particle in fluid, and because nanometer sheet its thickness is minimum, it can also make its resistance quilt for fluid
Control forms very big fluid flux (when particularly nanometer sheet has higher height) in very low level, far superior to
Existing perforated membrane, filtrating chip based on transverse flow channels etc..
Wherein, described matrix 801 can have larger thickness, it is formed preferably foregoing micro-/ nano chip arrays
Support, while the mechanical strength of the filtrating chip can be increased further, make the filtrating chip is pressure-resistant, resistant to bending, resistance to touch
Hit, impact resistance, and then it is applied and will not be damaged in a variety of environment, such as can apply to high pressure, high velocity stream
Body is handled, and this function is that existing perforated membrane etc. can not be reached.
Wherein, the material selection range of the filtrating chip each several part (801,802,803,804) is various, Ke Yishi
Inorganic material or organic material, such as metal, non-metal inorganic material, plastics, ceramics, semiconductor, glass, polymerization
Thing etc..When these parts all select to use inorganic material, the filtrating chip also has the characteristic of resistance to temperature change, can locate
Manage high temperature and cryogen.
Wherein, the flow impedance portion can be that sheet, its thickness etc. can adjust according to practical application request.
Further, in the present embodiment, the more than one support of setting that can also be symmetrically or non-symmetrically around through hole
Body, it can also increase the support to the flow impedance portion by the supporter, realize between flow impedance portion and matrix more
The cooperation of firm stable, and protection effectively can be formed to the micro-/ nano chip arrays being distributed between flow impedance portion and matrix,
Avoid because flow impedance portion and/or matrix by external force after being acted on, micro- caused by the extruding of foregoing micro-/ nano chip arrays/
The problems such as nanometer sheet is caved in, damaged.
Wherein, the supporter can be variform, such as can have rectangle, trapezoidal, step tee section etc.,
And not limited to this.In some specific embodiments of the tenth embodiment, the supporter can be from the through hole edge
Portion projects upwards boss to be formed etc., and the connection flow impedance portion is shored in its upper end.
Wherein, the quantity of the supporter, diameter, distribution density etc. can adjust according to being actually needed, but it is few to try one's best
Occupancy described matrix first surface space, avoid its fluid flux to the micro-/ nano chip arrays from causing big influence.
Using previous designs filtrating chip can (ultrasound) cleaning, be used for multiple times, and remain at good fluid
Reason ability.
When being handled using described filtrating chip convection body, the fluid containing impurity particle state before entry it is micro-/
During nano-chip arrays, wherein particle diameter is more than particle (or some drops incompatible with fluid, such as in air of certain numerical value
Water droplet in water droplet or oil) it is blocked in outside foregoing micro-/ nano chip arrays, fluid is between each micro-/ nano piece afterwards
Groove enters back into through hole 104 after reaching the porch of through hole 104, realizes the purification of convection body and/or to required particle (liquid
Drop) enriching and recovering.
Referring to shown in Figure 18-Figure 19, in some concrete application schemes of the tenth embodiment, it is foregoing it is micro-/receive
The thickness of rice piece can be 1nm~50 μm, highly can be 50nm~200 μm, and the groove width between adjacent micro-/ nano piece can
Think 1nm~50 μm.The aperture of the through hole 804 can be 1 μm~1mm.The thickness of described matrix can be more than 1 μm.Institute
The thickness for stating flow impedance portion can be 0.5 μm~200 μm.
The section of groove before being formed at adjacent micro-/ nano piece can be rule or irregular shape, such as can be with
It is polygon (triangle, quadrangle or other), circle, ellipse, star etc..
Foregoing micro-/ nano piece can regular or irregular, the uniform or first surface heterogeneous for being distributed in described matrix
On.
In addition, in the tenth embodiment, shape (the particularly longitudinal direction or horizontal in aforementioned through-hole 804 and flow impedance portion 802
To the shape in section) can be various, such as can be circular, square, rectangle or other shapes.
Refer to shown in Figure 20, more preferably, in the 11st embodiment of the application, a kind of filtrating chip includes base
Body 901, described matrix 901 have mutually back to first surface and second surface, and some conducts are distributed with described matrix 901
The through hole 904 of fluid passage, it is provided with what the micro-/ nano piece 903 that multi-disc transversely continuously extends was formed on the first surface
Formed with the groove for being available for fluid to pass through between array, wherein micro-/ nano piece, the bore of the opening portion of the groove be more than 0 but
Less than mixing in the particle diameter of the selected particle in pending fluid, wherein, there are multiple micro-/ nano pieces directly from the through hole
By so that cooperatively forming the fluid passage connected with through hole 904 between these micro-/ nano pieces and matrix, and waiting to locate on 904
The fluid of reason is only capable of entering through hole 904 by the fluid passage.
Further, in this embodiment, can also be in connecting fluid stop part 902 on micro-/ nano chip arrays, the fluid
Stop part 902 is arranged above the fluid intake of the through hole 904, pending fluid can not be bypassed foregoing micro-/ nano
Chip arrays and be directly entered the through hole 904.
Further, one or several supporters are may also set up around through hole 904.
Matrix, micro-/ nano chip arrays, flow impedance portion, through hole, supporter employed in 11st embodiment etc.
Structure, setting form, material etc. can with address above it is same or similar, so here is omitted.
In the 11st embodiment of the application, the filtrating chip can have similar with first, second embodiment
Structure, difference are, more than one can be also set up on through hole, such as the more supports symmetrically or non-symmetrically arranged
Beam, it can also increase the support to the flow impedance portion by the support beam, realize between flow impedance portion and matrix more
The cooperation of firm stable, and protection effectively can be formed to the micro-/ nano chip arrays being distributed between flow impedance portion and matrix,
Avoid because flow impedance portion and/or matrix by external force after being acted on, micro- caused by the extruding of foregoing micro-/ nano linear array/
The problems such as nanometer sheet is caved in, damaged.
Wherein, the support beam can be variform, such as can be with arch-shaped etc., and not limited to this.And further
, the support beam can also coordinate with other supporters, such as the supporter addressed in second embodiment coordinates.
Wherein, the quantity of the support beam, size, distribution density etc. can adjust according to being actually needed, but it is few to try one's best
The fluid intake for blocking the through hole, avoid its fluid flux to the filtrating chip from causing big influence.
The structure of matrix, micro-/ nano linear array, flow impedance portion, through hole employed in 11st embodiment etc., set
Put form, material etc. can with address above it is same or similar, so here is omitted.
Refer to shown in Figure 21, in the 12nd embodiment of the application, a kind of filtrating chip can have with the tenth, the
The similar structure of any one in 11 embodiments, difference are:In the surface of nanometer sheet 1103 and the first table of matrix 1101
Layers of photo-catalytic material 1105 is additionally provided with face.Handled with the filtrating chip convection body comprising layers of photo-catalytic material 1105
When, if being aided with ultraviolet lighting etc., some organic pollutions that can also be in convection body etc. carry out photocatalytic degradation, realize convection body
Multiple purifying.
Wherein, for the benefit of light penetrates, and part or all of in the flow impedance portion 1102, matrix, lug boss can be with
It is made of clear material.In some specific embodiments of the present embodiment, the flow impedance portion can be integrally by transparent material
Material is made, such as light is injected.
Wherein, more typical catalysis material can be titanium dioxide etc., but not limited to this.
Wherein, to form the layers of photo-catalytic material 1105, those skilled in the art can use a variety of known to industry
Mode, such as it is coated with (spin coating, spraying, printing etc.), physically or chemically vapour deposition (such as MOCVD, PECVD, ald
Deng), sputtering etc., and not limited to this.
Wherein, the thickness of the layers of photo-catalytic material 1105 can be controlled in nanoscale, to reduce it to described as far as possible
The influence of the fluid flux of filtrating chip.
The structure of matrix, micro-/ nano linear array, flow impedance portion, through hole employed in 12nd embodiment etc., set
Put form, material etc. can with address above it is same or similar, so here is omitted.
Refer to shown in Figure 22, more preferably, in the 13rd embodiment of the application, a kind of filtrating chip can have
Have and be to any one similar structure in the ten, the 11st, the 12nd embodiment, difference:On the surface of nanometer sheet 1203
And anti-biotic material layer 1205 is additionally provided with the first surface of matrix 1201.To include the filtrating chip of anti-biotic material layer 1205
When convection body is handled, it can synchronously kill in fluid bacterium, virus etc. in the processing procedure of fluid, realize convection current
The multiple purifying of body.
Wherein, more typical anti-biotic material can be noble metals such as Au, Ag etc., but not limited to this.
Wherein, to form the anti-biotic material layer 1205, those skilled in the art can use a variety of sides known to industry
Formula, for example, coating (spin coating, spraying, printing etc.), physically or chemically vapour deposition (such as MOCVD, PECVD, ald),
Sputtering etc., and not limited to this.
Wherein, the thickness of the anti-biotic material layer 1205 can be controlled in nanoscale, to reduce it to the mistake as far as possible
The influence of the fluid flux of filter element slice.
The structure of matrix, micro-/ nano linear array, flow impedance portion, through hole employed in 13rd embodiment etc., set
Put form, material etc. can with address above it is same or similar, so here is omitted.
The filtrating chip of the application can prepare by physics, chemical method, such as can be chemically grown method, thing
Manage processing method etc., particularly MEMS (MEMS, Microelectromechanical Systems) method etc..
In the 14th embodiment of the application, a kind of preparation technology of filtrating chip may include steps of:
S1:Patterned photoresist is set to cover on a side surface (being named as first surface) for substrate (such as silicon chip)
Mould;
S2:The first surface of the substrate is performed etching, is spaced so as to be formed in the first surface of the substrate
The multiple vertical nanowires pieces extended transversely set, remove the first photoresist mask afterwards;
S3:Soluble or corrodible organic matter and/or inorganic matter are coated with the first surface of the substrate, and is made organic
Groove between thing and/or inorganics filled each vertical nanowires piece, form sacrifice layer;
S4:Photoresist is set on the sacrifice layer, and carries out photoetching;
S5:The sacrifice layer is performed etching, makes to be distributed in more in the second area of the first surface of the substrate
Exposed at the top of vertical nanowires piece, remove photoresist afterwards;
S6:The substrate first surface set photoresist mask, and make it is on the substrate first surface, with it is described
The corresponding region in flow impedance portion exposes;
S7:Deposition forms flow impedance portion in region expose, corresponding with the flow impedance portion, then peels off
Remove photoresist;
S8:The substrate and first surface mutually back to another side surface (being named as the 3rd surface) on figure is set
The etching mask of change, then another side surface of the substrate is performed etching, it is filled in neighboring vertical nanometer sheet until exposing
Between expendable material, so as to form slotted eye, the slotted eye position and the lining in another side surface of the substrate
The first area of the first surface at bottom is corresponding, and the second area of the first surface of the substrate is set around the first area
Put;
S9:The etching mask and the expendable material being filled between each vertical nanowires piece are removed, filtrating chip is made.
The lithographic method used in These steps can be photoetching, Mechanical lithography, dry etching, wet etching etc..
For example, in abovementioned steps S1, forming the method for the photoresist mask of graphical (nano graph) includes:Photoetching skill
Art, nanometer bead mask technique, nanometer (metal) particle mask technology etc., and not limited to this.
For example, in abovementioned steps S2, mode known to industry, such as RIE, ICP, wet etching, electrochemistry can be passed through
Corrosion etc. etches vertical nanowires chip arrays.
For example, in abovementioned steps S3, the dissolved organic matter of filling can be photoresist etc. or corrodible inorganic matter such as
Metal, SiO2, SiN etc..
For example, in abovementioned steps S8, mode known to industry, such as RIE, ICP, wet etching, electrochemistry can be passed through
Corrosion etc. etches the slotted eye.
Refer to shown in Figure 23, in the 15th embodiment of the application, a kind of filtrating chip is mainly to being contaminated with
The fluid of selected particle is handled, and it includes matrix 1300, described matrix 1300 have phase back to the He of first surface 1301
Second surface 1302, and some through holes 1303 as fluid passage are distributed with described matrix 1300.In any through hole 1303
Some micro-/ nano line/pipes 1400 (i.e. any of micro wire, micron tube, nano wire, nanotube or a variety of) are inside distributed with,
Especially nano wire/pipe (nano wire and/or nanotube).The through hole 1303 is fixed in the micro-/ nano line/one end of pipe 1400
Hole wall on, the other end radially extends along the through hole.These micro-/ nano line/pipes 2 are assembled in the form of cross one another to be turned into
Loose structure.The diameter of the loose structure inside aperture is more than 0 but less than the particle diameter of the selected particle.
Refer to Figure 24 again, the loose structure is using the view overlooked as the grid that is distributed in the through hole 1303
Structure.
Wherein, because foregoing micro-/ nano line/pipe 1400 has larger ratio of height to diameter (or draw ratio) so that this slightly/receive
Rice noodles/pipe 1400 can be densely arranged in the through hole, and by adjusting distribution density, the length of these micro-/ nano line/pipes 1400
Degree etc., you can the particle of different-grain diameter scope is purged processing in convection body 1500, and particularly, what it is when use is nanometer
During line/pipe, by the way that the hole pore size control that these nano wire/pipes intersect to form in nanoscale, can be not only removed in fluid
Atomic small particle, and because nano wire/pipe diameter itself is minimum, it can also be controlled in for the resistance of fluid very low
Level, and form very big fluid flux, far superior to existing perforated membrane, filtrating chip based on transverse flow channels etc..
Wherein, described matrix 1300 can have larger thickness, and nationality is to further enhance the machinery of the filtrating chip
Intensity, make the pressure-resistant filtrating chip, resistant to bending, impact resistant, impact resistance, so allow its in a variety of environment apply without
Damage is caused, such as can apply to handle high pressure, high-velocity fluid, this function is that existing perforated membrane etc. can not be reached
's.
Particularly, because described micro-/ nano line/pipe 1400 is distributed in the through hole 1303 so that these micro-/ nanos
Line/pipe 1400 is substantially subjected to the protection of matrix 1300, and then, even if the filtrating chip is under pressure, it will not also make this
Slightly/nano wire/pipe 1400 is damaged.
Wherein, the material selection range of the filtrating chip each several part (1301,1302,1303) is various, Ke Yishi
Inorganic material or organic material, such as can be metal, ceramics, polymer, etc..When these parts all select to make
During with inorganic material, the filtrating chip also has the characteristic of resistance to temperature change, can handle high temperature and cryogen.
Using previous designs filtrating chip can (ultrasound) cleaning, be used for multiple times, and remain at good fluid
Reason ability.
When being handled using described filtrating chip convection body, the fluid containing impurity particle is stated porous before entry
During structure, wherein particle diameter be more than certain numerical value particle (or some drops incompatible with fluid, for example, water droplet in air or
Water droplet in oil) it is blocked in outside previous porous structure, fluid flows out from through hole 1303 afterwards, realizes the purification of convection body
And/or the enriching and recovering to required particle (drop).
In some concrete application schemes of the embodiment, the diameter of foregoing micro-/ nano line/pipe 1400 can be 1nm~
500μm。
In some concrete application schemes of the embodiment, the aperture of aforementioned through-hole 1303 can be 1 μm~1mm.
In some concrete application schemes of the embodiment, the thickness of aforementioned substrates can be more than 1 μm.
The lateral cross section structure of foregoing nano wire can be rule or irregular shape, such as can be polygon (three
Angular, quadrangle is other), circular, ellipse, star etc..
Foregoing micro-/ nano line/pipe 1400 can be regular or irregular, uniform or heterogeneous be distributed in the through hole 1303
It is interior.
Foregoing micro-/ nano line/pipe 1400 can preferably be selected from carbon nanocoils, CNT, ZnO nano-wire, GaN nanometers
Line, TiO2Nano wire, Ag nano wires, Au nano wires etc., and not limited to this.
Foregoing micro-/ nano line/pipe 1400 can pass through external world's transfer, growth in situ (such as chemically grown, electrochemical student
It is long) or modes such as (such as physics, chemical vapor depositions, electro-deposition) is deposited in growth in situ shape on the inwall of through hole 1303
Into.
The shape shape of lateral cross section (particularly) of aforementioned through-hole 1303 can be various, for example, can be it is circular,
Square, rectangle, rhombus, polygon or Else Rule or irregular shape.
In some concrete application schemes of the embodiment, foregoing micro-/ nano line/pipe 1400 can by catalysis material or
Material with antibacterial, sterilizing function is formed, or, foregoing micro-/ nano line/pipe 1400 can also be surface covered with photocatalysis
Material or the coating with sterilization, the material formation of antibacterial functions.
For example, foregoing micro-/ nano line/pipe 1400 can use ZnO nano-wire, GaN nano wire, TiO2 nano wires etc. to have light
The nano wire of the property of catalysis, under light auxiliary irradiation, the organic matter in the fluid that can degrade.
For example, foregoing micro-/ nano line/pipe 1400 can use Ag nano wires, Au nano wires etc., it is thin in fluid to kill
Bacterium, virus, microorganism.
In some concrete application schemes of the embodiment, the surface of described matrix 1300, particularly its first surface
Layers of photo-catalytic material or anti-biotic material layer etc. are also provided with 1301.
When being handled with the filtrating chip convection body comprising layers of photo-catalytic material, if being aided with ultraviolet lighting etc., may be used also
Some organic pollutions in convection body etc. carry out photocatalytic degradation, realize the multiple purifying of convection body.
Wherein, for the benefit of light penetrates, and the members or whole in the filtrating chip can be by transparent materials
It is made.
Wherein, more typical catalysis material can be titanium dioxide etc., but not limited to this.
Wherein, to form the layers of photo-catalytic material, those skilled in the art can use various ways known to industry,
Such as (spin coating, spraying, printing etc.) is coated with, is physically or chemically vapor-deposited (such as MOCVD, PECVD, ald), splashes
Penetrate etc., and not limited to this.
Wherein, the thickness of the layers of photo-catalytic material can be controlled in nanoscale, to reduce it to the filtering as far as possible
The influence of the fluid flux of chip.
And when being handled with the filtrating chip convection body comprising anti-biotic material layer, can be in the processing procedure of fluid
In, bacterium in fluid, virus etc. are synchronously killed, realizes the multiple purifying of convection body.
Wherein, more typical anti-biotic material can be noble metals such as Au, Ag etc., but not limited to this.
Wherein, to form the anti-biotic material layer, those skilled in the art can use various ways, example known to industry
Such as it is coated with (spin coating, spraying, printing), is physically or chemically vapor-deposited (such as MOCVD, PECVD, ald), sputtering
Etc., and not limited to this.
Wherein, the thickness of the anti-biotic material layer can be controlled in nanoscale, to reduce it to the filtration core as far as possible
The influence of the fluid flux of piece.
One of preferred embodiment as the embodiment, it can also set and be spaced in the first surface of described matrix
More setting nano wires, these nano wires can surround as fluid passage aforementioned through-hole setting.
More preferable, these draw ratios for erectting nano wire are 4:1~200000:1, it is adjacent setting nano wire between
The ratio of distance and the length of the setting nano wire is 1:4~1:200000.
By using this structure and the setting nano wire of distributional pattern, multiple setting nano wires can be made intensive can to arrange
(proportion is few certainly in unit area for lug boss), is handled, while also assign beneficial to the molecule in convection body
The larger fluid flux of the filtrating chip (hole erect between nano wire is bigger than nano wire own vol is erect).
It is more preferable, the setting nano wire can have with the foregoing identical material of micro-/ nano line/pipe 1400, size,
Structure etc..
Particularly, if with reference to known to industry scheme, the carry out such as the arrangement density of foregoing setting nano wire is suitable
Design, is allowed to form nano-wire array, can also be allowed to form super-drainage structure, superoleophobic structure, can not only remove in fluid
Particle, and can also be by automatic cleaning action, the particle for making to be blocked can not gather on the filtrating chip surface.
Wherein, because described matrix can have larger thickness so that foregoing setting nano wire can obtain preferable support.
One of preferred embodiment as the embodiment, also on these foregoing setting nano wires fluid can be set to hinder
Stopper, the flow impedance portion can (it be the 3rd table that can name it with the surface that the first surface with described matrix is oppositely arranged
Face), and the complex root erects the first surface that nemutogen one end is fixedly installed on described matrix, the other end and the fluid
3rd surface of stop part is fixedly connected, wherein the distance between adjacent setting nemutogen is more than 0 but is less than the selected particle
Particle diameter.
Wherein, the flow impedance portion can be variform, such as can be sheet, shell shape, cuboid shape, more
Face body shape etc..
Preferably, these foregoing are erect and cooperatively form a fluid passage between nano wire, flow impedance portion and matrix, treat
The fluid of processing can only enter the fluid passage (through hole 1303) for the first surface for being distributed in described matrix via the fluid passage
Fluid intake, realize the first time processing of convection body, enter back into afterwards in the fluid passage being distributed on matrix, and by foregoing
The aggregation of micro-/ nano line/pipe 1400 carries out second and handled, and can so realize the multi task process of convection body.
Wherein, by carrying out certain design to these foregoing spacing for erectting nano wire, it is allowed to and foregoing micro-/ nano
The aperture for the hole that line/pipe 1400 intersects to form is different, particularly makes to the spacing between the setting nano wire more than described
The aperture for the hole that micro-/ nano line/pipe 1400 intersects to form, it can also realize the classification processing of different size particle in convection body.
Wherein, the setting form in the flow impedance portion can also be it is various, for example, it can entirety and described matrix
But it is arranged at intervals, locally can be also connected with described matrix, or even in some cases, is also integrally machined shape with described matrix
Into.
Wherein, the fluid intake of the fluid passage (through hole 1303) and more setting nano wires can be distributed in the fluid
Stop part is in the orthographic projection of the first surface of described matrix.
The shape of aforesaid fluid stop part can be various, such as can be circular, square, rectangle or other shapes
Shape.
The material of aforesaid fluid stop part can be selected from metal, nonmetallic, organic material, inorganic material etc., such as silicon chip,
Polymer, ceramics etc., and not limited to this.
More preferable, foregoing catalysis material, sterilization material etc. can be also distributed with aforesaid fluid stop part surface, or
Person, aforesaid fluid stop part surface integrally can be also made up of foregoing catalysis material, sterilization material etc..
More preferable, aforesaid fluid stop part can also have local transparent structure, or overall is transparent, with for example
Light is injected.
The filtrating chip of the application can prepare by physics, chemical method, such as can be chemically grown method, thing
Manage processing method etc., particularly MEMS (MEMS, Microelectromechanical Systems) method etc..
For example, referring to shown in Figure 25, in the 16th embodiment of the present invention, a kind of preparation technology of filtrating chip can
To comprise the following steps:
S1:Patterned photoresist mask is set in the first surface of substrate (such as silicon chip), it includes and makes micro-nano by lithography
The lines of metrical scale;
S2:The first surface of the substrate is performed etching using the photoresist mask, so as to be formed through the lining
Bottom first surface and with the first surface mutually back to second surface some through holes, to as fluid passage;
S3:The kind for micro-/ nano line/pipe growth is deposited on the inwall of fluid passage and the first surface of the substrate
Sublayer;
S4:Growth forms more micro-/ nano line/pipes in the Seed Layer, controls the growth conditions of micro-/ nano line/pipe,
So as to grow to form more be spaced setting micro-/ nano line/pipes in the first surface of the substrate, and lead in the fluid
Growth forms some micro-/ nano line/pipes radially extended in road, the more micro-/ nano lines in the fluid passage/manage that
This intersects, and forms the intersection grid of micro-nano-scale;
S5:Remove the micro-/ nano line/pipe (can also retain) for the first surface for being distributed in the substrate;
S6:Scribing, encapsulation, filtrating chip is made.
The lithographic method used in These steps can be photoetching, Mechanical lithography, dry etching, wet etching etc..
For example, in abovementioned steps, forming the method for the photoresist mask of graphical (nano graph) includes:Photoetching skill
Art, nanometer bead mask technique, nanometer (metal) particle mask technology etc., and not limited to this.
For example, in abovementioned steps, can be rotten by mode known to industry, such as RIE, ICP, wet etching, electrochemistry
Erosion etc. etches fluid passage etc..
Above-mentioned embodiment, technical concept and architectural feature only to illustrate the invention, it is therefore intended that allow and be familiar with this
The stakeholder of item technology can implement according to this, but above said content is not intended to limit protection scope of the present invention, every foundation
Any equivalent change or modification that the Spirit Essence of the present invention is made, all should fall under the scope of the present invention.