WO2017211215A1 - Fluid processing device and preparation method therefor - Google Patents

Fluid processing device and preparation method therefor Download PDF

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Publication number
WO2017211215A1
WO2017211215A1 PCT/CN2017/086780 CN2017086780W WO2017211215A1 WO 2017211215 A1 WO2017211215 A1 WO 2017211215A1 CN 2017086780 W CN2017086780 W CN 2017086780W WO 2017211215 A1 WO2017211215 A1 WO 2017211215A1
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WIPO (PCT)
Prior art keywords
fluid
substrate
fluid passage
distributed
region
Prior art date
Application number
PCT/CN2017/086780
Other languages
French (fr)
Chinese (zh)
Inventor
杨国勇
史建伟
Original Assignee
杨国勇
蔡勇
史建伟
毛凌锋
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201610399546.8A external-priority patent/CN107469480A/en
Priority claimed from CN201610398435.5A external-priority patent/CN107469476A/en
Priority claimed from CN201610399542.XA external-priority patent/CN107473434B/en
Priority claimed from CN201610399521.8A external-priority patent/CN107469246B/en
Priority claimed from CN201610398449.7A external-priority patent/CN107469477A/en
Priority claimed from CN201610398960.7A external-priority patent/CN107469478B/en
Priority claimed from CN201610399527.5A external-priority patent/CN107469479B/en
Application filed by 杨国勇, 蔡勇, 史建伟, 毛凌锋 filed Critical 杨国勇
Publication of WO2017211215A1 publication Critical patent/WO2017211215A1/en

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    • AHUMAN NECESSITIES
    • A62LIFE-SAVING; FIRE-FIGHTING
    • A62BDEVICES, APPARATUS OR METHODS FOR LIFE-SAVING
    • A62B23/00Filters for breathing-protection purposes
    • A62B23/06Nose filters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D46/00Filters or filtering processes specially modified for separating dispersed particles from gases or vapours

Definitions

  • the present invention specifically relates to an apparatus for purifying a fluid containing particulate matter and a preparation method thereof.
  • Conventional fluid processing devices such as masks, air purifiers, etc.
  • defects such as low flux, large volume, short service life, and the like, and the effect of removing fine particles in the fluid is low.
  • people in order to protect the health and safety of the human body, people have used masks made of cotton, gauze and other materials to filter out particulate pollutants in the air.
  • masks are only effective for larger particle contaminants and may be contaminated after a short period of use.
  • the primary object of the present application is to provide an improved fluid processing apparatus and method of making same that overcomes the deficiencies of the prior art.
  • the technical solution adopted by the present application includes:
  • the embodiment of the present application provides a fluid processing apparatus, including:
  • a fluid treatment mechanism for treating the fluid to be treated when the fluid to be treated mixed with the selected particles flows through the fluid passage or before flowing through the fluid passage;
  • the fluid processing mechanism is distributed on the first surface of the substrate or inside the fluid channel and has a fluid processing microstructure, wherein the diameter of the opening for fluid passage in the fluid processing microstructure is greater than 0 but less than the selected The particle size of the particles.
  • the embodiment of the present application further provides a fluid processing apparatus, including:
  • a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
  • the protrusions spaced apart from each other, the protrusions extending continuously on the first surface of the base body in a lateral direction, a lower portion fixedly disposed on the first surface of the base body, and an upper portion having a cap extending continuously in the lateral direction a shape-shaped structure, the opposite sides of the hat-shaped structure are laterally extended, and an opening portion through which the fluid can pass is formed between the adjacent hat-shaped structures, and the diameter of the opening portion is greater than 0 but less than the mixed a particle size of the selected particles in the fluid to be treated, wherein at least two of the raised portions are respectively disposed adjacent to opposite sides of the fluid inlet of the first fluid passage, and at least one The raised portion passes directly from the fluid inlet of the first fluid passage, thereby engaging a plurality of hat-shaped structures, a plurality of projections and the base body to form a second fluid in communication with the first fluid passage The passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  • the embodiment of the present application further provides a fluid processing apparatus, including:
  • a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
  • a porous structure formed by intersecting a plurality of linear bodies to form a second fluid passage with the first surface of the base body, wherein the plurality of linear bodies are fixedly connected to the base body at one end, and the porous structure has a hole a diameter greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, and the fluid to be treated can only pass through the second fluid The road enters the first fluid passage.
  • the embodiment of the present application further provides a fluid processing apparatus, including:
  • a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
  • a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
  • the convex portion is fixedly disposed at one end in a second region of the first surface of the base body, and the other end is fixedly connected to the second surface of the fluid blocking portion, wherein adjacent
  • the distance between the raised portions is greater than zero but less than the particle size of the selected particles that are intermingled with the fluid to be treated, the second region of the first surface of the substrate being contiguous with the first region, such that the plurality of convexities
  • the starting portion, the fluid blocking portion and the base body cooperate to form a second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  • Embodiments of the present invention also provide a fluid processing apparatus, including:
  • a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
  • a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
  • a plurality of vertical nano-linear bodies distributed in a second region of the first surface of the substrate and spaced apart from each other, a second region of the first surface of the substrate being disposed around the first region, Two ends of the nano-linear body are respectively fixedly connected to the first surface of the base body and the second surface of the fluid blocking portion, wherein a distance between adjacent nano-linear bodies is greater than 0 but less than mixed with the fluid to be treated a particle size of the selected particles, such that the plurality of nanowires, the fluid barrier and the substrate cooperate to form a second fluid channel, and the fluid to be treated can only enter through the second fluid channel A fluid passage.
  • a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
  • a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
  • a plurality of protrusions extending continuously in a second region of the first surface of the substrate in a lateral direction, wherein a groove through which a fluid can pass is formed between adjacent protrusions, the groove
  • the opening of the opening has a diameter greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, and the upper end of the raised portion is sealingly connected to the first surface of the base, a partial region of the lower end is sealingly coupled to the second surface of the fluid blocking portion such that more than one groove, fluid barrier between the plurality of projections cooperates with the base to form a second fluid passage, and the to-be-processed Fluid can only enter the first fluid passage through the second fluid passage.
  • a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
  • the protrusions being fixedly disposed on the first surface of the base body and extending continuously on the first surface of the base body in a lateral direction, wherein between the adjacent protrusions Forming a groove through which the fluid can pass, the opening of the groove having a diameter greater than 0 but smaller than the particle size of the selected particles mixed in the fluid to be treated, and wherein at least two of the raised portions are respectively Two opposite sides of the opposite sides of the fluid inlet of the first fluid passage are disposed adjacent to each other, and at least one convex portion directly passes through the fluid inlet of the first fluid passage, so that the plurality of convex portions and the base body
  • the interfitting forms a second fluid passage in communication with the first fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  • the embodiment of the present application further provides another fluid processing apparatus, including:
  • the aggregates are distributed within the fluid channel and have a porous structure, the pores within the porous structure having a diameter greater than zero but less than the particle size of the selected particles.
  • the embodiment of the present application further provides a nasal plug respirator, including:
  • a nasal plug and a filter chip at least one end of the nasal plug can be inserted into a nasal cavity of a user, and the nasal plug includes a gas passage communicating with the nasal cavity, and the filter chip is used to filter out the mixed airflow to be treated, a particle having a particle diameter larger than a set value, wherein the gas to be treated flows into the gas passage in the nasal plug after flowing through the filter chip;
  • a filter chip protection structure is used to protect the filter chip.
  • the fluid processing device provided by the present application has at least a large flux, a small flow resistance, and can effectively remove micro/nano-sized particles in a fluid, and can also adopt a thick substrate, has high mechanical strength, and can be (ultrasonic) cleaned and It has many times of use, long service life, and preferably has self-cleaning function, and the preparation process is simple and controllable, and is suitable for large-scale preparation in large scale.
  • the nasal plug type respirator provided by the present application has good filterability, convenient breathing, good comfort, can be used multiple times, and has a long service life;
  • the filter chip in the present application has at least a large flux, a small flow resistance, and can efficiently remove micro/nano particles in the air, etc.
  • Features can also use thicker substrate, high mechanical strength, can be (ultrasonic) cleaning and multiple use, long service life, and preferably has a self-cleaning function, while its preparation process is simple and controllable, suitable for large-scale large-scale preparation .
  • FIG. 1 is a cross-sectional view of a fluid processing apparatus including a lateral flow path in the prior art
  • Figure 2 is a plan view of a fluid processing apparatus in a first embodiment of the present application
  • Figure 3 is a partial cross-sectional view (A-A direction) of a fluid processing apparatus in a first embodiment of the present application;
  • FIG. 4 is a flow chart of a preparation process of a fluid processing apparatus according to a first embodiment of the present application
  • Figure 5 is a plan view of a fluid processing apparatus in a second embodiment of the present application.
  • Figure 6 is a partial cross-sectional view showing a fluid processing apparatus in a second embodiment of the present application.
  • FIG. 7 is a flow chart showing a preparation process of a fluid processing apparatus according to a second embodiment of the present application.
  • Figure 8 is a cross-sectional view showing a fluid processing apparatus in a third embodiment of the present application.
  • 9a-9e are transverse cross-sectional views of a raised portion of a fluid processing apparatus in some exemplary embodiments of the present application.
  • 10a-10c are schematic views showing the arrangement of the bosses in a fluid processing apparatus according to some exemplary embodiments of the present application.
  • 11a-11c are top views of various fluid processing devices in a third embodiment of the present application.
  • Figure 12 is a plan view of a fluid processing apparatus in a fourth embodiment of the present application.
  • Figure 13 is a plan view of a fluid processing apparatus in a fifth embodiment of the present application.
  • Figure 14 is a cross-sectional view showing a fluid processing apparatus in a sixth embodiment of the present application.
  • Figure 15 is a cross-sectional view showing a fluid processing apparatus in a seventh embodiment of the present application.
  • 16 is a flow chart showing a preparation process of a fluid processing apparatus according to an eighth embodiment of the present application.
  • FIG. 17 is a flow chart showing a preparation process of a fluid processing apparatus according to a ninth embodiment of the present application.
  • Figure 18 is a plan view of a fluid processing apparatus in a tenth embodiment of the present application.
  • Figure 19 is a partial cross-sectional view showing a fluid processing apparatus in a tenth embodiment of the present application.
  • Figure 20 is a plan view showing a fluid processing apparatus in an eleventh embodiment of the present application.
  • Figure 21 is a partial cross-sectional view showing a fluid processing apparatus in a twelfth embodiment of the present application.
  • Figure 22 is a partial cross-sectional view showing a fluid processing apparatus in a thirteenth embodiment of the present application.
  • Figure 23 is a plan view showing a fluid processing apparatus in a fourteenth embodiment of the present application.
  • Figure 24 is a partial cross-sectional view showing a fluid processing apparatus in a fifteenth embodiment of the present application.
  • Figure 25 is a flow chart showing the preparation process of a fluid processing apparatus in a sixteenth embodiment of the present application.
  • Figure 26 is a schematic view showing the structure of a nasal stopper type respirator according to a seventeenth embodiment of the present application.
  • a fluid treatment mechanism for treating the fluid to be treated when the fluid to be treated mixed with the selected particles flows through the fluid passage or before flowing through the fluid passage;
  • the fluid processing mechanism is distributed on the first surface of the substrate or inside the fluid channel and has a fluid processing microstructure, wherein the diameter of the opening for fluid passage in the fluid processing microstructure is greater than 0 but less than the selected The particle size of the particles.
  • a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
  • the protrusions spaced apart from each other, the protrusions extending continuously on the first surface of the base body in a lateral direction, a lower portion fixedly disposed on the first surface of the base body, and an upper portion having a cap extending continuously in the lateral direction a shape-shaped structure, the opposite sides of the hat-shaped structure are laterally extended, and an opening portion through which the fluid can pass is formed between the adjacent hat-shaped structures, and the diameter of the opening portion is greater than 0 but less than the mixed a particle size of the selected particles in the fluid to be treated, wherein at least two of the raised portions are respectively disposed adjacent to opposite sides of the fluid inlet of the first fluid passage, and at least one The raised portion passes directly from the fluid inlet of the first fluid passage, thereby engaging a plurality of hat-shaped structures, a plurality of projections and the base body to form a second fluid in communication with the first fluid passage The passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  • lateral direction can be understood to mean any direction that is parallel or substantially parallel to the first surface of the substrate.
  • ide can be understood as any direction that is not perpendicular to the first surface but intersects the "lateral".
  • the “lateral direction” may be a direction extending horizontally outward or obliquely upward from a side of the protrusion.
  • the substrate may be in various forms, such as a rectangular shape, a sheet shape, a polyhedral shape, a hemispherical shape, a spherical shape or other irregular forms.
  • the "first surface” may be any non-specific suitable plane or curved surface on the substrate.
  • the first fluid passage may be a through hole of any shape
  • the fluid inlet thereof is distributed on the first surface of the base body
  • the fluid outlet thereof may be distributed on the base body different from the first surface
  • the other surface for example, the other surface may be adjacent to, opposite to the first surface
  • the first surface may also be distributed on the first surface (of course, in this case, the first There should be a fluid blocking mechanism on the surface such that the fluid to be treated does not flow directly onto the first surface to the fluid outlet.
  • the fluid outlet of the first fluid channel can also be distributed Inside the substrate, for example, when there is a cavity in the substrate to receive the treated fluid.
  • the plurality of raised portions refers to two or more raised portions.
  • the raised portion is a flat or concave portion with respect to the first surface of the base body, the shape thereof may be various, for example, as viewed from a plan view, it may have a straight or curved contour Strips, sheets or other regular or irregular forms, etc., and are not limited thereto.
  • the plurality of protrusions may be regularly or irregularly distributed uniformly or non-uniformly on the first surface of the substrate.
  • At least two of said projections pass directly over the fluid inlet of said first fluid passage.
  • the plurality of raised portions are distributed in parallel on the first surface of the substrate.
  • the protrusions are strip-shaped, the width thereof may be larger, and the pitch of each protrusion portion may be larger, so that the protrusion portion has greater mechanical strength and the hat-shaped structure is formed better.
  • the support while also imparting a greater fluid flux to the fluid treatment device.
  • the raised portion has a height of 0.1 ⁇ m to 400 ⁇ m, a width of 0.1 ⁇ m to 100 ⁇ m, and a distance between adjacent convex portions of 0.1 ⁇ m to 100 ⁇ m.
  • the hat-shaped structure may have various regular or irregular cross-sectional structures, for example, preferably not limited to an inverted trapezoidal cross-sectional structure, but an opening formed between adjacent hat-shaped structures should have a diameter greater than 0 but less than mixed
  • the particle size of the selected particles in the fluid to be treated is used to treat particles having a particle size as small as nanometers in the fluid.
  • the opening formed between the adjacent hat-shaped structures has a diameter of 1 nm to 50 ⁇ m.
  • the hat-shaped structure has a height of 50 nm to 200 ⁇ m.
  • the hat-shaped structure is integrally provided with the convex portion, and may be directly formed on the upper portion of the convex portion by, for example, evaporation, deposition, growth, etc., and the hat-shaped structure may also follow the convex portion along the lateral direction. Continuously extending so as to form an opening portion extending continuously in the lateral direction between adjacent hat-shaped structures, so that the treatment of selected particles mixed in the fluid to be treated can be ensured, and a high flux is also maintained, and The processing difficulty is reduced (the spacing of adjacent protrusions is limited by the processing capability, and it is generally difficult to reach a distance of about 1 nm), which saves cost.
  • the material of the hat-shaped structure may be selected from an insulating dielectric material such as silicon oxide, silicon nitride oxide, borophosphosilicate glass, or the like, or a semiconductor material such as Si, ZnO, GaN, TiO 2 , InN, or the like, or a metal material.
  • an insulating dielectric material such as silicon oxide, silicon nitride oxide, borophosphosilicate glass, or the like
  • a semiconductor material such as Si, ZnO, GaN, TiO 2 , InN, or the like
  • a metal material such as Ag, Au, Al, Ni, Cr, Ti, etc. may of course be selected from other inorganic and/or organic materials and the like.
  • the fluid inlet of the first fluid channel has a regular or irregular shape, such as a polygon (rectangular, diamond or other), a circle or an ellipse, etc., which can be easily adjusted according to the needs of practical applications.
  • the opening portion formed between the adjacent convex portions may have various forms of cross-sectional shapes, and may be, for example, a regular or irregular shape such as a rectangle, a trapezoid, an inverted trapezoid, a triangle, or a semicircle.
  • the fluid to be treated may be in a gas phase or a liquid phase, such as air, water, oil, and in some cases, may be a collection of fluid substances in a fluid state, or a molten state of certain substances, etc. .
  • the particles mainly refer to solid phase particles, but in some cases, may also be droplets or the like which are incompatible with the fluid (especially a liquid phase fluid).
  • the first fluid channel may have a pore size of from 1 ⁇ m to 1 mm.
  • the substrate has a thickness of 1 ⁇ m or more to provide a better mechanical strength of the substrate to provide stronger support for the raised portion and the hat-shaped structure.
  • the material of the substrate may be selected from a metal, a non-metal, an organic material, an inorganic material, or the like, such as a silicon wafer, a polymer, a ceramic, or the like, and is not limited thereto.
  • the surface of at least one of the convex portion, the hat-shaped structure and the base body is further provided with a functional material layer, and the material of the functional material layer comprises a photocatalytic material, an antibacterial material and the like.
  • a typical photocatalytic material may be titanium dioxide or the like.
  • some organic pollutants in the fluid may be photocatalyzed by ultraviolet light or the like. Degradation, achieving multiple purification of fluids.
  • a more typical antibacterial material may be a noble metal such as Au or Ag, which can synchronously kill bacteria, viruses and the like in the fluid during the processing of the fluid.
  • the above-mentioned photocatalytic material, antibacterial material, or the like can also be directly formed into the convex portion, the hat-shaped structure, and the base body. At least one of them.
  • part or all of the hat-shaped structure, the base body, and the convex portion may be made of a transparent material.
  • Another aspect of the present application provides a method of preparing a fluid processing apparatus comprising:
  • a hat-shaped structure continuously extending in a lateral direction at an upper portion of the convex portion, and laterally extending opposite sides of the opposite side of the hat-shaped structure, and forming an adjacent between the adjacent hat-shaped structures
  • a second fluid passage is formed and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  • the method of preparation comprises:
  • a hat-shaped structure on each of the plurality of protrusions at least one of evaporating, depositing, and growing, and laterally extending the opposite sides of the hat-shaped structure, and The opening portion is formed between adjacent hat-shaped structures.
  • a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
  • a porous structure formed by intersecting a plurality of linear bodies to form a second fluid passage with the first surface of the base body, wherein the plurality of linear bodies are fixedly connected to the base body at one end, and the porous structure has a hole
  • the diameter is greater than zero but less than the particle size of the selected particles that are intermixed within the fluid to be treated, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  • the substrate may be in various forms, such as a rectangular shape, a sheet shape, a polyhedral shape, a hemispherical shape, a spherical shape or other irregular forms.
  • the "first surface” may be any non-specific suitable plane or curved surface on the substrate.
  • the first fluid passage may be a through hole of any shape
  • the fluid inlet thereof is distributed on the first surface of the base body
  • the fluid outlet thereof may be distributed on the base body different from the first surface
  • the other surface for example, the other surface may be adjacent to, opposite to the first surface
  • the first surface may also be distributed on the first surface (of course, in this case, the first There should be a fluid blocking mechanism on the surface such that the fluid to be treated does not flow directly onto the first surface to the fluid outlet.
  • the fluid outlet of the first fluid channel can also be distributed Inside the substrate, for example, when there is a cavity in the substrate to receive the treated fluid.
  • the fluid to be treated may be in a gas phase or a liquid phase, such as air, water, oil, and in some cases, may be a collection of fluid substances in a fluid state, or a molten state of certain substances, etc. .
  • the particles mainly refer to solid phase particles, but in some cases, may also be droplets or the like which are incompatible with the fluid (especially a liquid phase fluid).
  • the linear body may be linear, curved, preferably linear, which is advantageous for preparation, and can make the size of the hole in the formed porous structure more controllable.
  • the linear body may be solid or hollow, such as a nano- or micro-scale wire, tube, etc., but is not limited thereto.
  • the diameter of the linear body is preferably from 1 nm to 50 ⁇ m.
  • the distance between one end of any linear body and one end of another linear body adjacent to the linear body is preferably from 1 nm to 50 ⁇ m.
  • the length of the linear body is preferably 50 nm to 200 ⁇ m.
  • the linear body can adopt nanowires, which are small in diameter and can be densely distributed to form pores having a small pore diameter, thereby maintaining a high fluid flux and achieving a smaller particle size ( The fluid of the particles of micron or even nanometers is processed.
  • the linear body may adopt nanowires, and the array formed by the nanowires may have a superhydrophobic structure, thereby enabling the fluid processing apparatus to have a self-cleaning function.
  • nanowires may also be replaced by nanotubes or the like.
  • the linear body may be preferably selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
  • the linear body may be fixed to the surface of the substrate or to the substrate by external transfer, in-situ growth (for example, chemical growth, electrochemical growth) or deposition (for example, physical, chemical vapor deposition, electrodeposition) or the like.
  • in-situ growth for example, chemical growth, electrochemical growth
  • deposition for example, physical, chemical vapor deposition, electrodeposition
  • the fluid inlet of the first fluid channel has a regular or irregular shape, such as a polygon (rectangular, diamond or other), a circle or an ellipse, etc., which can be easily adjusted according to the needs of practical applications.
  • one end of the plurality of linear bodies is fixedly coupled to the first surface of the base body and is distributed around the fluid inlet of the first fluid passage.
  • Such an arrangement allows the porous structure formed between the plurality of linear bodies distributed around the fluid inlet to be part of the second fluid passage, thereby obtaining a larger fluid flux.
  • the fluid processing apparatus further includes:
  • the raised portion is fixedly disposed on the first surface of the base body, and extends continuously on the first surface of the base body in a lateral direction, wherein at least two raised portions are respectively respectively Adjacent to opposite sides of the fluid inlet of the first fluid passage, at least one projection directly passes through the fluid inlet of the first fluid passage, and the projection is fixedly connected with two The linear body described above.
  • the plurality of raised portions refers to two or more raised portions.
  • the raised portion is a flat or concave portion with respect to the first surface of the base body, the shape thereof may be various, for example, as viewed from a plan view, it may have a straight or curved contour Strips, sheets or other regular or irregular forms, etc., and are not limited thereto.
  • the raised portion may have a larger thickness and a larger width, so that the linear body may be better supported, and the distance between the convex portions may be larger.
  • the plurality of protrusions may be regularly or irregularly distributed uniformly or non-uniformly on the first surface of the substrate.
  • the plurality of linear bodies attached to a raised portion and the plurality of linear bodies joined to the other raised portion adjacent the raised portion intersect each other.
  • the plurality of raised portions are distributed in parallel on the first surface of the substrate.
  • the raised portion has a width of from 0.1 ⁇ m to 100 ⁇ m and a height of from 0.1 ⁇ m to 400 ⁇ m.
  • transverse refers to any direction that is parallel or substantially parallel to the first surface of the substrate.
  • longitudinal means a direction that is perpendicular or substantially perpendicular to the transverse direction.
  • the distance between adjacent raised portions is from 0.1 ⁇ m to 100 ⁇ m.
  • the material selection range of each part in the fluid processing device is various, and may be an inorganic material or an organic material.
  • it may be selected from metals, silicon wafers, ceramics, polymers, and the like, and is not limited thereto.
  • the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
  • the surface of the convex portion is further provided with a layer of a functional material
  • the material of the functional material layer includes a photocatalytic material, an antibacterial material and the like, and is not limited thereto.
  • a typical photocatalytic material may be titanium dioxide or the like.
  • some organic pollutants in the fluid may be photocatalyzed by ultraviolet light or the like. Degradation, achieving multiple purification of fluids.
  • a more typical antibacterial material may be a noble metal such as Au or Ag, which can synchronously kill bacteria, viruses and the like in the fluid during the processing of the fluid.
  • part or all of the substrate, the linear body, and the convex portion may be made of a transparent material.
  • the fluid processing apparatus includes a plurality of beams (ie, the raised portions) that are distributed in parallel on a first surface of the substrate, the beams being first in a lateral direction at the base
  • the surface extends continuously, wherein at least two of the beams are respectively disposed adjacent to opposite sides of the fluid inlet of the first fluid passage, and at least one of the beams passes directly from the fluid inlet of the first fluid passage;
  • a plurality of linear bodies are disposed on any of the beams, and at least a portion of the linear bodies of the plurality of linear bodies are fixed to the surface of the beam, and the other end extends obliquely away from the direction of the beam and/or
  • the porous structure is formed by continuously extending on a plane parallel to the first surface of the substrate and intersecting a plurality of linear bodies distributed on another beam adjacent to the one of the beams.
  • At least two beams pass directly over the fluid inlet of the first fluid passage.
  • the substrate Processing the substrate to form a first fluid channel on the substrate, the first fluid channel having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid channel being distributed over the substrate First surface
  • the diameter is greater than zero but less than the particle size of the selected particles that are intermixed within the fluid to be treated, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  • the method of preparation comprises:
  • the method of preparation comprises:
  • a plurality of nanowires are grown on the seed layer remaining on the top of the raised portion, and the plurality of nanowires are crossed to form a porous structure.
  • a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
  • a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
  • the convex portion is fixedly disposed at one end in a second region of the first surface of the base body, and the other end is fixedly connected to the second surface of the fluid blocking portion, wherein adjacent
  • the distance between the raised portions is greater than zero but less than the particle size of the selected particles that are intermingled with the fluid to be treated, the second region of the first surface of the substrate being contiguous with the first region, such that the plurality of convexities
  • the starting portion, the fluid blocking portion and the base body cooperate to form a second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  • a fluid processing apparatus includes:
  • a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
  • a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
  • a plurality of vertical nano-linear bodies distributed in a second region of the first surface of the substrate and spaced apart from each other, a second region of the first surface of the substrate being disposed around the first region, Both ends of the nanowire body and the base
  • the first surface of the body and the second surface of the fluid barrier are fixedly connected, wherein the distance between adjacent nano-linear bodies is greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, thereby
  • the plurality of nano-linear bodies, the fluid blocking portion and the base body cooperate to form a second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  • the substrate may be in various forms, such as a rectangular shape, a sheet shape, a polyhedral shape, a hemispherical shape, a spherical shape or other irregular forms.
  • the "first surface” may be any non-specific suitable plane or curved surface on the substrate.
  • the first fluid passage may be a through hole of any shape
  • the fluid inlet thereof is distributed on the first surface of the base body
  • the fluid outlet thereof may be distributed on the base body different from the first surface
  • the other surface for example, the other surface may be adjacent to, opposite to the first surface
  • the first surface may also be distributed on the first surface (of course, in this case, the first There should be a fluid blocking mechanism on the surface such that the fluid to be treated does not flow directly onto the first surface to the fluid outlet.
  • the fluid outlet of the first fluid channel can also be distributed Inside the substrate, for example, when there is a cavity in the substrate to receive the treated fluid.
  • the fluid blocking portion may be in various forms, for example, a sheet shape, a thin shell shape, a rectangular shape, a polyhedral shape, or the like, as long as it can prevent the fluid to be processed from being subjected to the plurality of convexities.
  • the fluid passage other than the second fluid passage formed by the cooperation between the starting portion (or the nano-linear body) and the fluid blocking portion and the base body may enter the fluid inlet of the first fluid passage.
  • the arrangement of the fluid blocking portion may also be various. For example, it may be disposed integrally with the base body, or may be partially connected to the base body, or even in some cases, may be Integrated processing.
  • the distribution of the first region and the second region of the first surface of the substrate may be various.
  • the first region and the second region may be adjacent to each other, or may be separated by a certain distance, or may be
  • the two regions are disposed around the first region, and the first region may be partially embedded in the second region.
  • the distribution pattern of the two can be adjusted depending on the fluid blocking portion, the structure of the substrate, the positional relationship between each other, and the like.
  • the plurality of raised portions refers to two or more raised portions.
  • the convex portion is a flat or concave portion with respect to the first surface of the base body, and the shape thereof may be various, for example, it may be a line, a column, a sheet, or a tubular, tapered, frustum-like structure or other regular or irregular structure, preferably a nano-linear body, and a transverse cross-sectional structure thereof (the lateral direction herein mainly refers to a direction parallel to the first surface of the substrate) It may also be of a regular or irregular shape, such as a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, etc. (see Figures 9a-9e).
  • the plurality of protrusions may be regularly or irregularly distributed uniformly or non-uniformly on the first surface of the substrate (see FIGS. 10a-10c).
  • the vertical nanowire body is grown in situ on the first surface of the substrate.
  • the fluid inlet of the first fluid channel has a regular or irregular shape, such as a polygon (rectangular, diamond or other), a circle or an ellipse, etc., which can be easily adjusted according to the needs of practical applications.
  • the fluid to be treated may be in a gas phase or a liquid phase, such as air, water, oil, and in some cases, may be a collection of fluid substances in a fluid state, or a molten state of certain substances, etc. .
  • the particles mainly refer to solid phase particles, but in some cases, may also be droplets or the like which are incompatible with the fluid (especially a liquid phase fluid).
  • the second region of the first surface of the substrate is disposed about the first region.
  • a plurality of raised portions distributed in the second region are disposed around the fluid inlet of the first fluid passage. Such an arrangement allows the gaps between the plurality of raised portions distributed in the second region to be part of the second fluid passage, thereby obtaining a larger fluid flux.
  • the third surface of the first surface of the substrate is also spaced apart from the plurality of protrusions, and the second region is disposed between the third region and the first region.
  • the tops of the plurality of protrusions distributed in the third region may or may not be connected to the fluid blocking portion, in particular, when the tops of the protrusions are not associated with the fluid
  • the gap between the tops of the raised portions may also constitute a fluid passage, thereby further increasing the contact surface of the fluid processing device with the fluid and increasing the fluid flux.
  • a third region of the first surface of the substrate is disposed around the second region.
  • the convex portion distributed in the third region and the convex portion distributed in the second region may be the same or different. Particularly preferably, whether it is distributed in the third region or the second region, as long as the distance between adjacent convex portions distributed on the first surface of the substrate is greater than 0 but less than mixed The particle size of the selected particles within the fluid.
  • the first region and the second region of the first surface of the substrate are distributed within an orthographic projection of the fluid blocking portion on the first surface of the substrate.
  • the convex portion is a linear or columnar protrusion having an aspect ratio of 4:1 to 200000:1, and a ratio of a distance between adjacent convex portions to a length of the convex portion. It is 1:4 ⁇ 1:200000.
  • a plurality of convex portions can be densely arranged (the proportion of the convex portion itself in a unit area is small), which facilitates processing of minute particles in the fluid, and also The fluid handling device is given a greater fluid flux (the pores between the bosses are larger than the boss itself).
  • the convex portion is an upright microwire (tube) or a nanowire (tube) having a diameter of 1 nm to 50 ⁇ m, a length of 50 nm to 200 ⁇ m, and a distance between adjacent convex portions of 1 nm. 50 ⁇ m, this allows the fluid handling device to be constructed to handle particles of particle size as small as nanometers in the fluid while maintaining a high fluid handling flux.
  • the plurality of protrusions distributed in the third region of the first surface of the substrate are arranged to form a micro- or nano-scale array structure having superhydrophobic or superoleophobic properties.
  • the fluid processing device can also be provided with functions such as self-cleaning.
  • the convex portion by forming a coating formed of a suitable low surface energy substance known in the art on a part or the whole surface of the convex portion, or directly forming the convex portion with a hydrophobic material, thereby making it superhydrophobic. Performance, self-cleaning performance, etc.
  • the first fluid channel may have a pore size of from 1 ⁇ m to 1 mm.
  • the substrate has a thickness of 1 ⁇ m or more.
  • the material of the substrate may be selected from a metal, a non-metal, an organic material, an inorganic material, or the like, such as a silicon wafer, a polymer, a ceramic, or the like, and is not limited thereto.
  • the raised portion may be selected from nanowires, such as carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires. Any one or a combination of two or more.
  • the protrusion may be formed of a photocatalytic material or a material having an antibacterial or bactericidal function, or the protrusion may be covered with a photocatalytic material or have a bactericidal or antibacterial function.
  • a coating formed by the material may employ nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO 2 nanowires, and are capable of degrading organic substances in the fluid under light-assisted illumination.
  • the protrusions may employ Ag nanowires, Au nanowires, or the like to kill bacteria, viruses, and microorganisms in the fluid.
  • the fluid barrier has a thickness of from 0.5 ⁇ m to 200 ⁇ m.
  • the fluid treatment device may further include at least one support body, one end of the support body being fixedly coupled to the base body and the other end being fixedly coupled to the fluid blocking portion.
  • the support body By the support body, a more stable and stable fit between the fluid blocking portion and the base body can be achieved, and the convex portion distributed between the fluid blocking portion and the base body can be effectively protected from the fluid blocking portion and / or the problem that the base body is collapsed, damaged, etc. caused by the pressing of the convex portion after being subjected to an external force.
  • the support body may be in various forms, such as a column shape (cylindrical, polygonal prism, etc.), a step shape, a frustum shape, or the like, and is not limited thereto, and the folding resistance should be greater than any of the raised portions.
  • the support body may be formed by machining between the fluid blocking portion and the base body, or may be integrally formed with the base body or the fluid blocking portion.
  • the support body may be two or more, and the two or more support bodies are symmetrically distributed around the fluid inlet of the first fluid passage.
  • more than one branch may be disposed on the fluid inlet of the first fluid passage.
  • the support beam is fixedly connected to the fluid blocking portion for forming a support for the fluid blocking portion to further enhance the structural strength of the fluid processing device.
  • the support beam may be a plurality of wires, which may be arranged in parallel on the fluid inlet of the first fluid channel.
  • the surface of the convex portion is further provided with a layer of a functional material
  • the material of the functional material layer includes a photocatalytic material, an antibacterial material and the like, and is not limited thereto.
  • a typical photocatalytic material may be titanium dioxide or the like.
  • some organic pollutants in the fluid may be photocatalyzed by ultraviolet light or the like. Degradation, achieving multiple purification of fluids.
  • a more typical antibacterial material may be a noble metal such as Au or Ag, which can synchronously kill bacteria, viruses and the like in the fluid during the processing of the fluid.
  • At least a portion of the components of the fluid treatment device are at least partially transparent to facilitate light penetration.
  • part or all of the fluid blocking portion, the base body, and the boss portion may be made of a transparent material.
  • a fluid barrier having a second surface disposed opposite the first surface of the substrate on a first surface of the substrate and at least distributed in a second region of the first surface of the substrate a plurality of protrusions fixedly connected to the second surface of the fluid blocking portion;
  • the method of preparation comprises:
  • the plurality of raised portions are a plurality of vertical nano-pillars or vertical nanowires arranged in an array.
  • a fluid barrier having a second surface disposed opposite the first surface of the substrate on a first surface of the substrate and at least distributed in a second region of the first surface of the substrate a plurality of nano-linear bodies fixedly connected to the second surface of the fluid blocking portion;
  • the preparation method is characterized by comprising:
  • the third photoresist mask and the sacrificial material filled between the plurality of nanowires are removed, and the first fluid channel is formed on the substrate.
  • a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
  • a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
  • a plurality of protrusions extending continuously in a second region of the first surface of the substrate in a lateral direction, wherein a groove through which a fluid can pass is formed between adjacent protrusions, the groove
  • the opening of the opening has a diameter greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, and the upper end of the raised portion is sealingly connected to the first surface of the base, and the partial portion of the lower end is
  • the second surface of the fluid blocking portion is sealingly connected such that more than one groove between the plurality of raised portions and the fluid blocking portion cooperate with the base body to form a second fluid passage, and the fluid to be treated can pass only the first The two fluid passages enter the first fluid passage.
  • lateral direction can be understood to mean any direction that is parallel or substantially parallel to the first surface of the substrate.
  • longitudinal as used hereinafter may be understood to mean a direction that is perpendicular or substantially perpendicular to the transverse direction.
  • the substrate may be in various forms, such as a rectangular shape, a sheet shape, a polyhedral shape, a hemispherical shape, a spherical shape or other irregular forms.
  • the "first surface” may be any non-specific suitable plane or curved surface on the substrate.
  • the first fluid passage may be a through hole of any shape
  • the fluid inlet thereof is distributed on the first surface of the base body
  • the fluid outlet thereof may be distributed on the base body different from the first surface
  • the other surface for example, the other surface may be adjacent to, opposite to the first surface
  • the first surface may also be distributed on the first surface (of course, in this case, the first There should be a fluid blocking mechanism on the surface such that the fluid to be treated does not flow directly onto the first surface to the fluid outlet.
  • the fluid outlet of the first fluid channel can also be distributed Inside the substrate, for example, when there is a cavity in the substrate to receive the treated fluid.
  • the fluid blocking portion may also be in various forms, such as a sheet shape, a thin shell shape, a rectangular shape, and a plurality of a face shape or the like as long as it can prevent the fluid to be treated from entering the first fluid from a fluid passage other than the second fluid passage formed by the plurality of projections, the fluid blocking portion and the base body
  • the fluid inlet of the channel is sufficient.
  • the arrangement of the fluid blocking portion may also be various. For example, it may be disposed integrally with the base body, or may be partially connected to the base body, or even in some cases, may be Integrated processing.
  • the distribution of the first region and the second region of the first surface of the substrate may be various.
  • the first region and the second region may be adjacent to each other, or may be separated by a certain distance, or may be
  • the two regions are disposed around the first region, and the first region may be partially embedded in the second region.
  • the distribution pattern of the two can be adjusted depending on the fluid blocking portion, the structure of the substrate, the positional relationship between each other, and the like.
  • the plurality of raised portions refers to two or more raised portions.
  • the raised portion is a flat or concave portion with respect to the first surface of the base body, the shape thereof may be various, for example, as viewed from a plan view, it may have a straight or curved contour Strips, sheets or other regular or irregular forms, etc., and are not limited thereto.
  • the plurality of protrusions may be regularly or irregularly distributed uniformly or non-uniformly on the first surface of the substrate.
  • the fluid inlet of the first fluid channel has a regular or irregular shape, such as a polygon (rectangular, diamond or other), a circle or an ellipse, etc., which can be easily adjusted according to the needs of practical applications.
  • the grooves formed between the adjacent convex portions may have various forms of cross-sectional shapes, for example, regular or irregular shapes such as rectangular, trapezoidal, inverted trapezoidal, triangular, semi-circular, etc., but should be made to be open
  • the size of the portion is less than the particle size of the selected particles that are mixed in the fluid to be treated.
  • the fluid to be treated may be in a gas phase or a liquid phase, such as air, water, oil, and in some cases, may be a collection of fluid substances in a fluid state, or a molten state of certain substances, etc. .
  • the particles mainly refer to solid phase particles, but in some cases, may also be droplets or the like which are incompatible with the fluid (especially a liquid phase fluid).
  • the second region of the first surface of the substrate is disposed about the first region.
  • a plurality of raised portions distributed in the second region are disposed around the fluid inlet of the first fluid passage. Such an arrangement allows the gaps between the plurality of raised portions distributed in the second region to be part of the second fluid passage, thereby obtaining a larger fluid flux.
  • all or part of the first region and the second region of the first surface of the substrate are distributed within an orthographic projection of the fluid blocking portion on the first surface of the substrate.
  • the convex portion is (as viewed from a plan view) a sheet shape, and the width thereof can be controlled to a micron order or a nanometer order, whereby a plurality of convex portions can be densely arranged (the convex portion itself is in the unit) Concentration in the area), conducive to convection
  • the fine particles in the body are treated while also imparting a greater fluid flux to the fluid processing device (the cross-sectional area of the grooves formed between the raised portions can be larger).
  • the convex portion has a sheet shape having a linear outline (as viewed from a plan view), and has a width of 1 nm to 50 ⁇ m, and an opening portion of the groove formed between the adjacent convex portions has a size of 1 nm. 50 ⁇ m, this allows the fluid handling device to be constructed to handle particles of particle size as small as nanometers in the fluid while maintaining a high fluid handling flux.
  • the first fluid channel may have a pore size of from 1 ⁇ m to 1 mm.
  • the substrate has a thickness of 1 ⁇ m or more.
  • the material of the substrate may be selected from a metal, a non-metal, an organic material, an inorganic material, or the like, such as a silicon wafer, a polymer, a ceramic, or the like, and is not limited thereto.
  • the fluid barrier has a thickness of from 0.5 ⁇ m to 200 ⁇ m.
  • the fluid treatment device may further include at least one support body, one end of the support body being fixedly coupled to the base body and the other end being fixedly coupled to the fluid blocking portion.
  • the support body By the support body, a more stable and stable fit between the fluid blocking portion and the base body can be achieved, and the convex portion distributed between the fluid blocking portion and the base body can be effectively protected from the fluid blocking portion and / or the problem that the base body is collapsed, damaged, etc. caused by the pressing of the convex portion after being subjected to an external force.
  • the support body may be in various forms, such as a column shape (cylindrical, polygonal prism, etc.), a step shape, a frustum shape, or the like, and is not limited thereto, and the folding resistance should be greater than any of the raised portions.
  • the support body may be formed by machining between the fluid blocking portion and the base body, or may be integrally formed with the base body or the fluid blocking portion.
  • the support body may be two or more, and the two or more support bodies are symmetrically distributed around the fluid inlet of the first fluid passage.
  • one or more support beams may be disposed on the fluid inlet of the first fluid passage, and the support beam is fixedly coupled to the fluid blocking portion to form a support for the fluid blocking portion. The structural strength of the fluid treatment device is further increased.
  • the support beam may be a plurality of wires, which may be arranged in parallel on the fluid inlet of the first fluid channel.
  • the surface of the convex portion is further provided with a layer of a functional material
  • the material of the functional material layer includes a photocatalytic material, an antibacterial material and the like, and is not limited thereto.
  • a typical photocatalytic material may be titanium dioxide or the like.
  • some organic pollutants in the fluid may be photocatalyzed by ultraviolet light or the like. Degradation, achieving multiple purification of fluids.
  • a typical antibacterial material may be a noble metal such as Au or Ag, which can simultaneously kill bacteria, viruses, and the like in the fluid during the processing of the fluid.
  • part or all of the fluid blocking portion, the base body, and the convex portion may be made of a transparent material.
  • a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
  • the protrusions being fixedly disposed on the first surface of the base body and extending continuously on the first surface of the base body in a lateral direction, wherein between the adjacent protrusions Forming a groove through which the fluid can pass, the opening of the groove having a diameter greater than 0 but smaller than the particle size of the selected particles mixed in the fluid to be treated, and wherein at least two of the raised portions are respectively Two opposite sides of the opposite sides of the fluid inlet of the first fluid passage are disposed adjacent to each other, and at least one convex portion directly passes through the fluid inlet of the first fluid passage, so that the plurality of convex portions and the base body
  • the interfitting forms a second fluid passage in communication with the first fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  • the fluid treatment device further comprises:
  • a fluid blocking portion having a second surface disposed opposite the first surface of the substrate, the fluid inlet of the first fluid channel being distributed within an orthographic projection formed by the fluid blocking portion on the first surface of the substrate
  • the plurality of raised portions have opposite first and second ends, the first end being sealingly coupled to the first surface of the base, the partial portion of the second end and the second portion of the shielding portion Surface sealed connection.
  • the shape, material, structure, and the like of the base, the boss, the fluid barrier, and the first fluid passage may be the same as or similar to those described above.
  • the plurality of raised portions are distributed in parallel on the first surface of the substrate.
  • Another aspect of the present application provides a method of preparing a fluid processing apparatus comprising:
  • a second surface of the substrate to form a first fluid passage through the substrate, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate,
  • the second region of the first surface of the substrate is contiguous with the first region such that a plurality of trenches, fluid barriers are distributed between the plurality of raised portions in the second region of the first surface of the substrate
  • a second fluid passage is formed in cooperation with the substrate, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  • the method of preparation comprises:
  • the plurality of raised portions are a plurality of nano-sheets or nano-bars arranged in parallel in the lateral direction on the first surface of the substrate.
  • the aggregates are distributed within the fluid channel and have a porous structure, the pores within the porous structure having a diameter greater than zero but less than the particle size of the selected particles.
  • the substrate may be in various forms, such as a rectangular shape, a sheet shape, a polyhedral shape, a hemispherical shape, a spherical shape or Other irregular forms.
  • the "first surface” may be any non-specific suitable plane or curved surface on the substrate.
  • the fluid passage may be a through hole of any shape, and a fluid inlet thereof may be distributed on the surface of the base body, for example, a surface of the base body, which may be defined as a first surface, and a fluid outlet thereof may be distributed in the same
  • the other surface of the substrate different from the first surface may also be distributed on the first surface (of course In this case, the first surface should have a fluid blocking mechanism such that the fluid to be treated does not flow directly on the first surface to the fluid outlet.
  • the fluid The fluid outlet of the channel may also be distributed within the substrate, for example, when there is a cavity in the substrate to receive the treated fluid.
  • the fluid to be treated may be in a gas phase or a liquid phase, such as air, water, oil, and in some cases, may be a collection of fluid substances in a fluid state, or a molten state of certain substances, etc. .
  • the particles mainly refer to solid phase particles, but in some cases, may also be droplets or the like which are incompatible with the fluid (especially a liquid phase fluid).
  • the linear body may be linear, curved, preferably linear, which is advantageous for preparation, and can make the size of the hole in the formed porous structure more controllable.
  • the linear body may be solid or hollow, such as a nano- or micro-scale wire, tube, etc., but is not limited thereto.
  • the cross-sectional structure of the linear body in the radial direction may be regular or irregular, and may be, for example, a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, or the like.
  • the linear body is fixedly coupled at one end to an inner wall of the fluid passage and at the other end in a radial direction of the fluid passage.
  • the plurality of linear bodies intersect each other or are interwoven to form the porous structure.
  • the plurality of linear bodies are spaced apart from each other and arranged in parallel to form the porous structure.
  • the linear body is further distributed with a photocatalytic material or an antibacterial material.
  • the linear body may be composed entirely of a photocatalytic material or an antibacterial material.
  • the linear body has a diameter of 1 nm to 500 ⁇ m, preferably 1 nm to 50 ⁇ m.
  • the aforementioned linear body may adopt nanowires, which are small in diameter and can be densely distributed to form pores having a small pore diameter, thereby further maintaining a relatively high fluid flux while achieving a smaller particle size (micron).
  • the fluid of the particles even at the nanometer level, is processed.
  • the linear body may be a microwire (tube), a nanowire (tube), and particularly the latter, from these nanowires (tubes)
  • the formed array can have a superhydrophobic or superoleophobic structure, thereby allowing the fluid handling device to have a self-cleaning function.
  • the coating formed by a suitable low surface energy material known in the art may be provided on a part or the whole surface of the linear body and a part or the whole surface of the substrate, or the line may be directly formed by using a hydrophobic material.
  • the body and the matrix are such that they have superhydrophobic properties, self-cleaning properties and the like.
  • the linear body may be preferably selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
  • the linear body may be fixed to the surface of the substrate or to the substrate by external transfer, in-situ growth (for example, chemical growth, electrochemical growth) or deposition (for example, physical, chemical vapor deposition, electrodeposition) or the like. Surface growth is formed.
  • in-situ growth for example, chemical growth, electrochemical growth
  • deposition for example, physical, chemical vapor deposition, electrodeposition
  • the fluid inlet of the fluid channel has a regular or irregular shape, such as a polygon (rectangular, diamond or other), a circle or an ellipse, etc., which can be easily adjusted according to the needs of practical applications.
  • the substrate has opposing first and second surfaces, the fluid inlet of the fluid channel being distributed over the first surface of the substrate.
  • the first surface of the substrate is further distributed with a plurality of upright linear bodies spaced apart from each other, the plurality of upright linear bodies being disposed around the fluid channel.
  • the fluid treatment device can further include a fluid barrier having a surface (which can be named as a third surface) disposed opposite the first surface of the substrate, and One end of the plurality of upright linear bodies is fixedly disposed on the first surface of the base body, and the other end is fixedly connected to the third surface of the fluid blocking portion, wherein a distance between adjacent upright linear bodies is greater than 0 but less than the selected The particle size of the particles.
  • a fluid barrier having a surface (which can be named as a third surface) disposed opposite the first surface of the substrate, and One end of the plurality of upright linear bodies is fixedly disposed on the first surface of the base body, and the other end is fixedly connected to the third surface of the fluid blocking portion, wherein a distance between adjacent upright linear bodies is greater than 0 but less than the selected The particle size of the particles.
  • the fluid blocking portion may have various forms, and may be, for example, a sheet shape, a thin shell shape, a rectangular shape, a polyhedral shape, or the like.
  • the plurality of upright linear bodies, the fluid blocking portion and the base body cooperate to form a fluid passage through which the fluid to be treated can only enter the fluid inlet of the fluid passage distributed on the first surface of the base body.
  • the first treatment of the fluid is carried out, and then into the fluid channel distributed on the substrate, and the second treatment is performed by the aggregate of the linear body.
  • the arrangement of the fluid blocking portion may also be various, for example, it may be integrally spaced from the substrate, or may be partially connected to the substrate, and in some cases, may be associated with the substrate. It is formed by integral processing.
  • the fluid inlet of the fluid channel and the plurality of upright linear bodies are distributed within an orthographic projection of the fluid barrier portion of the first surface of the substrate.
  • the erected linear body has an aspect ratio of 4:1 to 200000:1.
  • the ratio of the distance between adjacent upright linear bodies to the length of the upright linear body is 1:4 to 1: 200000.
  • the upright linear body may have the same material, structure, and the like as the linear body described above.
  • the material selection range of each part in the fluid processing device is various, and may be an inorganic material or an organic material.
  • it may be selected from metals, silicon wafers, ceramics, polymers, and the like, and is not limited thereto.
  • the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
  • the surface of the substrate, particularly the first surface of the substrate, is further provided with a layer of functional material, and the material of the functional material layer includes a photocatalytic material, an antibacterial material, etc., and is not limited thereto.
  • a typical photocatalytic material may be titanium dioxide or the like.
  • some organic pollutants in the fluid may be photocatalyzed by ultraviolet light or the like. Degradation, achieving multiple purification of fluids.
  • a more typical antibacterial material may be a noble metal such as Au or Ag, which can synchronously kill bacteria, viruses and the like in the fluid during the processing of the fluid.
  • some or all of the components of the fluid treatment device may be made of a transparent material.
  • the fluid channel having a fluid inlet and a fluid outlet, the fluid inlet of the fluid channel being distributed over the first surface of the substrate;
  • the aggregate of the plurality of linear bodies having a porous structure for treating a fluid mixed with the selected particles flowing through the fluid channel, And the diameter of the pores in the porous structure is greater than 0 but smaller than the particle size of the selected particles.
  • the method of preparation may further comprise:
  • a plurality of linear bodies are formed on the first surface of the substrate and the inner wall of the fluid channel based on the seed layer.
  • the preparation method comprises: forming a plurality of linearly extending linear bodies on the inner wall of the fluid passage based on the seed layer, the plurality of linear bodies intersecting each other to form the porous structure.
  • the preparation method comprises: forming a plurality of upright linear bodies on the first surface of the substrate based on the seed layer, the plurality of vertical linear bodies being spaced apart from each other, and between adjacent vertical linear bodies The distance is greater than zero but less than the particle size of the selected particles.
  • the linear body and the upright linear body may have the same material, structure, and the like as the linear body.
  • Embodiments of the present invention provide a nasal plug type respirator, including:
  • a nasal plug and a filter chip at least one end of the nasal plug can be inserted into a nasal cavity of a user, and the nasal plug includes a gas passage communicating with the nasal cavity, and the filter chip is used to filter out the mixed airflow to be treated, a particle having a particle diameter larger than a set value, wherein the gas to be treated flows into the gas passage in the nasal plug after flowing through the filter chip;
  • a filter chip protection structure is used to protect the filter chip.
  • the filter chip protection structure comprises a first fixed hard filter and a second fixed hard filter, the filter chip being disposed on the first fixed hard filter and the second fixed Between hard filters.
  • the nasal plug respirator further includes a first filter fabric and/or a second filter fabric, the first filter fabric being distributed between the nasal plug and the filter chip, the filter chip being distributed Second between the filter fabric and the nasal plug.
  • the nasal plug respirator further includes a first detachable hard screen and/or a second detachable hard screen, the first detachable hard screen and the first The filter fabric is fixedly attached, and the second detachable hard screen is fixedly coupled to the second filter fabric.
  • the nasal plug is a lumbar drum type nasal plug which can be partially or wholly inserted into the nasal cavity of the human body.
  • the nasal plug respirator further includes a housing that is open at both ends, the nasal plug is detachably mounted at one end of the housing, and the filter chip is received in the housing.
  • the housing can further protect the filter chip, and on the other hand, it can accommodate the various components described above, so that the respirator is compact and firm.
  • the housing preferably uses a rigid housing.
  • the filter chip comprises:
  • a base having a first fluid passage, the first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed on the first surface of the base;
  • the protrusions spaced apart from each other, the protrusions extending continuously on the first surface of the base body in a lateral direction, a lower portion fixedly disposed on the first surface of the base body, and an upper portion having a cap extending continuously in the lateral direction a shape-shaped structure, the opposite sides of the hat-shaped structure are laterally extended, and an opening portion through which air can pass is formed between adjacent hat-shaped structures, and the diameter of the opening portion is greater than 0 but less than mixed a particle size of the selected particles in the air to be treated, wherein at least two of the raised portions are respectively disposed adjacent to opposite sides of the air inlet of the first fluid passage, and at least one The raised portion directly passes through the air inlet of the first fluid passage, thereby engaging a plurality of hat-shaped structures, a plurality of protrusions and the base body to form a second fluid communicating with the first fluid passage
  • the passage, and the air to be treated can only enter the first fluid passage through the second fluid passage.
  • At least two of the raised portions pass directly over the air inlet of the first fluid passage; and/or the plurality of raised portions are distributed in parallel at the base of the base On the surface.
  • the hat-shaped structure is integrally provided with the boss.
  • the hat-shaped structure may have an inverted trapezoidal cross-sectional structure.
  • the opening formed between the adjacent hat-shaped structures has a diameter of 1 nm to 50 ⁇ m.
  • the hat-shaped structure has a height of 50 nm to 200 ⁇ m.
  • the distance between adjacent convex portions is from 0.1 ⁇ m to 100 ⁇ m.
  • the raised portion has a height of 0.1 ⁇ m to 400 ⁇ m and a width of 0.1 ⁇ m to 100 ⁇ m.
  • the first fluid passage has a pore diameter of 1 ⁇ m to 1 mm.
  • the thickness of the substrate is 1 ⁇ m or more.
  • At least the surface of any of the raised portion, the cap-shaped structure and the substrate is provided with a layer of a photocatalytic functional material and/or a layer of an antimicrobial functional material.
  • At least a portion of at least one of the raised portion, the cap-shaped structure and the base is a transparent structure.
  • the filter chip comprises:
  • a base having a first fluid passage, the first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed on the first surface of the base;
  • a porous structure formed by intersecting a plurality of linear bodies to form a second fluid passage with the first surface of the base body, wherein the plurality of linear bodies are fixedly connected to the base body at one end, and the porous structure has a hole
  • the diameter is greater than zero but less than the particle size of the selected particles that are intermixed with the air to be treated, and the air to be treated can only enter the first fluid passage through the second fluid passage.
  • one end of the plurality of linear bodies is fixedly connected to the first surface of the base body and is distributed around the air inlet of the first fluid passage.
  • the air filter chip further includes a plurality of protrusions spaced apart from each other, the protrusions being fixedly disposed on the first surface of the base body and laterally on the first surface of the base body Continuously extending upwardly, wherein at least two protrusions are respectively disposed adjacent to opposite sides of the air inlet of the first fluid passage, and at least one protrusion is directly from the air inlet of the first fluid passage Two or more linear bodies are fixedly connected to the convex portion.
  • the plurality of linear bodies connected to one of the bosses and the plurality of linear bodies connected to the other of the bosses adjacent to the bosses intersect each other.
  • the plurality of protrusions are distributed in parallel on the first surface of the substrate.
  • the shape of the convex portion includes an elongated shape or a sheet shape, and is not limited thereto.
  • the plurality of protrusions are uniformly distributed or non-uniformly distributed on the first surface of the substrate.
  • the raised portion has a width of 0.1 ⁇ m to 100 ⁇ m and a height of 0.1 ⁇ m to 400 ⁇ m.
  • the distance between adjacent convex portions is from 0.1 ⁇ m to 100 ⁇ m.
  • the surface of the protrusion is further provided with a layer of photocatalytic functional material and/or a layer of antibacterial functional material.
  • At least a part of the base body, the plurality of linear bodies, and the plurality of raised portions are transparent structures.
  • the linear body has a diameter of from 1 nm to 50 ⁇ m.
  • the distance between one end of any one of the linear bodies and one end of the other linear body adjacent to the linear body is from 1 nm to 50 ⁇ m.
  • the linear body has a length of 50 nm to 200 ⁇ m.
  • At least the surface of the linear body is further distributed with a photocatalytic material or an antibacterial material.
  • At least a part of at least one of the base body and the plurality of linear bodies is a transparent structure.
  • the linear body is linear.
  • the air inlet of the first fluid passage has a regular or irregular shape, and the regular shape includes a polygon, a circle or an ellipse.
  • the first fluid passage has a pore diameter of 1 ⁇ m to 1 mm.
  • the thickness of the substrate is 1 ⁇ m or more.
  • the filter chip further includes a plurality of beams distributed in parallel on the first surface of the substrate, the beams extending continuously in a lateral direction on the first surface of the substrate, wherein at least two beams are respectively associated with the
  • the air inlets of the first fluid passage are disposed adjacent to opposite sides of the air inlet, at least one beam directly passes through the air inlet of the first fluid passage; and any of the beams is distributed with a plurality of linear bodies.
  • One end of at least a portion of the plurality of linear bodies is fixed to the surface of the beam, and the other end extends obliquely away from the direction of the beam and/or continuously on a plane parallel to the first surface of the substrate
  • the porous structure is formed by extending and intersecting a plurality of linear bodies distributed on another beam adjacent to the one of the beams.
  • At least two beams pass directly over the air inlet of the first fluid passage.
  • the linear body includes any one or a combination of two or more of carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, and Au nanowires, but Not limited to this.
  • the filter chip comprises:
  • a base having a first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed in a first region of the first surface of the base;
  • An air blocking portion having a second surface disposed opposite the first surface of the base body for blocking an air inlet of the air to be treated directly entering the first fluid passage;
  • the convex portion is fixedly disposed at one end in a second region of the first surface of the base body, and the other end is fixedly connected to the second surface of the air blocking portion, wherein adjacent
  • the distance between the raised portions is greater than zero but less than the particle size of the selected particles that are intermingled with the air to be treated, the second region of the first surface of the substrate being contiguous with the first region, such that the plurality of convexities
  • the starting portion, the air blocking portion and the base body cooperate to form a second fluid passage, and the air to be treated can only enter the first fluid passage through the second fluid passage.
  • the plurality of protrusions are disposed around the air inlet of the first fluid passage.
  • a plurality of protrusions are also disposed in the third region of the first surface of the base body, and the second region is disposed between the third region and the first region.
  • the first fluid passage has a pore diameter of 1 ⁇ m to 1 mm.
  • the thickness of the substrate is 1 ⁇ m or more.
  • the air blocking portion has a thickness of 0.5 ⁇ m to 200 ⁇ m.
  • the surface of the convex portion is further provided with a layer of functional material, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material.
  • At least part of the components of the air filter chip are at least partially transparent.
  • a third area of the first surface of the substrate is disposed around the second area.
  • first region and the second region of the first surface of the substrate are distributed in an orthographic projection of the air blocking portion on the first surface of the substrate.
  • the air filter chip further includes at least one support body, one end of the support body is fixedly connected to the base body, and the other end is fixedly connected to the air blocking portion.
  • the plurality of raised portions of the third region distributed over the first surface of the substrate are arranged to form a micron or nanoscale array structure having superhydrophobic or superoleophobic properties.
  • the air filter chip includes two or more of the support bodies, and the two or more support bodies are symmetrically distributed around the air inlet of the first fluid passage.
  • the air inlet of the first fluid passage is provided with more than one supporting beam, and the supporting beam is fixedly connected with the air blocking portion.
  • the raised portion is any one of a linear, columnar, sheet-like, tubular, tapered, and frustum-like structure that is standing, and is not limited thereto.
  • the lateral section of the convex portion has a regular or irregular shape, and the regular shape includes a polygon, a circle, or an ellipse, but is not limited thereto.
  • the plurality of protrusions are uniformly distributed or non-uniformly distributed on the first surface of the substrate.
  • the air inlet of the first fluid passage has a regular or irregular shape, and the regular shape includes a polygon, a circle or an ellipse, but is not limited thereto.
  • the raised portion is a linear protrusion having an aspect ratio of 4:1 to 200000:1.
  • the ratio of the distance between adjacent convex portions to the length of the convex portion is 1:4 to 1:200,000.
  • the raised portion is an upright microwire or a nanowire having a diameter of 1 nm to 50 ⁇ m, a length of 50 nm to 200 ⁇ m, and a distance between adjacent convex portions of 1 nm to 50 ⁇ m.
  • the filter chip comprises:
  • a base having a first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed in a first region of the first surface of the base;
  • An air blocking portion having a second surface disposed opposite the first surface of the base body for blocking an air inlet of the air to be treated directly entering the first fluid passage;
  • the opening of the opening has a diameter greater than 0 but less than the particle size of the selected particles mixed in the air to be treated, and the upper end of the raised portion is sealingly connected to the first surface of the base, and the partial portion of the lower end is
  • the second surface of the air blocking portion is sealingly connected such that more than one groove between the plurality of convex portions and the air blocking portion cooperate with the base body to form a second fluid passage, and the air to be treated can pass only the first The two fluid passages enter the first fluid passage.
  • the second region of the first surface of the substrate is disposed around the first region.
  • a partial region of the second end of the convex portion and an air inlet of the first fluid channel are distributed in an orthographic projection formed on the first surface of the substrate by the air blocking portion.
  • the shape of the convex portion includes an elongated shape or a sheet shape, but is not limited thereto.
  • the plurality of protrusions are uniformly distributed or non-uniformly distributed on the first surface of the substrate.
  • the air inlet of the first fluid passage has a regular or irregular shape, and the regular shape includes a polygon, a circle or an ellipse, but is not limited thereto.
  • the raised portion has a width of 1 nm to 50 ⁇ m and a height of 50 nm to 200 ⁇ m.
  • the size of the opening of the groove formed between the adjacent convex portions is 1 nm to 50 ⁇ m.
  • the first fluid passage has a pore diameter of 1 ⁇ m to 1 mm.
  • the thickness of the substrate is 1 ⁇ m or more.
  • the air blocking portion has a thickness of 0.5 ⁇ m to 200 ⁇ m.
  • the surface of the convex portion is further provided with a layer of functional material, and the material of the functional material layer comprises photocatalysis. Material or antibacterial material.
  • At least a part of at least one of the base body, the air blocking portion, and the convex portion is a transparent structure.
  • the filter chip comprises:
  • a base having a first fluid passage, the first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed on the first surface of the base;
  • the protrusions being fixedly disposed on the first surface of the base body and extending continuously on the first surface of the base body in a lateral direction, wherein between the adjacent protrusions Forming a groove through which air can pass, the opening of the groove having a diameter greater than 0 but smaller than the particle size of the selected particles mixed in the air to be treated, and wherein at least two of the raised portions are respectively Two opposite sides of the opposite sides of the air inlet of the first fluid passage are disposed adjacent to each other, and at least one convex portion directly passes through the air inlet of the first fluid passage, so that the plurality of convex portions and the base body
  • the interfitting forms a second fluid passage in communication with the first fluid passage, and the air to be treated can only enter the first fluid passage through the second fluid passage.
  • the filter chip further includes: an air blocking portion having a second surface disposed opposite to the first surface of the base body, wherein an air inlet of the first fluid passage is distributed in the air blocking portion
  • the plurality of protrusions are distributed in parallel on the first surface of the substrate.
  • the size of the opening of the groove formed between the adjacent convex portions is 1 nm to 50 ⁇ m.
  • the first fluid passage has a pore diameter of 1 ⁇ m to 1 mm.
  • the thickness of the substrate is 1 ⁇ m or more.
  • the surface of the convex portion is further provided with a layer of functional material, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material.
  • the air blocking portion has a thickness of 0.5 ⁇ m to 200 ⁇ m.
  • At least a part of at least one of the base body, the air blocking portion, and the convex portion is a transparent structure.
  • the filter chip comprises:
  • An aggregate of a plurality of linear bodies for treating air flowing through the fluid passage mixed with selected particles ;
  • the aggregates are distributed within the fluid channel and have a porous structure, the pores within the porous structure having a diameter greater than zero but less than the particle size of the selected particles.
  • one end of the linear body is fixedly connected to the inner wall of the fluid passage, and the other end is along the fluid passage Radial extension.
  • the plurality of linear bodies are crossed or interwoven to form the porous structure.
  • the plurality of linear bodies are spaced apart from each other and arranged in parallel to form the porous structure.
  • the base body has a first surface and a second surface opposite to each other, and an air inlet of the fluid passage is distributed on the first surface of the base body.
  • first surface of the base body is further distributed with a plurality of vertical linear bodies spaced apart from each other, and the plurality of vertical linear bodies are disposed around the fluid passage.
  • the filter chip further includes an air blocking portion having a third surface disposed opposite to the first surface of the base body, and one end of the plurality of upright linear bodies is fixedly disposed on the base body The first surface, the other end is fixedly coupled to the third surface of the air barrier, wherein the distance between adjacent upright linear bodies is greater than zero but less than the particle size of the selected particles.
  • the first surface of the base body is further provided with a layer of functional material, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material.
  • At least some of the components of the air filter chip have a transparent structure.
  • the air inlet of the fluid passage has a regular or irregular shape, and the regular shape includes a polygon, a circle, or an ellipse, but is not limited thereto.
  • the fluid passage has a pore diameter of from 1 ⁇ m to 1 mm.
  • the thickness of the substrate is 1 ⁇ m or more.
  • the air inlet of the fluid passage and the plurality of upright linear bodies are distributed in an orthographic projection of the air blocking portion on the first surface of the base body.
  • the erected linear body has an aspect ratio of 4:1 to 200000:1.
  • the ratio of the distance between adjacent upright linear bodies to the length of the upright linear bodies is 1:4 to 1:200,000.
  • the linear body has a diameter of from 1 nm to 500 ⁇ m.
  • the linear body is selected from the group consisting of nanowires or nanotubes.
  • At least the surface of the linear body is further distributed with a photocatalytic material or an antibacterial material.
  • the linear body includes any one or a combination of two or more of carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, and Au nanowires, but Not limited to this.
  • a fluid processing device The base body 101 has a first surface 1011 and a second surface 1012 opposite to each other, and a plurality of through holes 102 as fluid passages are disposed in the base body 101, and the first surface is provided with a plurality of An array of beams 103 (named as raised portions) arranged in parallel, wherein a plurality of beams 103 are directly traversed from the through holes 102 and a plurality of beams 103 are distributed on both sides of the through holes 102, wherein the beams 103
  • the top is also distributed with a hat-shaped structure 104 (abbreviated as a cap layer), and each cap layer also continuously extends along the transverse direction in the transverse direction, and forms an array of hat-shaped structures, and the fluid to be treated cannot bypass the array of the above-mentioned hat-shaped structures. Directly enter the through hole 102.
  • an opening portion (which may be referred to as a micro-flow channel) having a selected size can be formed, and the particles of different particle size ranges in the fluid can be removed, in particular,
  • the pitch of these cap structures is controlled at the nanometer level, very minute particles (nanoscale particles) in the fluid can be removed.
  • the foregoing beams may be strip-shaped and have a large width and thickness, so that the beams can have higher mechanical strength, so that they can form better support for the hat-shaped layer, and the spacing of the beams can be larger to provide a comparison. Large fluid flux.
  • the cap layer may also have a large thickness, and both sides are laterally extended so that the spacing of adjacent cap layers can be made small, for example, as low as 1 nm, so that the trapping of the fluid to be treated is minimal. particle.
  • the cap layer may be integrally provided with the convex portion, for example, may be directly formed on the upper portion of the convex portion by evaporation, deposition, growth, or the like (typically, such as metal sputtering, MOCVD, PECVD, electrochemical deposition, etc.), and
  • the hat-shaped structure may also continuously extend in the lateral direction with the convex portion, so that an opening portion extending continuously in the lateral direction is formed between the adjacent hat-shaped structures, so that on the one hand, the selection of the fluid mixed in the fluid to be treated can be ensured.
  • the treatment of the fixed particles also maintains a high throughput, which reduces the processing difficulty and saves costs.
  • the material of the cap layer may be selected from an insulating dielectric material such as silicon oxide, silicon nitride oxide, borophosphosilicate glass, or the like, or a semiconductor material such as Si, ZnO, GaN, TiO 2 , InN, or the like, or a metal material such as Ag or Au. , Al, Ni, Cr, Ti, etc., but are not limited thereto.
  • an insulating dielectric material such as silicon oxide, silicon nitride oxide, borophosphosilicate glass, or the like, or a semiconductor material such as Si, ZnO, GaN, TiO 2 , InN, or the like, or a metal material such as Ag or Au. , Al, Ni, Cr, Ti, etc., but are not limited thereto.
  • the base body 101 can have a large thickness, so that it can form a good support for the aforementioned micro/nano-array array, and can further enhance the mechanical strength of the fluid processing device, and make the fluid processing device withstand voltage. It is resistant to bending, impact and impact, so that it can be applied in a variety of environments without damage. For example, it can be applied to the treatment of high-pressure, high-speed fluids, which is unmatched by existing porous membranes. .
  • each part (101, 102, 103, 104) of the fluid processing device is diverse, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, or a semiconductor. , glass, polymer, etc.
  • the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
  • the fluid treatment device of the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain a good fluid Ability.
  • the fluid containing the impurity particles enters the array of the aforementioned hat-shaped structure, wherein the particle diameter is larger than a certain value.
  • the particles or some droplets that are incompatible with the fluid, such as water droplets in the air or water droplets in the oil) are blocked outside the array of the aforementioned hat-shaped structures, after which the fluid reaches through the opening between the respective hat-shaped structures The entrance of the through hole 102 is then re-entered into the through hole 102 to effect purification of the fluid and/or enrichment recovery of the desired particles (droplets).
  • the gap of each of the cap layers may be 1 nm to 50 ⁇ m, and the height of the cap layer may be 50 nm to 200 ⁇ m.
  • the through hole may have a diameter of 1 ⁇ m to 1 mm, and the substrate may have a thickness of >1 ⁇ m.
  • the height of the beam may be 0.1 ⁇ m to 400 ⁇ m
  • the width may be 0.1 ⁇ m to 100 ⁇ m
  • the distance between the beams may be 0.1 ⁇ m to 100 ⁇ m.
  • the longitudinal section of the opening formed before the adjacent hat-shaped layer and the adjacent beam may be regular or irregular, and may be, for example, trapezoidal, polygonal (triangle, quadrilateral or other), circular, elliptical, star, etc. Wait.
  • the aforementioned beam and cap layer may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate.
  • the shape of the through hole 102 may be various, and may be, for example, a circle, a square, a rectangle, or the like.
  • a fluid processing apparatus may have a structure similar to any of the foregoing embodiments, except that a photocatalytic material may be disposed on the beam, the cap layer, and the surface of the substrate. Floor.
  • a photocatalytic material may be disposed on the beam, the cap layer, and the surface of the substrate.
  • Floor When the fluid is treated by a fluid processing device including a photocatalytic material layer, if it is supplemented with ultraviolet light or the like, photocatalytic degradation of some organic pollutants in the fluid may be performed to achieve multiple purification of the fluid.
  • the beam and the base may be made of a transparent material.
  • the hat layer and the beam may be made entirely of a transparent material, such as light.
  • a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
  • photocatalytic material layer in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atom.
  • Layer deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the fluid processing device.
  • the structures, arrangement forms, materials, and the like of the base, the cap layer, the beam, the through hole, and the like used in the embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • a fluid treatment device may have a structure similar to any of the previous embodiments, except that an antibacterial material layer may be disposed on the beam, the cap layer, and the surface of the substrate.
  • a fluid processing device comprising a layer of antimicrobial material, bacteria, viruses, etc. in the fluid can be simultaneously killed during the processing of the fluid to achieve multiple purification of the fluid.
  • the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
  • antibacterial material layer in order to form the antibacterial material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer). Deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atomic layer.
  • Deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the antimicrobial material layer can be controlled at the nanometer level to minimize its effect on the fluid flux of the fluid treatment device.
  • the structures, arrangement forms, materials, and the like of the base, the cap layer, the beam, the through hole, and the like used in the embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • the fluid processing apparatus of the present application can be prepared by physical or chemical methods, and may be, for example, a chemical growth method, a physical processing method, or the like, particularly a MEMS (Micro Electromechanical Systems) method.
  • MEMS Micro Electromechanical Systems
  • the preparation process of the fluid processing apparatus in this embodiment may include the following steps:
  • S1 providing a substrate (such as a silicon wafer);
  • S2 lithographically patterning micro-nano-scale lines on one side surface of the substrate (designated as the first surface), ie forming a patterned photoresist mask;
  • the etching method used in the foregoing steps may also be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming the patterned photoresist mask includes a photolithography technique, a nanosphere mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
  • the preparation process of the fluid processing device of the present application is simple and controllable, and is suitable for mass production in large quantities, and the obtained fluid processing device has at least the following advantages: (1) large flux and small flow resistance; (2) physical filtration It can effectively remove particles larger than nano-slit; (3) straddle beam and large substrate thickness can ensure high mechanical strength; (5) can be (ultrasonic) cleaning, multiple use.
  • a fluid processing apparatus in a second embodiment of the present application, includes a base 201 having a first surface 2011 and a second surface 2012 opposite to each other, and the base 201 A plurality of through holes 204 are provided as fluid passages.
  • the first surface 2011 is provided with a plurality of cross beams 203 arranged in parallel, the cross beams 203 continuously extending in a lateral direction on the first surface, and a plurality of cross beams 203 are continuously traversed from the through holes 204, It can therefore also be regarded as a spanning beam 203.
  • Each of the beams 203 is distributed with a plurality of nanowires 202.
  • One end of the plurality of nanowires 202 is fixed to the surface of the beam 203, and the other end is obliquely extended away from the beam 203. It can be considered to be laterally extended and intersects with a plurality of nanowires 202 distributed on another beam adjacent to either of the beams 203 to form the porous structure 205.
  • the porous structure 205 is viewed in a plan view to cover the mesh structure of the through holes 204.
  • the diameter of the pores in the porous structure 205 is greater than zero but less than the particle size of selected particles that are intermixed within the fluid to be treated. Referring to FIG.
  • porous structure 205 formed by the intersection of the plurality of nanowires 202 cooperates with the first surface 2011 of the base 201 to form another fluid passage, so that the fluid to be treated 206 can pass only the other A fluid passage enters the through hole 204.
  • the nanowires can be densely arranged on the first surface of the substrate, by adjusting the spacing between the beams and the nanowires. Density, length, direction of extension, etc., can be used to remove particles of different particle size ranges in the fluid.
  • the pore size formed by the intersection of these nanowires is controlled at the nanometer level. Not only can the tiny particles in the fluid be removed, but also because the nanowire itself has a very small diameter, it can also control the resistance to the fluid to a very low level and form a large fluid flux, which is far superior to the present.
  • the arrangement of the aforementioned nanowires is designed to be super-hydrophobic structure and super-oleophobic structure, which can not only remove particles in the fluid, but also pass The self-cleaning action prevents the blocked particles from accumulating in the functional areas of the fluid handling device (the nanowire array surface), preventing the fluid handling device from failing after prolonged use.
  • the beam 203 may be distributed at a suitable density on the first surface 2011 of the base 201 to
  • the fluid handling device has as high a fluid handling flux as possible.
  • the beam 203 can have a suitable width such that the beam 203, while having sufficient mechanical strength, can also avoid excessive effects on the flux of the fluid treatment device.
  • the beam may have a height of 0.1 ⁇ m to 100 ⁇ m, a width of 0.1 ⁇ m to 400 ⁇ m, and a pitch between the beams of 0.1 ⁇ m to 100 ⁇ m.
  • the base 201 can have a larger thickness and the beam 203 can have a larger height, so that it can form a better support for the nanowire array, and can further enhance the mechanical strength of the fluid processing device.
  • the fluid processing device is resistant to pressure, bending, impact, and impact, so that it can be applied in various environments without damage, for example, it can be applied to high-pressure, high-speed fluid processing. Existing porous membranes and the like are unattainable.
  • each part (201, 202, 203) of the fluid processing device is various, and may be an inorganic material or an organic material. When these portions are all selected to use inorganic materials, the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
  • the fluid treatment device of the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
  • the fluid containing the foreign particles enters the porous structure 205, wherein the particles having a particle size larger than a certain value (or some liquid incompatible with the fluid, such as air)
  • the water droplets or the water droplets in the oil are blocked outside the porous structure 205, after which the fluid reaches the entrance of the through hole 204 via the gap between the nanowires and then enters the through hole 204, thereby purifying the fluid and/or Enrichment recovery of the desired particles (droplets).
  • the nanowires 202 may have a diameter and a pitch of 1 nm to 50 ⁇ m and a length (height) of 50 nm to 200 ⁇ m.
  • the through hole 204 may have a diameter of 1 ⁇ m to 1 mm.
  • the thickness of the substrate may be 1 ⁇ m or more.
  • the transverse cross-sectional structure of the aforementioned nanowires may be regular or irregular, and may be, for example, a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, or the like.
  • the aforementioned nanowires 202 may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate 201.
  • the array formed by these nanowires 202 can have a superhydrophobic structure, thereby allowing the fluid handling device to have a self-cleaning function.
  • the aforementioned nanowires 202 may preferably be selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
  • the foregoing nanowires 202 may be fixed to the surface of the substrate or grown on the surface of the substrate by external transfer, in-situ growth (eg, chemical growth, electrochemical growth) or deposition (eg, physical, chemical vapor deposition, electrodeposition). .
  • the shape of the aforementioned through holes 204 may be various, and may be, for example, a circle, a square, a rectangle, a diamond, a polygon, or other regular or irregular shapes.
  • the nanowires 202 may be formed of a photocatalytic material or a material having an antibacterial or bactericidal function, or the nanowires 202 may be surface covered with a photocatalytic material or have sterilization. a coating formed of an antibacterial material.
  • the nanowires 202 may adopt nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO2 nanowires, and are capable of degrading organic substances in the fluid under light-assisted illumination.
  • the nanowires 202 may employ Ag nanowires, Au nanowires, or the like to kill bacteria, viruses, and microorganisms in the fluid.
  • the first surface 2011 of the base 201 is further provided with a photocatalytic material layer or an antibacterial material layer or the like.
  • photocatalytic degradation of some organic pollutants in the fluid may be performed to achieve multiple purification of the fluid.
  • part or all of the substrate, the protrusion, and the nanowire may be made of a transparent material.
  • a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
  • photocatalytic material layer in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atom.
  • Layer deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the fluid processing device.
  • the fluid processing device including the antibacterial material layer, bacteria, viruses, and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
  • the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
  • antibacterial material layer in order to form the antibacterial material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer). Deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atomic layer.
  • Deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the antimicrobial material layer can be controlled at the nanometer level to minimize its effect on the fluid flux of the fluid treatment device.
  • the fluid processing device of the present application may be prepared by physical or chemical methods, for example, may be a chemical growth method, Processing methods, etc., in particular, MEMS (Microelectromechanical Systems) method.
  • MEMS Microelectromechanical Systems
  • a preparation process of a fluid processing apparatus may include the following steps:
  • S1 depositing a seed layer for nanowire growth on a first surface of a substrate such as a silicon wafer.
  • a patterned photoresist mask is disposed on the seed layer, which comprises lithographic lines on the micro-nano scale.
  • S6 growing nanowires on the seed layer, controlling the growth conditions of the nanowires, making the nanowires have a certain lateral growth ratio, and forming a cross-grid of micro-nano scale.
  • the etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming the patterned (nano-pattern) photoresist mask includes a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
  • the beam 203, the via 204, and the like may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
  • the preparation process of the fluid processing apparatus of the present embodiment is simple and controllable, and is suitable for mass production in large quantities.
  • a fluid processing apparatus in a third embodiment of the present application, includes a base 301 having a first surface 301a and a first of the base 301
  • the region 3011 (the region enclosed by the broken line in the figure) is distributed with a plurality of through holes 304 as fluid passages, and the first surface is provided with a plurality of vertical micro/nano wires/tubes 303 (ie, micron-sized wires, micrometers)
  • the top of the wire/tube 303 is also connected with a fluid blocking portion 302 disposed above the fluid inlet of the through hole 304 so that the fluid to be treated cannot bypass the aforementioned micro/nano wire/tube array.
  • the fluid blocking portion 302 has a second surface 302b disposed opposite the first surface 3011.
  • a plurality of vertical micro/nano wires/tubes 303 may also be densely distributed in the remaining area 3013 of the first surface 3011 (which may be named as the third area).
  • arrows with dashed lines show the direction of travel of the fluid.
  • the micro/nano wires/tubes have a large aspect ratio (or aspect ratio), so that the micro/nano wires/tubes are dense.
  • the arrangement is arranged on the first surface of the substrate, and by adjusting the spacing of the micro/nano wires/tubes, the particles of different particle size ranges in the fluid can be removed, in particular, when the nanowires are used/
  • By controlling the spacing between these nanowires/tubes at the nanometer level not only can the tiny particles in the fluid be removed, but also because the nanowire/tube itself has a very small diameter, it can also be made resistant to fluids. It is controlled at a very low level and forms a large fluid flux, which is far superior to existing porous membranes, fluid flow devices based on lateral flow channels, and the like.
  • the super-hydrophobic structure and the super-oleophobic structure can be formed, which can not only remove particles in the fluid, but also By self-cleaning action, the blocked particles cannot accumulate in the functional areas of the fluid treatment device (micro/nanowire/tube array surface), avoiding failure of the fluid treatment device after prolonged use.
  • the base 301 may have a larger thickness to form a better support for the micro/nano wire/tube array, and further enhance the mechanical strength of the fluid processing device, so that the fluid processing device It is resistant to pressure, bending, impact and impact, which makes it suitable for use in a variety of environments without damage. For example, it can be applied to high-pressure, high-speed fluids. This function is impossible for existing porous membranes. Enterprise.
  • the fluid blocking portion may be in the form of a sheet, and the thickness and the like may be adjusted according to actual application requirements.
  • each part (301, 302, 303, 304) of the fluid processing device is diverse, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, or a semiconductor. , glass, polymer, etc.
  • the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
  • the fluid treatment device of the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
  • the fluid containing the impurity particles enters the array of the micro/nano wires 103, wherein the particles having a particle diameter larger than a certain value (or some fluids incompatible with the fluid) Drops, such as water droplets in the air or water droplets in the oil, are blocked outside of the aforementioned micro/nanowire/tube array, after which the fluid reaches the entrance of the via 304 via the gap between each micro/nano wire/tube. Access to the through holes 304 allows for purification of the fluid and/or enrichment recovery of the desired particles (droplets).
  • the micro/nano wires may have a diameter of 1 nm to 50 ⁇ m, and the length (height) h 1 may be 50 nm to 200 ⁇ m, adjacent to each other.
  • the distance between the nanowires may be from 1 nm to 50 ⁇ m.
  • the through hole 104 may have a diameter w of 1 ⁇ m to 1 mm.
  • the thickness h 2 of the substrate may be 1 ⁇ m or more.
  • the thickness h 3 of the fluid blocking portion may be from 0.5 ⁇ m to 200 ⁇ m.
  • the transverse cross-sectional structure of the aforementioned micro/nano wires may be regular or irregular.
  • a polygon triangle, quadrilateral or other
  • a circle a circle
  • an ellipse a star
  • the like such as a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, and the like.
  • the aforementioned micro/nanowires may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate.
  • the average pitch of adjacent micro/nano wires is between 1 nm and 50 ⁇ m.
  • the shape of the through hole 304 and the fluid blocking portion 302 may be various, for example, may be circular, square, Rectangular or other shape.
  • a fluid processing apparatus includes a base 401 having a first surface and a first surface opposite to the first surface a three-surface, and the substrate 401 is provided with a plurality of through holes 404 as fluid passages, and the first surface is provided with an array of a plurality of vertical micro/nano wires/tubes 403 distributed around the through holes 404
  • the top of the plurality of micro/nano wires/tubes 403 is also connected with a fluid blocking portion 402 disposed above the fluid inlet of the through hole 404, so that the fluid to be treated cannot bypass the aforementioned micro/ The nanowire/tube array directly enters the via 404.
  • more than one, for example, four support bodies 405 are distributed symmetrically or asymmetrically around the through hole 404, and the support body 405 can also increase the support of the fluid blocking portion 402 to realize the fluid.
  • the sealing portion and the base body are more firmly and stably matched, and the micro/nano wire/tube array distributed between the fluid blocking portion and the base body can be effectively protected from external forces due to the fluid blocking portion and/or the base body. After the action, the micro/nanowire/tube 403 is collapsed and damaged due to the extrusion of the aforementioned micro/nanowire/tube array.
  • the support body may be in various forms, for example, may have a rectangular, trapezoidal, stepped longitudinal section (the longitudinal direction herein may be understood as a direction perpendicular to the first surface of the base body), and the like, and is not limited thereto.
  • the support body may be a boss or the like that protrudes upward from an edge portion of the through hole 204, and an upper end thereof is connected to the fluid blocking portion 402.
  • the number, diameter, distribution density and the like of the support body can be adjusted according to actual needs, but the space of the first surface of the base body should be occupied as little as possible to avoid the fluid flux to the micro/nano wires. Great impact.
  • the structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in the fourth embodiment may be the same as or similar to those described above, and thus will not be described herein. .
  • a fluid processing apparatus includes a base 501 having a first surface and a first surface opposite to the first surface a three-surface, and the substrate 501 is distributed with a plurality of through holes 504 as fluid passages, and the first surface is provided with an array of a plurality of vertical micro/nano wires/tubes 503 distributed around the through holes 504
  • the top of the plurality of micro/nano wires/tubes 503 is also connected with a fluid blocking portion 502 disposed above the fluid inlet of the through hole 504, so that the fluid to be treated cannot bypass the aforementioned micro/ The nanowire/tube array directly enters the via 504.
  • the support beam 505 can also increase the support of the fluid blocking portion 502, thereby achieving a more stable and stable cooperation between the fluid blocking portion and the base body, and Effectively protecting the micro/nanowire/tube array distributed between the fluid barrier and the substrate, avoiding the extrusion of the micro/nanowire/tube array by the fluid barrier and/or the substrate after being subjected to an external force
  • the resulting micro/nano wire/tube 503 collapses, is damaged, and the like.
  • the support beam may be in various forms, such as an arch bridge shape, etc., and is not limited thereto. Further, the support beam may also cooperate with other support bodies, such as the support body described in the fourth embodiment.
  • the number, size, distribution density and the like of the support beam can be adjusted according to actual needs, but the fluid inlet of the through hole should be blocked as little as possible to avoid causing a large fluid flow to the fluid processing device. influences.
  • the structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in the fifth embodiment may be the same as or similar to those described above, and thus will not be described herein. .
  • a fluid processing apparatus includes a base 601 having a first surface 6011 and a first surface opposite to the first surface. a three-surface 6012, and the base 601 is provided with a plurality of through holes 604 as fluid passages, and the first surface is provided with an array of a plurality of vertical nano-pillars 603, and a plurality of distributed around the through-holes 604
  • the top of the nano-pillar 603 is also connected with a fluid blocking portion 602 disposed above the fluid inlet of the through-hole 604, so that the fluid to be treated cannot directly bypass the aforementioned array of nano-pillars and directly enter the through-hole. Hole 604.
  • a photocatalytic material layer 605 is further disposed on the surface of the nano-pillar 603 and the first surface of the base 601.
  • the fluid processing device including the photocatalytic material layer 605 if it is supplemented by ultraviolet light or the like, some organic pollutants in the fluid may be photocatalyzed to achieve multiple purification of the fluid.
  • part or all of the fluid blocking portion, the base body, and the convex portion may be made of a transparent material.
  • the fluid barrier may be made entirely of a transparent material, such as light.
  • a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
  • photocatalytic material layer 605 In order to form the photocatalytic material layer 605, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, Atomic layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, Atomic layer deposition, etc.
  • sputtering etc., and are not limited thereto.
  • the thickness of the photocatalytic material layer 605 can be controlled at the nanometer level to minimize its influence on the fluid flux of the fluid processing device.
  • the structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in the sixth embodiment may be the same as or similar to those described above, and thus will not be described herein. .
  • a fluid processing apparatus includes a base 701 having a first surface 7011 and a first surface opposite to the first surface. a three-surface 7012 face, and the base body 701 is provided with a plurality of through holes 704 as fluid passages, and the first surface is provided with an array of a plurality of vertical nano-pillars 703, which are distributed around the through-holes 704
  • the top of the root nano-pillar 703 is also connected with a fluid blocking portion 702 disposed above the fluid inlet of the through-hole 704, so that the fluid to be treated cannot directly bypass the aforementioned array of nano-pillars and directly enter the Through hole 704.
  • an antibacterial material layer 705 is further disposed on the surface of the nano-pillar 703 and the first surface of the base 701.
  • bacteria, viruses, and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
  • the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
  • the antibacterial material layer 705 in order to form the antibacterial material layer 705, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atom.
  • Layer deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the antimicrobial material layer 705 can be controlled at the nanometer level to minimize its effect on the fluid flux of the fluid treatment device.
  • the structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in the seventh embodiment may be the same as or similar to those described above, and thus will not be described herein. .
  • the fluid processing apparatus of the present application can be prepared by physical or chemical methods, and may be, for example, a chemical growth method, a physical processing method, or the like, particularly a MEMS (Micro Electromechanical Systems) method.
  • MEMS Micro Electromechanical Systems
  • a preparation process of a fluid processing apparatus may include the following steps:
  • S1 providing a patterned photoresist mask on one side surface (defined as the first surface a) of the substrate (for example, a silicon wafer);
  • S3 coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between the vertical nanowires with an organic substance and/or an inorganic substance to form a sacrificial layer;
  • the etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming the patterned (nano-pattern) photoresist mask includes: photolithography technology, nano-spherical mask technology, nano (metal) particle mask technology, etc., and is not limited thereto. .
  • the vertical nanowire array can be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
  • the filled soluble organic matter may be a photoresist or the like or a corrodible inorganic substance such as metal, SiO 2 , silicon nitride or the like.
  • the slots may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
  • a preparation process of a fluid processing apparatus may include the following steps:
  • S1 growing on a first surface of a substrate (eg, a silicon wafer) to form a plurality of vertical nanowires/tubes spaced apart from each other;
  • a substrate eg, a silicon wafer
  • S2 coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between each vertical nanowire/tube with an organic substance and/or an inorganic substance to form a sacrificial layer;
  • S4 etching the sacrificial layer to expose a plurality of vertical nanowires distributed in a second region of the first surface of the substrate, and then removing the photoresist;
  • the manner in which the vertical nanowires/tubes are grown to form in the foregoing steps may be selected from a variety of ways known in the art, such as MOCVD, PECVD, electrochemical deposition, and the like.
  • the etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming a patterned (nano-pattern) photoresist mask in the foregoing steps includes: a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
  • the substrate may be etched in the foregoing steps by methods known in the art, such as RIE, ICP, wet etching, electrochemical etching, and the like.
  • the filled soluble organic matter may be a photoresist or the like or a corrodible inorganic substance such as metal, SiO 2 , SiN or the like.
  • a fluid processing apparatus in a tenth embodiment of the present application, includes a base 801 having a first surface 8011 and a second surface 8012 opposite to each other, and the base 801
  • the upper first region 8013 is distributed with a plurality of through holes 804 as fluid passages
  • the second region 8014 of the first surface is provided with a plurality of micro/nano sheets 803 (micro sheets and/or nano sheets) arranged in parallel.
  • An array, a partial region of the top of the plurality of micro/nano sheets 803 distributed around the through holes 804 is connected to the fluid blocking portion 802, the fluid blocking portion 802 being disposed above the fluid inlet of the through hole 804 for processing The fluid cannot enter the via 804 directly bypassing the aforementioned array of micro/nanosheets.
  • the micro/nanosheet micro/nanosheets can be densely arranged on the first surface of the substrate by adjusting the spacing of the micro/nanosheets.
  • a groove having an opening of a selected size (which may be referred to as a micro flow channel) is formed, and the particles of different particle size ranges in the fluid are removed, in particular, when the nanosheets are used, Controlling the spacing between these nanosheets at the nanometer level not only removes very small particles in the fluid, but also minimizes the thickness of the nanosheet itself, allowing its resistance to fluids to be kept at a very low level, and The formation of a large fluid flux (especially when the nanosheets have a high height) is far superior to existing porous membranes, fluid flow devices based on lateral flow channels, and the like.
  • the base body 801 can have a larger thickness to form a better support for the aforementioned micro/nano-array array, and at the same time further enhance the mechanical strength of the fluid processing apparatus to make the fluid processing apparatus withstand voltage It is resistant to bending, impact and impact, so that it can be applied in a variety of environments without damage. For example, it can be applied to the treatment of high-pressure, high-speed fluids, which is unmatched by existing porous membranes. .
  • each part (801, 802, 803, 804) of the fluid processing device is various, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, or a semiconductor. , glass, polymer, etc.
  • the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
  • the fluid blocking portion may be in the form of a sheet, and the thickness and the like may be adjusted according to actual application requirements.
  • more than one support body may be symmetrically or asymmetrically disposed around the through hole, and the support body may further increase the support of the fluid blocking portion to realize the fluid blocking portion and A more stable and stable fit between the substrates, and an effective protection of the micro/nano-array array distributed between the fluid blocking portion and the substrate, avoiding the aforementioned action of the fluid blocking portion and/or the substrate after being subjected to an external force Micro/nano-sheet collapse and damage caused by micro/nano-slice array extrusion.
  • the support body may be in various forms, for example, may have a rectangular shape, a trapezoidal shape, a stepped cross section, or the like, and is not limited thereto.
  • the support body may be a boss or the like that protrudes upward from an edge portion of the through hole, and an upper end of the support portion is connected to the fluid blocking portion.
  • the number, diameter, distribution density and the like of the support body can be adjusted according to actual needs, but the space of the first surface of the base body should be occupied as little as possible, and the fluid flux to the micro/nano piece array should be avoided. Cause a big impact.
  • the fluid handling device of the foregoing design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
  • the fluid containing the foreign particles enters the micro/nano-array array, wherein the particles having a particle size larger than a certain value (or some liquid-incompatible droplets, for example) Water droplets in the air or water droplets in the oil are blocked outside the array of micro/nanosheets, after which the fluid reaches the entrance of the via 804 via the trench between the micro/nanosheets and then enters the via 804. Purification of fluids and/or enrichment recovery of desired particles (droplets).
  • the micro/nano piece may have a thickness of 1 nm to 50 ⁇ m, a height of 50 nm to 200 ⁇ m, and adjacent micro/nano pieces.
  • the groove width between the electrodes may be from 1 nm to 50 ⁇ m.
  • the through hole 104 may have a diameter of 1 ⁇ m to 1 mm.
  • the thickness of the substrate may be 1 ⁇ m or more.
  • the fluid blocking portion may have a thickness of 0.5 ⁇ m to 200 ⁇ m.
  • the cross section of the trench formed before the adjacent micro/nanosheets may be regular or irregular, such as polygonal (triangle, quadrilateral or other), circular, elliptical, star, and the like.
  • micro/nanosheets may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate.
  • the shape of the aforementioned through hole 804 and the fluid blocking portion 802 (especially longitudinal or lateral)
  • the shape of the cross section may be varied, for example, may be circular, square, rectangular or other shapes.
  • a fluid processing apparatus includes a base 901 having opposite first and second surfaces, and
  • the substrate 901 is provided with a plurality of through holes 904 as fluid passages, and the first surface is provided with a plurality of arrays of micro/nano sheets 903 extending continuously in the lateral direction, wherein micro/nano sheets are formed between a groove through which the fluid passes, the opening of the groove having a diameter greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, wherein a plurality of micro/nano sheets are directly from the through hole 904
  • the upper passage is such that the micro/nanosheets cooperate with the substrate to form a fluid passage communicating with the through hole 904, and the fluid to be treated can only enter the through hole 904 through the fluid passage.
  • the fluid blocking portion 202 can also be connected to the micro/nano array, and the fluid blocking portion 902 is disposed above the fluid inlet of the through hole 904, so that the fluid to be processed cannot be bypassed.
  • the aforementioned micro/nanochip array directly enters the through hole 904.
  • one or several supports may also be disposed around the through holes 904.
  • the structure, arrangement form, material, and the like of the substrate, the micro/nano-sheet array, the fluid blocking portion, the through-hole, the support, and the like used in the second embodiment may be the same as or similar to those described above, and thus are no longer here. Narration.
  • the fluid processing apparatus may have a structure similar to that of the tenth embodiment, except that more than one, for example, symmetrical or asymmetrical, may be placed on the through hole.
  • the plurality of support beams arranged by the support beam can also increase the support of the fluid blocking portion, thereby achieving a firmer and stable cooperation between the fluid blocking portion and the base body, and effectively distributing the fluid barrier
  • the micro/nano-sheet array between the portion and the substrate forms protection to avoid problems such as collapse/damage of the micro/nanosheet caused by the extrusion of the micro/nanowire array after the fluid blocking portion and/or the substrate are subjected to an external force. .
  • the support beam may be in various forms, such as an arch bridge shape, etc., and is not limited thereto. Further, the support beam may also cooperate with other support bodies, such as the support body described in the first embodiment.
  • the number, size, distribution density and the like of the support beam can be adjusted according to actual needs, but the fluid inlet of the through hole should be blocked as little as possible to avoid causing a large fluid flow to the fluid processing device. influences.
  • the structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in the eleventh embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • a fluid processing apparatus may have a structure similar to any of the tenth and eleventh embodiments, except that: in the nanosheet A photocatalytic material layer 1105 is further disposed on the first surface of the 1103 surface and the substrate 1101.
  • the fluid is treated by the fluid processing device including the photocatalytic material layer 1105, if it is supplemented by ultraviolet light, etc., some organic pollutants in the fluid may be photocatalyzed and decomposed to achieve convection. Multiple purification of the body.
  • the base body, and the convex portion may be made of a transparent material.
  • the fluid barrier may be made entirely of a transparent material, such as light.
  • a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
  • photocatalytic material layer 1105 In order to form the photocatalytic material layer 1105, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, Atomic layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, Atomic layer deposition, etc.
  • sputtering etc., and are not limited thereto.
  • the thickness of the photocatalytic material layer 1105 can be controlled at the nanometer level to minimize its influence on the fluid flux of the fluid processing device.
  • the structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in the third embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • a fluid processing apparatus may have a structure similar to any of the tenth, eleventh, and twelfth embodiments. The difference is that an antibacterial material layer 1205 is further disposed on the surface of the nanosheet 1203 and the first surface of the substrate 1201.
  • the fluid treatment device including the antimicrobial material layer 1205 bacteria, viruses, and the like in the fluid can be synchronously killed during the treatment of the fluid to achieve multiple purification of the fluid.
  • the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
  • the antibacterial material layer 1205 in order to form the antibacterial material layer 1205, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atom.
  • Layer deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the antimicrobial material layer 405 can be controlled at the nanometer level to minimize its effect on the fluid flux of the fluid treatment device.
  • the structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in the thirteenth embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • the fluid processing apparatus of the present application can be prepared by physical or chemical methods, and may be, for example, a chemical growth method, a physical processing method, or the like, particularly a MEMS (Micro Electromechanical Systems) method.
  • MEMS Micro Electromechanical Systems
  • S1 providing a patterned photoresist mask on one side surface (designated as the first surface) of the substrate (for example, a silicon wafer);
  • S3 coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the groove between the vertical nanosheets with an organic substance and/or an inorganic substance to form a sacrificial layer;
  • S8 providing a patterned etch mask on the other side surface of the substrate opposite to the first surface (designated as the third surface), and then performing the other side surface of the substrate Etching until a sacrificial material filled between adjacent vertical nanosheets is exposed, thereby forming a slot in the other side surface of the substrate, the slot being located at a position opposite to the first surface of the substrate Corresponding to the first region, a second region of the first surface of the substrate is disposed around the first region;
  • the etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming the patterned (nano-pattern) photoresist mask includes: photolithography technology, nano-spherical mask technology, nano (metal) particle mask technology, etc., and is not limited thereto. .
  • the vertical nanochip array can be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
  • the filled soluble organic matter may be a photoresist or the like or a corrosive inorganic substance such as metal, SiO 2 , SiN or the like.
  • the slots may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
  • a fluid processing apparatus is mainly used for processing a fluid mixed with selected particles, and includes a base 1300 having opposite pairs.
  • the first surface 1301 and the second surface 1302, and the base 1300 is distributed with a plurality of through holes 1303 as fluid passages.
  • a plurality of micro/nano wires/tubes 1400 ie, any one or more of microwires, microtubes, nanowires, nanotubes), in particular nanowires/tubes (nanowires and/or), are distributed within any of the vias 1303 nanotube).
  • micro/nano wire/tube 1400 One end of the micro/nano wire/tube 1400 is fixed to the hole wall of the through hole 1303, and the other end extends in the radial direction of the through hole. These micro/nano wires/tubes 1400 are gathered in a mutual intersection to become more Hole structure.
  • the pores within the porous structure have a diameter greater than zero but less than the particle size of the selected particles.
  • the porous structure is a grid structure distributed in the through hole 1303 as viewed from a plan view.
  • the micro/nano wires/tubes 1400 can be densely arranged in the through holes, and by adjusting the micro The distribution density, length, etc. of the nanowire/tube 1400 can be used to remove particles of different particle size ranges in the fluid 1500, in particular, when the nanowires/tubes are used, by using these nanowires/tubes.
  • the pores formed by the cross-section are controlled at the nanometer level, which not only removes very small particles in the fluid, but also minimizes the diameter of the nanowire/tube itself, and also controls the resistance to fluid at a very low level.
  • the large fluid flux is far superior to existing porous membranes, fluid handling devices based on lateral flow channels, and the like.
  • the base body 1300 can have a relatively large thickness, thereby further enhancing the mechanical strength of the fluid processing device, so that the fluid processing device can withstand pressure, bend, impact, and impact, thereby enabling It can be applied in a variety of environments without damage, for example, it can be applied to the treatment of high-pressure, high-speed fluids, which is unmatched by existing porous membranes.
  • micro/nano wires/tubes 1400 are all distributed within the through holes 1303, the micro/nano wires/tubes 1400 are actually protected by the substrate 1300, and further, even if the fluid processing device is subjected to Pressure, etc., will not damage these micro/nano wires/tubes 1400.
  • each part (1301, 1302, 1303) of the fluid processing device is various, and may be an inorganic material or an organic material, for example, a metal, a ceramic, a polymer, or the like.
  • the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
  • the fluid handling device of the foregoing design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
  • the fluid containing the foreign particles enters the porous structure, wherein the particles having a particle diameter larger than a certain value (or some liquid incompatible with the fluid, such as in air) Water droplets or water droplets in the oil are blocked outside of the aforementioned porous structure, after which the fluid flows out of the through hole 1303 to effect purification of the fluid and/or enrichment recovery of the desired particles (droplets).
  • a certain value or some liquid incompatible with the fluid, such as in air
  • the micro/nanowire/tube 1400 may have a diameter of 1 nm to 500 ⁇ m.
  • the through hole 1303 may have a diameter of 1 ⁇ m to 1 mm.
  • the thickness of the aforementioned substrate may be 1 ⁇ m or more.
  • the transverse cross-sectional structure of the aforementioned nanowires may be regular or irregular, and may be, for example, a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, or the like.
  • micro/nano wires/tubes 1400 may be distributed within the through holes 1303 regularly or irregularly, uniformly or non-uniformly.
  • micro/nanowire/tube 1400 may preferably be selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
  • micro/nanowire/tube 1400 may be in situ on the inner wall of the through hole 1303 by external transfer, in-situ growth (for example, chemical growth, electrochemical growth) or deposition (for example, physical, chemical vapor deposition, electrodeposition) or the like. Growth formation.
  • in-situ growth for example, chemical growth, electrochemical growth
  • deposition for example, physical, chemical vapor deposition, electrodeposition
  • the shape of the aforementioned through hole 1303 may be various, and may be, for example, a circle, a square, a rectangle, a diamond, a polygon, or other regular or irregular shape.
  • the micro/nanowire/tube 1400 may be formed of a photocatalytic material or a material having an antibacterial or bactericidal function, or the micro/nanowire/tube 1400 may also be covered with a surface.
  • the micro/nanowire/tube 1400 may employ nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO2 nanowires, and can degrade organic substances in the fluid under light-assisted illumination.
  • nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO2 nanowires
  • the aforementioned micro/nanowire/tube 1400 may employ Ag nanowires, Au nanowires, or the like to kill bacteria, viruses, and microorganisms in the fluid.
  • the surface of the substrate 1300 may also be provided with a layer of photocatalytic material or a layer of antibacterial material or the like.
  • photocatalytic degradation of some organic pollutants in the fluid may be performed to achieve multiple purification of the fluid.
  • some or all of the components of the fluid processing apparatus may be made of a transparent material.
  • a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
  • photocatalytic material layer in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atom.
  • Layer deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the fluid processing device.
  • the fluid processing device including the antibacterial material layer, bacteria, viruses, and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
  • the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
  • coating Cloth spin coating, spray coating, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atomic layer deposition, etc.
  • sputtering and the like, and is not limited thereto.
  • the thickness of the antimicrobial material layer can be controlled at the nanometer level to minimize its effect on the fluid flux of the fluid treatment device.
  • a plurality of erected nanowires spaced apart from each other may be disposed on the first surface of the substrate, and the nanowires may be disposed around the aforementioned through holes as fluid passages.
  • the aspect ratio of the upright nanowires is 4:1 to 200000:1, and the ratio of the distance between adjacent vertical nanowires to the length of the vertical nanowires is 1:4 to 1:200,000.
  • a plurality of erected nanowires can be densely arranged (the proportion of the bulge itself in a unit area is small), which facilitates processing of minute particles in the fluid while also The fluid handling device is given a greater fluid flux (the pores between the erected nanowires are larger than the erected nanowires themselves).
  • the upright nanowires may have the same material, size, structure, etc. as the micro/nano wires/tubes 1400 described above.
  • the arrangement density of the above-mentioned erected nanowires and the like are appropriately designed to form a nanowire array, and a superhydrophobic structure and a super oleophobic structure can be formed.
  • the particles in the fluid are removed and the blocked particles are also unable to accumulate on the surface of the fluid treatment device by self-cleaning.
  • the substrate can have a large thickness, the aforementioned erected nanowires can obtain better support.
  • a fluid blocking portion may be further disposed on the aforementioned upright nanowires, and the fluid blocking portion may have a surface disposed opposite to the first surface of the base body (may be named as the first a three-surface), and one end of the plurality of upright linear bodies is fixedly disposed on the first surface of the base body, and the other end is fixedly connected to the third surface of the fluid blocking portion, wherein a distance between adjacent vertical linear bodies is greater than 0 but less than the particle size of the selected particles.
  • the fluid blocking portion may have various forms, and may be, for example, a sheet shape, a thin shell shape, a rectangular shape, a polyhedral shape, or the like.
  • the foregoing erected nanowires, the fluid blocking portion and the base body cooperate to form a fluid passage through which the fluid to be treated can only enter the fluid passage distributed on the first surface of the base body (through hole 1303).
  • the apertures formed by the intersection of the micro/nano wires/tubes 1400 are different, in particular, the spacing between the erected nanowires is greater than
  • the pore size of the pores formed by the intersection of the micro/nanowire/tube 1400 can also achieve grading treatment of particles of different sizes in the fluid.
  • the arrangement of the fluid blocking portion may also be various, for example, it may be integrally spaced from the substrate, or may be partially connected to the substrate, and in some cases, may be associated with the substrate. It is formed by integral processing.
  • the fluid inlet of the fluid channel (through hole 1303) and the plurality of upright nanowires may be distributed within an orthographic projection of the fluid blocking portion on the first surface of the substrate.
  • the shape of the aforementioned fluid blocking portion may be varied, and may be, for example, a circle, a square, a rectangle, or the like.
  • the material of the fluid blocking portion may be selected from a metal, a non-metal, an organic material, an inorganic material, or the like, such as a silicon wafer, a polymer, a ceramic, or the like, and is not limited thereto.
  • the surface of the fluid blocking portion may be distributed with the photocatalytic material, the sterilizing material, or the like, or the surface of the fluid blocking portion may be entirely composed of the photocatalytic material, the sterilizing material, or the like.
  • the fluid blocking portion may have a partially transparent structure or be transparent as a whole, for example, by light.
  • the fluid processing apparatus of the present application can be prepared by physical or chemical methods, and may be, for example, a chemical growth method, a physical processing method, or the like, particularly a MEMS (Micro Electromechanical Systems) method.
  • MEMS Micro Electromechanical Systems
  • a preparation process of a fluid processing apparatus may include the following steps:
  • S1 providing a patterned photoresist mask on the first surface of the substrate (for example, a silicon wafer), which comprises lithographically patterning micro-nano scale lines;
  • S3 depositing a seed layer for micro/nanowire/tube growth on an inner wall of the fluid channel and the first surface of the substrate;
  • S4 growing a plurality of micro/nano wires/tubes on the seed layer to control the growth conditions of the micro/nano wires/tubes, thereby growing on the first surface of the substrate to form a plurality of erect micro/spaces spaced apart from each other a nanowire/tube that grows within the fluid channel to form a plurality of micro/nano wires/tubes extending in a radial direction, a plurality of micro/nano wires/tubes within the fluid channel intersecting each other to form a micro-nano scale Cross grid
  • the etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming the patterned (nano-pattern) photoresist mask includes a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
  • etching it may be in a manner known in the art, such as RIE, ICP, wet etching, electrochemical etching Etching out a fluid channel or the like.
  • the preparation process of the fluid processing device of the present application is simple and controllable, and is suitable for batch mass production.
  • a nasal plug respirator may include:
  • the embedded hard wire mesh assembly comprises two embedded hard wire meshes 12 disposed laterally and spacedly in the outer casing 11;
  • the filter fabric sheet assembly comprises two sheets of filter fabric sheets 13 disposed laterally and spaced apart in the outer casing 11.
  • the two sheets of filter fabric sheets 13 are located between the two embedded rigid screens 12 and are respectively fixed to Embedded on the hard screen 12;
  • the fixed hard wire mesh assembly comprises two fixed hard wire meshes 14 disposed laterally and spacedly in the outer casing 11 , and the fixed hard wire mesh 14 is located between the two pieces of filter wire fabric sheets 13 ;
  • the filter chip is disposed laterally in the outer casing 11 and located between the two fixed hard screens 14;
  • the waist drum type nasal plug 15 includes a connecting piece body 151 and two nasal plug bodies 152 protruding outward from one side of the connecting piece body 151.
  • the waist drum type nasal plug 15 is embedded in one end of the inner cavity of the outer casing 11 via the connecting piece body 151.
  • the nasal plug body 152 is in communication with the lumen of the outer casing 11.
  • the two ends of the embedded rigid wire mesh 12 are detachably connected to the inner cavity wall of the outer casing 11 respectively.
  • the two ends of the filter fabric sheet 13 are respectively connected to the inner cavity wall of the outer casing 11, one side of which is fixedly connected to the embedded hard wire mesh 12, and the other side of which is erected on the boss protruding from the inner cavity wall of the outer casing 11. on.
  • Both ends of the fixed hard screen 14 are respectively fixed to the inner cavity wall of the outer casing 11.
  • Both ends of the filter chip are respectively fixed on the inner cavity wall of the outer casing 11.
  • the foregoing filter chip may be prepared by using MEMS (Micro Electro Mechanical System Processing Technology), and thus may also be named as a MEMS filter chip.
  • MEMS Micro Electro Mechanical System Processing Technology
  • a filter chip in a preferred embodiment of the present application, includes a base 101 having a first surface 1011 and a second surface 1012 opposite to each other, and A plurality of through holes 102 are formed in the base 101 as fluid passages.
  • the first surface is provided with an array of a plurality of beams 103 (which may be named as protrusions) arranged in parallel, wherein a plurality of beams 103 are directly from the through holes.
  • a plurality of beams 103 are disposed on the sides of the through holes 102, wherein the tops of the beams 103 are also distributed with a hat-shaped structure 104 (abbreviated as a cap layer), and the cap layers are continuously extended along the transverse direction of the beams.
  • a hat-shaped structure 104 abbreviated as a cap layer
  • an opening portion (which may be referred to as a micro-flow channel) having a selected size can be formed, and the particles of different particle size ranges in the air can be removed, in particular,
  • the pitch of these cap structures is controlled at the nanometer level, extremely small particles (nanoscale particles) in the air can be removed.
  • the aforementioned beams may be strip-shaped and have a large width and thickness so that the beams can have a high mechanical strength. It provides better support for the cap layer, and the spacing of the beams can be large to provide greater air flux.
  • the cap layer may also have a large thickness, and both sides are laterally extended so that the spacing of adjacent cap layers can be made small, for example, as low as 1 nm, so that the trapping of the air to be treated is minimal. particle.
  • the cap layer may be integrally provided with the convex portion, for example, may be directly formed on the upper portion of the convex portion by evaporation, deposition, growth, or the like (typically, such as metal sputtering, MOCVD, PECVD, electrochemical deposition, etc.), and
  • the hat-shaped structure may also continuously extend in the lateral direction with the convex portion, so that an opening portion extending continuously in the lateral direction is formed between the adjacent hat-shaped structures, so that on the one hand, the selection of the air mixed in the air to be treated can be ensured.
  • the treatment of the fixed particles also maintains a high throughput, which reduces the processing difficulty and saves costs.
  • the material of the cap layer may be selected from an insulating dielectric material such as silicon oxide, silicon nitride oxide, borophosphosilicate glass, or the like, or a semiconductor material such as Si, ZnO, GaN, TiO 2 , InN, or the like, or a metal material such as Ag or Au. , Al, Ni, Cr, Ti, etc., but are not limited thereto.
  • an insulating dielectric material such as silicon oxide, silicon nitride oxide, borophosphosilicate glass, or the like, or a semiconductor material such as Si, ZnO, GaN, TiO 2 , InN, or the like, or a metal material such as Ag or Au. , Al, Ni, Cr, Ti, etc., but are not limited thereto.
  • the base body 101 can have a relatively large thickness, so that it can form a good support for the aforementioned micro/nano-array array, and can further enhance the mechanical strength of the filter chip, so that the filter chip can withstand pressure and resistance. It can be bent, impact-resistant and impact-resistant, so that it can be applied in various environments without damage. For example, it can be applied to high-pressure, high-speed air treatment, which is unmatched by existing porous membranes.
  • each part (101, 102, 103, 104) of the filter chip is various, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, a semiconductor, or the like. Glass, polymer, etc.
  • the filter chip also has a temperature-resistant property and can handle high temperature and low temperature air.
  • Filter chips using the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good air handling capabilities.
  • the air containing the impurity particles enters the array of the above-mentioned hat-shaped structure, wherein the particle diameter is larger than a certain value.
  • the particles or some air-incompatible droplets, such as water droplets in the air or water droplets in the oil) are blocked outside the array of the aforementioned hat-shaped structures, after which the air reaches the passage through the opening between the respective hat-shaped structures
  • the entrance of the aperture 102 is then re-entered into the via 102 to effect purification of the air and/or enrichment recovery of the desired particles (droplets).
  • the gap of each of the cap layers may be 1 nm to 50 ⁇ m, and the height of the cap layer may be 50 nm to 200 ⁇ m.
  • the through hole may have a diameter of 1 ⁇ m to 1 mm, and the substrate may have a thickness of >1 ⁇ m.
  • the height of the beam may be 0.1 ⁇ m to 400 ⁇ m
  • the width may be 0.1 ⁇ m to 100 ⁇ m
  • the distance between the beams may be 0.1 ⁇ m to 100 ⁇ m.
  • the longitudinal section of the opening formed before the adjacent hat-shaped layer and the adjacent beam may be regular or irregular, and may be, for example, trapezoidal, polygonal (triangle, quadrilateral or other), circular, elliptical, star, etc. Wait.
  • the aforementioned beam and cap layer may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate.
  • the shape of the through hole 102 may be various, and may be, for example, a circle, a square, a rectangle, or the like.
  • a filter chip may have a structure similar to any of the foregoing embodiments, except that a photocatalytic material layer may be disposed on the beam, the cap layer, and the surface of the substrate. .
  • a photocatalytic material layer may be disposed on the beam, the cap layer, and the surface of the substrate.
  • the beam and the base may be made of a transparent material.
  • the hat layer and the beam may be made entirely of a transparent material, such as light.
  • a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
  • photocatalytic material layer in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atom.
  • Layer deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the air flux of the filter chip.
  • the structures, arrangement forms, materials, and the like of the base, the cap layer, the beam, the through hole, and the like used in the embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • a filter chip may have a structure similar to any of the previous embodiments, except that an antibacterial material layer may be disposed on the beam, the cap layer, and the surface of the substrate.
  • an antibacterial material layer may be disposed on the beam, the cap layer, and the surface of the substrate.
  • the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
  • antibacterial material layer in order to form the antibacterial material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer). Deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atomic layer.
  • Deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the antibacterial material layer can be controlled at the nanometer level to minimize its influence on the air flux of the filter chip.
  • the structures, arrangement forms, materials, and the like of the base, the cap layer, the beam, the through hole, and the like used in the embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • the filter chip of the present application can be prepared by physical or chemical methods, for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
  • a chemical growth method for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
  • MEMS Micro Electromechanical Systems
  • a process for preparing a filter chip may include the following steps:
  • S1 providing a substrate (such as a silicon wafer);
  • S2 lithographically patterning micro-nano-scale lines on one side surface of the substrate (designated as the first surface), ie forming a patterned photoresist mask;
  • the etching method used in the foregoing steps may also be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming the patterned photoresist mask includes a photolithography technique, a nanosphere mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
  • the preparation process of the filter chip in this embodiment is simple and controllable, and is suitable for mass production in large quantities, and the obtained filter chip has at least the following advantages: (1) large flux and small flow resistance; (2) physical filtration It can effectively remove particles larger than nano-slit; (3) straddle beam and large substrate thickness can ensure high mechanical strength; (5) can be (ultrasonic) cleaning, multiple use.
  • a filter chip in another preferred embodiment of the present application, includes a base 201 having a first surface 2011 and a second surface 2012 opposite to each other, and the base 201 A plurality of through holes 204 are provided as fluid passages.
  • the first surface 2011 is provided with a plurality of cross beams 203 arranged in parallel, and the beam 203 is at The first surface extends continuously in the lateral direction, and a plurality of beams 203 thereof traverse continuously from the through holes 204, and thus can also be regarded as a spanning beam 203.
  • Each of the beams 203 is distributed with a plurality of nanowires 202.
  • One end of the plurality of nanowires 202 is fixed to the surface of the beam 203, and the other end is obliquely extended away from the beam 203. It can be considered to be laterally extended and intersects with a plurality of nanowires 202 distributed on another beam adjacent to either of the beams 203 to form the porous structure 205.
  • the porous structure 205 is viewed in a plan view to cover the mesh structure of the through holes 204.
  • the diameter of the pores in the porous structure 205 is greater than zero but less than the particle size of selected particles that are intermixed within the fluid to be treated.
  • the porous structure 205 formed by the intersection of the plurality of nanowires 102 cooperates with the first surface 2011 of the substrate 201 to form another fluid passage, so that the fluid 206 to be treated can only pass.
  • the other fluid passage enters the through hole 204.
  • the nanowires can be densely arranged on the first surface of the substrate, by adjusting the spacing between the beams and the nanowires. Density, length, direction of extension, etc., can be used to remove particles of different particle size ranges in the fluid.
  • the pore size formed by the intersection of these nanowires is controlled at the nanometer level. Not only can the tiny particles in the fluid be removed, but also because the nanowire itself has a very small diameter, it can also control the resistance to the fluid to a very low level and form a large fluid flux, which is far superior to the present.
  • the arrangement of the aforementioned nanowires is designed to be super-hydrophobic structure and super-oleophobic structure, which can not only remove particles in the fluid, but also pass
  • the self-cleaning action prevents the blocked particles from accumulating in the functional area (the surface of the nanowire array) of the filter chip, thereby preventing the filter chip from failing after long-term use.
  • the beam 203 can be distributed at a suitable density on the first surface 2011 of the substrate 201 to provide the filter chip with as high a fluid handling flux as possible.
  • the beam 203 may have a suitable width such that the beam 203, while having sufficient mechanical strength, may also avoid excessive effects on the flux of the filter chip.
  • the beam may have a height of 0.1 ⁇ m to 100 ⁇ m, a width of 0.1 ⁇ m to 400 ⁇ m, and a pitch between the beams of 0.1 ⁇ m to 100 ⁇ m.
  • the base 201 can have a larger thickness and the beam 203 can have a larger height, so that it can form a better support for the nanowire array, and can further enhance the mechanical strength of the filter chip.
  • the filter chip is resistant to pressure, bending, impact and impact, so that it can be applied in various environments without damage, for example, it can be applied to processing high pressure and high speed fluids. A porous membrane or the like cannot be achieved.
  • each part (201, 202, 203) of the filter chip is various, and may be an inorganic material or an organic material. When these parts are selected to use inorganic materials, the filter chip also has temperature resistance The ability to handle high temperature and low temperature fluids.
  • the filter chip of the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
  • the fluid containing the foreign particles enters the porous structure 205, wherein the particles having a particle diameter larger than a certain value (or some liquid-incompatible droplets, such as air) Water droplets or water droplets in the oil are blocked outside the porous structure 205, after which the fluid reaches the entrance of the through hole 204 via the gap between the nanowires and then enters the through hole 204, thereby purifying the fluid and/or Enrichment recovery of the desired particles (droplets).
  • a certain value or some liquid-incompatible droplets, such as air
  • the diameter and spacing of the nanowires 202 may be 1 nm to 50 ⁇ m, and the length 6 degrees (height) may be 50 nm to 200 ⁇ m.
  • the through hole 104 may have a diameter of 1 ⁇ m to 1 mm.
  • the thickness of the substrate may be 1 ⁇ m or more.
  • the transverse cross-sectional structure of the aforementioned nanowires may be regular or irregular, and may be, for example, a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, or the like.
  • the aforementioned nanowires 202 may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate 201.
  • the array formed by these nanowires 202 can have a superhydrophobic structure, thereby allowing the filter chip to have a self-cleaning function.
  • the aforementioned nanowires 202 may preferably be selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
  • the foregoing nanowires 202 may be fixed to the surface of the substrate or grown on the surface of the substrate by external transfer, in-situ growth (eg, chemical growth, electrochemical growth) or deposition (eg, physical, chemical vapor deposition, electrodeposition). .
  • the shape of the aforementioned through holes 204 may be various, and may be, for example, a circle, a square, a rectangle, a diamond, a polygon, or other regular or irregular shapes.
  • the nanowires 202 may be formed of a photocatalytic material or a material having an antibacterial or bactericidal function, or the nanowires 202 may be surface covered with a photocatalytic material or have sterilization. a coating formed of an antibacterial material.
  • the nanowires 202 may adopt nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO2 nanowires, and are capable of degrading organic substances in the fluid under light-assisted illumination.
  • the nanowires 202 may employ Ag nanowires, Au nanowires, or the like to kill bacteria, viruses, and microorganisms in the fluid.
  • the first surface 2011 of the base 201 is further provided with a photocatalytic material layer or an antibacterial material layer or the like.
  • the fluid When the fluid is treated by a filter chip containing a photocatalytic material layer, if it is supplemented with ultraviolet light, etc., some organic pollutants in the fluid may be photocatalyzed to achieve multiple purification of the fluid.
  • part or all of the substrate, the protrusion, and the nanowire may be made of a transparent material.
  • a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
  • photocatalytic material layer in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atom.
  • Layer deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
  • bacteria, viruses and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
  • the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
  • antibacterial material layer in order to form the antibacterial material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer). Deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atomic layer.
  • Deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the antimicrobial material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
  • the filter chip of the present application can be prepared by physical or chemical methods, for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
  • a chemical growth method for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
  • MEMS Micro Electromechanical Systems
  • a process for preparing a filter chip may include the following steps:
  • S1 depositing a seed layer for nanowire growth on a first surface of a substrate such as a silicon wafer.
  • a patterned photoresist mask is disposed on the seed layer, which comprises lithographic lines on the micro-nano scale.
  • S6 growing nanowires on the seed layer, controlling the growth conditions of the nanowires, making the nanowires have a certain lateral growth ratio, and forming a cross-grid of micro-nano scale.
  • S7 dicing, encapsulation, and making a filter chip.
  • the etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming the patterned (nano-pattern) photoresist mask includes a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
  • the beam 203, the via 204, and the like may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
  • the preparation process of the filter chip of the present application is simple and controllable, and is suitable for batch mass production.
  • a filter chip in a preferred embodiment of the present application, includes a base 301 having a first surface 301a and a first area of the base 301 3011 (the area enclosed by the dotted line in the figure) is distributed with a plurality of through holes 304 as fluid passages, and the first surface is provided with a plurality of vertical micro/nano wires/tubes 303 (ie, micron-sized wires, micron-sized An array formed by a combination of any one or more of tubes, nanowires, nanotubes, distributed over the plurality of micro/nano wires distributed around the vias 304 in the second region 3012 of the first region 3011
  • the top of the tube 303 is also connected with a fluid blocking portion 302 disposed above the fluid inlet of the through hole 304 so that the fluid to be treated cannot directly bypass the aforementioned micro/nano wire/tube array.
  • the fluid blocking portion 302 has a second surface 302b disposed opposite the first surface 3011.
  • a plurality of vertical micro/nano wires/tubes 303 may also be densely distributed in the remaining area 3013 of the first surface 3011 (which may be named as the third area).
  • arrows with dashed lines show the direction of travel of the fluid.
  • the micro/nano wires/tubes can be densely arranged on the first surface of the substrate, by adjusting these micro// Nanowire/tube spacing allows for the removal of particles of different particle sizes in the fluid, especially when nanowires/tubes are used, by controlling the spacing between these nanowires/tubes in the nanometer
  • the grade not only removes very small particles in the fluid, but also because the nanowire/tube itself has a very small diameter, it can also control the resistance to fluids to a very low level and form a large fluid flux. It is far superior to existing porous membranes, filter chips based on lateral flow channels, and the like.
  • the super-hydrophobic structure and the super-oleophobic structure can be formed, which can not only remove particles in the fluid, but also By self-cleaning, the blocked particles cannot be accumulated in the functional area (micro/nanowire/tube array surface) of the filter chip, and the filter chip is prevented from failing after long-term use.
  • the base 301 can have a large thickness to form a better support for the micro/nano wire/tube array, and further enhance the mechanical strength of the filter chip to make the filter chip withstand voltage. It is resistant to bending, impact and impact, which makes it suitable for use in a variety of environments without damage, for example, for high pressure, high speed fluids. Treatment, this function is unmatched by existing porous membranes.
  • the fluid blocking portion may be in the form of a sheet, and the thickness and the like may be adjusted according to actual application requirements.
  • each part (301, 302, 303, 304) of the filter chip is various, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, a semiconductor, Glass, polymer, etc.
  • the filter chip also has temperature-resistant characteristics and can handle high temperature and low temperature fluids.
  • the filter chip of the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
  • the fluid containing the impurity particles enters the array of the aforementioned micro/nano wires 303, wherein the particles having a particle diameter larger than a certain value (or some liquid incompatible with the fluid) , for example, water droplets in the air or water droplets in the oil) are blocked outside the aforementioned micro/nanowire/tube array, after which the fluid reaches the entrance of the through hole 304 via the gap between the respective micro/nano wires/tubes and then enters
  • the through holes 304 enable purification of the fluid and/or enrichment recovery of the desired particles (droplets).
  • the micro/nano wires may have a diameter of 1 nm to 50 ⁇ m, and the length (height) h 1 may be 50 nm to 200 ⁇ m, and adjacent micro/nano lines. The distance between them may be from 1 nm to 50 ⁇ m.
  • the through hole 304 may have a diameter w of 1 ⁇ m to 1 mm.
  • the thickness h 2 of the substrate may be 1 ⁇ m or more.
  • the thickness h 3 of the fluid blocking portion may be from 0.5 ⁇ m to 200 ⁇ m.
  • the transverse cross-sectional structure of the aforementioned micro/nano wires may be regular or irregular, such as polygonal (triangle, quadrilateral or other), circular, elliptical, star, and the like.
  • the aforementioned micro/nanowires may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate.
  • the average pitch of adjacent micro/nano wires is between 1 nm and 50 ⁇ m.
  • the shape of the through hole 304 and the fluid blocking portion 302 may be various, for example, may be circular, square, rectangular or Other shapes.
  • a filter chip includes a base 401 having a first surface and opposite to the first surface and a third a surface, and the substrate 401 is provided with a plurality of through holes 404 as fluid passages, and the first surface is provided with an array of vertical micro/nano wires/tubes 403 distributed around the through holes 404.
  • the top of the plurality of micro/nano wires/tubes 403 is also connected with a fluid blocking portion 402 disposed above the fluid inlet of the through hole 404, so that the fluid to be treated cannot bypass the aforementioned micro/nano.
  • the line/tube array directly enters the through hole 404.
  • a symmetric or asymmetric distribution around the through hole 404 is also provided.
  • One or more, for example, four support bodies 405 can also support the fluid blocking portion 402 by the support body 405, thereby achieving a more stable and stable cooperation between the fluid blocking portion and the base body, and can be effective.
  • the support body may be in various forms, for example, may have a rectangular, trapezoidal, stepped longitudinal section (the longitudinal direction herein may be understood as a direction perpendicular to the first surface of the base body), and the like, and is not limited thereto.
  • the support body may be a boss or the like that protrudes upward from an edge portion of the through hole 404, and an upper end thereof is connected to the fluid blocking portion 402.
  • the number, diameter, distribution density and the like of the support body can be adjusted according to actual needs, but the space of the first surface of the base body should be occupied as little as possible to avoid the fluid flux to the micro/nano wires. Great impact.
  • the structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • a filter chip includes a base 501 having a first surface and opposite to the first surface and a third a surface, and the substrate 501 is provided with a plurality of through holes 504 as fluid passages, and the first surface is provided with an array formed by a plurality of vertical micro/nano wires/tubes 503 distributed around the through holes 504.
  • the top of the plurality of micro/nano wires/tubes 503 is also connected with a fluid blocking portion 502 disposed above the fluid inlet of the through hole 504, so that the fluid to be treated cannot bypass the aforementioned micro/nano.
  • the line/tube array directly enters the via 504.
  • a plurality of support beams 505, such as symmetric or asymmetric arrangement, are further disposed on the through hole 504, and the support beam 505 can also increase the support of the fluid blocking portion 502.
  • a more stable and stable fit between the fluid barrier and the substrate is achieved, and the micro/nanowire/tube array distributed between the fluid barrier and the substrate can be effectively protected from being blocked by the fluid barrier and/or the substrate.
  • the micro/nanowire/tube 503 is collapsed and damaged due to the extrusion of the aforementioned micro/nanowire/tube array.
  • the support beam may be in various forms, such as an arch bridge shape, etc., and is not limited thereto. Further, the support beam can also cooperate with other support bodies, such as the support body described in the foregoing embodiments.
  • the number, size, distribution density and the like of the support beam can be adjusted according to actual needs, but the fluid inlet of the through hole should be blocked as little as possible to avoid a large influence on the fluid flux of the filter chip. .
  • the structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • a filter chip includes a base 601 having a first surface 6011 and a third opposite to the first surface. Surface 6012, and the substrate A plurality of through holes 604 as fluid passages are disposed on the 601, and the first surface is provided with an array formed by a plurality of vertical nano-pillars 603, and the tops of the plurality of nano-pillars 603 distributed around the through-holes 604 are also connected.
  • the fluid blocking portion 602 is disposed above the fluid inlet of the through hole 604, so that the fluid to be treated cannot directly enter the through hole 604 by bypassing the aforementioned array of nanopillars.
  • a photocatalytic material layer 605 is further disposed on the surface of the nano-pillar 603 and the first surface of the base 601.
  • the filter chip including the photocatalytic material layer 605 if it is supplemented with ultraviolet light or the like, some organic pollutants in the fluid may be photocatalyzed to achieve multiple purification of the fluid.
  • part or all of the fluid blocking portion, the base body, and the convex portion may be made of a transparent material.
  • the fluid barrier may be made entirely of a transparent material, such as light.
  • a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
  • photocatalytic material layer 605 In order to form the photocatalytic material layer 605, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, Atomic layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, Atomic layer deposition, etc.
  • sputtering etc., and are not limited thereto.
  • the thickness of the photocatalytic material layer 605 can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
  • the structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • a filter chip includes a base 701 having a first surface 7011 and a third opposite to the first surface.
  • the surface of the substrate 701 is distributed with a plurality of through holes 704 as fluid passages, and the first surface is provided with an array of a plurality of vertical nano-pillars 703, and a plurality of distributed around the through-holes 704
  • the top of the nano-pillar 703 is also connected with a fluid blocking portion 702 disposed above the fluid inlet of the through-hole 704, so that the fluid to be treated cannot directly bypass the aforementioned array of nano-pillars and directly enter the through-hole. Hole 704.
  • an antibacterial material layer 705 is further disposed on the surface of the nano-pillar 703 and the first surface of the base 701.
  • bacteria, viruses, and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
  • the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
  • the antibacterial material layer 705 in order to form the antibacterial material layer 705, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atom.
  • Layer deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the antimicrobial material layer 705 can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
  • the structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • the filter chip of the present application can be prepared by physical or chemical methods, for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
  • a chemical growth method for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
  • MEMS Micro Electromechanical Systems
  • a process for preparing a filter chip may include the following steps:
  • S1 providing a patterned photoresist mask on one side surface (defined as the first surface a) of the substrate (for example, a silicon wafer);
  • S3 coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between the vertical nanowires with an organic substance and/or an inorganic substance to form a sacrificial layer;
  • the etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming the patterned (nano-pattern) photoresist mask includes: photolithography technology, nano-spherical mask technology, nano (metal) particle mask technology, etc., and is not limited thereto. .
  • step S2 it can be by a method known in the art, such as RIE, ICP, wet etching, electrochemistry
  • a vertical nanowire array is etched by etching or the like.
  • the filled soluble organic matter may be a photoresist or the like or a corrodible inorganic substance such as metal, SiO 2 , silicon nitride or the like.
  • the slots may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
  • the preparation process of the filter chip of the present application is simple and controllable, and is suitable for batch mass production.
  • a process for preparing a filter chip may include the following steps:
  • S1 growing on a first surface of a substrate (eg, a silicon wafer) to form a plurality of vertical nanowires/tubes spaced apart from each other;
  • a substrate eg, a silicon wafer
  • S2 coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between each vertical nanowire/tube with an organic substance and/or an inorganic substance to form a sacrificial layer;
  • S4 etching the sacrificial layer to expose a plurality of vertical nanowires distributed in a second region of the first surface of the substrate, and then removing the photoresist;
  • the manner in which the vertical nanowires/tubes are grown to form in the foregoing steps may be selected from a variety of ways known in the art, such as MOCVD, PECVD, electrochemical deposition, and the like.
  • the etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming a patterned (nano-pattern) photoresist mask in the foregoing steps includes: a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
  • the substrate may be etched in the foregoing steps by methods known in the art, such as RIE, ICP, wet etching, electrochemical etching, and the like.
  • the filled soluble organic matter may be a photoresist or the like or a corrodible inorganic substance such as metal, SiO 2 , SiN or the like.
  • a filter chip in a preferred embodiment of the present application, includes a base 801 having a first surface 18011 and a second surface 8012 opposite to each other, and the base 801 is The first region 8013 is distributed with a plurality of through holes 804 as fluid passages, and the second region 8014 of the first surface is provided with an array of a plurality of micro/nano sheets 803 (micro sheets and/or nano sheets) arranged in parallel a partial area of the top of the plurality of micro/nano sheets 803 distributed around the through holes 804 is connected to the fluid blocking portion 802, which is disposed above the fluid inlet of the through holes 804, to be processed The fluid cannot enter the through hole 804 directly bypassing the aforementioned array of micro/nanosheets.
  • the micro/nanosheet micro/nanosheets can be densely arranged on the first surface of the substrate by adjusting the spacing of the micro/nanosheets.
  • a groove having an opening of a selected size (which may be referred to as a micro flow channel) is formed, and the particles of different particle size ranges in the fluid are removed, in particular, when the nanosheets are used, Controlling the spacing between these nanosheets at the nanometer level not only removes very small particles in the fluid, but also minimizes the thickness of the nanosheet itself, allowing its resistance to fluids to be kept at a very low level, and The formation of a large fluid flux (especially when the nanosheets have a high height) is far superior to existing porous membranes, lateral flow channel-based filter chips, and the like.
  • the base body 801 can have a large thickness, so that it can form a good support for the micro/nano-array array, and can further enhance the mechanical strength of the filter chip, so that the filter chip can withstand pressure and resistance. Bending, impact resistance, impact resistance, and thus can be applied in a variety of environments without damage, for example, can be applied to the treatment of high pressure, high speed fluid, this function is unmatched by existing porous membranes.
  • each part (801, 802, 803, 804) of the filter chip is various, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, a semiconductor, or the like. Glass, polymer, etc.
  • the filter chip also has temperature-resistant characteristics and can handle high temperature and low temperature fluids.
  • the fluid blocking portion may be in the form of a sheet, and the thickness and the like may be adjusted according to actual application requirements.
  • more than one support body may be symmetrically or asymmetrically disposed around the through hole, and the support body may further increase the support of the fluid blocking portion to realize the fluid blocking portion and A more stable and stable fit between the substrates, and an effective protection of the micro/nano-array array distributed between the fluid blocking portion and the substrate, avoiding the aforementioned action of the fluid blocking portion and/or the substrate after being subjected to an external force Micro/nano-sheet collapse and damage caused by micro/nano-slice array extrusion.
  • the support body may be in various forms, for example, may have a rectangular shape, a trapezoidal shape, a stepped cross section, or the like, and Not limited to this.
  • the support body may be a boss or the like formed to protrude upward from the edge portion of the through hole, and an upper end of the support is connected to the fluid blocking portion.
  • the number, diameter, distribution density and the like of the support body can be adjusted according to actual needs, but the space of the first surface of the base body should be occupied as little as possible, and the fluid flux to the micro/nano piece array should be avoided. Cause a big impact.
  • Filter chips using the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
  • the fluid containing the impurity particles enters the micro/nano-array array, wherein particles having a particle diameter larger than a certain value (or some fluid-incompatible droplets such as air)
  • the water droplets in the water or the water droplets in the oil are blocked outside the array of micro/nano-sheets, after which the fluid reaches the entrance of the through-hole 104 via the trench between the micro/nano-chips and then enters the through-hole 104, thereby achieving Purification of the fluid and/or enrichment recovery of the desired particles (droplets).
  • the micro/nano piece may have a thickness of 1 nm to 50 ⁇ m and a height of 50 nm to 200 ⁇ m between adjacent micro/nano sheets.
  • the groove width may be from 1 nm to 50 ⁇ m.
  • the through hole 804 may have a diameter of 1 ⁇ m to 1 mm.
  • the thickness of the substrate may be 1 ⁇ m or more.
  • the fluid blocking portion may have a thickness of 0.5 ⁇ m to 200 ⁇ m.
  • the cross section of the trench formed before the adjacent micro/nanosheets may be regular or irregular, such as polygonal (triangle, quadrilateral or other), circular, elliptical, star, and the like.
  • micro/nanosheets may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate.
  • the shape of the aforementioned through hole 804 and the fluid blocking portion 802 may be various, and may be, for example, a circle, a square, a rectangle, or the like.
  • a filter chip includes a base 901 having opposite first and second surfaces, and the base A plurality of through holes 904 as fluid passages are disposed on the 901, and the first surface is provided with a plurality of arrays of micro/nano sheets 903 extending continuously in the lateral direction, wherein the micro/nano sheets are formed with fluids for passage therethrough.
  • micro/nanosheets are mated with the substrate to form a fluid passage that communicates with the through holes 904, and the fluid to be treated can only enter the through holes 904 through the fluid passages.
  • the fluid blocking portion 902 can also be connected to the micro/nano-sheet array.
  • the fluid blocking portion 902 is disposed above the fluid inlet of the through-hole 904, so that the fluid to be processed cannot be bypassed.
  • the aforementioned micro/nanochip array directly enters the through hole 904.
  • one or several supports may also be disposed around the through holes 904.
  • the structures, arrangement forms, materials, and the like of the substrate, the micro/nano-sheet array, the fluid barrier, the through-hole, the support, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • the filter chip may have a structure similar to that of the foregoing embodiment, except that more than one, for example, symmetric or asymmetric arrangement may be disposed on the through hole.
  • the support beam can also increase the support of the fluid blocking portion by the support beam, thereby achieving a more stable and stable cooperation between the fluid blocking portion and the base body, and can be effectively distributed to the fluid blocking portion and the base body.
  • the inter-micro/nano-sheet array is protected from problems such as collapse/damage of the micro/nano-sheet due to extrusion of the micro/nanowire array by the fluid barrier and/or the substrate after being subjected to an external force.
  • the support beam may be in various forms, such as an arch bridge shape, etc., and is not limited thereto. Further, the support beam can also cooperate with other support bodies, such as the support body described in the foregoing embodiments.
  • the number, size, distribution density and the like of the support beam can be adjusted according to actual needs, but the fluid inlet of the through hole should be blocked as little as possible to avoid a large influence on the fluid flux of the filter chip. .
  • the structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • a filter chip may have a structure similar to any of the foregoing embodiments, except that the surface of the nanosheet 1103 and the substrate 1101 are A photocatalytic material layer 1105 is also disposed on a surface.
  • the filter chip including the photocatalytic material layer 1105 if it is supplemented with ultraviolet light or the like, some organic pollutants in the fluid may be photocatalyzed to achieve multiple purification of the fluid.
  • the base body, and the convex portion may be made of a transparent material.
  • the fluid barrier may be made entirely of a transparent material, such as light.
  • a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
  • photocatalytic material layer 1105 In order to form the photocatalytic material layer 1105, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, Atomic layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, Atomic layer deposition, etc.
  • sputtering etc., and are not limited thereto.
  • the thickness of the photocatalytic material layer 1105 can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
  • the structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • a filter chip may have a structure similar to any of the foregoing embodiments, except that the surface of the nanosheet 1203 and First table of the base 1201 An antibacterial material layer 1205 is also disposed on the surface.
  • bacteria, viruses, and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
  • the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
  • the antibacterial material layer 1205 in order to form the antibacterial material layer 1205, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atom.
  • Layer deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the antibacterial material layer 1205 can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
  • the structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
  • the filter chip of the present application can be prepared by physical or chemical methods, for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
  • a chemical growth method for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
  • MEMS Micro Electromechanical Systems
  • a preparation process of a filter chip may include the following steps:
  • S1 providing a patterned photoresist mask on one side surface (designated as the first surface) of the substrate (for example, a silicon wafer);
  • S3 coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the groove between the vertical nanosheets with an organic substance and/or an inorganic substance to form a sacrificial layer;
  • S8 providing a patterned etch mask on the other side surface of the substrate opposite to the first surface (designated as the third surface), and then performing the other side surface of the substrate Etching until a sacrificial material filled between adjacent vertical nanosheets is exposed, thereby forming a slot in the other side surface of the substrate, the slot being located at a position opposite to the first surface of the substrate Corresponding to the first region, a second region of the first surface of the substrate is disposed around the first region;
  • the etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming the patterned (nano-pattern) photoresist mask includes: photolithography technology, nano-spherical mask technology, nano (metal) particle mask technology, etc., and is not limited thereto. .
  • the vertical nanochip array can be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
  • the filled soluble organic matter may be a photoresist or the like or a corrosive inorganic substance such as metal, SiO 2 , SiN or the like.
  • the slots may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
  • a filter chip is mainly used for processing a fluid mixed with selected particles, and includes a base 1300 having opposite phases.
  • a surface 1301 and a second surface 1302, and a plurality of through holes 1303 as fluid passages are distributed on the base 1300.
  • a plurality of micro/nano wires/tubes 1400 ie, any one or more of microwires, microtubes, nanowires, nanotubes), in particular nanowires/tubes (nanowires and/or), are distributed within any of the vias 1303 nanotube).
  • micro/nano wire/tube 1400 is fixed to the hole wall of the through hole 1303, and the other end extends in the radial direction of the through hole.
  • These micro/nano wires/tubes 2 are aggregated into a porous structure in a mutually intersecting form.
  • the pores within the porous structure have a diameter greater than zero but less than the particle size of the selected particles.
  • the porous structure is a grid structure distributed in the through hole 1303 as viewed from a plan view.
  • the micro/nano wires/tubes 1400 can be densely arranged in the through holes, and by adjusting the micro The distribution density, length, etc. of the nanowire/tube 1400 can be used to remove particles of different particle size ranges in the fluid 1500, in particular, when the nanowires/tubes are used, by using these nanowires/tubes
  • the pores formed by the cross-section are controlled at the nanometer level, which not only removes very small particles in the fluid, but also minimizes the diameter of the nanowire/tube itself, and also controls the resistance to fluid at a very low level.
  • the large fluid flux is far superior to existing porous membranes, lateral flow channel based filter chips, and the like.
  • the base body 1300 can have a large thickness, thereby further enhancing the mechanical strength of the filter chip, so that the filter chip can withstand pressure, bending, collision, impact resistance, and thus can be used in various It can be applied to the environment without damage, for example, it can be applied to the treatment of high-pressure, high-speed fluids, which is unmatched by existing porous membranes.
  • micro/nano wires/tubes 1400 are all distributed in the through holes 1303, the micro/nano wires/tubes 1400 are actually protected by the substrate 1300, and further, even if the filter chip is under pressure Etc., these micro/nano wires/tubes 1400 are not damaged.
  • each part (1301, 1302, 1303) of the filter chip is diverse, and may be none
  • the machine material may also be an organic material such as a metal, a ceramic, a polymer, or the like.
  • the filter chip also has temperature-resistant characteristics and can handle high temperature and low temperature fluids.
  • Filter chips using the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
  • the fluid containing the impurity particles enters the porous structure, wherein the particles having a particle diameter larger than a certain value (or some droplets incompatible with the fluid, such as water droplets in the air)
  • the water droplets in the oil are blocked outside the aforementioned porous structure, after which the fluid flows out of the through holes 1303 to effect purification of the fluid and/or enrichment recovery of the desired particles (droplets).
  • the micro/nanowire/tube 1400 may have a diameter of 1 nm to 500 ⁇ m.
  • the through hole 1303 may have a diameter of 1 ⁇ m to 1 mm.
  • the thickness of the aforementioned substrate may be 1 ⁇ m or more.
  • the transverse cross-sectional structure of the aforementioned nanowires may be regular or irregular, and may be, for example, a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, or the like.
  • micro/nano wires/tubes 1400 may be distributed within the through holes 1303 regularly or irregularly, uniformly or non-uniformly.
  • micro/nanowire/tube 1400 may preferably be selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
  • micro/nanowire/tube 1400 may be in situ on the inner wall of the through hole 1303 by external transfer, in-situ growth (for example, chemical growth, electrochemical growth) or deposition (for example, physical, chemical vapor deposition, electrodeposition) or the like. Growth formation.
  • in-situ growth for example, chemical growth, electrochemical growth
  • deposition for example, physical, chemical vapor deposition, electrodeposition
  • the shape of the aforementioned through hole 1303 may be various, and may be, for example, a circle, a square, a rectangle, a diamond, a polygon, or other regular or irregular shape.
  • the micro/nanowire/tube 1400 may be formed of a photocatalytic material or a material having an antibacterial or bactericidal function, or the micro/nanowire/tube 1400 may also be covered with a surface.
  • the micro/nanowire/tube 1400 may employ nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO2 nanowires, and can degrade organic substances in the fluid under light-assisted illumination.
  • nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO2 nanowires
  • the aforementioned micro/nanowire/tube 1400 may employ Ag nanowires, Au nanowires, or the like to kill bacteria, viruses, and microorganisms in the fluid.
  • the surface of the substrate 1300 may also be provided with a layer of photocatalytic material or a layer of antibacterial material or the like.
  • the fluid When the fluid is treated with a filter chip containing a layer of a photocatalytic material, if it is supplemented with ultraviolet light or the like, the fluid may be Some organic pollutants in the process are photocatalyticly degraded to achieve multiple purification of the fluid.
  • some or all of the components in the filter chip may be made of a transparent material.
  • a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
  • photocatalytic material layer in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atom.
  • Layer deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
  • bacteria, viruses and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
  • the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
  • antibacterial material layer in order to form the antibacterial material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer). Deposition, etc.), sputtering, etc., and are not limited thereto.
  • coating spin coating, spraying, printing, etc.
  • physical or chemical vapor deposition such as MOCVD, PECVD, atomic layer.
  • Deposition, etc. sputtering, etc., and are not limited thereto.
  • the thickness of the antimicrobial material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
  • a plurality of erected nanowires spaced apart from each other may be disposed on the first surface of the substrate, and the nanowires may be disposed around the aforementioned through holes as fluid passages.
  • the aspect ratio of the upright nanowires is 4:1 to 200000:1, and the ratio of the distance between adjacent vertical nanowires to the length of the vertical nanowires is 1:4 to 1:200,000.
  • a plurality of erected nanowires can be densely arranged (the proportion of the bulge itself in a unit area is small), which facilitates processing of minute particles in the fluid while also
  • the filter chip is given a larger fluid flux (the pores between the erected nanowires are larger than the erected nanowires themselves).
  • the upright nanowires may have the same material, size, structure, etc. as the micro/nano wires/tubes 1400 described above.
  • the arrangement density of the above-mentioned erected nanowires and the like are appropriately designed to form a nanowire array, and a superhydrophobic structure and a super oleophobic structure can be formed.
  • the particles in the fluid are removed and the blocked particles are also unable to accumulate on the surface of the filter chip by self-cleaning.
  • the substrate can have a large thickness, the aforementioned erected nanowires can obtain better support.
  • a fluid blocking portion may also be disposed on the aforementioned upright nanowires,
  • the fluid blocking portion may have a surface (which may be named as a third surface) disposed opposite to the first surface of the base body, and one end of the plurality of upright linear bodies is fixedly disposed on the first surface of the base body, and the other end Attached to the third surface of the fluid barrier, wherein the distance between adjacent upright linear bodies is greater than zero but less than the particle size of the selected particles.
  • the fluid blocking portion may have various forms, and may be, for example, a sheet shape, a thin shell shape, a rectangular shape, a polyhedral shape, or the like.
  • the foregoing erected nanowires, the fluid blocking portion and the base body cooperate to form a fluid passage through which the fluid to be treated can only enter the fluid passage distributed on the first surface of the base body (through hole 1303).
  • the apertures formed by the intersection of the micro/nano wires/tubes 1400 are different, in particular, the spacing between the erected nanowires is greater than
  • the pore size of the pores formed by the intersection of the micro/nanowire/tube 1400 can also achieve grading treatment of particles of different sizes in the fluid.
  • the arrangement of the fluid blocking portion may also be various, for example, it may be integrally spaced from the substrate, or may be partially connected to the substrate, and in some cases, may be associated with the substrate. It is formed by integral processing.
  • the fluid inlet of the fluid channel (through hole 1303) and the plurality of upright nanowires may be distributed within an orthographic projection of the fluid blocking portion on the first surface of the substrate.
  • the shape of the aforementioned fluid blocking portion may be varied, and may be, for example, a circle, a square, a rectangle, or the like.
  • the material of the fluid blocking portion may be selected from a metal, a non-metal, an organic material, an inorganic material, or the like, such as a silicon wafer, a polymer, a ceramic, or the like, and is not limited thereto.
  • the surface of the fluid blocking portion may be distributed with the photocatalytic material, the sterilizing material, or the like, or the surface of the fluid blocking portion may be entirely composed of the photocatalytic material, the sterilizing material, or the like.
  • the fluid blocking portion may have a partially transparent structure or be transparent as a whole, for example, by light.
  • the filter chip of the present application can be prepared by physical or chemical methods, for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
  • a chemical growth method for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
  • MEMS Micro Electromechanical Systems
  • a process for preparing a filter chip may include the following steps:
  • S1 providing a patterned photoresist mask on the first surface of the substrate (for example, a silicon wafer), which comprises lithographically patterning micro-nano scale lines;
  • S2 etching a first surface of the substrate by using the photoresist mask to form a first through the substrate a plurality of through holes having a surface and a second surface opposite the first surface for acting as a fluid passage;
  • S3 depositing a seed layer for micro/nanowire/tube growth on an inner wall of the fluid channel and the first surface of the substrate;
  • S4 growing a plurality of micro/nano wires/tubes on the seed layer to control the growth conditions of the micro/nano wires/tubes, thereby growing on the first surface of the substrate to form a plurality of erect micro/spaces spaced apart from each other a nanowire/tube that grows within the fluid channel to form a plurality of micro/nano wires/tubes extending in a radial direction, a plurality of micro/nano wires/tubes within the fluid channel intersecting each other to form a micro-nano scale Cross grid
  • the etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
  • the method of forming the patterned (nano-pattern) photoresist mask includes a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
  • the fluid passage or the like can be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.

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Abstract

Disclosed are a fluid processing device and a preparation method therefor. The fluid processing device comprises: a substrate (101) having a fluid channel, and a fluid processing mechanism for processing a fluid to be processed when the fluid to be processed in a mixture with selected particles flows through the fluid channel or prior to flowing through the fluid channel; the fluid processing mechanism is distributed on a first surface (1011) of the substrate (101) or inside the fluid channel and has a fluid processing microstructure, the diameter of the opening through which the fluid flows in the fluid processing microstructure is greater than 0 but less than the particle size of the selected particles. The fluid processing device has the characteristics of a large flux, a small flow resistance, and efficient removal of micro/nano scale particles in the fluid, and is reusable, has a long service life and is suitable for large-scale mass production. The present invention also relates to a method for preparing the fluid processing device.

Description

流体处理装置及其制备方法Fluid processing device and preparation method thereof 技术领域Technical field
本申请具体涉及一种对含有颗粒物的流体进行净化处理的装置及其制备方法。The present invention specifically relates to an apparatus for purifying a fluid containing particulate matter and a preparation method thereof.
背景技术Background technique
在日常的生活、工作中,人们对于去除流体中的颗粒而使流体得以净化有着广泛的需求。例如,针对低质量的空气,需去除其中的粉尘、微小颗粒等,以保障人体的健康。又例如,针对水、油(食用油、汽油、柴油等),需去除其中的颗粒物,以实现水、油的纯化。再例如,针对生物医药等领域,需去除或筛选血液和体液中的细胞、病毒、细菌等。再例如,一般而言,空气中通常存在粉尘等颗粒污染物,若人体长期吸入含有这样的空气,往往会导致人体呼吸系统等受损。尤其对于某些特殊人群,例如对于花粉等过敏的人群来说,若吸入含有这些过敏源的空气,将导致这些人员发生哮喘、呼气困难等症状。In daily life and work, there is a wide demand for purifying fluids in the fluid to purify the fluid. For example, for low-quality air, it is necessary to remove dust, tiny particles, etc. to protect the health of the human body. For another example, for water, oil (edible oil, gasoline, diesel, etc.), the particulate matter needs to be removed to purify water and oil. For example, in the field of biomedicine and the like, it is necessary to remove or screen cells, viruses, bacteria, and the like in blood and body fluids. For example, in general, there are usually particulate pollutants such as dust in the air. If the human body inhales such air for a long time, it often causes damage to the human respiratory system. Especially for some special people, such as those who are allergic to pollen, if they inhale the air containing these allergens, they will cause asthma, exhalation and other symptoms.
传统的流体处理装置(例如口罩、空气净化器等)大多存在通量低、体积大、使用寿命短等缺陷,且对于流体中细微颗粒的清除效果低下。例如,为保障人体的健康和安全,人们已经习于采用棉布、纱布等材质制作的口罩来滤除空气中的颗粒污染物。但此类传统口罩仅对尺寸较大的颗粒污染物有效,且经短时间使用即可能被污染。又及,考虑到近年来在国内外多地出现的严重雾霾天气,在空气中存在的大量PM2.5(空气中等效粒径在2.5μm以下的颗粒)将严重影响人体健康,而普通的口罩对于PM2.5并无滤除效果的问题。业界又提出了包含静电过滤器等特殊过滤器的口罩、呼吸器(例如N95口罩等),其对于空气中普通污染颗粒的过滤性好,但气阻大,呼吸困难,且对于雾霾天气而言,同样也基本无法起到保护作用。Conventional fluid processing devices (such as masks, air purifiers, etc.) often have defects such as low flux, large volume, short service life, and the like, and the effect of removing fine particles in the fluid is low. For example, in order to protect the health and safety of the human body, people have used masks made of cotton, gauze and other materials to filter out particulate pollutants in the air. However, such conventional masks are only effective for larger particle contaminants and may be contaminated after a short period of use. In addition, considering the severe smog weather that has occurred in many places at home and abroad in recent years, a large amount of PM2.5 (particles with an equivalent particle size of 2.5 μm or less in the air) present in the air will seriously affect human health, while ordinary The mask has no filtering effect on PM2.5. The industry has also proposed masks and respirators (such as N95 masks) that contain special filters such as electrostatic filters, which have good filtering properties for common polluting particles in the air, but have large air resistance, difficulty in breathing, and smog weather. In other words, it is basically impossible to protect.
近年来,随着微纳米加工技术的发展,研究人员又提出了一些基于多孔薄膜的流体处理设备,即,通过在薄膜上刻蚀(腐蚀)出微米或纳米级的众多孔洞,使其可以应用于清除流体中的颗粒,尤其是微小颗粒,其尺寸能精准控制,通量大。但是这种装置存在通量与机械强度间的矛盾,通量大的,往往机械结构脆弱,而机械强度大的,通量又很小。这是由于其加工技术的限制,若孔洞越小,则薄膜厚度就需要越薄,这也使得多孔薄膜的机械支撑性能进一步劣化,无法适应恶劣环境,且使用寿命亦非常有限,所以迄今为止还不能实用化。In recent years, with the development of micro-nano processing technology, researchers have proposed some fluid processing equipment based on porous film, which can be applied by etching (corroding) many holes in the micrometer or nanometer on the film. In the removal of particles in the fluid, especially tiny particles, the size can be precisely controlled, and the flux is large. However, such a device has a contradiction between flux and mechanical strength. When the flux is large, the mechanical structure is often fragile, and the mechanical strength is large, and the flux is small. This is due to the limitations of its processing technology. If the pores are smaller, the thinner the film thickness is, which further deteriorates the mechanical support properties of the porous film, cannot adapt to harsh environments, and has a very limited service life. Can not be put into practical use.
当前还有研究人员利用牺牲层技术,实现了包含横向流道的流体处理装置(参阅图1所 示),这些横向流道的孔径可以被控制在数个纳米,因此利于清除流体中的细微颗粒,但其通量过小。Researchers have also used sacrificial layer technology to implement fluid handling devices that include lateral flow paths (see Figure 1). Shown that the pore size of these lateral flow channels can be controlled to a few nanometers, thus facilitating the removal of fine particles in the fluid, but the flux is too small.
发明内容Summary of the invention
本申请的主要目的在于提供一种改良的流体处理装置及其制备方法,以克服现有技术中的不足。The primary object of the present application is to provide an improved fluid processing apparatus and method of making same that overcomes the deficiencies of the prior art.
为实现前述发明目的,本申请采用的技术方案包括:To achieve the foregoing object, the technical solution adopted by the present application includes:
本申请实施例提供了一种流体处理装置,其包括:The embodiment of the present application provides a fluid processing apparatus, including:
具有流体通道的基体,以及,a substrate having a fluid passage, and,
流体处理机构,用以在混杂有选定颗粒的待处理流体流经所述流体通道时或者流经所述流体通道前对所述待处理流体进行处理;a fluid treatment mechanism for treating the fluid to be treated when the fluid to be treated mixed with the selected particles flows through the fluid passage or before flowing through the fluid passage;
所述流体处理机构分布于所述基体的第一表面或者所述流体通道内部,并具有流体处理微结构,所述流体处理微结构中用以流体通过的开口直径大于0但小于所述选定颗粒的粒径。The fluid processing mechanism is distributed on the first surface of the substrate or inside the fluid channel and has a fluid processing microstructure, wherein the diameter of the opening for fluid passage in the fluid processing microstructure is greater than 0 but less than the selected The particle size of the particles.
本申请实施例还提供了一种流体处理装置,其包括:The embodiment of the present application further provides a fluid processing apparatus, including:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面;a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
彼此间隔设置的复数个凸起部,所述凸起部沿横向在所述基体的第一表面上连续延伸,下部固定设置于所述基体的第一表面,上部设有沿横向连续延伸的帽形结构,所述帽形结构的相背对的两侧部沿侧向外延,而相邻帽形结构之间形成有可供流体通过的开口部,所述开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,其中至少两个所述的凸起部分别与所述第一流体通道的流体入口的相背对的两侧相邻设置,以及至少一个所述的凸起部直接从所述第一流体通道的流体入口上通过,从而使复数个帽形结构、复数个凸起部与基体之间配合形成与所述第一流体通道连通的第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions spaced apart from each other, the protrusions extending continuously on the first surface of the base body in a lateral direction, a lower portion fixedly disposed on the first surface of the base body, and an upper portion having a cap extending continuously in the lateral direction a shape-shaped structure, the opposite sides of the hat-shaped structure are laterally extended, and an opening portion through which the fluid can pass is formed between the adjacent hat-shaped structures, and the diameter of the opening portion is greater than 0 but less than the mixed a particle size of the selected particles in the fluid to be treated, wherein at least two of the raised portions are respectively disposed adjacent to opposite sides of the fluid inlet of the first fluid passage, and at least one The raised portion passes directly from the fluid inlet of the first fluid passage, thereby engaging a plurality of hat-shaped structures, a plurality of projections and the base body to form a second fluid in communication with the first fluid passage The passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
本申请实施例还提供了一种流体处理装置,其包括:The embodiment of the present application further provides a fluid processing apparatus, including:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面;a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
由复数根线形体相互交叉形成的多孔结构,用以与所述基体的第一表面配合形成第二流体通道,所述复数根线形体一端均与所述基体固定连接,所述多孔结构中孔洞的直径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,且待处理的流体仅能通过所述第二流体通 道进入第一流体通道。a porous structure formed by intersecting a plurality of linear bodies to form a second fluid passage with the first surface of the base body, wherein the plurality of linear bodies are fixedly connected to the base body at one end, and the porous structure has a hole a diameter greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, and the fluid to be treated can only pass through the second fluid The road enters the first fluid passage.
本申请实施例还提供了一种流体处理装置,其包括:The embodiment of the present application further provides a fluid processing apparatus, including:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面的第一区域内;a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
流体阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理流体直接进入所述第一流体通道的流体入口;a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
彼此间隔设置的复数个凸起部,所述凸起部一端固定设置于所述基体的第一表面的第二区域内,另一端与所述流体阻挡部的第二表面固定连接,其中相邻凸起部之间的距离大于0但小于混杂于待处理的流体内的选定颗粒的粒径,所述基体的第一表面的第二区域与第一区域邻接,从而使所述复数个凸起部、流体阻挡部与基体之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of raised portions spaced apart from each other, the convex portion is fixedly disposed at one end in a second region of the first surface of the base body, and the other end is fixedly connected to the second surface of the fluid blocking portion, wherein adjacent The distance between the raised portions is greater than zero but less than the particle size of the selected particles that are intermingled with the fluid to be treated, the second region of the first surface of the substrate being contiguous with the first region, such that the plurality of convexities The starting portion, the fluid blocking portion and the base body cooperate to form a second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
本发明实施例还提供了一种流体处理装置,其包括:Embodiments of the present invention also provide a fluid processing apparatus, including:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面的第一区域内;a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
流体阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理流体直接进入所述第一流体通道的流体入口;a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
分布于所述基体的第一表面的第二区域内的、且彼此间隔的复数根竖直纳米线状体,所述基体的第一表面的第二区域环绕所述第一区域设置,所述纳米线状体的两端分别与所述基体的第一表面及所述流体阻挡部的第二表面固定连接,其中相邻纳米线状体之间的距离大于0但小于混杂于待处理的流体内的选定颗粒的粒径,从而使所述复数根纳米线状体、流体阻挡部与基体之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of vertical nano-linear bodies distributed in a second region of the first surface of the substrate and spaced apart from each other, a second region of the first surface of the substrate being disposed around the first region, Two ends of the nano-linear body are respectively fixedly connected to the first surface of the base body and the second surface of the fluid blocking portion, wherein a distance between adjacent nano-linear bodies is greater than 0 but less than mixed with the fluid to be treated a particle size of the selected particles, such that the plurality of nanowires, the fluid barrier and the substrate cooperate to form a second fluid channel, and the fluid to be treated can only enter through the second fluid channel A fluid passage.
本申请实施例还提供了一种流体处理装置包括:The embodiment of the present application further provides a fluid processing apparatus comprising:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面的第一区域内;a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
流体阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理流体直接进入所述第一流体通道的流体入口;a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
复数个凸起部,所述凸起部沿横向在所述基体的第一表面的第二区域连续延伸,其中相邻凸起部之间形成有可供流体通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,并且所述凸起部的上端与所述基体的第一表面密封连接, 下端的局部区域与所述流体阻挡部的第二表面密封连接,从而使所述复数个凸起部之间的一个以上沟槽、流体阻挡部与基体配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions extending continuously in a second region of the first surface of the substrate in a lateral direction, wherein a groove through which a fluid can pass is formed between adjacent protrusions, the groove The opening of the opening has a diameter greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, and the upper end of the raised portion is sealingly connected to the first surface of the base, a partial region of the lower end is sealingly coupled to the second surface of the fluid blocking portion such that more than one groove, fluid barrier between the plurality of projections cooperates with the base to form a second fluid passage, and the to-be-processed Fluid can only enter the first fluid passage through the second fluid passage.
本申请实施例还提供了另一种流体处理装置包括:Another embodiment of the present application provides another fluid processing apparatus comprising:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面;a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
彼此间隔设置的复数个凸起部,所述凸起部固定设置在所述基体的第一表面上,并沿横向在所述基体的第一表面上连续延伸,其中相邻凸起部之间形成有可供流体通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,以及,其中至少两个凸起部分别与所述第一流体通道的流体入口的相背对的两侧相邻设置,至少一个凸起部直接从所述第一流体通道的流体入口上通过,从而使所述复数个凸起部与基体之间配合形成与所述第一流体通道连通的第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions spaced apart from each other, the protrusions being fixedly disposed on the first surface of the base body and extending continuously on the first surface of the base body in a lateral direction, wherein between the adjacent protrusions Forming a groove through which the fluid can pass, the opening of the groove having a diameter greater than 0 but smaller than the particle size of the selected particles mixed in the fluid to be treated, and wherein at least two of the raised portions are respectively Two opposite sides of the opposite sides of the fluid inlet of the first fluid passage are disposed adjacent to each other, and at least one convex portion directly passes through the fluid inlet of the first fluid passage, so that the plurality of convex portions and the base body The interfitting forms a second fluid passage in communication with the first fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
本申请实施例还提供了另一种流体处理装置,其包括:The embodiment of the present application further provides another fluid processing apparatus, including:
具有流体通道的基体,以及a substrate having a fluid passage, and
复数根线形体的聚集体,用以对流经所述流体通道的、混杂有选定颗粒的流体进行处理;An aggregate of a plurality of linear bodies for treating a fluid mixed with the selected particles flowing through the fluid passage;
所述聚集体分布于所述流体通道内,并具有多孔结构,所述多孔结构内孔洞的直径大于0但小于所述选定颗粒的粒径。The aggregates are distributed within the fluid channel and have a porous structure, the pores within the porous structure having a diameter greater than zero but less than the particle size of the selected particles.
本申请实施例还提供了一种鼻塞式呼吸器,其包括:The embodiment of the present application further provides a nasal plug respirator, including:
鼻塞和过滤芯片,至少所述鼻塞的一端部能够插入使用者的鼻腔,且所述鼻塞包含有与所述鼻腔连通的气体通道,所述过滤芯片用以滤除混杂于待处理气流内的、粒径大于设定值的颗粒,待处理的气体流经所述过滤芯片后进入所述鼻塞内的气体通道;以及,a nasal plug and a filter chip, at least one end of the nasal plug can be inserted into a nasal cavity of a user, and the nasal plug includes a gas passage communicating with the nasal cavity, and the filter chip is used to filter out the mixed airflow to be treated, a particle having a particle diameter larger than a set value, wherein the gas to be treated flows into the gas passage in the nasal plug after flowing through the filter chip;
过滤芯片防护结构,用以对所述过滤芯片进行防护。A filter chip protection structure is used to protect the filter chip.
与现有技术相比,本申请的优点包括:Advantages of the present application compared to the prior art include:
1)本申请提供的流体处理装置至少具有通量大、流阻小、能高效清除流体中微/纳米级颗粒等特点,还可采用较厚的基体,机械强度高,可以(超声)清洗及多次使用,使用寿命长,且优选具有自清洁功能,且制备工艺简单可控,适于规模化大批量制备。1) The fluid processing device provided by the present application has at least a large flux, a small flow resistance, and can effectively remove micro/nano-sized particles in a fluid, and can also adopt a thick substrate, has high mechanical strength, and can be (ultrasonic) cleaned and It has many times of use, long service life, and preferably has self-cleaning function, and the preparation process is simple and controllable, and is suitable for large-scale preparation in large scale.
2)本申请提供的鼻塞式呼吸器过滤性好、呼吸方便、舒适感好,可多次使用,使用寿命长;2) The nasal plug type respirator provided by the present application has good filterability, convenient breathing, good comfort, can be used multiple times, and has a long service life;
3)本申请中的过滤芯片至少具有通量大、流阻小、能高效清除空气中微/纳米级颗粒等 特点,还可采用较厚的基体,机械强度高,可以(超声)清洗及多次使用,使用寿命长,且优选具有自清洁功能,同时其制备工艺简单可控,适于规模化大批量制备。3) The filter chip in the present application has at least a large flux, a small flow resistance, and can efficiently remove micro/nano particles in the air, etc. Features, can also use thicker substrate, high mechanical strength, can be (ultrasonic) cleaning and multiple use, long service life, and preferably has a self-cleaning function, while its preparation process is simple and controllable, suitable for large-scale large-scale preparation .
附图说明DRAWINGS
为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请中记载的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings to be used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description are only It is a few embodiments described in the present application, and other drawings can be obtained from those skilled in the art without any creative work.
图1为现有技术中一种包含横向流道的流体处理装置的剖视图;1 is a cross-sectional view of a fluid processing apparatus including a lateral flow path in the prior art;
图2为本申请第一实施例中一种流体处理装置的俯视图;Figure 2 is a plan view of a fluid processing apparatus in a first embodiment of the present application;
图3为本申请第一实施例中一种流体处理装置的局部剖视图(A-A向);Figure 3 is a partial cross-sectional view (A-A direction) of a fluid processing apparatus in a first embodiment of the present application;
图4为本申请第一实施例中一种流体处理装置的制备工艺流程图;4 is a flow chart of a preparation process of a fluid processing apparatus according to a first embodiment of the present application;
图5为本申请第二实施例中一种流体处理装置的俯视图;Figure 5 is a plan view of a fluid processing apparatus in a second embodiment of the present application;
图6为本申请第二实施例中一种流体处理装置的局部剖视图;Figure 6 is a partial cross-sectional view showing a fluid processing apparatus in a second embodiment of the present application;
图7为本申请第二实施例中一种流体处理装置的制备工艺流程图;7 is a flow chart showing a preparation process of a fluid processing apparatus according to a second embodiment of the present application;
图8为本申请第三实施例中一种流体处理装置的剖视图;Figure 8 is a cross-sectional view showing a fluid processing apparatus in a third embodiment of the present application;
图9a-图9e为本申请一些典型实施方案中一种流体处理装置中凸起部的横向截面图;9a-9e are transverse cross-sectional views of a raised portion of a fluid processing apparatus in some exemplary embodiments of the present application;
图10a-图10c为本申请一些典型实施方案中一种流体处理装置中凸起部的排布示意图;10a-10c are schematic views showing the arrangement of the bosses in a fluid processing apparatus according to some exemplary embodiments of the present application;
图11a-图11c为本申请第三实施例中多种流体处理装置的俯视图;11a-11c are top views of various fluid processing devices in a third embodiment of the present application;
图12为本申请第四实施例中一种流体处理装置的俯视图;Figure 12 is a plan view of a fluid processing apparatus in a fourth embodiment of the present application;
图13为本申请第五实施例中一种流体处理装置的俯视图;Figure 13 is a plan view of a fluid processing apparatus in a fifth embodiment of the present application;
图14为本申请第六实施例中一种流体处理装置的剖视图;Figure 14 is a cross-sectional view showing a fluid processing apparatus in a sixth embodiment of the present application;
图15为本申请第七实施例中一种流体处理装置的剖视图;Figure 15 is a cross-sectional view showing a fluid processing apparatus in a seventh embodiment of the present application;
图16为本申请第八实施例中一种流体处理装置的制备工艺流程图;16 is a flow chart showing a preparation process of a fluid processing apparatus according to an eighth embodiment of the present application;
图17为本申请第九实施例中一种流体处理装置的制备工艺流程图;17 is a flow chart showing a preparation process of a fluid processing apparatus according to a ninth embodiment of the present application;
图18为本申请第十实施例中一种流体处理装置的俯视图;Figure 18 is a plan view of a fluid processing apparatus in a tenth embodiment of the present application;
图19为本申请第十实施例中一种流体处理装置的局部剖视图;Figure 19 is a partial cross-sectional view showing a fluid processing apparatus in a tenth embodiment of the present application;
图20为本申请第十一实施例中一种流体处理装置的俯视图;Figure 20 is a plan view showing a fluid processing apparatus in an eleventh embodiment of the present application;
图21为本申请第十二实施例中一种流体处理装置的局部剖视图;Figure 21 is a partial cross-sectional view showing a fluid processing apparatus in a twelfth embodiment of the present application;
图22为本申请第十三实施例中一种流体处理装置的局部剖视图; Figure 22 is a partial cross-sectional view showing a fluid processing apparatus in a thirteenth embodiment of the present application;
图23为本申请第十四实施例中一种流体处理装置的俯视图;Figure 23 is a plan view showing a fluid processing apparatus in a fourteenth embodiment of the present application;
图24为本申请第十五实施例中一种流体处理装置的局部剖视图;Figure 24 is a partial cross-sectional view showing a fluid processing apparatus in a fifteenth embodiment of the present application;
图25为本申请第十六实施例中一种流体处理装置的制备工艺流程图;Figure 25 is a flow chart showing the preparation process of a fluid processing apparatus in a sixteenth embodiment of the present application;
图26为本申请第十七实施例中一种鼻塞式呼吸器的结构示意图。Figure 26 is a schematic view showing the structure of a nasal stopper type respirator according to a seventeenth embodiment of the present application.
具体实施方式detailed description
为使本申请的目的、技术方案和优点更加清楚,下面结合附图对本申请的具体实施方式进行详细说明。这些优选实施方式的示例在附图中进行了例示。附图中所示和根据附图描述的本申请的实施方式仅仅是示例性的,并且本申请并不限于这些实施方式。The specific embodiments of the present application are described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the drawings. The embodiments of the present application shown in the drawings and described in the drawings are merely exemplary, and the application is not limited to the embodiments.
在此,还需要说明的是,为了避免因不必要的细节而模糊了本申请,在附图中仅仅示出了与根据本申请的方案密切相关的结构和/或处理步骤,而省略了与本申请关系不大的其他细节。It should also be noted that, in order to avoid obscuring the present application by unnecessary detail, only the structures and/or processing steps closely related to the solution according to the present application are shown in the drawings, and the Other details of this application are not relevant.
本申请实施例的一个方面提出的一种流体处理装置包括:A fluid processing apparatus according to an aspect of the embodiments of the present application includes:
具有流体通道的基体,以及,a substrate having a fluid passage, and,
流体处理机构,用以在混杂有选定颗粒的待处理流体流经所述流体通道时或者流经所述流体通道前对所述待处理流体进行处理;a fluid treatment mechanism for treating the fluid to be treated when the fluid to be treated mixed with the selected particles flows through the fluid passage or before flowing through the fluid passage;
所述流体处理机构分布于所述基体的第一表面或者所述流体通道内部,并具有流体处理微结构,所述流体处理微结构中用以流体通过的开口直径大于0但小于所述选定颗粒的粒径。The fluid processing mechanism is distributed on the first surface of the substrate or inside the fluid channel and has a fluid processing microstructure, wherein the diameter of the opening for fluid passage in the fluid processing microstructure is greater than 0 but less than the selected The particle size of the particles.
本申请实施例的另一个方面提出的一种流体处理装置包括:A fluid processing apparatus according to another aspect of the embodiments of the present application includes:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面;a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
彼此间隔设置的复数个凸起部,所述凸起部沿横向在所述基体的第一表面上连续延伸,下部固定设置于所述基体的第一表面,上部设有沿横向连续延伸的帽形结构,所述帽形结构的相背对的两侧部沿侧向外延,而相邻帽形结构之间形成有可供流体通过的开口部,所述开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,其中至少两个所述的凸起部分别与所述第一流体通道的流体入口的相背对的两侧相邻设置,以及至少一个所述的凸起部直接从所述第一流体通道的流体入口上通过,从而使复数个帽形结构、复数个凸起部与基体之间配合形成与所述第一流体通道连通的第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions spaced apart from each other, the protrusions extending continuously on the first surface of the base body in a lateral direction, a lower portion fixedly disposed on the first surface of the base body, and an upper portion having a cap extending continuously in the lateral direction a shape-shaped structure, the opposite sides of the hat-shaped structure are laterally extended, and an opening portion through which the fluid can pass is formed between the adjacent hat-shaped structures, and the diameter of the opening portion is greater than 0 but less than the mixed a particle size of the selected particles in the fluid to be treated, wherein at least two of the raised portions are respectively disposed adjacent to opposite sides of the fluid inlet of the first fluid passage, and at least one The raised portion passes directly from the fluid inlet of the first fluid passage, thereby engaging a plurality of hat-shaped structures, a plurality of projections and the base body to form a second fluid in communication with the first fluid passage The passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
前述的“横向”可以被理解为平行或基本平行于所述基体的第一表面的任意方向。而前述 的“侧向”可以被理解为不与所述第一表面垂直,而与所述“横向”交叉的任意方向。优选的,若所述第一表面为水平面,则所述的“侧向”可以是以所述凸出部的侧边为起点水平向外延伸或向上倾斜延伸的方向。The foregoing "lateral direction" can be understood to mean any direction that is parallel or substantially parallel to the first surface of the substrate. And the foregoing "Side" can be understood as any direction that is not perpendicular to the first surface but intersects the "lateral". Preferably, if the first surface is a horizontal plane, the “lateral direction” may be a direction extending horizontally outward or obliquely upward from a side of the protrusion.
其中,所述基体可以是各种形态的,例如矩形体状、片状、多面体状、半球状、球状或其它非规则形态的。因此,所述的“第一表面”可以是所述基体上的任何一个非特定的合适的平面或曲面。Wherein, the substrate may be in various forms, such as a rectangular shape, a sheet shape, a polyhedral shape, a hemispherical shape, a spherical shape or other irregular forms. Thus, the "first surface" may be any non-specific suitable plane or curved surface on the substrate.
其中,所述第一流体通道可以是任意形态的通孔,其流体入口分布在所述基体的第一表面上,而其流体出口既可以分布在所述基体的与所述第一表面不同的另一表面上(例如,该另一表面可以与所述第一表面相邻、相背对),也可分布在所述的第一表面上(当然在这种情况下,所述的第一表面上应有流体阻隔机构,使待处理的流体不会在所述第一表面上直接流动至所述流体出口处。在一些情况下,所述第一流体通道的流体出口也是可以分布在所述基体内部的,例如,当所述基体内存在用以接收经处理后的流体的空腔时。Wherein, the first fluid passage may be a through hole of any shape, the fluid inlet thereof is distributed on the first surface of the base body, and the fluid outlet thereof may be distributed on the base body different from the first surface On the other surface (for example, the other surface may be adjacent to, opposite to the first surface), may also be distributed on the first surface (of course, in this case, the first There should be a fluid blocking mechanism on the surface such that the fluid to be treated does not flow directly onto the first surface to the fluid outlet. In some cases, the fluid outlet of the first fluid channel can also be distributed Inside the substrate, for example, when there is a cavity in the substrate to receive the treated fluid.
其中,所述的复数个凸起部是指两个或更多凸起部。其中所述的凸起部是相对于所述基体的第一表面的平坦或凹下的部分而言,其形态可以是多样的,例如,从俯视图上观察,其可以为具有直线或曲线形轮廓等的条状、片状或其它规则或不规则形态等,且不限于此。Wherein, the plurality of raised portions refers to two or more raised portions. Where the raised portion is a flat or concave portion with respect to the first surface of the base body, the shape thereof may be various, for example, as viewed from a plan view, it may have a straight or curved contour Strips, sheets or other regular or irregular forms, etc., and are not limited thereto.
其中,所述的复数个凸起部可以规则或不规则、均匀或非均匀的分布在所述基体的第一表面上。Wherein, the plurality of protrusions may be regularly or irregularly distributed uniformly or non-uniformly on the first surface of the substrate.
在一些较为优选的实施方案中,至少两个所述的凸起部直接从所述第一流体通道的流体入口上通过。In some preferred embodiments, at least two of said projections pass directly over the fluid inlet of said first fluid passage.
在一些较为优选的实施方案中,所述的复数个凸起部平行分布在所述基体的第一表面上。In some preferred embodiments, the plurality of raised portions are distributed in parallel on the first surface of the substrate.
较为优选的,所述凸起部为条状,其宽度可以较大,各凸起部的间距可以较大,如此可以使凸起部具有较大的机械强度而对帽形结构形成较好的支撑,同时还可赋予所述流体处理装置较大的流体通量。Preferably, the protrusions are strip-shaped, the width thereof may be larger, and the pitch of each protrusion portion may be larger, so that the protrusion portion has greater mechanical strength and the hat-shaped structure is formed better. The support, while also imparting a greater fluid flux to the fluid treatment device.
尤其优选的,所述凸起部的高度为0.1μm~400μm,宽度为0.1μm~100μm,相邻凸起部之间距离为0.1μm~100μm。Particularly preferably, the raised portion has a height of 0.1 μm to 400 μm, a width of 0.1 μm to 100 μm, and a distance between adjacent convex portions of 0.1 μm to 100 μm.
另外,也可以通过在所述凸起部的局部或全部表面设置由业界已知的合适低表面能物质形成的涂层或特定的纳米结构,从而使其具有超疏水性能、自清洁性能等。In addition, it is also possible to impart superhydrophobic properties, self-cleaning properties, and the like by providing a coating or a specific nanostructure formed of a suitable low surface energy substance known in the art on a part or all of the surface of the convex portion.
其中,所述帽形结构可以具有各种规则或不规则的截面结构,例如可以优选而不限于倒梯形截面结构,但相邻帽形结构之间形成的开口部的口径应大于0但小于混杂于待处理的流体内的选定颗粒的粒径,用以处理流体中粒径小至纳米级的颗粒。 Wherein, the hat-shaped structure may have various regular or irregular cross-sectional structures, for example, preferably not limited to an inverted trapezoidal cross-sectional structure, but an opening formed between adjacent hat-shaped structures should have a diameter greater than 0 but less than mixed The particle size of the selected particles in the fluid to be treated is used to treat particles having a particle size as small as nanometers in the fluid.
优选的,形成于相邻帽形结构之间的开口部的口径为1nm~50μm。Preferably, the opening formed between the adjacent hat-shaped structures has a diameter of 1 nm to 50 μm.
优选的,所述帽形结构的高度为50nm~200μm。Preferably, the hat-shaped structure has a height of 50 nm to 200 μm.
其中,所述帽形结构与凸起部一体设置,例如可以通过蒸发、沉积、生长等技术直接形成于所述凸起部上部,并且所述帽形结构亦可随所述凸起部沿横向连续延伸,从而使相邻帽形结构之间形成沿横向连续延伸的开口部,如此即可以保证对混杂于待处理的流体内的选定颗粒的处理,亦还保持很高的通量,且降低了加工难度(相邻凸起部的间距受到加工能力的限制,一般很难达到约1nm的距离),节约了成本。Wherein, the hat-shaped structure is integrally provided with the convex portion, and may be directly formed on the upper portion of the convex portion by, for example, evaporation, deposition, growth, etc., and the hat-shaped structure may also follow the convex portion along the lateral direction. Continuously extending so as to form an opening portion extending continuously in the lateral direction between adjacent hat-shaped structures, so that the treatment of selected particles mixed in the fluid to be treated can be ensured, and a high flux is also maintained, and The processing difficulty is reduced (the spacing of adjacent protrusions is limited by the processing capability, and it is generally difficult to reach a distance of about 1 nm), which saves cost.
其中,所述帽形结构的材质可以选自绝缘介质材料如氧化硅、氮化硅氧化铝、硼磷硅玻璃等,或者半导体材料如Si、ZnO、GaN、TiO2、InN等,或金属材料如Ag、Au、Al、Ni、Cr、Ti等,当然也可以选自其它无机和/或有机材料等。Wherein, the material of the hat-shaped structure may be selected from an insulating dielectric material such as silicon oxide, silicon nitride oxide, borophosphosilicate glass, or the like, or a semiconductor material such as Si, ZnO, GaN, TiO 2 , InN, or the like, or a metal material. For example, Ag, Au, Al, Ni, Cr, Ti, etc. may of course be selected from other inorganic and/or organic materials and the like.
其中,所述第一流体通道的流体入口具有规则或不规则形状,例如多边形(矩形、菱形或其它)、圆形或椭圆形等,其可以依据实际应用之需求而简单调整。Wherein, the fluid inlet of the first fluid channel has a regular or irregular shape, such as a polygon (rectangular, diamond or other), a circle or an ellipse, etc., which can be easily adjusted according to the needs of practical applications.
其中,形成于相邻凸起部之间的开口部可以具有多种形式的截面形状,例如可以是矩形、梯形、倒梯形、三角形、半圆形等规则或不规则形状。The opening portion formed between the adjacent convex portions may have various forms of cross-sectional shapes, and may be, for example, a regular or irregular shape such as a rectangle, a trapezoid, an inverted trapezoid, a triangle, or a semicircle.
其中,所述的待处理流体可以是气相或液相的,例如空气、水、油类,在某些情况下,也可以是呈流体状的颗粒物质的集合,或者某些物质的熔融态等。Wherein, the fluid to be treated may be in a gas phase or a liquid phase, such as air, water, oil, and in some cases, may be a collection of fluid substances in a fluid state, or a molten state of certain substances, etc. .
其中,所述的“颗粒”主要是指固相颗粒,但在某些情况下,亦可以是与所述流体(特别是液相流体)不相容的液滴等。Herein, the "particles" mainly refer to solid phase particles, but in some cases, may also be droplets or the like which are incompatible with the fluid (especially a liquid phase fluid).
在一些较为具体的实施方案中,所述第一流体通道的孔径可以为1μm~1mm。In some more specific embodiments, the first fluid channel may have a pore size of from 1 μm to 1 mm.
在一些较为具体的实施方案中,所述基体的厚度在1μm以上,以使基体具有较好的机械强度,从而能够为凸起部和帽形结构提供更强的支撑。In some more specific embodiments, the substrate has a thickness of 1 μm or more to provide a better mechanical strength of the substrate to provide stronger support for the raised portion and the hat-shaped structure.
其中,所述基体的材质可以选自金属、非金属、有机材料、无机材料等,例如硅片、聚合物、陶瓷等,且不限于此。The material of the substrate may be selected from a metal, a non-metal, an organic material, an inorganic material, or the like, such as a silicon wafer, a polymer, a ceramic, or the like, and is not limited thereto.
在一些较为优选的实施方案中,所述凸起部、帽形结构、基体中至少一者的表面还设置有功能材料层,所述功能材料层的材质包括光催化材料、抗菌材料等等,且不限于此。例如,较为典型的光催化材料可以是二氧化钛等,在包含此种功能材料的流体处理装置对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。又例如,较为典型的抗菌材料可以是诸如Au、Ag等贵金属,藉其可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等。In some preferred embodiments, the surface of at least one of the convex portion, the hat-shaped structure and the base body is further provided with a functional material layer, and the material of the functional material layer comprises a photocatalytic material, an antibacterial material and the like. It is not limited to this. For example, a typical photocatalytic material may be titanium dioxide or the like. When the fluid is processed by a fluid processing device containing such a functional material, some organic pollutants in the fluid may be photocatalyzed by ultraviolet light or the like. Degradation, achieving multiple purification of fluids. For another example, a more typical antibacterial material may be a noble metal such as Au or Ag, which can synchronously kill bacteria, viruses and the like in the fluid during the processing of the fluid.
当然,也可直接以前述的光催化材料、抗菌材料等制成所述凸起部、帽形结构、基体中 的至少一者。Of course, the above-mentioned photocatalytic material, antibacterial material, or the like can also be directly formed into the convex portion, the hat-shaped structure, and the base body. At least one of them.
进一步的,为利于光线透入,所述帽形结构、基体、凸起部中的部分或全部可以由透明材料制成。Further, in order to facilitate light penetration, part or all of the hat-shaped structure, the base body, and the convex portion may be made of a transparent material.
本申请的另一个方面提出了一种流体处理装置的制备方法,包括:Another aspect of the present application provides a method of preparing a fluid processing apparatus comprising:
提供具有第一表面和与第一表面相背对的第二表面的衬底;Providing a substrate having a first surface and a second surface opposite the first surface;
在所述衬底的第一表面加工形成彼此间隔设置的复数个凸起部,所述凸起部沿横向在所述基体的第一表面上连续延伸,其下部固定设置于所述基体的第一表面;Forming, on a first surface of the substrate, a plurality of protrusions spaced apart from each other, the protrusions extending continuously on a first surface of the substrate in a lateral direction, and a lower portion of the substrate being fixedly disposed on the substrate a surface
对所述衬底的第二表面进行加工,形成贯穿所述衬底的第一流体通道,并使所述第一流体通道的流体入口分布于所述衬底的第一表面,且使至少两个所述的凸起部分别与第一流体通道的流体入口的相背对的两侧相邻设置以及使至少一个所述的凸起部直接从所述第一流体通道的流体入口上通过;Processing a second surface of the substrate to form a first fluid passage through the substrate, and distributing a fluid inlet of the first fluid passage to a first surface of the substrate, and causing at least two The raised portions are respectively disposed adjacent to opposite sides of the fluid inlet of the first fluid passage and the at least one of the raised portions directly passes through the fluid inlet of the first fluid passage;
在所述凸起部上部形成沿横向连续延伸的帽形结构,并使所述帽形结构的相背对的两侧部沿侧向外延,且使相邻帽形结构之间形成有可供流体通过的开口部,所述开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,从而在复数个帽形结构、复数个凸起部与衬底之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。Forming a hat-shaped structure continuously extending in a lateral direction at an upper portion of the convex portion, and laterally extending opposite sides of the opposite side of the hat-shaped structure, and forming an adjacent between the adjacent hat-shaped structures An opening through which the fluid passes, the opening having a diameter greater than 0 but smaller than the particle size of the selected particles mixed in the fluid to be treated, thereby cooperating between the plurality of cap structures, the plurality of projections and the substrate A second fluid passage is formed and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
在一些较为具体的实施方案中,所述的制备方法包括:In some more specific embodiments, the method of preparation comprises:
在所述衬底的第一表面上设置图形化的第一掩模,再对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的复数个凸起部,之后除去所述第一掩模;Forming a patterned first mask on the first surface of the substrate, and etching the first surface of the substrate to form a plurality of spaced apart ones on the first surface of the substrate a raised portion, after which the first mask is removed;
在所述衬底的第二表面上设置图形化的第二掩模,再对所述衬底的第二表面进行刻蚀,直至形成贯穿所述衬底的第一流体通道,再除去所述第二掩模;Forming a second mask on the second surface of the substrate, and etching the second surface of the substrate until a first fluid passage is formed through the substrate, and then removing the Second mask;
至少选用蒸镀、沉积和生长中的任一种方式在所述复数个凸起部上部分别形成帽形结构,并使所述帽形结构的相背对的两侧部沿侧向外延,且使相邻帽形结构之间形成所述的开口部。Forming a hat-shaped structure on each of the plurality of protrusions at least one of evaporating, depositing, and growing, and laterally extending the opposite sides of the hat-shaped structure, and The opening portion is formed between adjacent hat-shaped structures.
本申请实施例的另一个方面提供的一种流体处理装置包括:Another aspect of the embodiments of the present application provides a fluid processing apparatus comprising:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面;a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
由复数根线形体相互交叉形成的多孔结构,用以与所述基体的第一表面配合形成第二流体通道,所述复数根线形体一端均与所述基体固定连接,所述多孔结构中孔洞的直径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。 a porous structure formed by intersecting a plurality of linear bodies to form a second fluid passage with the first surface of the base body, wherein the plurality of linear bodies are fixedly connected to the base body at one end, and the porous structure has a hole The diameter is greater than zero but less than the particle size of the selected particles that are intermixed within the fluid to be treated, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
其中,所述基体可以是各种形态的,例如矩形体状、片状、多面体状、半球状、球状或其它非规则形态的。因此,所述的“第一表面”可以是所述基体上的任何一个非特定的合适的平面或曲面。Wherein, the substrate may be in various forms, such as a rectangular shape, a sheet shape, a polyhedral shape, a hemispherical shape, a spherical shape or other irregular forms. Thus, the "first surface" may be any non-specific suitable plane or curved surface on the substrate.
其中,所述第一流体通道可以是任意形态的通孔,其流体入口分布在所述基体的第一表面上,而其流体出口既可以分布在所述基体的与所述第一表面不同的另一表面上(例如,该另一表面可以与所述第一表面相邻、相背对),也可分布在所述的第一表面上(当然在这种情况下,所述的第一表面上应有流体阻隔机构,使待处理的流体不会在所述第一表面上直接流动至所述流体出口处。在一些情况下,所述第一流体通道的流体出口也是可以分布在所述基体内部的,例如,当所述基体内存在用以接收经处理后的流体的空腔时。Wherein, the first fluid passage may be a through hole of any shape, the fluid inlet thereof is distributed on the first surface of the base body, and the fluid outlet thereof may be distributed on the base body different from the first surface On the other surface (for example, the other surface may be adjacent to, opposite to the first surface), may also be distributed on the first surface (of course, in this case, the first There should be a fluid blocking mechanism on the surface such that the fluid to be treated does not flow directly onto the first surface to the fluid outlet. In some cases, the fluid outlet of the first fluid channel can also be distributed Inside the substrate, for example, when there is a cavity in the substrate to receive the treated fluid.
其中,所述的待处理流体可以是气相或液相的,例如空气、水、油类,在某些情况下,也可以是呈流体状的颗粒物质的集合,或者某些物质的熔融态等。Wherein, the fluid to be treated may be in a gas phase or a liquid phase, such as air, water, oil, and in some cases, may be a collection of fluid substances in a fluid state, or a molten state of certain substances, etc. .
其中,所述的“颗粒”主要是指固相颗粒,但在某些情况下,亦可以是与所述流体(特别是液相流体)不相容的液滴等。Herein, the "particles" mainly refer to solid phase particles, but in some cases, may also be droplets or the like which are incompatible with the fluid (especially a liquid phase fluid).
其中,所述的线形体可以是直线形、曲线形的,优选为直线形的,其利于制备,且可使形成的多孔结构中的孔洞大小等更为可控。以及,所述的线形体可以是实心或空心的,例如纳米级或微米级的线、管等,但不限于此。Wherein, the linear body may be linear, curved, preferably linear, which is advantageous for preparation, and can make the size of the hole in the formed porous structure more controllable. And, the linear body may be solid or hollow, such as a nano- or micro-scale wire, tube, etc., but is not limited thereto.
其中,所述线形体的直径优选为1nm~50μm。The diameter of the linear body is preferably from 1 nm to 50 μm.
其中,任一线形体的一端和与该线形体相邻的另一线形体的一端之间的距离优选为1nm~50μm。The distance between one end of any linear body and one end of another linear body adjacent to the linear body is preferably from 1 nm to 50 μm.
其中,所述线形体的长度优选为50nm~200μm。The length of the linear body is preferably 50 nm to 200 μm.
优选的,所述线形体可采用纳米线,其直径较小,可以密集分布以形成孔径较小的孔洞,进而可以在保持较高流体通量的同时,还可实现对包含较小粒径(微米乃至纳米级别)的颗粒的流体进行处理。Preferably, the linear body can adopt nanowires, which are small in diameter and can be densely distributed to form pores having a small pore diameter, thereby maintaining a high fluid flux and achieving a smaller particle size ( The fluid of the particles of micron or even nanometers is processed.
优选的,所述线形体可采用纳米线,由这些纳米线形成的阵列可具有超疏水结构,进而使得所述流体处理装置具有自清洁功能。Preferably, the linear body may adopt nanowires, and the array formed by the nanowires may have a superhydrophobic structure, thereby enabling the fluid processing apparatus to have a self-cleaning function.
前述纳米线亦可替换为纳米管等。The aforementioned nanowires may also be replaced by nanotubes or the like.
例如,所述的线形体可以优选自碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线等,且不限于此。For example, the linear body may be preferably selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
其中,所述的线形体可以通过外界转移、原位生长(例如化学生长、电化学生长)或沉积(例如物理、化学气相沉积,电沉积)等方式固定于所述基体表面或者于所述基体表面生 长形成。Wherein, the linear body may be fixed to the surface of the substrate or to the substrate by external transfer, in-situ growth (for example, chemical growth, electrochemical growth) or deposition (for example, physical, chemical vapor deposition, electrodeposition) or the like. Surface growth Long formation.
其中,所述第一流体通道的流体入口具有规则或不规则形状,例如多边形(矩形、菱形或其它)、圆形或椭圆形等,其可以依据实际应用之需求而简单调整。Wherein, the fluid inlet of the first fluid channel has a regular or irregular shape, such as a polygon (rectangular, diamond or other), a circle or an ellipse, etc., which can be easily adjusted according to the needs of practical applications.
在一些较为优选的实施方案中,所述复数根线形体的一端均与所述基体的第一表面固定连接,并环绕分布于所述第一流体通道的流体入口周围。这样的设置形式,可使分布于所述流体入口周围的复数根线形体之间形成的多孔结构均作为第二流体通道的组成部分,从而获得较大的流体通量。In some preferred embodiments, one end of the plurality of linear bodies is fixedly coupled to the first surface of the base body and is distributed around the fluid inlet of the first fluid passage. Such an arrangement allows the porous structure formed between the plurality of linear bodies distributed around the fluid inlet to be part of the second fluid passage, thereby obtaining a larger fluid flux.
在一些较为优选的实施方案中,所述的流体处理装置还包括:In some preferred embodiments, the fluid processing apparatus further includes:
彼此间隔设置的复数个凸起部,所述凸起部固定设置在所述基体的第一表面上,并沿横向在所述基体的第一表面上连续延伸,其中至少两个凸起部分别与所述第一流体通道的流体入口的相背对的两侧相邻设置,至少一个凸起部直接从所述第一流体通道的流体入口上通过,所述凸起部上固定连接有两根以上所述的线形体。a plurality of raised portions spaced apart from each other, the raised portion is fixedly disposed on the first surface of the base body, and extends continuously on the first surface of the base body in a lateral direction, wherein at least two raised portions are respectively respectively Adjacent to opposite sides of the fluid inlet of the first fluid passage, at least one projection directly passes through the fluid inlet of the first fluid passage, and the projection is fixedly connected with two The linear body described above.
其中,所述的复数个凸起部是指两个或更多凸起部。其中所述的凸起部是相对于所述基体的第一表面的平坦或凹下的部分而言,其形态可以是多样的,例如,从俯视图上观察,其可以为具有直线或曲线形轮廓等的条状、片状或其它规则或不规则形态等,且不限于此。优选的,所述凸起部可以具有较大的厚度和较大的宽度,如此可以为所述线形体提供较好的支撑,而各凸起部的距离可以较大。Wherein, the plurality of raised portions refers to two or more raised portions. Where the raised portion is a flat or concave portion with respect to the first surface of the base body, the shape thereof may be various, for example, as viewed from a plan view, it may have a straight or curved contour Strips, sheets or other regular or irregular forms, etc., and are not limited thereto. Preferably, the raised portion may have a larger thickness and a larger width, so that the linear body may be better supported, and the distance between the convex portions may be larger.
其中,所述的复数个凸起部可以规则或不规则、均匀或非均匀的分布在所述基体的第一表面上。Wherein, the plurality of protrusions may be regularly or irregularly distributed uniformly or non-uniformly on the first surface of the substrate.
在一些较为优选的实施方案中,连接在一凸起部上的复数根线形体和连接在与该凸起部相邻的另一凸起部上的复数根线形体相互交叉。In some preferred embodiments, the plurality of linear bodies attached to a raised portion and the plurality of linear bodies joined to the other raised portion adjacent the raised portion intersect each other.
在一些较为优选的实施案例中,所述复数个凸起部平行分布在所述基体的第一表面上。In some preferred embodiments, the plurality of raised portions are distributed in parallel on the first surface of the substrate.
在一些较为优选的具体实施方案中,所述凸起部的宽度为0.1μm~100μm,高度为0.1μm~400μm。In some preferred embodiments, the raised portion has a width of from 0.1 μm to 100 μm and a height of from 0.1 μm to 400 μm.
前述的“横向”系指平行或基本平行于所述基体的第一表面的任意方向。相应的,前述的“纵向”系指垂直或基本垂直于所述横向的方向。The foregoing "transverse" refers to any direction that is parallel or substantially parallel to the first surface of the substrate. Correspondingly, the aforementioned "longitudinal" means a direction that is perpendicular or substantially perpendicular to the transverse direction.
在一些较为优选的具体实施方案中,相邻凸起部之间的距离为0.1μm~100μm。In some preferred embodiments, the distance between adjacent raised portions is from 0.1 μm to 100 μm.
其中,所述流体处理装置中各部分的材料选择范围是多样的,可以是无机材料,也可以是有机材料。例如,可以选自金属、硅片、陶瓷、聚合物等,且不限于此。当这些部分都选择使用无机材料时,所述流体处理装置还具有耐温度变化的特性,可以处理高温和低温流体。 Wherein, the material selection range of each part in the fluid processing device is various, and may be an inorganic material or an organic material. For example, it may be selected from metals, silicon wafers, ceramics, polymers, and the like, and is not limited thereto. When these portions are all selected to use inorganic materials, the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
在一些较为优选的实施方案中,所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化材料、抗菌材料等等,且不限于此。例如,较为典型的光催化材料可以是二氧化钛等,在包含此种功能材料的流体处理装置对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。又例如,较为典型的抗菌材料可以是诸如Au、Ag等贵金属,藉其可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等。In some preferred embodiments, the surface of the convex portion is further provided with a layer of a functional material, and the material of the functional material layer includes a photocatalytic material, an antibacterial material and the like, and is not limited thereto. For example, a typical photocatalytic material may be titanium dioxide or the like. When the fluid is processed by a fluid processing device containing such a functional material, some organic pollutants in the fluid may be photocatalyzed by ultraviolet light or the like. Degradation, achieving multiple purification of fluids. For another example, a more typical antibacterial material may be a noble metal such as Au or Ag, which can synchronously kill bacteria, viruses and the like in the fluid during the processing of the fluid.
进一步的,为利于光线透入,所述基体、线形体、凸起部中的部分或全部可以由透明材料制成。Further, in order to facilitate light penetration, part or all of the substrate, the linear body, and the convex portion may be made of a transparent material.
在一些较为优选的实施方案中,所述流体处理装置包括平行分布在所述基体的第一表面的复数根横梁(即所述凸起部),所述横梁沿横向在所述基体的第一表面连续延伸,其中至少两根横梁分别与所述第一流体通道的流体入口的相背对的两侧相邻设置,至少一根横梁直接从所述第一流体通道的流体入口上通过;以及,任一横梁上均分布有复数根线形体,该复数根线形体中的至少部分线形体的一端固定于所述横梁表面,另一端沿逐渐远离该任一横梁的方向斜向延伸和/或在平行于所述基体第一表面的面上连续延伸,并与分布在相邻于该任一横梁的另一横梁上的复数根线形体相互交叉,从而形成所述多孔结构。In some preferred embodiments, the fluid processing apparatus includes a plurality of beams (ie, the raised portions) that are distributed in parallel on a first surface of the substrate, the beams being first in a lateral direction at the base The surface extends continuously, wherein at least two of the beams are respectively disposed adjacent to opposite sides of the fluid inlet of the first fluid passage, and at least one of the beams passes directly from the fluid inlet of the first fluid passage; a plurality of linear bodies are disposed on any of the beams, and at least a portion of the linear bodies of the plurality of linear bodies are fixed to the surface of the beam, and the other end extends obliquely away from the direction of the beam and/or The porous structure is formed by continuously extending on a plane parallel to the first surface of the substrate and intersecting a plurality of linear bodies distributed on another beam adjacent to the one of the beams.
在一些具体实施例中,至少两根横梁直接从所述第一流体通道的流体入口上通过。In some embodiments, at least two beams pass directly over the fluid inlet of the first fluid passage.
本申请实施例的另一个方面提出的一种制备所述流体处理装置的方法包括:A method of preparing the fluid processing apparatus according to another aspect of the embodiments of the present application includes:
提供具有相背对的第一表面和第二表面的衬底;Providing a substrate having opposite first and second surfaces;
对所述衬底进行加工,从而在所述衬底上形成第一流体通道,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述衬底的第一表面;Processing the substrate to form a first fluid channel on the substrate, the first fluid channel having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid channel being distributed over the substrate First surface
于所述衬底上形成复数根线形体,并使该复数根线形体相互交叉形成多孔结构,所述多孔结构与所述基体的第一表面配合形成第二流体通道,所述多孔结构中孔洞的直径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。Forming a plurality of linear bodies on the substrate, and intersecting the plurality of linear bodies to form a porous structure, the porous structure cooperating with the first surface of the substrate to form a second fluid channel, the hole in the porous structure The diameter is greater than zero but less than the particle size of the selected particles that are intermixed within the fluid to be treated, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
在一些较为具体的实施方案中,所述制备方法包括:In some more specific embodiments, the method of preparation comprises:
对所述衬底的第一表面进行加工,从而在所述衬底的第一表面形成彼此间隔设置的复数个凸起部,或者,在所述衬底的第一表面生长形成彼此间隔设置的复数个凸起部,所述凸起部沿横向在所述基体的第一表面上连续延伸,其中至少两个凸起部分别与所述第一流体通道的流体入口的相背对的两侧相邻设置,至少一个凸起部直接从所述第一流体通道的流体入口上通过; Processing the first surface of the substrate to form a plurality of protrusions spaced apart from each other on the first surface of the substrate, or growing on the first surface of the substrate to form a space spaced apart from each other a plurality of raised portions extending continuously in a lateral direction on the first surface of the base body, wherein at least two raised portions are respectively opposite to opposite sides of the fluid inlet of the first fluid passage Adjacently disposed, at least one raised portion directly passes over the fluid inlet of the first fluid passage;
于所述凸起部上生长形成复数根线形体,且使任一凸起部上的复数根线形体和与该任一凸起部相邻的另一凸起部上的复数根线形体相互交叉形成多孔结构,所述多孔结构与所述基体的第一表面配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。Forming a plurality of linear bodies on the convex portion, and causing a plurality of linear bodies on any convex portion and a plurality of linear bodies on another convex portion adjacent to the convex portion to mutually The intersection forms a porous structure that cooperates with the first surface of the substrate to form a second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
在一些更为具体的实施方案中,所述制备方法包括:In some more specific embodiments, the method of preparation comprises:
在所述衬底的第一表面设置用于纳米线(即所述线形体)生长的种子层;Providing a seed layer for growth of nanowires (ie, the linear bodies) on a first surface of the substrate;
在所述种子层上设置图形化的第一光刻胶掩模,再对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的复数个凸起部,之后除去所述第一光刻胶掩模;Forming a patterned first photoresist mask on the seed layer, and etching the first surface of the substrate to form a plurality of protrusions spaced apart from each other on the first surface of the substrate Starting, then removing the first photoresist mask;
在所述衬底的第二表面上设置图形化的第二光刻胶掩模,再对所述衬底的第二表面进行刻蚀,从而在所述衬底的第二表面形成贯穿至所述衬底的第一表面的槽孔,用以作为第一流体通道,之后除去所述第四光刻胶掩模;Forming a second photoresist mask on the second surface of the substrate, and etching the second surface of the substrate to form a through surface at the second surface of the substrate a slot of the first surface of the substrate for use as a first fluid passage, after which the fourth photoresist mask is removed;
在余留于所述凸起部顶部的种子层上生长形成复数根纳米线,并使该复数根纳米线相互交叉形成多孔结构。A plurality of nanowires are grown on the seed layer remaining on the top of the raised portion, and the plurality of nanowires are crossed to form a porous structure.
本申请实施例的另一个方面提出的一种流体处理装置包括:A fluid processing apparatus according to another aspect of the embodiments of the present application includes:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面的第一区域内;a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
流体阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理流体直接进入所述第一流体通道的流体入口;a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
彼此间隔设置的复数个凸起部,所述凸起部一端固定设置于所述基体的第一表面的第二区域内,另一端与所述流体阻挡部的第二表面固定连接,其中相邻凸起部之间的距离大于0但小于混杂于待处理的流体内的选定颗粒的粒径,所述基体的第一表面的第二区域与第一区域邻接,从而使所述复数个凸起部、流体阻挡部与基体之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of raised portions spaced apart from each other, the convex portion is fixedly disposed at one end in a second region of the first surface of the base body, and the other end is fixedly connected to the second surface of the fluid blocking portion, wherein adjacent The distance between the raised portions is greater than zero but less than the particle size of the selected particles that are intermingled with the fluid to be treated, the second region of the first surface of the substrate being contiguous with the first region, such that the plurality of convexities The starting portion, the fluid blocking portion and the base body cooperate to form a second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
作为优选方案之一,本申请实施例的另一个方面提出的一种流体处理装置包括:As one of the preferred embodiments, a fluid processing apparatus according to another aspect of the embodiments of the present application includes:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面的第一区域内;a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
流体阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理流体直接进入所述第一流体通道的流体入口;a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
分布于所述基体的第一表面的第二区域内的、且彼此间隔的复数根竖直纳米线状体,所述基体的第一表面的第二区域环绕所述第一区域设置,所述纳米线状体的两端分别与所述基 体的第一表面及所述流体阻挡部的第二表面固定连接,其中相邻纳米线状体之间的距离大于0但小于混杂于待处理的流体内的选定颗粒的粒径,从而使所述复数根纳米线状体、流体阻挡部与基体之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of vertical nano-linear bodies distributed in a second region of the first surface of the substrate and spaced apart from each other, a second region of the first surface of the substrate being disposed around the first region, Both ends of the nanowire body and the base The first surface of the body and the second surface of the fluid barrier are fixedly connected, wherein the distance between adjacent nano-linear bodies is greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, thereby The plurality of nano-linear bodies, the fluid blocking portion and the base body cooperate to form a second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
其中,所述基体可以是各种形态的,例如矩形体状、片状、多面体状、半球状、球状或其它非规则形态的。因此,所述的“第一表面”可以是所述基体上的任何一个非特定的合适的平面或曲面。Wherein, the substrate may be in various forms, such as a rectangular shape, a sheet shape, a polyhedral shape, a hemispherical shape, a spherical shape or other irregular forms. Thus, the "first surface" may be any non-specific suitable plane or curved surface on the substrate.
其中,所述第一流体通道可以是任意形态的通孔,其流体入口分布在所述基体的第一表面上,而其流体出口既可以分布在所述基体的与所述第一表面不同的另一表面上(例如,该另一表面可以与所述第一表面相邻、相背对),也可分布在所述的第一表面上(当然在这种情况下,所述的第一表面上应有流体阻隔机构,使待处理的流体不会在所述第一表面上直接流动至所述流体出口处。在一些情况下,所述第一流体通道的流体出口也是可以分布在所述基体内部的,例如,当所述基体内存在用以接收经处理后的流体的空腔时。Wherein, the first fluid passage may be a through hole of any shape, the fluid inlet thereof is distributed on the first surface of the base body, and the fluid outlet thereof may be distributed on the base body different from the first surface On the other surface (for example, the other surface may be adjacent to, opposite to the first surface), may also be distributed on the first surface (of course, in this case, the first There should be a fluid blocking mechanism on the surface such that the fluid to be treated does not flow directly onto the first surface to the fluid outlet. In some cases, the fluid outlet of the first fluid channel can also be distributed Inside the substrate, for example, when there is a cavity in the substrate to receive the treated fluid.
其中,所述流体阻挡部亦可以是多种形态的,例如可以为片状、薄壳状、矩形体状、多面体状等,只要其能够使待处理的流体不会从由所述复数个凸起部(或者纳米线状体)、流体阻挡部与基体之间配合形成的第二流体通道之外的流体通道进入所述的第一流体通道的流体入口即可。而所述流体阻挡部的设置形式亦可以为多样的,例如,其可以整体与所述基体间隔设置,亦可局部与所述基体连接,甚至在某些情况下,亦可是与所述基体被一体加工形成。The fluid blocking portion may be in various forms, for example, a sheet shape, a thin shell shape, a rectangular shape, a polyhedral shape, or the like, as long as it can prevent the fluid to be processed from being subjected to the plurality of convexities. The fluid passage other than the second fluid passage formed by the cooperation between the starting portion (or the nano-linear body) and the fluid blocking portion and the base body may enter the fluid inlet of the first fluid passage. The arrangement of the fluid blocking portion may also be various. For example, it may be disposed integrally with the base body, or may be partially connected to the base body, or even in some cases, may be Integrated processing.
其中,所述基体的第一表面的第一区域和第二区域的分布形态可以是多样的,例如所述第一区域与第二区域可以是邻接的,也可以间隔一定距离,也可以是第二区域环绕第一区域设置,也可以是第一区域局部嵌入第二区域。该两者的分布形态可依据所述流体阻挡部、基体的结构及彼此之间的位置关系等而调整。The distribution of the first region and the second region of the first surface of the substrate may be various. For example, the first region and the second region may be adjacent to each other, or may be separated by a certain distance, or may be The two regions are disposed around the first region, and the first region may be partially embedded in the second region. The distribution pattern of the two can be adjusted depending on the fluid blocking portion, the structure of the substrate, the positional relationship between each other, and the like.
其中,所述的复数个凸起部是指两个或更多凸起部。其中所述的凸起部是相对于所述基体的第一表面的平坦或凹下的部分而言,其形态可以是多样的,例如,其可以为站立设置的线状、柱状、片状、管状、锥状、锥台状结构或其它规则或不规则结构,优选为纳米线状体,而其横向截面结构(此处的横向,主要是指与所述基体的第一表面平行的方向)亦可以是规则或不规则形状的,例如可以是多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等(参阅图9a-图9e)。Wherein, the plurality of raised portions refers to two or more raised portions. Wherein the convex portion is a flat or concave portion with respect to the first surface of the base body, and the shape thereof may be various, for example, it may be a line, a column, a sheet, or a tubular, tapered, frustum-like structure or other regular or irregular structure, preferably a nano-linear body, and a transverse cross-sectional structure thereof (the lateral direction herein mainly refers to a direction parallel to the first surface of the substrate) It may also be of a regular or irregular shape, such as a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, etc. (see Figures 9a-9e).
其中,所述的复数个凸起部可以规则或不规则、均匀或非均匀的分布在所述基体的第一表面上(参阅图10a-图10c)。 Wherein, the plurality of protrusions may be regularly or irregularly distributed uniformly or non-uniformly on the first surface of the substrate (see FIGS. 10a-10c).
优选的,所述竖直纳米线状体原位生长于所述基体的第一表面。Preferably, the vertical nanowire body is grown in situ on the first surface of the substrate.
其中,所述第一流体通道的流体入口具有规则或不规则形状,例如多边形(矩形、菱形或其它)、圆形或椭圆形等,其可以依据实际应用之需求而简单调整。Wherein, the fluid inlet of the first fluid channel has a regular or irregular shape, such as a polygon (rectangular, diamond or other), a circle or an ellipse, etc., which can be easily adjusted according to the needs of practical applications.
其中,所述的待处理流体可以是气相或液相的,例如空气、水、油类,在某些情况下,也可以是呈流体状的颗粒物质的集合,或者某些物质的熔融态等。Wherein, the fluid to be treated may be in a gas phase or a liquid phase, such as air, water, oil, and in some cases, may be a collection of fluid substances in a fluid state, or a molten state of certain substances, etc. .
其中,所述的“颗粒”主要是指固相颗粒,但在某些情况下,亦可以是与所述流体(特别是液相流体)不相容的液滴等。Herein, the "particles" mainly refer to solid phase particles, but in some cases, may also be droplets or the like which are incompatible with the fluid (especially a liquid phase fluid).
在一些较为优选的实施方案中,所述基体的第一表面的第二区域环绕所述第一区域设置。特别是,分布于所述第二区域的复数个凸起部环绕所述第一流体通道的流体入口设置。这样的设置形式,可使分布于所述第二区域的复数个凸起部之间的间隙均作为第二流体通道的组成部分,从而获得较大的流体通量。In some preferred embodiments, the second region of the first surface of the substrate is disposed about the first region. In particular, a plurality of raised portions distributed in the second region are disposed around the fluid inlet of the first fluid passage. Such an arrangement allows the gaps between the plurality of raised portions distributed in the second region to be part of the second fluid passage, thereby obtaining a larger fluid flux.
在一些较为优选的实施方案中,所述基体的第一表面的第三区域内亦间隔设置有复数个凸起部,所述第二区域设于所述第三区域和第一区域之间。其中,分布在所述第三区域的复数个凸起部的顶部可与所述流体阻挡部连接,也可不与所述流体阻挡部连接,特别是,当这些凸起部顶部不与所述流体阻挡部连接时,则这些凸起部顶部之间的间隙亦可构成流体通道,从而进一步增加所述流体处理装置与流体的接触面,提升流体通量。In some preferred embodiments, the third surface of the first surface of the substrate is also spaced apart from the plurality of protrusions, and the second region is disposed between the third region and the first region. Wherein the tops of the plurality of protrusions distributed in the third region may or may not be connected to the fluid blocking portion, in particular, when the tops of the protrusions are not associated with the fluid When the blocking portions are connected, the gap between the tops of the raised portions may also constitute a fluid passage, thereby further increasing the contact surface of the fluid processing device with the fluid and increasing the fluid flux.
尤其优选的,所述基体的第一表面的第三区域环绕所述第二区域设置。进一步的,分布在所述第三区域的凸起部与分布在所述第二区域的凸起部可以是相同或不同的。特别优选的,无论是分布在所述第三区域还是所述第二区域,只要是分布在所述基体的第一表面的相邻凸起部之间的距离均大于0但小于混杂于待处理的流体内的选定颗粒的粒径。Particularly preferably, a third region of the first surface of the substrate is disposed around the second region. Further, the convex portion distributed in the third region and the convex portion distributed in the second region may be the same or different. Particularly preferably, whether it is distributed in the third region or the second region, as long as the distance between adjacent convex portions distributed on the first surface of the substrate is greater than 0 but less than mixed The particle size of the selected particles within the fluid.
较为优选的,所述基体的第一表面的第一区域及第二区域分布在所述流体阻挡部于所述基体的第一表面上的正投影内。More preferably, the first region and the second region of the first surface of the substrate are distributed within an orthographic projection of the fluid blocking portion on the first surface of the substrate.
较为优选的,所述凸起部为线状或柱状凸起,其长径比为4:1~200000:1,而相邻凸起部之间的距离与所述凸起部的长度的比值为1:4~1:200000。通过采用这种结构和分布形态的凸起部,可以使多个凸起部可密集布置(凸起部自身在单位面积内所占比例少),利于对流体中的微小颗粒进行处理,同时还赋予所述流体处理装置较大的流体通量(凸起部之间的孔隙较之凸起部自身体积更大)。Preferably, the convex portion is a linear or columnar protrusion having an aspect ratio of 4:1 to 200000:1, and a ratio of a distance between adjacent convex portions to a length of the convex portion. It is 1:4~1:200000. By adopting the convex portion of such a structure and a distribution pattern, a plurality of convex portions can be densely arranged (the proportion of the convex portion itself in a unit area is small), which facilitates processing of minute particles in the fluid, and also The fluid handling device is given a greater fluid flux (the pores between the bosses are larger than the boss itself).
尤其优选的,所述凸起部为竖立设置的微米线(管)或纳米线(管),其直径为1nm~50μm,长度为50nm~200μm,相邻凸起部之间的距离为1nm~50μm,如此可以使构建形成的流体处理装置能处理流体中粒径小至纳米级的颗粒,且保持较高的流体处理通量。 Particularly preferably, the convex portion is an upright microwire (tube) or a nanowire (tube) having a diameter of 1 nm to 50 μm, a length of 50 nm to 200 μm, and a distance between adjacent convex portions of 1 nm. 50 μm, this allows the fluid handling device to be constructed to handle particles of particle size as small as nanometers in the fluid while maintaining a high fluid handling flux.
更进一步的,分布于所述基体的第一表面的第三区域的复数个凸起部排布形成具有超疏水或超疏油性能的微米级或纳米级阵列结构。如此,还可赋予所述流体处理装置自清洁等功能。Further, the plurality of protrusions distributed in the third region of the first surface of the substrate are arranged to form a micro- or nano-scale array structure having superhydrophobic or superoleophobic properties. In this way, the fluid processing device can also be provided with functions such as self-cleaning.
当然,也可以通过在所述凸起部的局部或全部表面设置由业界已知的合适低表面能物质形成的涂层,或直接利用疏水材料形成所述凸起部,从而使其具有超疏水性能、自清洁性能等。Of course, it is also possible to form the convex portion by forming a coating formed of a suitable low surface energy substance known in the art on a part or the whole surface of the convex portion, or directly forming the convex portion with a hydrophobic material, thereby making it superhydrophobic. Performance, self-cleaning performance, etc.
在一些较为具体的实施方案中,所述第一流体通道的孔径可以为1μm~1mm。In some more specific embodiments, the first fluid channel may have a pore size of from 1 μm to 1 mm.
在一些较为具体的实施方案中,所述基体的厚度在1μm以上。In some more specific embodiments, the substrate has a thickness of 1 μm or more.
其中,所述基体的材质可以选自金属、非金属、有机材料、无机材料等,例如硅片、聚合物、陶瓷等,且不限于此。The material of the substrate may be selected from a metal, a non-metal, an organic material, an inorganic material, or the like, such as a silicon wafer, a polymer, a ceramic, or the like, and is not limited thereto.
在一些较为优选的实施方案中,所述凸起部可选自纳米线,例如碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线中的任一种或两种以上的组合。In some preferred embodiments, the raised portion may be selected from nanowires, such as carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires. Any one or a combination of two or more.
在一些具体应用方案中,所述凸起部可以由光催化材料或具有抗菌、杀菌功能的材料形成,或者,所述凸起部也可以是表面覆盖有光催化材料或具有杀菌、抗菌功能的材料形成的涂层。例如,所述凸起部可采用ZnO纳米线、GaN纳米线、TiO2纳米线等具有光催化的性质的纳米线,在光辅助照射下,能够降解流体中的有机物。例如,所述凸起部可采用Ag纳米线、Au纳米线等,以杀灭流体中的细菌、病毒、微生物。In some specific applications, the protrusion may be formed of a photocatalytic material or a material having an antibacterial or bactericidal function, or the protrusion may be covered with a photocatalytic material or have a bactericidal or antibacterial function. A coating formed by the material. For example, the protrusions may employ nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO 2 nanowires, and are capable of degrading organic substances in the fluid under light-assisted illumination. For example, the protrusions may employ Ag nanowires, Au nanowires, or the like to kill bacteria, viruses, and microorganisms in the fluid.
在一些较为具体的实施方案中,所述流体阻挡部的厚度为0.5μm~200μm。In some more specific embodiments, the fluid barrier has a thickness of from 0.5 μm to 200 μm.
在一些较为优选的实施方案中,所述流体处理装置还可包括至少一个支撑体,所述支撑体一端与所述基体固定连接,另一端与所述流体阻挡部固定连接。藉由所述支撑体,可实现流体阻挡部与基体之间更为牢固稳定的配合,并可有效的对分布在流体阻挡部与基体之间的凸起部形成保护,避免因流体阻挡部和/或基体在受到外力作用后,对所述凸起部挤压而造成的凸起部坍塌、损毁等问题。In some preferred embodiments, the fluid treatment device may further include at least one support body, one end of the support body being fixedly coupled to the base body and the other end being fixedly coupled to the fluid blocking portion. By the support body, a more stable and stable fit between the fluid blocking portion and the base body can be achieved, and the convex portion distributed between the fluid blocking portion and the base body can be effectively protected from the fluid blocking portion and / or the problem that the base body is collapsed, damaged, etc. caused by the pressing of the convex portion after being subjected to an external force.
其中,所述支撑体可以是多种形态的,例如柱状(圆柱、多棱柱等)、台阶状、锥台状等,且不限于此,其抗折能力应大于任一所述的凸起部。以及,所述支撑体可以是在流体阻挡部与基体之间加工形成,也可以是与基体或流体阻挡部一体加工形成。Wherein, the support body may be in various forms, such as a column shape (cylindrical, polygonal prism, etc.), a step shape, a frustum shape, or the like, and is not limited thereto, and the folding resistance should be greater than any of the raised portions. . And, the support body may be formed by machining between the fluid blocking portion and the base body, or may be integrally formed with the base body or the fluid blocking portion.
进一步的,所述的支撑体可以是两个以上,并且该两个以上支撑体对称分布于所述第一流体通道的流体入口周围。Further, the support body may be two or more, and the two or more support bodies are symmetrically distributed around the fluid inlet of the first fluid passage.
在一些较为优选的实施方案中,所述第一流体通道的流体入口上还可架设有一根以上支 撑梁,所述支撑梁与所述流体阻挡部固定连接,用以对流体阻挡部形成支撑,进一步提升所述流体处理装置的结构强度。In some preferred embodiments, more than one branch may be disposed on the fluid inlet of the first fluid passage. The support beam is fixedly connected to the fluid blocking portion for forming a support for the fluid blocking portion to further enhance the structural strength of the fluid processing device.
进一步的,所述支撑梁可以为多根,其可以平行排布在所述第一流体通道的流体入口上。Further, the support beam may be a plurality of wires, which may be arranged in parallel on the fluid inlet of the first fluid channel.
在一些较为优选的实施方案中,所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化材料、抗菌材料等等,且不限于此。例如,较为典型的光催化材料可以是二氧化钛等,在包含此种功能材料的流体处理装置对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。又例如,较为典型的抗菌材料可以是诸如Au、Ag等贵金属,藉其可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等。In some preferred embodiments, the surface of the convex portion is further provided with a layer of a functional material, and the material of the functional material layer includes a photocatalytic material, an antibacterial material and the like, and is not limited thereto. For example, a typical photocatalytic material may be titanium dioxide or the like. When the fluid is processed by a fluid processing device containing such a functional material, some organic pollutants in the fluid may be photocatalyzed by ultraviolet light or the like. Degradation, achieving multiple purification of fluids. For another example, a more typical antibacterial material may be a noble metal such as Au or Ag, which can synchronously kill bacteria, viruses and the like in the fluid during the processing of the fluid.
进一步的,为利于光线透入,所述流体处理装置中的至少部分组件的至少局部为透明结构。例如,所述流体阻挡部、基体、凸起部中的部分或全部可以由透明材料制成。Further, at least a portion of the components of the fluid treatment device are at least partially transparent to facilitate light penetration. For example, part or all of the fluid blocking portion, the base body, and the boss portion may be made of a transparent material.
本申请实施例的另一个方面提出的一种流体处理装置的制备方法包括:A method for preparing a fluid processing apparatus according to another aspect of the embodiments of the present application includes:
提供具有第一表面和与第一表面相背对的第三表面的衬底;Providing a substrate having a first surface and a third surface opposite the first surface;
对所述衬底的第一表面进行加工,从而在所述衬底的第一表面形成彼此间隔设置的复数个凸起部,或者,在所述衬底的第一表面生长形成彼此间隔设置的复数个凸起部,其中相邻凸起部之间的距离大于0但小于混杂于待处理的流体内的选定颗粒的粒径;Processing the first surface of the substrate to form a plurality of protrusions spaced apart from each other on the first surface of the substrate, or growing on the first surface of the substrate to form a space spaced apart from each other a plurality of raised portions, wherein a distance between adjacent raised portions is greater than zero but less than a particle size of selected particles mixed in the fluid to be treated;
在所述衬底的第一表面上设置具有与所述衬底的第一表面相对设置的第二表面的流体阻挡部,并至少使分布在所述衬底的第一表面的第二区域内的复数个凸起部与所述流体阻挡部的第二表面固定连接;Providing a fluid barrier having a second surface disposed opposite the first surface of the substrate on a first surface of the substrate and at least distributed in a second region of the first surface of the substrate a plurality of protrusions fixedly connected to the second surface of the fluid blocking portion;
对所述衬底的第三表面进行加工,形成贯穿所述衬底的第一流体通道,所述第一流体通道的流体入口分布于所述衬底的第一表面的第一区域内,所述衬底的第一表面的第二区域与第一区域邻接,使分布在所述衬底的第一表面的第二区域内的复数个凸起部、流体阻挡部与衬底之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。Processing a third surface of the substrate to form a first fluid passage through the substrate, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate, a second region of the first surface of the substrate abuts the first region to form a plurality of protrusions, a fluid barrier, and a substrate disposed in a second region of the first surface of the substrate The second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
在一些较为具体的实施方案中,所述的制备方法包括:In some more specific embodiments, the method of preparation comprises:
在所述衬底的第一表面上设置图形化的第一光刻胶掩模,再对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的复数个凸起部,之后除去所述第一光刻胶掩模;Forming a patterned first photoresist mask on the first surface of the substrate, and etching the first surface of the substrate to form a space on the first surface of the substrate a plurality of raised portions, after which the first photoresist mask is removed;
在所述衬底的第一表面涂布可溶性或可腐蚀的有机物和/或无机物,并使有机物和/或无机物填充所述复数个凸起部之间的间隙,形成牺牲层; Coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between the plurality of protrusions with an organic substance and/or an inorganic substance to form a sacrificial layer;
在所述牺牲层上设置第二光刻胶掩模,再对所述牺牲层进行刻蚀,至少使分布在所述衬底的第一表面的第二区域中的复数个凸起部顶部暴露出,之后除去所述第二光刻胶掩模;Providing a second photoresist mask on the sacrificial layer, and etching the sacrificial layer to expose at least a top of the plurality of protrusions distributed in the second region of the first surface of the substrate And then removing the second photoresist mask;
在所述衬底的第一表面设置第三掩模,并使所述衬底第一表面上的、与所述流体阻挡部相对应的区域暴露出,之后沉积形成流体阻挡部,再除去所述第三掩模;Providing a third mask on the first surface of the substrate, and exposing a region on the first surface of the substrate corresponding to the fluid blocking portion, and then depositing to form a fluid blocking portion, and then removing the a third mask;
在所述衬底的第三表面上设置图形化的第四光刻胶掩模,再对所述衬底的第三表面进行刻蚀,直至露出填充在相邻凸起部之间的牺牲材料,从而在所述衬底的第三表面形成槽孔,所述槽孔所在位置与所述衬底的第一表面的第一区域相对应,所述衬底的第一表面的第二区域环绕所述第一区域设置,Forming a fourth photoresist mask on the third surface of the substrate, and etching the third surface of the substrate until the sacrificial material filled between the adjacent protrusions is exposed Forming a slot in the third surface of the substrate, the slot being located corresponding to the first area of the first surface of the substrate, the second area of the first surface of the substrate surrounding The first area setting,
除去所述第四光刻胶掩模及填充在所述复数个凸起部之间的牺牲材料,于所述衬底上形成所述第一流体通道。Removing the fourth photoresist mask and the sacrificial material filled between the plurality of protrusions to form the first fluid channel on the substrate.
较为优选的,所述的复数个凸起部为阵列排布的复数根竖直纳米柱或竖直纳米线。More preferably, the plurality of raised portions are a plurality of vertical nano-pillars or vertical nanowires arranged in an array.
本申请实施例的另一个方面提出的一种流体处理装置的制备方法包括:A method for preparing a fluid processing apparatus according to another aspect of the embodiments of the present application includes:
提供具有第一表面和与该第一表面相背对的第三表面的衬底;Providing a substrate having a first surface and a third surface opposite the first surface;
在所述衬底的第一表面上生长形成彼此间隔的复数根竖直纳米线状体,其中相邻纳米线状体之间的距离大于0但小于混杂于待处理的流体内的选定颗粒的粒径;Growing on the first surface of the substrate to form a plurality of vertical nano-linear bodies spaced apart from each other, wherein a distance between adjacent nano-linear bodies is greater than 0 but less than selected particles mixed in the fluid to be treated Particle size
在所述衬底的第一表面上设置具有与所述衬底的第一表面相对设置的第二表面的流体阻挡部,并至少使分布在所述衬底的第一表面的第二区域内的复数根纳米线状体与所述流体阻挡部的第二表面固定连接;Providing a fluid barrier having a second surface disposed opposite the first surface of the substrate on a first surface of the substrate and at least distributed in a second region of the first surface of the substrate a plurality of nano-linear bodies fixedly connected to the second surface of the fluid blocking portion;
对所述衬底的第三表面进行加工,形成贯穿所述衬底的第一流体通道,所述第一流体通道的流体入口分布于所述衬底的第一表面的第一区域内,所述衬底的第一表面的第二区域环绕所述第一区域设置,使分布在所述衬底的第一表面的第二区域内的复数根纳米线状体、流体阻挡部与衬底之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。Processing a third surface of the substrate to form a first fluid passage through the substrate, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate, a second region of the first surface of the substrate disposed around the first region such that a plurality of nanowires, fluid barriers, and substrates are distributed in a second region of the first surface of the substrate The interfitting forms a second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
在一些较为具体的实施方案中,所述的制备方法,其特征在于包括:In some more specific embodiments, the preparation method is characterized by comprising:
在所述衬底的第一表面生长形成彼此间隔的复数根纳米线状体;Growing on the first surface of the substrate to form a plurality of nano-linear bodies spaced apart from each other;
在所述衬底的第一表面涂布可溶性或可腐蚀的有机物和/或无机物,并使有机物和/或无机物填充所述复数根纳米线状体之间的间隙,形成牺牲层;Coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between the plurality of nano-linear bodies with an organic substance and/or an inorganic substance to form a sacrificial layer;
在所述牺牲层上设置第一光刻胶掩模,再对所述牺牲层进行刻蚀,至少使分布在所述衬底的第一表面的第二区域中的复数根纳米线状体顶部暴露出,之后除去所述第一光刻胶掩模;Providing a first photoresist mask on the sacrificial layer, and etching the sacrificial layer to at least top a plurality of nano-linear bodies distributed in a second region of the first surface of the substrate Exposing, then removing the first photoresist mask;
在所述衬底的第一表面设置第二掩模,并使所述衬底第一表面上的、与所述流体阻挡部 相对应的区域暴露出,之后沉积形成流体阻挡部,再除去所述第二掩模;Providing a second mask on the first surface of the substrate, and the first surface of the substrate and the fluid blocking portion Corresponding regions are exposed, and then deposited to form a fluid barrier, and then the second mask is removed;
在所述衬底的第三表面上设置图形化的第三光刻胶掩模,再对所述衬底的第三表面进行刻蚀,直至露出填充在相邻纳米线状体之间的牺牲材料,从而在所述衬底的第三表面形成槽孔,所述槽孔所在位置与所述衬底的第一表面的第一区域相对应,所述衬底的第一表面的第二区域环绕所述第一区域设置,Forming a patterned third photoresist mask on the third surface of the substrate, and etching the third surface of the substrate until the sacrifice between the adjacent nanowires is exposed a material to form a slot in a third surface of the substrate, the slot being located corresponding to a first region of the first surface of the substrate, the second region of the first surface of the substrate Surrounding the first area setting,
除去所述第三光刻胶掩模及填充在所述复数根纳米线状体之间的牺牲材料,于所述衬底上形成所述第一流体通道。The third photoresist mask and the sacrificial material filled between the plurality of nanowires are removed, and the first fluid channel is formed on the substrate.
本申请实施例的另一个方面提出的一种流体处理装置包括:A fluid processing apparatus according to another aspect of the embodiments of the present application includes:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面的第一区域内;a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
流体阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理流体直接进入所述第一流体通道的流体入口;a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
复数个凸起部,所述凸起部沿横向在所述基体的第一表面的第二区域连续延伸,其中相邻凸起部之间形成有可供流体通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,并且所述凸起部的上端与所述基体的第一表面密封连接,下端的局部区域与所述流体阻挡部的第二表面密封连接,从而使所述复数个凸起部之间的一个以上沟槽、流体阻挡部与基体配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions extending continuously in a second region of the first surface of the substrate in a lateral direction, wherein a groove through which a fluid can pass is formed between adjacent protrusions, the groove The opening of the opening has a diameter greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, and the upper end of the raised portion is sealingly connected to the first surface of the base, and the partial portion of the lower end is The second surface of the fluid blocking portion is sealingly connected such that more than one groove between the plurality of raised portions and the fluid blocking portion cooperate with the base body to form a second fluid passage, and the fluid to be treated can pass only the first The two fluid passages enter the first fluid passage.
前述的“横向”可以被理解为平行或基本平行于所述基体的第一表面的任意方向。而下文述及的“纵向”可以被理解为垂直或基本垂直于所述横向的方向。The foregoing "lateral direction" can be understood to mean any direction that is parallel or substantially parallel to the first surface of the substrate. The term "longitudinal" as used hereinafter may be understood to mean a direction that is perpendicular or substantially perpendicular to the transverse direction.
其中,所述基体可以是各种形态的,例如矩形体状、片状、多面体状、半球状、球状或其它非规则形态的。因此,所述的“第一表面”可以是所述基体上的任何一个非特定的合适的平面或曲面。Wherein, the substrate may be in various forms, such as a rectangular shape, a sheet shape, a polyhedral shape, a hemispherical shape, a spherical shape or other irregular forms. Thus, the "first surface" may be any non-specific suitable plane or curved surface on the substrate.
其中,所述第一流体通道可以是任意形态的通孔,其流体入口分布在所述基体的第一表面上,而其流体出口既可以分布在所述基体的与所述第一表面不同的另一表面上(例如,该另一表面可以与所述第一表面相邻、相背对),也可分布在所述的第一表面上(当然在这种情况下,所述的第一表面上应有流体阻隔机构,使待处理的流体不会在所述第一表面上直接流动至所述流体出口处。在一些情况下,所述第一流体通道的流体出口也是可以分布在所述基体内部的,例如,当所述基体内存在用以接收经处理后的流体的空腔时。Wherein, the first fluid passage may be a through hole of any shape, the fluid inlet thereof is distributed on the first surface of the base body, and the fluid outlet thereof may be distributed on the base body different from the first surface On the other surface (for example, the other surface may be adjacent to, opposite to the first surface), may also be distributed on the first surface (of course, in this case, the first There should be a fluid blocking mechanism on the surface such that the fluid to be treated does not flow directly onto the first surface to the fluid outlet. In some cases, the fluid outlet of the first fluid channel can also be distributed Inside the substrate, for example, when there is a cavity in the substrate to receive the treated fluid.
其中,所述流体阻挡部亦可以是多种形态的,例如可以为片状、薄壳状、矩形体状、多 面体状等,只要其能够使待处理的流体不会从由所述复数个凸起部、流体阻挡部与基体之间配合形成的第二流体通道之外的流体通道进入所述的第一流体通道的流体入口即可。而所述流体阻挡部的设置形式亦可以为多样的,例如,其可以整体与所述基体间隔设置,亦可局部与所述基体连接,甚至在某些情况下,亦可是与所述基体被一体加工形成。The fluid blocking portion may also be in various forms, such as a sheet shape, a thin shell shape, a rectangular shape, and a plurality of a face shape or the like as long as it can prevent the fluid to be treated from entering the first fluid from a fluid passage other than the second fluid passage formed by the plurality of projections, the fluid blocking portion and the base body The fluid inlet of the channel is sufficient. The arrangement of the fluid blocking portion may also be various. For example, it may be disposed integrally with the base body, or may be partially connected to the base body, or even in some cases, may be Integrated processing.
其中,所述基体的第一表面的第一区域和第二区域的分布形态可以是多样的,例如所述第一区域与第二区域可以是邻接的,也可以间隔一定距离,也可以是第二区域环绕第一区域设置,也可以是第一区域局部嵌入第二区域。该两者的分布形态可依据所述流体阻挡部、基体的结构及彼此之间的位置关系等而调整。The distribution of the first region and the second region of the first surface of the substrate may be various. For example, the first region and the second region may be adjacent to each other, or may be separated by a certain distance, or may be The two regions are disposed around the first region, and the first region may be partially embedded in the second region. The distribution pattern of the two can be adjusted depending on the fluid blocking portion, the structure of the substrate, the positional relationship between each other, and the like.
其中,所述的复数个凸起部是指两个或更多凸起部。其中所述的凸起部是相对于所述基体的第一表面的平坦或凹下的部分而言,其形态可以是多样的,例如,从俯视图上观察,其可以为具有直线或曲线形轮廓等的条状、片状或其它规则或不规则形态等,且不限于此。Wherein, the plurality of raised portions refers to two or more raised portions. Where the raised portion is a flat or concave portion with respect to the first surface of the base body, the shape thereof may be various, for example, as viewed from a plan view, it may have a straight or curved contour Strips, sheets or other regular or irregular forms, etc., and are not limited thereto.
其中,所述的复数个凸起部可以规则或不规则、均匀或非均匀的分布在所述基体的第一表面上。Wherein, the plurality of protrusions may be regularly or irregularly distributed uniformly or non-uniformly on the first surface of the substrate.
其中,所述第一流体通道的流体入口具有规则或不规则形状,例如多边形(矩形、菱形或其它)、圆形或椭圆形等,其可以依据实际应用之需求而简单调整。Wherein, the fluid inlet of the first fluid channel has a regular or irregular shape, such as a polygon (rectangular, diamond or other), a circle or an ellipse, etc., which can be easily adjusted according to the needs of practical applications.
其中,形成于相邻凸起部之间的沟槽可以具有多种形式的截面形状,例如可以是矩形、梯形、倒梯形、三角形、半圆形等规则或不规则形状,但应使其开口部尺寸小于混杂于待处理的流体内的选定颗粒的粒径。Wherein, the grooves formed between the adjacent convex portions may have various forms of cross-sectional shapes, for example, regular or irregular shapes such as rectangular, trapezoidal, inverted trapezoidal, triangular, semi-circular, etc., but should be made to be open The size of the portion is less than the particle size of the selected particles that are mixed in the fluid to be treated.
其中,所述的待处理流体可以是气相或液相的,例如空气、水、油类,在某些情况下,也可以是呈流体状的颗粒物质的集合,或者某些物质的熔融态等。Wherein, the fluid to be treated may be in a gas phase or a liquid phase, such as air, water, oil, and in some cases, may be a collection of fluid substances in a fluid state, or a molten state of certain substances, etc. .
其中,所述的“颗粒”主要是指固相颗粒,但在某些情况下,亦可以是与所述流体(特别是液相流体)不相容的液滴等。Herein, the "particles" mainly refer to solid phase particles, but in some cases, may also be droplets or the like which are incompatible with the fluid (especially a liquid phase fluid).
在一些较为优选的实施方案中,所述基体的第一表面的第二区域环绕所述第一区域设置。特别是,分布于所述第二区域的复数个凸起部环绕所述第一流体通道的流体入口设置。这样的设置形式,可使分布于所述第二区域的复数个凸起部之间的间隙均作为第二流体通道的组成部分,从而获得较大的流体通量。In some preferred embodiments, the second region of the first surface of the substrate is disposed about the first region. In particular, a plurality of raised portions distributed in the second region are disposed around the fluid inlet of the first fluid passage. Such an arrangement allows the gaps between the plurality of raised portions distributed in the second region to be part of the second fluid passage, thereby obtaining a larger fluid flux.
较为优选的,所述基体的第一表面的第一区域及第二区域的全部或部分分布在所述流体阻挡部于所述基体的第一表面上的正投影内。More preferably, all or part of the first region and the second region of the first surface of the substrate are distributed within an orthographic projection of the fluid blocking portion on the first surface of the substrate.
较为优选的,所述凸起部为(从俯视图上观察)片状,其宽度可以被控制于微米级或纳米级,藉此可以使多个凸起部可密集布置(凸起部自身在单位面积内所占比例少),利于对流 体中的微小颗粒进行处理,同时还赋予所述流体处理装置较大的流体通量(凸起部之间形成的沟槽的截面面积可以较大)。Preferably, the convex portion is (as viewed from a plan view) a sheet shape, and the width thereof can be controlled to a micron order or a nanometer order, whereby a plurality of convex portions can be densely arranged (the convex portion itself is in the unit) Concentration in the area), conducive to convection The fine particles in the body are treated while also imparting a greater fluid flux to the fluid processing device (the cross-sectional area of the grooves formed between the raised portions can be larger).
尤其优选的,所述凸起部为具有直线形轮廓(从俯视图上观察)的片状,其宽度为1nm~50μm,相邻凸起部之间形成的沟槽的开口部的尺寸为1nm~50μm,如此可以使构建形成的流体处理装置能处理流体中粒径小至纳米级的颗粒,且保持较高的流体处理通量。Particularly preferably, the convex portion has a sheet shape having a linear outline (as viewed from a plan view), and has a width of 1 nm to 50 μm, and an opening portion of the groove formed between the adjacent convex portions has a size of 1 nm. 50 μm, this allows the fluid handling device to be constructed to handle particles of particle size as small as nanometers in the fluid while maintaining a high fluid handling flux.
另外,也可以通过在所述凸起部的局部或全部表面设置由业界已知的合适低表面能物质形成的涂层或特定的纳米结构,从而使其具有超疏水性能、自清洁性能等。In addition, it is also possible to impart superhydrophobic properties, self-cleaning properties, and the like by providing a coating or a specific nanostructure formed of a suitable low surface energy substance known in the art on a part or all of the surface of the convex portion.
在一些较为具体的实施方案中,所述第一流体通道的孔径可以为1μm~1mm。In some more specific embodiments, the first fluid channel may have a pore size of from 1 μm to 1 mm.
在一些较为具体的实施方案中,所述基体的厚度在1μm以上。In some more specific embodiments, the substrate has a thickness of 1 μm or more.
其中,所述基体的材质可以选自金属、非金属、有机材料、无机材料等,例如硅片、聚合物、陶瓷等,且不限于此。The material of the substrate may be selected from a metal, a non-metal, an organic material, an inorganic material, or the like, such as a silicon wafer, a polymer, a ceramic, or the like, and is not limited thereto.
在一些较为具体的实施方案中,所述流体阻挡部的厚度为0.5μm~200μm。In some more specific embodiments, the fluid barrier has a thickness of from 0.5 μm to 200 μm.
在一些较为优选的实施方案中,所述流体处理装置还可包括至少一个支撑体,所述支撑体一端与所述基体固定连接,另一端与所述流体阻挡部固定连接。藉由所述支撑体,可实现流体阻挡部与基体之间更为牢固稳定的配合,并可有效的对分布在流体阻挡部与基体之间的凸起部形成保护,避免因流体阻挡部和/或基体在受到外力作用后,对所述凸起部挤压而造成的凸起部坍塌、损毁等问题。In some preferred embodiments, the fluid treatment device may further include at least one support body, one end of the support body being fixedly coupled to the base body and the other end being fixedly coupled to the fluid blocking portion. By the support body, a more stable and stable fit between the fluid blocking portion and the base body can be achieved, and the convex portion distributed between the fluid blocking portion and the base body can be effectively protected from the fluid blocking portion and / or the problem that the base body is collapsed, damaged, etc. caused by the pressing of the convex portion after being subjected to an external force.
其中,所述支撑体可以是多种形态的,例如柱状(圆柱、多棱柱等)、台阶状、锥台状等,且不限于此,其抗折能力应大于任一所述的凸起部。以及,所述支撑体可以是在流体阻挡部与基体之间加工形成,也可以是与基体或流体阻挡部一体加工形成。Wherein, the support body may be in various forms, such as a column shape (cylindrical, polygonal prism, etc.), a step shape, a frustum shape, or the like, and is not limited thereto, and the folding resistance should be greater than any of the raised portions. . And, the support body may be formed by machining between the fluid blocking portion and the base body, or may be integrally formed with the base body or the fluid blocking portion.
进一步的,所述的支撑体可以是两个以上,并且该两个以上支撑体对称分布于所述第一流体通道的流体入口周围。Further, the support body may be two or more, and the two or more support bodies are symmetrically distributed around the fluid inlet of the first fluid passage.
在一些较为优选的实施方案中,所述第一流体通道的流体入口上还可架设有一根以上支撑梁,所述支撑梁与所述流体阻挡部固定连接,用以对流体阻挡部形成支撑,进一步提升所述流体处理装置的结构强度。In some preferred embodiments, one or more support beams may be disposed on the fluid inlet of the first fluid passage, and the support beam is fixedly coupled to the fluid blocking portion to form a support for the fluid blocking portion. The structural strength of the fluid treatment device is further increased.
进一步的,所述支撑梁可以为多根,其可以平行排布在所述第一流体通道的流体入口上。Further, the support beam may be a plurality of wires, which may be arranged in parallel on the fluid inlet of the first fluid channel.
在一些较为优选的实施方案中,所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化材料、抗菌材料等等,且不限于此。例如,较为典型的光催化材料可以是二氧化钛等,在包含此种功能材料的流体处理装置对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。又例如,较为 典型的抗菌材料可以是诸如Au、Ag等贵金属,藉其可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等。In some preferred embodiments, the surface of the convex portion is further provided with a layer of a functional material, and the material of the functional material layer includes a photocatalytic material, an antibacterial material and the like, and is not limited thereto. For example, a typical photocatalytic material may be titanium dioxide or the like. When the fluid is processed by a fluid processing device containing such a functional material, some organic pollutants in the fluid may be photocatalyzed by ultraviolet light or the like. Degradation, achieving multiple purification of fluids. Another example is A typical antibacterial material may be a noble metal such as Au or Ag, which can simultaneously kill bacteria, viruses, and the like in the fluid during the processing of the fluid.
进一步的,为利于光线透入,所述流体阻挡部、基体、凸起部中的部分或全部可以由透明材料制成。Further, in order to facilitate light penetration, part or all of the fluid blocking portion, the base body, and the convex portion may be made of a transparent material.
本申请实施例的另一个方面提供的一种流体处理装置包括:Another aspect of the embodiments of the present application provides a fluid processing apparatus comprising:
具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面;a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
彼此间隔设置的复数个凸起部,所述凸起部固定设置在所述基体的第一表面上,并沿横向在所述基体的第一表面上连续延伸,其中相邻凸起部之间形成有可供流体通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,以及,其中至少两个凸起部分别与所述第一流体通道的流体入口的相背对的两侧相邻设置,至少一个凸起部直接从所述第一流体通道的流体入口上通过,从而使所述复数个凸起部与基体之间配合形成与所述第一流体通道连通的第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions spaced apart from each other, the protrusions being fixedly disposed on the first surface of the base body and extending continuously on the first surface of the base body in a lateral direction, wherein between the adjacent protrusions Forming a groove through which the fluid can pass, the opening of the groove having a diameter greater than 0 but smaller than the particle size of the selected particles mixed in the fluid to be treated, and wherein at least two of the raised portions are respectively Two opposite sides of the opposite sides of the fluid inlet of the first fluid passage are disposed adjacent to each other, and at least one convex portion directly passes through the fluid inlet of the first fluid passage, so that the plurality of convex portions and the base body The interfitting forms a second fluid passage in communication with the first fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
在一些实施方案中,所述流体处理装置还包括:In some embodiments, the fluid treatment device further comprises:
流体阻挡部,具有与所述基体的第一表面相对设置的第二表面,所述第一流体通道的流体入口分布在所述流体阻挡部于所述基体的第一表面上形成的正投影内,所述复数个凸起部具有相背对的第一端和第二端,所述第一端与所述基体的第一表面密封连接,第二端的局部区域与所述遮挡部的第二表面密封连接。a fluid blocking portion having a second surface disposed opposite the first surface of the substrate, the fluid inlet of the first fluid channel being distributed within an orthographic projection formed by the fluid blocking portion on the first surface of the substrate The plurality of raised portions have opposite first and second ends, the first end being sealingly coupled to the first surface of the base, the partial portion of the second end and the second portion of the shielding portion Surface sealed connection.
在本申请的该实施方案中,所述基体、凸起部、流体阻挡部、第一流体通道的形状、材质、结构等亦可与前文述及的相同或相似。In this embodiment of the present application, the shape, material, structure, and the like of the base, the boss, the fluid barrier, and the first fluid passage may be the same as or similar to those described above.
在一些较为优选的实施方案中,所述复数个凸起部平行分布在所述基体的第一表面上。In some preferred embodiments, the plurality of raised portions are distributed in parallel on the first surface of the substrate.
本申请的另一个方面提出了一种流体处理装置的制备方法,包括:Another aspect of the present application provides a method of preparing a fluid processing apparatus comprising:
提供具有相背对的第一表面和第二表面的衬底;Providing a substrate having opposite first and second surfaces;
对所述衬底的第一表面进行加工,从而在所述衬底的第一表面形成彼此间隔设置的复数个凸起部,或者,在所述衬底的第一表面生长形成彼此间隔设置的复数个凸起部,所述凸起部沿横向在所述基体的第一表面的第二区域连续延伸,其中相邻凸起部之间形成有可供流体通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,并且所述凸起部的上端与所述基体的第一表面密封连接;Processing the first surface of the substrate to form a plurality of protrusions spaced apart from each other on the first surface of the substrate, or growing on the first surface of the substrate to form a space spaced apart from each other a plurality of protrusions extending continuously in a second region of the first surface of the substrate in a lateral direction, wherein a groove through which a fluid can pass is formed between adjacent protrusions, the groove The opening of the opening has a diameter greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, and the upper end of the raised portion is sealingly connected to the first surface of the base;
在所述衬底的第一表面上设置具有与所述衬底的第一表面相对设置的第二表面的流体阻 挡部,并至少使所述流体阻挡部的第二表面与所述凸起部的下端的局部区域密封连接;Providing a fluid resistance having a second surface disposed opposite the first surface of the substrate on the first surface of the substrate a blocking portion and at least sealingly connecting the second surface of the fluid blocking portion with a partial region of the lower end of the convex portion;
对所述衬底的第二表面进行加工,形成贯穿所述衬底的第一流体通道,所述第一流体通道的流体入口分布于所述衬底的第一表面的第一区域内,所述衬底的第一表面的第二区域与第一区域邻接,使分布在所述衬底的第一表面的第二区域内的复数个凸起部之间的复数个沟槽、流体阻挡部与衬底之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。Processing a second surface of the substrate to form a first fluid passage through the substrate, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate, The second region of the first surface of the substrate is contiguous with the first region such that a plurality of trenches, fluid barriers are distributed between the plurality of raised portions in the second region of the first surface of the substrate A second fluid passage is formed in cooperation with the substrate, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
在一些较为具体的实施方案中,所述的制备方法包括:In some more specific embodiments, the method of preparation comprises:
在所述衬底的第一表面上设置图形化的第一光刻胶掩模,再对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的复数个凸起部,之后除去所述第一光刻胶掩模;Forming a patterned first photoresist mask on the first surface of the substrate, and etching the first surface of the substrate to form a space on the first surface of the substrate a plurality of raised portions, after which the first photoresist mask is removed;
在所述衬底的第一表面涂布可溶性或可腐蚀的有机物和/或无机物,并使有机物和/或无机物填充所述复数个凸起部之间的间隙,形成牺牲层;Coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between the plurality of protrusions with an organic substance and/or an inorganic substance to form a sacrificial layer;
在所述牺牲层上设置第二光刻胶掩模,再对所述牺牲层进行刻蚀,至少使分布在所述衬底的第一表面的第二区域中的复数个凸起部顶部暴露出,之后除去所述第二光刻胶掩模;Providing a second photoresist mask on the sacrificial layer, and etching the sacrificial layer to expose at least a top of the plurality of protrusions distributed in the second region of the first surface of the substrate And then removing the second photoresist mask;
在所述衬底的第一表面设置第三掩模,并使所述衬底第一表面上的、与所述流体阻挡部相对应的区域暴露出,之后沉积形成流体阻挡部,再除去所述第三掩模;Providing a third mask on the first surface of the substrate, and exposing a region on the first surface of the substrate corresponding to the fluid blocking portion, and then depositing to form a fluid blocking portion, and then removing the a third mask;
在所述衬底的第二表面上设置图形化的第四光刻胶掩模,再对所述衬底的第二表面进行刻蚀,直至露出填充在相邻凸起部之间的牺牲材料,从而在所述衬底的第二表面形成槽孔,所述槽孔所在位置与所述衬底的第一表面的第一区域相对应,所述衬底的第一表面的第二区域环绕所述第一区域设置,Forming a fourth photoresist mask on the second surface of the substrate, and etching the second surface of the substrate until the sacrificial material filled between the adjacent protrusions is exposed Forming a slot in the second surface of the substrate, the slot being located corresponding to the first area of the first surface of the substrate, the second area of the first surface of the substrate surrounding The first area setting,
除去所述第四光刻胶掩模及填充在所述复数个凸起部之间的牺牲材料,于所述衬底上形成所述第一流体通道。Removing the fourth photoresist mask and the sacrificial material filled between the plurality of protrusions to form the first fluid channel on the substrate.
较为优选的,所述的复数个凸起部为沿横向平行排布在所述基体第一表面的复数个纳米片或纳米条。More preferably, the plurality of raised portions are a plurality of nano-sheets or nano-bars arranged in parallel in the lateral direction on the first surface of the substrate.
本申请实施例的另一个方面提供的一种流体处理装置包括:Another aspect of the embodiments of the present application provides a fluid processing apparatus comprising:
具有流体通道的基体,以及a substrate having a fluid passage, and
复数根线形体的聚集体,用以对流经所述流体通道的、混杂有选定颗粒的流体进行处理;An aggregate of a plurality of linear bodies for treating a fluid mixed with the selected particles flowing through the fluid passage;
所述聚集体分布于所述流体通道内,并具有多孔结构,所述多孔结构内孔洞的直径大于0但小于所述选定颗粒的粒径。The aggregates are distributed within the fluid channel and have a porous structure, the pores within the porous structure having a diameter greater than zero but less than the particle size of the selected particles.
其中,所述基体可以是各种形态的,例如矩形体状、片状、多面体状、半球状、球状或 其它非规则形态的。因此,所述的“第一表面”可以是所述基体上的任何一个非特定的合适的平面或曲面。Wherein, the substrate may be in various forms, such as a rectangular shape, a sheet shape, a polyhedral shape, a hemispherical shape, a spherical shape or Other irregular forms. Thus, the "first surface" may be any non-specific suitable plane or curved surface on the substrate.
其中,所述流体通道可以是任意形态的通孔,其流体入口可以分布在所述基体表面,例如所述基体的一个表面,其可定义为第一表面,而其流体出口既可以分布在所述基体的与所述第一表面不同的另一表面上(例如,该另一表面可以与所述第一表面相邻、相背对),也可分布在所述的第一表面上(当然在这种情况下,所述的第一表面上应有流体阻隔机构,使待处理的流体不会在所述第一表面上直接流动至所述流体出口处。在一些情况下,所述流体通道的流体出口也是可以分布在所述基体内部的,例如,当所述基体内存在用以接收经处理后的流体的空腔时。Wherein, the fluid passage may be a through hole of any shape, and a fluid inlet thereof may be distributed on the surface of the base body, for example, a surface of the base body, which may be defined as a first surface, and a fluid outlet thereof may be distributed in the same The other surface of the substrate different from the first surface (for example, the other surface may be adjacent to the first surface, opposite to each other) may also be distributed on the first surface (of course In this case, the first surface should have a fluid blocking mechanism such that the fluid to be treated does not flow directly on the first surface to the fluid outlet. In some cases, the fluid The fluid outlet of the channel may also be distributed within the substrate, for example, when there is a cavity in the substrate to receive the treated fluid.
其中,所述的待处理流体可以是气相或液相的,例如空气、水、油类,在某些情况下,也可以是呈流体状的颗粒物质的集合,或者某些物质的熔融态等。Wherein, the fluid to be treated may be in a gas phase or a liquid phase, such as air, water, oil, and in some cases, may be a collection of fluid substances in a fluid state, or a molten state of certain substances, etc. .
其中,所述的“颗粒”主要是指固相颗粒,但在某些情况下,亦可以是与所述流体(特别是液相流体)不相容的液滴等。Herein, the "particles" mainly refer to solid phase particles, but in some cases, may also be droplets or the like which are incompatible with the fluid (especially a liquid phase fluid).
其中,所述的“复数”系指两个或两个以上。Here, the term "plural" means two or more.
其中,所述的线形体可以是直线形、曲线形的,优选为直线形的,其利于制备,且可使形成的多孔结构中的孔洞大小等更为可控。以及,所述的线形体可以是实心或空心的,例如纳米级或微米级的线、管等,但不限于此。Wherein, the linear body may be linear, curved, preferably linear, which is advantageous for preparation, and can make the size of the hole in the formed porous structure more controllable. And, the linear body may be solid or hollow, such as a nano- or micro-scale wire, tube, etc., but is not limited thereto.
其中,所述线形体沿径向的截面结构可以是规则或不规则形状的,例如可以是多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等。Wherein, the cross-sectional structure of the linear body in the radial direction may be regular or irregular, and may be, for example, a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, or the like.
在一些实施方案中,所述线形体一端均与所述流体通道的内壁固定连接,另一端沿所述流体通道的径向延伸。In some embodiments, the linear body is fixedly coupled at one end to an inner wall of the fluid passage and at the other end in a radial direction of the fluid passage.
在一些实施例中,所述复数根线形体相互交叉或彼此交织形成所述多孔结构。In some embodiments, the plurality of linear bodies intersect each other or are interwoven to form the porous structure.
在一些实施例中,所述复数根线形体彼此间隔设置并平行排布形成所述多孔结构。In some embodiments, the plurality of linear bodies are spaced apart from each other and arranged in parallel to form the porous structure.
较为优选的,至少于所述线形体表面还分布有光催化材料或抗菌材料。特别是,所述线性体可整体由光催化材料或抗菌材料组成。More preferably, at least the surface of the linear body is further distributed with a photocatalytic material or an antibacterial material. In particular, the linear body may be composed entirely of a photocatalytic material or an antibacterial material.
其中,所述线形体的直径为1nm~500μm,优选为1nm~50μm。The linear body has a diameter of 1 nm to 500 μm, preferably 1 nm to 50 μm.
优选的,前述线形体可采用纳米线,其直径较小,可以密集分布以形成孔径较小的孔洞,进而可以在保持较高流体通量的同时,还可实现对包含较小粒径(微米乃至纳米级别)的颗粒的流体进行处理。Preferably, the aforementioned linear body may adopt nanowires, which are small in diameter and can be densely distributed to form pores having a small pore diameter, thereby further maintaining a relatively high fluid flux while achieving a smaller particle size (micron). The fluid of the particles, even at the nanometer level, is processed.
优选的,所述线形体可采用微米线(管)、纳米线(管),特别是后者,由这些纳米线(管) 形成的阵列可具有超疏水或超疏油结构,进而使得所述流体处理装置具有自清洁功能。Preferably, the linear body may be a microwire (tube), a nanowire (tube), and particularly the latter, from these nanowires (tubes) The formed array can have a superhydrophobic or superoleophobic structure, thereby allowing the fluid handling device to have a self-cleaning function.
优选的,也可以通过在所述线性体的局部或全部表面及所述基体的局部或全部表面设置由业界已知的合适低表面能物质形成的涂层,或直接利用疏水材料形成所述线形体、基体,从而使其具有超疏水性能、自清洁性能等。Preferably, the coating formed by a suitable low surface energy material known in the art may be provided on a part or the whole surface of the linear body and a part or the whole surface of the substrate, or the line may be directly formed by using a hydrophobic material. The body and the matrix are such that they have superhydrophobic properties, self-cleaning properties and the like.
例如,所述的线形体可以优选自碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线等,且不限于此。For example, the linear body may be preferably selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
其中,所述的线形体可以通过外界转移、原位生长(例如化学生长、电化学生长)或沉积(例如物理、化学气相沉积,电沉积)等方式固定于所述基体表面或者于所述基体表面生长形成。Wherein, the linear body may be fixed to the surface of the substrate or to the substrate by external transfer, in-situ growth (for example, chemical growth, electrochemical growth) or deposition (for example, physical, chemical vapor deposition, electrodeposition) or the like. Surface growth is formed.
其中,所述流体通道的流体入口具有规则或不规则形状,例如多边形(矩形、菱形或其它)、圆形或椭圆形等,其可以依据实际应用之需求而简单调整。Wherein, the fluid inlet of the fluid channel has a regular or irregular shape, such as a polygon (rectangular, diamond or other), a circle or an ellipse, etc., which can be easily adjusted according to the needs of practical applications.
在一些实施方案中,所述基体具有相背对的第一表面和第二表面,所述流体通道的流体入口分布于所述基体的第一表面。In some embodiments, the substrate has opposing first and second surfaces, the fluid inlet of the fluid channel being distributed over the first surface of the substrate.
在一些实施方案中,所述基体的第一表面还分布有彼此间隔设置的复数根竖立线形体,所述复数根竖立线形体环绕所述流体通道设置。In some embodiments, the first surface of the substrate is further distributed with a plurality of upright linear bodies spaced apart from each other, the plurality of upright linear bodies being disposed around the fluid channel.
在一些实施方案中,所述的流体处理装置还可包括流体阻挡部,所述流体阻挡部具有与所述基体的第一表面相对设置的表面(可命名其为第三表面),并且所述复数根竖立线形体一端固定设置于所述基体的第一表面,另一端与所述流体阻挡部的第三表面固定连接,其中相邻竖立线形体之间的距离大于0但小于所述选定颗粒的粒径。In some embodiments, the fluid treatment device can further include a fluid barrier having a surface (which can be named as a third surface) disposed opposite the first surface of the substrate, and One end of the plurality of upright linear bodies is fixedly disposed on the first surface of the base body, and the other end is fixedly connected to the third surface of the fluid blocking portion, wherein a distance between adjacent upright linear bodies is greater than 0 but less than the selected The particle size of the particles.
其中,所述流体阻挡部可以是多种形态的,例如可以为片状、薄壳状、矩形体状、多面体状等。优选的,所述复数根竖立线形体、流体阻挡部与基体之间配合形成一流体通道,待处理的流体仅可经由该流体通道进入分布于所述基体的第一表面的流体通道的流体入口,实现对流体的第一次处理,之后再进入分布于基体上的流体通道内,并由前述线形体的聚集体进行第二次处理。The fluid blocking portion may have various forms, and may be, for example, a sheet shape, a thin shell shape, a rectangular shape, a polyhedral shape, or the like. Preferably, the plurality of upright linear bodies, the fluid blocking portion and the base body cooperate to form a fluid passage through which the fluid to be treated can only enter the fluid inlet of the fluid passage distributed on the first surface of the base body. The first treatment of the fluid is carried out, and then into the fluid channel distributed on the substrate, and the second treatment is performed by the aggregate of the linear body.
其中,所述流体阻挡部的设置形式亦可以为多样的,例如,其可以整体与所述基体间隔设置,亦可局部与所述基体连接,甚至在某些情况下,亦可是与所述基体被一体加工形成。The arrangement of the fluid blocking portion may also be various, for example, it may be integrally spaced from the substrate, or may be partially connected to the substrate, and in some cases, may be associated with the substrate. It is formed by integral processing.
在一些实施例中,所述流体通道的流体入口及复数根竖立线形体分布在所述流体阻挡部于所述基体的第一表面的正投影内。In some embodiments, the fluid inlet of the fluid channel and the plurality of upright linear bodies are distributed within an orthographic projection of the fluid barrier portion of the first surface of the substrate.
较为优选的,所述竖立线形体的长径比为4:1~200000:1。More preferably, the erected linear body has an aspect ratio of 4:1 to 200000:1.
较为优选的,相邻竖立线形体之间的距离与所述竖立线形体的长度的比值为1:4~1: 200000。More preferably, the ratio of the distance between adjacent upright linear bodies to the length of the upright linear body is 1:4 to 1: 200000.
较为优选的,所述竖立线形体可具有与前述线性体相同的材质、结构等。More preferably, the upright linear body may have the same material, structure, and the like as the linear body described above.
其中,所述流体处理装置中各部分的材料选择范围是多样的,可以是无机材料,也可以是有机材料。例如,可以选自金属、硅片、陶瓷、聚合物等,且不限于此。当这些部分都选择使用无机材料时,所述流体处理装置还具有耐温度变化的特性,可以处理高温和低温流体。Wherein, the material selection range of each part in the fluid processing device is various, and may be an inorganic material or an organic material. For example, it may be selected from metals, silicon wafers, ceramics, polymers, and the like, and is not limited thereto. When these portions are all selected to use inorganic materials, the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
在一些较为优选的实施方案中,所述基体表面,特别是所述基体的第一表面还设置有功能材料层,所述功能材料层的材质包括光催化材料、抗菌材料等等,且不限于此。例如,较为典型的光催化材料可以是二氧化钛等,在包含此种功能材料的流体处理装置对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。又例如,较为典型的抗菌材料可以是诸如Au、Ag等贵金属,藉其可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等。In some preferred embodiments, the surface of the substrate, particularly the first surface of the substrate, is further provided with a layer of functional material, and the material of the functional material layer includes a photocatalytic material, an antibacterial material, etc., and is not limited thereto. this. For example, a typical photocatalytic material may be titanium dioxide or the like. When the fluid is processed by a fluid processing device containing such a functional material, some organic pollutants in the fluid may be photocatalyzed by ultraviolet light or the like. Degradation, achieving multiple purification of fluids. For another example, a more typical antibacterial material may be a noble metal such as Au or Ag, which can synchronously kill bacteria, viruses and the like in the fluid during the processing of the fluid.
进一步的,为利于光线透入,所述流体处理装置中的部分组件或全部组件可以由透明材料制成。Further, to facilitate light penetration, some or all of the components of the fluid treatment device may be made of a transparent material.
本申请实施例的另一个方面提出的一种制备所述流体处理装置的方法包括:A method of preparing the fluid processing apparatus according to another aspect of the embodiments of the present application includes:
提供具有相背对的第一表面和第二表面的衬底;Providing a substrate having opposite first and second surfaces;
对所述衬底进行加工,从而在所述衬底上形成一个以上流体通道,所述流体通道具有流体入口和流体出口,所述流体通道的流体入口分布于所述衬底的第一表面;Processing the substrate to form more than one fluid channel on the substrate, the fluid channel having a fluid inlet and a fluid outlet, the fluid inlet of the fluid channel being distributed over the first surface of the substrate;
至少于所述流体通道的内壁上覆设用于生长所述线形体的种子层;Depositing a seed layer for growing the linear body on at least an inner wall of the fluid passage;
基于所述种子层在所述流体通道内生长形成复数根线形体,该复数根线形体的聚集体具有多孔结构,用以对流经所述流体通道的、混杂有选定颗粒的流体进行处理,并且所述多孔结构内孔洞的直径大于0但小于所述选定颗粒的粒径。Forming a plurality of linear bodies in the fluid channel based on the seed layer, the aggregate of the plurality of linear bodies having a porous structure for treating a fluid mixed with the selected particles flowing through the fluid channel, And the diameter of the pores in the porous structure is greater than 0 but smaller than the particle size of the selected particles.
在一些更为具体的实施方案中,所述制备方法还可包括:In some more specific embodiments, the method of preparation may further comprise:
在所述衬底的第一表面及所述流体通道的内壁上覆设用于生长所述线形体的种子层;Depositing a seed layer for growing the linear body on a first surface of the substrate and an inner wall of the fluid passage;
基于所述种子层在所述衬底的第一表面及所述流体通道内壁上生长形成复数根线形体。A plurality of linear bodies are formed on the first surface of the substrate and the inner wall of the fluid channel based on the seed layer.
优选的,所述制备方法包括:基于所述种子层在所述流体通道内壁上生长形成复数根沿径向延伸的线形体,该复数根线形体相互交叉形成所述的多孔结构。Preferably, the preparation method comprises: forming a plurality of linearly extending linear bodies on the inner wall of the fluid passage based on the seed layer, the plurality of linear bodies intersecting each other to form the porous structure.
优选的,所述制备方法包括:基于所述种子层在所述衬底的第一表面生长形成复数根竖立的线形体,该复数根竖立线形体彼此间隔设置,且相邻竖立线形体之间的距离大于0但小于所述选定颗粒的粒径。Preferably, the preparation method comprises: forming a plurality of upright linear bodies on the first surface of the substrate based on the seed layer, the plurality of vertical linear bodies being spaced apart from each other, and between adjacent vertical linear bodies The distance is greater than zero but less than the particle size of the selected particles.
较为优选的,所述线形体、竖立线形体均可具有与前述线性体相同的材质、结构等。 More preferably, the linear body and the upright linear body may have the same material, structure, and the like as the linear body.
本发明实施例提供了一种鼻塞式呼吸器,其包括:Embodiments of the present invention provide a nasal plug type respirator, including:
鼻塞和过滤芯片,至少所述鼻塞的一端部能够插入使用者的鼻腔,且所述鼻塞包含有与所述鼻腔连通的气体通道,所述过滤芯片用以滤除混杂于待处理气流内的、粒径大于设定值的颗粒,待处理的气体流经所述过滤芯片后进入所述鼻塞内的气体通道;以及,a nasal plug and a filter chip, at least one end of the nasal plug can be inserted into a nasal cavity of a user, and the nasal plug includes a gas passage communicating with the nasal cavity, and the filter chip is used to filter out the mixed airflow to be treated, a particle having a particle diameter larger than a set value, wherein the gas to be treated flows into the gas passage in the nasal plug after flowing through the filter chip;
过滤芯片防护结构,用以对所述过滤芯片进行防护。A filter chip protection structure is used to protect the filter chip.
在一些实施方案中,所述过滤芯片防护结构包括第一固定式硬质滤网和第二固定式硬质滤网,所述过滤芯片设置于第一固定式硬质滤网和第二固定式硬质滤网之间。In some embodiments, the filter chip protection structure comprises a first fixed hard filter and a second fixed hard filter, the filter chip being disposed on the first fixed hard filter and the second fixed Between hard filters.
在一些实施方案中,所述鼻塞式呼吸器还包括第一过滤织物和/或第二过滤织物,所述第一过滤织物分布于所述鼻塞和过滤芯片之间,所述过滤芯片分布于第二过滤织物与鼻塞之间。In some embodiments, the nasal plug respirator further includes a first filter fabric and/or a second filter fabric, the first filter fabric being distributed between the nasal plug and the filter chip, the filter chip being distributed Second between the filter fabric and the nasal plug.
在一些实施方案中,所述鼻塞式呼吸器还包括第一可拆卸式硬质滤网和/或第二可拆式硬质滤网,所述第一可拆卸式硬质滤网与第一过滤织物固定连接,所述第二可拆卸式硬质滤网与第二过滤织物固定连接。In some embodiments, the nasal plug respirator further includes a first detachable hard screen and/or a second detachable hard screen, the first detachable hard screen and the first The filter fabric is fixedly attached, and the second detachable hard screen is fixedly coupled to the second filter fabric.
较为优选的,所述鼻塞采用腰鼓型鼻塞,其可局部或整体插入人体鼻腔内。More preferably, the nasal plug is a lumbar drum type nasal plug which can be partially or wholly inserted into the nasal cavity of the human body.
较为优选的,所述鼻塞式呼吸器还包括一两端开口的壳体,所述鼻塞可拆卸的安装于所述壳体一端,所述过滤芯片容置于所述壳体内。该壳体一方面可以实现对过滤芯片的进一步防护,另一方面也可以容置前述的各种组件,使得该呼吸器结构紧凑牢固。该壳体优选采用硬质壳体。More preferably, the nasal plug respirator further includes a housing that is open at both ends, the nasal plug is detachably mounted at one end of the housing, and the filter chip is received in the housing. On the one hand, the housing can further protect the filter chip, and on the other hand, it can accommodate the various components described above, so that the respirator is compact and firm. The housing preferably uses a rigid housing.
在本发明的较为具体的第一实施方案中,所述过滤芯片包括:In a more specific first embodiment of the present invention, the filter chip comprises:
具有第一流体通道的基体,所述第一流体通道具有空气入口和空气出口,所述第一流体通道的空气入口分布于所述基体的第一表面;a base having a first fluid passage, the first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed on the first surface of the base;
彼此间隔设置的复数个凸起部,所述凸起部沿横向在所述基体的第一表面上连续延伸,下部固定设置于所述基体的第一表面,上部设有沿横向连续延伸的帽形结构,所述帽形结构的相背对的两侧部沿侧向外延,而相邻帽形结构之间形成有可供空气通过的开口部,所述开口部的口径大于0但小于混杂于待处理的空气内的选定颗粒的粒径,其中至少两个所述的凸起部分别与所述第一流体通道的空气入口的相背对的两侧相邻设置,以及至少一个所述的凸起部直接从所述第一流体通道的空气入口上通过,从而使复数个帽形结构、复数个凸起部与基体之间配合形成与所述第一流体通道连通的第二流体通道,且待处理的空气仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions spaced apart from each other, the protrusions extending continuously on the first surface of the base body in a lateral direction, a lower portion fixedly disposed on the first surface of the base body, and an upper portion having a cap extending continuously in the lateral direction a shape-shaped structure, the opposite sides of the hat-shaped structure are laterally extended, and an opening portion through which air can pass is formed between adjacent hat-shaped structures, and the diameter of the opening portion is greater than 0 but less than mixed a particle size of the selected particles in the air to be treated, wherein at least two of the raised portions are respectively disposed adjacent to opposite sides of the air inlet of the first fluid passage, and at least one The raised portion directly passes through the air inlet of the first fluid passage, thereby engaging a plurality of hat-shaped structures, a plurality of protrusions and the base body to form a second fluid communicating with the first fluid passage The passage, and the air to be treated, can only enter the first fluid passage through the second fluid passage.
在该第一实施方案中,至少两个所述的凸起部直接从所述第一流体通道的空气入口上通过;和/或,所述复数个凸起部平行分布在所述基体的第一表面上。 In the first embodiment, at least two of the raised portions pass directly over the air inlet of the first fluid passage; and/or the plurality of raised portions are distributed in parallel at the base of the base On the surface.
较为优选的,所述帽形结构与凸起部一体设置。More preferably, the hat-shaped structure is integrally provided with the boss.
在该第一实施方案中,所述帽形结构可具有倒梯形截面结构。In this first embodiment, the hat-shaped structure may have an inverted trapezoidal cross-sectional structure.
较为优选的,形成于相邻帽形结构之间的开口部的口径为1nm~50μm。More preferably, the opening formed between the adjacent hat-shaped structures has a diameter of 1 nm to 50 μm.
较为优选的,所述帽形结构的高度为50nm~200μm。More preferably, the hat-shaped structure has a height of 50 nm to 200 μm.
较为优选的,相邻凸起部之间的距离为0.1μm~100μm。More preferably, the distance between adjacent convex portions is from 0.1 μm to 100 μm.
较为优选的,所述凸起部的高度为0.1μm~400μm,宽度为0.1μm~100μm。More preferably, the raised portion has a height of 0.1 μm to 400 μm and a width of 0.1 μm to 100 μm.
较为优选的,所述第一流体通道的孔径为1μm~1mm。More preferably, the first fluid passage has a pore diameter of 1 μm to 1 mm.
较为优选的,所述基体的厚度在1μm以上。More preferably, the thickness of the substrate is 1 μm or more.
较为优选的,至少于所述凸起部、帽形结构和基体中的任一者的表面还设置有光催化功能材料层和/或抗菌功能材料层。More preferably, at least the surface of any of the raised portion, the cap-shaped structure and the substrate is provided with a layer of a photocatalytic functional material and/or a layer of an antimicrobial functional material.
较为优选的,所述凸起部、帽形结构和基体中的至少一者的至少局部为透明结构。More preferably, at least a portion of at least one of the raised portion, the cap-shaped structure and the base is a transparent structure.
在本发明的较为具体的第二实施方案中,所述过滤芯片包括:In a more specific second embodiment of the present invention, the filter chip comprises:
具有第一流体通道的基体,所述第一流体通道具有空气入口和空气出口,所述第一流体通道的空气入口分布于所述基体的第一表面;a base having a first fluid passage, the first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed on the first surface of the base;
由复数根线形体相互交叉形成的多孔结构,用以与所述基体的第一表面配合形成第二流体通道,所述复数根线形体一端均与所述基体固定连接,所述多孔结构中孔洞的直径大于0但小于混杂于待处理的空气内的选定颗粒的粒径,且待处理的空气仅能通过所述第二流体通道进入第一流体通道。a porous structure formed by intersecting a plurality of linear bodies to form a second fluid passage with the first surface of the base body, wherein the plurality of linear bodies are fixedly connected to the base body at one end, and the porous structure has a hole The diameter is greater than zero but less than the particle size of the selected particles that are intermixed with the air to be treated, and the air to be treated can only enter the first fluid passage through the second fluid passage.
进一步的,所述复数根线形体的一端均与所述基体的第一表面固定连接,并环绕分布于所述第一流体通道的空气入口周围。Further, one end of the plurality of linear bodies is fixedly connected to the first surface of the base body and is distributed around the air inlet of the first fluid passage.
较为优选的,所述的空气过滤芯片还包括彼此间隔设置的复数个凸起部,所述凸起部固定设置在所述基体的第一表面上,并沿横向在所述基体的第一表面上连续延伸,其中至少两个凸起部分别与所述第一流体通道的空气入口的相背对的两侧相邻设置,至少一个凸起部直接从所述第一流体通道的空气入口上通过,所述凸起部上固定连接有两根以上所述的线形体。Preferably, the air filter chip further includes a plurality of protrusions spaced apart from each other, the protrusions being fixedly disposed on the first surface of the base body and laterally on the first surface of the base body Continuously extending upwardly, wherein at least two protrusions are respectively disposed adjacent to opposite sides of the air inlet of the first fluid passage, and at least one protrusion is directly from the air inlet of the first fluid passage Two or more linear bodies are fixedly connected to the convex portion.
较为优选的,连接在一凸起部上的复数根线形体和连接在与该凸起部相邻的另一凸起部上的复数根线形体相互交叉。More preferably, the plurality of linear bodies connected to one of the bosses and the plurality of linear bodies connected to the other of the bosses adjacent to the bosses intersect each other.
较为优选的,所述复数个凸起部平行分布在所述基体的第一表面上。More preferably, the plurality of protrusions are distributed in parallel on the first surface of the substrate.
进一步的,所述凸起部的形状包括长条状或片状,且不限于此。Further, the shape of the convex portion includes an elongated shape or a sheet shape, and is not limited thereto.
进一步的,所述的复数个凸起部均匀分布或非均匀分布在所述基体的第一表面上。Further, the plurality of protrusions are uniformly distributed or non-uniformly distributed on the first surface of the substrate.
较为优选的,所述凸起部的宽度为0.1μm~100μm,高度为0.1μm~400μm。 More preferably, the raised portion has a width of 0.1 μm to 100 μm and a height of 0.1 μm to 400 μm.
较为优选的,相邻凸起部之间的距离为0.1μm~100μm。More preferably, the distance between adjacent convex portions is from 0.1 μm to 100 μm.
较为优选的,所述凸起部表面还设置有光催化功能材料层和/或抗菌功能材料层。More preferably, the surface of the protrusion is further provided with a layer of photocatalytic functional material and/or a layer of antibacterial functional material.
较为优选的,所述基体、所述复数根线形体、所述复数个凸起部中的至少一者的至少局部为透明结构。More preferably, at least a part of the base body, the plurality of linear bodies, and the plurality of raised portions are transparent structures.
较为优选的,所述线形体的直径为1nm~50μm。More preferably, the linear body has a diameter of from 1 nm to 50 μm.
较为优选的,其中任一线形体的一端和与该线形体相邻的另一线形体的一端之间的距离为1nm~50μm。More preferably, the distance between one end of any one of the linear bodies and one end of the other linear body adjacent to the linear body is from 1 nm to 50 μm.
较为优选的,所述线形体的长度为50nm~200μm。More preferably, the linear body has a length of 50 nm to 200 μm.
较为优选的,至少于所述线形体表面还分布有光催化材料或抗菌材料。More preferably, at least the surface of the linear body is further distributed with a photocatalytic material or an antibacterial material.
较为优选的,所述基体和所述复数根线形体中的至少一者的至少局部为透明结构。More preferably, at least a part of at least one of the base body and the plurality of linear bodies is a transparent structure.
较为优选的,所述线形体为直线形。More preferably, the linear body is linear.
进一步的,所述第一流体通道的空气入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形。Further, the air inlet of the first fluid passage has a regular or irregular shape, and the regular shape includes a polygon, a circle or an ellipse.
较为优选的,所述第一流体通道的孔径为1μm~1mm。More preferably, the first fluid passage has a pore diameter of 1 μm to 1 mm.
较为优选的,所述基体的厚度在1μm以上。More preferably, the thickness of the substrate is 1 μm or more.
较为优选的,所述过滤芯片还包括平行分布在所述基体的第一表面的复数根横梁,所述横梁沿横向在所述基体的第一表面连续延伸,其中至少两根横梁分别与所述第一流体通道的空气入口的相背对的两侧相邻设置,至少一根横梁直接从所述第一流体通道的空气入口上通过;以及,任一横梁上均分布有复数根线形体,该复数根线形体中的至少部分线形体的一端固定于所述横梁表面,另一端沿逐渐远离该任一横梁的方向斜向延伸和/或在平行于所述基体第一表面的面上连续延伸,并与分布在相邻于该任一横梁的另一横梁上的复数根线形体相互交叉,从而形成所述多孔结构。Preferably, the filter chip further includes a plurality of beams distributed in parallel on the first surface of the substrate, the beams extending continuously in a lateral direction on the first surface of the substrate, wherein at least two beams are respectively associated with the The air inlets of the first fluid passage are disposed adjacent to opposite sides of the air inlet, at least one beam directly passes through the air inlet of the first fluid passage; and any of the beams is distributed with a plurality of linear bodies. One end of at least a portion of the plurality of linear bodies is fixed to the surface of the beam, and the other end extends obliquely away from the direction of the beam and/or continuously on a plane parallel to the first surface of the substrate The porous structure is formed by extending and intersecting a plurality of linear bodies distributed on another beam adjacent to the one of the beams.
较为优选的,至少两根横梁直接从所述第一流体通道的空气入口上通过。More preferably, at least two beams pass directly over the air inlet of the first fluid passage.
较为优选的,所述线形体包括碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线中的任一种或两种以上的组合,但不限于此。More preferably, the linear body includes any one or a combination of two or more of carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, and Au nanowires, but Not limited to this.
在本发明的较为具体的第三实施方案中,所述过滤芯片包括:In a more specific third embodiment of the present invention, the filter chip comprises:
具有第一流体通道的基体,所述第一流体通道具有空气入口和空气出口,所述第一流体通道的空气入口分布于所述基体的第一表面的第一区域内;a base having a first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed in a first region of the first surface of the base;
空气阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理空气直接进入所述第一流体通道的空气入口; An air blocking portion having a second surface disposed opposite the first surface of the base body for blocking an air inlet of the air to be treated directly entering the first fluid passage;
彼此间隔设置的复数个凸起部,所述凸起部一端固定设置于所述基体的第一表面的第二区域内,另一端与所述空气阻挡部的第二表面固定连接,其中相邻凸起部之间的距离大于0但小于混杂于待处理的空气内的选定颗粒的粒径,所述基体的第一表面的第二区域与第一区域邻接,从而使所述复数个凸起部、空气阻挡部与基体之间配合形成第二流体通道,且待处理的空气仅能通过所述第二流体通道进入第一流体通道。a plurality of raised portions spaced apart from each other, the convex portion is fixedly disposed at one end in a second region of the first surface of the base body, and the other end is fixedly connected to the second surface of the air blocking portion, wherein adjacent The distance between the raised portions is greater than zero but less than the particle size of the selected particles that are intermingled with the air to be treated, the second region of the first surface of the substrate being contiguous with the first region, such that the plurality of convexities The starting portion, the air blocking portion and the base body cooperate to form a second fluid passage, and the air to be treated can only enter the first fluid passage through the second fluid passage.
进一步的,所述复数个凸起部环绕所述第一流体通道的空气入口设置。Further, the plurality of protrusions are disposed around the air inlet of the first fluid passage.
进一步的,所述基体的第一表面的第三区域内亦间隔设置有复数个凸起部,所述第二区域设于所述第三区域和第一区域之间。Further, a plurality of protrusions are also disposed in the third region of the first surface of the base body, and the second region is disposed between the third region and the first region.
较为优选的,所述第一流体通道的孔径为1μm~1mm。More preferably, the first fluid passage has a pore diameter of 1 μm to 1 mm.
较为优选的,所述基体的厚度在1μm以上。More preferably, the thickness of the substrate is 1 μm or more.
较为优选的,所述空气阻挡部的厚度为0.5μm~200μm。More preferably, the air blocking portion has a thickness of 0.5 μm to 200 μm.
较为优选的,所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料。Preferably, the surface of the convex portion is further provided with a layer of functional material, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material.
较为优选的,所述空气过滤芯片中的至少部分组件的至少局部为透明结构。Preferably, at least part of the components of the air filter chip are at least partially transparent.
进一步的,所述基体的第一表面的第三区域环绕所述第二区域设置。Further, a third area of the first surface of the substrate is disposed around the second area.
进一步的,所述基体的第一表面的第一区域及第二区域分布在所述空气阻挡部于所述基体的第一表面上的正投影内。Further, the first region and the second region of the first surface of the substrate are distributed in an orthographic projection of the air blocking portion on the first surface of the substrate.
较为优选的,所述空气过滤芯片还包括至少一个支撑体,所述支撑体一端与所述基体固定连接,另一端与所述空气阻挡部固定连接。Preferably, the air filter chip further includes at least one support body, one end of the support body is fixedly connected to the base body, and the other end is fixedly connected to the air blocking portion.
较为优选的,分布于所述基体的第一表面的第三区域的复数个凸起部排布形成具有超疏水或超疏油性能的微米级或纳米级阵列结构。More preferably, the plurality of raised portions of the third region distributed over the first surface of the substrate are arranged to form a micron or nanoscale array structure having superhydrophobic or superoleophobic properties.
较为优选的,所述空气过滤芯片包括两个以上所述的支撑体,并且该两个以上所述的支撑体对称分布于所述第一流体通道的空气入口周围。More preferably, the air filter chip includes two or more of the support bodies, and the two or more support bodies are symmetrically distributed around the air inlet of the first fluid passage.
较为优选的,所述第一流体通道的空气入口上架设有一根以上支撑梁,所述支撑梁与所述空气阻挡部固定连接。Preferably, the air inlet of the first fluid passage is provided with more than one supporting beam, and the supporting beam is fixedly connected with the air blocking portion.
进一步的,所述凸起部为站立设置的线状、柱状、片状、管状、锥状、锥台状结构中的任意一种,且不限于此。Further, the raised portion is any one of a linear, columnar, sheet-like, tubular, tapered, and frustum-like structure that is standing, and is not limited thereto.
进一步的,所述凸起部的横向截面具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形,但不限于此。Further, the lateral section of the convex portion has a regular or irregular shape, and the regular shape includes a polygon, a circle, or an ellipse, but is not limited thereto.
进一步的,所述的复数个凸起部均匀分布或非均匀分布在所述基体的第一表面上。 Further, the plurality of protrusions are uniformly distributed or non-uniformly distributed on the first surface of the substrate.
进一步的,所述第一流体通道的空气入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形,但不限于此。Further, the air inlet of the first fluid passage has a regular or irregular shape, and the regular shape includes a polygon, a circle or an ellipse, but is not limited thereto.
较为优选的,所述凸起部为线状凸起,其长径比为4:1~200000:1。More preferably, the raised portion is a linear protrusion having an aspect ratio of 4:1 to 200000:1.
较为优选的,相邻凸起部之间的距离与所述凸起部的长度的比值为1:4~1:200000。More preferably, the ratio of the distance between adjacent convex portions to the length of the convex portion is 1:4 to 1:200,000.
较为优选的,所述凸起部为竖立设置的微米线或纳米线,其直径为1nm~50μm,长度为50nm~200μm,相邻凸起部之间的距离为1nm~50μm。More preferably, the raised portion is an upright microwire or a nanowire having a diameter of 1 nm to 50 μm, a length of 50 nm to 200 μm, and a distance between adjacent convex portions of 1 nm to 50 μm.
在本发明的较为具体的第四实施方案中,所述过滤芯片包括:In a more specific fourth embodiment of the present invention, the filter chip comprises:
具有第一流体通道的基体,所述第一流体通道具有空气入口和空气出口,所述第一流体通道的空气入口分布于所述基体的第一表面的第一区域内;a base having a first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed in a first region of the first surface of the base;
空气阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理空气直接进入所述第一流体通道的空气入口;An air blocking portion having a second surface disposed opposite the first surface of the base body for blocking an air inlet of the air to be treated directly entering the first fluid passage;
复数个凸起部,所述凸起部沿横向在所述基体的第一表面的第二区域连续延伸,其中相邻凸起部之间形成有可供空气通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的空气内的选定颗粒的粒径,并且所述凸起部的上端与所述基体的第一表面密封连接,下端的局部区域与所述空气阻挡部的第二表面密封连接,从而使所述复数个凸起部之间的一个以上沟槽、空气阻挡部与基体配合形成第二流体通道,且待处理的空气仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions extending continuously in a second region of the first surface of the substrate in a lateral direction, wherein a groove through which air can pass is formed between adjacent protrusions, the groove The opening of the opening has a diameter greater than 0 but less than the particle size of the selected particles mixed in the air to be treated, and the upper end of the raised portion is sealingly connected to the first surface of the base, and the partial portion of the lower end is The second surface of the air blocking portion is sealingly connected such that more than one groove between the plurality of convex portions and the air blocking portion cooperate with the base body to form a second fluid passage, and the air to be treated can pass only the first The two fluid passages enter the first fluid passage.
进一步的,所述基体的第一表面的第二区域环绕第一区域设置。Further, the second region of the first surface of the substrate is disposed around the first region.
进一步的,所述凸起部的第二端的局部区域及所述第一流体通道的空气入口均分布在所述空气阻挡部于所述基体的第一表面上形成的正投影内。Further, a partial region of the second end of the convex portion and an air inlet of the first fluid channel are distributed in an orthographic projection formed on the first surface of the substrate by the air blocking portion.
进一步的,所述凸起部的形状包括长条状或片状,但不限于此。Further, the shape of the convex portion includes an elongated shape or a sheet shape, but is not limited thereto.
进一步的,所述的复数个凸起部均匀分布或非均匀分布在所述基体的第一表面上。Further, the plurality of protrusions are uniformly distributed or non-uniformly distributed on the first surface of the substrate.
进一步的,所述第一流体通道的空气入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形,但不限于此。Further, the air inlet of the first fluid passage has a regular or irregular shape, and the regular shape includes a polygon, a circle or an ellipse, but is not limited thereto.
较为优选的,所述凸起部的宽度为1nm~50μm,高度为50nm~200μm。More preferably, the raised portion has a width of 1 nm to 50 μm and a height of 50 nm to 200 μm.
较为优选的,形成于相邻凸起部之间的沟槽开口部的尺寸为1nm~50μm。More preferably, the size of the opening of the groove formed between the adjacent convex portions is 1 nm to 50 μm.
较为优选的,所述第一流体通道的孔径为1μm~1mm。More preferably, the first fluid passage has a pore diameter of 1 μm to 1 mm.
较为优选的,所述基体的厚度在1μm以上。More preferably, the thickness of the substrate is 1 μm or more.
较为优选的,所述空气阻挡部的厚度为0.5μm~200μm。More preferably, the air blocking portion has a thickness of 0.5 μm to 200 μm.
较为优选的,所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化 材料或抗菌材料。Preferably, the surface of the convex portion is further provided with a layer of functional material, and the material of the functional material layer comprises photocatalysis. Material or antibacterial material.
较为优选的,所述基体、空气阻挡部、凸起部中的至少一者的至少局部为透明结构。More preferably, at least a part of at least one of the base body, the air blocking portion, and the convex portion is a transparent structure.
在本发明的较为具体的第五实施方案中,所述过滤芯片包括:In a more specific fifth embodiment of the present invention, the filter chip comprises:
具有第一流体通道的基体,所述第一流体通道具有空气入口和空气出口,所述第一流体通道的空气入口分布于所述基体的第一表面;a base having a first fluid passage, the first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed on the first surface of the base;
彼此间隔设置的复数个凸起部,所述凸起部固定设置在所述基体的第一表面上,并沿横向在所述基体的第一表面上连续延伸,其中相邻凸起部之间形成有可供空气通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的空气内的选定颗粒的粒径,以及,其中至少两个凸起部分别与所述第一流体通道的空气入口的相背对的两侧相邻设置,至少一个凸起部直接从所述第一流体通道的空气入口上通过,从而使所述复数个凸起部与基体之间配合形成与所述第一流体通道连通的第二流体通道,且待处理的空气仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions spaced apart from each other, the protrusions being fixedly disposed on the first surface of the base body and extending continuously on the first surface of the base body in a lateral direction, wherein between the adjacent protrusions Forming a groove through which air can pass, the opening of the groove having a diameter greater than 0 but smaller than the particle size of the selected particles mixed in the air to be treated, and wherein at least two of the raised portions are respectively Two opposite sides of the opposite sides of the air inlet of the first fluid passage are disposed adjacent to each other, and at least one convex portion directly passes through the air inlet of the first fluid passage, so that the plurality of convex portions and the base body The interfitting forms a second fluid passage in communication with the first fluid passage, and the air to be treated can only enter the first fluid passage through the second fluid passage.
较为优选的,所述过滤芯片还包括:空气阻挡部,具有与所述基体的第一表面相对设置的第二表面,所述第一流体通道的空气入口分布在所述空气阻挡部于所述基体的第一表面上形成的正投影内,所述复数个凸起部具有相背对的第一端和第二端,所述第一端与所述基体的第一表面密封连接,第二端的局部区域与所述遮挡部的第二表面密封连接。More preferably, the filter chip further includes: an air blocking portion having a second surface disposed opposite to the first surface of the base body, wherein an air inlet of the first fluid passage is distributed in the air blocking portion An orthographic projection formed on the first surface of the substrate, the plurality of protrusions having opposite first and second ends, the first end being sealingly coupled to the first surface of the substrate, second A partial region of the end is sealingly coupled to the second surface of the shield.
较为优选的,所述复数个凸起部平行分布在所述基体的第一表面上。More preferably, the plurality of protrusions are distributed in parallel on the first surface of the substrate.
较为优选的,形成于相邻凸起部之间的沟槽的开口部的尺寸为1nm~50μm。More preferably, the size of the opening of the groove formed between the adjacent convex portions is 1 nm to 50 μm.
较为优选的,所述第一流体通道的孔径为1μm~1mm。More preferably, the first fluid passage has a pore diameter of 1 μm to 1 mm.
较为优选的,所述基体的厚度在1μm以上。More preferably, the thickness of the substrate is 1 μm or more.
较为优选的,所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料。Preferably, the surface of the convex portion is further provided with a layer of functional material, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material.
较为优选的,所述空气阻挡部的厚度为0.5μm~200μm。More preferably, the air blocking portion has a thickness of 0.5 μm to 200 μm.
较为优选的,所述基体、空气阻挡部、凸起部中的至少一者的至少局部为透明结构。More preferably, at least a part of at least one of the base body, the air blocking portion, and the convex portion is a transparent structure.
在本发明的较为具体的第六实施方案中,所述过滤芯片包括:In a more specific sixth embodiment of the present invention, the filter chip comprises:
具有流体通道的基体,以及a substrate having a fluid passage, and
复数根线形体的聚集体,用以对流经所述流体通道的、混杂有选定颗粒的空气进行处理;An aggregate of a plurality of linear bodies for treating air flowing through the fluid passage mixed with selected particles;
所述聚集体分布于所述流体通道内,并具有多孔结构,所述多孔结构内孔洞的直径大于0但小于所述选定颗粒的粒径。The aggregates are distributed within the fluid channel and have a porous structure, the pores within the porous structure having a diameter greater than zero but less than the particle size of the selected particles.
进一步的,所述线形体一端均与所述流体通道的内壁固定连接,另一端沿所述流体通道 的径向延伸。Further, one end of the linear body is fixedly connected to the inner wall of the fluid passage, and the other end is along the fluid passage Radial extension.
进一步的,所述复数根线形体相互交叉或彼此交织形成所述多孔结构。Further, the plurality of linear bodies are crossed or interwoven to form the porous structure.
进一步的,所述复数根线形体彼此间隔设置并平行排布形成所述多孔结构。Further, the plurality of linear bodies are spaced apart from each other and arranged in parallel to form the porous structure.
进一步的,所述基体具有相背对的第一表面和第二表面,所述流体通道的空气入口分布于所述基体的第一表面。Further, the base body has a first surface and a second surface opposite to each other, and an air inlet of the fluid passage is distributed on the first surface of the base body.
进一步的,所述基体的第一表面还分布有彼此间隔设置的复数根竖立线形体,所述复数根竖立线形体环绕所述流体通道设置。Further, the first surface of the base body is further distributed with a plurality of vertical linear bodies spaced apart from each other, and the plurality of vertical linear bodies are disposed around the fluid passage.
进一步的,所述过滤芯片还包括空气阻挡部,所述空气阻挡部具有与所述基体的第一表面相对设置的第三表面,并且所述复数根竖立线形体一端固定设置于所述基体的第一表面,另一端与所述空气阻挡部的第三表面固定连接,其中相邻竖立线形体之间的距离大于0但小于所述选定颗粒的粒径。Further, the filter chip further includes an air blocking portion having a third surface disposed opposite to the first surface of the base body, and one end of the plurality of upright linear bodies is fixedly disposed on the base body The first surface, the other end is fixedly coupled to the third surface of the air barrier, wherein the distance between adjacent upright linear bodies is greater than zero but less than the particle size of the selected particles.
较为优选的,所述基体的第一表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料。Preferably, the first surface of the base body is further provided with a layer of functional material, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material.
较为优选的,所述空气过滤芯片中的至少部分组件具有透明结构。More preferably, at least some of the components of the air filter chip have a transparent structure.
进一步的,所述流体通道的空气入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形,但不限于此。Further, the air inlet of the fluid passage has a regular or irregular shape, and the regular shape includes a polygon, a circle, or an ellipse, but is not limited thereto.
较为优选的,所述流体通道的孔径为1μm~1mm。More preferably, the fluid passage has a pore diameter of from 1 μm to 1 mm.
较为优选的,所述基体的厚度在1μm以上。More preferably, the thickness of the substrate is 1 μm or more.
进一步的,所述流体通道的空气入口及复数根竖立线形体分布在所述空气阻挡部于所述基体的第一表面的正投影内。Further, the air inlet of the fluid passage and the plurality of upright linear bodies are distributed in an orthographic projection of the air blocking portion on the first surface of the base body.
较为优选的,所述竖立线形体的长径比为4:1~200000:1。More preferably, the erected linear body has an aspect ratio of 4:1 to 200000:1.
较为优选的,相邻竖立线形体之间的距离与所述竖立线形体的长度的比值为1:4~1:200000。More preferably, the ratio of the distance between adjacent upright linear bodies to the length of the upright linear bodies is 1:4 to 1:200,000.
较为优选的,所述线形体的直径为1nm~500μm。More preferably, the linear body has a diameter of from 1 nm to 500 μm.
较为优选的,所述线形体选自纳米线或纳米管。More preferably, the linear body is selected from the group consisting of nanowires or nanotubes.
较为优选的,至少于所述线形体表面还分布有光催化材料或抗菌材料。More preferably, at least the surface of the linear body is further distributed with a photocatalytic material or an antibacterial material.
较为优选的,所述线形体包括碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线中的任一种或两种以上的组合,但不限于此。More preferably, the linear body includes any one or a combination of two or more of carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, and Au nanowires, but Not limited to this.
以下将结合附图及若干实施例对本申请的技术方案作进一步的说明。The technical solutions of the present application will be further described below in conjunction with the accompanying drawings and several embodiments.
请参阅图2-图3所示,在本申请的一实施例(命名为第一实施例)中,一种流体处理装 置包括基体101,所述基体101具有相背对的第一表面1011和第二表面1012,且所述基体101内分布有若干作为流体通道的通孔102,所述第一表面设置有多个横梁103(可命名为凸起部)平行排布形成的阵列,其中有多根横梁103直接从通孔102上跨过以及有多根横梁103分布在通孔102两侧,其中,各横梁103顶部还均分布有帽形结构104(简称帽层),各帽层亦随各横梁沿横向连续延伸,并形成帽形结构的阵列,且待处理的流体无法绕过前述帽形结构的阵列而直接进入所述通孔102。Referring to Figures 2 - 3, in an embodiment of the present application (named as the first embodiment), a fluid processing device The base body 101 has a first surface 1011 and a second surface 1012 opposite to each other, and a plurality of through holes 102 as fluid passages are disposed in the base body 101, and the first surface is provided with a plurality of An array of beams 103 (named as raised portions) arranged in parallel, wherein a plurality of beams 103 are directly traversed from the through holes 102 and a plurality of beams 103 are distributed on both sides of the through holes 102, wherein the beams 103 The top is also distributed with a hat-shaped structure 104 (abbreviated as a cap layer), and each cap layer also continuously extends along the transverse direction in the transverse direction, and forms an array of hat-shaped structures, and the fluid to be treated cannot bypass the array of the above-mentioned hat-shaped structures. Directly enter the through hole 102.
其中,通过调整前述各帽形结构之间的间距,即可形成具有选定尺寸的开口部(可以称为微流道),实现对流体中不同粒径范围的颗粒进行清除处理,特别是,当将这些帽形结构的间距控制在纳米级时,可以去除流体中的极微小的颗粒(纳米级的颗粒)。Wherein, by adjusting the spacing between the foregoing hat-shaped structures, an opening portion (which may be referred to as a micro-flow channel) having a selected size can be formed, and the particles of different particle size ranges in the fluid can be removed, in particular, When the pitch of these cap structures is controlled at the nanometer level, very minute particles (nanoscale particles) in the fluid can be removed.
前述横梁可以为条状,并具有较大的宽度和厚度,使得这些横梁可具有较高机械强度,使其对帽形层形成较好的支撑,而各横梁的间距可以较大,以提供较大的流体通量。The foregoing beams may be strip-shaped and have a large width and thickness, so that the beams can have higher mechanical strength, so that they can form better support for the hat-shaped layer, and the spacing of the beams can be larger to provide a comparison. Large fluid flux.
前述帽层亦可以具有较大的厚度,其两侧沿侧向外延,使相邻帽层的间距可以达到很小,例如可以低至1nm,因此可以截留混杂于待处理的流体内的极小的颗粒。The cap layer may also have a large thickness, and both sides are laterally extended so that the spacing of adjacent cap layers can be made small, for example, as low as 1 nm, so that the trapping of the fluid to be treated is minimal. particle.
前述帽层可以与凸起部一体设置,例如可以通过蒸发、沉积、生长等(典型的如金属溅射、MOCVD、PECVD、电化学沉积等)技术直接形成于所述凸起部上部,并且所述帽形结构亦可随所述凸起部沿横向连续延伸,从而使相邻帽形结构之间形成沿横向连续延伸的开口部,如此一方面可以保证对混杂于待处理的流体内的选定颗粒的处理,亦还保持很高的通量,且降低了加工难度,节约了成本。The cap layer may be integrally provided with the convex portion, for example, may be directly formed on the upper portion of the convex portion by evaporation, deposition, growth, or the like (typically, such as metal sputtering, MOCVD, PECVD, electrochemical deposition, etc.), and The hat-shaped structure may also continuously extend in the lateral direction with the convex portion, so that an opening portion extending continuously in the lateral direction is formed between the adjacent hat-shaped structures, so that on the one hand, the selection of the fluid mixed in the fluid to be treated can be ensured. The treatment of the fixed particles also maintains a high throughput, which reduces the processing difficulty and saves costs.
前述帽层的材质可以选自绝缘介质材料如氧化硅、氮化硅氧化铝、硼磷硅玻璃等,或者半导体材料如Si、ZnO、GaN、TiO2、InN等,或金属材料如Ag、Au、Al、Ni、Cr、Ti等,但不限于此。The material of the cap layer may be selected from an insulating dielectric material such as silicon oxide, silicon nitride oxide, borophosphosilicate glass, or the like, or a semiconductor material such as Si, ZnO, GaN, TiO 2 , InN, or the like, or a metal material such as Ag or Au. , Al, Ni, Cr, Ti, etc., but are not limited thereto.
其中,所述基体101可以具有较大的厚度,使其对前述微/纳米片阵列形成较好的支撑,同时还可进一步增强所述流体处理装置的机械强度,使所述流体处理装置耐压、耐弯折、耐碰撞、耐冲击,进而使其可以在多种环境中应用而不致损坏,例如可以应用于对高压、高速流体进行处理,这一功能是现有的多孔膜等无法企及的。Wherein, the base body 101 can have a large thickness, so that it can form a good support for the aforementioned micro/nano-array array, and can further enhance the mechanical strength of the fluid processing device, and make the fluid processing device withstand voltage. It is resistant to bending, impact and impact, so that it can be applied in a variety of environments without damage. For example, it can be applied to the treatment of high-pressure, high-speed fluids, which is unmatched by existing porous membranes. .
其中,所述流体处理装置各部分(101、102、103、104)的材料选择范围是多样的,可以是无机材料,也可以是有机材料,例如金属、非金属无机材料、塑料、陶瓷、半导体、玻璃、聚合物等。当这些部分都选择使用无机材料时,所述流体处理装置还具有耐温度变化的特性,可以处理高温和低温流体。Wherein, the material selection range of each part (101, 102, 103, 104) of the fluid processing device is diverse, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, or a semiconductor. , glass, polymer, etc. When these portions are all selected to use inorganic materials, the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
采用前述设计的流体处理装置可以(超声)清洗,多次使用,且仍旧保持良好的流体处 理能力。The fluid treatment device of the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain a good fluid Ability.
当利用所述的流体处理装置对流体进行处理时,含有杂质颗粒的流体(流体流向如图3中带有虚线的箭头所示)在进入前述帽形结构的阵列时,其中粒径大于一定数值的颗粒(或一些与流体不相容的液滴,例如空气中的水滴或油中的水滴)被阻挡在前述帽形结构的阵列之外,之后流体经由各帽形结构之间的开口部到达通孔102的入口处后再进入通孔102,实现对流体的净化和/或者对所需颗粒(液滴)的富集回收。When the fluid is treated by the fluid processing device, the fluid containing the impurity particles (the fluid flow is indicated by the arrow with a broken line in FIG. 3) enters the array of the aforementioned hat-shaped structure, wherein the particle diameter is larger than a certain value. The particles (or some droplets that are incompatible with the fluid, such as water droplets in the air or water droplets in the oil) are blocked outside the array of the aforementioned hat-shaped structures, after which the fluid reaches through the opening between the respective hat-shaped structures The entrance of the through hole 102 is then re-entered into the through hole 102 to effect purification of the fluid and/or enrichment recovery of the desired particles (droplets).
在该实施例的一些具体应用方案中,前述各帽层的间隙可以为1nm~50μm,帽层的高度可以为50nm~200μm。In some specific applications of the embodiment, the gap of each of the cap layers may be 1 nm to 50 μm, and the height of the cap layer may be 50 nm to 200 μm.
在该实施例的一些具体应用方案中,前述通孔的孔径可以为1μm~1mm,前述基体的厚度可以>1μm。In some specific applications of the embodiment, the through hole may have a diameter of 1 μm to 1 mm, and the substrate may have a thickness of >1 μm.
在该实施例的一些具体应用方案中,前述横梁的高度可以为0.1μm~400μm,宽度可以为0.1um~100μm,各横梁的间距可以为0.1μm~100μm。In some specific applications of the embodiment, the height of the beam may be 0.1 μm to 400 μm, the width may be 0.1 μm to 100 μm, and the distance between the beams may be 0.1 μm to 100 μm.
形成于相邻帽形层及相邻横梁之前的开口部的纵向截面可以是规则或不规则形状的,例如可以是梯形、多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等。The longitudinal section of the opening formed before the adjacent hat-shaped layer and the adjacent beam may be regular or irregular, and may be, for example, trapezoidal, polygonal (triangle, quadrilateral or other), circular, elliptical, star, etc. Wait.
前述横梁及帽形层可以规则或不规则、均匀或非均匀的分布在所述基体的第一表面上。The aforementioned beam and cap layer may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate.
另外,在该第一实施例中,前述通孔102的形状可以是多样的,例如可以是圆形、正方形、长方形或其它形状。In addition, in the first embodiment, the shape of the through hole 102 may be various, and may be, for example, a circle, a square, a rectangle, or the like.
在本申请的其它一些实施例中,一种流体处理装置可以具有与前述实施例中任一者相似的结构,不同之处在于:在横梁、帽形层及基体表面还可设置有光催化材料层。在以包含光催化材料层的流体处理装置对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。In some other embodiments of the present application, a fluid processing apparatus may have a structure similar to any of the foregoing embodiments, except that a photocatalytic material may be disposed on the beam, the cap layer, and the surface of the substrate. Floor. When the fluid is treated by a fluid processing device including a photocatalytic material layer, if it is supplemented with ultraviolet light or the like, photocatalytic degradation of some organic pollutants in the fluid may be performed to achieve multiple purification of the fluid.
其中,为利于光线透入,所述帽形层、横梁及基体中的部分或全部可以由透明材料制成。在本实施例的一些具体实施方案中,所述帽形层、横梁可以整体由透明材料制成,例如光线射入。Wherein, in order to facilitate light penetration, part or all of the hat layer, the beam and the base may be made of a transparent material. In some embodiments of the embodiment, the hat layer and the beam may be made entirely of a transparent material, such as light.
其中,较为典型的光催化材料可以是二氧化钛等,但不限于此。Among them, a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
其中,为形成所述光催化材料层,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述光催化材料层的厚度可以被控制在纳米级,以尽量减少其对所述流体处理装置的流体通量的影响。 Wherein, the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the fluid processing device.
该实施例中所采用的基体、帽形层、横梁、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structures, arrangement forms, materials, and the like of the base, the cap layer, the beam, the through hole, and the like used in the embodiment may be the same as or similar to those described above, and thus will not be described herein.
在本申请的其它一些实施例中,一种流体处理装置可以具有与前述实施例中任一者相似的结构,不同之处在于:在横梁、帽形层及基体表面还可设置有抗菌材料层。在以包含抗菌材料层的流体处理装置对流体进行处理时,可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等,实现对流体的多重净化。In some other embodiments of the present application, a fluid treatment device may have a structure similar to any of the previous embodiments, except that an antibacterial material layer may be disposed on the beam, the cap layer, and the surface of the substrate. . When the fluid is treated with a fluid processing device comprising a layer of antimicrobial material, bacteria, viruses, etc. in the fluid can be simultaneously killed during the processing of the fluid to achieve multiple purification of the fluid.
其中,较为典型的抗菌材料可以是诸如Au、Ag等贵金属等,但不限于此。Among them, the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
其中,为形成所述抗菌材料层,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the antibacterial material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer). Deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述抗菌材料层的厚度可以被控制在纳米级,以尽量减少其对所述流体处理装置的流体通量的影响。Wherein, the thickness of the antimicrobial material layer can be controlled at the nanometer level to minimize its effect on the fluid flux of the fluid treatment device.
该实施例中所采用的基体、帽形层、横梁、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structures, arrangement forms, materials, and the like of the base, the cap layer, the beam, the through hole, and the like used in the embodiment may be the same as or similar to those described above, and thus will not be described herein.
本申请的所述流体处理装置可以通过物理、化学方法制备,例如可以是化学生长法、物理加工法等,特别是MEMS(微机电系统,Microelectromechanical Systems)法等。The fluid processing apparatus of the present application can be prepared by physical or chemical methods, and may be, for example, a chemical growth method, a physical processing method, or the like, particularly a MEMS (Micro Electromechanical Systems) method.
如图4所示,该实施例中所述流体处理装置的制备工艺可以包括如下步骤:As shown in FIG. 4, the preparation process of the fluid processing apparatus in this embodiment may include the following steps:
S1:提供衬底(例如硅片);S1: providing a substrate (such as a silicon wafer);
S2:在衬底的一侧表面(命名为第一表面)上光刻出微纳米尺度的线条,即形成图形化的光刻胶掩模;S2: lithographically patterning micro-nano-scale lines on one side surface of the substrate (designated as the first surface), ie forming a patterned photoresist mask;
S3:在所述衬底的第一表面刻蚀(RIE、ICP、湿法腐蚀、电化学腐蚀等)出微纳米尺度的多根横梁,之后除去所述光刻胶掩模;S3: etching, on the first surface of the substrate (RIE, ICP, wet etching, electrochemical etching, etc.) a plurality of beams on the micro-nano scale, and then removing the photoresist mask;
S4:在所述衬底的与第一表面相背对的另一侧表面(命名为第二表面)上设置光刻胶刻蚀掩模;S4: providing a photoresist etching mask on another side surface (named second surface) of the substrate opposite to the first surface;
S5:对所述衬底的该另一侧表面进行刻蚀,直至在所述衬底的该另一侧表面形成作为流体通道的通孔;S5: etching the other side surface of the substrate until a through hole as a fluid passage is formed on the other side surface of the substrate;
S6:除去光刻胶刻蚀掩模,之后在有衬底的有横梁一侧的表面蒸镀或沉积或生长帽层结构。蒸镀或沉积或生长工艺过程中存在侧向延伸的现象,能够使帽层间隙随着厚度的增加而减小,最小可以达到几个纳米。S6: removing the photoresist etch mask, and then evaporating or depositing or growing the cap layer structure on the surface of the substrate having the beam side. There is a lateral extension during the evaporation or deposition or growth process, which enables the cap gap to decrease with increasing thickness, up to a few nanometers.
S7:划片、封装,制得流体处理装置(该步骤在图中未示出)。 S7: dicing, encapsulation, and preparation of a fluid treatment device (this step is not shown in the drawings).
前述各步骤中采用的刻蚀方法还可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may also be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,在前述步骤中,形成图形化的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, in the foregoing steps, the method of forming the patterned photoresist mask includes a photolithography technique, a nanosphere mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
显然,本申请流体处理装置的制备工艺是简单可控的,适合批量化大规模生产,且所获流体处理装置至少具有如下优点:(1)通量大,流阻小;(2)物理过滤,能有效清除大于纳米缝隙的颗粒;(3)跨越式横梁和较大的衬底厚度,可以保证高机械强度;(5)可以(超声)清洗,多次使用。Obviously, the preparation process of the fluid processing device of the present application is simple and controllable, and is suitable for mass production in large quantities, and the obtained fluid processing device has at least the following advantages: (1) large flux and small flow resistance; (2) physical filtration It can effectively remove particles larger than nano-slit; (3) straddle beam and large substrate thickness can ensure high mechanical strength; (5) can be (ultrasonic) cleaning, multiple use.
请参阅图5所示,在本申请的第二实施例中,一种流体处理装置包括基体201,所述基体201具有相背对的第一表面2011和第二表面2012,且所述基体201上分布有若干作为流体通道的通孔204。所述第一表面2011上设置有平行排布的多根横梁203,所述横梁203在所述第一表面上沿横向连续延伸,其中的若干横梁203从所述通孔204上连续跨过,因此也可以被视为跨越式横梁203。其中任一横梁203上均分布有多根纳米线202,该多根纳米线202的一端均固定于该任一横梁203表面,另一端沿逐渐远离该任一横梁203的方向斜向延伸(亦可认为是侧向延伸),并与分布在相邻于该任一横梁203的另一横梁上的多根纳米线202相互交叉,从而形成所述多孔结构205。请再次参阅图5,所述多孔结构205以俯视的视角观察为掩盖所述通孔204的网格结构。所述多孔结构205中孔洞的直径大于0但小于混杂于待处理的流体内的选定颗粒的粒径。而请参阅图6,可以看到该多根纳米线202交叉形成的多孔结构205与所述基体201的第一表面2011配合形成另一流体通道,使得待处理的流体206仅能通过该另一流体通道进入所述通孔204。Referring to FIG. 5, in a second embodiment of the present application, a fluid processing apparatus includes a base 201 having a first surface 2011 and a second surface 2012 opposite to each other, and the base 201 A plurality of through holes 204 are provided as fluid passages. The first surface 2011 is provided with a plurality of cross beams 203 arranged in parallel, the cross beams 203 continuously extending in a lateral direction on the first surface, and a plurality of cross beams 203 are continuously traversed from the through holes 204, It can therefore also be regarded as a spanning beam 203. Each of the beams 203 is distributed with a plurality of nanowires 202. One end of the plurality of nanowires 202 is fixed to the surface of the beam 203, and the other end is obliquely extended away from the beam 203. It can be considered to be laterally extended and intersects with a plurality of nanowires 202 distributed on another beam adjacent to either of the beams 203 to form the porous structure 205. Referring again to FIG. 5, the porous structure 205 is viewed in a plan view to cover the mesh structure of the through holes 204. The diameter of the pores in the porous structure 205 is greater than zero but less than the particle size of selected particles that are intermixed within the fluid to be treated. Referring to FIG. 6 , it can be seen that the porous structure 205 formed by the intersection of the plurality of nanowires 202 cooperates with the first surface 2011 of the base 201 to form another fluid passage, so that the fluid to be treated 206 can pass only the other A fluid passage enters the through hole 204.
其中,因前述纳米线具有较大的高径比(或者长径比),使得这些纳米线可密集排布于所述基体的第一表面,通过调整前述横梁之间的间距以及这些纳米线的密度、长度、延伸方向等,即可对流体中不同粒径范围的颗粒进行清除处理,特别是,当采用的均是纳米线时,通过将这些纳米线交叉形成的孔洞孔径控制在纳米级,不仅可以去除流体中的极微小的颗粒,而且因纳米线自身直径极小,还可使其对于流体的阻力被控制在很低的水平,并形成很大的流体通量,远远优于现有的多孔膜、基于横向流道的流体处理装置等。Wherein, because the nanowires have a large aspect ratio (or aspect ratio), the nanowires can be densely arranged on the first surface of the substrate, by adjusting the spacing between the beams and the nanowires. Density, length, direction of extension, etc., can be used to remove particles of different particle size ranges in the fluid. In particular, when nanowires are used, the pore size formed by the intersection of these nanowires is controlled at the nanometer level. Not only can the tiny particles in the fluid be removed, but also because the nanowire itself has a very small diameter, it can also control the resistance to the fluid to a very low level and form a large fluid flux, which is far superior to the present. Some porous membranes, fluid processing devices based on lateral flow channels, and the like.
其中,若参考业界已知的方案,将前述的纳米线的排布方式进行一定的设计,还可使之形成超疏水结构、超疏油结构,不仅可以清除流体中的颗粒,且还可通过自清洁作用,使被阻挡的颗粒无法在所述流体处理装置的功能区域(纳米线阵列表面)积聚,避免所述流体处理装置在长期使用后失效。Wherein, according to the solution known in the industry, the arrangement of the aforementioned nanowires is designed to be super-hydrophobic structure and super-oleophobic structure, which can not only remove particles in the fluid, but also pass The self-cleaning action prevents the blocked particles from accumulating in the functional areas of the fluid handling device (the nanowire array surface), preventing the fluid handling device from failing after prolonged use.
其中,所述横梁203可以在所述基体201的第一表面2011上以合适的密度分布,以使所 述流体处理装置具有尽可能高的流体处理通量。以及,所述横梁203可具有合适的宽度,以使所述横梁203在具有足够的机械强度的同时,还可避免对所述流体处理装置的通量造成过多影响。例如,所述横梁的高度可以为0.1μm~100μm,宽度可以为0.1μm~400μm,横梁之间的间距可以为0.1μm~100μm。Wherein, the beam 203 may be distributed at a suitable density on the first surface 2011 of the base 201 to The fluid handling device has as high a fluid handling flux as possible. Also, the beam 203 can have a suitable width such that the beam 203, while having sufficient mechanical strength, can also avoid excessive effects on the flux of the fluid treatment device. For example, the beam may have a height of 0.1 μm to 100 μm, a width of 0.1 μm to 400 μm, and a pitch between the beams of 0.1 μm to 100 μm.
其中,所述基体201可以具有较大的厚度及所述横梁203可以具有较大的高度,使其对前述纳米线阵列形成较好的支撑,同时还可进一步增强所述流体处理装置的机械强度,使所述流体处理装置耐压、耐弯折、耐碰撞、耐冲击,进而使其可以在多种环境中应用而不致损坏,例如可以应用于对高压、高速流体进行处理,这一功能是现有的多孔膜等无法企及的。Wherein, the base 201 can have a larger thickness and the beam 203 can have a larger height, so that it can form a better support for the nanowire array, and can further enhance the mechanical strength of the fluid processing device. The fluid processing device is resistant to pressure, bending, impact, and impact, so that it can be applied in various environments without damage, for example, it can be applied to high-pressure, high-speed fluid processing. Existing porous membranes and the like are unattainable.
其中,所述流体处理装置各部分(201、202、203)的材料选择范围是多样的,可以是无机材料,也可以是有机材料。当这些部分都选择使用无机材料时,所述流体处理装置还具有耐温度变化的特性,可以处理高温和低温流体。The material selection range of each part (201, 202, 203) of the fluid processing device is various, and may be an inorganic material or an organic material. When these portions are all selected to use inorganic materials, the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
采用前述设计的所述的流体处理装置可以(超声)清洗,多次使用,且仍旧保持良好的流体处理能力。The fluid treatment device of the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
当利用所述的流体处理装置对流体进行处理时,含有杂质颗粒的流体在进入前述多孔结构205时,其中粒径大于一定数值的颗粒(或一些与流体不相容的液滴,例如空气中的水滴或油中的水滴)被阻挡在前述多孔结构205之外,之后流体经由各纳米线之间的间隙到达通孔204的入口处后再进入通孔204,实现对流体的净化和/或者对所需颗粒(液滴)的富集回收。When the fluid is treated with the fluid processing device, the fluid containing the foreign particles enters the porous structure 205, wherein the particles having a particle size larger than a certain value (or some liquid incompatible with the fluid, such as air) The water droplets or the water droplets in the oil are blocked outside the porous structure 205, after which the fluid reaches the entrance of the through hole 204 via the gap between the nanowires and then enters the through hole 204, thereby purifying the fluid and/or Enrichment recovery of the desired particles (droplets).
请再次参阅图6所示,在该实施例的一些具体应用方案中,前述纳米线202的直径和间距可以为1nm~50μm,长度(高度)可以为50nm~200μm。所述通孔204的孔径可以为1μm~1mm。所述基体的厚度可以在1μm以上。Referring to FIG. 6 again, in some specific applications of the embodiment, the nanowires 202 may have a diameter and a pitch of 1 nm to 50 μm and a length (height) of 50 nm to 200 μm. The through hole 204 may have a diameter of 1 μm to 1 mm. The thickness of the substrate may be 1 μm or more.
前述纳米线的横向截面结构可以是规则或不规则形状的,例如可以是多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等。The transverse cross-sectional structure of the aforementioned nanowires may be regular or irregular, and may be, for example, a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, or the like.
前述纳米线202可以规则或不规则、均匀或非均匀的分布在所述基体201的第一表面上。The aforementioned nanowires 202 may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate 201.
由这些纳米线202形成的阵列可具有超疏水结构,进而使得所述流体处理装置具有自清洁功能。The array formed by these nanowires 202 can have a superhydrophobic structure, thereby allowing the fluid handling device to have a self-cleaning function.
前述的纳米线202可以优选自碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线等,且不限于此。The aforementioned nanowires 202 may preferably be selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
前述纳米线202可以通过外界转移、原位生长(例如化学生长、电化学生长)或沉积(例如物理、化学气相沉积,电沉积)等方式固定于所述基体表面或者于所述基体表面生长形成。 The foregoing nanowires 202 may be fixed to the surface of the substrate or grown on the surface of the substrate by external transfer, in-situ growth (eg, chemical growth, electrochemical growth) or deposition (eg, physical, chemical vapor deposition, electrodeposition). .
前述通孔204的形状(特别是横向截面的形状)可以是多样的,例如可以是圆形、正方形、长方形、菱形、多边形或其它规则或不规则形状。The shape of the aforementioned through holes 204 (especially the shape of the transverse cross section) may be various, and may be, for example, a circle, a square, a rectangle, a diamond, a polygon, or other regular or irregular shapes.
在该实施例的一些具体应用方案中,所述纳米线202可以由光催化材料或具有抗菌、杀菌功能的材料形成,或者,所述纳米线202也可以是表面覆盖有光催化材料或具有杀菌、抗菌功能的材料形成的涂层。In some specific applications of the embodiment, the nanowires 202 may be formed of a photocatalytic material or a material having an antibacterial or bactericidal function, or the nanowires 202 may be surface covered with a photocatalytic material or have sterilization. a coating formed of an antibacterial material.
例如,所述纳米线202可采用ZnO纳米线、GaN纳米线、TiO2纳米线等具有光催化的性质的纳米线,在光辅助照射下,能够降解流体中的有机物。For example, the nanowires 202 may adopt nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO2 nanowires, and are capable of degrading organic substances in the fluid under light-assisted illumination.
例如,所述纳米线202可采用Ag纳米线、Au纳米线等,以杀灭流体中的细菌、病毒、微生物。For example, the nanowires 202 may employ Ag nanowires, Au nanowires, or the like to kill bacteria, viruses, and microorganisms in the fluid.
在该实施例的一些具体应用方案中,所述基体201的第一表面2011上还设置有光催化材料层或抗菌材料层等。In some specific applications of the embodiment, the first surface 2011 of the base 201 is further provided with a photocatalytic material layer or an antibacterial material layer or the like.
在以包含光催化材料层的流体处理装置对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。When the fluid is treated by a fluid processing device including a photocatalytic material layer, if it is supplemented with ultraviolet light or the like, photocatalytic degradation of some organic pollutants in the fluid may be performed to achieve multiple purification of the fluid.
其中,为利于光线透入,所述基体、凸起部、纳米线中的部分或全部可以由透明材料制成。Wherein, in order to facilitate light penetration, part or all of the substrate, the protrusion, and the nanowire may be made of a transparent material.
其中,较为典型的光催化材料可以是二氧化钛等,但不限于此。Among them, a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
其中,为形成所述光催化材料层,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述光催化材料层的厚度可以被控制在纳米级,以尽量减少其对所述流体处理装置的流体通量的影响。Wherein, the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the fluid processing device.
而在以包含抗菌材料层的流体处理装置对流体进行处理时,可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等,实现对流体的多重净化。When the fluid is treated by the fluid processing device including the antibacterial material layer, bacteria, viruses, and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
其中,较为典型的抗菌材料可以是诸如Au、Ag等贵金属等,但不限于此。Among them, the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
其中,为形成所述抗菌材料层,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the antibacterial material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer). Deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述抗菌材料层的厚度可以被控制在纳米级,以尽量减少其对所述流体处理装置的流体通量的影响。Wherein, the thickness of the antimicrobial material layer can be controlled at the nanometer level to minimize its effect on the fluid flux of the fluid treatment device.
本申请的所述流体处理装置可以通过物理、化学方法制备,例如可以是化学生长法、物 理加工法等,特别是MEMS(微机电系统,Microelectromechanical Systems)法等。The fluid processing device of the present application may be prepared by physical or chemical methods, for example, may be a chemical growth method, Processing methods, etc., in particular, MEMS (Microelectromechanical Systems) method.
例如,请参阅图7所示,在该实施例中,一种流体处理装置的制备工艺可以包括如下步骤:For example, referring to FIG. 7, in this embodiment, a preparation process of a fluid processing apparatus may include the following steps:
S1:在衬底(例如硅片)的第一表面上沉积用于纳米线生长的种子层。S1: depositing a seed layer for nanowire growth on a first surface of a substrate such as a silicon wafer.
S2:在所述种子层上设置图形化的光刻胶掩模,其包含光刻出微纳米尺度的线条。S2: A patterned photoresist mask is disposed on the seed layer, which comprises lithographic lines on the micro-nano scale.
S3:利用所述光刻胶掩模对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的多根微纳米尺度的横梁结构,之后除去所述光刻胶掩模。S3: etching the first surface of the substrate by using the photoresist mask to form a plurality of micro-nano-scale beam structures spaced apart from each other on the first surface of the substrate, and then removing the A photoresist mask is described.
S4:在所述衬底的第二表面上设置光刻胶形成的图形化刻蚀掩模。S4: providing a patterned etch mask formed by photoresist on the second surface of the substrate.
S5:对所述衬底的第二表面进行刻蚀,并刻蚀至所述横梁底部,从而在所述衬底的第二表面形成用作流体通道的槽孔,并除去光刻胶。S5: etching a second surface of the substrate and etching to the bottom of the beam to form a hole serving as a fluid passage on the second surface of the substrate, and removing the photoresist.
S6:在种子层上生长纳米线,控制纳米线的生长条件,使纳米线有一定的侧向生长比率,并且形成微纳米尺度的交叉网格。S6: growing nanowires on the seed layer, controlling the growth conditions of the nanowires, making the nanowires have a certain lateral growth ratio, and forming a cross-grid of micro-nano scale.
S7:划片、封装,制得流体处理装置。S7: dicing, encapsulating, and preparing a fluid processing device.
前述各步骤中采用的刻蚀方法可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,在前述步骤中,形成图形化(纳米图形)的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, in the foregoing steps, the method of forming the patterned (nano-pattern) photoresist mask includes a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
例如,在前述步骤中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等刻蚀出横梁203、通孔204等。For example, in the foregoing steps, the beam 203, the via 204, and the like may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
显然,本实施例流体处理装置的制备工艺是简单可控的,适合批量化大规模生产。Obviously, the preparation process of the fluid processing apparatus of the present embodiment is simple and controllable, and is suitable for mass production in large quantities.
请参阅图8及图11a-图11b所示,在本申请的第三实施例中,一种流体处理装置包括基体301,所述基体301具有第一表面301a,且所述基体301的第一区域3011(图中虚线围合的区域)分布有若干作为流体通道的通孔304,所述第一表面上设置有多根竖直微/纳米线/管303(即,微米级的线、微米级的管、纳米线、纳米管中的任一种或多种的组合)形成的阵列,分布在环绕第一区域3011的第二区域3012内的所述通孔304分布的多根微/纳米线/管303的顶部还连接有流体阻挡部302,所述流体阻挡部302设置于所述通孔304的流体入口上方,使待处理的流体无法绕过前述的微/纳米线/管阵列而直接进入所述通孔304,所述流体阻挡部302具有与所述第一表面3011相对设置的第二表面302b。而在所述第一表面3011的其余区域3013(可命名为第三区域)内亦可密集分布多根竖直微/纳米线/管303。在图8中,带有虚线的箭头示出了流体的行进方向。Referring to FIG. 8 and FIG. 11a - FIG. 11b, in a third embodiment of the present application, a fluid processing apparatus includes a base 301 having a first surface 301a and a first of the base 301 The region 3011 (the region enclosed by the broken line in the figure) is distributed with a plurality of through holes 304 as fluid passages, and the first surface is provided with a plurality of vertical micro/nano wires/tubes 303 (ie, micron-sized wires, micrometers) An array formed by a combination of any one or more of the tubes, nanowires, and nanotubes, distributed over the plurality of micro/nano distributed in the through holes 304 in the second region 3012 surrounding the first region 3011 The top of the wire/tube 303 is also connected with a fluid blocking portion 302 disposed above the fluid inlet of the through hole 304 so that the fluid to be treated cannot bypass the aforementioned micro/nano wire/tube array. Directly entering the through hole 304, the fluid blocking portion 302 has a second surface 302b disposed opposite the first surface 3011. A plurality of vertical micro/nano wires/tubes 303 may also be densely distributed in the remaining area 3013 of the first surface 3011 (which may be named as the third area). In Figure 8, arrows with dashed lines show the direction of travel of the fluid.
其中,因前述微/纳米线/管具有较大的高径比(或者长径比),使得这些微/纳米线/管可密 集排布于所述基体的第一表面,通过调整这些微/纳米线/管的间距,即可对流体中不同粒径范围的颗粒进行清除处理,特别是,当采用的均是纳米线/管时,通过将这些纳米线/管之间的间距控制在纳米级,不仅可以去除流体中的极微小的颗粒,而且因纳米线/管自身直径极小,还可使其对于流体的阻力被控制在很低的水平,并形成很大的流体通量,远远优于现有的多孔膜、基于横向流道的流体处理装置等。Wherein, the micro/nano wires/tubes have a large aspect ratio (or aspect ratio), so that the micro/nano wires/tubes are dense. The arrangement is arranged on the first surface of the substrate, and by adjusting the spacing of the micro/nano wires/tubes, the particles of different particle size ranges in the fluid can be removed, in particular, when the nanowires are used/ By controlling the spacing between these nanowires/tubes at the nanometer level, not only can the tiny particles in the fluid be removed, but also because the nanowire/tube itself has a very small diameter, it can also be made resistant to fluids. It is controlled at a very low level and forms a large fluid flux, which is far superior to existing porous membranes, fluid flow devices based on lateral flow channels, and the like.
其中,若参考业界已知的方案,将前述的微/纳米线/管阵列进行一定的设计,还可使之形成超疏水结构、超疏油结构,不仅可以清除流体中的颗粒,且还可通过自清洁作用,使被阻挡的颗粒无法在所述流体处理装置的功能区域(微/纳米线/管阵列表面)积聚,避免所述流体处理装置在长期使用后失效。Wherein, if the micro/nanowire/tube array is designed according to a scheme known in the art, the super-hydrophobic structure and the super-oleophobic structure can be formed, which can not only remove particles in the fluid, but also By self-cleaning action, the blocked particles cannot accumulate in the functional areas of the fluid treatment device (micro/nanowire/tube array surface), avoiding failure of the fluid treatment device after prolonged use.
其中,所述基体301可以具有较大的厚度,使其对前述微/纳米线/管阵列形成较好的支撑,同时还可进一步增强所述流体处理装置的机械强度,使所述流体处理装置耐压、耐弯折、耐碰撞、耐冲击,进而使其可以在多种环境中应用而不致损坏,例如可以应用于对高压、高速流体进行处理,这一功能是现有的多孔膜等无法企及的。Wherein, the base 301 may have a larger thickness to form a better support for the micro/nano wire/tube array, and further enhance the mechanical strength of the fluid processing device, so that the fluid processing device It is resistant to pressure, bending, impact and impact, which makes it suitable for use in a variety of environments without damage. For example, it can be applied to high-pressure, high-speed fluids. This function is impossible for existing porous membranes. Enterprise.
其中,所述流体阻挡部可以是片状的,其厚度等可依据实际应用需求而调整。Wherein, the fluid blocking portion may be in the form of a sheet, and the thickness and the like may be adjusted according to actual application requirements.
其中,所述流体处理装置各部分(301、302、303、304)的材料选择范围是多样的,可以是无机材料,也可以是有机材料,例如金属、非金属无机材料、塑料、陶瓷、半导体、玻璃、聚合物等。当这些部分都选择使用无机材料时,所述流体处理装置还具有耐温度变化的特性,可以处理高温和低温流体。Wherein, the material selection range of each part (301, 302, 303, 304) of the fluid processing device is diverse, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, or a semiconductor. , glass, polymer, etc. When these portions are all selected to use inorganic materials, the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
采用前述设计的所述的流体处理装置可以(超声)清洗,多次使用,且仍旧保持良好的流体处理能力。The fluid treatment device of the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
当利用所述的流体处理装置对流体进行处理时,含有杂质颗粒的流体在进入前述微/纳米线103组成的阵列时,其中粒径大于一定数值的颗粒(或一些与流体不相容的液滴,例如空气中的水滴或油中的水滴)被阻挡在前述微/纳米线/管阵列之外,之后流体经由各微/纳米线/管之间的间隙到达通孔304的入口处后再进入通孔304,实现对流体的净化和/或者对所需颗粒(液滴)的富集回收。When the fluid is treated by the fluid treatment device, the fluid containing the impurity particles enters the array of the micro/nano wires 103, wherein the particles having a particle diameter larger than a certain value (or some fluids incompatible with the fluid) Drops, such as water droplets in the air or water droplets in the oil, are blocked outside of the aforementioned micro/nanowire/tube array, after which the fluid reaches the entrance of the via 304 via the gap between each micro/nano wire/tube. Access to the through holes 304 allows for purification of the fluid and/or enrichment recovery of the desired particles (droplets).
请再次参阅图8所示,在该第三实施例的一些具体应用方案中,前述微/纳米线的直径可以为1nm~50μm,长度(高度)h1可以为50nm~200μm,相邻微/纳米线之间的距离可以为1nm~50μm。所述通孔104的孔径w可以为1μm~1mm。所述基体的厚度h2可以在1μm以上。所述流体阻挡部的厚度h3可以为0.5μm~200μm。Referring to FIG. 8 again, in some specific applications of the third embodiment, the micro/nano wires may have a diameter of 1 nm to 50 μm, and the length (height) h 1 may be 50 nm to 200 μm, adjacent to each other. The distance between the nanowires may be from 1 nm to 50 μm. The through hole 104 may have a diameter w of 1 μm to 1 mm. The thickness h 2 of the substrate may be 1 μm or more. The thickness h 3 of the fluid blocking portion may be from 0.5 μm to 200 μm.
请再次参阅图9a-图9e,前述微/纳米线的横向截面结构可以是规则或不规则形状的,例 如可以是多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等。Referring again to FIGS. 9a-9e, the transverse cross-sectional structure of the aforementioned micro/nano wires may be regular or irregular. Such as a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, and the like.
请再次参阅图10a-图10c,前述微/纳米线可以规则或不规则、均匀或非均匀的分布在所述基体的第一表面上。在一些较为具体的应用方案中,相邻微/纳米线的平均间距在1nm~50μm。Referring again to Figures 10a-10c, the aforementioned micro/nanowires may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate. In some specific applications, the average pitch of adjacent micro/nano wires is between 1 nm and 50 μm.
另外,请参阅图11a-图11c,在该第一实施例中,前述通孔304和流体阻挡部302的形状(特别是横向截面的形状)可以是多样的,例如可以是圆形、正方形、长方形或其它形状。In addition, referring to FIG. 11a - FIG. 11c, in the first embodiment, the shape of the through hole 304 and the fluid blocking portion 302 (especially the shape of the transverse cross section) may be various, for example, may be circular, square, Rectangular or other shape.
请参阅图12所示,较为优选的,在本申请的第四实施例中,一种流体处理装置包括基体401,所述基体401具有第一表面和与该第一表面相背对的和第三表面,且所述基体401上分布有若干作为流体通道的通孔404,所述第一表面上设置有多根竖直微/纳米线/管403形成的阵列,环绕所述通孔404分布的多根微/纳米线/管403的顶部还连接有流体阻挡部402,所述流体阻挡部402设置于所述通孔404的流体入口上方,使待处理的流体无法绕过前述的微/纳米线/管阵列而直接进入所述通孔404。并且,在所述通孔404周围还对称或不对称的分布有一个以上的,例如四根支撑体405,藉由所述支撑体405还可增加对所述流体阻挡部402的支撑,实现流体阻挡部与基体之间更为牢固稳定的配合,并可有效的对分布在流体阻挡部与基体之间的微/纳米线/管阵列形成保护,避免因流体阻挡部和/或基体在受到外力作用后,对前述微/纳米线/管阵列挤压而造成的微/纳米线/管403坍塌、损毁等问题。Referring to FIG. 12, preferably, in a fourth embodiment of the present application, a fluid processing apparatus includes a base 401 having a first surface and a first surface opposite to the first surface a three-surface, and the substrate 401 is provided with a plurality of through holes 404 as fluid passages, and the first surface is provided with an array of a plurality of vertical micro/nano wires/tubes 403 distributed around the through holes 404 The top of the plurality of micro/nano wires/tubes 403 is also connected with a fluid blocking portion 402 disposed above the fluid inlet of the through hole 404, so that the fluid to be treated cannot bypass the aforementioned micro/ The nanowire/tube array directly enters the via 404. Moreover, more than one, for example, four support bodies 405 are distributed symmetrically or asymmetrically around the through hole 404, and the support body 405 can also increase the support of the fluid blocking portion 402 to realize the fluid. The sealing portion and the base body are more firmly and stably matched, and the micro/nano wire/tube array distributed between the fluid blocking portion and the base body can be effectively protected from external forces due to the fluid blocking portion and/or the base body. After the action, the micro/nanowire/tube 403 is collapsed and damaged due to the extrusion of the aforementioned micro/nanowire/tube array.
其中,所述支撑体可以是多种形态的,例如可以具有矩形、梯形、台阶形纵向截面(此处的纵向可理解为垂直于所述基体第一表面的方向)等等,且不限于此。在该第四实施例的一些具体实施方案中,所述支撑体可以为自所述通孔204边缘部向上突出形成的凸台等,其上端连接所述流体阻挡部402。Wherein, the support body may be in various forms, for example, may have a rectangular, trapezoidal, stepped longitudinal section (the longitudinal direction herein may be understood as a direction perpendicular to the first surface of the base body), and the like, and is not limited thereto. . In some embodiments of the fourth embodiment, the support body may be a boss or the like that protrudes upward from an edge portion of the through hole 204, and an upper end thereof is connected to the fluid blocking portion 402.
其中,所述支撑体的数量、直径、分布密度等可根据实际需要而调整,但应尽量少的占用所述基体第一表面的空间,避免其对所述微/纳米线的流体通量造成大的影响。Wherein, the number, diameter, distribution density and the like of the support body can be adjusted according to actual needs, but the space of the first surface of the base body should be occupied as little as possible to avoid the fluid flux to the micro/nano wires. Great impact.
该第四实施例中所采用的基体、微/纳米线/管阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in the fourth embodiment may be the same as or similar to those described above, and thus will not be described herein. .
请参阅图13所示,较为优选的,在本申请的第五实施例中,一种流体处理装置包括基体501,所述基体501具有第一表面和与该第一表面相背对的和第三表面,且所述基体501上分布有若干作为流体通道的通孔504,所述第一表面上设置有多根竖直微/纳米线/管503形成的阵列,环绕所述通孔504分布的多根微/纳米线/管503的顶部还连接有流体阻挡部502,所述流体阻挡部502设置于所述通孔504的流体入口上方,使待处理的流体无法绕过前述的微/纳米线/管阵列而直接进入所述通孔504。并且,在所述通孔504上还架设有一根以上的,例如 对称或不对称排布的多根支撑梁505,藉由所述支撑梁505还可增加对所述流体阻挡部502的支撑,实现流体阻挡部与基体之间更为牢固稳定的配合,并可有效的对分布在流体阻挡部与基体之间的微/纳米线/管阵列形成保护,避免因流体阻挡部和/或基体在受到外力作用后,对前述微/纳米线/管阵列挤压而造成的微/纳米线/管503坍塌、损毁等问题。Referring to FIG. 13, it is preferable that in a fifth embodiment of the present application, a fluid processing apparatus includes a base 501 having a first surface and a first surface opposite to the first surface a three-surface, and the substrate 501 is distributed with a plurality of through holes 504 as fluid passages, and the first surface is provided with an array of a plurality of vertical micro/nano wires/tubes 503 distributed around the through holes 504 The top of the plurality of micro/nano wires/tubes 503 is also connected with a fluid blocking portion 502 disposed above the fluid inlet of the through hole 504, so that the fluid to be treated cannot bypass the aforementioned micro/ The nanowire/tube array directly enters the via 504. Moreover, more than one is placed on the through hole 504, for example A plurality of support beams 505 arranged symmetrically or asymmetrically, the support beam 505 can also increase the support of the fluid blocking portion 502, thereby achieving a more stable and stable cooperation between the fluid blocking portion and the base body, and Effectively protecting the micro/nanowire/tube array distributed between the fluid barrier and the substrate, avoiding the extrusion of the micro/nanowire/tube array by the fluid barrier and/or the substrate after being subjected to an external force The resulting micro/nano wire/tube 503 collapses, is damaged, and the like.
其中,所述支撑梁可以是多种形态的,例如可以拱桥形等,且不限于此。且进一步的,所述支撑梁还可与其它支撑体配合,例如第四实施例中述及的支撑体配合。The support beam may be in various forms, such as an arch bridge shape, etc., and is not limited thereto. Further, the support beam may also cooperate with other support bodies, such as the support body described in the fourth embodiment.
其中,所述支撑梁的数量、尺寸、分布密度等可根据实际需要而调整,但应尽量少的遮挡所述通孔的流体入口,避免其对所述流体处理装置的流体通量造成大的影响。Wherein, the number, size, distribution density and the like of the support beam can be adjusted according to actual needs, but the fluid inlet of the through hole should be blocked as little as possible to avoid causing a large fluid flow to the fluid processing device. influences.
该第五实施例中所采用的基体、微/纳米线/管阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in the fifth embodiment may be the same as or similar to those described above, and thus will not be described herein. .
请参阅图14所示,较为优选的,在本申请的第六实施例中,一种流体处理装置包括基体601,所述基体601具有第一表面6011和与该第一表面相背对的第三表面6012,且所述基体601上分布有若干作为流体通道的通孔604,所述第一表面上设置有多根竖直纳米柱603形成的阵列,环绕所述通孔604分布的多根纳米柱603的顶部还连接有流体阻挡部602,所述流体阻挡部602设置于所述通孔604的流体入口上方,使待处理的流体无法绕过前述的纳米柱阵列而直接进入所述通孔604。并且,在所述纳米柱603表面及所述基体601的第一表面上还设置有光催化材料层605。在以包含光催化材料层605的流体处理装置对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。Referring to FIG. 14, it is preferable that in a sixth embodiment of the present application, a fluid processing apparatus includes a base 601 having a first surface 6011 and a first surface opposite to the first surface. a three-surface 6012, and the base 601 is provided with a plurality of through holes 604 as fluid passages, and the first surface is provided with an array of a plurality of vertical nano-pillars 603, and a plurality of distributed around the through-holes 604 The top of the nano-pillar 603 is also connected with a fluid blocking portion 602 disposed above the fluid inlet of the through-hole 604, so that the fluid to be treated cannot directly bypass the aforementioned array of nano-pillars and directly enter the through-hole. Hole 604. Further, a photocatalytic material layer 605 is further disposed on the surface of the nano-pillar 603 and the first surface of the base 601. When the fluid is treated by the fluid processing device including the photocatalytic material layer 605, if it is supplemented by ultraviolet light or the like, some organic pollutants in the fluid may be photocatalyzed to achieve multiple purification of the fluid.
其中,为利于光线透入,所述流体阻挡部、基体、凸起部中的部分或全部可以由透明材料制成。在本实施例的一些具体实施方案中,所述流体阻挡部可以整体由透明材料制成,例如光线射入。Wherein, in order to facilitate light penetration, part or all of the fluid blocking portion, the base body, and the convex portion may be made of a transparent material. In some embodiments of this embodiment, the fluid barrier may be made entirely of a transparent material, such as light.
其中,较为典型的光催化材料可以是二氧化钛等,但不限于此。Among them, a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
其中,为形成所述光催化材料层605,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。In order to form the photocatalytic material layer 605, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, Atomic layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述光催化材料层605的厚度可以被控制在纳米级,以尽量减少其对所述流体处理装置的流体通量的影响。Wherein, the thickness of the photocatalytic material layer 605 can be controlled at the nanometer level to minimize its influence on the fluid flux of the fluid processing device.
该第六实施例中所采用的基体、微/纳米线/管阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。 The structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in the sixth embodiment may be the same as or similar to those described above, and thus will not be described herein. .
请参阅图15所示,较为优选的,在本申请的第七实施例中,一种流体处理装置包括基体701,所述基体701具有第一表面7011和与该第一表面相背对的第三表7012面,且所述基体701上分布有若干作为流体通道的通孔704,所述第一表面上设置有多根竖直纳米柱703形成的阵列,环绕所述通孔704分布的多根纳米柱703的顶部还连接有流体阻挡部702,所述流体阻挡部702设置于所述通孔704的流体入口上方,使待处理的流体无法绕过前述的纳米柱阵列而直接进入所述通孔704。并且,在所述纳米柱703表面及所述基体701的第一表面上还设置有抗菌材料层705。在以包含抗菌材料层705的流体处理装置对流体进行处理时,可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等,实现对流体的多重净化。Referring to FIG. 15, it is preferable that in a seventh embodiment of the present application, a fluid processing apparatus includes a base 701 having a first surface 7011 and a first surface opposite to the first surface. a three-surface 7012 face, and the base body 701 is provided with a plurality of through holes 704 as fluid passages, and the first surface is provided with an array of a plurality of vertical nano-pillars 703, which are distributed around the through-holes 704 The top of the root nano-pillar 703 is also connected with a fluid blocking portion 702 disposed above the fluid inlet of the through-hole 704, so that the fluid to be treated cannot directly bypass the aforementioned array of nano-pillars and directly enter the Through hole 704. Further, an antibacterial material layer 705 is further disposed on the surface of the nano-pillar 703 and the first surface of the base 701. When the fluid is treated by the fluid processing device including the antimicrobial material layer 705, bacteria, viruses, and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
其中,较为典型的抗菌材料可以是诸如Au、Ag等贵金属等,但不限于此。Among them, the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
其中,为形成所述抗菌材料层705,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the antibacterial material layer 705, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述抗菌材料层705的厚度可以被控制在纳米级,以尽量减少其对所述流体处理装置的流体通量的影响。Wherein, the thickness of the antimicrobial material layer 705 can be controlled at the nanometer level to minimize its effect on the fluid flux of the fluid treatment device.
该第七实施例中所采用的基体、微/纳米线/管阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in the seventh embodiment may be the same as or similar to those described above, and thus will not be described herein. .
本申请的所述流体处理装置可以通过物理、化学方法制备,例如可以是化学生长法、物理加工法等,特别是MEMS(微机电系统,Microelectromechanical Systems)法等。The fluid processing apparatus of the present application can be prepared by physical or chemical methods, and may be, for example, a chemical growth method, a physical processing method, or the like, particularly a MEMS (Micro Electromechanical Systems) method.
例如,请参阅图16所示,在本申请的第八实施例中,一种流体处理装置的制备工艺可以包括如下步骤:For example, referring to FIG. 16, in the eighth embodiment of the present application, a preparation process of a fluid processing apparatus may include the following steps:
S1:在衬底(例如硅片)的一侧表面(定义为第一表面a)上设置图形化的光刻胶掩模;S1: providing a patterned photoresist mask on one side surface (defined as the first surface a) of the substrate (for example, a silicon wafer);
S2:对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的多根垂直纳米线,之后除去所述第一光刻胶掩模;S2: etching a first surface of the substrate to form a plurality of vertical nanowires spaced apart from each other on a first surface of the substrate, and then removing the first photoresist mask;
S3:在所述衬底的第一表面涂布可溶性或可腐蚀的有机物和/或无机物,并使有机物和/或无机物填充各垂直纳米线之间的间隙,形成牺牲层;S3: coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between the vertical nanowires with an organic substance and/or an inorganic substance to form a sacrificial layer;
S4:在所述牺牲层上设置光刻胶,并进行光刻;S4: disposing a photoresist on the sacrificial layer and performing photolithography;
S5:对所述牺牲层进行刻蚀,使分布在所述衬底的第一表面的第二区域中的多根垂直纳米线顶部暴露出,之后除去光刻胶;S5: etching the sacrificial layer to expose a plurality of vertical nanowires distributed in a second region of the first surface of the substrate, and then removing the photoresist;
S6:在所述衬底的第一表面设置光刻胶掩模,并使所述衬底第一表面上的、与所述流体阻挡部相对应的区域暴露出; S6: providing a photoresist mask on the first surface of the substrate, and exposing a region on the first surface of the substrate corresponding to the fluid blocking portion;
S7:在暴露出的、与所述流体阻挡部相对应的区域内沉积形成流体阻挡部;S7: depositing a fluid blocking portion in an exposed region corresponding to the fluid blocking portion;
S8:剥离除去光刻胶;S8: stripping and removing the photoresist;
S9:在所述衬底的第二表面上设置图形化的刻蚀掩模;S9: providing a patterned etch mask on the second surface of the substrate;
S10:对所述衬底的与第一表面相背对的另一侧表面(定义为第三表面b)进行刻蚀,直至露出填充在相邻垂直纳米线之间的牺牲材料,从而在所述衬底的第三表面形成槽孔,所述槽孔所在位置与所述衬底的第一表面的第一区域相对应,所述衬底的第一表面的第二区域环绕所述第一区域设置;S10: etching another side surface (defined as the third surface b) of the substrate opposite to the first surface until the sacrificial material filled between the adjacent vertical nanowires is exposed, thereby a third surface of the substrate forming a slot, the slot being located corresponding to a first area of the first surface of the substrate, the second area of the first surface of the substrate surrounding the first regional settings;
S11:除去所述刻蚀掩模及填充在各垂直纳米线之间的牺牲材料,制得流体处理装置。S11: removing the etching mask and the sacrificial material filled between the vertical nanowires to prepare a fluid processing device.
前述各步骤中采用的刻蚀方法可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,在前述步骤S1中,形成图形化(纳米图形)的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, in the foregoing step S1, the method of forming the patterned (nano-pattern) photoresist mask includes: photolithography technology, nano-spherical mask technology, nano (metal) particle mask technology, etc., and is not limited thereto. .
例如,在前述步骤S2中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等刻蚀出垂直纳米线阵列。For example, in the aforementioned step S2, the vertical nanowire array can be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
例如,在前述步骤S3中,填充的可溶性有机物可以是光刻胶等或可腐蚀无机物如金属、SiO2、氮化硅等。For example, in the foregoing step S3, the filled soluble organic matter may be a photoresist or the like or a corrodible inorganic substance such as metal, SiO 2 , silicon nitride or the like.
例如,在前述步骤S10中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等刻蚀出所述槽孔。For example, in the foregoing step S10, the slots may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
例如,请参阅图17所示,在本申请的第九实施例中,一种流体处理装置的制备工艺可以包括如下步骤:For example, referring to FIG. 17, in the ninth embodiment of the present application, a preparation process of a fluid processing apparatus may include the following steps:
S1:在衬底(例如硅片)的第一表面生长形成彼此间隔设置的多根竖直纳米线/管;S1: growing on a first surface of a substrate (eg, a silicon wafer) to form a plurality of vertical nanowires/tubes spaced apart from each other;
S2:在所述衬底的第一表面涂布可溶性或可腐蚀的有机物和/或无机物,并使有机物和/或无机物填充各竖直纳米线/管之间的间隙,形成牺牲层;S2: coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between each vertical nanowire/tube with an organic substance and/or an inorganic substance to form a sacrificial layer;
S3:在所述牺牲层上设置光刻胶,并进行光刻;S3: disposing a photoresist on the sacrificial layer and performing photolithography;
S4:对所述牺牲层进行刻蚀,使分布在所述衬底的第一表面的第二区域中的多根竖直纳米线顶部暴露出,之后除去光刻胶;S4: etching the sacrificial layer to expose a plurality of vertical nanowires distributed in a second region of the first surface of the substrate, and then removing the photoresist;
S5:在所述衬底的第一表面设置光刻胶掩模,并使所述衬底第一表面上的、与所述流体阻挡部相对应的区域暴露出;S5: providing a photoresist mask on the first surface of the substrate, and exposing a region on the first surface of the substrate corresponding to the fluid blocking portion;
S6:在暴露出的、与所述流体阻挡部相对应的区域内沉积形成流体阻挡部;S6: depositing a fluid blocking portion in an exposed region corresponding to the fluid blocking portion;
S7:剥离除去光刻胶;S7: stripping and removing the photoresist;
S8:在所述衬底的与第一表面相背对的第三表面上设置图形化的刻蚀掩模; S8: providing a patterned etch mask on the third surface of the substrate opposite to the first surface;
S9:对所述衬底的第三表面进行刻蚀,直至露出填充在相邻垂直纳米线之间的牺牲材料,从而在所述衬底的第三表面形成槽孔,所述槽孔所在位置与所述衬底的第一表面的第一区域相对应,所述衬底的第一表面的第二区域环绕所述第一区域设置;S9: etching a third surface of the substrate until a sacrificial material filled between adjacent vertical nanowires is exposed, thereby forming a slot on a third surface of the substrate, where the slot is located Corresponding to the first region of the first surface of the substrate, the second region of the first surface of the substrate is disposed around the first region;
S10:除去所述刻蚀掩模及填充在各垂直纳米线之间的牺牲材料,制得流体处理装置。S10: removing the etching mask and the sacrificial material filled between the vertical nanowires to prepare a fluid processing device.
前述步骤中用以生长形成竖直纳米线/管的方式可以选自MOCVD、PECVD、电化学沉积等业界已知的多种方式。The manner in which the vertical nanowires/tubes are grown to form in the foregoing steps may be selected from a variety of ways known in the art, such as MOCVD, PECVD, electrochemical deposition, and the like.
前述各步骤中采用的刻蚀方法可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,前述步骤中形成图形化(纳米图形)的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, the method of forming a patterned (nano-pattern) photoresist mask in the foregoing steps includes: a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
例如,在前述步骤中可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等对衬底进行刻蚀。For example, the substrate may be etched in the foregoing steps by methods known in the art, such as RIE, ICP, wet etching, electrochemical etching, and the like.
例如,在前述步骤中,填充的可溶性有机物可以是光刻胶等或可腐蚀无机物如金属、SiO2、SiN等。For example, in the foregoing steps, the filled soluble organic matter may be a photoresist or the like or a corrodible inorganic substance such as metal, SiO 2 , SiN or the like.
请参阅图18所示,在本申请的第十实施例中,一种流体处理装置包括基体801,所述基体801具有相背对的第一表面8011和第二表面8012,且所述基体801上的第一区域8013分布有若干作为流体通道的通孔804,所述第一表面的第二区域8014设置有多个微/纳米片803(微米片和/或纳米片)平行排布形成的阵列,环绕所述通孔804分布的多根微/纳米片803的顶部的局部区域与流体阻挡部802连接,所述流体阻挡部802设置于所述通孔804的流体入口上方,使待处理的流体无法绕过前述的微/纳米片阵列而直接进入所述通孔804。Referring to FIG. 18, in a tenth embodiment of the present application, a fluid processing apparatus includes a base 801 having a first surface 8011 and a second surface 8012 opposite to each other, and the base 801 The upper first region 8013 is distributed with a plurality of through holes 804 as fluid passages, and the second region 8014 of the first surface is provided with a plurality of micro/nano sheets 803 (micro sheets and/or nano sheets) arranged in parallel. An array, a partial region of the top of the plurality of micro/nano sheets 803 distributed around the through holes 804 is connected to the fluid blocking portion 802, the fluid blocking portion 802 being disposed above the fluid inlet of the through hole 804 for processing The fluid cannot enter the via 804 directly bypassing the aforementioned array of micro/nanosheets.
其中,因前述微/纳米片微/纳米片具有较薄的厚度,使得这些微/纳米片微/纳米片可密集排布于所述基体的第一表面,通过调整这些微/纳米片的间距,即可形成具有选定尺寸的开口部的沟槽(可以称为微流道),实现对流体中不同粒径范围的颗粒进行清除处理,特别是,当采用的均是纳米片时,通过将这些纳米片之间的间距控制在纳米级,不仅可以去除流体中的极微小的颗粒,而且因纳米片自身厚度极小,还可使其对于流体的阻力被控制在很低的水平,并形成很大的流体通量(特别是纳米片具有较高的高度时),远远优于现有的多孔膜、基于横向流道的流体处理装置等。Wherein, because the micro/nanosheet micro/nanosheet has a relatively thin thickness, the micro/nanosheet micro/nanosheets can be densely arranged on the first surface of the substrate by adjusting the spacing of the micro/nanosheets. , a groove having an opening of a selected size (which may be referred to as a micro flow channel) is formed, and the particles of different particle size ranges in the fluid are removed, in particular, when the nanosheets are used, Controlling the spacing between these nanosheets at the nanometer level not only removes very small particles in the fluid, but also minimizes the thickness of the nanosheet itself, allowing its resistance to fluids to be kept at a very low level, and The formation of a large fluid flux (especially when the nanosheets have a high height) is far superior to existing porous membranes, fluid flow devices based on lateral flow channels, and the like.
其中,所述基体801可以具有较大的厚度,使其对前述微/纳米片阵列形成较好的支撑,同时还可进一步增强所述流体处理装置的机械强度,使所述流体处理装置耐压、耐弯折、耐碰撞、耐冲击,进而使其可以在多种环境中应用而不致损坏,例如可以应用于对高压、高速流体进行处理,这一功能是现有的多孔膜等无法企及的。 Wherein, the base body 801 can have a larger thickness to form a better support for the aforementioned micro/nano-array array, and at the same time further enhance the mechanical strength of the fluid processing apparatus to make the fluid processing apparatus withstand voltage It is resistant to bending, impact and impact, so that it can be applied in a variety of environments without damage. For example, it can be applied to the treatment of high-pressure, high-speed fluids, which is unmatched by existing porous membranes. .
其中,所述流体处理装置各部分(801、802、803、804)的材料选择范围是多样的,可以是无机材料,也可以是有机材料,例如金属、非金属无机材料、塑料、陶瓷、半导体、玻璃、聚合物等。当这些部分都选择使用无机材料时,所述流体处理装置还具有耐温度变化的特性,可以处理高温和低温流体。The material selection range of each part (801, 802, 803, 804) of the fluid processing device is various, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, or a semiconductor. , glass, polymer, etc. When these portions are all selected to use inorganic materials, the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
其中,所述流体阻挡部可以是片状的,其厚度等可依据实际应用需求而调整。Wherein, the fluid blocking portion may be in the form of a sheet, and the thickness and the like may be adjusted according to actual application requirements.
进一步的,在本实施例中,于通孔周围还可对称或不对称的设置一个以上的支撑体,藉由所述支撑体还可增加对所述流体阻挡部的支撑,实现流体阻挡部与基体之间更为牢固稳定的配合,并可有效的对分布在流体阻挡部与基体之间的微/纳米片阵列形成保护,避免因流体阻挡部和/或基体在受到外力作用后,对前述微/纳米片阵列挤压而造成的微/纳米片坍塌、损毁等问题。Further, in this embodiment, more than one support body may be symmetrically or asymmetrically disposed around the through hole, and the support body may further increase the support of the fluid blocking portion to realize the fluid blocking portion and A more stable and stable fit between the substrates, and an effective protection of the micro/nano-array array distributed between the fluid blocking portion and the substrate, avoiding the aforementioned action of the fluid blocking portion and/or the substrate after being subjected to an external force Micro/nano-sheet collapse and damage caused by micro/nano-slice array extrusion.
其中,所述支撑体可以是多种形态的,例如可以具有矩形、梯形、台阶形截面等等,且不限于此。在该第一实施例的一些具体实施方案中,所述支撑体可以为自所述通孔边缘部向上突出形成的凸台等,其上端顶撑连接所述流体阻挡部。Wherein, the support body may be in various forms, for example, may have a rectangular shape, a trapezoidal shape, a stepped cross section, or the like, and is not limited thereto. In some embodiments of the first embodiment, the support body may be a boss or the like that protrudes upward from an edge portion of the through hole, and an upper end of the support portion is connected to the fluid blocking portion.
其中,所述支撑体的数量、直径、分布密度等可根据实际需要而调整,但应尽量少的占用所述基体第一表面的空间,避免其对所述微/纳米片阵列的流体通量造成大的影响。Wherein, the number, diameter, distribution density and the like of the support body can be adjusted according to actual needs, but the space of the first surface of the base body should be occupied as little as possible, and the fluid flux to the micro/nano piece array should be avoided. Cause a big impact.
采用前述设计的流体处理装置可以(超声)清洗,多次使用,且仍旧保持良好的流体处理能力。The fluid handling device of the foregoing design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
当利用所述的流体处理装置对流体进行处理时,含有杂质颗粒的流体在进入前述微/纳米片阵列时,其中粒径大于一定数值的颗粒(或一些与流体不相容的液滴,例如空气中的水滴或油中的水滴)被阻挡在前述微/纳米片阵列之外,之后流体经由各微/纳米片之间的沟槽到达通孔804的入口处后再进入通孔804,实现对流体的净化和/或者对所需颗粒(液滴)的富集回收。When the fluid is treated with the fluid processing device, the fluid containing the foreign particles enters the micro/nano-array array, wherein the particles having a particle size larger than a certain value (or some liquid-incompatible droplets, for example) Water droplets in the air or water droplets in the oil are blocked outside the array of micro/nanosheets, after which the fluid reaches the entrance of the via 804 via the trench between the micro/nanosheets and then enters the via 804. Purification of fluids and/or enrichment recovery of desired particles (droplets).
请再次参阅图18-图19所示,在该第十实施例的一些具体应用方案中,前述微/纳米片的厚度可以为1nm~50μm,高度可以为50nm~200μm,相邻微/纳米片之间的沟槽宽度可以为1nm~50μm。所述通孔104的孔径可以为1μm~1mm。所述基体的厚度可以在1μm以上。所述流体阻挡部的厚度可以为0.5μm~200μm。Referring to FIG. 18 to FIG. 19 again, in some specific applications of the tenth embodiment, the micro/nano piece may have a thickness of 1 nm to 50 μm, a height of 50 nm to 200 μm, and adjacent micro/nano pieces. The groove width between the electrodes may be from 1 nm to 50 μm. The through hole 104 may have a diameter of 1 μm to 1 mm. The thickness of the substrate may be 1 μm or more. The fluid blocking portion may have a thickness of 0.5 μm to 200 μm.
形成于相邻微/纳米片之前的沟槽的截面可以是规则或不规则形状的,例如可以是多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等。The cross section of the trench formed before the adjacent micro/nanosheets may be regular or irregular, such as polygonal (triangle, quadrilateral or other), circular, elliptical, star, and the like.
前述微/纳米片可以规则或不规则、均匀或非均匀的分布在所述基体的第一表面上。The aforementioned micro/nanosheets may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate.
另外,在该第十实施例中,前述通孔804和流体阻挡部802的形状(特别是纵向或横向 截面的形状)可以是多样的,例如可以是圆形、正方形、长方形或其它形状。Further, in the tenth embodiment, the shape of the aforementioned through hole 804 and the fluid blocking portion 802 (especially longitudinal or lateral) The shape of the cross section may be varied, for example, may be circular, square, rectangular or other shapes.
请参阅图20所示,较为优选的,在本申请的第十一实施例中,一种流体处理装置包括基体901,所述基体901具有相背对的第一表面和第二表面,且所述基体901上分布有若干作为流体通道的通孔904,所述第一表面上设置有多片沿横向连续延伸的微/纳米片903形成的阵列,其中微/纳米片之间形成有可供流体通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,其中,有多个微/纳米片直接从所述通孔904上通过,从而使这些微/纳米片与基体之间配合形成与通孔904连通的流体通道,且待处理的流体仅能通过该流体通道进入通孔904。Referring to FIG. 20, more preferably, in an eleventh embodiment of the present application, a fluid processing apparatus includes a base 901 having opposite first and second surfaces, and The substrate 901 is provided with a plurality of through holes 904 as fluid passages, and the first surface is provided with a plurality of arrays of micro/nano sheets 903 extending continuously in the lateral direction, wherein micro/nano sheets are formed between a groove through which the fluid passes, the opening of the groove having a diameter greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, wherein a plurality of micro/nano sheets are directly from the through hole 904 The upper passage is such that the micro/nanosheets cooperate with the substrate to form a fluid passage communicating with the through hole 904, and the fluid to be treated can only enter the through hole 904 through the fluid passage.
进一步的,在该实施例中,还可于微/纳米片阵列上连接流体阻挡部202,所述流体阻挡部902设置于所述通孔904的流体入口上方,使待处理的流体无法绕过前述的微/纳米片阵列而直接进入所述通孔904。Further, in this embodiment, the fluid blocking portion 202 can also be connected to the micro/nano array, and the fluid blocking portion 902 is disposed above the fluid inlet of the through hole 904, so that the fluid to be processed cannot be bypassed. The aforementioned micro/nanochip array directly enters the through hole 904.
进一步的,在通孔904周围也可设置一个或若干支撑体。Further, one or several supports may also be disposed around the through holes 904.
该第二实施例中所采用的基体、微/纳米片阵列、流体阻挡部、通孔、支撑体等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structure, arrangement form, material, and the like of the substrate, the micro/nano-sheet array, the fluid blocking portion, the through-hole, the support, and the like used in the second embodiment may be the same as or similar to those described above, and thus are no longer here. Narration.
在本申请的第十一实施例中,所述流体处理装置可具有与第十实施例相类似的结构,不同之处在于,在通孔上还可架设有一根以上的,例如对称或不对称排布的多根支撑梁,藉由所述支撑梁还可增加对所述流体阻挡部的支撑,实现流体阻挡部与基体之间更为牢固稳定的配合,并可有效的对分布在流体阻挡部与基体之间的微/纳米片阵列形成保护,避免因流体阻挡部和/或基体在受到外力作用后,对前述微/纳米线阵列挤压而造成的微/纳米片坍塌、损毁等问题。In an eleventh embodiment of the present application, the fluid processing apparatus may have a structure similar to that of the tenth embodiment, except that more than one, for example, symmetrical or asymmetrical, may be placed on the through hole. The plurality of support beams arranged by the support beam can also increase the support of the fluid blocking portion, thereby achieving a firmer and stable cooperation between the fluid blocking portion and the base body, and effectively distributing the fluid barrier The micro/nano-sheet array between the portion and the substrate forms protection to avoid problems such as collapse/damage of the micro/nanosheet caused by the extrusion of the micro/nanowire array after the fluid blocking portion and/or the substrate are subjected to an external force. .
其中,所述支撑梁可以是多种形态的,例如可以拱桥形等,且不限于此。且进一步的,所述支撑梁还可与其它支撑体配合,例如第一实施例中述及的支撑体配合。The support beam may be in various forms, such as an arch bridge shape, etc., and is not limited thereto. Further, the support beam may also cooperate with other support bodies, such as the support body described in the first embodiment.
其中,所述支撑梁的数量、尺寸、分布密度等可根据实际需要而调整,但应尽量少的遮挡所述通孔的流体入口,避免其对所述流体处理装置的流体通量造成大的影响。Wherein, the number, size, distribution density and the like of the support beam can be adjusted according to actual needs, but the fluid inlet of the through hole should be blocked as little as possible to avoid causing a large fluid flow to the fluid processing device. influences.
该第十一实施例中所采用的基体、微/纳米线阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in the eleventh embodiment may be the same as or similar to those described above, and thus will not be described herein.
请参阅图21所示,在本申请的第十二实施例中,一种流体处理装置可以具有与第十、第十一实施例中任一者相似的结构,不同之处在于:在纳米片1103表面及基体1101的第一表面上还设置有光催化材料层1105。在以包含光催化材料层1105的流体处理装置对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流 体的多重净化。Referring to FIG. 21, in a twelfth embodiment of the present application, a fluid processing apparatus may have a structure similar to any of the tenth and eleventh embodiments, except that: in the nanosheet A photocatalytic material layer 1105 is further disposed on the first surface of the 1103 surface and the substrate 1101. When the fluid is treated by the fluid processing device including the photocatalytic material layer 1105, if it is supplemented by ultraviolet light, etc., some organic pollutants in the fluid may be photocatalyzed and decomposed to achieve convection. Multiple purification of the body.
其中,为利于光线透入,所述流体阻挡部1102、基体、凸起部中的部分或全部可以由透明材料制成。在本实施例的一些具体实施方案中,所述流体阻挡部可以整体由透明材料制成,例如光线射入。Wherein, in order to facilitate light penetration, part or all of the fluid blocking portion 1102, the base body, and the convex portion may be made of a transparent material. In some embodiments of this embodiment, the fluid barrier may be made entirely of a transparent material, such as light.
其中,较为典型的光催化材料可以是二氧化钛等,但不限于此。Among them, a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
其中,为形成所述光催化材料层1105,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。In order to form the photocatalytic material layer 1105, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, Atomic layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述光催化材料层1105的厚度可以被控制在纳米级,以尽量减少其对所述流体处理装置的流体通量的影响。Wherein, the thickness of the photocatalytic material layer 1105 can be controlled at the nanometer level to minimize its influence on the fluid flux of the fluid processing device.
该第三实施例中所采用的基体、微/纳米线阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in the third embodiment may be the same as or similar to those described above, and thus will not be described herein.
请参阅图22所示,较为优选的,在本申请的第十三实施例中,一种流体处理装置可以具有与第十、第十一、第十二实施例中任一者相似的结构,不同之处在于:在纳米片1203表面及基体1201的第一表面上还设置有抗菌材料层1205。在以包含抗菌材料层1205的流体处理装置对流体进行处理时,可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等,实现对流体的多重净化。Referring to FIG. 22, it is preferable that in the thirteenth embodiment of the present application, a fluid processing apparatus may have a structure similar to any of the tenth, eleventh, and twelfth embodiments. The difference is that an antibacterial material layer 1205 is further disposed on the surface of the nanosheet 1203 and the first surface of the substrate 1201. When the fluid is treated by the fluid treatment device including the antimicrobial material layer 1205, bacteria, viruses, and the like in the fluid can be synchronously killed during the treatment of the fluid to achieve multiple purification of the fluid.
其中,较为典型的抗菌材料可以是诸如Au、Ag等贵金属等,但不限于此。Among them, the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
其中,为形成所述抗菌材料层1205,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the antibacterial material layer 1205, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述抗菌材料层405的厚度可以被控制在纳米级,以尽量减少其对所述流体处理装置的流体通量的影响。Wherein, the thickness of the antimicrobial material layer 405 can be controlled at the nanometer level to minimize its effect on the fluid flux of the fluid treatment device.
该第十三实施例中所采用的基体、微/纳米线阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in the thirteenth embodiment may be the same as or similar to those described above, and thus will not be described herein.
本申请的所述流体处理装置可以通过物理、化学方法制备,例如可以是化学生长法、物理加工法等,特别是MEMS(微机电系统,Microelectromechanical Systems)法等。The fluid processing apparatus of the present application can be prepared by physical or chemical methods, and may be, for example, a chemical growth method, a physical processing method, or the like, particularly a MEMS (Micro Electromechanical Systems) method.
在本申请的一优选实施例的流体处理装置的制备工艺可以包括如下步骤:The preparation process of the fluid processing apparatus in a preferred embodiment of the present application may include the following steps:
S1:在衬底(例如硅片)的一侧表面(命名为第一表面)上设置图形化的光刻胶掩模;S1: providing a patterned photoresist mask on one side surface (designated as the first surface) of the substrate (for example, a silicon wafer);
S2:对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的 多个沿横向延伸的垂直纳米片,之后除去所述第一光刻胶掩模;S2: etching the first surface of the substrate to form spaced apart from each other on the first surface of the substrate a plurality of vertical nanosheets extending in a lateral direction, after which the first photoresist mask is removed;
S3:在所述衬底的第一表面涂布可溶性或可腐蚀的有机物和/或无机物,并使有机物和/或无机物填充各垂直纳米片之间的沟槽,形成牺牲层;S3: coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the groove between the vertical nanosheets with an organic substance and/or an inorganic substance to form a sacrificial layer;
S4:在所述牺牲层上设置光刻胶,并进行光刻;S4: disposing a photoresist on the sacrificial layer and performing photolithography;
S5:对所述牺牲层进行刻蚀,使分布在所述衬底的第一表面的第二区域中的多根垂直纳米片顶部暴露出,之后除去光刻胶;S5: etching the sacrificial layer to expose a plurality of vertical nanosheets distributed in a second region of the first surface of the substrate, and then removing the photoresist;
S6:在所述衬底的第一表面设置光刻胶掩模,并使所述衬底第一表面上的、与所述流体阻挡部相对应的区域暴露出;S6: providing a photoresist mask on the first surface of the substrate, and exposing a region on the first surface of the substrate corresponding to the fluid blocking portion;
S7:在暴露出的、与所述流体阻挡部相对应的区域内沉积形成流体阻挡部,再剥离除去光刻胶;S7: depositing a fluid blocking portion in the exposed region corresponding to the fluid blocking portion, and stripping and removing the photoresist;
S8:在所述衬底的与第一表面相背对的另一侧表面(命名为第三表面)上设置图形化的刻蚀掩模,再对所述衬底的该另一侧表面进行刻蚀,直至露出填充在相邻垂直纳米片之间的牺牲材料,从而在所述衬底的该另一侧表面形成槽孔,所述槽孔所在位置与所述衬底的第一表面的第一区域相对应,所述衬底的第一表面的第二区域环绕所述第一区域设置;S8: providing a patterned etch mask on the other side surface of the substrate opposite to the first surface (designated as the third surface), and then performing the other side surface of the substrate Etching until a sacrificial material filled between adjacent vertical nanosheets is exposed, thereby forming a slot in the other side surface of the substrate, the slot being located at a position opposite to the first surface of the substrate Corresponding to the first region, a second region of the first surface of the substrate is disposed around the first region;
S9:除去所述刻蚀掩模及填充在各垂直纳米片之间的牺牲材料,制得流体处理装置。S9: removing the etching mask and the sacrificial material filled between the vertical nanosheets to prepare a fluid processing device.
前述各步骤中采用的刻蚀方法可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,在前述步骤S1中,形成图形化(纳米图形)的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, in the foregoing step S1, the method of forming the patterned (nano-pattern) photoresist mask includes: photolithography technology, nano-spherical mask technology, nano (metal) particle mask technology, etc., and is not limited thereto. .
例如,在前述步骤S2中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等刻蚀出垂直纳米片阵列。For example, in the foregoing step S2, the vertical nanochip array can be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
例如,在前述步骤S3中,填充的可溶性有机物可以是光刻胶等或可腐蚀无机物如金属、SiO2、SiN等。For example, in the foregoing step S3, the filled soluble organic matter may be a photoresist or the like or a corrosive inorganic substance such as metal, SiO 2 , SiN or the like.
例如,在前述步骤S8中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等刻蚀出所述槽孔。For example, in the foregoing step S8, the slots may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
请参阅图23所示,在本申请的第十四实施例中,一种流体处理装置主要用以对混杂有选定颗粒的流体进行处理,其包括基体1300,所述基体1300具有相背对的第一表面1301和第二表面1302,且所述基体1300上分布有若干作为流体通道的通孔1303。在任一通孔1303内分布有若干微/纳米线/管1400(即微米线、微米管、纳米线、纳米管中的任一种或多种),尤其是纳米线/管(纳米线和/或纳米管)。所述微/纳米线/管1400一端固定于所述通孔1303的孔壁上,另一端沿所述通孔的径向延伸。这些微/纳米线/管1400以相互交叉的形式聚集成为多 孔结构。所述多孔结构内孔洞的直径大于0但小于所述选定颗粒的粒径。Referring to FIG. 23, in a fourteenth embodiment of the present application, a fluid processing apparatus is mainly used for processing a fluid mixed with selected particles, and includes a base 1300 having opposite pairs. The first surface 1301 and the second surface 1302, and the base 1300 is distributed with a plurality of through holes 1303 as fluid passages. A plurality of micro/nano wires/tubes 1400 (ie, any one or more of microwires, microtubes, nanowires, nanotubes), in particular nanowires/tubes (nanowires and/or), are distributed within any of the vias 1303 nanotube). One end of the micro/nano wire/tube 1400 is fixed to the hole wall of the through hole 1303, and the other end extends in the radial direction of the through hole. These micro/nano wires/tubes 1400 are gathered in a mutual intersection to become more Hole structure. The pores within the porous structure have a diameter greater than zero but less than the particle size of the selected particles.
再请参阅图24,在本申请的第十五实施例中,所述多孔结构以俯视的视角观察为分布于所述通孔1303内的网格结构。Referring to FIG. 24 again, in the fifteenth embodiment of the present application, the porous structure is a grid structure distributed in the through hole 1303 as viewed from a plan view.
其中,因前述微/纳米线/管1400具有较大的高径比(或者长径比),使得这些微/纳米线/管1400可密集排布于所述通孔内,而通过调整这些微/纳米线/管1400的分布密度、长度等,即可对流体1500中不同粒径范围的颗粒进行清除处理,特别是,当采用的均是纳米线/管时,通过将这些纳米线/管交叉形成的孔洞孔径控制在纳米级,不仅可以去除流体中的极微小的颗粒,而且因纳米线/管自身直径极小,还可使其对于流体的阻力被控制在很低的水平,并形成很大的流体通量,远远优于现有的多孔膜、基于横向流道的流体处理装置等。Wherein, since the micro/nano wires/tubes 1400 have a large aspect ratio (or aspect ratio), the micro/nano wires/tubes 1400 can be densely arranged in the through holes, and by adjusting the micro The distribution density, length, etc. of the nanowire/tube 1400 can be used to remove particles of different particle size ranges in the fluid 1500, in particular, when the nanowires/tubes are used, by using these nanowires/tubes The pores formed by the cross-section are controlled at the nanometer level, which not only removes very small particles in the fluid, but also minimizes the diameter of the nanowire/tube itself, and also controls the resistance to fluid at a very low level. The large fluid flux is far superior to existing porous membranes, fluid handling devices based on lateral flow channels, and the like.
其中,所述基体1300可以具有较大的厚度,籍以进一步增强所述流体处理装置的机械强度,使所述流体处理装置耐压、耐弯折、耐碰撞、耐冲击,进而使其可以在多种环境中应用而不致损坏,例如可以应用于对高压、高速流体进行处理,这一功能是现有的多孔膜等无法企及的。Wherein, the base body 1300 can have a relatively large thickness, thereby further enhancing the mechanical strength of the fluid processing device, so that the fluid processing device can withstand pressure, bend, impact, and impact, thereby enabling It can be applied in a variety of environments without damage, for example, it can be applied to the treatment of high-pressure, high-speed fluids, which is unmatched by existing porous membranes.
特别是,因所述的微/纳米线/管1400均分布于所述通孔1303内,使得这些微/纳米线/管1400实际上受到基体1300的保护,进而,即使所述流体处理装置受到压力等,也不会使这些微/纳米线/管1400被损坏。In particular, since the micro/nano wires/tubes 1400 are all distributed within the through holes 1303, the micro/nano wires/tubes 1400 are actually protected by the substrate 1300, and further, even if the fluid processing device is subjected to Pressure, etc., will not damage these micro/nano wires/tubes 1400.
其中,所述流体处理装置各部分(1301、1302、1303)的材料选择范围是多样的,可以是无机材料,也可以是有机材料,例如可以是金属、陶瓷、聚合物,等等。当这些部分都选择使用无机材料时,所述流体处理装置还具有耐温度变化的特性,可以处理高温和低温流体。Wherein, the material selection range of each part (1301, 1302, 1303) of the fluid processing device is various, and may be an inorganic material or an organic material, for example, a metal, a ceramic, a polymer, or the like. When these portions are all selected to use inorganic materials, the fluid treatment device also has temperature-resistant characteristics that can handle high temperature and low temperature fluids.
采用前述设计的流体处理装置可以(超声)清洗,多次使用,且仍旧保持良好的流体处理能力。The fluid handling device of the foregoing design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
当利用所述的流体处理装置对流体进行处理时,含有杂质颗粒的流体在进入前述多孔结构时,其中粒径大于一定数值的颗粒(或一些与流体不相容的液滴,例如空气中的水滴或油中的水滴)被阻挡在前述多孔结构之外,之后流体从通孔1303中流出,实现对流体的净化和/或者对所需颗粒(液滴)的富集回收。When the fluid is treated by the fluid processing device, the fluid containing the foreign particles enters the porous structure, wherein the particles having a particle diameter larger than a certain value (or some liquid incompatible with the fluid, such as in air) Water droplets or water droplets in the oil are blocked outside of the aforementioned porous structure, after which the fluid flows out of the through hole 1303 to effect purification of the fluid and/or enrichment recovery of the desired particles (droplets).
在该实施例的一些具体应用方案中,前述微/纳米线/管1400的直径可以为1nm~500μm。In some specific applications of this embodiment, the micro/nanowire/tube 1400 may have a diameter of 1 nm to 500 μm.
在该实施例的一些具体应用方案中,前述通孔1303的孔径可以为1μm~1mm。In some specific applications of the embodiment, the through hole 1303 may have a diameter of 1 μm to 1 mm.
在该实施例的一些具体应用方案中,前述基体的厚度可以在1μm以上。In some specific applications of this embodiment, the thickness of the aforementioned substrate may be 1 μm or more.
前述纳米线的横向截面结构可以是规则或不规则形状的,例如可以是多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等。 The transverse cross-sectional structure of the aforementioned nanowires may be regular or irregular, and may be, for example, a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, or the like.
前述微/纳米线/管1400可以规则或不规则、均匀或非均匀的分布在所述通孔1303内。The aforementioned micro/nano wires/tubes 1400 may be distributed within the through holes 1303 regularly or irregularly, uniformly or non-uniformly.
前述的微/纳米线/管1400可以优选自碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线等,且不限于此。The aforementioned micro/nanowire/tube 1400 may preferably be selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
前述微/纳米线/管1400可以通过外界转移、原位生长(例如化学生长、电化学生长)或沉积(例如物理、化学气相沉积,电沉积)等方式于所述通孔1303内壁上原位生长形成。The aforementioned micro/nanowire/tube 1400 may be in situ on the inner wall of the through hole 1303 by external transfer, in-situ growth (for example, chemical growth, electrochemical growth) or deposition (for example, physical, chemical vapor deposition, electrodeposition) or the like. Growth formation.
前述通孔1303的形状(特别是横向截面的形状)可以是多样的,例如可以是圆形、正方形、长方形、菱形、多边形或其它规则或不规则形状。The shape of the aforementioned through hole 1303 (particularly the shape of the transverse cross section) may be various, and may be, for example, a circle, a square, a rectangle, a diamond, a polygon, or other regular or irregular shape.
在该实施例的一些具体应用方案中,前述微/纳米线/管1400可以由光催化材料或具有抗菌、杀菌功能的材料形成,或者,前述微/纳米线/管1400也可以是表面覆盖有光催化材料或具有杀菌、抗菌功能的材料形成的涂层。In some specific applications of the embodiment, the micro/nanowire/tube 1400 may be formed of a photocatalytic material or a material having an antibacterial or bactericidal function, or the micro/nanowire/tube 1400 may also be covered with a surface. A coating formed of a photocatalytic material or a material having a bactericidal or antibacterial function.
例如,前述微/纳米线/管1400可采用ZnO纳米线、GaN纳米线、TiO2纳米线等具有光催化的性质的纳米线,在光辅助照射下,能够降解流体中的有机物。For example, the micro/nanowire/tube 1400 may employ nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO2 nanowires, and can degrade organic substances in the fluid under light-assisted illumination.
例如,前述微/纳米线/管1400可采用Ag纳米线、Au纳米线等,以杀灭流体中的细菌、病毒、微生物。For example, the aforementioned micro/nanowire/tube 1400 may employ Ag nanowires, Au nanowires, or the like to kill bacteria, viruses, and microorganisms in the fluid.
在该实施例的一些具体应用方案中,所述基体1300的表面,特别是其第一表面1301上还可设置有光催化材料层或抗菌材料层等。In some specific applications of the embodiment, the surface of the substrate 1300, particularly the first surface 1301 thereof, may also be provided with a layer of photocatalytic material or a layer of antibacterial material or the like.
在以包含光催化材料层的流体处理装置对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。When the fluid is treated by a fluid processing device including a photocatalytic material layer, if it is supplemented with ultraviolet light or the like, photocatalytic degradation of some organic pollutants in the fluid may be performed to achieve multiple purification of the fluid.
其中,为利于光线透入,所述流体处理装置中的的部分组件或全部全部均可以由透明材料制成。Wherein, in order to facilitate light penetration, some or all of the components of the fluid processing apparatus may be made of a transparent material.
其中,较为典型的光催化材料可以是二氧化钛等,但不限于此。Among them, a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
其中,为形成所述光催化材料层,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述光催化材料层的厚度可以被控制在纳米级,以尽量减少其对所述流体处理装置的流体通量的影响。Wherein, the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the fluid processing device.
而在以包含抗菌材料层的流体处理装置对流体进行处理时,可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等,实现对流体的多重净化。When the fluid is treated by the fluid processing device including the antibacterial material layer, bacteria, viruses, and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
其中,较为典型的抗菌材料可以是诸如Au、Ag等贵金属等,但不限于此。Among them, the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
其中,为形成所述抗菌材料层,本领域技术人员可以采用业界已知的多种方式,例如涂 布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the antibacterial material layer, those skilled in the art may adopt various methods known in the art, such as coating Cloth (spin coating, spray coating, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer deposition, etc.), sputtering, and the like, and is not limited thereto.
其中,所述抗菌材料层的厚度可以被控制在纳米级,以尽量减少其对所述流体处理装置的流体通量的影响。Wherein, the thickness of the antimicrobial material layer can be controlled at the nanometer level to minimize its effect on the fluid flux of the fluid treatment device.
作为该实施例的优选实施方案之一,也可以在所述基体的第一表面设置彼此间隔的多根竖立纳米线,这些纳米线可环绕作为流体通道的前述通孔设置。As one of the preferred embodiments of this embodiment, a plurality of erected nanowires spaced apart from each other may be disposed on the first surface of the substrate, and the nanowires may be disposed around the aforementioned through holes as fluid passages.
较为优选的,这些竖立纳米线的长径比为4:1~200000:1,相邻竖立纳米线之间的距离与所述竖立纳米线的长度的比值为1:4~1:200000。More preferably, the aspect ratio of the upright nanowires is 4:1 to 200000:1, and the ratio of the distance between adjacent vertical nanowires to the length of the vertical nanowires is 1:4 to 1:200,000.
通过采用这种结构和分布形态的竖立纳米线,可以使多个竖立纳米线可密集布置(凸起部自身在单位面积内所占比例少),利于对流体中的微小颗粒进行处理,同时还赋予所述流体处理装置较大的流体通量(竖立纳米线之间的孔隙较之竖立纳米线自身体积更大)。By adopting such a structure and a distributed shape of the erected nanowires, a plurality of erected nanowires can be densely arranged (the proportion of the bulge itself in a unit area is small), which facilitates processing of minute particles in the fluid while also The fluid handling device is given a greater fluid flux (the pores between the erected nanowires are larger than the erected nanowires themselves).
较为优选的,所述竖立纳米线可具有与前述微/纳米线/管1400相同的材质、尺寸、结构等。More preferably, the upright nanowires may have the same material, size, structure, etc. as the micro/nano wires/tubes 1400 described above.
特别是,若参考业界已知的方案,将前述的竖立纳米线的排布密度等进行合适的设计,使之形成纳米线阵列,还可使之形成超疏水结构、超疏油结构,不仅可以清除流体中的颗粒,且还可通过自清洁作用,使被阻挡的颗粒无法在所述流体处理装置表面积聚。In particular, if referring to a solution known in the art, the arrangement density of the above-mentioned erected nanowires and the like are appropriately designed to form a nanowire array, and a superhydrophobic structure and a super oleophobic structure can be formed. The particles in the fluid are removed and the blocked particles are also unable to accumulate on the surface of the fluid treatment device by self-cleaning.
其中,因所述基体可以具有较大的厚度,使得前述竖立纳米线可获得较好的支撑。Wherein, since the substrate can have a large thickness, the aforementioned erected nanowires can obtain better support.
作为该实施例的优选实施方案之一,还可在前述的这些竖立纳米线上设置流体阻挡部,该流体阻挡部可具有与所述基体的第一表面相对设置的表面(可命名其为第三表面),并且所述复数根竖立线形体一端固定设置于所述基体的第一表面,另一端与所述流体阻挡部的第三表面固定连接,其中相邻竖立线形体之间的距离大于0但小于所述选定颗粒的粒径。As one of the preferred embodiments of the embodiment, a fluid blocking portion may be further disposed on the aforementioned upright nanowires, and the fluid blocking portion may have a surface disposed opposite to the first surface of the base body (may be named as the first a three-surface), and one end of the plurality of upright linear bodies is fixedly disposed on the first surface of the base body, and the other end is fixedly connected to the third surface of the fluid blocking portion, wherein a distance between adjacent vertical linear bodies is greater than 0 but less than the particle size of the selected particles.
其中,所述流体阻挡部可以是多种形态的,例如可以为片状、薄壳状、矩形体状、多面体状等。The fluid blocking portion may have various forms, and may be, for example, a sheet shape, a thin shell shape, a rectangular shape, a polyhedral shape, or the like.
优选的,前述的这些竖立纳米线、流体阻挡部与基体之间配合形成一流体通道,待处理的流体仅可经由该流体通道进入分布于所述基体的第一表面的流体通道(通孔1303)的流体入口,实现对流体的第一次处理,之后再进入分布于基体上的流体通道内,并由前述微/纳米线/管1400的聚集体进行第二次处理,如此可以实现对流体的多重处理。Preferably, the foregoing erected nanowires, the fluid blocking portion and the base body cooperate to form a fluid passage through which the fluid to be treated can only enter the fluid passage distributed on the first surface of the base body (through hole 1303). The fluid inlet, the first treatment of the fluid, and then into the fluid channel distributed on the substrate, and the second treatment of the agglomerates of the micro/nano wires/tubes 1400, so that the fluid can be realized Multiple processing.
其中,通过对前述的这些竖立纳米线的间距进行一定的设计,使之与前述微/纳米线/管1400交叉形成的孔洞的孔径不同,特别是使对所述竖立纳米线之间的间距大于所述微/纳米线/管1400交叉形成的孔洞的孔径,还可实现对流体中不同大小颗粒的分级处理。 Wherein, by spacing the spacing of the erected nanowires described above, the apertures formed by the intersection of the micro/nano wires/tubes 1400 are different, in particular, the spacing between the erected nanowires is greater than The pore size of the pores formed by the intersection of the micro/nanowire/tube 1400 can also achieve grading treatment of particles of different sizes in the fluid.
其中,所述流体阻挡部的设置形式亦可以为多样的,例如,其可以整体与所述基体间隔设置,亦可局部与所述基体连接,甚至在某些情况下,亦可是与所述基体被一体加工形成。The arrangement of the fluid blocking portion may also be various, for example, it may be integrally spaced from the substrate, or may be partially connected to the substrate, and in some cases, may be associated with the substrate. It is formed by integral processing.
其中,所述流体通道(通孔1303)的流体入口及多根竖立纳米线可分布在所述流体阻挡部于所述基体的第一表面的正投影内。Wherein, the fluid inlet of the fluid channel (through hole 1303) and the plurality of upright nanowires may be distributed within an orthographic projection of the fluid blocking portion on the first surface of the substrate.
前述流体阻挡部的形状可以是多样的,例如可以是圆形、正方形、长方形或其它形状。The shape of the aforementioned fluid blocking portion may be varied, and may be, for example, a circle, a square, a rectangle, or the like.
前述流体阻挡部的材质可以选自金属、非金属、有机材料、无机材料等,例如硅片、聚合物、陶瓷等,且不限于此。The material of the fluid blocking portion may be selected from a metal, a non-metal, an organic material, an inorganic material, or the like, such as a silicon wafer, a polymer, a ceramic, or the like, and is not limited thereto.
较为优选的,前述流体阻挡部表面亦可分布有前述光催化材料、杀菌材料等,或者,前述流体阻挡部表面亦可整体由前述光催化材料、杀菌材料等组成。Preferably, the surface of the fluid blocking portion may be distributed with the photocatalytic material, the sterilizing material, or the like, or the surface of the fluid blocking portion may be entirely composed of the photocatalytic material, the sterilizing material, or the like.
较为优选的,前述流体阻挡部亦可以具有局部透明结构,或整体是透明的,以例如光线射入。More preferably, the fluid blocking portion may have a partially transparent structure or be transparent as a whole, for example, by light.
本申请的所述流体处理装置可以通过物理、化学方法制备,例如可以是化学生长法、物理加工法等,特别是MEMS(微机电系统,Microelectromechanical Systems)法等。The fluid processing apparatus of the present application can be prepared by physical or chemical methods, and may be, for example, a chemical growth method, a physical processing method, or the like, particularly a MEMS (Micro Electromechanical Systems) method.
例如,请参阅图25所示,在本申请的第十六实施例中,一种流体处理装置的制备工艺可以包括如下步骤:For example, referring to FIG. 25, in the sixteenth embodiment of the present application, a preparation process of a fluid processing apparatus may include the following steps:
S1:在衬底(例如硅片)的第一表面设置图形化的光刻胶掩模,其包含光刻出微纳米尺度的线条;S1: providing a patterned photoresist mask on the first surface of the substrate (for example, a silicon wafer), which comprises lithographically patterning micro-nano scale lines;
S2:利用所述光刻胶掩模对所述衬底的第一表面进行刻蚀,从而形成贯穿所述衬底第一表面和与该第一表面相背对的第二表面的若干通孔,用以作为流体通道;S2: etching a first surface of the substrate by using the photoresist mask to form a plurality of via holes penetrating the first surface of the substrate and the second surface opposite to the first surface Used as a fluid passage;
S3:在流体通道的内壁及所述衬底的第一表面上沉积用于微/纳米线/管生长的种子层;S3: depositing a seed layer for micro/nanowire/tube growth on an inner wall of the fluid channel and the first surface of the substrate;
S4:在所述种子层上生长形成多根微/纳米线/管,控制微/纳米线/管的生长条件,从而在所述衬底的第一表面生长形成彼此间隔的多根竖立微/纳米线/管,而在所述流体通道内生长形成沿径向延伸的若干微/纳米线/管,在所述流体通道内的多根微/纳米线/管彼此交叉,形成微纳米尺度的交叉网格;S4: growing a plurality of micro/nano wires/tubes on the seed layer to control the growth conditions of the micro/nano wires/tubes, thereby growing on the first surface of the substrate to form a plurality of erect micro/spaces spaced apart from each other a nanowire/tube that grows within the fluid channel to form a plurality of micro/nano wires/tubes extending in a radial direction, a plurality of micro/nano wires/tubes within the fluid channel intersecting each other to form a micro-nano scale Cross grid
S5:去除分布在所述衬底的第一表面的微/纳米线/管(也可保留);S5: removing micro/nano wires/tubes (also retained) distributed on the first surface of the substrate;
S6:划片、封装,制得流体处理装置。S6: dicing, encapsulating, and preparing a fluid processing device.
前述各步骤中采用的刻蚀方法可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,在前述步骤中,形成图形化(纳米图形)的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, in the foregoing steps, the method of forming the patterned (nano-pattern) photoresist mask includes a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
例如,在前述步骤中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀 等刻蚀出流体通道等。For example, in the foregoing steps, it may be in a manner known in the art, such as RIE, ICP, wet etching, electrochemical etching Etching out a fluid channel or the like.
显然,本申请流体处理装置的制备工艺是简单可控的,适合批量化大规模生产。Obviously, the preparation process of the fluid processing device of the present application is simple and controllable, and is suitable for batch mass production.
请参阅图26所示,在本申请的第十七实施例中,一种鼻塞式呼吸器,其可以包括:Referring to FIG. 26, in a seventeenth embodiment of the present application, a nasal plug respirator may include:
硬质外壳11,Hard outer casing 11,
嵌入式硬质丝网组件,包括横向、间隔地设置于外壳11内的两片嵌入式硬质丝网12;The embedded hard wire mesh assembly comprises two embedded hard wire meshes 12 disposed laterally and spacedly in the outer casing 11;
过滤丝织物片组件,包括横向、间隔地设置于外壳11内的两片过滤丝织物片13,两片过滤丝织物片13位于两片嵌入式硬质丝网12之间,且分别固设于嵌入式硬质丝网12上;The filter fabric sheet assembly comprises two sheets of filter fabric sheets 13 disposed laterally and spaced apart in the outer casing 11. The two sheets of filter fabric sheets 13 are located between the two embedded rigid screens 12 and are respectively fixed to Embedded on the hard screen 12;
固定式硬质丝网组件,包括横向、间隔地设置于外壳11内的两片固定式硬质丝网14,固定式硬质丝网14位于两片过滤丝织物片13之间;The fixed hard wire mesh assembly comprises two fixed hard wire meshes 14 disposed laterally and spacedly in the outer casing 11 , and the fixed hard wire mesh 14 is located between the two pieces of filter wire fabric sheets 13 ;
过滤芯片,横向设置于外壳11内,并位于两片固定式硬质丝网14之间;The filter chip is disposed laterally in the outer casing 11 and located between the two fixed hard screens 14;
腰鼓型鼻塞15,包括连接片体151以及由连接片体151的一面向外凸伸出的两个鼻塞主体152,腰鼓型鼻塞15经连接片体151嵌设于外壳11的内腔的一端,且鼻塞主体152与外壳11的内腔相连通。The waist drum type nasal plug 15 includes a connecting piece body 151 and two nasal plug bodies 152 protruding outward from one side of the connecting piece body 151. The waist drum type nasal plug 15 is embedded in one end of the inner cavity of the outer casing 11 via the connecting piece body 151. The nasal plug body 152 is in communication with the lumen of the outer casing 11.
优选的,嵌入式硬质丝网12的两端分别可拆卸的与外壳11的内腔壁连接。过滤丝织物片13的两端分别与外壳11的内腔壁相接,其一面与嵌入式硬质丝网12固定连接,其另一面搭设于由外壳11的内腔壁凸伸出的凸台上。固定式硬质丝网14的两端分别固设于外壳11的内腔壁上。过滤芯片的两端分别固设于外壳11的内腔壁上。Preferably, the two ends of the embedded rigid wire mesh 12 are detachably connected to the inner cavity wall of the outer casing 11 respectively. The two ends of the filter fabric sheet 13 are respectively connected to the inner cavity wall of the outer casing 11, one side of which is fixedly connected to the embedded hard wire mesh 12, and the other side of which is erected on the boss protruding from the inner cavity wall of the outer casing 11. on. Both ends of the fixed hard screen 14 are respectively fixed to the inner cavity wall of the outer casing 11. Both ends of the filter chip are respectively fixed on the inner cavity wall of the outer casing 11.
在本发明中,前述过滤芯片可以是采用MEMS(微机电系统加工工艺)制备的,因此也可以命名为MEMS过滤芯片。In the present invention, the foregoing filter chip may be prepared by using MEMS (Micro Electro Mechanical System Processing Technology), and thus may also be named as a MEMS filter chip.
请参阅图2-图3所示,在本申请的一优选实施例中,一种过滤芯片包括基体101,所述基体101具有相背对的第一表面1011和第二表面1012,且所述基体101内分布有若干作为流体通道的通孔102,所述第一表面设置有多个横梁103(可命名为凸起部)平行排布形成的阵列,其中有多根横梁103直接从通孔102上跨过以及有多根横梁103分布在通孔102两侧,其中,各横梁103顶部还均分布有帽形结构104(简称帽层),各帽层亦随各横梁沿横向连续延伸,并形成帽形结构的阵列,且待处理的空气无法绕过前述帽形结构的阵列而直接进入所述通孔102。Referring to FIGS. 2 to 3, in a preferred embodiment of the present application, a filter chip includes a base 101 having a first surface 1011 and a second surface 1012 opposite to each other, and A plurality of through holes 102 are formed in the base 101 as fluid passages. The first surface is provided with an array of a plurality of beams 103 (which may be named as protrusions) arranged in parallel, wherein a plurality of beams 103 are directly from the through holes. A plurality of beams 103 are disposed on the sides of the through holes 102, wherein the tops of the beams 103 are also distributed with a hat-shaped structure 104 (abbreviated as a cap layer), and the cap layers are continuously extended along the transverse direction of the beams. And forming an array of hat-shaped structures, and the air to be treated cannot directly enter the through-holes 102 by bypassing the array of the aforementioned hat-shaped structures.
其中,通过调整前述各帽形结构之间的间距,即可形成具有选定尺寸的开口部(可以称为微流道),实现对空气中不同粒径范围的颗粒进行清除处理,特别是,当将这些帽形结构的间距控制在纳米级时,可以去除空气中的极微小的颗粒(纳米级的颗粒)。Wherein, by adjusting the spacing between the above-mentioned hat-shaped structures, an opening portion (which may be referred to as a micro-flow channel) having a selected size can be formed, and the particles of different particle size ranges in the air can be removed, in particular, When the pitch of these cap structures is controlled at the nanometer level, extremely small particles (nanoscale particles) in the air can be removed.
前述横梁可以为条状,并具有较大的宽度和厚度,使得这些横梁可具有较高机械强度, 使其对帽形层形成较好的支撑,而各横梁的间距可以较大,以提供较大的空气通量。The aforementioned beams may be strip-shaped and have a large width and thickness so that the beams can have a high mechanical strength. It provides better support for the cap layer, and the spacing of the beams can be large to provide greater air flux.
前述帽层亦可以具有较大的厚度,其两侧沿侧向外延,使相邻帽层的间距可以达到很小,例如可以低至1nm,因此可以截留混杂于待处理的空气内的极小的颗粒。The cap layer may also have a large thickness, and both sides are laterally extended so that the spacing of adjacent cap layers can be made small, for example, as low as 1 nm, so that the trapping of the air to be treated is minimal. particle.
前述帽层可以与凸起部一体设置,例如可以通过蒸发、沉积、生长等(典型的如金属溅射、MOCVD、PECVD、电化学沉积等)技术直接形成于所述凸起部上部,并且所述帽形结构亦可随所述凸起部沿横向连续延伸,从而使相邻帽形结构之间形成沿横向连续延伸的开口部,如此一方面可以保证对混杂于待处理的空气内的选定颗粒的处理,亦还保持很高的通量,且降低了加工难度,节约了成本。The cap layer may be integrally provided with the convex portion, for example, may be directly formed on the upper portion of the convex portion by evaporation, deposition, growth, or the like (typically, such as metal sputtering, MOCVD, PECVD, electrochemical deposition, etc.), and The hat-shaped structure may also continuously extend in the lateral direction with the convex portion, so that an opening portion extending continuously in the lateral direction is formed between the adjacent hat-shaped structures, so that on the one hand, the selection of the air mixed in the air to be treated can be ensured. The treatment of the fixed particles also maintains a high throughput, which reduces the processing difficulty and saves costs.
前述帽层的材质可以选自绝缘介质材料如氧化硅、氮化硅氧化铝、硼磷硅玻璃等,或者半导体材料如Si、ZnO、GaN、TiO2、InN等,或金属材料如Ag、Au、Al、Ni、Cr、Ti等,但不限于此。The material of the cap layer may be selected from an insulating dielectric material such as silicon oxide, silicon nitride oxide, borophosphosilicate glass, or the like, or a semiconductor material such as Si, ZnO, GaN, TiO 2 , InN, or the like, or a metal material such as Ag or Au. , Al, Ni, Cr, Ti, etc., but are not limited thereto.
其中,所述基体101可以具有较大的厚度,使其对前述微/纳米片阵列形成较好的支撑,同时还可进一步增强所述过滤芯片的机械强度,使所述过滤芯片耐压、耐弯折、耐碰撞、耐冲击,进而使其可以在多种环境中应用而不致损坏,例如可以应用于对高压、高速空气进行处理,这一功能是现有的多孔膜等无法企及的。Wherein, the base body 101 can have a relatively large thickness, so that it can form a good support for the aforementioned micro/nano-array array, and can further enhance the mechanical strength of the filter chip, so that the filter chip can withstand pressure and resistance. It can be bent, impact-resistant and impact-resistant, so that it can be applied in various environments without damage. For example, it can be applied to high-pressure, high-speed air treatment, which is unmatched by existing porous membranes.
其中,所述过滤芯片各部分(101、102、103、104)的材料选择范围是多样的,可以是无机材料,也可以是有机材料,例如金属、非金属无机材料、塑料、陶瓷、半导体、玻璃、聚合物等。当这些部分都选择使用无机材料时,所述过滤芯片还具有耐温度变化的特性,可以处理高温和低温空气。The material selection range of each part (101, 102, 103, 104) of the filter chip is various, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, a semiconductor, or the like. Glass, polymer, etc. When these parts are all selected to use inorganic materials, the filter chip also has a temperature-resistant property and can handle high temperature and low temperature air.
采用前述设计的过滤芯片可以(超声)清洗,多次使用,且仍旧保持良好的空气处理能力。Filter chips using the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good air handling capabilities.
当利用所述的过滤芯片对空气进行处理时,含有杂质颗粒的空气(空气流向如图3中带有虚线的箭头所示)在进入前述帽形结构的阵列时,其中粒径大于一定数值的颗粒(或一些与空气不相容的液滴,例如空气中的水滴或油中的水滴)被阻挡在前述帽形结构的阵列之外,之后空气经由各帽形结构之间的开口部到达通孔102的入口处后再进入通孔102,实现对空气的净化和/或者对所需颗粒(液滴)的富集回收。When the air is processed by the filter chip, the air containing the impurity particles (the air flow is indicated by the arrow with a broken line in FIG. 3) enters the array of the above-mentioned hat-shaped structure, wherein the particle diameter is larger than a certain value. The particles (or some air-incompatible droplets, such as water droplets in the air or water droplets in the oil) are blocked outside the array of the aforementioned hat-shaped structures, after which the air reaches the passage through the opening between the respective hat-shaped structures The entrance of the aperture 102 is then re-entered into the via 102 to effect purification of the air and/or enrichment recovery of the desired particles (droplets).
在该实施例的一些具体应用方案中,前述各帽层的间隙可以为1nm~50μm,帽层的高度可以为50nm~200μm。In some specific applications of the embodiment, the gap of each of the cap layers may be 1 nm to 50 μm, and the height of the cap layer may be 50 nm to 200 μm.
在该实施例的一些具体应用方案中,前述通孔的孔径可以为1μm~1mm,前述基体的厚度可以>1μm。 In some specific applications of the embodiment, the through hole may have a diameter of 1 μm to 1 mm, and the substrate may have a thickness of >1 μm.
在该实施例的一些具体应用方案中,前述横梁的高度可以为0.1μm~400μm,宽度可以为0.1um~100μm,各横梁的间距可以为0.1μm~100μm。In some specific applications of the embodiment, the height of the beam may be 0.1 μm to 400 μm, the width may be 0.1 μm to 100 μm, and the distance between the beams may be 0.1 μm to 100 μm.
形成于相邻帽形层及相邻横梁之前的开口部的纵向截面可以是规则或不规则形状的,例如可以是梯形、多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等。The longitudinal section of the opening formed before the adjacent hat-shaped layer and the adjacent beam may be regular or irregular, and may be, for example, trapezoidal, polygonal (triangle, quadrilateral or other), circular, elliptical, star, etc. Wait.
前述横梁及帽形层可以规则或不规则、均匀或非均匀的分布在所述基体的第一表面上。The aforementioned beam and cap layer may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate.
另外,在该实施例中,前述通孔102的形状可以是多样的,例如可以是圆形、正方形、长方形或其它形状。In addition, in this embodiment, the shape of the through hole 102 may be various, and may be, for example, a circle, a square, a rectangle, or the like.
在本申请的其它一些实施例中,一种过滤芯片可以具有与前述实施例中任一者相似的结构,不同之处在于:在横梁、帽形层及基体表面还可设置有光催化材料层。在以包含光催化材料层的过滤芯片对空气进行处理时,若辅以紫外光照等,还可对空气中的一些有机污染物等进行光催化降解,实现对空气的多重净化。In some other embodiments of the present application, a filter chip may have a structure similar to any of the foregoing embodiments, except that a photocatalytic material layer may be disposed on the beam, the cap layer, and the surface of the substrate. . When the air is treated by a filter chip containing a photocatalytic material layer, if it is supplemented with ultraviolet light, etc., some organic pollutants in the air may be photocatalyzed to achieve multiple purification of the air.
其中,为利于光线透入,所述帽形层、横梁及基体中的部分或全部可以由透明材料制成。在本实施例的一些具体实施方案中,所述帽形层、横梁可以整体由透明材料制成,例如光线射入。Wherein, in order to facilitate light penetration, part or all of the hat layer, the beam and the base may be made of a transparent material. In some embodiments of the embodiment, the hat layer and the beam may be made entirely of a transparent material, such as light.
其中,较为典型的光催化材料可以是二氧化钛等,但不限于此。Among them, a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
其中,为形成所述光催化材料层,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述光催化材料层的厚度可以被控制在纳米级,以尽量减少其对所述过滤芯片的空气通量的影响。Wherein, the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the air flux of the filter chip.
该实施例中所采用的基体、帽形层、横梁、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structures, arrangement forms, materials, and the like of the base, the cap layer, the beam, the through hole, and the like used in the embodiment may be the same as or similar to those described above, and thus will not be described herein.
在本申请的其它一些实施例中,一种过滤芯片可以具有与前述实施例中任一者相似的结构,不同之处在于:在横梁、帽形层及基体表面还可设置有抗菌材料层。在以包含抗菌材料层的过滤芯片对空气进行处理时,可以在空气的处理过程中,同步灭杀空气中的细菌、病毒等,实现对空气的多重净化。In some other embodiments of the present application, a filter chip may have a structure similar to any of the previous embodiments, except that an antibacterial material layer may be disposed on the beam, the cap layer, and the surface of the substrate. When the air is processed by the filter chip containing the antibacterial material layer, bacteria, viruses and the like in the air can be simultaneously killed during the air treatment to achieve multiple purification of the air.
其中,较为典型的抗菌材料可以是诸如Au、Ag等贵金属等,但不限于此。Among them, the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
其中,为形成所述抗菌材料层,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。 Wherein, in order to form the antibacterial material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer). Deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述抗菌材料层的厚度可以被控制在纳米级,以尽量减少其对所述过滤芯片的空气通量的影响。Wherein, the thickness of the antibacterial material layer can be controlled at the nanometer level to minimize its influence on the air flux of the filter chip.
该实施例中所采用的基体、帽形层、横梁、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structures, arrangement forms, materials, and the like of the base, the cap layer, the beam, the through hole, and the like used in the embodiment may be the same as or similar to those described above, and thus will not be described herein.
本申请的所述过滤芯片可以通过物理、化学方法制备,例如可以是化学生长法、物理加工法等,特别是MEMS(微机电系统,Microelectromechanical Systems)法等。The filter chip of the present application can be prepared by physical or chemical methods, for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
如图4所示,在本申请的另一些实施例中,一种过滤芯片的制备工艺可以包括如下步骤:As shown in FIG. 4, in other embodiments of the present application, a process for preparing a filter chip may include the following steps:
S1:提供衬底(例如硅片);S1: providing a substrate (such as a silicon wafer);
S2:在衬底的一侧表面(命名为第一表面)上光刻出微纳米尺度的线条,即形成图形化的光刻胶掩模;S2: lithographically patterning micro-nano-scale lines on one side surface of the substrate (designated as the first surface), ie forming a patterned photoresist mask;
S3:在所述衬底的第一表面刻蚀(RIE、ICP、湿法腐蚀、电化学腐蚀等)出微纳米尺度的多根横梁,之后除去所述光刻胶掩模;S3: etching, on the first surface of the substrate (RIE, ICP, wet etching, electrochemical etching, etc.) a plurality of beams on the micro-nano scale, and then removing the photoresist mask;
S4:在所述衬底的与第一表面相背对的另一侧表面(命名为第二表面)上设置光刻胶刻蚀掩模;S4: providing a photoresist etching mask on another side surface (named second surface) of the substrate opposite to the first surface;
S5:对所述衬底的该另一侧表面进行刻蚀,直至在所述衬底的该另一侧表面形成作为流体通道的通孔;S5: etching the other side surface of the substrate until a through hole as a fluid passage is formed on the other side surface of the substrate;
S6:除去光刻胶刻蚀掩模,之后在有衬底的有横梁一侧的表面蒸镀或沉积或生长帽层结构。蒸镀或沉积或生长工艺过程中存在侧向延伸的现象,能够使帽层间隙随着厚度的增加而减小,最小可以达到几个纳米。S6: removing the photoresist etch mask, and then evaporating or depositing or growing the cap layer structure on the surface of the substrate having the beam side. There is a lateral extension during the evaporation or deposition or growth process, which enables the cap gap to decrease with increasing thickness, up to a few nanometers.
S7:划片、封装,制得过滤芯片(该步骤在图中未示出)。S7: dicing, encapsulating, and manufacturing a filter chip (this step is not shown in the figure).
前述各步骤中采用的刻蚀方法还可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may also be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,在前述步骤中,形成图形化的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, in the foregoing steps, the method of forming the patterned photoresist mask includes a photolithography technique, a nanosphere mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
显然,该实施例中过滤芯片的制备工艺是简单可控的,适合批量化大规模生产,且所获过滤芯片至少具有如下优点:(1)通量大,流阻小;(2)物理过滤,能有效清除大于纳米缝隙的颗粒;(3)跨越式横梁和较大的衬底厚度,可以保证高机械强度;(5)可以(超声)清洗,多次使用。Obviously, the preparation process of the filter chip in this embodiment is simple and controllable, and is suitable for mass production in large quantities, and the obtained filter chip has at least the following advantages: (1) large flux and small flow resistance; (2) physical filtration It can effectively remove particles larger than nano-slit; (3) straddle beam and large substrate thickness can ensure high mechanical strength; (5) can be (ultrasonic) cleaning, multiple use.
请参阅图5所示,在本申请的另一优选实施例中,一种过滤芯片包括基体201,所述基体201具有相背对的第一表面2011和第二表面2012,且所述基体201上分布有若干作为流体通道的通孔204。所述第一表面2011上设置有平行排布的多根横梁203,所述横梁203在 所述第一表面上沿横向连续延伸,其中的若干横梁203从所述通孔204上连续跨过,因此也可以被视为跨越式横梁203。其中任一横梁203上均分布有多根纳米线202,该多根纳米线202的一端均固定于该任一横梁203表面,另一端沿逐渐远离该任一横梁203的方向斜向延伸(亦可认为是侧向延伸),并与分布在相邻于该任一横梁203的另一横梁上的多根纳米线202相互交叉,从而形成所述多孔结构205。请再次参阅图5,所述多孔结构205以俯视的视角观察为掩盖所述通孔204的网格结构。所述多孔结构205中孔洞的直径大于0但小于混杂于待处理的流体内的选定颗粒的粒径。而请参阅图5-图6,可以看到该多根纳米线102交叉形成的多孔结构205与所述基体201的第一表面2011配合形成另一流体通道,使得待处理的流体206仅能通过该另一流体通道进入所述通孔204。Referring to FIG. 5, in another preferred embodiment of the present application, a filter chip includes a base 201 having a first surface 2011 and a second surface 2012 opposite to each other, and the base 201 A plurality of through holes 204 are provided as fluid passages. The first surface 2011 is provided with a plurality of cross beams 203 arranged in parallel, and the beam 203 is at The first surface extends continuously in the lateral direction, and a plurality of beams 203 thereof traverse continuously from the through holes 204, and thus can also be regarded as a spanning beam 203. Each of the beams 203 is distributed with a plurality of nanowires 202. One end of the plurality of nanowires 202 is fixed to the surface of the beam 203, and the other end is obliquely extended away from the beam 203. It can be considered to be laterally extended and intersects with a plurality of nanowires 202 distributed on another beam adjacent to either of the beams 203 to form the porous structure 205. Referring again to FIG. 5, the porous structure 205 is viewed in a plan view to cover the mesh structure of the through holes 204. The diameter of the pores in the porous structure 205 is greater than zero but less than the particle size of selected particles that are intermixed within the fluid to be treated. 5-6, it can be seen that the porous structure 205 formed by the intersection of the plurality of nanowires 102 cooperates with the first surface 2011 of the substrate 201 to form another fluid passage, so that the fluid 206 to be treated can only pass. The other fluid passage enters the through hole 204.
其中,因前述纳米线具有较大的高径比(或者长径比),使得这些纳米线可密集排布于所述基体的第一表面,通过调整前述横梁之间的间距以及这些纳米线的密度、长度、延伸方向等,即可对流体中不同粒径范围的颗粒进行清除处理,特别是,当采用的均是纳米线时,通过将这些纳米线交叉形成的孔洞孔径控制在纳米级,不仅可以去除流体中的极微小的颗粒,而且因纳米线自身直径极小,还可使其对于流体的阻力被控制在很低的水平,并形成很大的流体通量,远远优于现有的多孔膜、基于横向流道的过滤芯片等。Wherein, because the nanowires have a large aspect ratio (or aspect ratio), the nanowires can be densely arranged on the first surface of the substrate, by adjusting the spacing between the beams and the nanowires. Density, length, direction of extension, etc., can be used to remove particles of different particle size ranges in the fluid. In particular, when nanowires are used, the pore size formed by the intersection of these nanowires is controlled at the nanometer level. Not only can the tiny particles in the fluid be removed, but also because the nanowire itself has a very small diameter, it can also control the resistance to the fluid to a very low level and form a large fluid flux, which is far superior to the present. Some porous membranes, filter chips based on lateral flow channels, and the like.
其中,若参考业界已知的方案,将前述的纳米线的排布方式进行一定的设计,还可使之形成超疏水结构、超疏油结构,不仅可以清除流体中的颗粒,且还可通过自清洁作用,使被阻挡的颗粒无法在所述过滤芯片的功能区域(纳米线阵列表面)积聚,避免所述过滤芯片在长期使用后失效。Wherein, according to the solution known in the industry, the arrangement of the aforementioned nanowires is designed to be super-hydrophobic structure and super-oleophobic structure, which can not only remove particles in the fluid, but also pass The self-cleaning action prevents the blocked particles from accumulating in the functional area (the surface of the nanowire array) of the filter chip, thereby preventing the filter chip from failing after long-term use.
其中,所述横梁203可以在所述基体201的第一表面2011上以合适的密度分布,以使所述过滤芯片具有尽可能高的流体处理通量。以及,所述横梁203可具有合适的宽度,以使所述横梁203在具有足够的机械强度的同时,还可避免对所述过滤芯片的通量造成过多影响。例如,所述横梁的高度可以为0.1μm~100μm,宽度可以为0.1μm~400μm,横梁之间的间距可以为0.1μm~100μm。Wherein, the beam 203 can be distributed at a suitable density on the first surface 2011 of the substrate 201 to provide the filter chip with as high a fluid handling flux as possible. Also, the beam 203 may have a suitable width such that the beam 203, while having sufficient mechanical strength, may also avoid excessive effects on the flux of the filter chip. For example, the beam may have a height of 0.1 μm to 100 μm, a width of 0.1 μm to 400 μm, and a pitch between the beams of 0.1 μm to 100 μm.
其中,所述基体201可以具有较大的厚度及所述横梁203可以具有较大的高度,使其对前述纳米线阵列形成较好的支撑,同时还可进一步增强所述过滤芯片的机械强度,使所述过滤芯片耐压、耐弯折、耐碰撞、耐冲击,进而使其可以在多种环境中应用而不致损坏,例如可以应用于对高压、高速流体进行处理,这一功能是现有的多孔膜等无法企及的。Wherein, the base 201 can have a larger thickness and the beam 203 can have a larger height, so that it can form a better support for the nanowire array, and can further enhance the mechanical strength of the filter chip. The filter chip is resistant to pressure, bending, impact and impact, so that it can be applied in various environments without damage, for example, it can be applied to processing high pressure and high speed fluids. A porous membrane or the like cannot be achieved.
其中,所述过滤芯片各部分(201、202、203)的材料选择范围是多样的,可以是无机材料,也可以是有机材料。当这些部分都选择使用无机材料时,所述过滤芯片还具有耐温度变 化的特性,可以处理高温和低温流体。The material selection range of each part (201, 202, 203) of the filter chip is various, and may be an inorganic material or an organic material. When these parts are selected to use inorganic materials, the filter chip also has temperature resistance The ability to handle high temperature and low temperature fluids.
采用前述设计的所述的过滤芯片可以(超声)清洗,多次使用,且仍旧保持良好的流体处理能力。The filter chip of the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
当利用所述的过滤芯片对流体进行处理时,含有杂质颗粒的流体在进入前述多孔结构205时,其中粒径大于一定数值的颗粒(或一些与流体不相容的液滴,例如空气中的水滴或油中的水滴)被阻挡在前述多孔结构205之外,之后流体经由各纳米线之间的间隙到达通孔204的入口处后再进入通孔204,实现对流体的净化和/或者对所需颗粒(液滴)的富集回收。When the fluid is treated with the filter chip, the fluid containing the foreign particles enters the porous structure 205, wherein the particles having a particle diameter larger than a certain value (or some liquid-incompatible droplets, such as air) Water droplets or water droplets in the oil are blocked outside the porous structure 205, after which the fluid reaches the entrance of the through hole 204 via the gap between the nanowires and then enters the through hole 204, thereby purifying the fluid and/or Enrichment recovery of the desired particles (droplets).
请再次参阅图5所示,在该实施例的一些具体应用方案中,前述纳米线202的直径和间距可以为1nm~50μm,长6度(高度)可以为50nm~200μm。所述通孔104的孔径可以为1μm~1mm。所述基体的厚度可以在1μm以上。Referring to FIG. 5 again, in some specific applications of the embodiment, the diameter and spacing of the nanowires 202 may be 1 nm to 50 μm, and the length 6 degrees (height) may be 50 nm to 200 μm. The through hole 104 may have a diameter of 1 μm to 1 mm. The thickness of the substrate may be 1 μm or more.
前述纳米线的横向截面结构可以是规则或不规则形状的,例如可以是多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等。The transverse cross-sectional structure of the aforementioned nanowires may be regular or irregular, and may be, for example, a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, or the like.
前述纳米线202可以规则或不规则、均匀或非均匀的分布在所述基体201的第一表面上。The aforementioned nanowires 202 may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate 201.
由这些纳米线202形成的阵列可具有超疏水结构,进而使得所述过滤芯片具有自清洁功能。The array formed by these nanowires 202 can have a superhydrophobic structure, thereby allowing the filter chip to have a self-cleaning function.
前述的纳米线202可以优选自碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线等,且不限于此。The aforementioned nanowires 202 may preferably be selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
前述纳米线202可以通过外界转移、原位生长(例如化学生长、电化学生长)或沉积(例如物理、化学气相沉积,电沉积)等方式固定于所述基体表面或者于所述基体表面生长形成。The foregoing nanowires 202 may be fixed to the surface of the substrate or grown on the surface of the substrate by external transfer, in-situ growth (eg, chemical growth, electrochemical growth) or deposition (eg, physical, chemical vapor deposition, electrodeposition). .
前述通孔204的形状(特别是横向截面的形状)可以是多样的,例如可以是圆形、正方形、长方形、菱形、多边形或其它规则或不规则形状。The shape of the aforementioned through holes 204 (especially the shape of the transverse cross section) may be various, and may be, for example, a circle, a square, a rectangle, a diamond, a polygon, or other regular or irregular shapes.
在该实施例的一些具体应用方案中,所述纳米线202可以由光催化材料或具有抗菌、杀菌功能的材料形成,或者,所述纳米线202也可以是表面覆盖有光催化材料或具有杀菌、抗菌功能的材料形成的涂层。In some specific applications of the embodiment, the nanowires 202 may be formed of a photocatalytic material or a material having an antibacterial or bactericidal function, or the nanowires 202 may be surface covered with a photocatalytic material or have sterilization. a coating formed of an antibacterial material.
例如,所述纳米线202可采用ZnO纳米线、GaN纳米线、TiO2纳米线等具有光催化的性质的纳米线,在光辅助照射下,能够降解流体中的有机物。For example, the nanowires 202 may adopt nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO2 nanowires, and are capable of degrading organic substances in the fluid under light-assisted illumination.
例如,所述纳米线202可采用Ag纳米线、Au纳米线等,以杀灭流体中的细菌、病毒、微生物。For example, the nanowires 202 may employ Ag nanowires, Au nanowires, or the like to kill bacteria, viruses, and microorganisms in the fluid.
在该实施例的一些具体应用方案中,所述基体201的第一表面2011上还设置有光催化材料层或抗菌材料层等。 In some specific applications of the embodiment, the first surface 2011 of the base 201 is further provided with a photocatalytic material layer or an antibacterial material layer or the like.
在以包含光催化材料层的过滤芯片对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。When the fluid is treated by a filter chip containing a photocatalytic material layer, if it is supplemented with ultraviolet light, etc., some organic pollutants in the fluid may be photocatalyzed to achieve multiple purification of the fluid.
其中,为利于光线透入,所述基体、凸起部、纳米线中的部分或全部可以由透明材料制成。Wherein, in order to facilitate light penetration, part or all of the substrate, the protrusion, and the nanowire may be made of a transparent material.
其中,较为典型的光催化材料可以是二氧化钛等,但不限于此。Among them, a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
其中,为形成所述光催化材料层,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述光催化材料层的厚度可以被控制在纳米级,以尽量减少其对所述过滤芯片的流体通量的影响。Wherein, the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
而在以包含抗菌材料层的过滤芯片对流体进行处理时,可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等,实现对流体的多重净化。When the fluid is processed by the filter chip containing the antibacterial material layer, bacteria, viruses and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
其中,较为典型的抗菌材料可以是诸如Au、Ag等贵金属等,但不限于此。Among them, the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
其中,为形成所述抗菌材料层,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the antibacterial material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer). Deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述抗菌材料层的厚度可以被控制在纳米级,以尽量减少其对所述过滤芯片的流体通量的影响。Wherein, the thickness of the antimicrobial material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
本申请的所述过滤芯片可以通过物理、化学方法制备,例如可以是化学生长法、物理加工法等,特别是MEMS(微机电系统,Microelectromechanical Systems)法等。The filter chip of the present application can be prepared by physical or chemical methods, for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
例如,请参阅图7所示,在该实施例中,一种过滤芯片的制备工艺可以包括如下步骤:For example, referring to FIG. 7, in this embodiment, a process for preparing a filter chip may include the following steps:
S1:在衬底(例如硅片)的第一表面上沉积用于纳米线生长的种子层。S1: depositing a seed layer for nanowire growth on a first surface of a substrate such as a silicon wafer.
S2:在所述种子层上设置图形化的光刻胶掩模,其包含光刻出微纳米尺度的线条。S2: A patterned photoresist mask is disposed on the seed layer, which comprises lithographic lines on the micro-nano scale.
S3:利用所述光刻胶掩模对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的多根微纳米尺度的横梁结构,之后除去所述光刻胶掩模。S3: etching the first surface of the substrate by using the photoresist mask to form a plurality of micro-nano-scale beam structures spaced apart from each other on the first surface of the substrate, and then removing the A photoresist mask is described.
S4:在所述衬底的第二表面上设置光刻胶形成的图形化刻蚀掩模。S4: providing a patterned etch mask formed by photoresist on the second surface of the substrate.
S5:对所述衬底的第二表面进行刻蚀,并刻蚀至所述横梁底部,从而在所述衬底的第二表面形成用作流体通道的槽孔,并除去光刻胶。S5: etching a second surface of the substrate and etching to the bottom of the beam to form a hole serving as a fluid passage on the second surface of the substrate, and removing the photoresist.
S6:在种子层上生长纳米线,控制纳米线的生长条件,使纳米线有一定的侧向生长比率,并且形成微纳米尺度的交叉网格。 S6: growing nanowires on the seed layer, controlling the growth conditions of the nanowires, making the nanowires have a certain lateral growth ratio, and forming a cross-grid of micro-nano scale.
S7:划片、封装,制得过滤芯片。S7: dicing, encapsulation, and making a filter chip.
前述各步骤中采用的刻蚀方法可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,在前述步骤中,形成图形化(纳米图形)的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, in the foregoing steps, the method of forming the patterned (nano-pattern) photoresist mask includes a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
例如,在前述步骤中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等刻蚀出横梁203、通孔204等。For example, in the foregoing steps, the beam 203, the via 204, and the like may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
显然,本申请过滤芯片的制备工艺是简单可控的,适合批量化大规模生产。Obviously, the preparation process of the filter chip of the present application is simple and controllable, and is suitable for batch mass production.
请参阅图8及图11a-图11b所示,在本申请的一优选实施例中,一种过滤芯片包括基体301,所述基体301具有第一表面301a,且所述基体301的第一区域3011(图中虚线围合的区域)分布有若干作为流体通道的通孔304,所述第一表面上设置有多根竖直微/纳米线/管303(即,微米级的线、微米级的管、纳米线、纳米管中的任一种或多种的组合)形成的阵列,分布在环绕第一区域3011的第二区域3012内的所述通孔304分布的多根微/纳米线/管303的顶部还连接有流体阻挡部302,所述流体阻挡部302设置于所述通孔304的流体入口上方,使待处理的流体无法绕过前述的微/纳米线/管阵列而直接进入所述通孔304,所述流体阻挡部302具有与所述第一表面3011相对设置的第二表面302b。而在所述第一表面3011的其余区域3013(可命名为第三区域)内亦可密集分布多根竖直微/纳米线/管303。在图8中,带有虚线的箭头示出了流体的行进方向。Referring to FIG. 8 and FIG. 11a - FIG. 11b, in a preferred embodiment of the present application, a filter chip includes a base 301 having a first surface 301a and a first area of the base 301 3011 (the area enclosed by the dotted line in the figure) is distributed with a plurality of through holes 304 as fluid passages, and the first surface is provided with a plurality of vertical micro/nano wires/tubes 303 (ie, micron-sized wires, micron-sized An array formed by a combination of any one or more of tubes, nanowires, nanotubes, distributed over the plurality of micro/nano wires distributed around the vias 304 in the second region 3012 of the first region 3011 The top of the tube 303 is also connected with a fluid blocking portion 302 disposed above the fluid inlet of the through hole 304 so that the fluid to be treated cannot directly bypass the aforementioned micro/nano wire/tube array. Entering the through hole 304, the fluid blocking portion 302 has a second surface 302b disposed opposite the first surface 3011. A plurality of vertical micro/nano wires/tubes 303 may also be densely distributed in the remaining area 3013 of the first surface 3011 (which may be named as the third area). In Figure 8, arrows with dashed lines show the direction of travel of the fluid.
其中,因前述微/纳米线/管具有较大的高径比(或者长径比),使得这些微/纳米线/管可密集排布于所述基体的第一表面,通过调整这些微/纳米线/管的间距,即可对流体中不同粒径范围的颗粒进行清除处理,特别是,当采用的均是纳米线/管时,通过将这些纳米线/管之间的间距控制在纳米级,不仅可以去除流体中的极微小的颗粒,而且因纳米线/管自身直径极小,还可使其对于流体的阻力被控制在很低的水平,并形成很大的流体通量,远远优于现有的多孔膜、基于横向流道的过滤芯片等。Wherein, because the aforementioned micro/nano wires/tubes have a large aspect ratio (or aspect ratio), the micro/nano wires/tubes can be densely arranged on the first surface of the substrate, by adjusting these micro// Nanowire/tube spacing allows for the removal of particles of different particle sizes in the fluid, especially when nanowires/tubes are used, by controlling the spacing between these nanowires/tubes in the nanometer The grade not only removes very small particles in the fluid, but also because the nanowire/tube itself has a very small diameter, it can also control the resistance to fluids to a very low level and form a large fluid flux. It is far superior to existing porous membranes, filter chips based on lateral flow channels, and the like.
其中,若参考业界已知的方案,将前述的微/纳米线/管阵列进行一定的设计,还可使之形成超疏水结构、超疏油结构,不仅可以清除流体中的颗粒,且还可通过自清洁作用,使被阻挡的颗粒无法在所述过滤芯片的功能区域(微/纳米线/管阵列表面)积聚,避免所述过滤芯片在长期使用后失效。Wherein, if the micro/nanowire/tube array is designed according to a scheme known in the art, the super-hydrophobic structure and the super-oleophobic structure can be formed, which can not only remove particles in the fluid, but also By self-cleaning, the blocked particles cannot be accumulated in the functional area (micro/nanowire/tube array surface) of the filter chip, and the filter chip is prevented from failing after long-term use.
其中,所述基体301可以具有较大的厚度,使其对前述微/纳米线/管阵列形成较好的支撑,同时还可进一步增强所述过滤芯片的机械强度,使所述过滤芯片耐压、耐弯折、耐碰撞、耐冲击,进而使其可以在多种环境中应用而不致损坏,例如可以应用于对高压、高速流体进行 处理,这一功能是现有的多孔膜等无法企及的。Wherein, the base 301 can have a large thickness to form a better support for the micro/nano wire/tube array, and further enhance the mechanical strength of the filter chip to make the filter chip withstand voltage. It is resistant to bending, impact and impact, which makes it suitable for use in a variety of environments without damage, for example, for high pressure, high speed fluids. Treatment, this function is unmatched by existing porous membranes.
其中,所述流体阻挡部可以是片状的,其厚度等可依据实际应用需求而调整。Wherein, the fluid blocking portion may be in the form of a sheet, and the thickness and the like may be adjusted according to actual application requirements.
其中,所述过滤芯片各部分(301、302、303、304)的材料选择范围是多样的,可以是无机材料,也可以是有机材料,例如金属、非金属无机材料、塑料、陶瓷、半导体、玻璃、聚合物等。当这些部分都选择使用无机材料时,所述过滤芯片还具有耐温度变化的特性,可以处理高温和低温流体。Wherein, the material selection range of each part (301, 302, 303, 304) of the filter chip is various, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, a semiconductor, Glass, polymer, etc. When these parts are all selected to use inorganic materials, the filter chip also has temperature-resistant characteristics and can handle high temperature and low temperature fluids.
采用前述设计的所述的过滤芯片可以(超声)清洗,多次使用,且仍旧保持良好的流体处理能力。The filter chip of the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
当利用所述的过滤芯片对流体进行处理时,含有杂质颗粒的流体在进入前述微/纳米线303组成的阵列时,其中粒径大于一定数值的颗粒(或一些与流体不相容的液滴,例如空气中的水滴或油中的水滴)被阻挡在前述微/纳米线/管阵列之外,之后流体经由各微/纳米线/管之间的间隙到达通孔304的入口处后再进入通孔304,实现对流体的净化和/或者对所需颗粒(液滴)的富集回收。When the fluid is processed by the filter chip, the fluid containing the impurity particles enters the array of the aforementioned micro/nano wires 303, wherein the particles having a particle diameter larger than a certain value (or some liquid incompatible with the fluid) , for example, water droplets in the air or water droplets in the oil) are blocked outside the aforementioned micro/nanowire/tube array, after which the fluid reaches the entrance of the through hole 304 via the gap between the respective micro/nano wires/tubes and then enters The through holes 304 enable purification of the fluid and/or enrichment recovery of the desired particles (droplets).
请再次参阅图8所示,在该实施例的一些具体应用方案中,前述微/纳米线的直径可以为1nm~50μm,长度(高度)h1可以为50nm~200μm,相邻微/纳米线之间的距离可以为1nm~50μm。所述通孔304的孔径w可以为1μm~1mm。所述基体的厚度h2可以在1μm以上。所述流体阻挡部的厚度h3可以为0.5μm~200μm。Referring to FIG. 8 again, in some specific applications of the embodiment, the micro/nano wires may have a diameter of 1 nm to 50 μm, and the length (height) h 1 may be 50 nm to 200 μm, and adjacent micro/nano lines. The distance between them may be from 1 nm to 50 μm. The through hole 304 may have a diameter w of 1 μm to 1 mm. The thickness h 2 of the substrate may be 1 μm or more. The thickness h 3 of the fluid blocking portion may be from 0.5 μm to 200 μm.
请再次参阅图9a-图9e,前述微/纳米线的横向截面结构可以是规则或不规则形状的,例如可以是多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等。Referring again to FIGS. 9a-9e, the transverse cross-sectional structure of the aforementioned micro/nano wires may be regular or irregular, such as polygonal (triangle, quadrilateral or other), circular, elliptical, star, and the like.
请再次参阅图10a-图10c,前述微/纳米线可以规则或不规则、均匀或非均匀的分布在所述基体的第一表面上。在一些较为具体的应用方案中,相邻微/纳米线的平均间距在1nm~50μm。Referring again to Figures 10a-10c, the aforementioned micro/nanowires may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate. In some specific applications, the average pitch of adjacent micro/nano wires is between 1 nm and 50 μm.
另外,请参阅图11a-图11c,在该实施例中,前述通孔304和流体阻挡部302的形状(特别是横向截面的形状)可以是多样的,例如可以是圆形、正方形、长方形或其它形状。In addition, referring to FIG. 11a - FIG. 11c, in this embodiment, the shape of the through hole 304 and the fluid blocking portion 302 (especially the shape of the transverse cross section) may be various, for example, may be circular, square, rectangular or Other shapes.
请参阅图12所示,较为优选的,在本申请的一优选实施例中,一种过滤芯片包括基体401,所述基体401具有第一表面和与该第一表面相背对的和第三表面,且所述基体401上分布有若干作为流体通道的通孔404,所述第一表面上设置有多根竖直微/纳米线/管403形成的阵列,环绕所述通孔404分布的多根微/纳米线/管403的顶部还连接有流体阻挡部402,所述流体阻挡部402设置于所述通孔404的流体入口上方,使待处理的流体无法绕过前述的微/纳米线/管阵列而直接进入所述通孔404。并且,在所述通孔404周围还对称或不对称的分布有 一个以上的,例如四根支撑体405,藉由所述支撑体405还可增加对所述流体阻挡部402的支撑,实现流体阻挡部与基体之间更为牢固稳定的配合,并可有效的对分布在流体阻挡部与基体之间的微/纳米线/管阵列形成保护,避免因流体阻挡部和/或基体在受到外力作用后,对前述微/纳米线/管阵列挤压而造成的微/纳米线/管403坍塌、损毁等问题。Referring to FIG. 12, preferably, in a preferred embodiment of the present application, a filter chip includes a base 401 having a first surface and opposite to the first surface and a third a surface, and the substrate 401 is provided with a plurality of through holes 404 as fluid passages, and the first surface is provided with an array of vertical micro/nano wires/tubes 403 distributed around the through holes 404. The top of the plurality of micro/nano wires/tubes 403 is also connected with a fluid blocking portion 402 disposed above the fluid inlet of the through hole 404, so that the fluid to be treated cannot bypass the aforementioned micro/nano. The line/tube array directly enters the through hole 404. Moreover, a symmetric or asymmetric distribution around the through hole 404 is also provided. One or more, for example, four support bodies 405 can also support the fluid blocking portion 402 by the support body 405, thereby achieving a more stable and stable cooperation between the fluid blocking portion and the base body, and can be effective. Protecting the micro/nanowire/tube array distributed between the fluid barrier and the substrate to avoid the extrusion of the micro/nanowire/tube array by the fluid barrier and/or the substrate after being subjected to an external force The micro/nano wire/tube 403 collapses, is damaged, and the like.
其中,所述支撑体可以是多种形态的,例如可以具有矩形、梯形、台阶形纵向截面(此处的纵向可理解为垂直于所述基体第一表面的方向)等等,且不限于此。在该实施例的一些具体实施方案中,所述支撑体可以为自所述通孔404边缘部向上突出形成的凸台等,其上端连接所述流体阻挡部402。Wherein, the support body may be in various forms, for example, may have a rectangular, trapezoidal, stepped longitudinal section (the longitudinal direction herein may be understood as a direction perpendicular to the first surface of the base body), and the like, and is not limited thereto. . In some embodiments of the embodiment, the support body may be a boss or the like that protrudes upward from an edge portion of the through hole 404, and an upper end thereof is connected to the fluid blocking portion 402.
其中,所述支撑体的数量、直径、分布密度等可根据实际需要而调整,但应尽量少的占用所述基体第一表面的空间,避免其对所述微/纳米线的流体通量造成大的影响。Wherein, the number, diameter, distribution density and the like of the support body can be adjusted according to actual needs, but the space of the first surface of the base body should be occupied as little as possible to avoid the fluid flux to the micro/nano wires. Great impact.
该实施例中所采用的基体、微/纳米线/管阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
请参阅图13所示,较为优选的,在本申请的一优选实施例中,一种过滤芯片包括基体501,所述基体501具有第一表面和与该第一表面相背对的和第三表面,且所述基体501上分布有若干作为流体通道的通孔504,所述第一表面上设置有多根竖直微/纳米线/管503形成的阵列,环绕所述通孔504分布的多根微/纳米线/管503的顶部还连接有流体阻挡部502,所述流体阻挡部502设置于所述通孔504的流体入口上方,使待处理的流体无法绕过前述的微/纳米线/管阵列而直接进入所述通孔504。并且,在所述通孔504上还架设有一根以上的,例如对称或不对称排布的多根支撑梁505,藉由所述支撑梁505还可增加对所述流体阻挡部502的支撑,实现流体阻挡部与基体之间更为牢固稳定的配合,并可有效的对分布在流体阻挡部与基体之间的微/纳米线/管阵列形成保护,避免因流体阻挡部和/或基体在受到外力作用后,对前述微/纳米线/管阵列挤压而造成的微/纳米线/管503坍塌、损毁等问题。Referring to FIG. 13, preferably, in a preferred embodiment of the present application, a filter chip includes a base 501 having a first surface and opposite to the first surface and a third a surface, and the substrate 501 is provided with a plurality of through holes 504 as fluid passages, and the first surface is provided with an array formed by a plurality of vertical micro/nano wires/tubes 503 distributed around the through holes 504. The top of the plurality of micro/nano wires/tubes 503 is also connected with a fluid blocking portion 502 disposed above the fluid inlet of the through hole 504, so that the fluid to be treated cannot bypass the aforementioned micro/nano. The line/tube array directly enters the via 504. Moreover, a plurality of support beams 505, such as symmetric or asymmetric arrangement, are further disposed on the through hole 504, and the support beam 505 can also increase the support of the fluid blocking portion 502. A more stable and stable fit between the fluid barrier and the substrate is achieved, and the micro/nanowire/tube array distributed between the fluid barrier and the substrate can be effectively protected from being blocked by the fluid barrier and/or the substrate. After the external force is applied, the micro/nanowire/tube 503 is collapsed and damaged due to the extrusion of the aforementioned micro/nanowire/tube array.
其中,所述支撑梁可以是多种形态的,例如可以拱桥形等,且不限于此。且进一步的,所述支撑梁还可与其它支撑体配合,例如前述实施例中述及的支撑体配合。The support beam may be in various forms, such as an arch bridge shape, etc., and is not limited thereto. Further, the support beam can also cooperate with other support bodies, such as the support body described in the foregoing embodiments.
其中,所述支撑梁的数量、尺寸、分布密度等可根据实际需要而调整,但应尽量少的遮挡所述通孔的流体入口,避免其对所述过滤芯片的流体通量造成大的影响。Wherein, the number, size, distribution density and the like of the support beam can be adjusted according to actual needs, but the fluid inlet of the through hole should be blocked as little as possible to avoid a large influence on the fluid flux of the filter chip. .
该实施例中所采用的基体、微/纳米线/管阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
请参阅图14所示,较为优选的,在本申请的一优选实施例中,一种过滤芯片包括基体601,所述基体601具有第一表面6011和与该第一表面相背对的第三表面6012,且所述基体 601上分布有若干作为流体通道的通孔604,所述第一表面上设置有多根竖直纳米柱603形成的阵列,环绕所述通孔604分布的多根纳米柱603的顶部还连接有流体阻挡部602,所述流体阻挡部602设置于所述通孔604的流体入口上方,使待处理的流体无法绕过前述的纳米柱阵列而直接进入所述通孔604。并且,在所述纳米柱603表面及所述基体601的第一表面上还设置有光催化材料层605。在以包含光催化材料层605的过滤芯片对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。Referring to FIG. 14, it is preferable that in a preferred embodiment of the present application, a filter chip includes a base 601 having a first surface 6011 and a third opposite to the first surface. Surface 6012, and the substrate A plurality of through holes 604 as fluid passages are disposed on the 601, and the first surface is provided with an array formed by a plurality of vertical nano-pillars 603, and the tops of the plurality of nano-pillars 603 distributed around the through-holes 604 are also connected The fluid blocking portion 602 is disposed above the fluid inlet of the through hole 604, so that the fluid to be treated cannot directly enter the through hole 604 by bypassing the aforementioned array of nanopillars. Further, a photocatalytic material layer 605 is further disposed on the surface of the nano-pillar 603 and the first surface of the base 601. When the fluid is processed by the filter chip including the photocatalytic material layer 605, if it is supplemented with ultraviolet light or the like, some organic pollutants in the fluid may be photocatalyzed to achieve multiple purification of the fluid.
其中,为利于光线透入,所述流体阻挡部、基体、凸起部中的部分或全部可以由透明材料制成。在本实施例的一些具体实施方案中,所述流体阻挡部可以整体由透明材料制成,例如光线射入。Wherein, in order to facilitate light penetration, part or all of the fluid blocking portion, the base body, and the convex portion may be made of a transparent material. In some embodiments of this embodiment, the fluid barrier may be made entirely of a transparent material, such as light.
其中,较为典型的光催化材料可以是二氧化钛等,但不限于此。Among them, a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
其中,为形成所述光催化材料层605,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。In order to form the photocatalytic material layer 605, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, Atomic layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述光催化材料层605的厚度可以被控制在纳米级,以尽量减少其对所述过滤芯片的流体通量的影响。Wherein, the thickness of the photocatalytic material layer 605 can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
该实施例中所采用的基体、微/纳米线/管阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
请参阅图15所示,较为优选的,在本申请的一优选实施例中,一种过滤芯片包括基体701,所述基体701具有第一表面7011和与该第一表面相背对的第三表7012面,且所述基体701上分布有若干作为流体通道的通孔704,所述第一表面上设置有多根竖直纳米柱703形成的阵列,环绕所述通孔704分布的多根纳米柱703的顶部还连接有流体阻挡部702,所述流体阻挡部702设置于所述通孔704的流体入口上方,使待处理的流体无法绕过前述的纳米柱阵列而直接进入所述通孔704。并且,在所述纳米柱703表面及所述基体701的第一表面上还设置有抗菌材料层705。在以包含抗菌材料层705的过滤芯片对流体进行处理时,可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等,实现对流体的多重净化。Referring to FIG. 15, it is preferable that in a preferred embodiment of the present application, a filter chip includes a base 701 having a first surface 7011 and a third opposite to the first surface. The surface of the substrate 701 is distributed with a plurality of through holes 704 as fluid passages, and the first surface is provided with an array of a plurality of vertical nano-pillars 703, and a plurality of distributed around the through-holes 704 The top of the nano-pillar 703 is also connected with a fluid blocking portion 702 disposed above the fluid inlet of the through-hole 704, so that the fluid to be treated cannot directly bypass the aforementioned array of nano-pillars and directly enter the through-hole. Hole 704. Further, an antibacterial material layer 705 is further disposed on the surface of the nano-pillar 703 and the first surface of the base 701. When the fluid is treated with the filter chip including the antimicrobial material layer 705, bacteria, viruses, and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
其中,较为典型的抗菌材料可以是诸如Au、Ag等贵金属等,但不限于此。Among them, the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
其中,为形成所述抗菌材料层705,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。 Wherein, in order to form the antibacterial material layer 705, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述抗菌材料层705的厚度可以被控制在纳米级,以尽量减少其对所述过滤芯片的流体通量的影响。Wherein, the thickness of the antimicrobial material layer 705 can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
该实施例中所采用的基体、微/纳米线/管阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structure, arrangement form, material, and the like of the substrate, the micro/nano wire/tube array, the fluid blocking portion, the through hole, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
本申请的所述过滤芯片可以通过物理、化学方法制备,例如可以是化学生长法、物理加工法等,特别是MEMS(微机电系统,Microelectromechanical Systems)法等。The filter chip of the present application can be prepared by physical or chemical methods, for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
例如,请参阅图16所示,在本申请的一优选实施例中,一种过滤芯片的制备工艺可以包括如下步骤:For example, referring to FIG. 16, in a preferred embodiment of the present application, a process for preparing a filter chip may include the following steps:
S1:在衬底(例如硅片)的一侧表面(定义为第一表面a)上设置图形化的光刻胶掩模;S1: providing a patterned photoresist mask on one side surface (defined as the first surface a) of the substrate (for example, a silicon wafer);
S2:对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的多根垂直纳米线,之后除去所述第一光刻胶掩模;S2: etching a first surface of the substrate to form a plurality of vertical nanowires spaced apart from each other on a first surface of the substrate, and then removing the first photoresist mask;
S3:在所述衬底的第一表面涂布可溶性或可腐蚀的有机物和/或无机物,并使有机物和/或无机物填充各垂直纳米线之间的间隙,形成牺牲层;S3: coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between the vertical nanowires with an organic substance and/or an inorganic substance to form a sacrificial layer;
S4:在所述牺牲层上设置光刻胶,并进行光刻;S4: disposing a photoresist on the sacrificial layer and performing photolithography;
S5:对所述牺牲层进行刻蚀,使分布在所述衬底的第一表面的第二区域中的多根垂直纳米线顶部暴露出,之后除去光刻胶;S5: etching the sacrificial layer to expose a plurality of vertical nanowires distributed in a second region of the first surface of the substrate, and then removing the photoresist;
S6:在所述衬底的第一表面设置光刻胶掩模,并使所述衬底第一表面上的、与所述流体阻挡部相对应的区域暴露出;S6: providing a photoresist mask on the first surface of the substrate, and exposing a region on the first surface of the substrate corresponding to the fluid blocking portion;
S7:在暴露出的、与所述流体阻挡部相对应的区域内沉积形成流体阻挡部;S7: depositing a fluid blocking portion in an exposed region corresponding to the fluid blocking portion;
S8:剥离除去光刻胶;S8: stripping and removing the photoresist;
S9:在所述衬底的第二表面上设置图形化的刻蚀掩模;S9: providing a patterned etch mask on the second surface of the substrate;
S10:对所述衬底的与第一表面相背对的另一侧表面(定义为第三表面b)进行刻蚀,直至露出填充在相邻垂直纳米线之间的牺牲材料,从而在所述衬底的第三表面形成槽孔,所述槽孔所在位置与所述衬底的第一表面的第一区域相对应,所述衬底的第一表面的第二区域环绕所述第一区域设置;S10: etching another side surface (defined as the third surface b) of the substrate opposite to the first surface until the sacrificial material filled between the adjacent vertical nanowires is exposed, thereby a third surface of the substrate forming a slot, the slot being located corresponding to a first area of the first surface of the substrate, the second area of the first surface of the substrate surrounding the first regional settings;
S11:除去所述刻蚀掩模及填充在各垂直纳米线之间的牺牲材料,制得过滤芯片。S11: removing the etching mask and the sacrificial material filled between the vertical nanowires to obtain a filter chip.
前述各步骤中采用的刻蚀方法可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,在前述步骤S1中,形成图形化(纳米图形)的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, in the foregoing step S1, the method of forming the patterned (nano-pattern) photoresist mask includes: photolithography technology, nano-spherical mask technology, nano (metal) particle mask technology, etc., and is not limited thereto. .
例如,在前述步骤S2中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学 腐蚀等刻蚀出垂直纳米线阵列。For example, in the aforementioned step S2, it can be by a method known in the art, such as RIE, ICP, wet etching, electrochemistry A vertical nanowire array is etched by etching or the like.
例如,在前述步骤S3中,填充的可溶性有机物可以是光刻胶等或可腐蚀无机物如金属、SiO2、氮化硅等。For example, in the foregoing step S3, the filled soluble organic matter may be a photoresist or the like or a corrodible inorganic substance such as metal, SiO 2 , silicon nitride or the like.
例如,在前述步骤S10中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等刻蚀出所述槽孔。For example, in the foregoing step S10, the slots may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
显然,本申请过滤芯片的制备工艺是简单可控的,适合批量化大规模生产。Obviously, the preparation process of the filter chip of the present application is simple and controllable, and is suitable for batch mass production.
请参阅图17所示,在本申请的一优选实施例中,一种过滤芯片的制备工艺可以包括如下步骤:Referring to FIG. 17, in a preferred embodiment of the present application, a process for preparing a filter chip may include the following steps:
S1:在衬底(例如硅片)的第一表面生长形成彼此间隔设置的多根竖直纳米线/管;S1: growing on a first surface of a substrate (eg, a silicon wafer) to form a plurality of vertical nanowires/tubes spaced apart from each other;
S2:在所述衬底的第一表面涂布可溶性或可腐蚀的有机物和/或无机物,并使有机物和/或无机物填充各竖直纳米线/管之间的间隙,形成牺牲层;S2: coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between each vertical nanowire/tube with an organic substance and/or an inorganic substance to form a sacrificial layer;
S3:在所述牺牲层上设置光刻胶,并进行光刻;S3: disposing a photoresist on the sacrificial layer and performing photolithography;
S4:对所述牺牲层进行刻蚀,使分布在所述衬底的第一表面的第二区域中的多根竖直纳米线顶部暴露出,之后除去光刻胶;S4: etching the sacrificial layer to expose a plurality of vertical nanowires distributed in a second region of the first surface of the substrate, and then removing the photoresist;
S5:在所述衬底的第一表面设置光刻胶掩模,并使所述衬底第一表面上的、与所述流体阻挡部相对应的区域暴露出;S5: providing a photoresist mask on the first surface of the substrate, and exposing a region on the first surface of the substrate corresponding to the fluid blocking portion;
S6:在暴露出的、与所述流体阻挡部相对应的区域内沉积形成流体阻挡部;S6: depositing a fluid blocking portion in an exposed region corresponding to the fluid blocking portion;
S7:剥离除去光刻胶;S7: stripping and removing the photoresist;
S8:在所述衬底的与第一表面相背对的第三表面上设置图形化的刻蚀掩模;S8: providing a patterned etch mask on the third surface of the substrate opposite to the first surface;
S9:对所述衬底的第三表面进行刻蚀,直至露出填充在相邻垂直纳米线之间的牺牲材料,从而在所述衬底的第三表面形成槽孔,所述槽孔所在位置与所述衬底的第一表面的第一区域相对应,所述衬底的第一表面的第二区域环绕所述第一区域设置;S9: etching a third surface of the substrate until a sacrificial material filled between adjacent vertical nanowires is exposed, thereby forming a slot on a third surface of the substrate, where the slot is located Corresponding to the first region of the first surface of the substrate, the second region of the first surface of the substrate is disposed around the first region;
S10:除去所述刻蚀掩模及填充在各垂直纳米线之间的牺牲材料,制得过滤芯片。S10: removing the etching mask and the sacrificial material filled between the vertical nanowires to prepare a filter chip.
前述步骤中用以生长形成竖直纳米线/管的方式可以选自MOCVD、PECVD、电化学沉积等业界已知的多种方式。The manner in which the vertical nanowires/tubes are grown to form in the foregoing steps may be selected from a variety of ways known in the art, such as MOCVD, PECVD, electrochemical deposition, and the like.
前述各步骤中采用的刻蚀方法可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,前述步骤中形成图形化(纳米图形)的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, the method of forming a patterned (nano-pattern) photoresist mask in the foregoing steps includes: a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
例如,在前述步骤中可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等对衬底进行刻蚀。 For example, the substrate may be etched in the foregoing steps by methods known in the art, such as RIE, ICP, wet etching, electrochemical etching, and the like.
例如,在前述步骤中,填充的可溶性有机物可以是光刻胶等或可腐蚀无机物如金属、SiO2、SiN等。For example, in the foregoing steps, the filled soluble organic matter may be a photoresist or the like or a corrodible inorganic substance such as metal, SiO 2 , SiN or the like.
请参阅图18所示,在本申请的一优选实施例中,一种过滤芯片包括基体801,所述基体801具有相背对的第一表面18011和第二表面8012,且所述基体801上的第一区域8013分布有若干作为流体通道的通孔804,所述第一表面的第二区域8014设置有多个微/纳米片803(微米片和/或纳米片)平行排布形成的阵列,环绕所述通孔804分布的多根微/纳米片803的顶部的局部区域与流体阻挡部802连接,所述流体阻挡部802设置于所述通孔804的流体入口上方,使待处理的流体无法绕过前述的微/纳米片阵列而直接进入所述通孔804。Referring to FIG. 18, in a preferred embodiment of the present application, a filter chip includes a base 801 having a first surface 18011 and a second surface 8012 opposite to each other, and the base 801 is The first region 8013 is distributed with a plurality of through holes 804 as fluid passages, and the second region 8014 of the first surface is provided with an array of a plurality of micro/nano sheets 803 (micro sheets and/or nano sheets) arranged in parallel a partial area of the top of the plurality of micro/nano sheets 803 distributed around the through holes 804 is connected to the fluid blocking portion 802, which is disposed above the fluid inlet of the through holes 804, to be processed The fluid cannot enter the through hole 804 directly bypassing the aforementioned array of micro/nanosheets.
其中,因前述微/纳米片微/纳米片具有较薄的厚度,使得这些微/纳米片微/纳米片可密集排布于所述基体的第一表面,通过调整这些微/纳米片的间距,即可形成具有选定尺寸的开口部的沟槽(可以称为微流道),实现对流体中不同粒径范围的颗粒进行清除处理,特别是,当采用的均是纳米片时,通过将这些纳米片之间的间距控制在纳米级,不仅可以去除流体中的极微小的颗粒,而且因纳米片自身厚度极小,还可使其对于流体的阻力被控制在很低的水平,并形成很大的流体通量(特别是纳米片具有较高的高度时),远远优于现有的多孔膜、基于横向流道的过滤芯片等。Wherein, because the micro/nanosheet micro/nanosheet has a relatively thin thickness, the micro/nanosheet micro/nanosheets can be densely arranged on the first surface of the substrate by adjusting the spacing of the micro/nanosheets. , a groove having an opening of a selected size (which may be referred to as a micro flow channel) is formed, and the particles of different particle size ranges in the fluid are removed, in particular, when the nanosheets are used, Controlling the spacing between these nanosheets at the nanometer level not only removes very small particles in the fluid, but also minimizes the thickness of the nanosheet itself, allowing its resistance to fluids to be kept at a very low level, and The formation of a large fluid flux (especially when the nanosheets have a high height) is far superior to existing porous membranes, lateral flow channel-based filter chips, and the like.
其中,所述基体801可以具有较大的厚度,使其对前述微/纳米片阵列形成较好的支撑,同时还可进一步增强所述过滤芯片的机械强度,使所述过滤芯片耐压、耐弯折、耐碰撞、耐冲击,进而使其可以在多种环境中应用而不致损坏,例如可以应用于对高压、高速流体进行处理,这一功能是现有的多孔膜等无法企及的。Wherein, the base body 801 can have a large thickness, so that it can form a good support for the micro/nano-array array, and can further enhance the mechanical strength of the filter chip, so that the filter chip can withstand pressure and resistance. Bending, impact resistance, impact resistance, and thus can be applied in a variety of environments without damage, for example, can be applied to the treatment of high pressure, high speed fluid, this function is unmatched by existing porous membranes.
其中,所述过滤芯片各部分(801、802、803、804)的材料选择范围是多样的,可以是无机材料,也可以是有机材料,例如金属、非金属无机材料、塑料、陶瓷、半导体、玻璃、聚合物等。当这些部分都选择使用无机材料时,所述过滤芯片还具有耐温度变化的特性,可以处理高温和低温流体。The material selection range of each part (801, 802, 803, 804) of the filter chip is various, and may be an inorganic material or an organic material, such as a metal, a non-metallic inorganic material, a plastic, a ceramic, a semiconductor, or the like. Glass, polymer, etc. When these parts are all selected to use inorganic materials, the filter chip also has temperature-resistant characteristics and can handle high temperature and low temperature fluids.
其中,所述流体阻挡部可以是片状的,其厚度等可依据实际应用需求而调整。Wherein, the fluid blocking portion may be in the form of a sheet, and the thickness and the like may be adjusted according to actual application requirements.
进一步的,在本实施例中,于通孔周围还可对称或不对称的设置一个以上的支撑体,藉由所述支撑体还可增加对所述流体阻挡部的支撑,实现流体阻挡部与基体之间更为牢固稳定的配合,并可有效的对分布在流体阻挡部与基体之间的微/纳米片阵列形成保护,避免因流体阻挡部和/或基体在受到外力作用后,对前述微/纳米片阵列挤压而造成的微/纳米片坍塌、损毁等问题。Further, in this embodiment, more than one support body may be symmetrically or asymmetrically disposed around the through hole, and the support body may further increase the support of the fluid blocking portion to realize the fluid blocking portion and A more stable and stable fit between the substrates, and an effective protection of the micro/nano-array array distributed between the fluid blocking portion and the substrate, avoiding the aforementioned action of the fluid blocking portion and/or the substrate after being subjected to an external force Micro/nano-sheet collapse and damage caused by micro/nano-slice array extrusion.
其中,所述支撑体可以是多种形态的,例如可以具有矩形、梯形、台阶形截面等等,且 不限于此。在该实施例的一些具体实施方案中,所述支撑体可以为自所述通孔边缘部向上突出形成的凸台等,其上端顶撑连接所述流体阻挡部。Wherein, the support body may be in various forms, for example, may have a rectangular shape, a trapezoidal shape, a stepped cross section, or the like, and Not limited to this. In some embodiments of the embodiment, the support body may be a boss or the like formed to protrude upward from the edge portion of the through hole, and an upper end of the support is connected to the fluid blocking portion.
其中,所述支撑体的数量、直径、分布密度等可根据实际需要而调整,但应尽量少的占用所述基体第一表面的空间,避免其对所述微/纳米片阵列的流体通量造成大的影响。Wherein, the number, diameter, distribution density and the like of the support body can be adjusted according to actual needs, but the space of the first surface of the base body should be occupied as little as possible, and the fluid flux to the micro/nano piece array should be avoided. Cause a big impact.
采用前述设计的过滤芯片可以(超声)清洗,多次使用,且仍旧保持良好的流体处理能力。Filter chips using the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
当利用所述的过滤芯片对流体进行处理时,含有杂质颗粒的流体在进入前述微/纳米片阵列时,其中粒径大于一定数值的颗粒(或一些与流体不相容的液滴,例如空气中的水滴或油中的水滴)被阻挡在前述微/纳米片阵列之外,之后流体经由各微/纳米片之间的沟槽到达通孔104的入口处后再进入通孔104,实现对流体的净化和/或者对所需颗粒(液滴)的富集回收。When the fluid is processed by the filter chip, the fluid containing the impurity particles enters the micro/nano-array array, wherein particles having a particle diameter larger than a certain value (or some fluid-incompatible droplets such as air) The water droplets in the water or the water droplets in the oil are blocked outside the array of micro/nano-sheets, after which the fluid reaches the entrance of the through-hole 104 via the trench between the micro/nano-chips and then enters the through-hole 104, thereby achieving Purification of the fluid and/or enrichment recovery of the desired particles (droplets).
请再次参阅图18-图19所示,在该实施例的一些具体应用方案中,前述微/纳米片的厚度可以为1nm~50μm,高度可以为50nm~200μm,相邻微/纳米片之间的沟槽宽度可以为1nm~50μm。所述通孔804的孔径可以为1μm~1mm。所述基体的厚度可以在1μm以上。所述流体阻挡部的厚度可以为0.5μm~200μm。Referring to FIG. 18 to FIG. 19 again, in some specific applications of the embodiment, the micro/nano piece may have a thickness of 1 nm to 50 μm and a height of 50 nm to 200 μm between adjacent micro/nano sheets. The groove width may be from 1 nm to 50 μm. The through hole 804 may have a diameter of 1 μm to 1 mm. The thickness of the substrate may be 1 μm or more. The fluid blocking portion may have a thickness of 0.5 μm to 200 μm.
形成于相邻微/纳米片之前的沟槽的截面可以是规则或不规则形状的,例如可以是多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等。The cross section of the trench formed before the adjacent micro/nanosheets may be regular or irregular, such as polygonal (triangle, quadrilateral or other), circular, elliptical, star, and the like.
前述微/纳米片可以规则或不规则、均匀或非均匀的分布在所述基体的第一表面上。The aforementioned micro/nanosheets may be distributed regularly or irregularly, uniformly or non-uniformly on the first surface of the substrate.
另外,在该实施例中,前述通孔804和流体阻挡部802的形状(特别是纵向或横向截面的形状)可以是多样的,例如可以是圆形、正方形、长方形或其它形状。Further, in this embodiment, the shape of the aforementioned through hole 804 and the fluid blocking portion 802 (especially the shape of the longitudinal or lateral cross section) may be various, and may be, for example, a circle, a square, a rectangle, or the like.
请参阅图20所示,较为优选的,在本申请的一优选实施例中,一种过滤芯片包括基体901,所述基体901具有相背对的第一表面和第二表面,且所述基体901上分布有若干作为流体通道的通孔904,所述第一表面上设置有多片沿横向连续延伸的微/纳米片903形成的阵列,其中微/纳米片之间形成有可供流体通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,其中,有多个微/纳米片直接从所述通孔904上通过,从而使这些微/纳米片与基体之间配合形成与通孔904连通的流体通道,且待处理的流体仅能通过该流体通道进入通孔904。Referring to FIG. 20, preferably, in a preferred embodiment of the present application, a filter chip includes a base 901 having opposite first and second surfaces, and the base A plurality of through holes 904 as fluid passages are disposed on the 901, and the first surface is provided with a plurality of arrays of micro/nano sheets 903 extending continuously in the lateral direction, wherein the micro/nano sheets are formed with fluids for passage therethrough. a groove having an opening having a diameter greater than 0 but smaller than a particle size of selected particles mixed in the fluid to be treated, wherein a plurality of micro/nano plates are directly passed through the through hole 904 Thus, the micro/nanosheets are mated with the substrate to form a fluid passage that communicates with the through holes 904, and the fluid to be treated can only enter the through holes 904 through the fluid passages.
进一步的,在该实施例中,还可于微/纳米片阵列上连接流体阻挡部902,所述流体阻挡部902设置于所述通孔904的流体入口上方,使待处理的流体无法绕过前述的微/纳米片阵列而直接进入所述通孔904。Further, in this embodiment, the fluid blocking portion 902 can also be connected to the micro/nano-sheet array. The fluid blocking portion 902 is disposed above the fluid inlet of the through-hole 904, so that the fluid to be processed cannot be bypassed. The aforementioned micro/nanochip array directly enters the through hole 904.
进一步的,在通孔904周围也可设置一个或若干支撑体。 Further, one or several supports may also be disposed around the through holes 904.
该实施例中所采用的基体、微/纳米片阵列、流体阻挡部、通孔、支撑体等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structures, arrangement forms, materials, and the like of the substrate, the micro/nano-sheet array, the fluid barrier, the through-hole, the support, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
在本申请的该实施例中,所述过滤芯片可具有与前述实施例相类似的结构,不同之处在于,在通孔上还可架设有一根以上的,例如对称或不对称排布的多根支撑梁,藉由所述支撑梁还可增加对所述流体阻挡部的支撑,实现流体阻挡部与基体之间更为牢固稳定的配合,并可有效的对分布在流体阻挡部与基体之间的微/纳米片阵列形成保护,避免因流体阻挡部和/或基体在受到外力作用后,对前述微/纳米线阵列挤压而造成的微/纳米片坍塌、损毁等问题。In this embodiment of the present application, the filter chip may have a structure similar to that of the foregoing embodiment, except that more than one, for example, symmetric or asymmetric arrangement may be disposed on the through hole. The support beam can also increase the support of the fluid blocking portion by the support beam, thereby achieving a more stable and stable cooperation between the fluid blocking portion and the base body, and can be effectively distributed to the fluid blocking portion and the base body. The inter-micro/nano-sheet array is protected from problems such as collapse/damage of the micro/nano-sheet due to extrusion of the micro/nanowire array by the fluid barrier and/or the substrate after being subjected to an external force.
其中,所述支撑梁可以是多种形态的,例如可以拱桥形等,且不限于此。且进一步的,所述支撑梁还可与其它支撑体配合,例如前述实施例中述及的支撑体配合。The support beam may be in various forms, such as an arch bridge shape, etc., and is not limited thereto. Further, the support beam can also cooperate with other support bodies, such as the support body described in the foregoing embodiments.
其中,所述支撑梁的数量、尺寸、分布密度等可根据实际需要而调整,但应尽量少的遮挡所述通孔的流体入口,避免其对所述过滤芯片的流体通量造成大的影响。Wherein, the number, size, distribution density and the like of the support beam can be adjusted according to actual needs, but the fluid inlet of the through hole should be blocked as little as possible to avoid a large influence on the fluid flux of the filter chip. .
该实施例中所采用的基体、微/纳米线阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
请参阅图21所示,在本申请的一优选实施例中,一种过滤芯片可以具有与前述实施例中任一者相似的结构,不同之处在于:在纳米片1103表面及基体1101的第一表面上还设置有光催化材料层1105。在以包含光催化材料层1105的过滤芯片对流体进行处理时,若辅以紫外光照等,还可对流体中的一些有机污染物等进行光催化降解,实现对流体的多重净化。Referring to FIG. 21, in a preferred embodiment of the present application, a filter chip may have a structure similar to any of the foregoing embodiments, except that the surface of the nanosheet 1103 and the substrate 1101 are A photocatalytic material layer 1105 is also disposed on a surface. When the fluid is treated by the filter chip including the photocatalytic material layer 1105, if it is supplemented with ultraviolet light or the like, some organic pollutants in the fluid may be photocatalyzed to achieve multiple purification of the fluid.
其中,为利于光线透入,所述流体阻挡部1102、基体、凸起部中的部分或全部可以由透明材料制成。在本实施例的一些具体实施方案中,所述流体阻挡部可以整体由透明材料制成,例如光线射入。Wherein, in order to facilitate light penetration, part or all of the fluid blocking portion 1102, the base body, and the convex portion may be made of a transparent material. In some embodiments of this embodiment, the fluid barrier may be made entirely of a transparent material, such as light.
其中,较为典型的光催化材料可以是二氧化钛等,但不限于此。Among them, a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
其中,为形成所述光催化材料层1105,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。In order to form the photocatalytic material layer 1105, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, Atomic layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述光催化材料层1105的厚度可以被控制在纳米级,以尽量减少其对所述过滤芯片的流体通量的影响。Wherein, the thickness of the photocatalytic material layer 1105 can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
该实施例中所采用的基体、微/纳米线阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
请参阅图22所示,较为优选的,在本申请的一优选实施例中,一种过滤芯片可以具有与前述实施例中任一者相似的结构,不同之处在于:在纳米片1203表面及基体1201的第一表 面上还设置有抗菌材料层1205。在以包含抗菌材料层1205的过滤芯片对流体进行处理时,可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等,实现对流体的多重净化。Referring to FIG. 22, preferably, in a preferred embodiment of the present application, a filter chip may have a structure similar to any of the foregoing embodiments, except that the surface of the nanosheet 1203 and First table of the base 1201 An antibacterial material layer 1205 is also disposed on the surface. When the fluid is treated with the filter chip including the antimicrobial material layer 1205, bacteria, viruses, and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
其中,较为典型的抗菌材料可以是诸如Au、Ag等贵金属等,但不限于此。Among them, the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
其中,为形成所述抗菌材料层1205,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the antibacterial material layer 1205, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述抗菌材料层1205的厚度可以被控制在纳米级,以尽量减少其对所述过滤芯片的流体通量的影响。Wherein, the thickness of the antibacterial material layer 1205 can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
该实施例中所采用的基体、微/纳米线阵列、流体阻挡部、通孔等的结构、设置形式、材质等可与前文述及的相同或相似,故而此处不再赘述。The structures, arrangement forms, materials, and the like of the substrate, the micro/nanowire array, the fluid barrier, the through holes, and the like used in this embodiment may be the same as or similar to those described above, and thus will not be described herein.
本申请的所述过滤芯片可以通过物理、化学方法制备,例如可以是化学生长法、物理加工法等,特别是MEMS(微机电系统,Microelectromechanical Systems)法等。The filter chip of the present application can be prepared by physical or chemical methods, for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
在本申请的一优选实施例中,一种过滤芯片的制备工艺可以包括如下步骤:In a preferred embodiment of the present application, a preparation process of a filter chip may include the following steps:
S1:在衬底(例如硅片)的一侧表面(命名为第一表面)上设置图形化的光刻胶掩模;S1: providing a patterned photoresist mask on one side surface (designated as the first surface) of the substrate (for example, a silicon wafer);
S2:对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的多个沿横向延伸的垂直纳米片,之后除去所述第一光刻胶掩模;S2: etching a first surface of the substrate to form a plurality of laterally extending vertical nanosheets spaced apart from each other on the first surface of the substrate, and then removing the first photoresist mask mold;
S3:在所述衬底的第一表面涂布可溶性或可腐蚀的有机物和/或无机物,并使有机物和/或无机物填充各垂直纳米片之间的沟槽,形成牺牲层;S3: coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the groove between the vertical nanosheets with an organic substance and/or an inorganic substance to form a sacrificial layer;
S4:在所述牺牲层上设置光刻胶,并进行光刻;S4: disposing a photoresist on the sacrificial layer and performing photolithography;
S5:对所述牺牲层进行刻蚀,使分布在所述衬底的第一表面的第二区域中的多根垂直纳米片顶部暴露出,之后除去光刻胶;S5: etching the sacrificial layer to expose a plurality of vertical nanosheets distributed in a second region of the first surface of the substrate, and then removing the photoresist;
S6:在所述衬底的第一表面设置光刻胶掩模,并使所述衬底第一表面上的、与所述流体阻挡部相对应的区域暴露出;S6: providing a photoresist mask on the first surface of the substrate, and exposing a region on the first surface of the substrate corresponding to the fluid blocking portion;
S7:在暴露出的、与所述流体阻挡部相对应的区域内沉积形成流体阻挡部,再剥离除去光刻胶;S7: depositing a fluid blocking portion in the exposed region corresponding to the fluid blocking portion, and stripping and removing the photoresist;
S8:在所述衬底的与第一表面相背对的另一侧表面(命名为第三表面)上设置图形化的刻蚀掩模,再对所述衬底的该另一侧表面进行刻蚀,直至露出填充在相邻垂直纳米片之间的牺牲材料,从而在所述衬底的该另一侧表面形成槽孔,所述槽孔所在位置与所述衬底的第一表面的第一区域相对应,所述衬底的第一表面的第二区域环绕所述第一区域设置;S8: providing a patterned etch mask on the other side surface of the substrate opposite to the first surface (designated as the third surface), and then performing the other side surface of the substrate Etching until a sacrificial material filled between adjacent vertical nanosheets is exposed, thereby forming a slot in the other side surface of the substrate, the slot being located at a position opposite to the first surface of the substrate Corresponding to the first region, a second region of the first surface of the substrate is disposed around the first region;
S9:除去所述刻蚀掩模及填充在各垂直纳米片之间的牺牲材料,制得过滤芯片。 S9: removing the etching mask and the sacrificial material filled between the vertical nanosheets to prepare a filter chip.
前述各步骤中采用的刻蚀方法可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,在前述步骤S1中,形成图形化(纳米图形)的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, in the foregoing step S1, the method of forming the patterned (nano-pattern) photoresist mask includes: photolithography technology, nano-spherical mask technology, nano (metal) particle mask technology, etc., and is not limited thereto. .
例如,在前述步骤S2中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等刻蚀出垂直纳米片阵列。For example, in the foregoing step S2, the vertical nanochip array can be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
例如,在前述步骤S3中,填充的可溶性有机物可以是光刻胶等或可腐蚀无机物如金属、SiO2、SiN等。For example, in the foregoing step S3, the filled soluble organic matter may be a photoresist or the like or a corrosive inorganic substance such as metal, SiO 2 , SiN or the like.
例如,在前述步骤S8中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等刻蚀出所述槽孔。For example, in the foregoing step S8, the slots may be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
请参阅图23所示,在本申请的一优选实施例中,一种过滤芯片主要用以对混杂有选定颗粒的流体进行处理,其包括基体1300,所述基体1300具有相背对的第一表面1301和第二表面1302,且所述基体1300上分布有若干作为流体通道的通孔1303。在任一通孔1303内分布有若干微/纳米线/管1400(即微米线、微米管、纳米线、纳米管中的任一种或多种),尤其是纳米线/管(纳米线和/或纳米管)。所述微/纳米线/管1400一端固定于所述通孔1303的孔壁上,另一端沿所述通孔的径向延伸。这些微/纳米线/管2以相互交叉的形式聚集成为多孔结构。所述多孔结构内孔洞的直径大于0但小于所述选定颗粒的粒径。Referring to FIG. 23, in a preferred embodiment of the present application, a filter chip is mainly used for processing a fluid mixed with selected particles, and includes a base 1300 having opposite phases. A surface 1301 and a second surface 1302, and a plurality of through holes 1303 as fluid passages are distributed on the base 1300. A plurality of micro/nano wires/tubes 1400 (ie, any one or more of microwires, microtubes, nanowires, nanotubes), in particular nanowires/tubes (nanowires and/or), are distributed within any of the vias 1303 nanotube). One end of the micro/nano wire/tube 1400 is fixed to the hole wall of the through hole 1303, and the other end extends in the radial direction of the through hole. These micro/nano wires/tubes 2 are aggregated into a porous structure in a mutually intersecting form. The pores within the porous structure have a diameter greater than zero but less than the particle size of the selected particles.
再请参阅图24,所述多孔结构以俯视的视角观察为分布于所述通孔1303内的网格结构。Referring to FIG. 24 again, the porous structure is a grid structure distributed in the through hole 1303 as viewed from a plan view.
其中,因前述微/纳米线/管1400具有较大的高径比(或者长径比),使得这些微/纳米线/管1400可密集排布于所述通孔内,而通过调整这些微/纳米线/管1400的分布密度、长度等,即可对流体1500中不同粒径范围的颗粒进行清除处理,特别是,当采用的均是纳米线/管时,通过将这些纳米线/管交叉形成的孔洞孔径控制在纳米级,不仅可以去除流体中的极微小的颗粒,而且因纳米线/管自身直径极小,还可使其对于流体的阻力被控制在很低的水平,并形成很大的流体通量,远远优于现有的多孔膜、基于横向流道的过滤芯片等。Wherein, since the micro/nano wires/tubes 1400 have a large aspect ratio (or aspect ratio), the micro/nano wires/tubes 1400 can be densely arranged in the through holes, and by adjusting the micro The distribution density, length, etc. of the nanowire/tube 1400 can be used to remove particles of different particle size ranges in the fluid 1500, in particular, when the nanowires/tubes are used, by using these nanowires/tubes The pores formed by the cross-section are controlled at the nanometer level, which not only removes very small particles in the fluid, but also minimizes the diameter of the nanowire/tube itself, and also controls the resistance to fluid at a very low level. The large fluid flux is far superior to existing porous membranes, lateral flow channel based filter chips, and the like.
其中,所述基体1300可以具有较大的厚度,籍以进一步增强所述过滤芯片的机械强度,使所述过滤芯片耐压、耐弯折、耐碰撞、耐冲击,进而使其可以在多种环境中应用而不致损坏,例如可以应用于对高压、高速流体进行处理,这一功能是现有的多孔膜等无法企及的。Wherein, the base body 1300 can have a large thickness, thereby further enhancing the mechanical strength of the filter chip, so that the filter chip can withstand pressure, bending, collision, impact resistance, and thus can be used in various It can be applied to the environment without damage, for example, it can be applied to the treatment of high-pressure, high-speed fluids, which is unmatched by existing porous membranes.
特别是,因所述的微/纳米线/管1400均分布于所述通孔1303内,使得这些微/纳米线/管1400实际上受到基体1300的保护,进而,即使所述过滤芯片受到压力等,也不会使这些微/纳米线/管1400被损坏。In particular, since the micro/nano wires/tubes 1400 are all distributed in the through holes 1303, the micro/nano wires/tubes 1400 are actually protected by the substrate 1300, and further, even if the filter chip is under pressure Etc., these micro/nano wires/tubes 1400 are not damaged.
其中,所述过滤芯片各部分(1301、1302、1303)的材料选择范围是多样的,可以是无 机材料,也可以是有机材料,例如可以是金属、陶瓷、聚合物,等等。当这些部分都选择使用无机材料时,所述过滤芯片还具有耐温度变化的特性,可以处理高温和低温流体。Wherein, the material selection range of each part (1301, 1302, 1303) of the filter chip is diverse, and may be none The machine material may also be an organic material such as a metal, a ceramic, a polymer, or the like. When these parts are all selected to use inorganic materials, the filter chip also has temperature-resistant characteristics and can handle high temperature and low temperature fluids.
采用前述设计的过滤芯片可以(超声)清洗,多次使用,且仍旧保持良好的流体处理能力。Filter chips using the aforementioned design can be (ultrasonic) cleaned, used multiple times, and still maintain good fluid handling capabilities.
当利用所述的过滤芯片对流体进行处理时,含有杂质颗粒的流体在进入前述多孔结构时,其中粒径大于一定数值的颗粒(或一些与流体不相容的液滴,例如空气中的水滴或油中的水滴)被阻挡在前述多孔结构之外,之后流体从通孔1303中流出,实现对流体的净化和/或者对所需颗粒(液滴)的富集回收。When the fluid is processed by the filter chip, the fluid containing the impurity particles enters the porous structure, wherein the particles having a particle diameter larger than a certain value (or some droplets incompatible with the fluid, such as water droplets in the air) The water droplets in the oil are blocked outside the aforementioned porous structure, after which the fluid flows out of the through holes 1303 to effect purification of the fluid and/or enrichment recovery of the desired particles (droplets).
在该实施例的一些具体应用方案中,前述微/纳米线/管1400的直径可以为1nm~500μm。In some specific applications of this embodiment, the micro/nanowire/tube 1400 may have a diameter of 1 nm to 500 μm.
在该实施例的一些具体应用方案中,前述通孔1303的孔径可以为1μm~1mm。In some specific applications of the embodiment, the through hole 1303 may have a diameter of 1 μm to 1 mm.
在该实施例的一些具体应用方案中,前述基体的厚度可以在1μm以上。In some specific applications of this embodiment, the thickness of the aforementioned substrate may be 1 μm or more.
前述纳米线的横向截面结构可以是规则或不规则形状的,例如可以是多边形(三角形、四边形或其它)、圆形、椭圆形、星形等等。The transverse cross-sectional structure of the aforementioned nanowires may be regular or irregular, and may be, for example, a polygon (triangle, quadrilateral or other), a circle, an ellipse, a star, or the like.
前述微/纳米线/管1400可以规则或不规则、均匀或非均匀的分布在所述通孔1303内。The aforementioned micro/nano wires/tubes 1400 may be distributed within the through holes 1303 regularly or irregularly, uniformly or non-uniformly.
前述的微/纳米线/管1400可以优选自碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线等,且不限于此。The aforementioned micro/nanowire/tube 1400 may preferably be selected from carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, Au nanowires, and the like, without being limited thereto.
前述微/纳米线/管1400可以通过外界转移、原位生长(例如化学生长、电化学生长)或沉积(例如物理、化学气相沉积,电沉积)等方式于所述通孔1303内壁上原位生长形成。The aforementioned micro/nanowire/tube 1400 may be in situ on the inner wall of the through hole 1303 by external transfer, in-situ growth (for example, chemical growth, electrochemical growth) or deposition (for example, physical, chemical vapor deposition, electrodeposition) or the like. Growth formation.
前述通孔1303的形状(特别是横向截面的形状)可以是多样的,例如可以是圆形、正方形、长方形、菱形、多边形或其它规则或不规则形状。The shape of the aforementioned through hole 1303 (particularly the shape of the transverse cross section) may be various, and may be, for example, a circle, a square, a rectangle, a diamond, a polygon, or other regular or irregular shape.
在该实施例的一些具体应用方案中,前述微/纳米线/管1400可以由光催化材料或具有抗菌、杀菌功能的材料形成,或者,前述微/纳米线/管1400也可以是表面覆盖有光催化材料或具有杀菌、抗菌功能的材料形成的涂层。In some specific applications of the embodiment, the micro/nanowire/tube 1400 may be formed of a photocatalytic material or a material having an antibacterial or bactericidal function, or the micro/nanowire/tube 1400 may also be covered with a surface. A coating formed of a photocatalytic material or a material having a bactericidal or antibacterial function.
例如,前述微/纳米线/管1400可采用ZnO纳米线、GaN纳米线、TiO2纳米线等具有光催化的性质的纳米线,在光辅助照射下,能够降解流体中的有机物。For example, the micro/nanowire/tube 1400 may employ nanowires having photocatalytic properties such as ZnO nanowires, GaN nanowires, and TiO2 nanowires, and can degrade organic substances in the fluid under light-assisted illumination.
例如,前述微/纳米线/管1400可采用Ag纳米线、Au纳米线等,以杀灭流体中的细菌、病毒、微生物。For example, the aforementioned micro/nanowire/tube 1400 may employ Ag nanowires, Au nanowires, or the like to kill bacteria, viruses, and microorganisms in the fluid.
在该实施例的一些具体应用方案中,所述基体1300的表面,特别是其第一表面1301上还可设置有光催化材料层或抗菌材料层等。In some specific applications of the embodiment, the surface of the substrate 1300, particularly the first surface 1301 thereof, may also be provided with a layer of photocatalytic material or a layer of antibacterial material or the like.
在以包含光催化材料层的过滤芯片对流体进行处理时,若辅以紫外光照等,还可对流体 中的一些有机污染物等进行光催化降解,实现对流体的多重净化。When the fluid is treated with a filter chip containing a layer of a photocatalytic material, if it is supplemented with ultraviolet light or the like, the fluid may be Some organic pollutants in the process are photocatalyticly degraded to achieve multiple purification of the fluid.
其中,为利于光线透入,所述过滤芯片中的的部分组件或全部均可以由透明材料制成。Wherein, in order to facilitate light penetration, some or all of the components in the filter chip may be made of a transparent material.
其中,较为典型的光催化材料可以是二氧化钛等,但不限于此。Among them, a typical photocatalytic material may be titanium dioxide or the like, but is not limited thereto.
其中,为形成所述光催化材料层,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the photocatalytic material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atom). Layer deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述光催化材料层的厚度可以被控制在纳米级,以尽量减少其对所述过滤芯片的流体通量的影响。Wherein, the thickness of the photocatalytic material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
而在以包含抗菌材料层的过滤芯片对流体进行处理时,可以在流体的处理过程中,同步灭杀流体中的细菌、病毒等,实现对流体的多重净化。When the fluid is processed by the filter chip containing the antibacterial material layer, bacteria, viruses and the like in the fluid can be synchronously killed during the processing of the fluid to achieve multiple purification of the fluid.
其中,较为典型的抗菌材料可以是诸如Au、Ag等贵金属等,但不限于此。Among them, the more typical antibacterial material may be a noble metal such as Au or Ag, but is not limited thereto.
其中,为形成所述抗菌材料层,本领域技术人员可以采用业界已知的多种方式,例如涂布(旋涂、喷涂、印刷等)、物理或化学气相沉积(如MOCVD、PECVD、原子层沉积等)、溅射等等,且不限于此。Wherein, in order to form the antibacterial material layer, those skilled in the art can adopt various methods known in the art, such as coating (spin coating, spraying, printing, etc.), physical or chemical vapor deposition (such as MOCVD, PECVD, atomic layer). Deposition, etc.), sputtering, etc., and are not limited thereto.
其中,所述抗菌材料层的厚度可以被控制在纳米级,以尽量减少其对所述过滤芯片的流体通量的影响。Wherein, the thickness of the antimicrobial material layer can be controlled at the nanometer level to minimize its influence on the fluid flux of the filter chip.
作为该实施例的优选实施方案之一,也可以在所述基体的第一表面设置彼此间隔的多根竖立纳米线,这些纳米线可环绕作为流体通道的前述通孔设置。As one of the preferred embodiments of this embodiment, a plurality of erected nanowires spaced apart from each other may be disposed on the first surface of the substrate, and the nanowires may be disposed around the aforementioned through holes as fluid passages.
较为优选的,这些竖立纳米线的长径比为4:1~200000:1,相邻竖立纳米线之间的距离与所述竖立纳米线的长度的比值为1:4~1:200000。More preferably, the aspect ratio of the upright nanowires is 4:1 to 200000:1, and the ratio of the distance between adjacent vertical nanowires to the length of the vertical nanowires is 1:4 to 1:200,000.
通过采用这种结构和分布形态的竖立纳米线,可以使多个竖立纳米线可密集布置(凸起部自身在单位面积内所占比例少),利于对流体中的微小颗粒进行处理,同时还赋予所述过滤芯片较大的流体通量(竖立纳米线之间的孔隙较之竖立纳米线自身体积更大)。By adopting such a structure and a distributed shape of the erected nanowires, a plurality of erected nanowires can be densely arranged (the proportion of the bulge itself in a unit area is small), which facilitates processing of minute particles in the fluid while also The filter chip is given a larger fluid flux (the pores between the erected nanowires are larger than the erected nanowires themselves).
较为优选的,所述竖立纳米线可具有与前述微/纳米线/管1400相同的材质、尺寸、结构等。More preferably, the upright nanowires may have the same material, size, structure, etc. as the micro/nano wires/tubes 1400 described above.
特别是,若参考业界已知的方案,将前述的竖立纳米线的排布密度等进行合适的设计,使之形成纳米线阵列,还可使之形成超疏水结构、超疏油结构,不仅可以清除流体中的颗粒,且还可通过自清洁作用,使被阻挡的颗粒无法在所述过滤芯片表面积聚。In particular, if referring to a solution known in the art, the arrangement density of the above-mentioned erected nanowires and the like are appropriately designed to form a nanowire array, and a superhydrophobic structure and a super oleophobic structure can be formed. The particles in the fluid are removed and the blocked particles are also unable to accumulate on the surface of the filter chip by self-cleaning.
其中,因所述基体可以具有较大的厚度,使得前述竖立纳米线可获得较好的支撑。Wherein, since the substrate can have a large thickness, the aforementioned erected nanowires can obtain better support.
作为该实施例的优选实施方案之一,还可在前述的这些竖立纳米线上设置流体阻挡部, 该流体阻挡部可具有与所述基体的第一表面相对设置的表面(可命名其为第三表面),并且所述复数根竖立线形体一端固定设置于所述基体的第一表面,另一端与所述流体阻挡部的第三表面固定连接,其中相邻竖立线形体之间的距离大于0但小于所述选定颗粒的粒径。As one of the preferred embodiments of this embodiment, a fluid blocking portion may also be disposed on the aforementioned upright nanowires, The fluid blocking portion may have a surface (which may be named as a third surface) disposed opposite to the first surface of the base body, and one end of the plurality of upright linear bodies is fixedly disposed on the first surface of the base body, and the other end Attached to the third surface of the fluid barrier, wherein the distance between adjacent upright linear bodies is greater than zero but less than the particle size of the selected particles.
其中,所述流体阻挡部可以是多种形态的,例如可以为片状、薄壳状、矩形体状、多面体状等。The fluid blocking portion may have various forms, and may be, for example, a sheet shape, a thin shell shape, a rectangular shape, a polyhedral shape, or the like.
优选的,前述的这些竖立纳米线、流体阻挡部与基体之间配合形成一流体通道,待处理的流体仅可经由该流体通道进入分布于所述基体的第一表面的流体通道(通孔1303)的流体入口,实现对流体的第一次处理,之后再进入分布于基体上的流体通道内,并由前述微/纳米线/管1400的聚集体进行第二次处理,如此可以实现对流体的多重处理。Preferably, the foregoing erected nanowires, the fluid blocking portion and the base body cooperate to form a fluid passage through which the fluid to be treated can only enter the fluid passage distributed on the first surface of the base body (through hole 1303). The fluid inlet, the first treatment of the fluid, and then into the fluid channel distributed on the substrate, and the second treatment of the agglomerates of the micro/nano wires/tubes 1400, so that the fluid can be realized Multiple processing.
其中,通过对前述的这些竖立纳米线的间距进行一定的设计,使之与前述微/纳米线/管1400交叉形成的孔洞的孔径不同,特别是使对所述竖立纳米线之间的间距大于所述微/纳米线/管1400交叉形成的孔洞的孔径,还可实现对流体中不同大小颗粒的分级处理。Wherein, by spacing the spacing of the erected nanowires described above, the apertures formed by the intersection of the micro/nano wires/tubes 1400 are different, in particular, the spacing between the erected nanowires is greater than The pore size of the pores formed by the intersection of the micro/nanowire/tube 1400 can also achieve grading treatment of particles of different sizes in the fluid.
其中,所述流体阻挡部的设置形式亦可以为多样的,例如,其可以整体与所述基体间隔设置,亦可局部与所述基体连接,甚至在某些情况下,亦可是与所述基体被一体加工形成。The arrangement of the fluid blocking portion may also be various, for example, it may be integrally spaced from the substrate, or may be partially connected to the substrate, and in some cases, may be associated with the substrate. It is formed by integral processing.
其中,所述流体通道(通孔1303)的流体入口及多根竖立纳米线可分布在所述流体阻挡部于所述基体的第一表面的正投影内。Wherein, the fluid inlet of the fluid channel (through hole 1303) and the plurality of upright nanowires may be distributed within an orthographic projection of the fluid blocking portion on the first surface of the substrate.
前述流体阻挡部的形状可以是多样的,例如可以是圆形、正方形、长方形或其它形状。The shape of the aforementioned fluid blocking portion may be varied, and may be, for example, a circle, a square, a rectangle, or the like.
前述流体阻挡部的材质可以选自金属、非金属、有机材料、无机材料等,例如硅片、聚合物、陶瓷等,且不限于此。The material of the fluid blocking portion may be selected from a metal, a non-metal, an organic material, an inorganic material, or the like, such as a silicon wafer, a polymer, a ceramic, or the like, and is not limited thereto.
较为优选的,前述流体阻挡部表面亦可分布有前述光催化材料、杀菌材料等,或者,前述流体阻挡部表面亦可整体由前述光催化材料、杀菌材料等组成。Preferably, the surface of the fluid blocking portion may be distributed with the photocatalytic material, the sterilizing material, or the like, or the surface of the fluid blocking portion may be entirely composed of the photocatalytic material, the sterilizing material, or the like.
较为优选的,前述流体阻挡部亦可以具有局部透明结构,或整体是透明的,以例如光线射入。More preferably, the fluid blocking portion may have a partially transparent structure or be transparent as a whole, for example, by light.
本申请的所述过滤芯片可以通过物理、化学方法制备,例如可以是化学生长法、物理加工法等,特别是MEMS(微机电系统,Microelectromechanical Systems)法等。The filter chip of the present application can be prepared by physical or chemical methods, for example, a chemical growth method, a physical processing method, or the like, in particular, a MEMS (Micro Electromechanical Systems) method.
例如,请参阅图25所示,在本申请的一优选实施例中,一种过滤芯片的制备工艺可以包括如下步骤:For example, as shown in FIG. 25, in a preferred embodiment of the present application, a process for preparing a filter chip may include the following steps:
S1:在衬底(例如硅片)的第一表面设置图形化的光刻胶掩模,其包含光刻出微纳米尺度的线条;S1: providing a patterned photoresist mask on the first surface of the substrate (for example, a silicon wafer), which comprises lithographically patterning micro-nano scale lines;
S2:利用所述光刻胶掩模对所述衬底的第一表面进行刻蚀,从而形成贯穿所述衬底第一 表面和与该第一表面相背对的第二表面的若干通孔,用以作为流体通道;S2: etching a first surface of the substrate by using the photoresist mask to form a first through the substrate a plurality of through holes having a surface and a second surface opposite the first surface for acting as a fluid passage;
S3:在流体通道的内壁及所述衬底的第一表面上沉积用于微/纳米线/管生长的种子层;S3: depositing a seed layer for micro/nanowire/tube growth on an inner wall of the fluid channel and the first surface of the substrate;
S4:在所述种子层上生长形成多根微/纳米线/管,控制微/纳米线/管的生长条件,从而在所述衬底的第一表面生长形成彼此间隔的多根竖立微/纳米线/管,而在所述流体通道内生长形成沿径向延伸的若干微/纳米线/管,在所述流体通道内的多根微/纳米线/管彼此交叉,形成微纳米尺度的交叉网格;S4: growing a plurality of micro/nano wires/tubes on the seed layer to control the growth conditions of the micro/nano wires/tubes, thereby growing on the first surface of the substrate to form a plurality of erect micro/spaces spaced apart from each other a nanowire/tube that grows within the fluid channel to form a plurality of micro/nano wires/tubes extending in a radial direction, a plurality of micro/nano wires/tubes within the fluid channel intersecting each other to form a micro-nano scale Cross grid
S5:去除分布在所述衬底的第一表面的微/纳米线/管(也可保留);S5: removing micro/nano wires/tubes (also retained) distributed on the first surface of the substrate;
S6:划片、封装,制得过滤芯片。S6: dicing, encapsulating, and manufacturing a filter chip.
前述各步骤中采用的刻蚀方法可以是光刻、机械刻蚀、干法刻蚀、湿法刻蚀等。The etching method used in the foregoing steps may be photolithography, mechanical etching, dry etching, wet etching, or the like.
例如,在前述步骤中,形成图形化(纳米图形)的光刻胶掩模的方法包括:光刻技术、纳米小球掩膜技术、纳米(金属)颗粒掩膜技术等,且不限于此。For example, in the foregoing steps, the method of forming the patterned (nano-pattern) photoresist mask includes a photolithography technique, a nano-spherical mask technique, a nano (metal) particle mask technique, and the like, and is not limited thereto.
例如,在前述步骤中,可通过业界已知的方式,例如RIE、ICP、湿法腐蚀、电化学腐蚀等刻蚀出流体通道等。For example, in the foregoing steps, the fluid passage or the like can be etched by means known in the art, such as RIE, ICP, wet etching, electrochemical etching, or the like.
应当理解,上述实施例仅为说明本申请的技术构思及特点,其目的在于让熟悉此项技术的人士能够了解本申请的内容并据以实施,并不能以此限制本申请的保护范围。凡根据本申请精神实质所作的等效变化或修饰,都应涵盖在本申请的保护范围之内。 It should be understood that the above embodiments are merely illustrative of the technical concept and the features of the present application, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present application and to implement it, and the scope of the present application is not limited thereto. Equivalent changes or modifications made in accordance with the spirit of the present application are intended to be included within the scope of the present application.

Claims (71)

  1. 一种流体处理装置,其特征在于包括:A fluid treatment device characterized by comprising:
    具有流体通道的基体,以及,a substrate having a fluid passage, and,
    流体处理机构,用以在混杂有选定颗粒的待处理流体流经所述流体通道时或者流经所述流体通道前对所述待处理流体进行处理;a fluid treatment mechanism for treating the fluid to be treated when the fluid to be treated mixed with the selected particles flows through the fluid passage or before flowing through the fluid passage;
    所述流体处理机构分布于所述基体的第一表面或者所述流体通道内部,并具有流体处理微结构,所述流体处理微结构中用以流体通过的开口直径大于0但小于所述选定颗粒的粒径。The fluid processing mechanism is distributed on the first surface of the substrate or inside the fluid channel and has a fluid processing microstructure, wherein the diameter of the opening for fluid passage in the fluid processing microstructure is greater than 0 but less than the selected The particle size of the particles.
  2. 一种流体处理装置,其特征在于包括:A fluid treatment device characterized by comprising:
    具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面;a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
    彼此间隔设置的复数个凸起部,所述凸起部沿横向在所述基体的第一表面上连续延伸,下部固定设置于所述基体的第一表面,上部设有沿横向连续延伸的帽形结构,所述帽形结构的相背对的两侧部沿侧向外延,而相邻帽形结构之间形成有可供流体通过的开口部,所述开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,其中至少两个所述的凸起部分别与所述第一流体通道的流体入口的相背对的两侧相邻设置,以及至少一个所述的凸起部直接从所述第一流体通道的流体入口上通过,从而使复数个帽形结构、复数个凸起部与基体之间配合形成与所述第一流体通道连通的第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions spaced apart from each other, the protrusions extending continuously on the first surface of the base body in a lateral direction, a lower portion fixedly disposed on the first surface of the base body, and an upper portion having a cap extending continuously in the lateral direction a shape-shaped structure, the opposite sides of the hat-shaped structure are laterally extended, and an opening portion through which the fluid can pass is formed between the adjacent hat-shaped structures, and the diameter of the opening portion is greater than 0 but less than the mixed a particle size of the selected particles in the fluid to be treated, wherein at least two of the raised portions are respectively disposed adjacent to opposite sides of the fluid inlet of the first fluid passage, and at least one The raised portion passes directly from the fluid inlet of the first fluid passage, thereby engaging a plurality of hat-shaped structures, a plurality of projections and the base body to form a second fluid in communication with the first fluid passage The passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  3. 根据权利要求2所述的流体处理装置,其特征在于:至少两个所述的凸起部直接从所述第一流体通道的流体入口上通过。A fluid treatment device according to claim 2 wherein at least two of said projections pass directly through the fluid inlet of said first fluid passage.
  4. 根据权利要求2所述的流体处理装置,其特征在于:所述复数个凸起部平行分布在所述基体的第一表面上。The fluid processing apparatus according to claim 2, wherein said plurality of projections are distributed in parallel on the first surface of said base.
  5. 根据权利要求2所述的流体处理装置,其特征在于:所述帽形结构与凸起部一体设置;和/或,所述帽形结构具有倒梯形截面结构。The fluid treatment device according to claim 2, wherein said cap-shaped structure is integrally provided with the boss portion; and/or said cap-shaped structure has an inverted trapezoidal cross-sectional structure.
  6. 根据权利要求2-5中任一项所述的流体处理装置,其特征在于:形成于相邻帽形结构之间的开口部的口径为1nm~50μm;和/或,所述帽形结构的高度为50nm~200μm。The fluid processing apparatus according to any one of claims 2 to 5, wherein the opening formed between the adjacent hat-shaped structures has a diameter of 1 nm to 50 μm; and/or the hat-shaped structure The height is 50 nm to 200 μm.
  7. 根据权利要求2-5中任一项所述的流体处理装置,其特征在于:相邻凸起部之间的距离为0.1μm~100μm;和/或,所述凸起部的高度为0.1μm~400μm,宽度为0.1μm~100μm。The fluid processing apparatus according to any one of claims 2 to 5, wherein a distance between adjacent convex portions is 0.1 μm to 100 μm; and/or the height of the convex portion is 0.1 μm ~400 μm and a width of 0.1 μm to 100 μm.
  8. 根据权利要求2-5中任一项所述的流体处理装置,其特征在于:所述第一流体通道的 孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上。A fluid treatment device according to any one of claims 2 to 5, wherein said first fluid passage The pore diameter is 1 μm to 1 mm; and/or the thickness of the substrate is 1 μm or more.
  9. 根据权利要求2-5中任一项所述的流体处理装置,其特征在于:至少于所述凸起部、帽形结构和基体中的任一者的表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料;和/或,所述凸起部、帽形结构和基体中的至少一者的至少局部为透明结构。The fluid processing apparatus according to any one of claims 2 to 5, wherein a surface of at least one of the convex portion, the hat-shaped structure and the base body is further provided with a functional material layer, The material of the functional material layer comprises a photocatalytic material or an antimicrobial material; and/or at least a portion of at least one of the raised portion, the hat-shaped structure and the substrate is a transparent structure.
  10. 权利要求2-9中任一项所述流体处理装置的制备方法,其特征在于包括:A method of preparing a fluid processing apparatus according to any one of claims 2-9, comprising:
    提供具有第一表面和与第一表面相背对的第二表面的衬底;Providing a substrate having a first surface and a second surface opposite the first surface;
    在所述衬底的第一表面加工形成彼此间隔设置的复数个凸起部,所述凸起部沿横向在所述基体的第一表面上连续延伸,其下部固定设置于所述基体的第一表面;Forming, on a first surface of the substrate, a plurality of protrusions spaced apart from each other, the protrusions extending continuously on a first surface of the substrate in a lateral direction, and a lower portion of the substrate being fixedly disposed on the substrate a surface
    对所述衬底的第二表面进行加工,形成贯穿所述衬底的第一流体通道,并使所述第一流体通道的流体入口分布于所述衬底的第一表面,且使至少两个所述的凸起部分别与第一流体通道的流体入口的相背对的两侧相邻设置以及使至少一个所述的凸起部直接从所述第一流体通道的流体入口上通过;Processing a second surface of the substrate to form a first fluid passage through the substrate, and distributing a fluid inlet of the first fluid passage to a first surface of the substrate, and causing at least two The raised portions are respectively disposed adjacent to opposite sides of the fluid inlet of the first fluid passage and the at least one of the raised portions directly passes through the fluid inlet of the first fluid passage;
    在所述凸起部上部形成沿横向连续延伸的帽形结构,并使所述帽形结构的相背对的两侧部沿侧向外延,且使相邻帽形结构之间形成有可供流体通过的开口部,所述开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,从而在复数个帽形结构、复数个凸起部与衬底之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。Forming a hat-shaped structure continuously extending in a lateral direction at an upper portion of the convex portion, and laterally extending opposite sides of the opposite side of the hat-shaped structure, and forming an adjacent between the adjacent hat-shaped structures An opening through which the fluid passes, the opening having a diameter greater than 0 but smaller than the particle size of the selected particles mixed in the fluid to be treated, thereby cooperating between the plurality of cap structures, the plurality of projections and the substrate A second fluid passage is formed and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  11. 根据权利要求10所述的制备方法,其特征在于包括:The preparation method according to claim 10, comprising:
    在所述衬底的第一表面上设置图形化的第一掩模,再对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的复数个凸起部,之后除去所述第一掩模;Forming a patterned first mask on the first surface of the substrate, and etching the first surface of the substrate to form a plurality of spaced apart ones on the first surface of the substrate a raised portion, after which the first mask is removed;
    在所述衬底的第二表面上设置图形化的第二掩模,再对所述衬底的第二表面进行刻蚀,直至形成贯穿所述衬底的第一流体通道,再除去所述第二掩模;Forming a second mask on the second surface of the substrate, and etching the second surface of the substrate until a first fluid passage is formed through the substrate, and then removing the Second mask;
    至少选用蒸镀、沉积和生长中的任一种方式在所述复数个凸起部上部分别形成帽形结构,并使所述帽形结构的相背对的两侧部沿侧向外延,且使相邻帽形结构之间形成所述的开口部。Forming a hat-shaped structure on each of the plurality of protrusions at least one of evaporating, depositing, and growing, and laterally extending the opposite sides of the hat-shaped structure, and The opening portion is formed between adjacent hat-shaped structures.
  12. 一种流体处理装置,其特征在于包括:A fluid treatment device characterized by comprising:
    具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面;a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
    由复数根线形体相互交叉形成的多孔结构,用以与所述基体的第一表面配合形成第二流体通道,所述复数根线形体一端均与所述基体固定连接,所述多孔结构中孔洞的直径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,且待处理的流体仅能通过所述第二流体通 道进入第一流体通道。a porous structure formed by intersecting a plurality of linear bodies to form a second fluid passage with the first surface of the base body, wherein the plurality of linear bodies are fixedly connected to the base body at one end, and the porous structure has a hole a diameter greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, and the fluid to be treated can only pass through the second fluid The road enters the first fluid passage.
  13. 根据权利要求12所述的流体处理装置,其特征在于:所述复数根线形体的一端均与所述基体的第一表面固定连接,并环绕分布于所述第一流体通道的流体入口周围;和/或,所述的流体处理装置还包括彼此间隔设置的复数个凸起部,所述凸起部固定设置在所述基体的第一表面上,并沿横向在所述基体的第一表面上连续延伸,其中至少两个凸起部分别与所述第一流体通道的流体入口的相背对的两侧相邻设置,至少一个凸起部直接从所述第一流体通道的流体入口上通过,所述凸起部上固定连接有两根以上所述的线形体。The fluid processing apparatus according to claim 12, wherein one end of said plurality of linear bodies is fixedly coupled to said first surface of said base body and distributed around said fluid inlet of said first fluid passage; And/or, the fluid processing apparatus further includes a plurality of protrusions spaced apart from each other, the protrusions being fixedly disposed on the first surface of the base body and laterally on the first surface of the base body Continuously extending upwardly, wherein at least two convex portions are respectively disposed adjacent to opposite sides of the fluid inlet of the first fluid passage, and at least one convex portion is directly from the fluid inlet of the first fluid passage Two or more linear bodies are fixedly connected to the convex portion.
  14. 根据权利要求13所述的流体处理装置,其特征在于:连接在一凸起部上的复数根线形体和连接在与该凸起部相邻的另一凸起部上的复数根线形体相互交叉;和/或,所述复数个凸起部平行分布在所述基体的第一表面上;和/或,所述凸起部的形状包括长条状或片状;和/或,所述的复数个凸起部均匀分布或非均匀分布在所述基体的第一表面上;和/或,所述凸起部的宽度为0.1μm~100μm,高度为0.1μm~400μm;和/或,相邻凸起部之间的距离为0.1μm~100μm。A fluid processing apparatus according to claim 13, wherein a plurality of linear bodies connected to a convex portion and a plurality of linear bodies connected to the other convex portion adjacent to said convex portion are mutually And/or, the plurality of raised portions are distributed in parallel on the first surface of the base; and/or the shape of the raised portion includes an elongated strip or a sheet; and/or The plurality of protrusions are evenly distributed or non-uniformly distributed on the first surface of the substrate; and/or the protrusions have a width of 0.1 μm to 100 μm and a height of 0.1 μm to 400 μm; and/or The distance between adjacent convex portions is from 0.1 μm to 100 μm.
  15. 根据权利要求13-14中任一项所述的流体处理装置,其特征在于:所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料;和/或,所述基体、所述复数根线形体、所述复数个凸起部中的至少一者的至少局部为透明结构。The fluid processing apparatus according to any one of claims 13 to 14, wherein the surface of the convex portion is further provided with a functional material layer, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material; Or at least a portion of the substrate, the plurality of linear bodies, and the plurality of raised portions are transparent structures.
  16. 根据权利要求12-14中任一项所述的流体处理装置,其特征在于:所述线形体的直径为1nm~50μm;和/或,其中任一线形体的一端和与该线形体相邻的另一线形体的一端之间的距离为1nm~50μm;和/或,所述线形体的长度为50nm~200μm;和/或,至少于所述线形体表面还分布有光催化材料或抗菌材料;和/或,所述基体和所述复数根线形体中的至少一者的至少局部为透明结构。The fluid processing apparatus according to any one of claims 12 to 14, wherein the linear body has a diameter of 1 nm to 50 μm; and/or one end of any linear body and adjacent to the linear body The distance between one end of the other linear body is 1 nm to 50 μm; and/or the length of the linear body is 50 nm to 200 μm; and/or at least the photocatalytic material or the antibacterial material is further distributed on the surface of the linear body; And/or at least a portion of at least one of the substrate and the plurality of linear bodies is a transparent structure.
  17. 根据权利要求12-14中任一项所述的流体处理装置,其特征在于:所述线形体为直线形。A fluid processing apparatus according to any one of claims 12 to 14, wherein the linear body is linear.
  18. 根据权利要求17所述的流体处理装置,其特征在于包括平行分布在所述基体的第一表面的复数根横梁,所述横梁沿横向在所述基体的第一表面连续延伸,其中至少两根横梁分别与所述第一流体通道的流体入口的相背对的两侧相邻设置,至少一根横梁直接从所述第一流体通道的流体入口上通过;以及,任一横梁上均分布有复数根线形体,该复数根线形体中的至少部分线形体的一端固定于所述横梁表面,另一端沿逐渐远离该任一横梁的方向斜向延伸和/或在平行于所述基体第一表面的面上连续延伸,并与分布在相邻于该任一横梁的另一横梁上的复数根线形体相互交叉,从而形成所述多孔结构。 A fluid treatment device according to claim 17, comprising a plurality of beams distributed in parallel on a first surface of said substrate, said beams extending continuously in a lateral direction on a first surface of said substrate, wherein at least two The beams are respectively disposed adjacent to opposite sides of the fluid inlet of the first fluid passage, at least one of the beams directly passing through the fluid inlet of the first fluid passage; and any of the beams are distributed a plurality of linear bodies, one end of at least a portion of the plurality of linear bodies being fixed to the surface of the beam, the other end extending obliquely away from the direction of the beam and/or first parallel to the substrate The surface of the surface extends continuously and intersects a plurality of linear bodies distributed on another beam adjacent to either of the beams to form the porous structure.
  19. 根据权利要求18所述的流体处理装置,其特征在于:至少两根横梁直接从所述第一流体通道的流体入口上通过。The fluid treatment device of claim 18 wherein at least two beams pass directly over the fluid inlet of said first fluid passage.
  20. 根据权利要求17所述的流体处理装置,其特征在于:所述线形体包括碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线中的任一种或两种以上的组合。The fluid processing apparatus according to claim 17, wherein the linear body comprises carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, and Au nanowires. Any one or a combination of two or more.
  21. 根据权利要求12所述的流体处理装置,其特征在于:所述第一流体通道的流体入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形;和/或,所述第一流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上。The fluid treatment device according to claim 12, wherein said fluid inlet of said first fluid passage has a regular or irregular shape, said regular shape comprising a polygon, a circle or an ellipse; and/or said The first fluid passage has a pore diameter of 1 μm to 1 mm; and/or the base has a thickness of 1 μm or more.
  22. 一种流体处理装置,其特征在于包括:A fluid treatment device characterized by comprising:
    具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面的第一区域内;a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
    流体阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理流体直接进入所述第一流体通道的流体入口;a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
    彼此间隔设置的复数个凸起部,所述凸起部一端固定设置于所述基体的第一表面的第二区域内,另一端与所述流体阻挡部的第二表面固定连接,其中相邻凸起部之间的距离大于0但小于混杂于待处理的流体内的选定颗粒的粒径,所述基体的第一表面的第二区域与第一区域邻接,从而使所述复数个凸起部、流体阻挡部与基体之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of raised portions spaced apart from each other, the convex portion is fixedly disposed at one end in a second region of the first surface of the base body, and the other end is fixedly connected to the second surface of the fluid blocking portion, wherein adjacent The distance between the raised portions is greater than zero but less than the particle size of the selected particles that are intermingled with the fluid to be treated, the second region of the first surface of the substrate being contiguous with the first region, such that the plurality of convexities The starting portion, the fluid blocking portion and the base body cooperate to form a second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  23. 根据权利要求22所述的流体处理装置,其特征在于:所述复数个凸起部环绕所述第一流体通道的流体入口设置;和/或,所述基体的第一表面的第三区域内亦间隔设置有复数个凸起部,所述第二区域设于所述第三区域和第一区域之间;和/或,所述基体的第一表面的第一区域及第二区域分布在所述流体阻挡部于所述基体的第一表面上的正投影内;和/或,所述流体处理装置还包括至少一个支撑体,所述支撑体一端与所述基体固定连接,另一端与所述流体阻挡部固定连接。A fluid treatment device according to claim 22, wherein said plurality of projections are disposed around a fluid inlet of said first fluid passage; and/or, in a third region of said first surface of said base Also disposed at intervals are a plurality of raised portions, the second region being disposed between the third region and the first region; and/or the first region and the second region of the first surface of the substrate are distributed The fluid blocking portion is within an orthographic projection on the first surface of the substrate; and/or the fluid processing device further includes at least one support body, the support body having one end fixedly connected to the base body and the other end being The fluid blocking portion is fixedly coupled.
  24. 根据权利要求23所述的流体处理装置,其特征在于:所述基体的第一表面的第三区域环绕所述第二区域设置;和/或,所述流体处理装置包括两个以上所述的支撑体,并且该两个以上所述的支撑体对称分布于所述第一流体通道的流体入口周围。A fluid treatment device according to claim 23, wherein a third region of the first surface of the substrate is disposed around the second region; and/or the fluid treatment device comprises two or more a support body, and the two or more support bodies are symmetrically distributed around the fluid inlet of the first fluid passage.
  25. 根据权利要求22所述的流体处理装置,其特征在于:所述第一流体通道的流体入口上架设有一根以上支撑梁,所述支撑梁与所述流体阻挡部固定连接;和/或,所述凸起部为站立设置的线状、柱状、片状、管状、锥状、锥台状结构中的任意一种;和/或,所述凸起部的 横向截面具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形;和/或,所述的复数个凸起部均匀分布或非均匀分布在所述基体的第一表面上;和/或,所述第一流体通道的流体入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形。The fluid processing apparatus according to claim 22, wherein: the fluid inlet of the first fluid passage is provided with one or more support beams, and the support beam is fixedly connected to the fluid blocking portion; and/or The raised portion is any one of a linear, columnar, sheet, tubular, tapered, and frustum-like structure that is standing upright; and/or the raised portion The transverse section has a regular or irregular shape, the regular shape includes a polygon, a circle or an ellipse; and/or the plurality of protrusions are evenly distributed or non-uniformly distributed on the first surface of the substrate; And/or, the fluid inlet of the first fluid channel has a regular or irregular shape, the regular shape comprising a polygon, a circle or an ellipse.
  26. 根据权利要求25所述的流体处理装置,其特征在于:所述凸起部为线状凸起,其长径比为4:1~200000:1;和/或,相邻凸起部之间的距离与所述凸起部的长度的比值为1:4~1:200000。The fluid processing apparatus according to claim 25, wherein said convex portion is a linear protrusion having an aspect ratio of 4:1 to 200000:1; and/or between adjacent convex portions The ratio of the distance to the length of the raised portion is 1:4 to 1:200,000.
  27. 根据权利要求26所述的流体处理装置,其特征在于:所述凸起部为竖立设置的微米线或纳米线,其直径为1nm~50μm,长度为50nm~200μm,相邻凸起部之间的距离为1nm~50μm。The fluid processing apparatus according to claim 26, wherein said convex portion is an upright microwire or nanowire having a diameter of 1 nm to 50 μm and a length of 50 nm to 200 μm between adjacent convex portions. The distance is 1 nm to 50 μm.
  28. 根据权利要求22或27所述的流体处理装置,其特征在于:分布于所述基体的第一表面的第三区域的复数个凸起部排布形成具有超疏水或超疏油性能的微米级或纳米级阵列结构。A fluid processing apparatus according to claim 22 or 27, wherein the plurality of projections distributed in the third region of the first surface of the substrate are arranged to form a micron-scale having superhydrophobic or superoleophobic properties. Or nanoscale array structure.
  29. 根据权利要求22所述的流体处理装置,其特征在于:所述第一流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上;和/或,所述流体阻挡部的厚度为0.5μm~200μm;和/或,所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料;和/或,所述流体处理装置中的至少部分组件的至少局部为透明结构。The fluid processing apparatus according to claim 22, wherein said first fluid passage has a pore diameter of from 1 μm to 1 mm; and/or said base has a thickness of 1 μm or more; and/or said fluid blocking portion a thickness of 0.5 μm to 200 μm; and/or the surface of the raised portion is further provided with a layer of functional material, the material of the functional material layer comprising a photocatalytic material or an antibacterial material; and/or, in the fluid processing device At least a portion of at least some of the components are transparent structures.
  30. 权利要求22-29中任一项所述流体处理装置的制备方法,其特征在于包括:A method of preparing a fluid processing apparatus according to any one of claims 22 to 29, comprising:
    提供具有第一表面和与第一表面相背对的第三表面的衬底;Providing a substrate having a first surface and a third surface opposite the first surface;
    对所述衬底的第一表面进行加工,从而在所述衬底的第一表面形成彼此间隔设置的复数个凸起部,或者,在所述衬底的第一表面生长形成彼此间隔设置的复数个凸起部,其中相邻凸起部之间的距离大于0但小于混杂于待处理的流体内的选定颗粒的粒径;Processing the first surface of the substrate to form a plurality of protrusions spaced apart from each other on the first surface of the substrate, or growing on the first surface of the substrate to form a space spaced apart from each other a plurality of raised portions, wherein a distance between adjacent raised portions is greater than zero but less than a particle size of selected particles mixed in the fluid to be treated;
    在所述衬底的第一表面上设置具有与所述衬底的第一表面相对设置的第二表面的流体阻挡部,并至少使分布在所述衬底的第一表面的第二区域内的复数个凸起部与所述流体阻挡部的第二表面固定连接;Providing a fluid barrier having a second surface disposed opposite the first surface of the substrate on a first surface of the substrate and at least distributed in a second region of the first surface of the substrate a plurality of protrusions fixedly connected to the second surface of the fluid blocking portion;
    对所述衬底的第三表面进行加工,形成贯穿所述衬底的第一流体通道,所述第一流体通道的流体入口分布于所述衬底的第一表面的第一区域内,所述衬底的第一表面的第二区域与第一区域邻接,使分布在所述衬底的第一表面的第二区域内的复数个凸起部、流体阻挡部与衬底之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。Processing a third surface of the substrate to form a first fluid passage through the substrate, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate, a second region of the first surface of the substrate abuts the first region to form a plurality of protrusions, a fluid barrier, and a substrate disposed in a second region of the first surface of the substrate The second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  31. 根据权利要求30所述的制备方法,其特征在于包括: The preparation method according to claim 30, comprising:
    在所述衬底的第一表面上设置图形化的第一光刻胶掩模,再对所述衬底的第一表面进行刻蚀,从而在所述衬底的第一表面形成彼此间隔设置的复数个凸起部,之后除去所述第一光刻胶掩模;Forming a patterned first photoresist mask on the first surface of the substrate, and etching the first surface of the substrate to form a space on the first surface of the substrate a plurality of raised portions, after which the first photoresist mask is removed;
    在所述衬底的第一表面涂布可溶性或可腐蚀的有机物和/或无机物,并使有机物和/或无机物填充所述复数个凸起部之间的间隙,形成牺牲层;Coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between the plurality of protrusions with an organic substance and/or an inorganic substance to form a sacrificial layer;
    在所述牺牲层上设置第二光刻胶掩模,再对所述牺牲层进行刻蚀,至少使分布在所述衬底的第一表面的第二区域中的复数个凸起部顶部暴露出,之后除去所述第二光刻胶掩模;Providing a second photoresist mask on the sacrificial layer, and etching the sacrificial layer to expose at least a top of the plurality of protrusions distributed in the second region of the first surface of the substrate And then removing the second photoresist mask;
    在所述衬底的第一表面设置第三掩模,并使所述衬底第一表面上的、与所述流体阻挡部相对应的区域暴露出,之后沉积形成流体阻挡部,再除去所述第三掩模;Providing a third mask on the first surface of the substrate, and exposing a region on the first surface of the substrate corresponding to the fluid blocking portion, and then depositing to form a fluid blocking portion, and then removing the a third mask;
    在所述衬底的第三表面上设置图形化的第四光刻胶掩模,再对所述衬底的第三表面进行刻蚀,直至露出填充在相邻凸起部之间的牺牲材料,从而在所述衬底的第三表面形成槽孔,所述槽孔所在位置与所述衬底的第一表面的第一区域相对应,所述衬底的第一表面的第二区域环绕所述第一区域设置,Forming a fourth photoresist mask on the third surface of the substrate, and etching the third surface of the substrate until the sacrificial material filled between the adjacent protrusions is exposed Forming a slot in the third surface of the substrate, the slot being located corresponding to the first area of the first surface of the substrate, the second area of the first surface of the substrate surrounding The first area setting,
    除去所述第四光刻胶掩模及填充在所述复数个凸起部之间的牺牲材料,于所述衬底上形成所述第一流体通道。Removing the fourth photoresist mask and the sacrificial material filled between the plurality of protrusions to form the first fluid channel on the substrate.
  32. 根据权利要求30或31所述的制备方法,其特征在于:所述的复数个凸起部为阵列排布的复数根竖直纳米柱或竖直纳米线。The preparation method according to claim 30 or 31, wherein the plurality of protrusions are a plurality of vertical nano-pillars or vertical nanowires arranged in an array.
  33. 一种流体处理装置,其特征在于包括:A fluid treatment device characterized by comprising:
    具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面的第一区域内;a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
    流体阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理流体直接进入所述第一流体通道的流体入口;a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
    分布于所述基体的第一表面的第二区域内的、且彼此间隔的复数根竖直纳米线状体,所述基体的第一表面的第二区域环绕所述第一区域设置,所述纳米线状体的两端分别与所述基体的第一表面及所述流体阻挡部的第二表面固定连接,其中相邻纳米线状体之间的距离大于0但小于混杂于待处理的流体内的选定颗粒的粒径,从而使所述复数根纳米线状体、流体阻挡部与基体之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of vertical nano-linear bodies distributed in a second region of the first surface of the substrate and spaced apart from each other, a second region of the first surface of the substrate being disposed around the first region, Two ends of the nano-linear body are respectively fixedly connected to the first surface of the base body and the second surface of the fluid blocking portion, wherein a distance between adjacent nano-linear bodies is greater than 0 but less than mixed with the fluid to be treated a particle size of the selected particles, such that the plurality of nanowires, the fluid barrier and the substrate cooperate to form a second fluid channel, and the fluid to be treated can only enter through the second fluid channel A fluid passage.
  34. 根据权利要求33所述的流体处理装置,其特征在于:所述基体的第一表面的第三区域内亦分布有彼此间隔设置的复数根纳米线状体,所述基体的第一表面的第三区域环绕所述 第二区域设置。The fluid processing apparatus according to claim 33, wherein a plurality of nano-linear bodies spaced apart from each other are disposed in the third region of the first surface of the substrate, and the first surface of the substrate is Three areas surround the said The second area is set.
  35. 根据权利要求33或34所述的流体处理装置,其特征在于:所述竖直纳米线状体原位生长于所述基体的第一表面。A fluid treatment device according to claim 33 or 34, wherein said vertical nanowire body is grown in situ on the first surface of said substrate.
  36. 根据权利要求33或34所述的流体处理装置,其特征在于:所述纳米线状体包括纳米线、纳米柱、纳米管中的任意一种;和/或,所述的复数根纳米线状体均匀分布或非均匀分布在所述基体的第一表面上;和/或,所述纳米线状体的长径比为4:1~200000:1;和/或,相邻纳米线状体之间的距离与所述纳米线状体的长度的比值为1:4~1:200000;和/或,所述第一流体通道的流体入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形。The fluid processing apparatus according to claim 33 or 34, wherein the nano-linear body comprises any one of a nanowire, a nanocolumn, and a nanotube; and/or the plurality of nanowires The body is uniformly or non-uniformly distributed on the first surface of the substrate; and/or the nano-linear body has an aspect ratio of 4:1 to 200000:1; and/or adjacent nano-linear bodies The ratio of the distance between the distance to the length of the nano-linear body is 1:4 to 1:200,000; and/or the fluid inlet of the first fluid channel has a regular or irregular shape, the regular shape including a polygon , round or oval.
  37. 根据权利要求36所述的流体处理装置,其特征在于:所述纳米线状体的直径为1nm~50μm,长度为50nm~200μm,相邻纳米线状体之间的距离为1nm~50μm;和/或,所述纳米线状体包括碳纳米管、硅纳米线、银纳米线、金纳米线、氧化锌纳米线、氮化镓纳米线中的任意一种。The fluid processing apparatus according to claim 36, wherein said nano-linear body has a diameter of 1 nm to 50 μm, a length of 50 nm to 200 μm, and a distance between adjacent nano-linear bodies of 1 nm to 50 μm; Or, the nano-linear body includes any one of carbon nanotubes, silicon nanowires, silver nanowires, gold nanowires, zinc oxide nanowires, and gallium nitride nanowires.
  38. 根据权利要求34所述的流体处理装置,其特征在于:分布于所述基体的第一表面的第三区域的复数根纳米线状体排布形成具有超疏水或超疏油性能的阵列结构。The fluid processing apparatus according to claim 34, wherein the plurality of nanowire-like bodies distributed in the third region of the first surface of the substrate form an array structure having superhydrophobic or superoleophobic properties.
  39. 根据权利要求33所述的流体处理装置,其特征在于:所述流体处理装置还包括至少一个支撑体,所述支撑体一端与所述基体固定连接,另一端与所述流体阻挡部固定连接。A fluid treatment device according to claim 33, wherein said fluid treatment device further comprises at least one support body, one end of said support body being fixedly coupled to said base body and the other end being fixedly coupled to said fluid blocking portion.
  40. 根据权利要求39所述的流体处理装置,其特征在于:所述流体处理装置包括两个以上所述的支撑体,并且该两个以上所述的支撑体对称分布于所述第一流体通道的流体入口周围。A fluid treatment device according to claim 39, wherein said fluid treatment device comprises two or more said support bodies, and said two or more said support bodies are symmetrically distributed over said first fluid passageway Around the fluid inlet.
  41. 根据权利要求33所述的流体处理装置,其特征在于:所述第一流体通道的流体入口上架设有一根以上支撑梁,所述支撑梁与所述流体阻挡部固定连接;和/或,所述第一流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上;和/或,所述流体阻挡部的厚度为0.5μm~200μm;和/或,所述纳米线状体表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料;和/或,所述流体处理装置中的至少部分组件的至少局部为透明结构。The fluid treatment device according to claim 33, wherein: the fluid inlet of the first fluid passage is provided with one or more support beams, and the support beam is fixedly connected to the fluid blocking portion; and/or The first fluid channel has a pore diameter of 1 μm to 1 mm; and/or the substrate has a thickness of 1 μm or more; and/or the fluid barrier portion has a thickness of 0.5 μm to 200 μm; and/or the nanowire The surface of the body is further provided with a layer of functional material, the material of which comprises a photocatalytic material or an antimicrobial material; and/or at least part of the assembly of the fluid treatment device is at least partially transparent.
  42. 权利要求33-41中任一项所述流体处理装置的制备方法,其特征在于包括:The method of preparing a fluid processing apparatus according to any one of claims 33 to 41, characterized by comprising:
    提供具有第一表面和与该第一表面相背对的第三表面的衬底;Providing a substrate having a first surface and a third surface opposite the first surface;
    在所述衬底的第一表面上生长形成彼此间隔的复数根竖直纳米线状体,其中相邻纳米线状体之间的距离大于0但小于混杂于待处理的流体内的选定颗粒的粒径; Growing on the first surface of the substrate to form a plurality of vertical nano-linear bodies spaced apart from each other, wherein a distance between adjacent nano-linear bodies is greater than 0 but less than selected particles mixed in the fluid to be treated Particle size
    在所述衬底的第一表面上设置具有与所述衬底的第一表面相对设置的第二表面的流体阻挡部,并至少使分布在所述衬底的第一表面的第二区域内的复数根纳米线状体与所述流体阻挡部的第二表面固定连接;Providing a fluid barrier having a second surface disposed opposite the first surface of the substrate on a first surface of the substrate and at least distributed in a second region of the first surface of the substrate a plurality of nano-linear bodies fixedly connected to the second surface of the fluid blocking portion;
    对所述衬底的第三表面进行加工,形成贯穿所述衬底的第一流体通道,所述第一流体通道的流体入口分布于所述衬底的第一表面的第一区域内,所述衬底的第一表面的第二区域环绕所述第一区域设置,使分布在所述衬底的第一表面的第二区域内的复数根纳米线状体、流体阻挡部与衬底之间配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。Processing a third surface of the substrate to form a first fluid passage through the substrate, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate, a second region of the first surface of the substrate disposed around the first region such that a plurality of nanowires, fluid barriers, and substrates are distributed in a second region of the first surface of the substrate The interfitting forms a second fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  43. 根据权利要求42所述的制备方法,其特征在于包括:The preparation method according to claim 42, comprising:
    在所述衬底的第一表面生长形成彼此间隔的复数根纳米线状体;Growing on the first surface of the substrate to form a plurality of nano-linear bodies spaced apart from each other;
    在所述衬底的第一表面涂布可溶性或可腐蚀的有机物和/或无机物,并使有机物和/或无机物填充所述复数根纳米线状体之间的间隙,形成牺牲层;Coating a soluble or corrodible organic and/or inorganic substance on the first surface of the substrate, and filling the gap between the plurality of nano-linear bodies with an organic substance and/or an inorganic substance to form a sacrificial layer;
    在所述牺牲层上设置第一光刻胶掩模,再对所述牺牲层进行刻蚀,至少使分布在所述衬底的第一表面的第二区域中的复数根纳米线状体顶部暴露出,之后除去所述第一光刻胶掩模;Providing a first photoresist mask on the sacrificial layer, and etching the sacrificial layer to at least top a plurality of nano-linear bodies distributed in a second region of the first surface of the substrate Exposing, then removing the first photoresist mask;
    在所述衬底的第一表面设置第二掩模,并使所述衬底第一表面上的、与所述流体阻挡部相对应的区域暴露出,之后沉积形成流体阻挡部,再除去所述第二掩模;Providing a second mask on the first surface of the substrate, and exposing a region on the first surface of the substrate corresponding to the fluid blocking portion, and then depositing to form a fluid blocking portion, and then removing the Said second mask;
    在所述衬底的第三表面上设置图形化的第三光刻胶掩模,再对所述衬底的第三表面进行刻蚀,直至露出填充在相邻纳米线状体之间的牺牲材料,从而在所述衬底的第三表面形成槽孔,所述槽孔所在位置与所述衬底的第一表面的第一区域相对应,所述衬底的第一表面的第二区域环绕所述第一区域设置,Forming a patterned third photoresist mask on the third surface of the substrate, and etching the third surface of the substrate until the sacrifice between the adjacent nanowires is exposed a material to form a slot in a third surface of the substrate, the slot being located corresponding to a first region of the first surface of the substrate, the second region of the first surface of the substrate Surrounding the first area setting,
    除去所述第三光刻胶掩模及填充在所述复数根纳米线状体之间的牺牲材料,于所述衬底上形成所述第一流体通道。The third photoresist mask and the sacrificial material filled between the plurality of nanowires are removed, and the first fluid channel is formed on the substrate.
  44. 一种流体处理装置,其特征在于包括:A fluid treatment device characterized by comprising:
    具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面的第一区域内;a substrate having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed in a first region of the first surface of the substrate;
    流体阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理流体直接进入所述第一流体通道的流体入口;a fluid blocking portion having a second surface disposed opposite the first surface of the base body for preventing a fluid inlet of the fluid to be treated from directly entering the first fluid passage;
    复数个凸起部,所述凸起部沿横向在所述基体的第一表面的第二区域连续延伸,其中相邻凸起部之间形成有可供流体通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,并且所述凸起部的上端与所述基体的第一表面密封连接, 下端的局部区域与所述流体阻挡部的第二表面密封连接,从而使所述复数个凸起部之间的一个以上沟槽、流体阻挡部与基体配合形成第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions extending continuously in a second region of the first surface of the substrate in a lateral direction, wherein a groove through which a fluid can pass is formed between adjacent protrusions, the groove The opening of the opening has a diameter greater than 0 but less than the particle size of the selected particles mixed in the fluid to be treated, and the upper end of the raised portion is sealingly connected to the first surface of the base, a partial region of the lower end is sealingly coupled to the second surface of the fluid blocking portion such that more than one groove, fluid barrier between the plurality of projections cooperates with the base to form a second fluid passage, and the to-be-processed Fluid can only enter the first fluid passage through the second fluid passage.
  45. 根据权利要求44所述的流体处理装置,其特征在于:所述基体的第一表面的第二区域环绕第一区域设置;和/或,所述凸起部的第二端的局部区域及所述第一流体通道的流体入口均分布在所述流体阻挡部于所述基体的第一表面上形成的正投影内.A fluid treatment device according to claim 44, wherein a second region of the first surface of the base is disposed around the first region; and/or a partial region of the second end of the projection and the The fluid inlets of the first fluid passage are both distributed in the orthographic projection formed by the fluid blocking portion on the first surface of the substrate.
  46. 根据权利要求44所述的流体处理装置,其特征在于:所述凸起部的形状包括长条状或片状;和/或,所述的复数个凸起部均匀分布或非均匀分布在所述基体的第一表面上;和/或,所述第一流体通道的流体入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形.A fluid processing apparatus according to claim 44, wherein said convex portion has a shape including an elongated strip or a sheet; and/or said plurality of convex portions are uniformly distributed or non-uniformly distributed On the first surface of the substrate; and/or, the fluid inlet of the first fluid channel has a regular or irregular shape, the regular shape comprising a polygon, a circle or an ellipse.
  47. 根据权利要求44所述的流体处理装置,其特征在于:所述凸起部的宽度为1nm~50μm,高度为50nm~200μm;和/或,形成于相邻凸起部之间的沟槽开口部的尺寸为1nm~50μm;和/或,所述第一流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上;和/或,所述流体阻挡部的厚度为0.5μm~200μm;和/或,所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料;和/或,所述基体、流体阻挡部、凸起部中的至少一者的至少局部为透明结构。The fluid processing apparatus according to claim 44, wherein said convex portion has a width of 1 nm to 50 μm and a height of 50 nm to 200 μm; and/or a groove opening formed between adjacent convex portions The size of the portion is 1 nm to 50 μm; and/or the pore diameter of the first fluid passage is 1 μm to 1 mm; and/or the thickness of the substrate is 1 μm or more; and/or the thickness of the fluid barrier portion is 0.5 μm~200 μm; and/or, the surface of the convex portion is further provided with a functional material layer, the material of the functional material layer comprises a photocatalytic material or an antibacterial material; and/or the substrate, the fluid blocking portion and the convex portion At least a portion of at least one of the risers is a transparent structure.
  48. 一种流体处理装置,其特征在于包括:A fluid treatment device characterized by comprising:
    具有第一流体通道的基体,所述第一流体通道具有流体入口和流体出口,所述第一流体通道的流体入口分布于所述基体的第一表面;a base having a first fluid passage having a fluid inlet and a fluid outlet, the fluid inlet of the first fluid passage being distributed on a first surface of the base;
    彼此间隔设置的复数个凸起部,所述凸起部固定设置在所述基体的第一表面上,并沿横向在所述基体的第一表面上连续延伸,其中相邻凸起部之间形成有可供流体通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的流体内的选定颗粒的粒径,以及,其中至少两个凸起部分别与所述第一流体通道的流体入口的相背对的两侧相邻设置,至少一个凸起部直接从所述第一流体通道的流体入口上通过,从而使所述复数个凸起部与基体之间配合形成与所述第一流体通道连通的第二流体通道,且待处理的流体仅能通过所述第二流体通道进入第一流体通道。a plurality of protrusions spaced apart from each other, the protrusions being fixedly disposed on the first surface of the base body and extending continuously on the first surface of the base body in a lateral direction, wherein between the adjacent protrusions Forming a groove through which the fluid can pass, the opening of the groove having a diameter greater than 0 but smaller than the particle size of the selected particles mixed in the fluid to be treated, and wherein at least two of the raised portions are respectively Two opposite sides of the opposite sides of the fluid inlet of the first fluid passage are disposed adjacent to each other, and at least one convex portion directly passes through the fluid inlet of the first fluid passage, so that the plurality of convex portions and the base body The interfitting forms a second fluid passage in communication with the first fluid passage, and the fluid to be treated can only enter the first fluid passage through the second fluid passage.
  49. 根据权利要求48所述的流体处理装置,其特征在于,所述流体处理装置还包括:The fluid treatment device of claim 48, wherein the fluid treatment device further comprises:
    流体阻挡部,具有与所述基体的第一表面相对设置的第二表面,所述第一流体通道的流体入口分布在所述流体阻挡部于所述基体的第一表面上形成的正投影内,所述复数个凸起部具有相背对的第一端和第二端,所述第一端与所述基体的第一表面密封连接,第二端的局部 区域与所述遮挡部的第二表面密封连接。a fluid blocking portion having a second surface disposed opposite the first surface of the substrate, the fluid inlet of the first fluid channel being distributed within an orthographic projection formed by the fluid blocking portion on the first surface of the substrate The plurality of raised portions have opposite first and second ends, the first end being sealingly coupled to the first surface of the base, and the second end being partially The region is sealingly coupled to the second surface of the obscuring portion.
  50. 根据权利要求48所述的流体处理装置,其特征在于:所述复数个凸起部平行分布在所述基体的第一表面上。A fluid treatment device according to claim 48, wherein said plurality of projections are distributed in parallel on the first surface of said base.
  51. 根据权利要求48-50中任一项所述的流体处理装置,其特征在于:形成于相邻凸起部之间的沟槽的开口部的尺寸为1nm~50μm;和/或,所述第一流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上;和/或,所述流体阻挡部的厚度为0.5μm~200μm。The fluid processing apparatus according to any one of claims 48 to 50, wherein an opening of the groove formed between the adjacent convex portions has a size of 1 nm to 50 μm; and/or said A fluid passage has a pore diameter of 1 μm to 1 mm; and/or the base body has a thickness of 1 μm or more; and/or the fluid barrier portion has a thickness of 0.5 μm to 200 μm.
  52. 根据权利要求48-50中任一项所述的流体处理装置,其特征在于:所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料。The fluid processing apparatus according to any one of claims 48 to 50, wherein the surface of the convex portion is further provided with a layer of a functional material, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material.
  53. 根据权利要求49所述的流体处理装置,其特征在于:所述基体、流体阻挡部、凸起部中的至少一者的至少局部为透明结构。The fluid treatment device according to claim 49, wherein at least a part of at least one of the base body, the fluid blocking portion, and the convex portion is a transparent structure.
  54. 一种流体处理装置,其特征在于包括:A fluid treatment device characterized by comprising:
    具有流体通道的基体,以及a substrate having a fluid passage, and
    复数根线形体的聚集体,用以对流经所述流体通道的、混杂有选定颗粒的流体进行处理;An aggregate of a plurality of linear bodies for treating a fluid mixed with the selected particles flowing through the fluid passage;
    所述聚集体分布于所述流体通道内,并具有多孔结构,所述多孔结构内孔洞的直径大于0但小于所述选定颗粒的粒径。The aggregates are distributed within the fluid channel and have a porous structure, the pores within the porous structure having a diameter greater than zero but less than the particle size of the selected particles.
  55. 根据权利要求54所述的流体处理装置,其特征在于:所述线形体一端均与所述流体通道的内壁固定连接,另一端沿所述流体通道的径向延伸;和/或,所述复数根线形体相互交叉或彼此交织形成所述多孔结构;或者,所述复数根线形体彼此间隔设置并平行排布形成所述多孔结构。A fluid processing apparatus according to claim 54, wherein one end of said linear body is fixedly coupled to an inner wall of said fluid passage, and the other end extends in a radial direction of said fluid passage; and/or said plural The root linear bodies cross each other or are interwoven with each other to form the porous structure; or, the plurality of linear bodies are spaced apart from each other and arranged in parallel to form the porous structure.
  56. 根据权利要求54所述的流体处理装置,其特征在于:所述基体具有相背对的第一表面和第二表面,所述流体通道的流体入口分布于所述基体的第一表面。A fluid treatment device according to claim 54, wherein said base body has opposite first and second surfaces, and a fluid inlet of said fluid passage is distributed over said first surface of said base.
  57. 根据权利要求56所述的流体处理装置,其特征在于:所述基体的第一表面还分布有彼此间隔设置的复数根竖立线形体,所述复数根竖立线形体环绕所述流体通道设置。A fluid processing apparatus according to claim 56, wherein said first surface of said base body is further distributed with a plurality of upright linear bodies spaced apart from each other, said plurality of upright linear bodies being disposed around said fluid passage.
  58. 根据权利要求57所述的流体处理装置,其特征在于还包括流体阻挡部,所述流体阻挡部具有与所述基体的第一表面相对设置的第三表面,并且所述复数根竖立线形体一端固定设置于所述基体的第一表面,另一端与所述流体阻挡部的第三表面固定连接,其中相邻竖立线形体之间的距离大于0但小于所述选定颗粒的粒径。A fluid treatment device according to claim 57, further comprising a fluid blocking portion having a third surface disposed opposite to the first surface of said base body, and said plurality of erected linear body ends The first surface is fixedly disposed on the first surface of the substrate, and the other end is fixedly connected to the third surface of the fluid blocking portion, wherein a distance between adjacent vertical linear bodies is greater than 0 but smaller than a particle diameter of the selected particles.
  59. 根据权利要求58所述的流体处理装置,其特征在于:所述流体通道的流体入口及复数根竖立线形体分布在所述流体阻挡部于所述基体的第一表面的正投影内。40. The fluid treatment device of claim 58 wherein the fluid inlet of the fluid passageway and the plurality of upright linear bodies are distributed within an orthographic projection of the fluid barrier portion on a first surface of the substrate.
  60. 根据权利要求57所述的流体处理装置,其特征在于:所述竖立线形体的长径比为4: 1~200000:1;和/或,相邻竖立线形体之间的距离与所述竖立线形体的长度的比值为1:4~1:200000;和/或,所述线形体的直径为1nm~500μm。A fluid treatment device according to claim 57, wherein said upright linear body has an aspect ratio of 4: 1 to 200000:1; and/or, the ratio of the distance between adjacent upright linear bodies to the length of the upright linear body is 1:4 to 1:200,000; and/or the diameter of the linear body is 1 nm ~500μm.
  61. 根据权利要求54所述的流体处理装置,其特征在于:所述线形体选自纳米线或纳米管。A fluid treatment device according to claim 54, wherein said linear body is selected from the group consisting of nanowires or nanotubes.
  62. 根据权利要求54-61中任一项所述的流体处理装置,其特征在于:至少于所述线形体表面还分布有光催化材料或抗菌材料;和/或,所述线形体包括碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线中的任一种或两种以上的组合。The fluid processing apparatus according to any one of claims 54 to 61, wherein at least a photocatalytic material or an antibacterial material is further distributed on a surface of the linear body; and/or the linear body comprises carbon nanowires Any one or a combination of two or more of carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, and Au nanowires.
  63. 根据权利要求54-61中任一项所述的流体处理装置,其特征在于:所述基体的第一表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料;和/或,所述流体处理装置中的至少部分组件具有透明结构;和/或,所述流体通道的流体入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形;和/或,所述流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上。The fluid processing apparatus according to any one of claims 54 to 61, wherein the first surface of the substrate is further provided with a functional material layer, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material; And/or at least a portion of the fluid treatment device has a transparent structure; and/or the fluid inlet of the fluid passage has a regular or irregular shape, the regular shape comprising a polygon, a circle or an ellipse; Or, the fluid passage has a pore diameter of 1 μm to 1 mm; and/or the base has a thickness of 1 μm or more.
  64. 一种鼻塞式呼吸器,其特征在于包括:A nasal plug respirator characterized by comprising:
    鼻塞和过滤芯片,至少所述鼻塞的一端部能够插入使用者的鼻腔,且所述鼻塞包含有与所述鼻腔连通的气体通道,所述过滤芯片用以滤除混杂于待处理气流内的、粒径大于设定值的颗粒,待处理的气体流经所述过滤芯片后进入所述鼻塞内的气体通道;以及,a nasal plug and a filter chip, at least one end of the nasal plug can be inserted into a nasal cavity of a user, and the nasal plug includes a gas passage communicating with the nasal cavity, and the filter chip is used to filter out the mixed airflow to be treated, a particle having a particle diameter larger than a set value, wherein the gas to be treated flows into the gas passage in the nasal plug after flowing through the filter chip;
    过滤芯片防护结构,用以对所述过滤芯片进行防护。A filter chip protection structure is used to protect the filter chip.
  65. 根据权利要求64所述的鼻塞式呼吸器,其特征在于:所述过滤芯片防护结构包括第一固定式硬质滤网和第二固定式硬质滤网,所述过滤芯片设置于第一固定式硬质滤网和第二固定式硬质滤网之间;The nasal plug respirator according to claim 64, wherein the filter chip protection structure comprises a first fixed hard filter and a second fixed hard filter, and the filter chip is disposed at the first fixed Between the hard filter and the second fixed hard filter;
    和/或,所述鼻塞式呼吸器还包括第一过滤织物和/或第二过滤织物,所述第一过滤织物分布于所述鼻塞和过滤芯片之间,所述过滤芯片分布于第二过滤织物与鼻塞之间;And/or the nasal plug respirator further includes a first filter fabric and/or a second filter fabric, the first filter fabric being distributed between the nasal plug and the filter chip, the filter chip being distributed in the second filter Between the fabric and the stuffy nose;
    优选的,所述鼻塞式呼吸器还包括第一可拆卸式硬质滤网和/或第二可拆式硬质滤网,所述第一可拆卸式硬质滤网与第一过滤织物固定连接,所述第二可拆卸式硬质滤网与第二过滤织物固定连接;Preferably, the nasal plug respirator further comprises a first detachable hard filter and/or a second detachable hard filter, and the first detachable hard filter is fixed to the first filter fabric. Connecting, the second detachable hard filter mesh is fixedly connected to the second filter fabric;
    和/或,所述鼻塞采用腰鼓型鼻塞;和/或,所述鼻塞式呼吸器还包括一两端开口的壳体,所述鼻塞可拆卸的安装于所述壳体一端,所述过滤芯片容置于所述壳体内。And/or, the nasal plug adopts a waist drum type nasal plug; and/or the nasal plug type respirator further includes a housing having an open end, the nasal plug is detachably mounted at one end of the housing, and the filter chip It is housed in the housing.
  66. 根据权利要求64所述的鼻塞式呼吸器,其特征在于,所述过滤芯片包括:A nasal plug respirator according to claim 64, wherein said filter chip comprises:
    具有第一流体通道的基体,所述第一流体通道具有空气入口和空气出口,所述第一流体通道的空气入口分布于所述基体的第一表面; a base having a first fluid passage, the first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed on the first surface of the base;
    彼此间隔设置的复数个凸起部,所述凸起部沿横向在所述基体的第一表面上连续延伸,下部固定设置于所述基体的第一表面,上部设有沿横向连续延伸的帽形结构,所述帽形结构的相背对的两侧部沿侧向外延,而相邻帽形结构之间形成有可供空气通过的开口部,所述开口部的口径大于0但小于混杂于待处理的空气内的选定颗粒的粒径,其中至少两个所述的凸起部分别与所述第一流体通道的空气入口的相背对的两侧相邻设置,以及至少一个所述的凸起部直接从所述第一流体通道的空气入口上通过,从而使复数个帽形结构、复数个凸起部与基体之间配合形成与所述第一流体通道连通的第二流体通道,且待处理的空气仅能通过所述第二流体通道进入第一流体通道;a plurality of protrusions spaced apart from each other, the protrusions extending continuously on the first surface of the base body in a lateral direction, a lower portion fixedly disposed on the first surface of the base body, and an upper portion having a cap extending continuously in the lateral direction a shape-shaped structure, the opposite sides of the hat-shaped structure are laterally extended, and an opening portion through which air can pass is formed between adjacent hat-shaped structures, and the diameter of the opening portion is greater than 0 but less than mixed a particle size of the selected particles in the air to be treated, wherein at least two of the raised portions are respectively disposed adjacent to opposite sides of the air inlet of the first fluid passage, and at least one The raised portion directly passes through the air inlet of the first fluid passage, thereby engaging a plurality of hat-shaped structures, a plurality of protrusions and the base body to form a second fluid communicating with the first fluid passage a passage, and the air to be treated can only enter the first fluid passage through the second fluid passage;
    优选的,至少两个所述的凸起部直接从所述第一流体通道的空气入口上通过;和/或,所述复数个凸起部平行分布在所述基体的第一表面上;和/或,所述帽形结构与凸起部一体设置;和/或,所述帽形结构具有倒梯形截面结构;和/或,形成于相邻帽形结构之间的开口部的口径为1nm~50μm;和/或,所述帽形结构的高度为50nm~200μm;和/或,相邻凸起部之间的距离为0.1μm~100μm;和/或,所述凸起部的高度为0.1μm~400μm,宽度为0.1μm~100μm;和/或,所述第一流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上;和/或,至少于所述凸起部、帽形结构和基体中的任一者的表面还设置有光催化功能材料层和/或抗菌功能材料层;和/或,所述凸起部、帽形结构和基体中的至少一者的至少局部为透明结构。Preferably, at least two of said raised portions pass directly over the air inlet of said first fluid passage; and/or said plurality of raised portions are distributed in parallel on said first surface of said base body; Or, the cap-shaped structure is integrally provided with the boss; and/or the cap-shaped structure has an inverted trapezoidal cross-sectional structure; and/or the opening formed between the adjacent cap-shaped structures has a diameter of 1 nm. ~50 μm; and/or, the height of the hat-shaped structure is 50 nm to 200 μm; and/or the distance between adjacent convex portions is 0.1 μm to 100 μm; and/or the height of the convex portion is 0.1 μm to 400 μm, width 0.1 μm to 100 μm; and/or, the first fluid channel has a pore diameter of 1 μm to 1 mm; and/or the substrate has a thickness of 1 μm or more; and/or at least The surface of any of the raised portion, the cap-shaped structure and the substrate is further provided with a layer of photocatalytic functional material and/or a layer of antimicrobial functional material; and/or at least one of the raised portion, the hat-shaped structure and the substrate At least part of one is a transparent structure.
  67. 根据权利要求64所述的鼻塞式呼吸器,其特征在于,所述过滤芯片包括:A nasal plug respirator according to claim 64, wherein said filter chip comprises:
    具有第一流体通道的基体,所述第一流体通道具有空气入口和空气出口,所述第一流体通道的空气入口分布于所述基体的第一表面;a base having a first fluid passage, the first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed on the first surface of the base;
    由复数根线形体相互交叉形成的多孔结构,用以与所述基体的第一表面配合形成第二流体通道,所述复数根线形体一端均与所述基体固定连接,所述多孔结构中孔洞的直径大于0但小于混杂于待处理的空气内的选定颗粒的粒径,且待处理的空气仅能通过所述第二流体通道进入第一流体通道;a porous structure formed by intersecting a plurality of linear bodies to form a second fluid passage with the first surface of the base body, wherein the plurality of linear bodies are fixedly connected to the base body at one end, and the porous structure has a hole a diameter greater than 0 but less than the particle size of the selected particles mixed in the air to be treated, and the air to be treated can only enter the first fluid passage through the second fluid passage;
    优选的,所述复数根线形体的一端均与所述基体的第一表面固定连接,并环绕分布于所述第一流体通道的空气入口周围;和/或,所述的空气过滤芯片还包括彼此间隔设置的复数个凸起部,所述凸起部固定设置在所述基体的第一表面上,并沿横向在所述基体的第一表面上连续延伸,其中至少两个凸起部分别与所述第一流体通道的空气入口的相背对的两侧相邻设置,至少一个凸起部直接从所述第一流体通道的空气入口上通过,所述凸起部上固定连接有两根以上所述的线形体;和/或,连接在一凸起部上的复数根线形体和连接在与该凸起部相邻的另一凸起部上的复数根线形体相互交叉;和/或,所述复数个凸起部平行分布在所述基体的 第一表面上;和/或,所述凸起部的形状包括长条状或片状;和/或,所述的复数个凸起部均匀分布或非均匀分布在所述基体的第一表面上;和/或,所述凸起部的宽度为0.1μm~100μm,高度为0.1μm~400μm;和/或,相邻凸起部之间的距离为0.1μm~100μm;和/或,所述凸起部表面还设置有光催化功能材料层和/或抗菌功能材料层;和/或,所述基体、所述复数根线形体、所述复数个凸起部中的至少一者的至少局部为透明结构;和/或,所述线形体的直径为1nm~50μm;和/或,其中任一线形体的一端和与该线形体相邻的另一线形体的一端之间的距离为1nm~50μm;和/或,所述线形体的长度为50nm~200μm;和/或,至少于所述线形体表面还分布有光催化材料或抗菌材料;和/或,所述基体和所述复数根线形体中的至少一者的至少局部为透明结构;和/或,所述线形体为直线形;和/或,所述第一流体通道的空气入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形;和/或,所述第一流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上;Preferably, one end of the plurality of linear bodies is fixedly connected to the first surface of the base body and is distributed around the air inlet of the first fluid passage; and/or the air filter chip further includes a plurality of raised portions spaced apart from each other, the raised portion is fixedly disposed on the first surface of the base body, and extends continuously on the first surface of the base body in a lateral direction, wherein at least two raised portions are respectively respectively Arranging adjacent to opposite sides of the air inlet of the first fluid passage, at least one convex portion directly passes through the air inlet of the first fluid passage, and the convex portion is fixedly connected with two a linear body as described above; and/or a plurality of linear bodies connected to a convex portion and a plurality of linear bodies connected to the other convex portion adjacent to the convex portion; and Or, the plurality of protrusions are distributed in parallel on the substrate And/or, the shape of the raised portion includes an elongated strip or a sheet; and/or the plurality of raised portions are evenly distributed or non-uniformly distributed on the first surface of the base And/or, the raised portion has a width of 0.1 μm to 100 μm, a height of 0.1 μm to 400 μm; and/or a distance between adjacent convex portions of 0.1 μm to 100 μm; and/or The surface of the protrusion is further provided with a layer of photocatalytic functional material and/or a layer of antibacterial functional material; and/or at least at least one of the substrate, the plurality of linear bodies, and the plurality of protrusions The portion is a transparent structure; and/or the linear body has a diameter of 1 nm to 50 μm; and/or a distance between one end of one of the linear bodies and one end of another linear body adjacent to the linear body is 1 nm. 50 μm; and/or, the linear body has a length of 50 nm to 200 μm; and/or at least a photocatalytic material or an antibacterial material is further distributed on the surface of the linear body; and/or the substrate and the plurality of roots At least a portion of at least one of the linear bodies is a transparent structure; and/or the linear body is linear And/or, the air inlet of the first fluid passage has a regular or irregular shape, the regular shape includes a polygon, a circle or an ellipse; and/or the first fluid passage has a diameter of 1 μm to 1 mm; And/or, the substrate has a thickness of 1 μm or more;
    优选的,所述过滤芯片还包括平行分布在所述基体的第一表面的复数根横梁,所述横梁沿横向在所述基体的第一表面连续延伸,其中至少两根横梁分别与所述第一流体通道的空气入口的相背对的两侧相邻设置,至少一根横梁直接从所述第一流体通道的空气入口上通过;以及,任一横梁上均分布有复数根线形体,该复数根线形体中的至少部分线形体的一端固定于所述横梁表面,另一端沿逐渐远离该任一横梁的方向斜向延伸和/或在平行于所述基体第一表面的面上连续延伸,并与分布在相邻于该任一横梁的另一横梁上的复数根线形体相互交叉,从而形成所述多孔结构;Preferably, the filter chip further includes a plurality of cross beams arranged in parallel on the first surface of the base body, the cross beams continuously extending in a lateral direction on a first surface of the base body, wherein at least two cross beams respectively respectively An air inlet of a fluid passage is disposed adjacent to opposite sides of the air inlet, at least one beam directly passes through the air inlet of the first fluid passage; and any of the beams is distributed with a plurality of linear bodies, One end of at least a portion of the linear body of the plurality of linear bodies is fixed to the surface of the beam, and the other end extends obliquely away from the direction of the one of the beams and/or continuously extends on a surface parallel to the first surface of the substrate. And intersecting a plurality of linear bodies distributed on another beam adjacent to the one of the beams to form the porous structure;
    优选的,至少两根横梁直接从所述第一流体通道的空气入口上通过;Preferably, at least two beams pass directly through the air inlet of the first fluid passage;
    优选的,所述线形体包括碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线中的任一种或两种以上的组合。Preferably, the linear body includes any one or a combination of two or more of carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Ag nanowires, and Au nanowires.
  68. 根据权利要求64所述的鼻塞式呼吸器,其特征在于,所述过滤芯片包括:A nasal plug respirator according to claim 64, wherein said filter chip comprises:
    具有第一流体通道的基体,所述第一流体通道具有空气入口和空气出口,所述第一流体通道的空气入口分布于所述基体的第一表面的第一区域内;a base having a first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed in a first region of the first surface of the base;
    空气阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理空气直接进入所述第一流体通道的空气入口;An air blocking portion having a second surface disposed opposite the first surface of the base body for blocking an air inlet of the air to be treated directly entering the first fluid passage;
    彼此间隔设置的复数个凸起部,所述凸起部一端固定设置于所述基体的第一表面的第二区域内,另一端与所述空气阻挡部的第二表面固定连接,其中相邻凸起部之间的距离大于0但小于混杂于待处理的空气内的选定颗粒的粒径,所述基体的第一表面的第二区域与第一区域邻接,从而使所述复数个凸起部、空气阻挡部与基体之间配合形成第二流体通道,且待处 理的空气仅能通过所述第二流体通道进入第一流体通道;a plurality of raised portions spaced apart from each other, the convex portion is fixedly disposed at one end in a second region of the first surface of the base body, and the other end is fixedly connected to the second surface of the air blocking portion, wherein adjacent The distance between the raised portions is greater than zero but less than the particle size of the selected particles that are intermingled with the air to be treated, the second region of the first surface of the substrate being contiguous with the first region, such that the plurality of convexities The second fluid passage is formed between the upper portion, the air blocking portion and the base body, and is to be treated The conditioned air can only enter the first fluid passage through the second fluid passage;
    优选的,所述复数个凸起部环绕所述第一流体通道的空气入口设置;和/或,所述基体的第一表面的第三区域内亦间隔设置有复数个凸起部,所述第二区域设于所述第三区域和第一区域之间;和/或,所述第一流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上;和/或,所述空气阻挡部的厚度为0.5μm~200μm;和/或,所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料;和/或,所述空气过滤芯片中的至少部分组件的至少局部为透明结构;Preferably, the plurality of protrusions are disposed around the air inlet of the first fluid passage; and/or the third area of the first surface of the base body is also spaced apart from the plurality of protrusions. a second region is disposed between the third region and the first region; and/or, the first fluid channel has a pore size of 1 μm to 1 mm; and/or the substrate has a thickness of 1 μm or more; and/or The air blocking portion has a thickness of 0.5 μm to 200 μm; and/or the surface of the convex portion is further provided with a functional material layer, and the material of the functional material layer comprises a photocatalytic material or an antibacterial material; and/or At least a portion of at least a portion of the components of the air filter chip are transparent structures;
    优选的,所述基体的第一表面的第三区域环绕所述第二区域设置;和/或,所述基体的第一表面的第一区域及第二区域分布在所述空气阻挡部于所述基体的第一表面上的正投影内;和/或,所述空气过滤芯片还包括至少一个支撑体,所述支撑体一端与所述基体固定连接,另一端与所述空气阻挡部固定连接;和/或,分布于所述基体的第一表面的第三区域的复数个凸起部排布形成具有超疏水或超疏油性能的微米级或纳米级阵列结构;Preferably, a third area of the first surface of the base body is disposed around the second area; and/or a first area and a second area of the first surface of the base body are distributed in the air blocking portion The orthographic projection on the first surface of the substrate; and/or the air filter chip further includes at least one support body, one end of the support body is fixedly connected to the base body, and the other end is fixedly connected to the air blocking portion And/or a plurality of raised portions distributed in a third region of the first surface of the substrate are arranged to form a micro- or nano-scale array structure having superhydrophobic or superoleophobic properties;
    优选的,所述空气过滤芯片包括两个以上所述的支撑体,并且该两个以上所述的支撑体对称分布于所述第一流体通道的空气入口周围;Preferably, the air filter chip includes two or more of the support bodies, and the two or more support bodies are symmetrically distributed around the air inlet of the first fluid passage;
    优选的,所述第一流体通道的空气入口上架设有一根以上支撑梁,所述支撑梁与所述空气阻挡部固定连接;和/或,所述凸起部为站立设置的线状、柱状、片状、管状、锥状、锥台状结构中的任意一种;和/或,所述凸起部的横向截面具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形;和/或,所述的复数个凸起部均匀分布或非均匀分布在所述基体的第一表面上;和/或,所述第一流体通道的空气入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形;和/或,所述凸起部为线状凸起,其长径比为4:1~200000:1;和/或,相邻凸起部之间的距离与所述凸起部的长度的比值为1:4~1:200000;Preferably, the air inlet of the first fluid passage is provided with more than one support beam, the support beam is fixedly connected with the air blocking portion; and/or the convex portion is a linear or columnar column. Any one of a sheet-like, tubular, tapered, and frustum-like structure; and/or the transverse section of the raised portion has a regular or irregular shape including a polygonal shape, a circular shape, or an elliptical shape And/or, the plurality of raised portions are evenly distributed or non-uniformly distributed on the first surface of the base; and/or the air inlet of the first fluid passage has a regular or irregular shape. The regular shape includes a polygon, a circle or an ellipse; and/or the raised portion is a linear protrusion having an aspect ratio of 4:1 to 200000:1; and/or adjacent convex portions The ratio of the distance between the distance to the length of the raised portion is 1:4 to 1:20000;
    优选的,所述凸起部为竖立设置的微米线或纳米线,其直径为1nm~50μm,长度为50nm~200μm,相邻凸起部之间的距离为1nm~50μm.Preferably, the raised portion is an upright micro-wire or nanowire having a diameter of 1 nm to 50 μm, a length of 50 nm to 200 μm, and a distance between adjacent convex portions of 1 nm to 50 μm.
  69. 根据权利要求64所述的鼻塞式呼吸器,其特征在于,所述过滤芯片包括:A nasal plug respirator according to claim 64, wherein said filter chip comprises:
    具有第一流体通道的基体,所述第一流体通道具有空气入口和空气出口,所述第一流体通道的空气入口分布于所述基体的第一表面的第一区域内;a base having a first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed in a first region of the first surface of the base;
    空气阻挡部,具有与所述基体的第一表面相对设置的第二表面,用于阻止待处理空气直接进入所述第一流体通道的空气入口;An air blocking portion having a second surface disposed opposite the first surface of the base body for blocking an air inlet of the air to be treated directly entering the first fluid passage;
    复数个凸起部,所述凸起部沿横向在所述基体的第一表面的第二区域连续延伸,其中相邻凸起部之间形成有可供空气通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待 处理的空气内的选定颗粒的粒径,并且所述凸起部的上端与所述基体的第一表面密封连接,下端的局部区域与所述空气阻挡部的第二表面密封连接,从而使所述复数个凸起部之间的一个以上沟槽、空气阻挡部与基体配合形成第二流体通道,且待处理的空气仅能通过所述第二流体通道进入第一流体通道;优选的,所述基体的第一表面的第二区域环绕第一区域设置;和/或,所述凸起部的第二端的局部区域及所述第一流体通道的空气入口均分布在所述空气阻挡部于所述基体的第一表面上形成的正投影内;和/或,所述凸起部的形状包括长条状或片状;和/或,所述的复数个凸起部均匀分布或非均匀分布在所述基体的第一表面上;和/或,所述第一流体通道的空气入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形;和/或,所述凸起部的宽度为1nm~50μm,高度为50nm~200μm;和/或,形成于相邻凸起部之间的沟槽开口部的尺寸为1nm~50μm;和/或,所述第一流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上;和/或,所述空气阻挡部的厚度为0.5μm~200μm;和/或,所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料;和/或,所述基体、空气阻挡部、凸起部中的至少一者的至少局部为透明结构。a plurality of protrusions extending continuously in a second region of the first surface of the substrate in a lateral direction, wherein a groove through which air can pass is formed between adjacent protrusions, the groove The diameter of the opening is greater than 0 but less than mixed a particle size of the selected particles in the treated air, and an upper end of the raised portion is sealingly coupled to the first surface of the base body, and a partial portion of the lower end is sealingly coupled to the second surface of the air blocking portion, thereby The one or more grooves between the plurality of protrusions and the air blocking portion cooperate with the base body to form a second fluid passage, and the air to be treated can only enter the first fluid passage through the second fluid passage; preferably, a second region of the first surface of the base body is disposed around the first region; and/or a partial region of the second end of the raised portion and an air inlet of the first fluid passage are both distributed in the air blocking portion And within an orthographic projection formed on the first surface of the substrate; and/or, the shape of the raised portion includes an elongated strip or a sheet; and/or the plurality of raised portions are evenly distributed or non- Uniformly distributed on the first surface of the substrate; and/or the air inlet of the first fluid channel has a regular or irregular shape, the regular shape comprising a polygon, a circle or an ellipse; and/or The width of the raised portion a size of 1 nm to 50 μm and a height of 50 nm to 200 μm; and/or a size of a groove opening formed between adjacent convex portions of 1 nm to 50 μm; and/or a pore diameter of the first fluid channel of 1 μm ~1 mm; and/or, the thickness of the substrate is 1 μm or more; and/or the thickness of the air blocking portion is 0.5 μm to 200 μm; and/or the surface of the convex portion is further provided with a functional material layer. The material of the functional material layer comprises a photocatalytic material or an antibacterial material; and/or at least a part of at least one of the substrate, the air blocking portion and the convex portion is a transparent structure.
  70. 根据权利要求64所述的鼻塞式呼吸器,其特征在于,所述过滤芯片包括:A nasal plug respirator according to claim 64, wherein said filter chip comprises:
    具有第一流体通道的基体,所述第一流体通道具有空气入口和空气出口,所述第一流体通道的空气入口分布于所述基体的第一表面;a base having a first fluid passage, the first fluid passage having an air inlet and an air outlet, the air inlet of the first fluid passage being distributed on the first surface of the base;
    彼此间隔设置的复数个凸起部,所述凸起部固定设置在所述基体的第一表面上,并沿横向在所述基体的第一表面上连续延伸,其中相邻凸起部之间形成有可供空气通过的沟槽,所述沟槽的开口部的口径大于0但小于混杂于待处理的空气内的选定颗粒的粒径,以及,其中至少两个凸起部分别与所述第一流体通道的空气入口的相背对的两侧相邻设置,至少一个凸起部直接从所述第一流体通道的空气入口上通过,从而使所述复数个凸起部与基体之间配合形成与所述第一流体通道连通的第二流体通道,且待处理的空气仅能通过所述第二流体通道进入第一流体通道;a plurality of protrusions spaced apart from each other, the protrusions being fixedly disposed on the first surface of the base body and extending continuously on the first surface of the base body in a lateral direction, wherein between the adjacent protrusions Forming a groove through which air can pass, the opening of the groove having a diameter greater than 0 but smaller than the particle size of the selected particles mixed in the air to be treated, and wherein at least two of the raised portions are respectively Two opposite sides of the opposite sides of the air inlet of the first fluid passage are disposed adjacent to each other, and at least one convex portion directly passes through the air inlet of the first fluid passage, so that the plurality of convex portions and the base body Interworking forms a second fluid passage in communication with the first fluid passage, and air to be treated can only enter the first fluid passage through the second fluid passage;
    优选的,所述过滤芯片还包括:空气阻挡部,具有与所述基体的第一表面相对设置的第二表面,所述第一流体通道的空气入口分布在所述空气阻挡部于所述基体的第一表面上形成的正投影内,所述复数个凸起部具有相背对的第一端和第二端,所述第一端与所述基体的第一表面密封连接,第二端的局部区域与所述遮挡部的第二表面密封连接;和/或,所述复数个凸起部平行分布在所述基体的第一表面上;和/或,形成于相邻凸起部之间的沟槽的开口部的尺寸为1nm~50μm;和/或,所述第一流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上;和/或,所述凸起部表面还设置有功能材料层,所述功能材料层的材质包括光催 化材料或抗菌材料;Preferably, the filter chip further includes: an air blocking portion having a second surface disposed opposite to the first surface of the base body, wherein an air inlet of the first fluid passage is distributed in the air blocking portion on the base body In the orthographic projection formed on the first surface, the plurality of protrusions have opposite first and second ends, the first end being sealingly connected to the first surface of the base, and the second end a partial region is sealingly coupled to the second surface of the shield; and/or the plurality of projections are distributed in parallel on the first surface of the substrate; and/or formed between adjacent projections The opening of the trench has a size of 1 nm to 50 μm; and/or the first fluid channel has a pore diameter of 1 μm to 1 mm; and/or the substrate has a thickness of 1 μm or more; and/or the convex The surface of the starting portion is further provided with a layer of functional material, and the material of the functional material layer includes light reminder Material or antibacterial material;
    优选的,所述空气阻挡部的厚度为0.5μm~200μm;和/或,所述基体、空气阻挡部、凸起部中的至少一者的至少局部为透明结构。Preferably, the air blocking portion has a thickness of 0.5 μm to 200 μm; and/or at least a part of at least one of the base body, the air blocking portion, and the convex portion is a transparent structure.
  71. 根据权利要求64所述的鼻塞式呼吸器,其特征在于,所述过滤芯片包括:A nasal plug respirator according to claim 64, wherein said filter chip comprises:
    具有流体通道的基体,以及a substrate having a fluid passage, and
    复数根线形体的聚集体,用以对流经所述流体通道的、混杂有选定颗粒的空气进行处理;An aggregate of a plurality of linear bodies for treating air flowing through the fluid passage mixed with selected particles;
    所述聚集体分布于所述流体通道内,并具有多孔结构,所述多孔结构内孔洞的直径大于0但小于所述选定颗粒的粒径;The aggregate is distributed in the fluid channel and has a porous structure, and a diameter of the pore in the porous structure is greater than 0 but smaller than a particle diameter of the selected particle;
    优选的,所述线形体一端均与所述流体通道的内壁固定连接,另一端沿所述流体通道的径向延伸;和/或,所述复数根线形体相互交叉或彼此交织形成所述多孔结构;或者,所述复数根线形体彼此间隔设置并平行排布形成所述多孔结构;和/或,所述基体具有相背对的第一表面和第二表面,所述流体通道的空气入口分布于所述基体的第一表面;和/或,所述基体的第一表面还分布有彼此间隔设置的复数根竖立线形体,所述复数根竖立线形体环绕所述流体通道设置;Preferably, one end of the linear body is fixedly connected to an inner wall of the fluid passage, and the other end extends in a radial direction of the fluid passage; and/or the plurality of linear bodies cross each other or interweave with each other to form the porous body. a structure; or, the plurality of linear bodies are spaced apart from each other and arranged in parallel to form the porous structure; and/or the substrate has opposite first and second surfaces, the air inlet of the fluid passage Distributed on the first surface of the substrate; and/or the first surface of the substrate is further distributed with a plurality of erected linear bodies spaced apart from each other, the plurality of erected linear bodies being disposed around the fluid passage;
    优选的,所述过滤芯片还包括空气阻挡部,所述空气阻挡部具有与所述基体的第一表面相对设置的第三表面,并且所述复数根竖立线形体一端固定设置于所述基体的第一表面,另一端与所述空气阻挡部的第三表面固定连接,其中相邻竖立线形体之间的距离大于0但小于所述选定颗粒的粒径;和/或,所述基体的第一表面还设置有功能材料层,所述功能材料层的材质包括光催化材料或抗菌材料;和/或,所述空气过滤芯片中的至少部分组件具有透明结构;和/或,所述流体通道的空气入口具有规则或不规则形状,所述规则形状包括多边形、圆形或椭圆形;和/或,所述流体通道的孔径为1μm~1mm;和/或,所述基体的厚度在1μm以上;Preferably, the filter chip further includes an air blocking portion having a third surface disposed opposite to the first surface of the base body, and one end of the plurality of upright linear bodies is fixedly disposed on the base body a first surface, the other end being fixedly coupled to the third surface of the air barrier, wherein a distance between adjacent upright linear bodies is greater than zero but less than a particle size of the selected particles; and/or The first surface is further provided with a layer of functional material, the material of the layer of functional material comprising a photocatalytic material or an antimicrobial material; and/or at least some of the components of the air filter chip have a transparent structure; and/or the fluid The air inlet of the passage has a regular or irregular shape including a polygonal shape, a circular shape or an elliptical shape; and/or the fluid passage has a pore diameter of 1 μm to 1 mm; and/or the base body has a thickness of 1 μm the above;
    优选的,所述流体通道的空气入口及复数根竖立线形体分布在所述空气阻挡部于所述基体的第一表面的正投影内;和/或,所述竖立线形体的长径比为4:1~200000:1;和/或,相邻竖立线形体之间的距离与所述竖立线形体的长度的比值为1:4~1:200000;和/或,所述线形体的直径为1nm~500μm;和/或,所述线形体选自纳米线或纳米管;Preferably, the air inlet of the fluid passage and the plurality of upright linear bodies are distributed in an orthographic projection of the air blocking portion on the first surface of the base body; and/or the aspect ratio of the upright linear body is 4:1 to 200000:1; and/or, the ratio of the distance between adjacent upright linear bodies to the length of the upright linear body is 1:4 to 1:200,000; and/or the diameter of the linear body Is from 1 nm to 500 μm; and/or, the linear body is selected from nanowires or nanotubes;
    优选的,至少于所述线形体表面还分布有光催化材料或抗菌材料;和/或,所述线形体包括碳纳米线、碳纳米管、ZnO纳米线、GaN纳米线、TiO2纳米线、Ag纳米线、Au纳米线中的任一种或两种以上的组合。 Preferably, at least the surface of the linear body is further distributed with a photocatalytic material or an antibacterial material; and/or the linear body comprises carbon nanowires, carbon nanotubes, ZnO nanowires, GaN nanowires, TiO 2 nanowires, Any one or a combination of two or more of Ag nanowires and Au nanowires.
PCT/CN2017/086780 2016-06-07 2017-06-01 Fluid processing device and preparation method therefor WO2017211215A1 (en)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
CN201610399546.8 2016-06-07
CN201610399546.8A CN107469480A (en) 2016-06-07 2016-06-07 Fluid treating device
CN201610399527.5 2016-06-07
CN201610398449.7 2016-06-07
CN201610398960.7 2016-06-07
CN201610398435.5A CN107469476A (en) 2016-06-07 2016-06-07 Fluid treating device
CN201610399542.XA CN107473434B (en) 2016-06-07 2016-06-07 Fluid treatment device and preparation method thereof
CN201610399521.8 2016-06-07
CN201610398435.5 2016-06-07
CN201610399542.X 2016-06-07
CN201610399521.8A CN107469246B (en) 2016-06-07 2016-06-07 Nose plug type respirator
CN201610398449.7A CN107469477A (en) 2016-06-07 2016-06-07 Fluid treating device and preparation method thereof
CN201610398960.7A CN107469478B (en) 2016-06-07 2016-06-07 Fluid treatment device and preparation method thereof
CN201610399527.5A CN107469479B (en) 2016-06-07 2016-06-07 Fluid treatment device

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