CN107431103A - 发光二极管封装和照明设备 - Google Patents
发光二极管封装和照明设备 Download PDFInfo
- Publication number
- CN107431103A CN107431103A CN201680016088.3A CN201680016088A CN107431103A CN 107431103 A CN107431103 A CN 107431103A CN 201680016088 A CN201680016088 A CN 201680016088A CN 107431103 A CN107431103 A CN 107431103A
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- CN
- China
- Prior art keywords
- layer
- type semiconductor
- semiconductor layer
- light emitting
- segment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
- H10H20/8162—Current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0042659 | 2015-03-26 | ||
| KR1020150042659A KR102434778B1 (ko) | 2015-03-26 | 2015-03-26 | 발광 소자 패키지 |
| PCT/KR2016/002612 WO2016153213A1 (ko) | 2015-03-26 | 2016-03-16 | 발광 소자 패키지 및 조명 장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107431103A true CN107431103A (zh) | 2017-12-01 |
Family
ID=56977599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680016088.3A Pending CN107431103A (zh) | 2015-03-26 | 2016-03-16 | 发光二极管封装和照明设备 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10381519B2 (enExample) |
| EP (1) | EP3276683B1 (enExample) |
| JP (1) | JP6811715B2 (enExample) |
| KR (1) | KR102434778B1 (enExample) |
| CN (1) | CN107431103A (enExample) |
| WO (1) | WO2016153213A1 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904285A (zh) * | 2019-03-11 | 2019-06-18 | 合肥彩虹蓝光科技有限公司 | 一种发光二极管芯片及其制造方法 |
| CN110214380A (zh) * | 2017-01-25 | 2019-09-06 | Lg 伊诺特有限公司 | 半导体器件 |
| CN111063778A (zh) * | 2018-10-16 | 2020-04-24 | 合肥彩虹蓝光科技有限公司 | 一种发光二极管结构 |
| CN112789738A (zh) * | 2018-05-17 | 2021-05-11 | 卡任特照明解决方案有限公司 | 具有窄绿色发射的荧光体 |
| WO2021098156A1 (zh) * | 2019-11-20 | 2021-05-27 | 厦门士兰明镓化合物半导体有限公司 | 倒装led芯片及其制造方法 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180073866A (ko) | 2016-12-23 | 2018-07-03 | 엘지이노텍 주식회사 | 반도체 소자 |
| KR102722845B1 (ko) * | 2017-01-25 | 2024-10-29 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 및 그 제조방법, 반도체 소자 패키지, 객체 검출 장치 |
| KR102327777B1 (ko) * | 2017-03-30 | 2021-11-17 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자, 반도체 소자 패키지, 객체 검출 장치 |
| KR102308692B1 (ko) * | 2017-03-30 | 2021-10-05 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 및 그 제조방법, 반도체 소자 패키지, 객체 검출 장치 |
| KR102311599B1 (ko) * | 2017-03-30 | 2021-10-12 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 및 그 제조방법, 반도체 소자 패키지 |
| CN110651404B (zh) * | 2017-05-19 | 2021-04-23 | Lg 伊诺特有限公司 | 激光二极管 |
| US10892297B2 (en) | 2017-11-27 | 2021-01-12 | Seoul Viosys Co., Ltd. | Light emitting diode (LED) stack for a display |
| US12100696B2 (en) | 2017-11-27 | 2024-09-24 | Seoul Viosys Co., Ltd. | Light emitting diode for display and display apparatus having the same |
| US11527519B2 (en) | 2017-11-27 | 2022-12-13 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
| US10892296B2 (en) * | 2017-11-27 | 2021-01-12 | Seoul Viosys Co., Ltd. | Light emitting device having commonly connected LED sub-units |
| US11282981B2 (en) | 2017-11-27 | 2022-03-22 | Seoul Viosys Co., Ltd. | Passivation covered light emitting unit stack |
| US10748881B2 (en) | 2017-12-05 | 2020-08-18 | Seoul Viosys Co., Ltd. | Light emitting device with LED stack for display and display apparatus having the same |
| US10886327B2 (en) | 2017-12-14 | 2021-01-05 | Seoul Viosys Co., Ltd. | Light emitting stacked structure and display device having the same |
| US11552057B2 (en) | 2017-12-20 | 2023-01-10 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
| US11522006B2 (en) | 2017-12-21 | 2022-12-06 | Seoul Viosys Co., Ltd. | Light emitting stacked structure and display device having the same |
| US11552061B2 (en) | 2017-12-22 | 2023-01-10 | Seoul Viosys Co., Ltd. | Light emitting device with LED stack for display and display apparatus having the same |
| US11114499B2 (en) | 2018-01-02 | 2021-09-07 | Seoul Viosys Co., Ltd. | Display device having light emitting stacked structure |
| US10784240B2 (en) | 2018-01-03 | 2020-09-22 | Seoul Viosys Co., Ltd. | Light emitting device with LED stack for display and display apparatus having the same |
| KR102093816B1 (ko) * | 2019-02-19 | 2020-03-26 | 엘지이노텍 주식회사 | 반도체 소자 |
| KR102212952B1 (ko) * | 2019-05-07 | 2021-02-08 | 엘지이노텍 주식회사 | 반도체 소자 |
| WO2024202662A1 (ja) * | 2023-03-24 | 2024-10-03 | ソニーセミコンダクタソリューションズ株式会社 | 発光装置および発光装置の製造方法ならびに画像表示装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163666A (zh) * | 2010-02-24 | 2011-08-24 | 乐金显示有限公司 | 混合发光二极管芯片和具有其的发光二极管器件及制造法 |
| CN103119735A (zh) * | 2010-09-24 | 2013-05-22 | 首尔半导体株式会社 | 晶片级发光二极管封装件及其制造方法 |
| US20130221398A1 (en) * | 2012-02-24 | 2013-08-29 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device and fabrication method thereof |
| US20140312369A1 (en) * | 2013-04-19 | 2014-10-23 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003124514A (ja) * | 2001-10-17 | 2003-04-25 | Sony Corp | 半導体発光素子及びその製造方法 |
| JP2006245156A (ja) | 2005-03-02 | 2006-09-14 | Ledarts Opto Corp | フリップチップ構造を具えた発光ダイオード装置 |
| KR100609118B1 (ko) | 2005-05-03 | 2006-08-08 | 삼성전기주식회사 | 플립 칩 발광다이오드 및 그 제조방법 |
| JP4359263B2 (ja) * | 2005-05-18 | 2009-11-04 | ローム株式会社 | 半導体発光装置 |
| KR100668964B1 (ko) | 2005-09-27 | 2007-01-12 | 엘지전자 주식회사 | 나노 홈을 갖는 발광 소자 및 그의 제조 방법 |
| US20090200568A1 (en) | 2006-05-02 | 2009-08-13 | Hideyoshi Horie | Semiconductor light-emitting device |
| US8368100B2 (en) * | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
| JP5449786B2 (ja) * | 2009-01-15 | 2014-03-19 | 昭和電工株式会社 | 炭化珪素半導体装置及び炭化珪素半導体装置の製造方法 |
| JP5334601B2 (ja) * | 2009-01-21 | 2013-11-06 | 株式会社東芝 | 半導体発光ダイオード素子及び半導体発光装置 |
| KR20110008550A (ko) * | 2009-07-20 | 2011-01-27 | 삼성전자주식회사 | 발광 소자 및 그 제조 방법 |
| JP5152133B2 (ja) | 2009-09-18 | 2013-02-27 | 豊田合成株式会社 | 発光素子 |
| KR101704022B1 (ko) * | 2010-02-12 | 2017-02-07 | 엘지이노텍 주식회사 | 발광소자, 발광소자의 제조방법 및 발광소자 패키지 |
| US9070851B2 (en) * | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
| JP5754173B2 (ja) | 2011-03-01 | 2015-07-29 | ソニー株式会社 | 発光ユニットおよび表示装置 |
| KR101362081B1 (ko) | 2012-12-28 | 2014-02-13 | 주식회사 위뷰 | 발광 소자 |
| JP2014150245A (ja) * | 2013-01-08 | 2014-08-21 | Rohm Co Ltd | 発光素子および発光素子パッケージ |
| KR101958419B1 (ko) * | 2013-01-29 | 2019-03-14 | 삼성전자 주식회사 | 반도체 발광 소자 |
-
2015
- 2015-03-26 KR KR1020150042659A patent/KR102434778B1/ko active Active
-
2016
- 2016-03-16 WO PCT/KR2016/002612 patent/WO2016153213A1/ko not_active Ceased
- 2016-03-16 JP JP2017543339A patent/JP6811715B2/ja active Active
- 2016-03-16 US US15/550,955 patent/US10381519B2/en active Active
- 2016-03-16 EP EP16769031.2A patent/EP3276683B1/en active Active
- 2016-03-16 CN CN201680016088.3A patent/CN107431103A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163666A (zh) * | 2010-02-24 | 2011-08-24 | 乐金显示有限公司 | 混合发光二极管芯片和具有其的发光二极管器件及制造法 |
| CN103119735A (zh) * | 2010-09-24 | 2013-05-22 | 首尔半导体株式会社 | 晶片级发光二极管封装件及其制造方法 |
| US20130221398A1 (en) * | 2012-02-24 | 2013-08-29 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device and fabrication method thereof |
| US20140312369A1 (en) * | 2013-04-19 | 2014-10-23 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110214380A (zh) * | 2017-01-25 | 2019-09-06 | Lg 伊诺特有限公司 | 半导体器件 |
| US11637227B2 (en) | 2017-01-25 | 2023-04-25 | Suzhou Lekin Semiconductor Co., Ltd. | Semiconductor device including multiple distributed bragg reflector layers |
| CN110214380B (zh) * | 2017-01-25 | 2024-04-09 | 苏州立琻半导体有限公司 | 半导体器件 |
| CN112789738A (zh) * | 2018-05-17 | 2021-05-11 | 卡任特照明解决方案有限公司 | 具有窄绿色发射的荧光体 |
| CN111063778A (zh) * | 2018-10-16 | 2020-04-24 | 合肥彩虹蓝光科技有限公司 | 一种发光二极管结构 |
| CN109904285A (zh) * | 2019-03-11 | 2019-06-18 | 合肥彩虹蓝光科技有限公司 | 一种发光二极管芯片及其制造方法 |
| WO2021098156A1 (zh) * | 2019-11-20 | 2021-05-27 | 厦门士兰明镓化合物半导体有限公司 | 倒装led芯片及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180026163A1 (en) | 2018-01-25 |
| JP2018509758A (ja) | 2018-04-05 |
| EP3276683A1 (en) | 2018-01-31 |
| KR102434778B1 (ko) | 2022-08-23 |
| EP3276683A4 (en) | 2018-09-12 |
| US10381519B2 (en) | 2019-08-13 |
| WO2016153213A1 (ko) | 2016-09-29 |
| EP3276683B1 (en) | 2020-03-11 |
| JP6811715B2 (ja) | 2021-01-13 |
| KR20160115301A (ko) | 2016-10-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171201 |
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| WD01 | Invention patent application deemed withdrawn after publication |