CN107428151A - 贴合设备的制造装置 - Google Patents

贴合设备的制造装置 Download PDF

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Publication number
CN107428151A
CN107428151A CN201680018585.7A CN201680018585A CN107428151A CN 107428151 A CN107428151 A CN 107428151A CN 201680018585 A CN201680018585 A CN 201680018585A CN 107428151 A CN107428151 A CN 107428151A
Authority
CN
China
Prior art keywords
workpiece
retaining surface
holding member
pair
workpiece retaining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680018585.7A
Other languages
English (en)
Chinese (zh)
Inventor
大谷義和
佐藤谦司
藤田也
藤田一也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Engineering Co Ltd
Original Assignee
Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Engineering Co Ltd filed Critical Shin Etsu Engineering Co Ltd
Priority to CN202210785506.2A priority Critical patent/CN115284718A/zh
Publication of CN107428151A publication Critical patent/CN107428151A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Fluid Mechanics (AREA)
  • Inorganic Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN201680018585.7A 2015-04-09 2016-02-01 贴合设备的制造装置 Pending CN107428151A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210785506.2A CN115284718A (zh) 2015-04-09 2016-02-01 贴合设备的制造装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015080336 2015-04-09
JP2015-080336 2015-04-09
PCT/JP2016/052931 WO2016163137A1 (ja) 2015-04-09 2016-02-01 貼合デバイスの製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202210785506.2A Division CN115284718A (zh) 2015-04-09 2016-02-01 贴合设备的制造装置

Publications (1)

Publication Number Publication Date
CN107428151A true CN107428151A (zh) 2017-12-01

Family

ID=57071925

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202210785506.2A Pending CN115284718A (zh) 2015-04-09 2016-02-01 贴合设备的制造装置
CN201680018585.7A Pending CN107428151A (zh) 2015-04-09 2016-02-01 贴合设备的制造装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202210785506.2A Pending CN115284718A (zh) 2015-04-09 2016-02-01 贴合设备的制造装置

Country Status (5)

Country Link
JP (1) JP6165384B2 (ja)
KR (1) KR102488733B1 (ja)
CN (2) CN115284718A (ja)
TW (1) TWI604952B (ja)
WO (1) WO2016163137A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110126247A (zh) * 2019-05-14 2019-08-16 东莞市集银智能装备有限公司 一种送料平台、具备其的全自动贴合设备及自动贴合方法
TWI826773B (zh) * 2018-07-09 2023-12-21 日商艾美柯技術股份有限公司 基板組裝裝置及基板組裝方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6255546B1 (ja) * 2016-10-17 2017-12-27 信越エンジニアリング株式会社 貼合デバイスの真空貼り合わせ装置
WO2018074013A1 (ja) * 2016-10-17 2018-04-26 信越エンジニアリング株式会社 貼合デバイスの真空貼り合わせ装置
JP6765761B2 (ja) * 2016-12-27 2020-10-07 株式会社ディスコ 静電チャック装置及び静電吸着方法
JP2018206993A (ja) * 2017-06-06 2018-12-27 日本特殊陶業株式会社 基板保持部材およびその製造方法
JP6374132B1 (ja) * 2018-04-06 2018-08-15 信越エンジニアリング株式会社 貼合デバイスの製造装置及び貼合デバイスの製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0945753A (ja) * 1995-07-28 1997-02-14 Kyocera Corp 物品保持装置
JP2004009165A (ja) * 2002-06-04 2004-01-15 Ngk Spark Plug Co Ltd 吸着用チャック
CN101026118A (zh) * 2006-02-20 2007-08-29 精工电子有限公司 传送机构
WO2008114337A1 (ja) * 2007-02-22 2008-09-25 Shin-Etsu Engineering Co., Ltd. 真空貼り合わせ方法及び真空貼り合わせ装置
TWI307420B (ja) * 2000-11-30 2009-03-11 Anelva Corp
JP5654155B1 (ja) * 2014-04-04 2015-01-14 信越エンジニアリング株式会社 ワーク貼り合わせ装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5523941A (en) * 1978-08-09 1980-02-20 Agency Of Ind Science & Technol Immobilization of enzyme using water-soluble photo- crosslinkable resin
JP2003332411A (ja) * 2002-05-17 2003-11-21 Nikon Corp 基板保持装置及び露光装置
JP3926231B2 (ja) * 2002-07-18 2007-06-06 鹿児島日本電気株式会社 液晶表示装置の製造方法
JP2005199380A (ja) * 2004-01-15 2005-07-28 Fujikura Rubber Ltd 吸引保持用の緩衝材
JP4899357B2 (ja) * 2005-07-01 2012-03-21 株式会社Ｉｈｉ 基板吸着装置
WO2009063877A1 (ja) * 2007-11-13 2009-05-22 Ulvac, Inc. 可動子、処理ステージ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0945753A (ja) * 1995-07-28 1997-02-14 Kyocera Corp 物品保持装置
TWI307420B (ja) * 2000-11-30 2009-03-11 Anelva Corp
JP2004009165A (ja) * 2002-06-04 2004-01-15 Ngk Spark Plug Co Ltd 吸着用チャック
CN101026118A (zh) * 2006-02-20 2007-08-29 精工电子有限公司 传送机构
WO2008114337A1 (ja) * 2007-02-22 2008-09-25 Shin-Etsu Engineering Co., Ltd. 真空貼り合わせ方法及び真空貼り合わせ装置
JP5654155B1 (ja) * 2014-04-04 2015-01-14 信越エンジニアリング株式会社 ワーク貼り合わせ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826773B (zh) * 2018-07-09 2023-12-21 日商艾美柯技術股份有限公司 基板組裝裝置及基板組裝方法
CN110126247A (zh) * 2019-05-14 2019-08-16 东莞市集银智能装备有限公司 一种送料平台、具备其的全自动贴合设备及自动贴合方法

Also Published As

Publication number Publication date
TW201641293A (zh) 2016-12-01
JPWO2016163137A1 (ja) 2017-08-10
WO2016163137A1 (ja) 2016-10-13
TWI604952B (zh) 2017-11-11
KR20170135839A (ko) 2017-12-08
KR102488733B1 (ko) 2023-01-13
CN115284718A (zh) 2022-11-04
JP6165384B2 (ja) 2017-07-19

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Legal Events

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20171201

RJ01 Rejection of invention patent application after publication