CN107381034B - Automatic circuit board feeding device - Google Patents
Automatic circuit board feeding device Download PDFInfo
- Publication number
- CN107381034B CN107381034B CN201710797195.0A CN201710797195A CN107381034B CN 107381034 B CN107381034 B CN 107381034B CN 201710797195 A CN201710797195 A CN 201710797195A CN 107381034 B CN107381034 B CN 107381034B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- opening
- plate
- platform
- sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/901—Devices for picking-up and depositing articles or materials provided with drive systems with rectilinear movements only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/905—Control arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an automatic circuit board feeding device which comprises a feeding mechanism and a manipulator, wherein the feeding mechanism comprises a clamping mechanism, a second rack and a board loading mechanism; a second horizontal sliding mechanism is arranged on the second rack table surface and comprises a first end and a second end along the track direction, and the area, close to the first end, on one side of the second horizontal sliding mechanism is used as a board loading area; the plate loading mechanism is arranged on the second horizontal sliding mechanism in a sliding manner; the clamping mechanism is fixedly arranged on the table top of the second rack and is positioned on one side of the second end of the second horizontal sliding mechanism; the plate loading mechanism comprises a support plate, and a vacuum suction plate mechanism and a clamp opening mechanism which are arranged on the support plate; after the circuit board is grabbed, the manipulator pushes the circuit board to a board mounting area; the circuit board is adsorbed at the first end in vacuum by the board loading mechanism and then slides to the second end, and the electroplating clamp is opened by the board loading mechanism to complete the loading and clamping of the circuit board. The invention can greatly improve the stability of the feeding operation for the circuit board, especially for thin plates and ultrathin plates.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to an automatic circuit board feeding device.
Background
Electroplating is an important process in the production and manufacturing process of circuit boards, and is a process of depositing a plating layer on a substrate by an electrolytic method.
Before electroplating, a circuit board to be electroplated needs to be loaded on an electroplating clamp, the conventional feeding mode is that the circuit board is directly grabbed from a material tray through a manipulator and is conveyed to the position of the electroplating clamp, and the subsequent clamping operation is finished manually, so that the defects of low automation degree and poor feeding stability exist.
Disclosure of Invention
The invention aims to provide an automatic circuit board feeding device which can realize automatic feeding operation with good stability.
In order to achieve the purpose, the invention adopts the following technical scheme:
an automatic circuit board feeding device comprises a feeding mechanism and a manipulator, wherein the manipulator is used for grabbing a circuit board and pushing the circuit board to the feeding mechanism; the feeding mechanism further comprises a second rack and a plate loading mechanism;
a second horizontal sliding mechanism is arranged on the table top of the second rack, the second horizontal sliding mechanism comprises a first end and a second end along the sliding track direction of the second horizontal sliding mechanism, and the area, close to the first end, of one side of the second horizontal sliding mechanism is used as a plate loading area;
the plate loading mechanism is arranged on the second horizontal sliding mechanism in a sliding manner; the clamping mechanism is fixedly arranged on the table top of the second rack and is positioned on one side of the second end of the second horizontal sliding mechanism;
the plate loading mechanism comprises a support plate, and a vacuum suction plate mechanism and a clamp opening mechanism which are arranged on the support plate;
after the circuit board is grabbed, the manipulator pushes the circuit board to the board loading area; the circuit board is vacuum-adsorbed at the first end by the board loading mechanism and then slides to the second end, and the electroplating clamp is opened by the board loading mechanism to complete the loading and clamping of the circuit board.
Optionally, the automatic circuit board feeding device further comprises a shaping mechanism for shaping the circuit board before feeding;
the shaping mechanism comprises a smooth surface platform, a pressing plate mechanism and a vacuum pump;
the smooth surface platform is connected with a vacuum pump, and a plurality of air suction holes are formed in the table top of the smooth surface platform;
the pressing plate mechanism comprises a first rack, a first horizontal sliding mechanism is fixed on a table top of the first rack, a vertical sliding mechanism is arranged on the first horizontal sliding mechanism in a sliding mode, a roller wheel support is arranged on the vertical sliding mechanism in a sliding mode, a roller wheel is fixedly arranged on the roller wheel support, and the length direction of the roller wheel is parallel to the table top of the smooth surface platform;
and the manipulator grabs the shaped circuit board from the smooth surface platform and pushes the circuit board to the board loading area.
Optionally, the automatic circuit board feeding device further includes a conveying mechanism, and an outlet end of the conveying mechanism is connected to an inlet end of the smooth surface platform.
Optionally, an industrial camera connected with a computer end is fixedly arranged above the smooth surface platform, and a shooting range of the industrial camera covers the whole smooth surface platform;
and the computer end is used for obtaining the specific position of the current circuit board on the smooth surface platform according to the shot picture of the industrial camera, calculating to obtain compensation adjustment data, and controlling the manipulator to adjust the grabbing posture according to the compensation adjustment data.
Optionally, the plate loading mechanism further comprises a rotating platform and a support plate base; the carrier plate is fixed on the carrier plate base;
the rotary platform is slidably mounted on the second horizontal sliding mechanism, and a rotary shaft of the rotary platform is vertical to the table top of the second rack; the top surface of the rotating platform is provided with a horizontal second sliding rail, and the support plate base is arranged on the second sliding rail in a sliding manner.
Optionally, the vacuum suction plate mechanism includes a first slide rail, a vacuum pump, and two vacuum suction plate bars connected to the vacuum pump; the first sliding rail is horizontally arranged on the support plate, and the two vacuum suction strips are arranged on the first sliding rail in a sliding manner in parallel and vertically.
Optionally, the clamping mechanism includes a third frame, and the third frame is provided with a top clamping mechanism and an auxiliary clamp opening and closing mechanism.
Optionally, a cathode shielding plate opening and closing mechanism is further disposed on the third frame.
Optionally, the auxiliary clamp opening and closing mechanism comprises a first opening and closing motor, a first sliding rail screw rod, a left auxiliary clamp opening and closing part and a right auxiliary clamp opening and closing part; the left auxiliary clamp opening and closing part and the right auxiliary clamp opening and closing part are respectively connected to two ends of a first sliding rail screw rod, and the first sliding rail screw rod is connected with a first opening and closing motor;
the cathode shield opening and closing mechanism comprises a second opening and closing motor, a second slide rail screw rod, a left cathode shield opening and closing part and a right cathode shield opening and closing part; the left cathode shield opening and closing part and the right cathode shield opening and closing part are respectively connected to two ends of a second sliding rail screw rod, and the second sliding rail screw rod is connected with a second opening and closing motor.
Optionally, the initial position of the roller is located at an inlet end of the smooth surface platform, the roller is parallel to a side edge of the inlet end of the smooth surface platform, and a slidable distance of the roller in the horizontal direction is not less than a vertical distance between the inlet end and the outlet end of the smooth surface platform.
The invention has the following beneficial effects:
1) In the embodiment, the circuit board is shaped in advance before being loaded to the electroplating clamp, so that the easily deformed thin plate, especially an ultrathin plate, can be flattened, and the stability of subsequent clamping operation can be greatly improved;
2) After the circuit board is shaped, the manipulator firstly carries out corresponding posture adjustment according to the current position of the circuit board and then grabs the circuit board, so that the accurate grabbing requirements of the circuit boards with different specifications are met, and the problem of inaccurate grabbing caused by position deviation of the circuit board can be solved, thereby ensuring the accuracy of the board loading position of the circuit board on the board loading mechanism and further improving the stability of subsequent clamping operation;
3) In the embodiment, the circuit board is conveyed to the clamping mechanism by the manipulator by the board clamping mechanism, so that the circuit board can be quickly, accurately and reliably conveyed; the vacuum suction plate strips with adjustable intervals are adopted on the plate loading mechanism, so that the vacuum suction plate strip is suitable for circuit boards with different sizes, and generates larger suction force on the circuit boards, thereby ensuring the reliability of the conveying process;
4) The electroplating clamp applicable to the existing clamping mechanism only has a main clamp and does not have an auxiliary clamp and a cathode shielding plate; and the clamping machine of this embodiment not only can open and shut the main clamp automatically, can also open and shut vice clamp and negative pole sunshade automatically, is applicable to simple and complicated electroplating and presss from both sides, and degree of automation is higher, has improved material loading efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is an overall structural view of an automatic circuit board feeding device according to an embodiment of the present invention;
fig. 2 is a structural view of a platen mechanism 220 according to an embodiment of the present invention;
fig. 3 is a structural view of a feeding mechanism 300 according to an embodiment of the present invention;
illustration of the drawings: the device comprises a conveying mechanism 100, a shaping mechanism 200, a feeding mechanism 300, a smooth platform 210, a plate pressing mechanism 220, an industrial camera 230, a camera support 240, a first frame 221, a first horizontal sliding mechanism 222, a vertical sliding mechanism 223, a roller support 224, a roller 225, a second frame 310, a plate loading mechanism 320, a clamping mechanism 330, a second horizontal sliding mechanism 311, a rotating platform 321, a support plate base 322, a support plate 323, a vacuum suction plate bar 324, a clamping mechanism 325, a first sliding rail 326, a second sliding rail 327, a third frame 331, a top clamping mechanism 332, a sub-clamping opening and closing mechanism 333 and a cathode shielding plate opening and closing mechanism 334.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Referring to fig. 1, the present embodiment provides an automatic circuit board feeding device, which mainly includes the following components: a transfer mechanism 100, a shaping mechanism 200, a robot (not shown), and a feed mechanism 300.
In this embodiment, the conveying mechanism 100, the shaping mechanism 200, and the feeding mechanism 300 are sequentially arranged, the circuit board is automatically conveyed from the conveying mechanism 100 to the shaping mechanism 200, and after the shaping operation is completed at the shaping mechanism 200, the circuit board is conveyed to the feeding mechanism 300 by a manipulator to complete the automatic feeding operation.
Each of the parts will be described in detail below.
(1) The outlet end of the transfer mechanism 100 is connected to the inlet end of the shaping mechanism 200, and is used for sequentially conveying the circuit boards to the shaping mechanism 200 at the initial moment. The conveying mechanism 100 can be realized by an automatic conveying structure composed of a plurality of rollers arranged in parallel as shown in fig. 1, and can also be realized by a conveyor belt, which is not limited in particular.
(2) And the shaping mechanism 200 is used for shaping the circuit board before loading so as to ensure the stability of subsequent loading operation and electroplating quality. The shaping mechanism 200 includes a smooth platen 210, a platen mechanism 220, and a vacuum pump (not shown) connected to the smooth platen 210.
The inlet end of the smooth platform 210 is connected to the outlet end of the conveying mechanism 100, and the smooth platform 210 has a plurality of air suction holes uniformly formed on the surface thereof, so that the vacuum pump can be used for vacuuming, thereby smoothly and tightly adsorbing the circuit board conveyed to the smooth platform 210 on the smooth platform 210.
Referring to fig. 1 and fig. 2, the pressing plate mechanism 220 includes a first frame 221, a first horizontal sliding mechanism 222 is fixed on a table of the first frame 221, a vertical sliding mechanism 223 is slidably disposed on the first horizontal sliding mechanism 222, a roller bracket 224 is slidably disposed on the vertical sliding mechanism 223, a roller 225 is fixedly disposed on the roller bracket 224, and a length direction of the roller 225 is parallel to the table of the smooth platform 210.
The roller 225 can be moved not only in the horizontal direction but also in the vertical direction by the action of the first horizontal sliding mechanism 222 and the vertical sliding mechanism 223. The roller 225 functions as: after the circuit board is vacuum-adsorbed on the smooth platform 210, the circuit board surface is rolled to make the circuit board flat, thereby achieving the purpose of shaping.
To achieve a good shaping effect, the entire circuit board needs to be rolled to avoid missing the corner area of the circuit board, so the horizontal motion track of the roller 225 needs to cover the entire smooth platform 210. Therefore, in this embodiment, the initial position of the roller 225 is set at the entrance end of the smooth platform 210, the roller 225 is parallel to the side edge of the entrance end of the smooth platform 210, and the slidable distance of the roller 225 in the horizontal direction is not less than the vertical distance between the entrance end and the exit end of the smooth platform 210, so that the rolling surface of the roller 225 can cover the entrance end to the exit end of the smooth platform 210, that is, the entire smooth platform 210.
The specific operation process of shaping the circuit board by applying the shaping mechanism 200 is as follows:
at the initial moment, the roller 225 stays above the entrance end of the smooth platform 210;
when the circuit board is transported to the smooth platform 210 by the transport mechanism 100, the vacuum pump pumps vacuum to tightly adhere the circuit board to the surface of the smooth platform 210;
the height of the roller 225 is reduced through the vertical sliding mechanism 223, so that the roller 225 is pressed against the circuit board; then, the first horizontal sliding mechanism 222 controls the roller 225 to move from the inlet end to the outlet end of the smooth platform 210 and then return to the inlet end, so as to roll the whole circuit board;
after the roller 225 returns to the entrance end, the height of the roller 225 is raised by the vertical sliding mechanism 223, so that the roller 225 and the circuit board are separated from each other and located at a position above the entrance end of the smooth platform 210, and thus the shaping operation of the circuit board is completed.
During the shaping operation, the number of times the circuit board is rolled by the roller 225 may be set as required to achieve the best shaping effect.
(3) And the manipulator is arranged on one side of the smooth surface platform 210 and used for pushing the shaped circuit board on the smooth surface platform 210 to a preset board loading position on the feeding mechanism 300.
Due to the existence of various external factors (for example, the circuit board is inclined due to the action of external force) or self factors (for example, the specifications of the circuit board are different), the coordinate positions of the circuit boards on the smooth surface platform 210 cannot be kept completely consistent all the time, so that the loading position of the circuit board is easy to deviate, and the final clamping effect and the electroplating effect are influenced.
Therefore, in this embodiment, an automatic compensation adjustment function is further added:
an industrial camera 230 is additionally arranged above the central point of the smooth surface platform 210, the shooting range of the industrial camera can cover the whole smooth surface platform 210, and the industrial camera is used for shooting the smooth surface platform 210 and sending the shot to a computer end after the shaping mechanism 200 finishes shaping operation on the circuit board;
the computer end obtains the specific position of the current circuit board on the smooth surface platform 210 from the picture, and calculates compensation adjustment data according to the specific position;
the manipulator firstly performs corresponding posture adjustment according to the compensation adjustment data, and then grabs the circuit board on the smooth surface platform 210 and pushes the circuit board to the feeding mechanism 300, so that the accuracy of the feeding position of each circuit board is ensured.
In order to save the assembly space of the industrial camera 230 and improve the assembly convenience, in the embodiment, a camera support 240 is fixedly disposed on the top surface of the first frame 221 of the pressing plate mechanism 220, and the industrial camera 230 is fixed on the camera support 240.
(4) And a feeding mechanism 300 for completing the feeding operation of the circuit board.
As shown in fig. 1 and 3, the loading mechanism 300 includes a second frame 310, a loader mechanism 320, and a clamper 330.
A second horizontal sliding mechanism 311 is disposed on the table top of the second frame 310, the second horizontal sliding mechanism 311 includes a first end and a second end along the sliding track direction, the first end is close to the smooth surface platform 210, and the second end is far away from the smooth surface platform 210.
The plate loading mechanism 320 is slidably arranged on the second horizontal sliding mechanism 311 and can reciprocate between the first end and the second end along the sliding track; the clamping mechanism 330 is fixedly disposed on the table of the second frame 310 and located at one side of the second end of the second horizontal sliding mechanism 311.
The board loading mechanism 320 is used for absorbing the circuit board conveyed by the mechanical hand and conveying the circuit board to the clamping mechanism 330. This loader mechanism 320 includes: a rotary platform 321, a carrier plate base 322, a carrier plate 323, a vacuum suction strip 324 and a clamp opening mechanism 325.
The carrier plate 323 is fixed on the carrier plate base 322, a horizontal first slide rail 326 is arranged on the carrier plate 323, two parallel and vertical vacuum suction plate bars 324 are slidably arranged on the first slide rail 326, and the distance between the two vacuum suction plate bars 324 can be adjusted according to the size of the circuit board to adapt to the circuit boards with different specifications. The top of the carrier plate 323 is further provided with a clamp opening mechanism 325 driven by an air cylinder, and the clamp opening mechanism 325 can move upwards under the driving action of the air cylinder to push the main clamp of the electroplating clamp to open.
The rotating platform 321 is slidably mounted on the second horizontal sliding mechanism 311, can slide along the track of the second horizontal sliding mechanism 311, and can also rotate, and the rotating shaft is perpendicular to the table top of the second rack 310. A horizontal second slide rail 327 is disposed on the top surface of the rotating platform 321, a track direction of the second slide rail 327 is perpendicular to a track direction of the first slide rail 326, and the carrier board base 322 carrying the carrier board 323 is slidably disposed on the second slide rail 327.
The plate mounting process of the plate mounting mechanism 320 specifically includes:
at the initial time of loading, the plate loading mechanism 320 is located at the first end of the second horizontal sliding mechanism 311 close to the smooth platform 210; when the manipulator grabs the circuit board and pushes the circuit board to the front of the board loading mechanism 320, the carrier plate 323 drives the vacuum suction plate strip 324 to move forward towards the manipulator along the second track until the vacuum suction plate strip 324 sucks the circuit board on the manipulator; after the vacuum suction bar 324 sucks the circuit board, the rotary platform 321 rotates 180 degrees and horizontally slides to the second end of the second horizontal sliding mechanism 311 so that the circuit board faces the chuck 330. Therefore, the loader 320 can quickly, reliably and accurately transport the circuit board from the robot position to the position where the loader 330 is located.
The clamping mechanism 330 is used for opening and closing an electroplating clamp (not shown in the figure) and loading the circuit board onto the electroplating clamp under the cooperation of the plate loading mechanism 320.
The clamping mechanism 330 comprises a third frame 331, and the third frame 331 is sequentially provided with a top clamping mechanism 332, an auxiliary clamping opening and closing mechanism 333 and a cathode shielding plate opening and closing mechanism 334 from top to bottom. Because some electroplating clamps on the market at present comprise an auxiliary clamp and a cathode shielding plate besides a main clamp, in order to meet the automatic clamping opening requirement of the electroplating clamp with such a structure to improve the clamping efficiency, compared with the conventional clamping mechanism 330, the clamping mechanism 330 of the embodiment further comprises an auxiliary clamp opening and closing mechanism 333 and a cathode shielding plate opening and closing mechanism 334.
The top clamping mechanism 332 of the clamping mechanism 330 and the opening clamping mechanism 325 of the plate clamping mechanism 320 cooperate with each other to open and close the main clamp of the electroplating clamp, specifically: when the front faces of the plate loading mechanism 320 and the clamping mechanism 330 are opposite, the clamp opening mechanism 325 is lifted to push the main clamp to open, and meanwhile, the top clamping mechanism 332 is abutted against the main clamp to prevent the main clamp from moving when being opened by stress.
The sub-clip opening and closing mechanism 333 includes a first opening and closing motor, a first slide rail screw, a left sub-clip opening and closing portion, and a right sub-clip opening and closing portion; the left auxiliary clamp opening and closing part and the right auxiliary clamp opening and closing part are respectively connected with a first sliding rail screw rod, and the first sliding rail screw rod is connected with a first opening and closing motor. When the first opening and closing motor rotates forwards or reversely, the distance between the opening and closing part of the left auxiliary clamp and the opening and closing part of the right auxiliary clamp is increased or reduced, so that the auxiliary clamps are opened and closed.
The cathode shutter opening and closing mechanism 334 includes a second opening and closing motor, a second slide rail screw, a left cathode shutter opening and closing portion, and a right cathode shutter opening and closing portion; the left cathode shield opening and closing part and the right cathode shield opening and closing part are respectively connected with a second slide rail screw rod, and the second slide rail screw rod is connected with a second opening and closing motor. When the second opening and closing motor rotates forwards or reversely, the distance between the opening and closing part of the left cathode shield and the opening and closing part of the right cathode shield is increased or reduced, so that the opening and closing of the cathode shields are realized.
The specific process of loading the circuit board on the electroplating clamp comprises the following steps: when the plate loading mechanism 320 moves to the clamping mechanism 330, the sub-clamp and the cathode shield of the electroplating clamp are respectively opened through the sub-clamp opening and closing mechanism 333 and the cathode shield opening and closing mechanism 334; the clamp opening mechanism 325 ascends, the main clamp of the electroplating clamp is opened under the cooperation of the top clamp mechanism 332, and the circuit board enters the electroplating clamp; when the main clamp, the auxiliary clamp and the cathode shielding plate of the electroplating clamp are closed, the electroplating clamp can stably clamp the circuit board, and then the normal electroplating process is carried out.
To sum up, the process of using the automatic circuit board feeding device of this embodiment to carry out the material loading is: firstly, automatically conveying the circuit board to the smooth surface platform 210 by the conveying mechanism 100, and performing rolling shaping on the circuit board after the circuit board is vacuum-absorbed by the smooth surface platform 210; then, the manipulator grabs the circuit board after performing corresponding posture adjustment and conveys the circuit board to the front of the board loading mechanism 320; the suction strips of the board mounting mechanism 320 move forward to suck the circuit board, and then rotate 180 degrees and move to the clamping mechanism 330; and opening the electroplating clamp to enable the circuit board to enter the electroplating clamp, and closing the electroplating clamp, so that the electroplating clamp clamps the circuit board, thereby finishing the loading operation of the circuit board.
Compare with current simple manipulator material loading mode, this embodiment has following characteristics:
1. before the circuit board is loaded to the electroplating clamp, the circuit board is shaped in advance at the smooth surface platform 210, so that the easily deformed thin plate, especially the ultrathin plate, can be flattened, and the stability of subsequent clamping operation can be greatly improved;
2. after the circuit board is shaped, compensation adjustment calculation is carried out on the coordinate position of the current circuit board on the smooth surface platform 210, and the manipulator grabs the circuit board after carrying out corresponding posture adjustment, so that the accurate grabbing requirement of the circuit boards with different specifications is met, and the problem of inaccurate grabbing caused by circuit board position deviation can be solved, so that the accuracy of the board installing position of the circuit board on the board installing mechanism 320 is ensured, and the stability of subsequent clamping operation is further improved;
3. in this embodiment, the board loading mechanism 320 is adopted to transport the circuit board from the manipulator to the board loading mechanism 330, so as to ensure that the circuit board can be transported quickly, accurately and reliably; the board mounting mechanism 320 adopts the vacuum suction boards with adjustable intervals, can be suitable for circuit boards with different sizes, generates larger suction force to the circuit boards and ensures the reliability of the conveying process;
4. the electroplating clamp suitable for the existing clamping mechanism 330 only has a main clamp and does not have an auxiliary clamp and a cathode shielding plate; the clamping mechanism 330 of the embodiment can automatically open and close the main clamp, the auxiliary clamp and the cathode shielding plate, is suitable for simple and complex electroplating clamps, has higher automation degree, and improves the feeding efficiency.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. An automatic circuit board feeding device comprises a feeding mechanism and a manipulator, wherein the manipulator is used for grabbing a circuit board and pushing the circuit board to the feeding mechanism; the automatic plate loading device is characterized in that the feeding mechanism further comprises a second rack and a plate loading mechanism;
a second horizontal sliding mechanism is arranged on the table top of the second rack, the second horizontal sliding mechanism comprises a first end and a second end along the sliding track direction of the second horizontal sliding mechanism, and the area, close to the first end, of one side of the second horizontal sliding mechanism is used as a plate loading area;
the plate loading mechanism is arranged on the second horizontal sliding mechanism in a sliding manner; the clamping mechanism is fixedly arranged on the table top of the second rack and is positioned on one side of the second end of the second horizontal sliding mechanism;
the plate loading mechanism comprises a support plate, a vacuum suction plate mechanism arranged on the support plate and a clamp opening mechanism arranged at the top of the support plate and driven by an air cylinder, wherein the clamp opening mechanism can move upwards under the driving action of the air cylinder to push a main clamp of the electroplating clamp to open;
after the circuit board is grabbed, the manipulator pushes the circuit board to the board loading area; the circuit board is vacuum-adsorbed at the first end by the board loading mechanism and then slides to the second end, and the electroplating clamp is opened by the clamping mechanism to complete clamping of the circuit board;
the clamping mechanism comprises a third rack, and a top clamping mechanism, an auxiliary clamp opening and closing mechanism and a cathode shield opening and closing mechanism are arranged on the third rack;
the auxiliary clamp opening and closing mechanism comprises a first opening and closing motor, a first sliding rail screw rod, a left auxiliary clamp opening and closing part and a right auxiliary clamp opening and closing part; the left auxiliary clamp opening and closing part and the right auxiliary clamp opening and closing part are respectively connected to two ends of a first sliding rail screw rod, and the first sliding rail screw rod is connected with a first opening and closing motor;
the cathode shield plate opening and closing mechanism comprises a second opening and closing motor, a second slide rail screw rod, a left cathode shield plate opening and closing part and a right cathode shield plate opening and closing part; the left cathode shield opening and closing part and the right cathode shield opening and closing part are respectively connected to two ends of a second slide rail screw rod, and the second slide rail screw rod is connected with a second opening and closing motor.
2. The automatic circuit board feeding device according to claim 1, further comprising a shaping mechanism for shaping the circuit board before feeding;
the shaping mechanism comprises a smooth surface platform, a pressing plate mechanism and a vacuum pump;
the smooth surface platform is connected with a vacuum pump, and a plurality of air extraction holes are formed in the table top of the smooth surface platform;
the pressing plate mechanism comprises a first rack, a first horizontal sliding mechanism is fixed on a table top of the first rack, a vertical sliding mechanism is arranged on the first horizontal sliding mechanism in a sliding mode, a roller wheel support is arranged on the vertical sliding mechanism in a sliding mode, a roller wheel is fixedly arranged on the roller wheel support, and the length direction of the roller wheel is parallel to the table top of the smooth surface platform;
and the manipulator grabs the shaped circuit board from the smooth surface platform and pushes the circuit board to the board loading area.
3. The automatic circuit board feeding device according to claim 2, further comprising a transfer mechanism, wherein an outlet end of the transfer mechanism is connected to an inlet end of the smooth platform.
4. The automatic circuit board feeding device according to claim 2, wherein an industrial camera connected with a computer end is fixedly arranged above the smooth platform, and a shooting range of the industrial camera covers the whole smooth platform;
and the computer end is used for obtaining the specific position of the current circuit board on the smooth surface platform according to the shot picture of the industrial camera, calculating to obtain compensation adjustment data, and controlling the manipulator to adjust the grabbing posture according to the compensation adjustment data.
5. The automatic circuit board feeding device according to claim 1, wherein said board loading mechanism further comprises a rotary platform and a carrier board base; the carrier plate is fixed on the carrier plate base;
the rotating platform is slidably mounted on the second horizontal sliding mechanism, and a rotating shaft of the rotating platform is perpendicular to the table top of the second rack; the top surface of the rotating platform is provided with a horizontal second sliding rail, and the support plate base is arranged on the second sliding rail in a sliding manner.
6. The automatic circuit board feeding device according to claim 1 or 5, wherein the vacuum suction plate mechanism comprises a first slide rail, a vacuum pump and two vacuum suction plate bars connected with the vacuum pump; the first sliding rail is horizontally arranged on the support plate, and the two vacuum suction strips are arranged on the first sliding rail in a sliding manner in parallel and vertically.
7. The automatic circuit board feeding device according to claim 2, wherein the initial position of the roller is located at the entrance end of the smooth platform, the roller is parallel to the side edge of the entrance end of the smooth platform, and the slidable distance of the roller in the horizontal direction is not less than the vertical distance between the entrance end and the exit end of the smooth platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710797195.0A CN107381034B (en) | 2017-09-06 | 2017-09-06 | Automatic circuit board feeding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710797195.0A CN107381034B (en) | 2017-09-06 | 2017-09-06 | Automatic circuit board feeding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107381034A CN107381034A (en) | 2017-11-24 |
| CN107381034B true CN107381034B (en) | 2023-01-24 |
Family
ID=60349307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710797195.0A Active CN107381034B (en) | 2017-09-06 | 2017-09-06 | Automatic circuit board feeding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107381034B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109710543B (en) * | 2018-11-28 | 2023-02-17 | 深圳市燕麦科技股份有限公司 | Stock tray counting marking method and device |
| CN109554736A (en) * | 2018-12-11 | 2019-04-02 | 佛山市阳和智能科技有限公司 | One kind can pinpoint circuit board electroplating line intelligence method for charging and discharging plate |
| CN112638036B (en) * | 2019-10-09 | 2022-04-29 | 捷惠自动机械股份有限公司 | Target drilling equipment |
| CN115818245B (en) * | 2023-02-22 | 2023-05-09 | 遂宁睿杰兴科技有限公司 | Circuit board loading attachment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM240452U (en) * | 2003-05-15 | 2004-08-11 | Applied Equipment Ltd | Material loading/unloading device for P.C.B. electroplating device |
| CN103952749A (en) * | 2014-05-16 | 2014-07-30 | 昆山东威电镀设备技术有限公司 | Circuit board feeding and clamping system and full-automatic circuit board clamping system |
| CN104928751A (en) * | 2015-06-25 | 2015-09-23 | 东莞宇宙电路板设备有限公司 | Synchronous automatic opening fixture device |
| CN204849095U (en) * | 2015-08-18 | 2015-12-09 | 昆山科比精工设备有限公司 | It presss from both sides device to electroplate automatic opening |
| CN105239138A (en) * | 2015-09-30 | 2016-01-13 | 东莞市威力固电路板设备有限公司 | Unloading system for electroplating equipment and control method |
| CN106087015A (en) * | 2016-07-01 | 2016-11-09 | 广州明毅电子机械有限公司 | A kind of electroplating device automatic board descending machine |
| CN106676615A (en) * | 2017-03-13 | 2017-05-17 | 深圳市盛泓量科技有限公司 | Rapid sliding block electroplating clamp and electroplating clamp component |
| CN207329729U (en) * | 2017-09-06 | 2018-05-08 | 东莞市威力固电路板设备有限公司 | A kind of circuit board automatic charging device |
-
2017
- 2017-09-06 CN CN201710797195.0A patent/CN107381034B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM240452U (en) * | 2003-05-15 | 2004-08-11 | Applied Equipment Ltd | Material loading/unloading device for P.C.B. electroplating device |
| CN103952749A (en) * | 2014-05-16 | 2014-07-30 | 昆山东威电镀设备技术有限公司 | Circuit board feeding and clamping system and full-automatic circuit board clamping system |
| CN104928751A (en) * | 2015-06-25 | 2015-09-23 | 东莞宇宙电路板设备有限公司 | Synchronous automatic opening fixture device |
| CN204849095U (en) * | 2015-08-18 | 2015-12-09 | 昆山科比精工设备有限公司 | It presss from both sides device to electroplate automatic opening |
| CN105239138A (en) * | 2015-09-30 | 2016-01-13 | 东莞市威力固电路板设备有限公司 | Unloading system for electroplating equipment and control method |
| CN106087015A (en) * | 2016-07-01 | 2016-11-09 | 广州明毅电子机械有限公司 | A kind of electroplating device automatic board descending machine |
| CN106676615A (en) * | 2017-03-13 | 2017-05-17 | 深圳市盛泓量科技有限公司 | Rapid sliding block electroplating clamp and electroplating clamp component |
| CN207329729U (en) * | 2017-09-06 | 2018-05-08 | 东莞市威力固电路板设备有限公司 | A kind of circuit board automatic charging device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107381034A (en) | 2017-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107381034B (en) | Automatic circuit board feeding device | |
| CN106216173B (en) | A kind of Full-automatic spot gluing, frictioning, unloader | |
| CN109838434B (en) | Automatic dispensing and screen pasting system | |
| CN110191593B (en) | Automatic paster mechanism | |
| CN111229531A (en) | Rubber coating banding production line | |
| CN208732084U (en) | A kind of optical frames label takes the automatic loading/unloading equipment of machine | |
| CN215591112U (en) | Workpiece film laminating machine | |
| CN206645524U (en) | A kind of PCB clamping delivery mechanism | |
| CN207329729U (en) | A kind of circuit board automatic charging device | |
| CN110677799A (en) | Loudspeaker magnetic circuit gluing automatic production line | |
| CN108437352A (en) | A kind of full-automatic rolling film sticking apparatus of injection molding machine peripheral hardware | |
| CN212120590U (en) | Rubber coating banding production line | |
| TW201914936A (en) | Carrying base capable of achieving more precise positioning | |
| CN210986429U (en) | Loudspeaker magnetic circuit gluing automatic production line | |
| CN211759588U (en) | Cell-phone camera support equipment | |
| CN111908103A (en) | Automatic change production with defeated material mechanism | |
| CN111715476A (en) | Full-automatic glue dispensing system for VCM module | |
| CN116652395B (en) | Automatic feeding and discharging and high-precision laser marking equipment for single IC chip strip trolley | |
| CN111715491A (en) | Dispensing method for VCM module | |
| CN111891731A (en) | Integrated circuit intelligent manufacturing feeding device | |
| CN218854905U (en) | Positive and negative detection device of iron core | |
| CN111251046A (en) | A feed mechanism for processing motor support spare part | |
| CN217349867U (en) | Feeding equipment is used in tinplate processing | |
| CN209920530U (en) | High accuracy carousel formula laminating equipment | |
| CN112635367B (en) | Linear die bonder and die bonding method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |