CN109554736A - One kind can pinpoint circuit board electroplating line intelligence method for charging and discharging plate - Google Patents
One kind can pinpoint circuit board electroplating line intelligence method for charging and discharging plate Download PDFInfo
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- CN109554736A CN109554736A CN201811509114.3A CN201811509114A CN109554736A CN 109554736 A CN109554736 A CN 109554736A CN 201811509114 A CN201811509114 A CN 201811509114A CN 109554736 A CN109554736 A CN 109554736A
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- plating
- wiring board
- lower plates
- general controller
- clamping
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to circuit board plating process fields, especially one kind can pinpoint circuit board electroplating line intelligence method for charging and discharging plate, it replaces manually operating the upper and lower plates that winged Ba Jinhang wiring board is electroplated by upper and lower plates robot, and deformation that plating flies bar being detected by vision inspection apparatus and analytical calculation goes out angular deviation, angle compensation is made during upper and lower plates by control upper and lower plates robot.The present invention provides one kind can pinpoint circuit board electroplating line intelligence method for charging and discharging plate, while vision inspection apparatus can accurately obtain 3D data, position compensation is carried out to the plating on winged bar of the plating to deform, guarantee that plating folder can steadily clamp wiring board, greatly reduces the board falling rate in plating step.
Description
Technical field
The present invention relates to circuit board plating process field, especially one kind can pinpoint circuit board electroplating line intelligence
Method for charging and discharging plate.
Background technique
Plating flies bar important component for being circuit board electroplating line, and effect is to fix wiring board, and wiring board is transferred
It is electroplated to different electroplating pools, upper and lower plates are the important procedures in the plating production stage of assist side.
Traditional circuit board electroplating line mostly uses greatly the mode of artificial upper and lower plates, i.e., manually the wiring board not being electroplated also
The plating folder being electroplated on winged bar is moved to be clamped or manually take being electroplated on winged bar of plating completes plating route on folder
Under, working efficiency is low.The step of edge that four sides of wiring board can reserve about 5mm is used to clamp, manual operation is easy so that folder
Tight position is unstable, causes to fly bar that board falling occurs in the handling, plating even upper and lower plates the step of, board falling rate is high, reduces life
It also will increase production cost while producing efficiency.And the bad environments in electroplating workshop can cause to damage to the body of operative employee
Evil.
In order to solve the problems, such as artificial loading, there is a kind of panel device up and down of robot, robot is inhaled using sucker
It is attached live wiring board, coordination galvanization fly bar on plating folder carry out loading and unloading.But sucker suction lives the middle position of wiring board
And contacted with wiring board, it is easy to deform wiring board, influences the electroplating quality of wiring board.
Also, in robot upper and lower plates step, position set by robot upper and lower plates is fixed, and is electroplated and flies
It bar can deform during handling, plating, wherein plating flies bar during electroplating pool is electroplated because of plating
Liquid shakes and stress deformation, so that the position of the plating folder on winged bar of plating can shift, these offsets are random, nothings
Orientation, or even there is the case where clamping two plating folder of same wiring board or more dislocation, i.e., the clamping that two plating are pressed from both sides
At angle, what it is due to wiring board is to be horizontally arranged on winged bar of plating to be clamped, and at this moment, will be gone out for point line and horizontal plane
The case where existing one of plating folder cannot clamp wiring board top edge, the board falling rate of wiring board is still very high.
Summary of the invention
Technical problem to be solved by the present invention lies in providing one kind can be in pinpoint circuit board electroplating line intelligence
Lower plate method replaces manual operation using upper and lower plates robot, while improving working efficiency, reduces worker in electroplating workshop
The interior time reduces the injury to human body.
The technical problems to be solved by the invention also reside in, and providing one kind can pinpoint circuit board electroplating line intelligence
Method for charging and discharging plate, can be realized by the edge of gripping apparatus grips wiring board can also keep away face folder while clamping wiring board
The plating face contact within the reserved edge of device and wiring board is held, influence of the clamping device to circuit board electroplating quality is reduced.
The technical problems to be solved by the invention also reside in, and providing one kind can pinpoint circuit board electroplating line intelligence
Method for charging and discharging plate, while capable of accurately obtaining 3D data by vision inspection apparatus, on winged bar of the plating to deform
Plating carries out position compensation, guarantees that plating folder can steadily clamp wiring board, greatly reduces the board falling in plating step
Rate.
One kind of the invention can pinpoint circuit board electroplating line intelligence method for charging and discharging plate, comprising the following steps:
A grabs the wiring board in material frame by the clamping device of upper and lower plates robot end;
B takes pictures to the plating folder on winged bar of plating by vision inspection apparatus, and General controller acquisition takes pictures information simultaneously
Analysis meter calculates the position 3D for clamping two plating folders of same wiring board and deviation angle, and the General controller is according to plating
Wiring board is moved at corresponding plating folder and to wiring board by the position 3D of folder and deviation angle control upper and lower plates robot
Angle compensation is carried out, so that wiring board is hung up to plating folder;
C after the plating for completing wiring board, takes pictures to the wiring board on winged bar of plating by vision inspection apparatus, always
Control device, which obtains, takes pictures information and analytical calculation goes out the position 3D and the deviation angle of wiring board, and the General controller is according to wiring board
The position 3D and deviation angle control upper and lower plates robot clamping device be moved at wiring board and to clamping device carry out
Angle compensation, so that clamping device flies a bar upper crawl wiring board from plating;
D, wiring board is placed in material frame by the clamping device of upper and lower plates robot.
Preferably, steps are as follows for the analytical calculation of the deviation angle in the step B:
S1, General controller analyze photo and obtain the 3D position data of two plating folders;
S2, General controller determine straight line parameter according to the 3D position data of two plating folders;
The angle parameter of straight line and horizontal plane is analyzed according to straight line parameter and calculated to S3, General controller.
Preferably, the material frame is arranged at intervals with multiple for placing the slot of wiring board, so that the wiring board is vertical
It is placed in material frame;The clamping device is for clamping at wiring board or more two edges, and the plating folder is for clamping wiring board
Upper edge.
Preferably, the step A the following steps are included:
A1 takes pictures to the wiring board in material frame by vision inspection apparatus;
A2, General controller, which obtains, takes pictures information and analytical calculation goes out the position 3D of wiring board;
Clamping device is moved to corresponding position according to the 3D position control upper and lower plates robot of wiring board by A3, General controller
It sets and clamps wiring board;
The step D the following steps are included:
D1 is taken pictures by slot of the vision inspection apparatus to material frame sky;
D2, General controller obtain the position 3D of take pictures information and the slot of analysis meter calculating sky;
Wiring board is moved to corresponding slot position according to the 3D position control upper and lower plates robot of slot by D3, General controller
It sets and wiring board is inserted into slot.
Preferably, when progress upper plate, winged bar of plating is located in plate bracing frame up and down, and the plating folder on winged bar of plating leads to
Cylinder of overdriving driving is opened, and the step that hangs up in the step B includes:
B1, PLC controller control press from both sides corresponding two driving cylinders time for clamping two plating of same wiring board
It receives, keeps two plating folders in clamped condition, two plating folders while the upper edge for clamping wiring board;
B2, General controller control the clamping device in upper and lower plates robot and unclamp wiring board left and right edges;
When progress lower plate, winged bar of plating is located in plate bracing frame up and down, and the plating folder holding on winged bar of plating is to route
The clamping of plate, the crawl step in the step C include:
C1, General controller control the gripping apparatus grips wiring board left and right edges in upper and lower plates robot;
C2, PLC controller control press from both sides corresponding two drivings cylinder top for clamping two plating of same wiring board
Out, make two plating folders in open configuration, two plating folders while the upper edge for unclamping wiring board.
Preferably, the plate bracing frame up and down is equipped with the crossbeam for installing driving cylinder, so that when winged bar of the plating
When being fixed in plate bracing frame up and down, the position and the position on winged bar of plating of the driving cylinder are corresponding one by one.
Preferably, the front and rear sides of the plate bracing frame up and down are equipped with one group of support base for being used to position winged bar of plating,
Winged bar of the sustainable plating being laterally arranged of support base described in every group.
Preferably, each upper and lower plates robot is equipped with two groups of clamping devices, and two groups of clamping devices are in the horizontal direction
It is arranged side by side.
Preferably, there are two the upper and lower plates robot is set.
The invention has the following beneficial effects:
1, upper and lower plates system of the invention is operated using upper and lower plates robot instead of artificial upper and lower plates, improves working efficiency
While, time of the worker in electroplating workshop is reduced, the injury to human body is reduced.
2, upper and lower plates system of the invention passes through the edge of gripping apparatus grips wiring board, can be realized and clamps route
The plating face contact within the reserved edge of face clamping device and wiring board can also be kept away while plate, reduce clamping device to line
The influence of road plate electroplating quality.
3, while the present invention can accurately obtain 3D data by vision inspection apparatus and General controller cooperation, to generation
Plating on winged bar of the plating of deformation carries out position compensation, guarantees that plating folder can steadily clamp wiring board, greatly drops
Board falling rate in low plating step.
4, upper and lower plates system of the invention takes pictures to plating folder by vision inspection apparatus, in upper plate to make
General controller can analyze the position 3D of two plating folders, and determine that the principle of straight line calculated by two o'clock and be used for
The straight line parameter for clamping two of same wiring board plating folders, finally by straight line parameter calculating with the straight line and horizontal
The angle in face is so that it is determined that angular deviation;When lower plate, vision inspection apparatus directly takes pictures to wiring board, to make total
The straight line ginseng of straight line where control device can directly analyze the upper sideline of wiring board and calculate the upper sideline of wiring board
Number, finally by the angle at straight line parameter calculating with the straight line and horizontal plane so that it is determined that angular deviation.
5, upper and lower plates system of the invention further decreases manual operation by the folding of driving cylinder driving plating folder
Participation amount, reduce worker operation burden;When muti-piece wiring board is placed in the slot of material frame, wiring board is gone back between each other
There are interval, play the role of that wiring board is avoided to contact with each other, improves the electroplating quality of wiring board.
Detailed description of the invention
Fig. 1 is the step flow chart of upper and lower plates in the embodiment of the present invention;
The flow chart of the obtaining step of angle offset in Fig. 2 step of embodiment of the present invention B;
It is electroplated in Fig. 3 embodiment of the present invention and flies a bar schematic diagram for the angular deviation of upper plating folder;
Fig. 4 is the structural schematic diagram of upper and lower plates system in the embodiment of the present invention;
Fig. 5 is that plating flies bar structural schematic diagram that wiring board is mounted in upper and lower plate bracing frame in the embodiment of the present invention;
Fig. 6 is that the installation of clamping device and vision inspection apparatus in upper and lower plates robot is shown in the embodiment of the present invention
It is intended to;
Fig. 7 is the structural schematic diagram of material frame in the embodiment of the present invention;
Fig. 8 is that wiring board is placed on the schematic diagram in material frame in the embodiment of the present invention.
In figure: 1, winged bar of plating;2, material frame;3, upper and lower plates robot;4, General controller;5, clamping device;6, upper and lower plates branch
Support;7, vision inspection apparatus;8, PLC controller;9, wiring board;11, plating folder;21, slot;51, holding frame;52, pneumatic
Finger.
Specific embodiment
With reference to the accompanying drawing and specific embodiment, the invention will be further described, in order to clearer understanding this
Invent claimed technical idea.Only this state, the present invention occur in the text or will occur upper and lower, left and right, it is preceding,
Afterwards, the orientation such as inside and outside word is not to specific restriction of the invention only on the basis of attached drawing of the invention.
As shown in figures 1-8, one of embodiment of invention can pinpoint 9 plating line intelligence upper and lower plates of wiring board
Method, comprising the following steps:
A grabs the wiring board 9 in material frame 2 by the clamping device 5 of 3 end of upper and lower plates robot;
B is taken pictures by the plating folder 11 on winged bar 1 of 7 pairs of vision inspection apparatus plating, and General controller 4 obtains letter of taking pictures
It ceases and analysis meter calculates the position 3D for clamping two plating folders 11 of same wiring board 9 and deviation angle, 4 basis of General controller
Wiring board 9 is moved at corresponding plating folder 11 by the position 3D of plating folder 11 and deviation angle control upper and lower plates robot 3
And angle compensation is carried out to wiring board 9, so that wiring board 9 is hung up to plating folder 11;
C after the plating for completing wiring board 9, is clapped by the wiring board 9 on winged bar 1 of 7 pairs of vision inspection apparatus plating
It is obtained according to, General controller 4 and takes pictures information and analytical calculation goes out the position 3D and the deviation angle of wiring board 9, General controller 4 is according to line
The clamping device 5 of the position 3D of road plate 9 and deviation angle control upper and lower plates robot 3 is moved at wiring board 9 and to clamping
Device 5 carries out angle compensation, so that clamping device 5 grabs wiring board 9 from winged bar 1 of plating;
D, wiring board 9 is placed in material frame 2 by the clamping device 5 of upper and lower plates robot 3.
It will appear deformation in the plating process due to being electroplated winged bar 1, the plating for clamping same wiring board 9 caused to be pressed from both sides
11 bite misplaces up and down, when 9 level of wiring board is hung up on winged bar 1 of plating, is easy board falling.Logical General controller 4, which is crossed, to be analyzed
The deviation angle of straight line with respect to the horizontal plane where calculating the bite of the plating folder 11 for clamping same wiring board 9, and
Angle compensation is carried out according to the clamping device 5 of deviation angle driving 3 end of upper and lower plates robot, guarantees plating folder 11 and folder
Holding device 5 can steadily clamp wiring board 9, greatly reduce the board falling rate in plating step.
Wherein, steps are as follows for the analytical calculation of the deviation angle in step B:
S1, General controller 4 analyze photo and obtain the 3D position data of two plating folders 11;
S2, General controller 4 determine straight line parameter according to the 3D position data of two plating folders 11;
The angle parameter of straight line and horizontal plane is analyzed according to straight line parameter and calculated to S3, General controller 4.
It is taken pictures by vision inspection apparatus 7 to two plating folder 11 for clamping same wiring board 9, master control
Device 4 can analyze the position 3D of two plating folders 11, and determine that the principle of straight line was calculated for pressing from both sides by two o'clock
The straight line parameter for holding two of same wiring board 9 plating folders 11, finally by straight line parameter calculating with the straight line and horizontal
The angle in face is so that it is determined that angular deviation.
In step C, General controller 4 can the upper sideline directly to wiring board 9 analyzed and calculate wiring board 9
The straight line parameter of straight line where upper sideline, finally by straight line parameter calculating with the angle of the straight line and horizontal plane to really
Determine angular deviation.
Wherein, step A the following steps are included:
A1 takes pictures to the wiring board 9 in material frame 2 by vision inspection apparatus 7;
A2, General controller 4, which obtains, takes pictures information and analytical calculation goes out the position 3D of wiring board 9;
Clamping device 5 is moved to accordingly by A3, General controller 4 according to the 3D position control upper and lower plates robot 3 of wiring board 9
Position and clamp wiring board 9;
Step D the following steps are included:
D1 is taken pictures by the slot 21 empty to material frame 2 of vision inspection apparatus 7;
D2, General controller 4 obtain the position 3D of take pictures information and the slot 21 of analysis meter calculating sky;
Wiring board 9 is moved to corresponding insert according to the 3D position control upper and lower plates robot 3 of slot 21 by D3, General controller 4
21 position of slot is simultaneously inserted into wiring board 9 in slot 21.
Intelligent method for charging and discharging plate of the invention replaces manually carrying out upper and lower plates behaviour to wiring board 9 using upper and lower plates robot 3
Make, it being capable of precision positioning and while carry out angle compensation, moreover it is possible to improve working efficiency, reduce worker in electroplating workshop
Time, reduce injury to human body.General controller 4 is the computer system equipped with calculating analysis software and control software, energy
Enough rapidly and accurately calculate analyzes data and controls the running of upper and lower plates robot 3.
Wherein, it is spaced the multiple plating folders 11 for clamping 9 edge of wiring board of setting along its length for winged bar 1 of plating,
Two neighboring plating folder 11 is used to clamp same wiring board 9.Plating folder 11 includes fixed arm, lever arm and elastic device,
Wherein lever arm is hinged with fixed arm and is fixed by elastic device, which is brute spring, provides enough clampings
Make plating folder 11 in normally off while power.The particular number for the plating folder 11 that winged bar 1 of each plating is according to each plating
Depending on 9 quantity of wiring board clamped by winged bar 1, if each be electroplated on winged bar 1 will clamp six pieces of wiring boards 9, then folder 11 is electroplated
Quantity is 12.
When carrying out upper and lower plates using intelligent method for charging and discharging plate of the invention, winged bar 1 of plating is preferably carried out by support frame 6
Positioning.Specifically, intelligent upper and lower plates system of the invention, which is additionally provided with, is used to support plate bracing frame 6 up and down for being electroplated winged bar 1, on
Lower plate bracing frame 6 is equipped with the driving cylinder 61 for controlling 11 folding of plating folder.The unlatching dynamics as needed for plating folder 11
Larger, the driving cylinder 61 for being used to open and close plating folder 11 is located at support frame 6 by the present invention, it is possible to reduce 11 folding of plating folder
When be electroplated fly bar 1 external force born.Wherein, when to carry out upper and lower plates operation for winged bar 1 of plating, worker is using driving two
Item plating flies bar 1 handling simultaneously to upper and lower plate bracing frame 6.At this point, cylinder 61 and winged bar of plating are driven in plate bracing frame 6 up and down
Plating on 1 is pressed from both sides 11 positions and is corresponded, also, the transverse slat of upper and lower plate bracing frame 6 is arranged in the fixing seat of driving cylinder 61
On, drive the output end of cylinder 61 towards plating corresponding with its position folder 11.Wherein, intelligent upper and lower plates system is additionally provided with
For controlling the PLC controller 8 of driving cylinder 61, the running of 4 control PLC controller 8 of General controller is driven by driving cylinder 61
11 folding of plating folder reduces worker operation burden to reduce manually-operated participation amount.It is highly preferred that upper and lower plate bracing frame
6 front and rear sides are equipped with one group for positioning winged bar 1 of plating of support base, and the sustainable transverse direction of every group of support base is set
Winged bar 1 of the plating set, meanwhile, the transverse slat equipped with installation driving cylinder 61, every cross are each provided with before and after upper and lower plate bracing frame 6
Winged bar 1 of each correspondence of plate one plating.Can be winged bar 1 of once mounting two plating in upper and lower plate bracing frame 6, upper and lower plates machine
After people 3 first can complete upper and lower plates operation to winged bar 1 of two plating, worker can hang away winged bar 1 of two plating simultaneously, save
Save the handling time.
Upper and lower plates robot 3 is used to move back and forth in wiring board 9 between material frame 2 and plating folder 11, upper and lower plates robot
3 execution end is equipped with clamping device 5 and vision inspection apparatus 7, and clamping device 5 is used to clamp the edge of wiring board 9.Vision
Detection device 7 selects to take pictures to plating folder 11 or wiring board 9 according to upper and lower plates, then transfers data to General controller
4, control upper and lower plates robot 3 is mobile after General controller 4 is analyzed.
Wherein, vision inspection apparatus 7 includes CCD camera and airborne laser range finder.General controller 4 is for acquiring vision-based detection
The detection data of device 7 simultaneously carries out position analysis to detection data, and upper and lower plates robot 3 is according to the analysis result control of General controller 4
The transmitting place of clamping device 5 processed.It is taken pictures by vision inspection apparatus 7 and laser ranging, the data detected is sent out
It is mapped to General controller 4, General controller 4 analyzes position data and angular deviation under the operation of software program, and obtained position
It sets data and angular deviation is sent to upper and lower plates robot 3 and robot is driven to operate.Guarantee that plating folder is equal with clamping device
Wiring board can be steadily clamped, the board falling rate in plating step is greatly reduced.
It should be noted that clamping device 5 is preferred at the left and right edges for clamping wiring board 9, plating folder 11 is preferably used
In the top edge of clamping wiring board 9, clamping device 5 and plating folder 11 is avoided to generate interference during joining wiring board 9.
Wherein, clamping device 5 includes holding frame 51 and is mounted on the pneumatic-fingers 52 of 51 top and bottom of holding frame,
The pneumatic-finger 52 is used to clamp at the two edges up and down of wiring board, further, the 51 top and bottom edge of holding frame
The width direction of wiring board is provided with multiple pneumatic-fingers 52, enables clamping device 5 that can more be held fixedly wiring board
9。
Correspondingly, clamp wiring board 9 in material frame 2 for the ease of clamping device 5, wiring board 9 of the invention in vertically according to
Secondary to be arranged in material frame 2, material frame 2, which is equipped with to protrude into for clamping device 5, crosses space.Specifically, material frame 2 is preferably by being provided with
Multiple slots 21 for being used to place wiring board 9, so that wiring board 9 is placed on vertically in material frame 2.When muti-piece wiring board 9 is placed on
When in the slot 21 of material frame 2, wiring board 9 plays the role of that wiring board 9 is avoided to contact with each other, mentions between each other there is also interval
The electroplating quality of elevated track plate 9.
When clamping wiring board 9 in material frame 2, holding frame 51 protrudes into clamping device 5 from the space of crossing in 2 front of material frame, presss from both sides
The pneumatic-finger 52 of top and bottom of running one's home simultaneously clamps at about 9 two edges of wiring board, and clamping device 5 drives wiring board 9 straight
Line moves up, and wiring board 9 is taken out from material frame.And clamping device 5 material frame 2 place wiring board 9 when, clamping device 5 drive route
Plate 9 moves down insertion slot 21 from 2 upper straight of material frame, and the pneumatic-finger 52 of clamping family top and bottom, which unclamps, clamps wiring board 9
At upper and lower two edges, holding frame 51 leaves from the space of crossing in 2 front of material frame.Wherein, upper and lower plates robot 3 is preferably provided with two
It is a.Upper and lower plates robot 3 can be disposed side by side on 6 front side or rear side of plate bracing frame up and down, can also be separately positioned on upper and lower plates
Plate efficiency up and down is improved in the front and rear sides of support frame 6.Also, each upper and lower plates robot 3 is preferably provided with two groups of clamping devices
5, two groups of clamping devices 5 are arranged side by side in the horizontal direction, one group of upper and lower plates robot 4 once can to two pieces of wiring boards 9 into
The operation of row upper and lower plates.
The above is only specific embodiments of the present invention, are not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field is included within the scope of the present invention.
Claims (9)
1. one kind can pinpoint circuit board electroplating line intelligence method for charging and discharging plate, it is characterised in that: the following steps are included:
A grabs the wiring board in material frame by the clamping device of upper and lower plates robot end;
B takes pictures to the plating folder on winged bar of plating by vision inspection apparatus, and General controller obtains take pictures information and analysis meter
The position 3D for clamping two plating folders of same wiring board and deviation angle are calculated, the General controller is according to the position 3D that folder is electroplated
It sets and wiring board is moved at corresponding plating folder and carries out angle to wiring board by deviation angle control upper and lower plates robot
Compensation, so that wiring board is hung up to plating folder;
C after the plating for completing wiring board, takes pictures to the wiring board on winged bar of plating by vision inspection apparatus, General controller
It obtains and takes pictures information and analytical calculation goes out the position 3D and the deviation angle of wiring board, the General controller is according to the position 3D of wiring board
It sets and the clamping device of deviation angle control upper and lower plates robot is moved at wiring board and carries out angle benefit to clamping device
It repays, so that clamping device flies a bar upper crawl wiring board from plating;
D, wiring board is placed in material frame by the clamping device of upper and lower plates robot.
2. one kind as described in claim 1 can pinpoint circuit board electroplating line intelligence method for charging and discharging plate, it is characterised in that:
Steps are as follows for the analytical calculation of deviation angle in the step B:
S1, General controller analyze photo and obtain the 3D position data of two plating folders;
S2, General controller determine straight line parameter according to the 3D position data of two plating folders;
The angle parameter of straight line and horizontal plane is analyzed according to straight line parameter and calculated to S3, General controller.
3. one kind as described in claim 1 can pinpoint circuit board electroplating line intelligence method for charging and discharging plate, it is characterised in that:
The material frame is arranged at intervals with multiple slots for being used to place wiring board, so that the wiring board is placed in material frame vertically;Institute
Clamping device is stated for clamping at wiring board or more two edges, the upper edge for clamping wiring board is pressed from both sides in the plating.
4. one kind as claimed in claim 3 can pinpoint circuit board electroplating line intelligence method for charging and discharging plate, it is characterised in that:
The step A the following steps are included:
A1 takes pictures to the wiring board in material frame by vision inspection apparatus;
A2, General controller, which obtains, takes pictures information and analytical calculation goes out the position 3D of wiring board;
Clamping device is moved to corresponding position according to the 3D position control upper and lower plates robot of wiring board and pressed from both sides by A3, General controller
Take wiring board;
The step D the following steps are included:
D1 is taken pictures by slot of the vision inspection apparatus to material frame sky;
D2, General controller obtain the position 3D of take pictures information and the slot of analysis meter calculating sky;
Wiring board is moved to corresponding slot position and handle according to the 3D position control upper and lower plates robot of slot by D3, General controller
Wiring board is inserted into slot.
5. one kind as described in claim 1 can pinpoint circuit board electroplating line intelligence method for charging and discharging plate, it is characterised in that:
When progress upper plate, winged bar of plating is located in plate bracing frame up and down, and the plating folder on winged bar of plating passes through driving cylinder driving and opens
It opens, the step that hangs up in the step B includes:
B1, PLC controller control press from both sides corresponding two driving cylinders recycling for clamping two plating of same wiring board, make two
A plating folder is in clamped condition, two plating folders while the upper edge for clamping wiring board;
B2, General controller control the clamping device in upper and lower plates robot and unclamp wiring board left and right edges;
When progress lower plate, winged bar of plating is located in plate bracing frame up and down, and the plating folder holding on winged bar of plating is to wiring board
It clamps, the crawl step in the step C includes:
C1, General controller control the gripping apparatus grips wiring board left and right edges in upper and lower plates robot;
C2, PLC controller control press from both sides corresponding two drivings cylinder ejector for clamping two plating of same wiring board, make two
A plating folder is in open configuration, two plating folders while the upper edge for unclamping wiring board.
6. one kind as claimed in claim 5 can pinpoint circuit board electroplating line intelligence method for charging and discharging plate, it is characterised in that:
The plate bracing frame up and down is equipped with the crossbeam for installing driving cylinder, so that being fixed on upper and lower plates support when winged bar of the plating
When on frame, the position and the position on winged bar of plating of the driving cylinder are corresponding one by one.
7. one kind as claimed in claim 5 can pinpoint circuit board electroplating line intelligence method for charging and discharging plate, it is characterised in that:
The front and rear sides of the plate bracing frame up and down are equipped with one group for positioning winged bar of plating of support base, and support base described in every group is equal
Winged bar of a sustainable plating being laterally arranged.
8. one kind as described in claim 1-6 any claim can pinpoint circuit board electroplating line intelligence upper and lower plates side
Method, it is characterised in that: each upper and lower plates robot is equipped with two groups of clamping devices, and two groups of clamping devices are in the horizontal direction simultaneously
Row's setting.
9. one kind as described in claim 1-6 any claim can pinpoint circuit board electroplating line intelligence upper and lower plates side
Method, it is characterised in that: there are two the upper and lower plates robot is set.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811509114.3A CN109554736A (en) | 2018-12-11 | 2018-12-11 | One kind can pinpoint circuit board electroplating line intelligence method for charging and discharging plate |
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