CN107318245B - Industrialized graphene heat dissipation structure and corresponding device - Google Patents
Industrialized graphene heat dissipation structure and corresponding device Download PDFInfo
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- CN107318245B CN107318245B CN201710341311.8A CN201710341311A CN107318245B CN 107318245 B CN107318245 B CN 107318245B CN 201710341311 A CN201710341311 A CN 201710341311A CN 107318245 B CN107318245 B CN 107318245B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
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Abstract
The invention provides an industrialized graphene heat dissipation structure, which comprises a first thin layer, a graphene thin film layer and a second thin layer; the first thin layer is a metal/nonmetal thin layer, and the second thin layer is a metal thin layer; the graphene film layer is positioned between the first thin layer and the second thin layer, and the first thin layer, the graphene film layer and the second thin layer are formed through pressing; the first thin layer is tightly contacted with the heat source and is of a part of hollow structure, the hollow part is arranged right below the heat source heating part, and a certain mutual overlapping area is formed between the first thin layer and the heat source heating part. The heat radiation structure has excellent heat radiation effect; the heat radiation structure is suitable for industrial production, and the obtained product has high yield and can be stably used for a long time.
Description
Technical Field
The invention belongs to the field of design and preparation of heat dissipation materials, and particularly relates to an industrialized graphene heat dissipation structure and a corresponding device.
Background
At present, a common heat dissipation material is metal, but with the precision and miniaturization of corresponding instruments, the traditional metal heat dissipation material has difficulty in meeting the heat dissipation requirements of the corresponding instruments. Particularly for a precise and miniaturized instrument, the volume of the metal heat dissipation material is too large, resulting in an increase in the production cost of the instrument.
With the continuous deep development of new materials, graphene is in general attention of people due to the excellent heat dissipation performance, and various heat dissipation structures are designed by using the graphene.
Today, the existing technologies are broadly divided into the following:
(1) Coating graphene slurry on the heating element;
(2) Preparing graphene into a film and combining the film with a heat-conducting adhesive;
(3) And placing a metal film at the bottom of the graphene film, and contacting the metal film with a heat source.
However, the above-described several schemes have the following drawbacks, respectively:
(1) The heat dissipation effect is not obvious;
(2) And (3) the service life of the heat dissipation structure is short, and the long-term heat dissipation stability is poor; the yield of the obtained heat dissipation structure is low, and industrialization is difficult.
Therefore, there is a need in the art for a heat dissipating structure that solves the above problems, which can be industrially produced, and which is well used in devices including electronic products, electrical products (especially in applications of lamps, air conditioners and refrigerators), lighting fixtures, and the like.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide an industrialized graphene heat dissipation structure, which comprises a first thin layer, a graphene thin film layer and a second thin layer; the first thin layer is a metal/nonmetal thin layer, and the second thin layer is a metal thin layer; the graphene film layer is positioned between the first thin layer and the second thin layer, and the first thin layer, the graphene film layer and the second thin layer are formed through pressing; the first thin layer is tightly contacted with the heat source and is of a part of hollow structure, the hollow part is arranged right below the heat source heating part, and a certain mutual overlapping area is formed between the first thin layer and the heat source heating part.
The invention can be industrialized and can be used for a long time with good yield and stability.
The good yield during preparation means that the product with excellent heat dissipation function accounts for high proportion of the total number of the produced products in one or more batches of the obtained products.
The inventors of the present invention found that when manufacturing the heat dissipation structure of the prior art design on an industrial scale, the yield is hardly ensured. The possible reason is that the existing heat dissipation structure is often complicated in preparation, and mass production is difficult to ensure; in practice, the performance of each product is excellent, which may be more important because the designed heat dissipation structure is not beneficial to exerting the excellent performance of the graphene.
The Chinese patent with the application number of 201320297826.X discloses a graphene metal heat-dissipating sheet. The difference between the graphene film and the graphene film is that the metal sheet is directly contacted with a heat source, and a layer of heat-conducting adhesive is coated on the graphene film. According to the heat dissipation structure with good heat dissipation performance, through heat conduction uniformity of metal in isotropy and heat radiation performance of graphene. Meanwhile, the heat-conducting adhesive is used for being connected with the electronic product shell.
The inventor of the invention discovers that the actual heat dissipation effect of the patent is not satisfactory, and more importantly, when the heat dissipation structure of the metal sheet-graphene film-heat-conducting adhesive is prepared, the obtained yield is very low, and the industrial production requirement is not met. Through repeated fumbling, the inventor finds that the heat dissipation structure of the patent does not fully utilize the heat dissipation characteristics of graphene.
When the scheme of the invention is adopted, the part of the first thin layer, which is heated by the heat source, is hollowed out, so that the graphene thin film is directly contacted with the heat source, and meanwhile, the graphene thin film is covered by another metal thin layer (second thin layer), and after the three-layer structure is pressed, a very excellent heat dissipation effect can be obtained.
The heat dissipation mechanism of the invention may be that the heat dissipation structure of the invention enables graphene to directly contact with a heat source, and then the heat is dissipated by utilizing the excellent transverse heat dissipation performance of the graphene. The first thin layer has sealing and auxiliary heat conduction functions, and the second thin layer has auxiliary heat conduction and heat dissipation functions.
Through researches, the Chinese patent with the application number of 201320297826.X is difficult to industrialize, and as shown in the comparative example of the invention, the production yield and long-term use stability of the patent are not satisfactory. The possible reason is that the graphene film is easy to fall off after long-time use, so that the heat dissipation performance is obviously reduced. In addition, the graphene powder is high-conductivity powder, and is not beneficial to safety after the powder is dropped.
Preferably, the heat dissipation structure further comprises at least one layer of heat dissipation slurry layer, and the heat dissipation slurry layer is located on the outer side of the second thin layer. More preferably, the heat dissipation paste is graphene paste.
Preferably, the thickness of the heat dissipation slurry layer is 0.010 mm-0.050 mm.
Preferably, when the first thin layer is a nonmetallic thin layer, the thickness of the first thin layer is 0.1 mm-1.5 mm; the nonmetal comprises PVC or ABS and the like; when the first thin layer is a metal thin layer, the thickness of the metal thin layer is 0.005-0.05 mm, and the thickness of the second thin layer is 0.005-0.05 mm; preferably, the metal in the first and/or second thin layers comprises copper, aluminum, silver, gold, tin or lead, and the best cost performance is copper
The thickness of the graphene film layer is 0.012 mm-1 mm.
Preferably, the area of the graphene film layer is greater than or equal to that of the first thin layer, and the area of the second thin layer is greater than or equal to that of the graphene film layer. More preferably, the graphene film layer portion having an area larger than that of the first thin layer and the second thin layer portion having an area larger than that of the graphene film layer are bent outwardly in a curved surface.
In the pressing, the pressing process is hot extrusion. The method comprises the following steps: and (3) flattening the first thin layer, the graphene thin layer and the second thin layer according to the structure, firstly raising the temperature to 150 ℃, slowly raising the temperature, and when the temperature reaches 180 ℃, pressing by using a 50-ton oil press.
It is another object of the present invention to provide a heat generating or light emitting device incorporating the above heat dissipating structure, including a light fixture, an air conditioner or a refrigerator.
The invention has the beneficial effects that:
1. the heat radiation structure has excellent heat radiation effect;
2. the heat radiation structure is suitable for industrial production, and the obtained product has high yield and can be stably used for a long time.
Drawings
FIG. 1 is a schematic diagram of an LED current heat dissipation scheme;
FIG. 2 is a schematic diagram of the heat dissipation structure of the present invention when applied to an LED lamp;
fig. 3 is a schematic diagram of a heat dissipation structure according to embodiment 1 of the present invention;
fig. 4 is a schematic diagram of a heat dissipation structure according to embodiment 2 of the present invention;
fig. 5 is a schematic diagram of a heat dissipation structure according to embodiment 3 of the present invention;
fig. 6 is a schematic diagram of a heat dissipation structure according to embodiment 4 of the present invention.
Detailed Description
The present invention is described in detail below by way of examples, which are necessary to be pointed out herein for further illustration of the invention and are not to be construed as limiting the scope of the invention, since numerous insubstantial modifications and adaptations of the invention will occur to those skilled in the art in light of the foregoing disclosure.
Example 1
The product obtained in this example is shown in FIG. 3.
Bonding a first thin layer (nonmetal thin layer), a graphene thin layer and a second thin layer (metal thin layer) together by hot pressing, so that the graphene thin layer is tightly contacted with the first thin layer and the second thin layer, no He Nianjie agent is used between the layers, the first thin layer is tightly contacted with a heat source and is in a part of hollow structure, the hollow part is right below a heat source heating part, the first thin layer and the heat source heating part have a certain mutual overlapping area, and the overlapping area is 60% of the area of the heat source heating part; the area of the graphene film layer is larger than or equal to that of the first thin layer, and the area of the second thin layer is larger than or equal to that of the graphene film layer.
Wherein the thickness of the first thin layer is 0.1 mm-1.5 mm; the thickness of the second thin layer is 0.005 mm-0.05 mm; the thickness of the graphene film layer is 0.012 mm-1 mm;
in this embodiment, the nonmetal in the first thin layer is PVC, and the metal in the second thin layer is copper.
And (3) flattening the first thin layer, the graphene thin layer and the second thin layer according to the structure, firstly raising the temperature to 150 ℃, slowly raising the temperature, and when the temperature reaches 180 ℃, pressing by using a 50 ton oil press.
Example 2
The product obtained in this example is shown in FIG. 4.
Bonding the first thin layer (metal thin layer), the graphene thin layer and the second thin layer (metal thin layer) together in a hot pressing mode, so that the graphene thin layer is tightly contacted with the first thin layer and the second thin layer, no adhesive is used between the layers, the first thin layer is tightly contacted with a heat source and is in a part of hollow structure, the hollow part is arranged under the heat source heating part, the first thin layer and the heat source heating part have a certain mutual overlapping area, and the overlapping area is 70% of the area of the heat source heating part;
wherein the thickness of the first thin layer is 0.1 mm-1.5 mm; the thickness of the second thin layer is 0.005 mm-0.05 mm; the thickness of the graphene film layer is 0.012 mm-1 mm;
in this embodiment, the metal in the first thin layer is copper, and the metal in the second thin layer is copper.
And (3) flattening the first thin layer, the graphene thin layer and the second thin layer according to the structure, firstly raising the temperature to 150 ℃, slowly raising the temperature, and when the temperature reaches 180 ℃, pressing by using a 50 ton oil press.
Example 3
The product obtained in this example is shown in FIG. 5.
Bonding a first thin layer (nonmetal thin layer), a graphene thin layer and a second thin layer (metal thin layer) together by hot pressing, so that the graphene thin layer is tightly contacted with the first thin layer and the second thin layer, no He Nianjie agent is used between the layers, the first thin layer is tightly contacted with a heat source and is in a part of hollow structure, the hollow part is right below a heat source heating part, the first thin layer and the heat source heating part have a certain mutual overlapping area, and the overlapping area is 60% of the area of the heat source heating part; coating a heat dissipation slurry layer (graphene slurry) on the second thin layer,
wherein the thickness of the first thin layer is 0.1 mm-1.5 mm; the thickness of the second thin layer is 0.005 mm-0.05 mm; the thickness of the graphene film layer is 0.012 mm-1 mm; the thickness of the heat dissipation slurry layer is 0.010 mm-0.050 mm;
in this embodiment, the nonmetal in the first thin layer is ABS, and the metal in the second thin layer is aluminum.
And (3) flattening the first thin layer, the graphene thin layer and the second thin layer according to the structure, firstly raising the temperature to 150 ℃, slowly raising the temperature, and when the temperature reaches 180 ℃, pressing by using a 50 ton oil press.
Example 4
The product obtained in this example is shown in FIG. 6.
Bonding a first thin layer (metal thin layer), a graphene thin layer and a second thin layer (metal thin layer) together in a hot pressing mode, so that the graphene thin layer is tightly contacted with the first thin layer and the second thin layer, no adhesive is used between the layers, the first thin layer is tightly contacted with a heat source and is in a part of hollow structure, the hollow part is arranged under the heat source heating part, the first thin layer and the heat source heating part have a certain mutual overlapping area, and the overlapping area is 60% of the area of the heat source heating part; coating a heat dissipation slurry layer (graphene slurry) on the second thin layer,
wherein the thickness of the first thin layer is 0.1 mm-1.5 mm; the thickness of the second thin layer is 0.005 mm-0.05 mm; the thickness of the graphene film layer is 0.012 mm-1 mm; the thickness of the heat dissipation slurry layer is 0.010 mm-0.050 mm;
in this embodiment, the metal in the first thin layer is copper, and the metal in the second thin layer is copper.
And (3) flattening the first thin layer, the graphene thin layer and the second thin layer according to the structure, firstly raising the temperature to 150 ℃, slowly raising the temperature, and when the temperature reaches 180 ℃, pressing by using a 50 ton oil press.
Experimental example
The heat dissipation performance of the 12W TSA-LED small flying saucer LED lamp manufactured by Chengdu Sanwuxing industry Co., ltd was tested by using the schemes of examples 1 to 4 as a test model. Each example produced 25 pieces in total, 100 pieces, and the heat dissipation test data obtained by the test are shown in table 1:
TABLE 1
Note that: the data in the tables are in units of ℃.
The existing structural scheme is an original structure of a 12W TSA-LED small flying saucer manufactured by Chengdu-Sanwuxing practical limited company.
Through testing, the yield of the product obtained by the production is 100%.
Through testing, after the product is continuously used for 3 months, the heat dissipation performance of the product is reduced by not more than 1%.
Comparative examples
Produced by the structure of figure 3 of Chinese patent with the application number of 201320297826.X, the heat dissipation effect of the obtained product is as follows: and the test environment is the same as that of the experimental example, 100 products are produced at room temperature, the yield is 86%, and the heat dissipation performance of the product is reduced by more than 15% after the product is continuously used for 3 months.
Claims (10)
1. An industrialized graphene heat dissipation structure is characterized by comprising a first thin layer, a graphene thin film layer and a second thin layer; the first thin layer is a metal/nonmetal thin layer, and the second thin layer is a metal thin layer; the graphene film layer is positioned between the first thin layer and the second thin layer, and the first thin layer, the graphene film layer and the second thin layer are formed through hot pressing; the first thin layer is tightly contacted with the heat source and is of a partial hollow structure, so that the graphene film is directly contacted with the heat source, the hollow part is arranged under the heat source heating part, and a certain mutual overlapping area exists between the first thin layer and the heat source heating part.
2. The heat spreading structure according to claim 1, further comprising at least one layer of heat spreading paste, the heat spreading paste being located outside the second layer.
3. The heat dissipating structure of claim 2, wherein the heat dissipating paste is a graphene paste.
4. The heat dissipation structure as defined in claim 2 or 3, wherein the thickness of the heat dissipation paste layer is 0.010mm to 0.050mm.
5. The heat dissipating structure of claim 1, wherein when the first thin layer is a non-metallic thin layer, a thickness thereof is 0.1mm to 1.5mm; the nonmetal comprises PVC or ABS; when the first thin layer is a metal thin layer, the thickness of the metal thin layer is 0.005-0.05 mm, and the thickness of the second thin layer is 0.005-0.05 mm.
6. The heat dissipation structure as recited in claim 1, wherein the thickness of the graphene film layer is 0.012 mm-1 mm.
7. The heat dissipating structure of claim 1 wherein the graphene film layer has an area equal to or greater than the first thin layer and the second thin layer has an area equal to or greater than the graphene film layer.
8. The heat dissipating structure of claim 7 wherein the portion of the graphene film layer having an area greater than the first thin layer and the portion of the second thin layer having an area greater than the graphene film layer are curved outwardly.
9. The heat dissipating structure of claim 1, wherein, in performing the pressing, the pressing process is: and (3) flattening the first thin layer, the graphene thin layer and the second thin layer according to the structure, firstly raising the temperature to 150 ℃, slowly raising the temperature, and when the temperature reaches 180 ℃, pressing by using a 50 ton oil press.
10. A heat generating or light emitting device incorporating the heat dissipating structure of any one of claims 1 to 9, said device comprising a light fixture, an air conditioner or a refrigerator.
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