CN107275239B - 一种指纹识别芯片封装方法及封装结构 - Google Patents

一种指纹识别芯片封装方法及封装结构 Download PDF

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CN107275239B
CN107275239B CN201710520623.5A CN201710520623A CN107275239B CN 107275239 B CN107275239 B CN 107275239B CN 201710520623 A CN201710520623 A CN 201710520623A CN 107275239 B CN107275239 B CN 107275239B
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黄玉龙
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National Center for Advanced Packaging Co Ltd
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Abstract

本发明公开了一种指纹识别芯片封装方法及封装结构，其中所述方法包括：将指纹识别芯片贴附于基板第一表面；基板第一表面印制有导线；在基板第一表面与指纹识别芯片之间设置连接导线；在基板和指纹识别芯片的外表面使用封装材料进行封装，封装层覆盖连接导线与指纹识别芯片；封装材料中包括脱模材料，脱模材料在封装层表面的浓度高于在封装层内部的浓度；对封装层进行研磨。由于封装材料中的脱模材料在封装层表面的浓度高于在封装层内部的浓度，因此在对该封装层进行研磨后即可降低指纹识别芯片表面的封装层中脱模材料的浓度，由此提高封装后的指纹识别芯片的识别灵敏度；由于指纹识别芯片表面有封装层的保护，因此可以保护指纹识别芯片不受损。

Description

一种指纹识别芯片封装方法及封装结构
技术领域
本发明涉及半导体封装技术领域，具体涉及一种指纹识别芯片封装方法及封装结构。
背景技术
指纹识别芯片是指内嵌指纹识别技术的芯片产品，能够片上实现指纹的图像采集、特征提取、特征比对的芯片，开发着可以方便的实现指纹识别的功能，大大降低了指纹识别行业的门槛，对指纹识别的推广具有十分积极的推动作用。
指纹识别芯片准确、灵敏地感应到指纹信号是指纹识别芯片封装工艺的关键点。对非指纹识别芯片进行封装时，往往通过塑封胶对芯片进行塑封，并且塑封胶会完全覆盖芯片，但是塑封胶会大大降低指纹识别芯片的识别灵敏度。
对此，现有技术在对指纹识别芯片进行封装时，塑封层往往并不覆盖指纹识别芯片的上表面，即感测区。然而当手指接触指纹识别芯片的感测区时，指纹识别芯片将承受来自手指的力量，容易因为反复承受应力而受损。
发明内容
有鉴于此，本发明实施例提供了一种指纹识别芯片封装方法及封装结构，以解决现有技术当中如果指纹识别芯片不封装则容易导致指纹识别芯片受损，而采用现有的封装工艺又会降低指纹识别芯片的识别灵敏度的问题。
本发明第一方面提供了一种指纹识别芯片封装方法，包括：将指纹识别芯片贴附于基板第一表面；所述基板第一表面印制有导线；在所述基板第一表面与所述指纹识别芯片之间设置连接导线；在所述基板和所述指纹识别芯片的外表面使用封装材料进行封装，封装层覆盖所述连接导线与所述指纹识别芯片；所述封装材料中包括脱模材料，所述脱模材料在封装层表面的浓度高于在所述封装层内部的浓度；对所述封装层进行研磨。
可选地，所述对所述封装层进行研磨的步骤中，研磨至所述封装层表面与所述基板第一表面之间的高度为20μm至50μm。
可选地，所述基板为双面印制电路板或多层印制电路板。
可选地，所述基板为柔性电路板。
可选地，所述基板还包括与第一表面相对设置的第二表面，在所述第二表面设置有焊盘；所述基板设置有至少一个贯穿所述基板第一表面和所述第二表面的导电柱，所述导电柱两端分别连接所述第一表面的导线和所述第二表面的焊盘。
可选地，所述对所述封装层进行研磨的步骤之后，还包括：在所述封装层表面设置保护层。
可选地，所述在所述封装层表面设置保护层的步骤包括：在所述封装层表面贴附玻璃薄片；和/或，在所述封装层表面涂布油漆或硅胶。
可选地，所述将指纹识别芯片贴附于图案化的基板第一表面的步骤包括：在所述基板第一表面涂布胶体层，再将所述指纹识别芯片放置到所述胶体层上；或者，在所述指纹识别芯片下表面涂布胶体层，再将所述指纹识别芯片下表面贴附于所述基板第一表面。
可选地，在所述封装层表面设置保护层的步骤之后，还包括：对板体进行切割，得到单个指纹识别芯片的封装结构。
本发明第二方面提供了采用第一方面或者第一方面任意一种可选实施方式所述的指纹识别芯片封装方法所制备的指纹识别芯片封装结构。
本发明实施例所提供的指纹识别芯片的封装方法，先将指纹识别芯片贴附于基板第一表面，然后在基板第一表面与指纹识别芯片之间设置连接导线，再在基板和指纹识别芯片的外表面使用封装材料进行封装，由于封装材料中的脱模材料在封装层表面的浓度高于在封装层内部的浓度，因此在对该封装层进行研磨后即可降低指纹识别芯片表面的封装层中脱模材料的浓度，由此提高封装后的指纹识别芯片的识别灵敏度；由于指纹识别芯片表面有封装层的保护，因此可以保护指纹识别芯片不受损。
附图说明
通过参考附图会更加清楚的理解本发明的特征和优点，附图是示意性的而不应理解为对本发明进行任何限制，在附图中：
图1示出了基板示意图；
图2示出了在基板上涂布胶体层的示意图；
图3示出了将指纹识别芯片贴附于胶体层的示意图；
图4示出了在基板第一表面与指纹识别芯片之间设置连接导线的示意图；
图5示出了在基板和指纹识别芯片的外表面使用封装材料进行封装的示意图；
图6示出了对封装层进行研磨的示意图；
图7示出了基板为双面印制电路板或多层印制电路板时封装层被研磨后的示意图；
图8示出了在封装层表面设置保护层的示意图；
图9示出了单个指纹识别芯片的封装结构示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明通过减少指纹识别芯片表面封装层的脱模材料的浓度来提高封装后的指纹识别芯片的识别灵敏度。发明人发现脱模材料的浓度越高，封装后的指纹识别芯片的识别灵敏度越低。而现有方式提高封装后的指纹识别芯片的识别灵敏度往往是通过减少封装层表面至指纹识别芯片表面之间的高度。
本发明实施例提供了一种指纹识别芯片封装方法，该方法包括如下步骤：
S10：将指纹识别芯片贴附于基板第一表面。基板第一表面印制有导线。
如图1、图2和图3所示，10为基板，20为胶体层，30为指纹识别芯片。基板10表面印制有导线能够将指纹识别芯片30的输出信号导出；采用印制工艺而不另外设置导线，能够减小指纹识别芯片封装结构的厚度。
本实施例中，基板10可以为双面印制电路板或多层印制电路板。此外，基板10还可以为柔性电路板。本申请对基板10的制备方法不做限定。
当基板10为双面印制电路板或多层印制电路板时，如图7所示，基板10还包括与第一表面相对设置的第二表面，在第二表面设置有焊盘60。基板10设置有至少一个贯穿基板第一表面和第二表面的导电柱70，导电柱70两端分别连接第一表面的导线和第二表面的焊盘60。
需要补充说明的是，第二表面除了设置有焊盘60之外，也可以印制有导线。此外，图7仅仅示出了基板10为双面印制电路板的情形，基板10还可以为多层印制电路板。
步骤S10将指纹识别芯片30贴附于基板10第一表面时，可以先在基板10第一表面涂布胶体层20，再将指纹识别芯片30放置到胶体层20上；或者，也可以先在指纹识别芯片30下表面涂布胶体层，再将指纹识别芯片30下表面贴附于基板10第一表面。本申请对具体的贴附方式不做限定。
S20：在基板第一表面与指纹识别芯片之间设置连接导线。
如图4所示，40为连接导线。连接导线40一端连接指纹识别芯片30表面的电极，另一端连接基板10上所印制的导线。
连接导线的材质可以为多种，例如，金、铜。可选地，本实施例中选用金线，以降低导线的电阻率，提高封装后的指纹识别芯片的识别灵敏度。
S30：在基板和指纹识别芯片的外表面使用封装材料进行封装，封装层覆盖连接导线与指纹识别芯片。封装材料中包括脱模材料，脱模材料在封装层表面的浓度高于在封装层内部的浓度。
如图5所示，50为封装层，60(图中的点)为脱模材料的浓度示意图，点的密度越高表示脱模材料的浓度越高。脱模材料60掺杂在封装胶体中，形成如图5所示的情形。
从图中可以看出，封装层50表面的脱模材料浓度高于封装层内部的浓度，一方面表面浓度高便于脱模，另一方面内部浓度低，对指纹识别芯片的干扰较小，能够提高封装后的指纹识别芯片的识别灵敏度。
S40：对封装层进行研磨。
如图6所示，在封装层50进行研磨后的表面，较未研磨之前脱模材料的浓度大大降低，从而对指纹识别芯片的干扰较小，提高了封装后的指纹识别芯片的识别灵敏度。
经试验发现，步骤S40研磨至封装层50表面与基板10第一表面之间的高度h为20μm至50μm时，指纹识别芯片已能够灵敏地识别指纹信号。
图7示出了基板10为双面印制电路板或多层印制电路板时，封装层50被研磨后的情形。其中70为导电柱，60为焊盘。
S50：在封装层表面设置保护层。
如图8所示，80为保护层。保护层的材质可以为蓝宝石、玻璃或者其他材质。例如，步骤S50可以为在封装层50表面贴附玻璃薄片，或者在封装层50表面涂布油漆或硅胶。
S60：对板体进行切割，得到单个指纹识别芯片的封装结构。
如图9所示，对图8所示的板体进行切割后，可以得到单个指纹识别芯片的封装结构。其中10为基板，20为胶体层，30为指纹识别芯片，40为连接导线，50为封装层，60为焊盘，70为导电柱。
需要补充说明的是，基板10也可以为单面印制电路板，在此情况下本发明实施例所制备的指纹识别芯片封装结构则没有图9中所示的焊盘60和导电柱70，而可以采用其他连接方式引出指纹识别芯片的信号，例如在基板10的第一表面焊接引脚。
上述指纹识别芯片的封装方法，先将指纹识别芯片贴附于基板第一表面，然后在基板第一表面与指纹识别芯片之间设置连接导线，再在基板和指纹识别芯片的外表面使用封装材料进行封装，由于封装材料中的脱模材料在封装层表面的浓度高于在封装层内部的浓度，因此在对该封装层进行研磨后即可降低指纹识别芯片表面的封装层中脱模材料的浓度，由此提高封装后的指纹识别芯片的识别灵敏度；由于指纹识别芯片表面有封装层的保护，因此可以保护指纹识别芯片不受损。
需要补充说明的是，本申请所提供的方法还可以用于掌纹识别芯片的封装。
虽然结合附图描述了本发明的实施例，但是本领域技术人员可以在不脱离本发明的精神和范围的情况下作出各种修改和变型，这样的修改和变型均落入由所附权利要求所限定的范围之内。

Claims (9)

1.一种指纹识别芯片封装方法，其特征在于，包括：
将指纹识别芯片贴附于基板第一表面；所述基板第一表面印制有导线；
在所述基板第一表面与所述指纹识别芯片之间设置连接导线；
在所述基板和所述指纹识别芯片的外表面使用封装材料进行封装，封装层覆盖所述连接导线与所述指纹识别芯片；所述封装材料中包括脱模材料，所述脱模材料在封装层表面的浓度高于在所述封装层内部的浓度；
对所述封装层进行研磨。
2.根据权利要求1所述的指纹识别芯片封装方法，其特征在于，所述对所述封装层进行研磨的步骤中，研磨至所述封装层表面与所述基板第一表面之间的高度为20μm至50μm。
3.根据权利要求1所述的指纹识别芯片封装方法，其特征在于，所述基板为双面印制电路板或多层印制电路板。
4.根据权利要求1或3所述的指纹识别芯片封装方法，其特征在于，所述基板为柔性电路板。
5.根据权利要求1所述的指纹识别芯片封装方法，其特征在于，所述基板还包括与第一表面相对设置的第二表面，在所述第二表面设置有焊盘；所述基板设置有至少一个贯穿所述基板第一表面和所述第二表面的导电柱，所述导电柱两端分别连接所述第一表面的导线和所述第二表面的焊盘。
6.根据权利要求1所述的指纹识别芯片封装方法，其特征在于，所述对所述封装层进行研磨的步骤之后，还包括：在所述封装层表面设置保护层。
7.根据权利要求6所述的指纹识别芯片封装方法，其特征在于，所述在所述封装层表面设置保护层的步骤包括：
在所述封装层表面贴附玻璃薄片；和/或，在所述封装层表面涂布油漆或硅胶。
8.根据权利要求6所述的指纹识别芯片封装方法，其特征在于，在所述封装层表面设置保护层的步骤之后，还包括：对板体进行切割，得到单个指纹识别芯片的封装结构。
9.一种采用权利要求1至8任一项所述的指纹识别芯片封装方法所制备的指纹识别芯片封装结构。
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