CN107275018A - A kind of noninductive resistance and the High-heat-conductiviinsulation insulation material for the noninductive resistance - Google Patents
A kind of noninductive resistance and the High-heat-conductiviinsulation insulation material for the noninductive resistance Download PDFInfo
- Publication number
- CN107275018A CN107275018A CN201710341334.9A CN201710341334A CN107275018A CN 107275018 A CN107275018 A CN 107275018A CN 201710341334 A CN201710341334 A CN 201710341334A CN 107275018 A CN107275018 A CN 107275018A
- Authority
- CN
- China
- Prior art keywords
- noninductive resistance
- heat
- noninductive
- pin
- insulation material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
- H01C3/02—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids arranged or constructed for reducing self-induction, capacitance or variation with frequency
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/024—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
Abstract
The invention provides a kind of noninductive resistance, including noninductive resistance chip, hot pressing shell, pin on noninductive resistance chip, the pin is drawn from the noninductive resistance chip and extends to the housing exterior, and the shell is hot-forming using High-heat-conductiviinsulation insulation material.A kind of High-heat-conductiviinsulation insulation material for the noninductive resistance, including following mass component are also provided：Powdered quartz：60 ~ 80, epoxy resin：10 ~ 18, phenolic resin：5 ~ 10, brominated epoxy resin：1 ~ 2, antimony oxide：1~2.Using High-heat-conductiviinsulation insulation material on noninductive resistance chip and its pin direct hot-forming shell, structure and technique are all more simple, change the mode of in the past traditional noninductive resistance artificial filling paste in ceramic case, can batch one-shot forming, greatly promote production efficiency, improve the yields of finished product, the large-scale application for such noninductive resistance provides possibility.
Description
Technical field
The present invention relates to electronic element device materials field, more particularly to a kind of noninductive resistance and for the noninductive resistance
High-heat-conductiviinsulation insulation material.
Background technology
Noninductive resistance is one kind of resistance, the features such as it has heat-resisting, moisture-proof, low price, and the induction reactance value on noninductive resistance is non-
It is often small, it can be ignored, some accurate instrumentation devices, electronics industry equipment usually needs to use such without electrification
Resistance, because commonly the resistance with high induction reactance easily produces other devices in concussion, defective loop in use.It is a large amount of at present
Use noninductive cement resistor, a kind of noninductive cement resistor as disclosed in CN201893210U, be by a ceramic package, by
Iron aluminium Chrome alloy strip, which is extruded, to be made the pellet resistance chip of shaping, is connected with resistance chip and is piercing in drawing for the ceramic package
Line is constituted, and resistance chip is encapsulated in the ceramic package by cement slurry, and usual such resistor is very small, ceramic package
Endoporus it is smaller（Between long several millimeters to one centimetre, 1-3 millimeters of width）, because small product size is small, this encapsulation process is difficult to lead to
Machine realization is crossed, thus is usually that artificial operation is completed, long-term production operation easily influences the eyesight of operating personnel, product matter
Also ginseng time is uneven for amount, and defective products rate remains high always.And also have every time can only be pre- in setting time, production process for cement slurry
Standby small part cement slurry, to prevent the solidification of water material-mud from causing to waste, whole production efficiency is extremely low, it is impossible to improve production efficiency
Produced in enormous quantities, seriously constrain the large-scale use of the type noninductive resistance.CN204066913U also discloses that one kind
Noninductive cement resistor, this is noninductive, and cement resistor is then that ceramic package is packaged using insulating heat-conduction material, although will
Packing material expands to other insulating heat-conduction materials to scope, but it still needs artificial filling, it is difficult to improving production efficiency and
Product quality.
CN201859718U discloses a kind of resistor, will be sealed above and below its resistor, the structure of the resistor
It is increasingly complex that CN201893210U is compared with manufacture craft.
The content of the invention
It is an object of the present invention to which there is provided a kind of noninductive resistance solved the above problems in view of the shortcomings of the prior art.
The technical scheme that is used to achieve the above object of the present invention for：A kind of noninductive resistance, the noninductive resistance
Including noninductive resistance chip, hot pressing shell, pin on noninductive resistance chip, the pin is from the noninductive resistance core
Piece is drawn and extends to the housing exterior, and the shell is hot-forming using High-heat-conductiviinsulation insulation material.
Preferably, the noninductive resistance is paster noninductive resistance, and the pin is drawn from the noninductive resistance chip
After be bent into paster pin, the paster pin is two or four.
Preferably, the noninductive resistance is plug-in unit noninductive resistance, and the pin is two or four.
Preferably, the High-heat-conductiviinsulation insulation material that the shell is used is high heat conductive insulating fire proofing.
The present invention also provides a kind of High-heat-conductiviinsulation insulation material for the noninductive resistance, including following mass component：
Powdered quartz：60~80
Epoxy resin：10~18
Phenolic resin：5~10
Brominated epoxy resin：1~2
Antimony oxide：1~2
Preferably, in addition to following mass component：Fire retardant：5~10.
The solution have the advantages that, the direct hot pressing on noninductive resistance chip and its pin using High-heat-conductiviinsulation insulation material
Shell molds, structure and technique are all more simple, change in the past traditional noninductive resistance artificial filling paste in ceramic case
Mode, can batch one-shot forming, greatly promote production efficiency, improve finished product yields, be the big rule of such noninductive resistance
Mould is applied there is provided possible.
In addition, traditional noninductive resistance is due to needing filling paste, therefore it can only typically be used as plug-in unit resistance, it is impossible to make paster
Resistance, noninductive resistance of the invention can not only make plug-in unit resistance, can also directly make Chip-R, in favor of with other
The SMD components such as type Chip-R, patch capacitor are produced by paster together, and greatly promoting needs to use this type resistance
Circuit board production efficiency.
The invention is specifically described below in conjunction with the accompanying drawings.
Brief description of the drawings
Fig. 1 is the structure schematic front view of first embodiment of the invention.
Fig. 2 is the structure partial schematic cross-sectional view of first embodiment of the invention.
Fig. 3 is the structural representation of first embodiment of the invention.
Fig. 4 is the structural representation of second embodiment of the invention.
Embodiment
First embodiment：
Referring to accompanying drawing 1,2,3 there is provided a kind of noninductive resistance, the present embodiment is a kind of plug-in unit noninductive resistance, including shell 101, nothing
Sensing resistor chip 102, pin 103, pin 103 is plug-in type pin, and noninductive resistance chip 102 can use planar metal material
Material, such as a variety of alloy materials of NiCu/NiCr/MnCu alloys, pin 103 passes through the modes such as welding with noninductive resistance chip 102
Realize electrical connection.Pin 103 be arranged as required to for two or four even more than.
Noninductive resistance chip 102 can produce heat in the course of the work, thus need highly heat-conductive material by the partial heat
Conduct in time, prior art is the insulating heat-conduction materials such as filling concrete mortar, the portion of material needs manually to fill,
It is very big to long period of operation personnel eyesight because product is small, and product quality ginseng time is uneven, defective products rate is high.The present embodiment
Using High-heat-conductiviinsulation insulation material that can be hot-forming, after pin 103 is electrically connected with the realization of noninductive resistance chip 102, directly use
Heat pressing forming machines hot-forming shell 101 on pin 103 and noninductive resistance chip 102, by pin 103 and noninductive resistance chip
102 are closed, one-shot forming, and pin 103 is extended out to outside shell 101 from noninductive resistance chip 102.
The High-heat-conductiviinsulation insulation material of the present embodiment includes following mass component：
Powdered quartz：63
Epoxy resin：12
Phenolic resin：6
Brominated epoxy resin：1
Antimony oxide：1
Above component material is mixed, graininess is made, the shaping of heat supply pressing machine is used in the noninductive resistance of the present embodiment
Shell 101 is molded, hot-forming with energy, and high heat conduction, the efficiency of insulation.
Second embodiment：
Referring to Fig. 4, second embodiment of the invention is paster noninductive resistance, and the difference with first embodiment is, its
Pin 303 is SMD, and pin 303 is bent into paster pin after the extraction of noninductive resistance chip 302.During production, into
After type shell 301, then pin 30 is carried out to flatten bending, the need for adapting to paster..
The High-heat-conductiviinsulation insulation material of second embodiment of the invention includes following mass component：
Powdered quartz：70
Epoxy resin：15
Phenolic resin：8
Brominated epoxy resin：2
Antimony oxide：2
To play flame retardant effect, fire retardant pentaerythrite can also be added, its mass component：10.
Above component material is mixed, graininess is made, the shaping of heat supply pressing machine be used in the present embodiment without electrification
The outer casing forming of resistance, it is hot-forming with energy, and high heat conduction, insulation, fire-retardant efficiency.
The beneficial effects of the invention are as follows the direct hot pressing on noninductive resistance chip and its pin using High-heat-conductiviinsulation insulation material
Shell molds, structure and technique are all more simple, change in the past traditional noninductive resistance artificial filling paste in ceramic case
Mode, can batch one-shot forming, greatly promote production efficiency, improve finished product yields, be the big rule of such noninductive resistance
Mould is applied there is provided possible.
In addition, traditional noninductive cement resistor is due to needing filling paste, therefore it can only typically be used as plug-in unit resistance, it is impossible to make
Chip-R, noninductive resistance of the invention can not only make plug-in unit resistance, can also directly make Chip-R, in favor of with
The SMD components such as other types Chip-R, patch capacitor are produced by paster together, and greatly promoting needs to use this type
The production efficiency of the circuit board of resistance.
Certainly, this invention can also have other conversion, it is not limited to which above-mentioned embodiment, those skilled in the art are had
Standby knowledge, can also various changes can be made without departing from the inventive concept of the premise, such change all should fall in this hair
In bright protection domain.
Claims (6)
1. a kind of noninductive resistance, it is characterised in that the noninductive resistance includes noninductive resistance chip, hot pressing in noninductive resistance chip
On shell, pin, the pin drawn from the noninductive resistance chip and extends to the housing exterior, and the shell is used
High-heat-conductiviinsulation insulation material is hot-forming.
2. noninductive resistance according to claim 1, it is characterised in that the noninductive resistance is paster noninductive resistance, described
Pin is bent into paster pin after noninductive resistance chip extraction, and the paster pin is two or four.
3. noninductive resistance according to claim 1, it is characterised in that the noninductive resistance is plug-in unit noninductive resistance, described
Pin is two or four.
4. noninductive resistance according to claim 1, it is characterised in that the High-heat-conductiviinsulation insulation material that the shell is used is height
Heat conductive insulating fire proofing.
5. a kind of High-heat-conductiviinsulation insulation material for noninductive resistance as claimed in claim 1, it is characterised in that including following matter
Measure component：
Powdered quartz：60~80
Epoxy resin：10~18
Phenolic resin：5~10
Brominated epoxy resin：1~2
Antimony oxide：1~2.
6. it is used for the High-heat-conductiviinsulation insulation material of noninductive resistance according to claim 5, it is characterised in that also including following matter
Measure component：Fire retardant：5~10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710341334.9A CN107275018A (en) | 2017-05-16 | 2017-05-16 | A kind of noninductive resistance and the High-heat-conductiviinsulation insulation material for the noninductive resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710341334.9A CN107275018A (en) | 2017-05-16 | 2017-05-16 | A kind of noninductive resistance and the High-heat-conductiviinsulation insulation material for the noninductive resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107275018A true CN107275018A (en) | 2017-10-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710341334.9A Pending CN107275018A (en) | 2017-05-16 | 2017-05-16 | A kind of noninductive resistance and the High-heat-conductiviinsulation insulation material for the noninductive resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107275018A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1069147A (en) * | 1991-05-01 | 1993-02-17 | 罗姆和哈斯公司 | Be used for the epoxy molding composition that the plate face is installed |
| CN1512522A (en) * | 2002-12-30 | 2004-07-14 | 广东风华高新科技集团有限公司 | Resin size used for chip resistor |
| CN201893210U (en) * | 2010-09-10 | 2011-07-06 | 东莞市福德电子有限公司 | Metal piece noninductive cement resistor |
| CN102337002A (en) * | 2011-06-17 | 2012-02-01 | 莱州市顺利达电子材料有限公司 | Organic silicon modified phenolic resin encapsulating material and preparation method and usage thereof |
| CN203444889U (en) * | 2013-09-03 | 2014-02-19 | 章波 | Small-size non-inductive thick-film high-precision module power resistor |
| CN205621531U (en) * | 2016-04-27 | 2016-10-05 | 东莞市晴远电子有限公司 | High -power paster metal film resistor |
-
2017
- 2017-05-16 CN CN201710341334.9A patent/CN107275018A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1069147A (en) * | 1991-05-01 | 1993-02-17 | 罗姆和哈斯公司 | Be used for the epoxy molding composition that the plate face is installed |
| CN1512522A (en) * | 2002-12-30 | 2004-07-14 | 广东风华高新科技集团有限公司 | Resin size used for chip resistor |
| CN201893210U (en) * | 2010-09-10 | 2011-07-06 | 东莞市福德电子有限公司 | Metal piece noninductive cement resistor |
| CN102337002A (en) * | 2011-06-17 | 2012-02-01 | 莱州市顺利达电子材料有限公司 | Organic silicon modified phenolic resin encapsulating material and preparation method and usage thereof |
| CN203444889U (en) * | 2013-09-03 | 2014-02-19 | 章波 | Small-size non-inductive thick-film high-precision module power resistor |
| CN205621531U (en) * | 2016-04-27 | 2016-10-05 | 东莞市晴远电子有限公司 | High -power paster metal film resistor |
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Application publication date: 20171020 |