CN107331485A - A kind of noninductive resistance and its manufacture method - Google Patents
A kind of noninductive resistance and its manufacture method Download PDFInfo
- Publication number
- CN107331485A CN107331485A CN201710341184.1A CN201710341184A CN107331485A CN 107331485 A CN107331485 A CN 107331485A CN 201710341184 A CN201710341184 A CN 201710341184A CN 107331485 A CN107331485 A CN 107331485A
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- Prior art keywords
- noninductive resistance
- pin
- heat
- noninductive
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
The invention provides a kind of noninductive resistance, the noninductive resistance includes noninductive resistance chip, hot pressing shell, pin on noninductive resistance chip, the pin is drawn from the noninductive resistance chip and extends to the housing exterior, and the shell is hot-forming using High-heat-conductiviinsulation insulation material.The present invention uses High-heat-conductiviinsulation insulation material directly hot-forming on noninductive resistance chip and its pin, structure and technique are all more simple, change the mode of in the past traditional noninductive resistance artificial filling paste in ceramic case, can batch one-shot forming, greatly promote production efficiency, improve the yields of finished product, the large-scale application for such noninductive resistance provides condition.
Description
Technical field
The present invention relates to electronic component field, more particularly to a kind of noninductive resistance and its manufacture method.
Background technology
Noninductive resistance is one kind of resistance, the features such as it has heat-resisting, moisture-proof, low price, and the induction reactance value on noninductive resistance is non-
It is often small, it can be ignored, some accurate instrumentation devices, electronics industry equipment usually needs to use such without electrification
Resistance, because commonly the resistance with high induction reactance easily produces other devices in concussion, defective loop in use.It is a large amount of at present
Use noninductive cement resistor, a kind of noninductive cement resistor as disclosed in CN201893210U, be by a ceramic package, by
Iron aluminium Chrome alloy strip, which is extruded, to be made the pellet resistance chip of shaping, is connected with resistance chip and is piercing in drawing for the ceramic package
Line is constituted, and resistance chip is encapsulated in the ceramic package by cement slurry, and usual such resistor is very small, ceramic package
Endoporus it is smaller（Between long several millimeters to one centimetre, 1-3 millimeters of width）, because small product size is small, this encapsulation process is difficult to lead to
Machine realization is crossed, thus is usually that artificial operation is completed, long-term production operation easily influences the eyesight of operating personnel, product matter
Also ginseng time is uneven for amount, and defective products rate remains high always.And also have every time can only be pre- in setting time, production process for cement slurry
Standby small part cement slurry, to prevent the solidification of water material-mud from causing to waste, whole production efficiency is extremely low, it is impossible to improve production efficiency
Produced in enormous quantities, seriously constrain the large-scale use of the type noninductive resistance.CN204066913U also discloses that one kind
Noninductive cement resistor, this is noninductive, and cement resistor is then that ceramic package is packaged using insulating heat-conduction material, although will
Packing material expands to other insulating heat-conduction materials to scope, but it still needs artificial filling, it is difficult to improving production efficiency and
Product quality.
CN201859718U discloses a kind of resistor, will be sealed above and below its resistor, the structure of the resistor
It is increasingly complex that CN201893210U is compared with manufacture craft.
The content of the invention
It is an object of the present invention to which there is provided a kind of noninductive resistance solved the above problems in view of the shortcomings of the prior art.
The technical scheme that is used to achieve the above object of the present invention for：A kind of noninductive resistance, the noninductive resistance
Including noninductive resistance chip, hot pressing shell, pin on noninductive resistance chip, the pin is from the noninductive resistance core
Piece is drawn and extends to the housing exterior, and the shell is hot-forming using High-heat-conductiviinsulation insulation material.
Preferably, the noninductive resistance is paster noninductive resistance, and the pin is drawn from the noninductive resistance chip
After be bent into paster pin, the paster pin is two or four.
Preferably, the noninductive resistance is plug-in unit noninductive resistance, and the pin is two or four.
Preferably, the High-heat-conductiviinsulation insulation material that the shell is used is high heat conductive insulating fire proofing.
The present invention also provides a kind of method for manufacturing the noninductive resistance, comprises the following steps：
A) noninductive resistance chip, High-heat-conductiviinsulation insulation material, pin are provided；
B) realize that noninductive resistance chip is electrically connected with the pin and is；
C) the hot-forming shell of High-heat-conductiviinsulation insulation material is used on noninductive resistance chip and pin by heat pressing forming machines, pin prolongs
Extend the housing exterior.
Preferably, the High-heat-conductiviinsulation insulation material is high heat conductive insulating fire proofing.
Preferably, after step C, the pin of the housing exterior is bent into paster pin.
The solution have the advantages that, the direct hot pressing on noninductive resistance chip and its pin using High-heat-conductiviinsulation insulation material
Shell molds, structure and technique are all more simple, change in the past traditional noninductive resistance artificial filling paste in ceramic case
Mode, can batch one-shot forming, greatly promote production efficiency, improve finished product yields, be the big rule of such noninductive resistance
Mould is applied there is provided possible.
In addition, traditional noninductive resistance is due to needing filling paste, therefore it can only typically be used as plug-in unit resistance, it is impossible to make paster
Resistance, noninductive resistance of the invention can not only make plug-in unit resistance, can also directly make Chip-R, in favor of with other
The SMD components such as type Chip-R, patch capacitor are produced by paster together, and greatly promoting needs to use this type resistance
Circuit board production efficiency.
The invention is specifically described below in conjunction with the accompanying drawings.
Brief description of the drawings
Fig. 1 is the structure schematic front view of first embodiment of the invention.
Fig. 2 is the structure partial schematic cross-sectional view of first embodiment of the invention.
Fig. 3 is the structural representation of first embodiment of the invention.
Fig. 4 is the manufacturing approach craft flow chart of first embodiment of the invention.
Fig. 5 is the structural representation of second embodiment of the invention.
Embodiment
First embodiment：
Referring to accompanying drawing 1,2,3 there is provided a kind of noninductive resistance, the present embodiment is a kind of plug-in unit noninductive resistance, including shell 101, nothing
Sensing resistor chip 102, pin 103, pin 103 is plug-in type pin, and noninductive resistance chip 102 can use planar metal material
Material, such as a variety of alloy materials of NiCu/NiCr/MnCu alloys, pin 103 passes through the modes such as welding with noninductive resistance chip 102
Realize electrical connection.Pin 103 be arranged as required to for two or four even more than.
Noninductive resistance chip 102 can produce heat in the course of the work, thus need highly heat-conductive material by the partial heat
Conduct in time, prior art is the insulating heat-conduction materials such as filling concrete mortar, the portion of material needs manually to fill,
It is very big to long period of operation personnel eyesight because product is small, and product quality ginseng time is uneven, defective products rate is high.The present embodiment
Using High-heat-conductiviinsulation insulation material that can be hot-forming, after pin 103 is electrically connected with the realization of noninductive resistance chip 102, directly use
Heat pressing forming machines hot-forming shell 101 on pin 103 and noninductive resistance chip 102, by pin 103 and noninductive resistance chip
102 are closed, one-shot forming, and pin 103 is extended out to outside shell 101 from noninductive resistance chip 102.
High-heat-conductiviinsulation insulation material scope that can be hot-forming is wider, the High-heat-conductiviinsulation insulation material component bag that the present embodiment is used
Include epoxy resin, phenoxy resin, curing agent, curing accelerator and heat filling, it would however also be possible to employ as CN103524995A institutes are public
The formula materials opened, naturally it is also possible to can carry out hot-forming High-heat-conductiviinsulation insulation material using other.
To play flame retardant effect, the High-heat-conductiviinsulation insulation material of the present embodiment can also select high heat conductive insulating fire proofing.
Referring to Fig. 4, the manufacture method of the present embodiment comprises the following steps:
201：Noninductive resistance chip 102, High-heat-conductiviinsulation insulation material, pin 103 are provided；
202：Realize that noninductive resistance chip 102 is electrically connected with pin 103；
203：By heat pressing forming machines high heat conductive insulating is used on noninductive resistance chip 102 and pin 103
The hot-forming shell 101 of material, pin 103 is extended to outside shell 101.
I.e. detectable after shaping, packaging shipment.
Second embodiment：
Referring to Fig. 5, second embodiment of the invention is paster noninductive resistance, and the difference with first embodiment is, its
Pin 303 is SMD, and pin 303 is bent into paster pin after the extraction of noninductive resistance chip 302.During production, into
After type shell 301, then pin 30 is carried out to flatten bending, the need for adapting to paster.
The beneficial effects of the invention are as follows the direct hot pressing on noninductive resistance chip and its pin using High-heat-conductiviinsulation insulation material
Shell molds, structure and technique are all more simple, change in the past traditional noninductive resistance artificial filling paste in ceramic case
Mode, can batch one-shot forming, greatly promote production efficiency, improve finished product yields, be the big rule of such noninductive resistance
Mould is applied there is provided possible.
In addition, traditional noninductive cement resistor is due to needing filling paste, therefore it can only typically be used as plug-in unit resistance, it is impossible to make
Chip-R, noninductive resistance of the invention can not only make plug-in unit resistance, can also directly make Chip-R, in favor of with
The SMD components such as other types Chip-R, patch capacitor are produced by paster together, and greatly promoting needs to use this type
The production efficiency of the circuit board of resistance.
Certainly, this invention can also have other conversion, it is not limited to which above-mentioned embodiment, those skilled in the art are had
Standby knowledge, can also various changes can be made without departing from the inventive concept of the premise, such change all should fall in this hair
In bright protection domain.
Claims (7)
1. a kind of noninductive resistance, it is characterised in that the noninductive resistance includes noninductive resistance chip, hot pressing in noninductive resistance chip
On shell, pin, the pin drawn from the noninductive resistance chip and extends to the housing exterior, and the shell is used
High-heat-conductiviinsulation insulation material is hot-forming.
2. noninductive resistance according to claim 1, it is characterised in that the noninductive resistance is paster noninductive resistance, described
Pin is bent into paster pin after noninductive resistance chip extraction, and the paster pin is two or four.
3. noninductive resistance according to claim 1, it is characterised in that the noninductive resistance is plug-in unit noninductive resistance, described
Pin is two or four.
4. noninductive resistance according to claim 1, it is characterised in that the High-heat-conductiviinsulation insulation material that the shell is used is height
Heat conductive insulating fire proofing.
5. a kind of method for manufacturing noninductive resistance as claimed in claim 1, it is characterised in that comprise the following steps：
A) noninductive resistance chip, High-heat-conductiviinsulation insulation material, pin are provided；
B) realize that noninductive resistance chip is electrically connected with the pin and is；
C) the hot-forming shell of High-heat-conductiviinsulation insulation material is used on noninductive resistance chip and pin by heat pressing forming machines, pin prolongs
Extend the housing exterior.
6. the method for noninductive resistance is manufactured according to claim 5, it is characterised in that the High-heat-conductiviinsulation insulation material is led for height
Heat insulation fire proofing.
7. the method for noninductive resistance is manufactured according to claim 5, it is characterised in that after step C, by the housing exterior
Pin is bent into paster pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710341184.1A CN107331485A (en) | 2017-05-16 | 2017-05-16 | A kind of noninductive resistance and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710341184.1A CN107331485A (en) | 2017-05-16 | 2017-05-16 | A kind of noninductive resistance and its manufacture method |
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| Publication Number | Publication Date |
|---|---|
| CN107331485A true CN107331485A (en) | 2017-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710341184.1A Pending CN107331485A (en) | 2017-05-16 | 2017-05-16 | A kind of noninductive resistance and its manufacture method |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB960096A (en) * | 1960-03-18 | 1964-06-10 | Dubilier Condenser Co 1925 Ltd | Improvements in or relating to the production of encapsulated electrical components |
| CN102735367A (en) * | 2012-07-09 | 2012-10-17 | 深圳市敏杰电子科技有限公司 | Temperature sensor for measuring surface temperature |
| CN203055584U (en) * | 2013-01-15 | 2013-07-10 | 贝迪斯电子有限公司 | Precise metal film network resistor |
| CN203085305U (en) * | 2012-12-28 | 2013-07-24 | 深圳顺络电子股份有限公司 | Piezoresistor |
| CN103236331A (en) * | 2013-04-07 | 2013-08-07 | 国家电网公司 | Non-inductive resistor for measuring high impulse voltage |
| CN205004121U (en) * | 2015-10-11 | 2016-01-27 | 广东百圳君耀电子有限公司 | Height endures type paster piezo -resistor |
| CN205621531U (en) * | 2016-04-27 | 2016-10-05 | 东莞市晴远电子有限公司 | High -power paster metal film resistor |
-
2017
- 2017-05-16 CN CN201710341184.1A patent/CN107331485A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB960096A (en) * | 1960-03-18 | 1964-06-10 | Dubilier Condenser Co 1925 Ltd | Improvements in or relating to the production of encapsulated electrical components |
| CN102735367A (en) * | 2012-07-09 | 2012-10-17 | 深圳市敏杰电子科技有限公司 | Temperature sensor for measuring surface temperature |
| CN203085305U (en) * | 2012-12-28 | 2013-07-24 | 深圳顺络电子股份有限公司 | Piezoresistor |
| CN203055584U (en) * | 2013-01-15 | 2013-07-10 | 贝迪斯电子有限公司 | Precise metal film network resistor |
| CN103236331A (en) * | 2013-04-07 | 2013-08-07 | 国家电网公司 | Non-inductive resistor for measuring high impulse voltage |
| CN205004121U (en) * | 2015-10-11 | 2016-01-27 | 广东百圳君耀电子有限公司 | Height endures type paster piezo -resistor |
| CN205621531U (en) * | 2016-04-27 | 2016-10-05 | 东莞市晴远电子有限公司 | High -power paster metal film resistor |
Non-Patent Citations (1)
| Title |
|---|
| 方大千，方欣编著: "《简明实用电工查算手册》", 31 July 2014, 机械工业出版社 * |
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Application publication date: 20171107 |