CN107249258A - A kind of repair method of PCB pads - Google Patents
A kind of repair method of PCB pads Download PDFInfo
- Publication number
- CN107249258A CN107249258A CN201710416295.4A CN201710416295A CN107249258A CN 107249258 A CN107249258 A CN 107249258A CN 201710416295 A CN201710416295 A CN 201710416295A CN 107249258 A CN107249258 A CN 107249258A
- Authority
- CN
- China
- Prior art keywords
- pad
- pcb
- repairing
- mending
- pcb pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a kind of repair method of PCB pads, several pads being connected with circuit are provided with PCB, sequentially include pad removal, surface polishing the step of being safeguarded to PCB pads, target land is cut out and pad is bonded, it is related to the integral replacing that pad is the single pad to being related in the method for repairing and mending, when carrying out pad removal, the connection inclined-plane with gradient is being cut out with being damaged on the circuit that pad is connected, the connection inclined-plane is used for the circuit when pad is bonded and docked with the reliable of pad.The present invention can quickly and efficiently complete the replacing maintenance for having damaged pad on PCB, due to using the pad maintenance of monoblock type, it is ensured that the PCB stabilitys height after maintenance be completed, still with good functional reliability.
Description
Technical field
The present invention relates to a kind of repair method of PCB pads.
Background technology
With the development of telling of electronic technology, electronic product is gradually intended to miniaturization, lighting, the direction of high integration
Development is gone, among these printed substrate（PCB）As the parts that electronic product is essential, but it is due to printed substrate
Overall structure characteristic, device thereon occurs tilting or even comes off wherein, wherein more universal is exactly pad damage, leads
Monoblock PCB performance losses are caused, or even are scrapped, system is not directed to this pad repair method at present.
The content of the invention
It is an object of the present invention to provide a kind of repair method of PCB pads, it can be completed for having been damaged on PCB
The reparation of bad pad, completes the PCB stabilitys height after maintenance, still with good functional reliability.
Especially, the invention provides a kind of repair method of PCB pads, on PCB several are provided with circuit to be connected
Pad, sequentially include that pad is removed, surface polishing, target land cuts out and pad the step of being safeguarded to PCB pads
Bonding.
For above-mentioned technical proposal, inventor also has further optimal enforcement scheme.
Further, the integral replacing that pad is the single pad to being related to is related in the method for repairing and mending.
Further, when carrying out pad removal, the company with gradient is being cut out with being damaged on the circuit that pad is connected
Inclined-plane is connect, the connection inclined-plane is used for the circuit when pad is bonded and docked with the reliable of pad.
Further, the length on the connection inclined-plane is 5 ~ 10mm.
Further, the gradient of the length on the connection inclined-plane is 10 ° to 20 °.
Further, after pad bonding is carried out, solder mask is sprayed in the junction of pad and circuit.
Further, it is that the residue that original pad is remained is removed by belt sanding when carrying out surface polishing, and
Polishing removes the oxide layer on target land surface in addition.
Further, the shape of the target land is identical with the bond pad shapes damaged, and carries out the target land
During cutting, first pass through sample paper and be cut out and damaged pad identical shape, then required target is cut out through the comparison of sample paper and weld
Disk.
Further, production PCB pads producer is configured with the target land matched with the bond pad shapes of each model on PCB
Repair piece, for target land directly take.
Further, when carrying out pad bonding, layers of two-sided is attached at the pad that first correspondence has been damaged on PCB, then
The target land is bonded in thereon, unnecessary layers of two-sided is finally cleared up.
Compared with prior art, the advantage of the invention is that：
The repair method of the PCB pads of the present invention, can quickly and efficiently complete the more repair for having damaged pad on PCB
Shield, due to using the pad maintenance of monoblock type, it is ensured that the PCB stabilitys height after maintenance is completed, still with good work
Make reliability.
According to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will be brighter
Above-mentioned and other purposes, the advantages and features of the present invention.
Brief description of the drawings
Some specific embodiments of the present invention are described in detail by way of example, and not by way of limitation with reference to the accompanying drawings hereinafter.
Identical reference denotes same or similar part or part in accompanying drawing.It should be appreciated by those skilled in the art that these
What accompanying drawing was not necessarily drawn to scale.In accompanying drawing：
Fig. 1 is according to the method flow diagram that PCB pad maintenances are carried out in one embodiment of the invention.
Embodiment
Fig. 1 is according to the method flow diagram that PCB pad maintenances are carried out in one embodiment of the invention.
As shown in figure 1, present embodiment describes a kind of repair method of PCB pads, several and circuit are provided with PCB
Connected pad, the step of being safeguarded to PCB pads sequentially include pad remove, surface polishing, target land cut out and
Pad is bonded.
It is related to the integral replacing that pad is the single pad to being related in pad method for repairing and mending described in the present embodiment.
Particularly, when carrying out pad removal, it need to be cut out with being damaged on the circuit that pad is connected with gradient
Inclined-plane is connected, the connection inclined-plane is used for the circuit when pad is bonded and docked with the reliable of pad, it is ensured that between pad and circuit
It is reliably connected, to ensure that PCB keeps original performance after maintenance.
In order to ensure being reliably connected between pad and circuit after repairing, the length on the connection inclined-plane is 5 ~ 10mm, and institute
The gradient for stating the length on connection inclined-plane is 10 ° to 20 °.
It should be noted that after pad bonding is carried out, spraying solder mask in the junction of pad and circuit, preventing the later stage
For the damage of circuit during progress PCB welding.
Further, it is that the residue that original pad is remained is removed by belt sanding when carrying out surface polishing, and
Polishing removes the oxide layer on target land surface in addition.
The shape of the target land is identical with the bond pad shapes damaged, and when carrying out the target land cutting, first leads to
Cross sample paper to be cut out with having damaged pad identical shape, then the target land needed for cutting out is compared through sample paper.
Convenient for the replacing of pad, production PCB pads producer is configured with the bond pad shapes matching with each model on PCB
Target land repair piece, so in PCB production find want maintenance pad if, directly by the repair piece of target land
Bring, be directly used in target land, without cutting out, improve work task efficiency.
When carrying out pad bonding, layers of two-sided is first attached at the pad that has damaged of correspondence on PCB, then by the target
Pad is bonded in thereon, finally clears up unnecessary layers of two-sided.
To sum up, it is seen that the repair method of the PCB pads described by the present embodiment, can quickly and efficiently it complete for PCB
On damaged the replacing maintenance of pad, due to using the pad maintenance of monoblock type, it is ensured that complete the PCB after maintenance stable
Degree is high, still with good functional reliability.
So far, although those skilled in the art will appreciate that detailed herein have shown and described multiple showing for the present invention
Example property embodiment, still, still can be direct according to present disclosure without departing from the spirit and scope of the present invention
It is determined that or deriving many other variations or modifications for meeting the principle of the invention.Therefore, the scope of the present invention is understood that and recognized
It is set to and covers other all these variations or modifications.
Claims (10)
1. it is provided with several pads being connected with circuit on a kind of repair method of PCB pads, PCB, it is characterised in that right
The step of PCB pads are safeguarded sequentially includes pad removal, surface polishing, target land is cut out and pad is bonded.
2. the method for repairing and mending of PCB pads according to claim 1, it is characterised in that be related to pad in the method for repairing and mending
It is the integral replacing of the single pad to being related to.
3. the method for repairing and mending of PCB pads according to claim 1, it is characterised in that when carrying out pad removal, with quilt
Damage and the connection inclined-plane with gradient cut out on the connected circuit of pad, the connection inclined-plane be used for when pad be bonded circuit and
The reliable docking of pad.
4. the method for repairing and mending of PCB pads according to claim 3, it is characterised in that the length on the connection inclined-plane is 5 ~
10mm。
5. the method for repairing and mending of the PCB pads according to claim 3 or 4, it is characterised in that the length on the connection inclined-plane
Gradient is 10 ° to 20 °.
6. the method for repairing and mending of PCB pads according to claim 1, it is characterised in that after pad bonding is carried out, in pad
Solder mask is sprayed with the junction of circuit.
7. the method for repairing and mending of PCB pads according to claim 1, it is characterised in that be to pass through when carrying out surface polishing
Belt sanding removes the residue of original pad residual, and polishing removes the oxide layer on target land surface in addition.
8. the method for repairing and mending of the PCB pads according to claim 1 or 7, it is characterised in that the shape of the target land with
The bond pad shapes damaged are identical, when carrying out the target land and cutting, first pass through sample paper be cut out it is identical with having damaged pad
Shape, then compared through sample paper and cut out required target land.
9. the method for repairing and mending of PCB pads according to claim 1, it is characterised in that production PCB pads producer be configured with
The repair piece for the target land that the bond pad shapes of each upper model of PCB match, for directly taking for target land.
10. the method for repairing and mending of PCB pads according to claim 1, it is characterised in that when carrying out pad bonding, first exist
Layers of two-sided is attached at the pad that correspondence has been damaged on PCB, then the target land is bonded in thereon, finally clears up unnecessary
Layers of two-sided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710416295.4A CN107249258A (en) | 2017-06-06 | 2017-06-06 | A kind of repair method of PCB pads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710416295.4A CN107249258A (en) | 2017-06-06 | 2017-06-06 | A kind of repair method of PCB pads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107249258A true CN107249258A (en) | 2017-10-13 |
Family
ID=60018011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710416295.4A Pending CN107249258A (en) | 2017-06-06 | 2017-06-06 | A kind of repair method of PCB pads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107249258A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023070580A1 (en) * | 2021-10-29 | 2023-05-04 | 京东方科技集团股份有限公司 | Printed circuit board, maintenance method therefor, and display apparatus |
| WO2024022287A1 (en) * | 2022-07-26 | 2024-02-01 | 京东方科技集团股份有限公司 | Pad repair apparatus and pad repair method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0217692A (en) * | 1988-07-06 | 1990-01-22 | Hitachi Ltd | Repair wiring |
| CN102036480A (en) * | 2010-07-30 | 2011-04-27 | 北大方正集团有限公司 | Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof |
-
2017
- 2017-06-06 CN CN201710416295.4A patent/CN107249258A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0217692A (en) * | 1988-07-06 | 1990-01-22 | Hitachi Ltd | Repair wiring |
| CN102036480A (en) * | 2010-07-30 | 2011-04-27 | 北大方正集团有限公司 | Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 吕淑珍: "怎样修复损坏的表面安装焊盘", 《电子工艺简讯》 * |
| 楊同慶: "BGA返修中的焊盘修理", 《百度文库》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023070580A1 (en) * | 2021-10-29 | 2023-05-04 | 京东方科技集团股份有限公司 | Printed circuit board, maintenance method therefor, and display apparatus |
| WO2024022287A1 (en) * | 2022-07-26 | 2024-02-01 | 京东方科技集团股份有限公司 | Pad repair apparatus and pad repair method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171013 |