CN102036480B - Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof - Google Patents
Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof Download PDFInfo
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- CN102036480B CN102036480B CN2010102421740A CN201010242174A CN102036480B CN 102036480 B CN102036480 B CN 102036480B CN 2010102421740 A CN2010102421740 A CN 2010102421740A CN 201010242174 A CN201010242174 A CN 201010242174A CN 102036480 B CN102036480 B CN 102036480B
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Abstract
The embodiment of the invention discloses a circuit repair paster structure and a manufacturing method thereof as well as a circuit board and a repair method thereof, which relates to the field of manufacturing of a printed circuit board and aims at effectively solving the problem that a circuit board is scrapped as a result of circuit breakage, bonding pad break-off, IC (integrated circuit) break-off and other phenomena. The circuit repair paster structure comprises one or more circuit repair pasters corresponding to original circuit patterns of at least one damaged part of a circuit board, wherein the shapes and the dimensions of the circuit repair pasters are the same with or are similar to those of the corresponding original circuit patterns of the damaged part, and the circuit repair pasters can replace the corresponding original circuit patterns to be connected with other circuit patterns of the circuit board. The invention can be used for manufacturing a circuit board.
Description
Technical field
The present invention relates to printed circuit board and make the field, relate in particular to a kind of circuit mending paster structure and preparation method thereof, circuit board and method for repairing and mending.
Background technology
Along with the develop rapidly of electron trade, also increasingly high to the requirement of circuit board, circuit board has begun to move towards the high-density packages kenel of fine and closely woven circuit, aperture, multilayer, and fine degree strengthens gradually.Because the restriction of assembly technology and process for manufacturing circuit board etc.; In the assembling process of circuit board, circuit board occurs single or phenomenon such as many rupture of lines, pads come off, IC (Integrated Circuit, integrated circuit) comes off easily; Cause circuit board damage, can not normally use.
In the prior art, when above-mentioned phenomenon occurring,, can adopt the metal lead wire mode that circuit board is repaired for the simple relatively circuit board of circuit; And for the precision circuit plate of circuit relative complex; Because restrictions such as size; Be not suitable for adopting the metal lead wire mode to repair, phenomenons such as rupture of line, pad come off, IC comes off occur and possibly cause the monoblock circuit board to be scrapped, and because the cost of every veneer is increasingly high; So just cause loss at high price, improved the cost of manufacture of circuit board indirectly.Therefore, how to avoid because the circuit board due to the phenomenon such as rupture of line, pad come off, IC comes off is scrapped is the problem that needs solve.
Summary of the invention
Main purpose of the present invention is, a kind of circuit mending paster structure and preparation method thereof, circuit board and method for repairing and mending are provided, and can effectively solve the problem of scrapping of the circuit board that phenomenons such as rupture of line, pad come off, IC comes off bring.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of circuit mending paster structure; Comprise with circuit board on the corresponding one or more circuit mending pasters of primary circuit figure of at least one damaged location; The shape and size of said circuit mending paster are same or similar with the shape and size of the corresponding primary circuit figure of said at least one damaged location, and the primary circuit figure that said circuit mending paster can substitute said correspondence is connected with other circuitous patterns of said circuit board.
The preparation method of the circuit mending paster structure that a kind of embodiment of the invention provides comprises:
On carrier substrate, be provided with and the corresponding coat of metal of said circuit mending paster structure;
The said coat of metal is separated from said carrier substrate, form said circuit mending paster structure.
A kind of circuit board, at least one damaged location on the said circuit board is replaced the circuit mending paster structure that provides with the embodiment of the invention, makes said circuit mending paster structure can substitute said primary circuit figure and realizes the function of said primary circuit figure.
A kind of method for repairing and mending of circuit board comprises:
Damaged location on the circuit mending paster structure fix-up circuit plate that provides with the embodiment of the invention makes said circuit mending paster structure can substitute said primary circuit figure and realizes the function of said primary circuit figure.
After adopting technique scheme; The method for repairing and mending of the circuit mending paster structure that the embodiment of the invention provides, the manufacture method of circuit mending paster structure, circuit board, circuit board; When come off when rupture of line, pad appear in circuit board, IC comes off etc. damaged phenomenon; Problems such as the repairing of the corresponding circuit mending paster of damaged location on utilization and the circuit board for example adopts the circuit mending paster of shapes such as circuit board line, pad and IC to repair, and solution rupture of line, pad come off, IC comes off; Avoid scrapping of circuit board, and then reduced the cost of manufacture of circuit board.And because the circuitous pattern of damaged location is corresponding on circuit mending paster and the circuit board, both shape and size are identical or basic identical, guaranteed the regularity and the aesthetics of entire circuit plate plate face.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the Facad structure sketch map of the embodiment of the invention one;
Fig. 2 is the Facad structure sketch map of the embodiment of the invention two;
The flow chart of the manufacture method of the circuit mending paster structure that Fig. 3 provides for the embodiment of the invention;
Fig. 4 is the process chart of the embodiment of the invention three;
Fig. 5 is the process chart of the embodiment of the invention four.
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Embodiments of the invention provide a kind of circuit mending paster structure; Comprise with circuit board on the corresponding one or more circuit mending pasters of at least a portion circuitous pattern; The shape and size of corresponding electrical circuits figure are same or similar on the shape and size of said circuit mending paster and the said circuit board, and said circuit mending paster can substitute said corresponding electrical circuits figure and be connected with other circuitous patterns of said circuit board.
The circuit mending paster structure that the embodiment of the invention provides can comprise one or more circuit mending pasters, and said circuit mending paster is used for the repairing of damaged location corresponding on the circuit board.When certain position on the circuit board is damaged; To repair paster with the damaged location corresponding electrical circuits adopts modes such as conducting resinl or soldering-tin layer be bonding to be arranged on the damaged location of circuit board; The primary circuit figure of damaged location is same or similar on the shape and size of the circuit mending paster that is adopted and the circuit board, and the circuit mending paster will substitute the primary circuit figure and be connected with other circuitous patterns on the circuit board, thereby realizes the function of primary circuit figure; Like this; Through the repairing of circuit mending paster, avoided scrapping of circuit board, and then reduced the cost of manufacture of circuit board.And because the circuitous pattern at the shape and size of the circuit mending paster of repairing and circuit board damage position is same or similar; Can either satisfy electrical connection; Avoid being connected with the short circuit of other elements or circuit; Can not bring extra electromagnetic effect again, guarantee the performance of entire circuit plate; And the vestige that the mode of repairing through the circuit mending paster can residual repairing has improved the regularity and the aesthetics of entire circuit plate plate face.
The primary circuit graphics circuitry that it is pointed out that damaged location on size and dimension and the circuit board of circuit mending paster might not be identical, similarly also can.Both shape and size are similar to be meant; The shape of circuit mending paster and primary circuit figure are basic identical, and size is mated basically, can substitute the primary circuit figure equally and realize the function of primary circuit figure; In the embodiment of the invention; When the shape similarity of circuit mending paster and primary circuit figure more than 90%, dimensional discrepancy thinks all that 10% with interior both are similar.
Wherein, The shape of circuit mending paster can be corresponding with at least a shape in the circuitous patterns such as circuit, pad and integrated circuit pin; Wherein pad also can comprise bar shaped pad, square pad, circular pad and oval pad etc.; That is to say, circuitous pattern repair paster shape can for circuit board on the corresponding arbitrary shape of circuitous pattern, can require to be provided with according to reality.And the size of difform circuit mending paster is not limit, and multiple size can be arranged, equally can be according to the actual conditions setting.
The circuit mending paster structure that the embodiment of the invention provides can include only a circuit mending paster of the single shape of single size, also can comprise a plurality of circuit mending pasters.When the circuit mending paster structure that provides when the embodiment of the invention comprises a plurality of circuit mending paster; Can include only a plurality of circuit mending pasters of single shape and single size; A plurality of circuit mending pasters that also can comprise single shape and multiple size; Can comprise that also multiple shape and every kind of shape have single size or multiple shape and every kind of a plurality of circuit mending pasters that shape has at least a size; Be the circuit mending paster structure that the embodiment of the invention provides, the shape and size and the number of circuit mending paster are not limit, and can according to circumstances require to be provided with arbitrarily with reality.
In order to make those skilled in the art better understand technical scheme of the present invention, through concrete embodiment the circuit mending paster structure that the embodiment of the invention provides is elaborated below.
Embodiment one
The circuit mending paster structure that present embodiment provides is a kind of circuit mending paster group; Comprise a plurality of circuit mending pasters, as shown in Figure 1, present embodiment is a rectangle metal framework; Be provided with a plurality of circuit mending pasters 10 in the inside casing; These circuit mending patch shape and size are in full accord, are oval pad shape, i.e. this enforcement comprises a plurality of circuit mending pasters 10 of single shape and single size.That is to say that it is single that present embodiment is directed against the circuitous pattern of repairing, when the pad obscission of same or similar shape and size occurring on the circuit board, can adopt the circuit mending paster 10 in the present embodiment to repair.
Certainly, the sort circuit of present embodiment is repaired paster structure, and the size and dimension of circuit mending paster 10 is not limit, and can be shape and size arbitrarily.
The sort circuit that present embodiment provides is repaired paster structure, and a plurality of circuit mending pasters can be provided, and promptly can be adapted to industrial needs for processes such as circuit board assembling provide the circuit mending paster in batches.During use, from present embodiment, the circuit mending paster of selecting is taken off, circuit board is repaired.In addition, present embodiment is also removable is divided into a plurality of independent circuit mending pasters 10 and uses.
Embodiment two
The circuit mending paster structure that present embodiment provides is similarly a kind of circuit mending paster group; Comprise a plurality of circuit mending pasters, as shown in Figure 2, identical with embodiment one; Present embodiment is a rectangle metal framework; Be provided with a plurality of circuit mending pasters 10 in the inside casing, different with embodiment one is to comprise the circuit mending paster 10 of multiple shape in the present embodiment; Include oval pad shape paster 101, circuit shape paster 102, square pad shape paster 103 and circular pad 104 etc., and the circuit mending paster 10 of every kind of shape includes at least a size.It is various to be that present embodiment is directed against the circuitous pattern of repairing, and when fracture or obscission occurring on the circuit board, can adopt the circuitous pattern of 10 pairs of damaged locations of circuit mending paster corresponding, same or similar shape and size in the present embodiment to repair.
Certainly, the sort circuit of present embodiment is repaired paster structure, and the size and dimension of circuit mending paster 10 is not limit, and can be the combination in any of the circuit mending paster of difformity and size.Relatively and embodiment one, the circuit mending paster kind of present embodiment is more, and range of application is wider.
The sort circuit that present embodiment provides is repaired paster structure, and a plurality of circuit mending pasters can be provided, and promptly can be adapted to industrial needs for processes such as circuit board assembling provide the circuit mending paster in batches.During use, from present embodiment, the circuit mending paster of selecting is taken off, circuit board is repaired.In addition, present embodiment is also removable is divided into a plurality of independent circuit mending pasters 10 and uses.
Accordingly, the embodiment of the invention also provides a kind of foregoing circuit to repair the manufacture method of paster structure, and flow chart as shown in Figure 3 comprises the following steps:
S11 is provided with the coat of metal corresponding with the circuit mending paster structure on carrier substrate;
Wherein, Said circuit mending paster structure comprise with circuit board on the corresponding one or more circuit mending pasters of at least a portion circuitous pattern; The shape and size of corresponding electrical circuits figure are same or similar on the shape and size of said circuit mending paster and the said circuit board, can substitute said corresponding electrical circuits figure and be connected with other circuitous patterns of said circuit board;
S12 separates the said coat of metal from said carrier substrate, form the circuit mending paster structure.
The manufacture method that the embodiment of the invention provides; Prepared circuit mending paster structure can comprise the circuit mending paster of arbitrary shape and size; Circuit board can be through repairing damaged location with the circuit mending paster of the same or similar shape and size of primary circuit figure of damaged location; Avoid scrapping of circuit board, reduced the cost of manufacture of circuit board.
Further; Before the S11 step, the preparation method that the embodiment of the invention provides also comprises: according to actual needs, design circuit is repaired paster structure; Said design comprises that design circuit repairing paster structure comprises shape, size and the number of circuit mending paster, and the outward appearance pattern etc.The circuit mending paster structure can comprise with circuit board on the corresponding one or more circuit mending pasters of at least a portion circuitous pattern, the circuit mending paster can have any shape and size, can design according to actual needs.And then, prepare the circuit mending paster structure that is designed through S11 and S12 step.
Wherein, Because in the S12 step; Need with said carrier substrate with separate with the corresponding coat of metal of circuit mending paster structure; Therefore, the carrier substrate material adopts on the physical property and said coat of metal material adhesive force materials with smaller each other usually, is convenient to successfully separating of the carrier substrate and the coat of metal.Generally, coat of metal material is a copper, and the steel plate that preferably adopt this moment and copper product adhesive force is less is as carrier substrate.Carrier substrate can use repeatedly, has reduced production cost.Certainly, can also select the carrier substrate of other materials, not do qualification here.
In order to make those skilled in the art better understand technical scheme of the present invention, the manufacture method of the circuit mending paster structure that the embodiment of the invention is provided through concrete embodiment below is elaborated.
Embodiment three
Present embodiment can be described as addition process, and is as shown in Figure 4, comprising:
S21 adopts steel plate as carrier substrate, and steel plate is carried out chemical cleaning;
This step is mainly in order to remove surface of steel plate impurity and dirt, and makes the surface of steel plate smooth.
Certainly, can also adopt the carrier substrate of other materials in this step.
S22 pastes dry film at surface of steel plate;
S23, the method through exposure imaging with the pattern transfer of prepared circuit mending paster structure to surface of steel plate;
After this step, will the exposing of the part that surface of steel plate is corresponding with said circuit mending paster structure, other parts are coated with dry film.Can be according to actual requirement; The pattern of circuit mending paster structure is set; Can comprise in the pattern of circuit mending paster structure and satisfy the actual arbitrary shape that requires and the circuit mending paster of size, the shape and size of corresponding electrical circuits figure are same or similar on the shape and size of said circuit mending paster and the circuit board.
S24 electroplates steel plate;
After this step; Surface of steel plate will not electroplated by the part that dry film covers; Coating material is generally copper, also can be other coating materials, and the part that promptly surface of steel plate is corresponding with prepared circuit mending paster structure will form line pattern coating; Other parts will be because the barrier effect of dry film can not form coating.
Like this, through S22 to S24 step, just on steel plate, be provided with the coat of metal corresponding with prepared circuit mending paster structure.
Further, present embodiment also can comprise:
S25 is to surface of steel plate deposition nickel-gold layer;
The nickel-gold layer that this step deposited plays the anti-oxidation protection effect to the line pattern copper coating, also in follow-up paster uses, plays to be prone to the welding effect.After this step; Metal coating surface corresponding with the circuit mending paster structure on the steel plate has covered one deck nickel-gold layer; Because other outer parts of the demetalization of surface of steel plate are also posted dry film, the nickel-gold layer of other parts can be removed along with the step of follow-up removal dry film simultaneously.
S26 removes the remaining dry film of surface of steel plate;
In this step, steel plate is immersed in NaOH (NaOH) solution the remaining dry film of stripping surface of steel plate, promptly on the surface of steel plate, the coat of metal corresponding with the circuit mending paster structure be with the dry film of exterior portions.
S27 separates the coat of metal through the mode of tearing from steel plate, the isolated coat of metal be the circuit mending paster structure that will obtain.
Embodiment four
Present embodiment can be described as subtractive process, and is as shown in Figure 5, comprising:
S31 adopts steel plate as carrier substrate, and steel plate is carried out chemical cleaning;
This step is mainly in order to remove surface of steel plate impurity and dirt, and makes the surface of steel plate smooth.
Certainly, can also adopt the carrier substrate of other materials in this step.
S32 electroplates steel plate, forms coating at surface of steel plate, is generally copper coating;
S33 pastes dry film at coating surface;
S34, the method through exposure imaging with the pattern transfer of prepared circuit mending paster structure to coating surface;
After this step, the part that surface of steel plate is corresponding with said circuit mending paster structure will be exposed, and other parts are coated with dry film.Can be according to actual requirement; The pattern of circuit mending paster structure is set; Can comprise in the pattern of circuit mending paster structure and satisfy the actual arbitrary shape that requires and the circuit mending paster of size, the shape and size of corresponding electrical circuits figure are same or similar on the shape and size of said circuit mending paster and the circuit board.
S35 is at coating surface deposition nickel-gold layer;
The nickel-gold layer that this step deposited plays following 2 effects:
One of which, in etching, play anticorrosive effect, corresponding line pattern coating is not etched thereby protective circuit is repaired paster structure;
Two, heavy nickel-gold layer plays in follow-up paster uses and is prone to the welding effect;
After this step, metal coating surface corresponding with the circuit mending paster structure on the steel plate has covered one deck nickel-gold layer, and other parts of the coat of metal also are coated with dry film, and the nickel-gold layer of these parts can be removed along with the step of follow-up removal dry film simultaneously.
S36 removes the remaining dry film of coating surface;
After accomplishing heavy nickel gold,, need carry out etching and processing in order to obtain the complete line pattern coating corresponding with the circuit mending paster structure.Therefore need at first to strip the dry film beyond the circuit, carry out etching again, just can obtain complete line pattern coating with NaOH solution.After this step, the copper coating surface coverage has the nickel-gold layer corresponding with the circuit mending paster structure.
S37 carries out etching to steel plate;
This step adopts the mode of alkaline etching usually; Steel plate is immersed in carries out etching in the sal-ammoniac alkaline etching liquid; Because the part corresponding with the circuit mending paster structure is coated with nickel-gold layer on the coating; Nickel-gold layer can protect this part coating not to be corroded, and other part coating that do not covered by nickel-gold layer will be corroded.Like this, through S32 to S37 step, just on steel plate, be provided with the coat of metal corresponding with prepared circuit mending paster structure.
S38 separates the coat of metal through the mode that peel manually leaves from steel plate, the isolated coat of metal be the circuit mending paster structure that will obtain.
The preparation method that the embodiment of the invention provides, carrier substrate can use repeatedly, and is with low cost, and the fabrication cycle of this preparation flow is short, can be used to prepare the circuit mending paster structure of the circuit mending paster that comprises arbitrary number and arbitrary graphic and size.
Accordingly; Embodiments of the invention provide a kind of circuit board again; At least one damaged location on the said circuit board is replaced the circuit mending paster structure that provides with the embodiment of the invention, makes said circuit mending paster structure can substitute said primary circuit figure and realizes the function of said primary circuit figure.
The circuit board that the embodiment of the invention provides, thus the primary circuit figure that adopts the circuit mending paster structure to substitute damaged location is realized the function of said primary circuit figure, has so just avoided scrapping of circuit board, has reduced the cost of manufacture of circuit board.
Wherein, damaged location is meant that circuitous pattern on the circuit board fracture occurs or come off waiting the position of damage phenomenon, the damaged location that for example rupture of line, pad come off, IC comes off.The circuit mending paster structure that is adopted comprises with the primary circuit figure corresponding electrical circuits of damaged location repairs paster, and the shape and size of the primary circuit figure of this circuit mending paster and damaged location are same or similar.
It is to be noted; The circuit board that the embodiment of the invention provides preferably adopts the identical circuit mending paster of shape and size with the primary circuit figure of damaged location; Like this; The registration of circuit mending paster and primary circuit figure is good, and vestige that can residual repairing has guaranteed the regularity and the aesthetics of entire circuit plate plate face.Certainly, the shape and size of circuit mending paster structure are not limited to the primary circuit figure of damaged location identical, similarly also can.Both shape and size are similar to be meant, the shape of circuit mending paster and primary circuit figure are basic identical, and size is mated basically, can substitute the primary circuit figure equally and realizes the function of primary circuit figure.In the embodiment of the invention, when the shape similarity of circuit mending paster and primary circuit figure more than 90%, dimensional discrepancy thinks all that 10% with interior both are similar.
Wherein, The circuit mending paster can adopt the welding or the mode of conductive adhesive to be arranged on the corresponding position of the primary circuit figure at circuit board damage position; The circuit mending paster is fixed on the corresponding position of the primary circuit figure of damaged location, and the primary circuit figure at replace damaged position is realized being connected with the functional electric of other circuitous patterns of circuit board.
In addition, the circuit board that the embodiment of the invention provides, the shape and size of circuit mending paster are not limit, and promptly the disappearance or the damage of the circuitous pattern of Any shape and size appears in the circuitous pattern on the circuit board, all can adopt corresponding circuit mending paster to repair
Accordingly, embodiments of the invention also provide a kind of method for repairing and mending of circuit board, comprising:
Damaged location on the circuit mending paster structure fix-up circuit plate that provides with the embodiment of the invention makes said circuit mending paster structure can substitute said primary circuit figure and realizes the function of said primary circuit figure.
Wherein, damaged location is meant that circuitous pattern on the circuit board fracture occurs or come off waiting the position of damage phenomenon, the damaged location that for example rupture of line, pad come off, IC comes off.
The method for repairing and mending that the embodiment of the invention provides; Thereby the primary circuit figure that adopts the circuit mending paster structure to substitute damaged location is realized the mode of the function of said primary circuit figure damaged location is repaired; So just avoid scrapping of circuit board, reduced the cost of manufacture of circuit board.
Wherein, damaged location is meant that circuitous pattern on the circuit board fracture occurs or come off waiting the position of damage phenomenon, the damaged location that for example rupture of line, pad come off, IC comes off.The circuit mending paster structure that is adopted comprises with the primary circuit figure corresponding electrical circuits of damaged location repairs paster, and the shape and size of the primary circuit figure of this circuit mending paster and damaged location are same or similar.
When come off when rupture of line, pad appear in some position on the circuit board, IC comes off etc. damaged phenomenon; The method for repairing and mending that the embodiment of the invention provides; Employing substitutes the primary circuit figure that is damaged with the circuit mending paster of the same or similar shape and size of primary circuit figure of damaged location, substitutes the function that the primary circuit figure is realized the primary circuit figure.Like this, just avoid scrapping of circuit board, reduced the cost of manufacture of circuit board.And because the shape and size and the primary circuit figure of the circuit mending paster that is used to repair are same or similar, when for example repairing circuit ruptured, how wide the fracture circuit be on the circuit board; Just adopt how wide circuit shape circuit mending paster during repairing, the come off circuit mending paster of position setting of pad is the pad shape circuit mending paster etc. of corresponding size, therefore; The registration of circuit mending paster and primary circuit figure is very good; Vestige that can residual repairing has guaranteed the regularity and the aesthetics of entire circuit plate plate face, and; The mode of repairing through the circuit mending paster promptly can satisfy the electrical connection between circuit; Avoid being connected, can not bring extra electromagnetic effect again, guaranteed the performance of entire circuit plate with the short circuit of other elements or circuit.
It is to be noted; The method for repairing and mending that the embodiment of the invention provides; The preferred employing circuit mending paster identical with the shape and size of the primary circuit figure of damaged location substitutes said primary circuit figure, and like this, the registration of circuit mending paster and primary circuit figure is good; Vestige that can residual repairing has guaranteed the regularity and the aesthetics of entire circuit plate plate face.Certainly, the shape and size of circuit mending paster structure are not limited to the primary circuit figure of damaged location identical, similarly also can.In the embodiment of the invention, when the shape similarity of circuit mending paster and primary circuit figure more than 90%, dimensional discrepancy thinks all that 10% with interior both are similar.
Wherein, Can adopt the mode of welding or conductive adhesive that the circuit mending paster is arranged on damaged location place on the circuit board; The circuit mending paster is fixed on the corresponding position of the primary circuit figure of damaged location, and the primary circuit figure at replace damaged position is realized being connected with the functional electric of other circuitous patterns of circuit board.
In addition, the method for repairing and mending that the embodiment of the invention provides before with the damaged location on the circuit mending paster fix-up circuit plate, needs the said damaged location of cleaning earlier, is easy to follow-up repairing and connects.When occurring the circuitous pattern fracture on the circuit board or coming off; Will there be at least two open circuit ports in the damaged location place; Can be at first to the processing of polishing of the open circuit port of circuit board damage position circuitous pattern, the port of will opening a way polishes wear down, is easy to follow-up repairing and connects.Then, between open circuit port top and port, coat solder(ing) paste, will aim at the position of primary circuit figure, be welded on the circuit board with the circuit mending paster of the primary circuit figure respective shapes of damaged location and size corresponding to the repairing area of primary circuit figure.And; In order to guarantee the regularity and the aesthetics of entire circuit plate plate face; And do not bring extra electromagnetic effect, when the circuit mending paster is set, guarantee as far as possible that the circuit mending paster covers replacement with aiming at of primary circuit figure; But manual-alignment or adopt automatic aligned device that the circuit mending paster is arranged on the circuit board on the corresponding position, the alignment precision that makes circuit mending paster and primary circuit figure is more than 90%.
After with the damaged location on the circuit mending paster fix-up circuit plate, the method for repairing and mending that the embodiment of the invention provides also comprises: the electrical property of the circuit board after test is repaired through the circuit mending paster.
After the damaged location of circuit board is provided with the circuit mending paster, can adopt electrical testing device etc. that the circuit mending paster is tested with the circuitous pattern electrical property that is connected, guarantee the reliability of repairing.
The shape that it is pointed out that the circuit mending paster that the method for repairing and mending of the embodiment of the invention adopts is not limit, and promptly the circuitous pattern on the circuit board disappearance of Any shape occurs or when damaging, all can adopt corresponding circuit mending paster to repair.
The above; Be merely embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technical staff who is familiar with the present technique field is in the technical scope that the present invention discloses; Can expect easily changing or replacement, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of said claim.
Claims (11)
1. a circuit mending paster structure is characterized in that, said circuit mending paster structure comprises:
A plurality of circuit mending pasters of single shape and single size, perhaps
A plurality of circuit mending pasters of single shape and at least two kinds of sizes, perhaps
At least two kinds of shapes and every kind of shape have a plurality of circuit mending pasters of single size, perhaps
At least two kinds of shapes and every kind of a plurality of circuit mending pasters that shape has at least a size;
The primary circuit figure of at least one damaged location on said circuit mending paster and the circuit board is corresponding; The shape and size of said circuit mending paster are same or similar with the shape and size of the corresponding primary circuit figure of said at least one damaged location, and the primary circuit figure that said circuit mending paster can substitute said correspondence is connected with other circuitous patterns of said circuit board.
2. circuit mending paster structure according to claim 1 is characterized in that, the shape of said circuit mending paster is corresponding with at least a shape in following: circuit, pad and integrated circuit pin.
3. the preparation method like each described circuit mending paster structure of claim 1 to 2 is characterized in that, comprising:
On carrier substrate, be provided with and the corresponding coat of metal of said circuit mending paster structure;
The said coat of metal is separated from said carrier substrate, form said circuit mending paster structure.
4. preparation method according to claim 3 is characterized in that, said on carrier substrate, the setting comprises with the corresponding coat of metal of said circuit mending paster structure:
Paste dry film on said carrier substrate surface;
Method through exposure imaging is surperficial with pattern transfer to the carrier substrate of said circuit mending paster structure;
Said carrier substrate is electroplated, formed and the corresponding coat of metal of said circuit mending paster structure on said carrier substrate surface.
5. preparation method according to claim 3 is characterized in that, said on carrier substrate, the setting comprises with the corresponding coat of metal of said circuit mending paster structure:
Said carrier substrate is electroplated, formed coating on said carrier substrate surface;
Paste dry film at said coating surface, the method through exposure imaging with the pattern transfer of said circuit mending paster structure to coating surface;
At said coating surface deposition nickel-gold layer;
Remove the remaining dry film of said coating surface;
Said carrier substrate is carried out etching, form and the corresponding coat of metal of said circuit mending paster structure on said carrier substrate surface.
6. according to each described preparation method of claim 3 to 5, it is characterized in that said carrier substrate is a steel plate.
7. circuit board; It is characterized in that; At least one damaged location on the said circuit board is replaced with like each described circuit mending paster structure in the claim 1 to 2, makes said circuit mending paster structure can substitute said primary circuit figure and realizes the function of said primary circuit figure.
8. circuit board according to claim 7 is characterized in that, said circuit mending paster structure adopts the mode of welding or conducting resinl bonding to be arranged on the corresponding position of the primary circuit figure of said damaged location.
9. the method for repairing and mending of a circuit board is characterized in that, comprising:
With like the damaged location on each described circuit mending paster structure fix-up circuit plate in the claim 1 to 2, make said circuit mending paster structure can substitute said primary circuit figure and realize the function of said primary circuit figure.
10. method for repairing and mending according to claim 9 is characterized in that,
The mode that adopts welding or conducting resinl to bond is arranged on said circuit mending paster structure at the damaged location place of said circuit board.
11. method for repairing and mending according to claim 9 is characterized in that, said method for repairing and mending also comprises:
Before with the damaged location on the circuit mending paster structure fix-up circuit plate, clear up said damaged location; And/or
After with the damaged location on the circuit mending paster structure fix-up circuit plate, the electrical property of the circuit board after test is repaired through said circuit mending paster structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN102392247B (en) * | 2011-10-26 | 2013-11-06 | 首都航天机械公司 | Electroplating method for middle local area of part for diffusion welding |
| CN107249258A (en) * | 2017-06-06 | 2017-10-13 | 苏州胜科设备技术有限公司 | A kind of repair method of PCB pads |
| CN109302793A (en) * | 2017-07-25 | 2019-02-01 | 双鸿电子(惠州)有限公司 | A kind of PCB mark mending method |
| CN107567200B (en) * | 2017-09-22 | 2019-09-06 | 广州兴森快捷电路科技有限公司 | Board pads restorative procedure |
| CN108712819B (en) * | 2018-05-17 | 2021-02-26 | 惠州中京电子科技有限公司 | Printed circuit board scrapping method |
| CN109561599B (en) * | 2018-12-12 | 2020-08-11 | 广东科翔电子科技股份有限公司 | Circuit repairing method for high-precision fine circuit PCB |
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