200948244 九、發明說明： 【發明所屬之技術領域】 本創作係有關於一種印刷電路板，尤其β 刷電路板上導線斷線之精緻修補及刷鍍方法。 夠將在斷線處完成補《，並且讓補線的地方平 滑，不只改善外觀，且具良好之導電性。 【先前技術】 印刷電路板以普说士 & a _ a過成為現今電子裝置中庵 的電路元件，其可隼人y J果》眾多的電子原在一板上 由印刷電路連結這些電 电于70件。所以印刷雷路 為當今高科技產業不可卞a & s丨刎電路 j或缺的一環。 唯在印刷電路板製 電路有斷線的情況，~ 須另外將該斷線處應用 【發明内容】 所以本創作的目的200948244 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a printed circuit board, in particular, a delicate repair and brush plating method for wire breakage on a β-brush circuit board. It is enough to complete the patch at the broken line, and make the line of the line smooth, not only improve the appearance, but also has good electrical conductivity. [Prior Art] The printed circuit board has become a circuit component in today's electronic devices by using a syllabus & a _ a, which can be used to connect these electronic devices to a board. 70 pieces. Therefore, the printing of the road is not a part of today's high-tech industry, a & s丨刎 circuit j or lack. Only in the case where the printed circuit board circuit has a disconnection, ~ must be additionally applied to the disconnection. [Inventive content] Therefore, the purpose of this creation
Jg ^ ,的係為解決上述習知技糊 題，本創作中提出一…& 種印刷電路板上導後斷賴 修補及刷鍍方法，可使货磁““ $綠斷縛Jg ^ , in order to solve the above-mentioned conventional technical paste, this work proposes a ... & kind of printed circuit board on the post-destruction repair and brush plating method, can make the goods magnetic "" $ green binding
i故主而 使其斷線處在補線後’J 平整的表面，一方面具有美 電的順暢性’減少電JJ且。 為達到上述目的本 導線斷線之精緻修補補 一種印 主要能 整光 為使用 ，並經 板已成 生某些 所以必 作的過程中，往往會產 以導致電路無法連通。 其他的導體連接起來。 好的外觀再者也〒 創作中提出一種印刷喝 線方法’包含下列步驟 上的問 之精緻 現光滑 增加導 路板上 :尋找印 6 200948244 刷電路板上的斷線處，在該斷線處做上標記，將 處端緣研磨，以去除在邊緣處的汙染物，因此可 • 平滑而清潔的表面，所以可增加導電性，減少電 將一銅線放置於斷線處的兩端之間，使該銅線的 分別接觸到兩端斷線處的邊緣，以形成可導電 接；將補線機的焊頭對準銅線與斷線處連接之處 用高週波焊接，將高頻的機械波導向該連接處， 得連結處兩端的銅線與斷線處兩端的連接處遇熱 合，因此使得原印刷電路板斷裂之線路因與銅 ® 接，而形成導電通路；應用砂紙將焊接處磨平， 平的方式係應用砂紙研磨連接處。 本發明另外提出一種印刷電路板上導線斷線 鍍方法，其為應用塗抹銀膏的方式進行斷線結合 方法說明如下：尋找印刷電路板上的斷線處，在該 處做上標記，將斷線處端緣研磨，以去除在邊緣 汙染物，因此可產生平滑而清潔的表面，所以可 導電性，減少電阻；以筆沾抹銀膏，再將銀膏塗 〇 斷線處的兩端之間，並連接斷線處的兩端，始形 整的導電電路；將結合處烘乾，使銀膏固結在斷韓 再將焊接處磨平，其磨平的方式係應用砂紙研磨 處，使其呈現光滑平整的表面，一方面具有美好 觀再者也可增加導電的順暢性，減少電阻；使用 剔除結合處的雜質或烘乾時產生的結塊；隨後在 及斷線處的兩端之表面鍍上銅液，可使外觀平整 為銅為電的良導體，可使導電性更佳。 由下文的說明可更進一步瞭解本創作的特徵 斷線 產生 阻； 兩端 之連 ，使 而使 而融 線連 其磨 之刷 ，其 斷線 處的 增加 抹在 成完 處， 連接 的外 刀片 銀膏 且因 及其 7 200948244 優點，閱讀時並請參考附圖。 【實施方式】 茲謹就本案的結構組成，及所能產生的功 效與優點，配合圖式，本發明主要是對印刷電 路板提出精緻修補及刷鍍，舉本案之精緻修補 及刷鍍之 較佳實施例詳細說明如下。 下文說明以精緻修補方式實施補線方法如 ❿ 下： (1 ).尋找印刷電路板 2上的斷線處，在該 斷線處做上標記（請參考圖一）。 (2).將斷線處端緣研磨，以去除在邊緣處 的汙染物，因此可產生平滑而清潔的表面，所 以可增加導電性，減少電阻。 (3 )·在斷線處的兩端之間放置銅線 3，使 © 該銅線的兩端分別接觸到兩端斷線處的邊 緣，以形成可導電之連接（請參考圖二）。 (4).將補線機 4的焊頭對準銅線與斷線處 連接之處，使用高週波焊接，將高頻的機械波 導向該連接處，而使得連結處兩端的銅線與斷 線處兩端的連接處遇熱而融合，因此使得原印 刷電路板斷裂之線路因與銅線連接，而形成導 電通路（請參考圖三）。 8 200948244 (5).再將焊接處磨平，其磨平的方式 用斜口刀砂紙及鋼針推平並研磨連接處， 呈現光滑平整的表面。一方面具有美好的 再者也可增加導電的順暢性，減少電阻。 使用金剛針剔除雜質或焊接時產生的結塊 得整體更顯出平整的外表（請參考圖四）。 本創作的另一實施例為印刷電路板 鍍方式，係應用塗抹銀膏的方式進行斷 合。其方法說明如下： (1 ).尋找印刷電路板 2上的斷線處， 斷線處做上標記。以利工作人員尋找斷線 而進行修補的動作（請參考圖五）。 (2 ).將斷線處端緣研磨，以去除在邊 的汙染物，因此可產生平滑而清潔的表面 以可增加導電性，減少電阻（請參考圖六） (3 )·使用特殊的單毛之筆5沾抹銀膏 再將銀膏塗抹在斷線處的兩端之間，並連 線處的兩端，始形成完整的導電電路（請 圖七）。 (4 )·將結合處烘乾，使銀膏固結在斷期 (5).再將焊接處磨平，其磨平的方式 用砂紙研磨連接處，使其呈現光滑平整 面。一方面具有美好的外觀再者也可增加 的順暢性，減少電阻。 係應 使其 外觀 也可 ，使 之刷 線‘結 在該 處’ 緣處 ，所 〇 5 2, 接斷 參考 .處。 係應 的表 導電 9 200948244 (6).使用刀片剔除結合處的雜質或烘乾 產生的結塊。 (7).隨後在銀膏 52及斷線處的兩端之 面鍍上銅液54，可使外觀平整且因為銅為電 良導體，可使導電性更佳，如此完成整個補 製程（請參考圖八）。 綜上所述，本案人性化之體貼設計，相 符合實際需求。其具體改進現有缺失，相較 ® 習知技術明顯具有突破性之進步優點，確實 有功效之增進，且非易於達成。本案未曾公 或揭露於國内與國外之文獻與市場上，已符 專利法規定。 上列詳細說明係針對本創作之一可行 施例之具體說明，惟該實施例並非用以限制 創作之專利範圍，凡未脫離本創作技藝精神 為之等效實施或變更，均應包含於本案之專 © 範圍中。 時 表 的 線 當 於 具 開 合 實 本 所 利 10 200948244 【圖式簡單說明】 圖一顯示本創作之印刷電路板之方法步驟示意 圖，其中顯示斷線處的位置。 圖二顯示本創作之印刷電路板之方法步驟示意 圖，其中顯示放置銅線的位置。 圖三顯示本創作之印刷電路板之方法步驟示意 圖，其中顯示補線機作用的位置。 ® 圖四顯示本創作之印刷電路板之方法步驟示意 圖，其中顯示補線完成後的情況。 圖五顯示本創作之印刷電路板之方法步驟示意 圖，其中顯示斷線處的位置。 圖六顯示本創作之印刷電路板之方法步驟示意 圖，其中顯示塗抹銀膏的位置。 圖七顯示本創作之印刷電路板之方法步驟示意 © 圖，其中顯示烘乾後的情況。 圖八顯示本創作之印刷電路板之方法步驟示意 圖，其中顯示鍵上銅液的示意圖。 【主要元件符號說明】 2 印刷電路板 52 銀膏 3 銅線 5 4 銅液 4 補線機 5 筆 11Therefore, the main line is to make the line break after the line is added, and the smooth surface of the motor is on the one hand, and the electric JJ is reduced. In order to achieve the above-mentioned purpose, the delicate repair of the wire breakage is mainly used for the use of the whole light, and the plate has become a certain part of the process, so the process is often required to cause the circuit to be disconnected. The other conductors are connected. The good appearance is also the same. In the creation, a printing and drinking line method is proposed, which includes the following steps. The exquisiteness of the question is now smooth and increased on the guide board: looking for the broken line on the printed circuit board on the printed circuit board 200948244, at the broken line Mark the edges and grind the edges to remove contaminants at the edges, thus providing a smooth and clean surface, thus increasing conductivity and reducing the need to place a copper wire between the ends of the wire break The copper wire is respectively contacted to the edge of the broken wire at both ends to form a conductive connection; the welding head of the wire bonding machine is aligned with the copper wire and the wire break is welded by high frequency, and the high frequency is At the joint of the mechanical waveguide, the copper wire at both ends of the joint is heat-sealed at the joint between the two ends of the broken wire, so that the broken circuit of the original printed circuit board is connected with the copper® to form a conductive path; the sandpaper is used for welding. The flattening, flat method is applied to the sandpaper grinding joint. The invention further provides a wire break plating method on a printed circuit board, which is described as follows: a method for applying a silver paste by means of applying a silver paste is as follows: finding a broken wire on a printed circuit board, marking it at the place, and breaking The edge of the wire is ground to remove contaminants at the edges, thus producing a smooth and clean surface, so it can be electrically conductive and reduce resistance; the silver paste is applied with a pen, and the silver paste is applied to both ends of the broken wire. Between, and connect the two ends of the broken line, start the shape of the conductive circuit; dry the joint, so that the silver paste is fixed in the broken Han and then the welding is smoothed, the way of smoothing is applied to the sandpaper grinding, To make it smooth and flat surface, on the one hand, it has a good view, it can also increase the smoothness of conduction, reduce the resistance; use the impurities in the joint or the agglomeration generated during drying; then at both ends of the broken line The surface is plated with copper to make the appearance flat and a good conductor of copper for electricity, which makes the conductivity better. The following description can further understand the characteristic broken line of the creation of the creation; the connection of the two ends, so that the melting line is connected to the brush of the grinding, the increase of the broken line is wiped into the finished part, the connected outer blade Silver paste and because of its 7 200948244 advantages, please refer to the attached drawings. [Embodiment] In view of the structural composition of the case, and the functions and advantages that can be produced, in conjunction with the drawings, the present invention mainly proposes delicate repair and brush plating on the printed circuit board, and the delicate repair and brush plating of the present case are compared. The preferred embodiment is described in detail below. The following describes how to perform the patching method in a delicate patching method, such as: (1). Look for the broken wire on the printed circuit board 2 and mark it at the broken wire (refer to Figure 1). (2) Grinding the edge of the wire break to remove contaminants at the edges, thus producing a smooth and clean surface, thereby increasing conductivity and reducing electrical resistance. (3) Place a copper wire 3 between the two ends of the wire break so that the ends of the copper wire are respectively contacted to the edges at the ends of the wire break to form an electrically conductive connection (refer to Figure 2). (4). Align the welding head of the wire bonding machine 4 with the copper wire and the broken wire. Use high-frequency welding to connect the high-frequency mechanical waveguide to the joint, so that the copper wire at both ends of the joint is broken. The joints at both ends of the wire are fused by heat, so that the line where the original printed circuit board is broken is connected to the copper wire to form a conductive path (refer to FIG. 3). 8 200948244 (5). Smooth the weld and smooth it. Use a slanted knife sandpaper and a steel needle to flatten and grind the joint to give a smooth and flat surface. On the one hand, it is beautiful, and it can also increase the smoothness of conduction and reduce the resistance. The use of diamond needles to remove impurities or agglomerates generated during welding gives the overall appearance a flat appearance (see Figure 4). Another embodiment of the present invention is a printed circuit board plating method in which a silver paste is applied for breaking. The method is described as follows: (1). Look for the broken line on the printed circuit board 2, and mark the broken line. Eli staff to find the broken line and repair the action (please refer to Figure 5). (2) Grinding the edge of the wire break to remove contaminants on the side, thus producing a smooth and clean surface to increase conductivity and reduce resistance (refer to Figure 6) (3) · Use special order The pen of the hair 5 is stained with silver paste and then the silver paste is applied between the ends of the broken wire, and the ends of the wire are connected to form a complete conductive circuit (please see Figure 7). (4)· Dry the joint to fix the silver paste in the break period (5). Then smooth the weld and smooth it with sandpaper to make the joint smooth and flat. On the one hand, it has a beautiful appearance and can also increase the smoothness and reduce the electrical resistance. It should be made to have a good appearance so that the brush line is 'knotted at the edge', 〇 5 2, and the reference is taken. Dependent table Conductive 9 200948244 (6). Use a blade to remove impurities from the joint or agglomerate from drying. (7). Then, the copper paste 54 is plated on both sides of the silver paste 52 and the broken wire, so that the appearance is flat and since the copper is a good conductor, the conductivity is better, thus completing the entire repair process (please Refer to Figure 8). In summary, the humanized design of this case is in line with actual needs. The specific improvement of the existing defects, compared to the │ conventional technology has a clear breakthrough advantage, it is indeed effective, and is not easy to achieve. The case has not been publicly disclosed or disclosed in domestic and foreign literature and markets, and has been stipulated by the Patent Law. The detailed description above is a specific description of one of the possible examples of this creation, but this example is not intended to limit the scope of the patents created, and any equivalent implementation or modification without departing from the spirit of the creative work shall be included in the case. In the scope of the exclusive ©. The line of the time table is for the opening and closing of the actual product. 10 200948244 [Simple description of the drawing] Figure 1 shows a schematic diagram of the method of the printed circuit board of the present invention, showing the position of the broken wire. Figure 2 shows a schematic diagram of the method steps for the printed circuit board of the present invention, showing the location where the copper wire is placed. Figure 3 shows a schematic diagram of the method steps of the printed circuit board of the present invention, showing the position of the wire feeder. ® Figure 4 shows a schematic diagram of the method steps for the printed circuit board of this creation, showing the situation after the completion of the patch. Figure 5 shows a schematic diagram of the method steps of the printed circuit board of the present invention, showing the location of the broken line. Figure 6 shows a schematic diagram of the method of the printed circuit board of the present invention, showing the location of the silver paste applied. Figure 7 shows the method steps for the printed circuit board of this creation. © Figure, which shows the situation after drying. Figure 8 shows a schematic diagram of the method of the printed circuit board of the present invention, showing a schematic diagram of the copper on the key. [Main component symbol description] 2 Printed circuit board 52 Silver paste 3 Copper wire 5 4 Copper liquid 4 Wire feeder 5 Pen 11