CN101662886A - Transplanting and repairing method of printed circuit board - Google Patents
Transplanting and repairing method of printed circuit board Download PDFInfo
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- CN101662886A CN101662886A CN200810214281A CN200810214281A CN101662886A CN 101662886 A CN101662886 A CN 101662886A CN 200810214281 A CN200810214281 A CN 200810214281A CN 200810214281 A CN200810214281 A CN 200810214281A CN 101662886 A CN101662886 A CN 101662886A
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Abstract
The invention provides a transplanting and repairing method of a printed circuit board. A mother sheet of the printed circuit board and son sheets are embedded in a concavo-convex platform mode; a space for containing an adhesive is reserved in the embedding position; the son sheets are embedded, glued and pressed vertically and downwards so that the adhesive flows and fills in the reserved embedded space for increasing the binding property of the adhesive. In addition, in the transplanting and repairing process, an adhesive tape is not needed and the procedures of magnet fixation, tearing bythe adhesive tape and the like are not used, thereby saving working procedures and reducing the cost.
Description
Technical field
The present invention is a kind of transplanting and repairing method of printed circuit board (PCB), referring in particular between a kind of master slice and sub-sheet utilizes medicine for treating uneven desk-top chimeric, and reserve the space that holds glue in chimeric place, vertical depression after sub-sheet is planted in embedding behind the glue, the embedding that allows the glue overflow be filled in reservation is handed in the space, to increase its fusible transplanting and repairing method.
Background technology
Electronic product stress frivolous require for fashion under, the attenuation that also diminishes of the printed circuit board (PCB) of carrying electronic building brick, therefore, in the prior art, also common a slice printed circuit board (PCB) master slice can cut into the situation of tens of slice, thin piece sheets.Right cause meaningless waste, therefore, the correlation technique of the transplanting and repairing method of printed circuit board (PCB) also occurred, reduce waste in the hope of making the best use of everything if a slice, thin piece sheet fault wherein will cause the full wafer master slice to be dropped.
In disclosed correlation technique, No. 232947 patent of invention of for example approved TaiWan, China and No. 095145025 application for a patent for invention case of disclosed TaiWan, China, all comprise in its method: adhesive tape is bonding to roll; The point adhesive curing; And adhesive tape such as removes at step.Program is complicated to be increased the manufacturing cost above-mentioned operation except that causing, and unnecessary operation also can increase the chance of defective products, really belongs to a fly in the ointment.
Therefore, be necessary to design a kind of transplanting and repairing method of printed circuit board (PCB), to overcome above-mentioned defective.
Summary of the invention
The object of the present invention is to provide a kind of transplanting and repairing method of printed circuit board (PCB), utilize medicine for treating uneven desk-top chimeric between its master slice and sub-sheet, and reserve the space that holds glue in chimeric place, vertical depression after sub-sheet is planted in embedding behind the glue, the embedding that allows the glue overflow be filled in reservation is handed in the space, increases its adhesiveness.
Another object of the present invention is to provide a kind of transplanting and repairing method of printed circuit board (PCB), it need not taped in transplanting and repairing process, need not use the fixing and tear tape supervisor of magnet, really can save operation and reduces cost.
In order to achieve the above object, the transplanting and repairing method of printed circuit board (PCB) of the present invention, be to use in a CNC machine-tool and a computer and plant in the sheet machine, wherein this CNC machine-tool has a milling bit, this computer is planted the sheet machine and is had a master slice microscope carrier, a sub-sheet microscope carrier, at least one scanning apparatus and a spot gluing equipment at least, and it comprises the following steps: that (a) scanned the image of a complete master slice and a sub-sheet by this scanning apparatus; (b) enclose the some glue position of selecting at least two characteristic points of this master slice and sub-sheet and storing this master slice respectively, and plant the characteristic point of this master slice of sheet computer and sub-sheet and the parameters such as X-axis, Y-axis and angle Θ of some glue position by this computer; (c) place this computer to plant on the master slice microscope carrier of sheet machine this master slice to be repaired; (d) with scanning identification and the storage scarce portion position of this scanning apparatus to this master slice to be repaired; (e) carry out a glue with this spot gluing equipment in the chimeric place of this scarce portion; (f) should good sub-sheet read via this scanning apparatus and plant its coordinates correction of sheet machine computing by this computer after be positioned over back pressing in this scarce portion; And (g) on this master slice to be repaired if still have then repeating step (e) and (f) till all scarce portions all finish of the portion of lacking.
Description of drawings
For making the auditor can further understand structure of the present invention, feature and purpose thereof, below in conjunction with the detailed description of accompanying drawing and preferred embodiment as after, wherein:
Fig. 1 is a schematic diagram, and it illustrates the schematic flow sheet of transplanting and repairing method of the printed circuit board (PCB) of a preferred embodiment of the present invention.
Fig. 2 is a schematic diagram, and it illustrates master slice to be repaired of the present invention and good sub-sheet in preprosthetic schematic diagram.
Fig. 3 is a schematic diagram, and its transplanting and repairing method that illustrates printed circuit board (PCB) of the present invention carries out the local enlarged diagram of a glue.
Fig. 4 is a schematic diagram, the local enlarged diagram that its transplanting and repairing method neutron sheet that illustrates printed circuit board (PCB) of the present invention engages with master slice.
Fig. 5 is a schematic diagram, and it illustrates the transplanting and repairing method neutron sheet of printed circuit board (PCB) of the present invention and the local enlarged diagram that master slice carries out pressing.
Embodiment
See also Fig. 1-Fig. 2, wherein Fig. 1 illustrates the schematic flow sheet of transplanting and repairing method of the printed circuit board (PCB) of a preferred embodiment of the present invention; Fig. 2 illustrates master slice to be repaired of the present invention and good sub-sheet in preprosthetic schematic diagram.
The objective of the invention is to carry out the transplanting reparation of printed circuit board (PCB).Palpus elder generation with the previous operations of at least one bad sub-sheet 20 from master slice 10 excisions to be repaired, makes the good sub-sheet 20 on this master slice 10 to be repaired can remain the continuation use by a CNC machine-tool (figure does not show) before reparation; Wherein, this CNC machine-tool is with milling bit these master slice 10 frames to be milled with pre-set dimension, path and shape to remove, and engages with another good sub-sheet 20 to reserve chimeric place.
In addition, the reverse side of this good sub-sheet 20 is pre-set dimension, path and shape and mill with this CNC machine-tool and to remove also, and the chimeric place of this master slice 10 and sub-sheet 20 is agreed with mutually; Wherein, milling place of this master slice 10 and sub-sheet 20 is chimeric mutually such as but not limited to being concavo-convex platform mode, but so that the glue overflow is filled in the embedding of reservation hands in the space, to increase its adhesiveness.In bad sub-sheet 20 can be carried out transplanting described later and reparation from this after master slice 10 excisions to be repaired.
As shown in the figure, the transplanting and repairing method of printed circuit board (PCB) of the present invention, be to use in a CNC machine-tool (figure does not show) and a computer and plant in the sheet machine (figure does not show), wherein this CNC machine-tool has a milling bit, this computer is planted the sheet machine and is had a master slice microscope carrier, a sub-sheet microscope carrier, at least one scanning apparatus, a spot gluing equipment and a storage device at least, and it comprises the following steps: that (a) scanned the image of a complete master slice 10 and a sub-sheet 20 by this scanning apparatus; (b) enclose the some glue position of selecting at least two characteristic points of this master slice 10 and sub-sheet 20 and storing this master slice respectively, and plant the characteristic point of this master slice of sheet computer and sub-sheet and the parameters such as X-axis, Y-axis and angle Θ of some glue position by this computer; (c) place this computer to plant on the master slice microscope carrier of sheet machine this master slice 10 to be repaired; (d) with scanning identification and storage scarce portion 11 positions of this scanning apparatus to this master slice 10 to be repaired; (e) carry out a glue with this spot gluing equipment in the chimeric place of this scarce portion 11; (f) should good sub-sheet 20 read via this scanning apparatus and plant its coordinates correction of sheet machine computing by this computer after be positioned over back pressing in this scarce portion 11; And (g) lack 11 repeating steps of portion (e) and (f) till all scarce portions all finish if still have on this master slice 10 to be repaired.
In this step (a), scan the image of a complete master slice 10 and a sub-sheet 20 by this scanning apparatus; Wherein, this scanning apparatus is used for the visual scanning and the storage of this complete master slice 10 and sub-sheet 20, its can place this master slice microscope carrier above or below locate, it is the emphasis of general known technology and non-this case, so do not intend giving unnecessary details at this.
In this step (b), circle selects at least two characteristic points of this master slice 10 and sub-sheet 20 respectively, and is planted the parameters such as X-axis, Y-axis and angle Θ of this master slice 10 of sheet computer and sub-sheet 20 by this computer; Wherein, at least two characteristic points 12,13 and 22,23 of this master slice 10 and sub-sheet 20 are for example and without limitation to optics point, insert hole or perforation, and this characteristic point 12,13 and 22,23 is more little, and the distance of 12,13 and 22,23 of two characteristic points is far away more then accurate more.
In this step (c), place this computer to plant on the master slice microscope carrier of sheet machine this master slice 10 to be repaired; Wherein, can the visual detection mode check that this master slice 10 is errorless really up, and can will this master slice 10 to be repaired place appropriate position on this master slice microscope carrier by manual type, it is the emphasis of general known technology and non-this case, so do not intend giving unnecessary details at this.
In this step (d), with scanning identification and storage scarce portion 11 positions of this scanning apparatus to this master slice 10 to be repaired; Wherein, can this scanning apparatus the touring scanning at this above master slice microscope carrier or back side, with the parameters such as X-axis, Y-axis, angle Θ and relative position of the scarce portion 11 of calculating this master slice 10 to be repaired.Wherein, this master slice microscope carrier is such as but not limited to the glass microscope carrier.
In this step (e), carry out a glue in the chimeric place of this scarce portion 11 with this spot gluing equipment; Wherein, this glue is for being for example and without limitation to Instant cement or thermosetting epoxy resin (epoxy), and it is the emphasis of general known technology and non-this case, so do not intend giving unnecessary details at this.
In this step (f), should good sub-sheet 20 read via this scanning apparatus and plant its coordinates correction of sheet machine computing by this computer after be positioned over back pressing in this scarce portion 11; Wherein, this scanning apparatus is that the below by this master slice microscope carrier upwards scans this sub-sheet 20, and pressing is really corrected at location feature, the contraposition of X-Y axle, location and the Θ axle clamp angle of carrying out this master slice 10 and sub-sheet 20, the embedding that can make the glue overflow be filled in reservation is handed in the space, to increase its adhesiveness.
In this step (g), lack 11 repeating steps of portion (e) and (f) till all scarce portions 11 all finish if still have on this master slice 10 to be repaired.
As mentioned above, the transplanting and repairing method of the printed circuit board (PCB) of this case does not need to use bonding the rolling of adhesive tape in traditional restorative procedure; And adhesive tape such as removes at step.So, reduce the manufacturing cost except that reaching, also can reduce the chance of defective products except that can significantly reducing operation.Therefore, the transplanting and repairing method tool progressive of the printed circuit board (PCB) that the transplanting and repairing method of the printed circuit board (PCB) of this case is really more known.
See also Fig. 3, its transplanting and repairing method that illustrates printed circuit board (PCB) of the present invention carries out the local enlarged diagram of a glue.Through above-mentioned will at least one bad sub-sheet 20 promptly can to present as shown in Figure 2 zigzag chimeric 14 at the edge of this master slice 10 after these master slice 10 excision steps, and this spot gluing equipment can be with this chimeric place 14 of glue injection after accurate contraposition.
See also Fig. 4, the local enlarged diagram that its transplanting and repairing method neutron sheet that illustrates printed circuit board (PCB) of the present invention engages with master slice.Through behind the some glue of above-mentioned Fig. 2, this step (f) should good sub-sheet 20 read via this scanning apparatus and plant its coordinates correction of sheet machine computing by this computer after be positioned over pressing afterwards in this scarce portion 11, this sub-sheet 20 equally also has a chimeric place 24.
See also Fig. 5, it illustrates the transplanting and repairing method neutron sheet of printed circuit board (PCB) of the present invention and the local enlarged diagram that master slice carries out pressing.Through behind the joint of above-mentioned Fig. 4, this step (f) further can be with a glue and this good sub-sheet 20 and master slice 10 pressings after engaging, but the glue overflow is filled in the embedding friendship space of reservation, to increase its adhesiveness.
Be with, enforcement via the transplanting and repairing method of printed circuit board (PCB) of the present invention, utilize medicine for treating uneven desk-top chimeric between its master slice and sub-sheet, and reserve the space that holds glue in chimeric place, vertical depression after sub-sheet is planted in embedding behind the glue, the embedding that allows the glue overflow be filled in reservation is handed in the space, to increase its adhesiveness; Of the present inventionly in addition in transplanting and repairing process, need not tape, need not use the fixing and tear tape supervisor of magnet, really can save operation and advantage such as reduce cost, therefore, really can improve the shortcoming of the transplanting and repairing method of known printed circuit board (PCB).
That this case disclosed is a kind of of preferred embodiment, the change of every part or modification and come from the technological thought of this case and be have the knack of this technology the people was easy to know by inference, all do not take off the claim category of this case.
Claims (6)
1. the transplanting and repairing method of a printed circuit board (PCB), be to use in a CNC machine-tool and a computer and plant in the sheet machine, wherein this CNC machine-tool has a milling bit, this computer is planted the sheet machine and is had a master slice microscope carrier, a sub-sheet microscope carrier, at least one scanning apparatus, a spot gluing equipment and a storage device at least, and it comprises the following steps:
(a) scan the image of a complete master slice and a sub-sheet by this scanning apparatus;
(b) enclose the some glue position of selecting at least two characteristic points of this master slice and sub-sheet and storing this master slice respectively, and plant the characteristic point of this master slice of sheet computer and sub-sheet and the parameters such as X-axis, Y-axis and angle Θ of some glue position by this computer;
(c) place this computer to plant on the master slice microscope carrier of sheet machine this master slice to be repaired;
(d) with scanning identification and the storage scarce portion position of this scanning apparatus to this master slice to be repaired;
(e) carry out a glue with this spot gluing equipment in the chimeric place of this scarce portion;
(f) should good sub-sheet read via this scanning apparatus and plant its coordinates correction of sheet machine computing by this computer after be positioned over back pressing in this scarce portion; And
(g) on this master slice to be repaired if still have then repeating step (e) and (f) till all scarce portions all finish of the portion that lacks.
2. the transplanting and repairing method of printed circuit board (PCB) as claimed in claim 1, wherein this scanning apparatus can place this computer plant the sheet machine the master slice microscope carrier above or below locate.
3. the transplanting and repairing method of printed circuit board (PCB) as claimed in claim 1, wherein this glue position is to be carried out the some glue path of master slice and sub-sheet and setting and planted by this computer that the sheet computer is best replaces and some glue sequence of positions by artificial instruction mode.
4. the transplanting and repairing method of printed circuit board (PCB) as claimed in claim 1, wherein this scanning apparatus touring scanning at this master slice microscope carrier place, and calculate the parameters such as X-axis, Y-axis, angle Θ and relative position of this master slice and sub-sheet characteristic point.
5. the transplanting and repairing method of printed circuit board (PCB) as claimed in claim 1, wherein this scanning apparatus is that below by this master slice microscope carrier scans this sub-sheet, and correct at location feature, the contraposition of X-Y axle, location and the Θ axle clamp angle of carrying out this sub-sheet.
6. the transplanting and repairing method of printed circuit board (PCB) as claimed in claim 1, it is chimeric mutually that wherein the chimeric place of this master slice and sub-sheet is concavo-convex platform mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810214281A CN101662886A (en) | 2008-08-29 | 2008-08-29 | Transplanting and repairing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810214281A CN101662886A (en) | 2008-08-29 | 2008-08-29 | Transplanting and repairing method of printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN101662886A true CN101662886A (en) | 2010-03-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810214281A Pending CN101662886A (en) | 2008-08-29 | 2008-08-29 | Transplanting and repairing method of printed circuit board |
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| Country | Link |
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| CN (1) | CN101662886A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101932198A (en) * | 2010-06-10 | 2010-12-29 | 瀚宇博德科技（江阴）有限公司 | Manufacturing method for transplanting printed circuit board and structure thereof |
| CN102036480A (en) * | 2010-07-30 | 2011-04-27 | 北大方正集团有限公司 | Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof |
-
2008
- 2008-08-29 CN CN200810214281A patent/CN101662886A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101932198A (en) * | 2010-06-10 | 2010-12-29 | 瀚宇博德科技（江阴）有限公司 | Manufacturing method for transplanting printed circuit board and structure thereof |
| CN102036480A (en) * | 2010-07-30 | 2011-04-27 | 北大方正集团有限公司 | Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof |
| CN102036480B (en) * | 2010-07-30 | 2012-07-25 | 北大方正集团有限公司 | Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof |
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Open date: 20100303 |