CN107238788A - Touch chip test system and its method of testing based on grid capacitive plate - Google Patents
Touch chip test system and its method of testing based on grid capacitive plate Download PDFInfo
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- CN107238788A CN107238788A CN201610188273.2A CN201610188273A CN107238788A CN 107238788 A CN107238788 A CN 107238788A CN 201610188273 A CN201610188273 A CN 201610188273A CN 107238788 A CN107238788 A CN 107238788A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
Abstract
The invention belongs to touch screen technology field, a kind of touch chip test system and its method of testing based on grid capacitive plate are disclosed.The test system includes grid capacitive plate, configuration file acquisition module, test link simulations module and test module.Wherein, test module is built-in with test program, for configuration file to be loaded onto into test program, and then operation is loaded with the test program of configuration file to test touch chip to be measured on the self-capacitance link or mutual capacitance link simulated.In the present invention, when touch chip to be measured is mutual capacitance type touch control chip, grid capacitive plate can be made to simulate mutual capacitance link jointly with touch chip to be measured, when touch chip to be measured is self-capacitance touch chip, grid capacitive plate simulates self-capacitance link jointly with touch chip to be measured, the test of mutual capacitance type touch control chip and self-capacitance touch chip is realized simultaneously on the basis of grid capacitive plate, the test coverage of grid capacitive plate is improved.
Description
Technical field
Surveyed the invention belongs to touch screen technology field, more particularly to a kind of touch chip based on grid capacitive plate
Test system and its method of testing.
Background technology
The various touch screen terminals such as smart mobile phone are required for using touch chip to carry out the touch control operation of user
Identification, response, touch chip can normal work be premise that touch screen terminal can be used normally.
The popularization of touch screen terminal brings the growth of the shipment amount explosion type of touch chip, and in touch chip
It is large batch of manufacture during, it is necessary to carry out strict test analysis to ensure shipment to touch chip
Touch chip being capable of normal work.There are following problems in current touch chip method for testing and analyzing：
1st, the coverage rate of testing tool has limitation.Conventional touch-screen has two kinds of mutual capacitance and self-capacitance, leads to
Often the testing tool for mutual capacitance type touch control chip is grid capacitive plate, but grid capacitive plate is simply possible to use in
Test mutual capacitance type touch control chip and cannot be used for self-capacitance touch chip, cause the test of grid capacitive plate
Coverage rate is not enough.
2nd, the test error of self-capacitance touch chip is larger.Self-capacitance touch chip test when, using
The ground capacity of different fixed numbers is built between the different passage of touch chip to simulate self-capacitance change,
But the deviation between passage is added in the fixed numbers, therefore test error is larger.
3rd, test to self-capacitance touch chip is comprehensive, accuracy is poor.Self-capacitance touch chip is surveyed
During examination, whether the semaphore tested under different self-capacitance gears, which changes to meet, is expected to assess during self-capacitance change
Circuit performance it is not comprehensive enough and accurate because first, test gear is limited；Second, test signal
The change of amount is doped with chip production manufacturing variation, the magnitude offset that testing tool deviation is brought.
The content of the invention
The invention provides a kind of touch chip test system based on grid capacitive plate, it is intended to makes grid capacitive
Plate can support the test of mutual capacitance type touch control chip and self-capacitance touch chip, lifting matrixes capacitor board simultaneously
Test coverage.
First aspect present invention provides a kind of touch chip test system based on grid capacitive plate, the touch-control
Chip test system includes grid capacitive plate, configuration file acquisition module, test link simulations module and survey
Die trial block；
The grid capacitive plate is connected in test by control with touch chip to be measured；
The configuration file acquisition module is used to obtain the configuration file corresponding with the type of touch chip to be measured；
Include the type information of touch chip to be measured in the configuration file；
The test link simulations module is connected with touch chip to be measured, for according to the touch chip to be measured
Type information control to form corresponding efficient circuit structure type between touch chip to be measured and grid capacitive plate,
So that grid capacitive plate simulates self-capacitance link or the mutual capacitance needed for test with touch chip to be measured jointly
Link；
The test module is built-in with test program, for the configuration file to be loaded onto into the test program,
Then on the self-capacitance link or mutual capacitance link simulated operation be loaded with the test program of configuration file with
Touch chip to be measured is tested.
With reference in a first aspect, in the first possible implementation of first aspect, the grid capacitive plate
Including a pcb board, the pcb board is provided with a capacitance matrix；Every a line of the capacitance matrix has
There is the first signal terminal, each row are respectively provided with secondary signal terminal；In the capacitance matrix, per a line
The first end of all electric capacity is connected to the first signal terminal corresponding to the row, all electric capacity of each row
Second end is connected to the secondary signal terminal corresponding to the row；Wherein, first signal terminal and second
A connection corresponding with the signal input pin of touch chip to be measured in signal terminal, another is touched with to be measured
The signal output pin correspondence for controlling chip is connected；
The touch chip to be measured includes the first signal generating circuit, secondary signal and occurs circuit, the first signal
If the signal output pin of receiving circuit, secondary signal receiving circuit and touch chip to be measured is one-to-one
Dry output switching element, the one-to-one some input switch lists of signal input pin with touch chip to be measured
Member；Wherein each output switching element includes first switch, second switch, third switch, each input
Switch element includes the 4th switch, the 5th switch, the 6th switch；
Wherein, first signal generating circuit connects corresponding signal output pin by each first switch,
First signal receiving circuit connects corresponding signal output pin, touch-control to be measured by each second switch
Each signal output pin of chip is also grounded by corresponding 3rd switch；Electricity occurs for the secondary signal
Road connects corresponding signal output pin by each 4th switch, and the secondary signal receiving circuit passes through every
Individual 5th switch connects corresponding signal output pin, and each signal output pin of touch chip to be measured also passes through
The corresponding 6th switch ground connection.
With reference to the first possible implementation of first aspect, when touch chip to be measured is mutual capacitance type touch control
During chip, the test link simulations module is used to control to need first in the output switching element tested to open
Close close, second switch disconnects, the 3rd switched off, control needs the in the input switch unit tested
Four are switched off, the 5th switch is closed, the 6th switches off；
When touch chip to be measured is self-capacitance touch chip, the test link simulations module is used for the
One test phase controls the first switch in each output switching element to close, second switch is closed, the 3rd opens
Shut-off is opened, and is controlled the in each input switch unit the 4th to switch off, the 5th is switched off, the 6th switch
Closure disconnects；Be additionally operable in the second test phase controls each input switch unit the 4th switch closure,
5th switch closure, the 6th switch off, control the first switch in each output switching element to disconnect, the
Two are switched off, the 3rd switch is closed or disconnected；Wherein, the 3rd switch, the closure of the 6th switch or disconnection
For the capacitance for the self-capacitance link for determining to simulate.
With reference to the first possible implementation of first aspect, when touch chip to be measured is mutual capacitance type touch control
During chip, the test link simulations module is additionally operable to control without first in the output switching element of test
Switch, second switch, the 3rd switch disconnect；Control is opened without the 4th in the input switch unit of test
Close, the 5th switch, the 6th switch disconnect.
With reference in a first aspect, in second of possible implementation of first aspect, the test module bag
Include the first test submodule and the second test submodule；
The first test submodule is used for when touch chip to be measured is mutual capacitance type touch control chip, judgement pair
Need whether the detection data of the electric capacity of test position meet default first detection threshold value on the grid capacitive plate
Scope, if meeting, judges that the functional test of part corresponding with the test position in touch chip to be measured is closed
Lattice, otherwise judge that the functional test of part corresponding with the test position is unqualified；
The second test submodule is used for when touch chip to be measured is self-capacitance touch chip, judgement pair
Need whether the detection data of the electric capacity of test position meet default second detection threshold value on the grid capacitive plate
Scope, if meeting, judges that the functional test of part corresponding with the test position in touch chip to be measured is closed
Lattice, otherwise judge that the functional test of part corresponding with the test position is unqualified.
With reference to second of possible implementation of first aspect, the test module is also sentenced including a stability
Disconnected submodule, for when repeatedly being tested touch chip to be measured, multiple test result to be divided at least
Two groups time, judge the inverse of the detection data of the self-capacitance link simulated during each test in each group time
Sum connects with the sum reciprocal of the detection data of self-capacitance link that is simulated when each time is tested in other groups time
Short range degree, if degree of closeness is within the scope of default, judges the stabilization of the self-capacitance link of chip to be measured
Degree is qualified, and otherwise the degree of stability of the self-capacitance link of chip to be measured is unqualified；
Wherein, each group time includes multiple test result, and simulated when each time is tested in each group time
The capacitance sum of self-capacitance link and the electric capacity of the self-capacitance link simulated in other groups time during each test
It is worth sum identical.
With reference in a first aspect, in the third possible implementation of first aspect, in the capacitance matrix
The capacitance of each electric capacity is 1.5pF or 1pF.
Second aspect of the present invention provides a kind of method of testing of the touch chip test system based on grid capacitive plate,
The grid capacitive plate is connected in test by control with touch chip to be measured；The method of testing includes following
Step：
Configuration file obtaining step：Obtain the configuration file corresponding with the type of touch chip to be measured；It is described
Include the type information of touch chip to be measured in configuration file；
Test link simulations step：Touch chip to be measured is controlled according to the type information of the touch chip to be measured
Corresponding efficient circuit structure type is formed between grid capacitive plate, so that grid capacitive plate is touched with to be measured
Control chip simulates the self-capacitance link or mutual capacitance link needed for test jointly；
Testing procedure：The configuration file is loaded onto the test program, then in the self-capacitance simulated
It is loaded with the test program of configuration file to enter touch chip to be measured described in operation on link or mutual capacitance link
Row test.
With reference to second aspect, in the first possible implementation of second aspect：
The grid capacitive plate includes a pcb board, and the pcb board is provided with a capacitance matrix；The electricity
The every a line for holding matrix is respectively provided with the first signal terminal, and each row are respectively provided with secondary signal terminal；In the electricity
Hold in matrix, the first end of all electric capacity per a line is connected to the first signal terminal corresponding to the row,
Second end of all electric capacity of each row is connected to the secondary signal terminal corresponding to the row；Wherein, it is described
The signal input pin of first signal terminal and one in secondary signal terminal and touch chip to be measured is corresponding to be connected
Connect, another connection corresponding with the signal output pin of touch chip to be measured；
The touch chip to be measured includes the first signal generating circuit, secondary signal and occurs circuit, the first signal
If the signal output pin of receiving circuit, secondary signal receiving circuit and touch chip to be measured is one-to-one
Dry output switching element, the one-to-one some input switch lists of signal input pin with touch chip to be measured
Member；Wherein each output switching element includes first switch, second switch, third switch, each input
Switch element includes the 4th switch, the 5th switch, the 6th switch；
Wherein, first signal generating circuit connects corresponding signal output pin by each first switch,
First signal receiving circuit connects corresponding signal output pin, touch-control to be measured by each second switch
Each signal output pin of chip is also grounded by corresponding 3rd switch；Electricity occurs for the secondary signal
Road connects corresponding signal input pin by each 4th switch, and the secondary signal receiving circuit passes through every
Individual 5th switch connects corresponding signal input pin, and each signal input pin of touch chip to be measured also passes through
The corresponding 6th switch ground connection.
With reference to second aspect, in the first possible implementation of second aspect, the test link simulations
Step is specifically included：
Mutual capacitance link simulations step：Control to need the first switch in the output switching element tested to close,
Second switch disconnects, the 3rd switches off, and control needs the 4th switch in the input switch unit of test disconnected
Open, the 5th switch is closed, the 6th switches off；
Self-capacitance link simulations step：First in the first test phase controls each output switching element opens
Closing is closed, second switch is closed, the 3rd switches off, and controls the 4th switch in each input switch unit
Disconnect, the 5th switch off, the 6th switch closure or disconnecting；Each input is controlled to open in the second test phase
Close the in unit the 4th switch closure, the 5th switch is closed, the 6th switches off, and controls each output switch
First switch in unit is disconnected, second switch disconnects, the 3rd switch is closed or disconnected；Wherein, the 3rd open
Pass, the closure of the 6th switch or the capacitance for disconnecting the self-capacitance link for determining to simulate.
With reference to the first possible implementation of second aspect, in the mutual capacitance link simulations step, also
Including：Control is broken without the first switch, second switch, third switch in the output switching element of test
Open；Control disconnects without the 4th switch in the input switch unit of test, the 5th switch, the 6th switch.
With reference to second aspect, in second of possible implementation of second aspect, the testing procedure includes：
When touch chip to be measured is mutual capacitance type touch control chip, judge to needing test on the grid capacitive plate
Whether the detection data of the electric capacity of position meet default first detection threshold value scope, if meeting, judgement is treated
The functional test for surveying part corresponding with the test position in touch chip is qualified, otherwise judges and test position
The functional test for putting corresponding part is unqualified；
When touch chip to be measured is self-capacitance touch chip, judge to needing test on the grid capacitive plate
Whether the detection data of the electric capacity of position meet default second detection threshold value scope, if meeting, judgement is treated
The functional test for surveying part corresponding with the test position in touch chip is qualified, otherwise judges and test position
The functional test for putting corresponding part is unqualified.
With reference to second of possible implementation of second aspect, the testing procedure also includes：
When repeatedly being tested touch chip to be measured, multiple test result is divided at least two groups times,
Judge the sum reciprocal of the detection data of self-capacitance link that is simulated when each time is tested in each group time and other
The degree of closeness of the sum reciprocal of the detection data of the self-capacitance link simulated in group time during each test, if
Degree of closeness judges that the degree of stability of the self-capacitance link of chip to be measured is qualified within the scope of default, then,
Otherwise the degree of stability of the self-capacitance link of chip to be measured is unqualified；
Wherein, each group time includes multiple test result, and simulated when each time is tested in each group time
The capacitance sum of self-capacitance link and the electric capacity of the self-capacitance link simulated in other groups time during each test
It is worth sum identical.
It was found from the embodiments of the present invention, the present invention can control to be measured according to the type of touch chip to be measured
Touch chip and the grid capacitive plate shape are into corresponding efficient circuit structure type, i.e. when touch-control core to be measured
When piece is mutual capacitance type touch control chip, grid capacitive plate can be made to simulate mutual capacitance jointly with touch chip to be measured
Link, and when touch chip to be measured is self-capacitance touch chip, grid capacitive plate and touch chip to be measured
Self-capacitance link is simulated jointly, so as to realize mutual capacitance type simultaneously on the basis of grid capacitive plate
The test of touch chip and self-capacitance touch chip, the test coverage of lifting matrixes capacitor board.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to implementing
The accompanying drawing used required in example or description of the prior art is briefly described, it should be apparent that, describe below
In accompanying drawing be only some embodiments of the present invention, for those skilled in the art, do not paying wound
On the premise of the property made is laborious, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is former for the framework of the touch chip test system provided in an embodiment of the present invention based on grid capacitive plate
Reason figure；
Fig. 2 is the structural representation of grid capacitive plate in Fig. 1；
Fig. 3 is the connection diagram of each signal output pin of touch chip to be measured in Fig. 1；
Fig. 4 is the connection diagram of each signal input pin of touch chip to be measured in Fig. 1；
Fig. 5 is the equivalent model figure of self-capacitance signal link provided in an embodiment of the present invention；
Fig. 6 is the test side of the touch chip test system provided in an embodiment of the present invention based on grid capacitive plate
The implementation process figure of method.
Embodiment
, below will knot to enable goal of the invention, feature, the advantage of the present invention more obvious and understandable
The accompanying drawing in the embodiment of the present invention is closed, the technical scheme in the embodiment of the present invention is clearly and completely retouched
State, it is clear that described embodiment is only a part of embodiment of the invention, and not all embodiments.Base
Embodiment in the present invention, what those skilled in the art were obtained under the premise of creative work is not made
Every other embodiment, belongs to the scope of protection of the invention.
Fig. 1 shows the frame of the touch chip test system provided in an embodiment of the present invention based on grid capacitive plate
Structure principle, reference picture 1, the test of the touch chip based on the grid capacitive plate system that the embodiment of the present invention is provided
System includes grid capacitive plate 1, configuration file acquisition module 2, test link simulations module 3 and test module
4.Wherein, grid capacitive plate 1 structure as shown in Fig. 2 grid capacitive plate 1 include a pcb board, should
Pcb board is provided with a capacitance matrix, every a line of capacitance matrix be respectively provided with the first signal terminal (Rx0, Rx1,
Rx2, Rx3, Rx4 ...), each row are respectively provided with secondary signal terminal (Tx0, Tx1, Tx2, Tx3, Tx4 ...).
In the capacitance matrix, the first end a of all electric capacity C per a line is connected to first corresponding to the row
Signal terminal (Rx0, Rx1, Rx2, Rx3, Rx4 ...), all electric capacity C of each row the second end b
It is connected to the secondary signal terminal (Tx0, Tx1, Tx2, Tx3, Tx4 ...) corresponding to the row.
In the embodiment of the present invention, the capacitance of each electric capacity in grid capacitive plate 1 typically takes 1.5pF or 1pF,
The capacitance of each electric capacity can be consistent, i.e. all 1.5pF or all 1pF.Can also be partly
1.5pF, another part are 1pF.Each electric capacity use package dimension for 0402 or 0201 high-accuracy electric capacity come
Reduce the influence of parasitic parameter, meanwhile, this less electric capacity of package dimension is also beneficial to grid capacitive plate 1
Volume be reduced.
Above-mentioned first signal terminal (Rx0, Rx1, Rx2, Rx3, Rx4 ...) and secondary signal terminal (Tx0,
Tx1, Tx2, Tx3, Tx4 ...) in one it is corresponding with the signal input pin of touch chip to be measured connection,
Another connection corresponding with the signal output pin of touch chip to be measured, that is to say, that can be specifically first
Signal terminal (Rx0, Rx1, Rx2, Rx3, Rx4 ...) and the signal input pin pair of touch chip to be measured
It should connect, and secondary signal terminal (Tx0, Tx1, Tx2, Tx3, Tx4 ...) and touch chip to be measured
Signal output pin correspondence is connected；Can also be the first signal terminal (Rx0, Rx1, Rx2, Rx3, Rx4 ...)
It is corresponding with the signal output pin of touch chip to be measured connection, and secondary signal terminal (Tx0, Tx1, Tx2,
Tx3, Tx4 ...) connection corresponding with the signal input pin of touch chip to be measured.
Configuration file acquisition module 2 is used to obtain the configuration file corresponding with the type of touch chip to be measured,
Include the type information of touch chip to be measured in the configuration file, for example, self-capacitance touch chip or mutual
Capacitive touch chip.As one embodiment of the present of invention, the type with touch chip to be measured is corresponding
Configuration file can be inputted before each test by tester, if the touch chip type currently tested with
The touch chip type that last time tested is identical, then need not input configuration file again.It is used as the present invention's
Another embodiment, all types of configuration files can also be backed up in advance, when being tested by tester
Member directly therefrom selects the configuration file that this is needed to use, for example, include all configuration files there is provided portion
The inventory of information is selected for tester, and " self-capacitance test configuration text can be included in the configuration file inventory
The option such as part ", " mutual capacitance test configuration file ", the then configuration file according to selected by tester
Option name calls corresponding configuration file content.
Test link simulations module 3 is connected with touch chip to be measured, for the type according to touch chip to be measured
Information (i.e. self-capacitance or mutual capacitance type) controls touch chip to be measured to form corresponding to grid capacitive plate 1
Efficient circuit structure type (i.e. self-capacitance link or mutual capacitance link) so that grid capacitive plate 1 with
Touch chip to be measured simulates the self-capacitance link or mutual capacitance link needed for test jointly.Grid capacitive plate 1
After simulating mutual capacitance link or self-capacitance link jointly with touch chip to be measured, touch-control to be measured is just constructed
Chip runs the basis of some functions, the test of touch chip can be carried out on this basis, to judge touch-control
Whether chip meets relevant criterion.
As described above, touch chip to be measured may be mutual capacitance type, it is also possible to be self-capacitance.Either
Mutual capacitance type touch control chip or self-capacitance touch chip, inside are designed with the signal needed for normal work
Generation circuit, signal receiving circuit and necessary switch element etc., the present invention are carried out to touch chip to be measured
, it is necessary to be multiplexed such circuit and switch element during test.The touch chip to be measured that need to be multiplexed when hereafter to test
Internal circuit configuration be briefly described.
First, it refer to the annexation of each signal output pin of touch chip to be measured shown in Fig. 3.It is to be measured
Touch chip includes the first signal generating circuit 31, the first signal receiving circuit 32 and touch chip to be measured
The one-to-one some output switching element 331-333n of signal output pin 1-n, wherein each output switch
Unit includes first switch K1, second switch K2, the 3rd switch K3, and each output switching element
First switch K1, second switch K2, the 3rd switch K3 can individually control.Electricity occurs for the first signal
Road 31 passes through the corresponding signal output pin of each first switch K1 connections, the first signal receiving circuit 32
Pass through the corresponding signal output pin of each second switch K2 connections, each signal output of touch chip to be measured
Pin 1-n also passes through each self-corresponding 3rd switch K3 ground connection.
Secondly, it refer to the annexation of each signal input pin of touch chip to be measured shown in Fig. 4.It is to be measured
Touch chip includes secondary signal and occurs circuit 41, secondary signal receiving circuit 42 and touch chip to be measured
The one-to-one some output switching element 431-433n of signal input pin 1-n, wherein each input switch
Unit includes the 4th switch K4, the 5th switch K5, the 6th switch K6, similarly, each input switch list
The 4th switch K4, the 5th switch K5, the 6th switch K6 of member also can be controlled individually.Secondary signal occurs
Circuit 41 passes through the corresponding signal input pin of each 4th switch K4 connections, secondary signal receiving circuit 42
Pass through the corresponding signal input pin of each 5th switch K5 connections, each signal input of touch chip to be measured
Pin also passes through the corresponding 6th switch K6 ground connection.
From figs. 3 and 4 it can be seen that the signal output pin and signal input pin of touch chip to be measured
Circuit connection topology is identical, during test, tests class of the link simulations module 2 according to touch chip to be measured
Type carrys out the above-mentioned state respectively switched in control section, so as to control each signal input pin and the signal output pin to be
It is no to have signal input/output.
When touch chip to be measured is mutual capacitance type, test link simulations module 2 is used to control to need what is tested
It is (right that first switch K1 closures in output switching element, second switch K2 disconnect, the 3rd switch K3 disconnects
Ground floating), control needs the 4th switch K4 in the input switch unit tested to disconnect, the 5th switch K5
Closure, the 6th switch K6 disconnect (floating over the ground), and in the output switching element without test
First switch, second switch, third switch and without the 4th switch in the input switch unit of test, the
Five switches, the 6th switch, disconnect under the control of test link simulations module 2.Now, grid capacitive
It is mutual between signal output part and signal input part in each capacitance simulation in plate 1 mutual capacitance type touch screen
Electric capacity, and due to thering is mutual capacitance to deposit between each signal output pin and all signal input pins
, thus now be very high with the mutual capacitance type touch screen model goodness of fit.
It is the simulation self-capacitance mode of operation in grid capacitive plate when touch chip to be measured is self-capacitance,
Two test phases need to be divided into be tested, test link simulations module 2 is used in the control of the first test phase
First switch K1 closures, second switch K2 closures, the 3rd switch K3 in each output switching element are broken
Open, controlling the in each input switch unit the 4th to switch, K4 disconnects, the 5th switch K5 disconnects, the 6th opens
Close K6 closures or disconnect；It is additionally operable to control the in each input switch unit the 4th to open in the second test phase
Close K4 closures, the 5th switch K5 closures, the 6th switch K6 to disconnect, control in each output switching element
First switch K1 disconnect, second switch K2 disconnect, the 3rd switch K3 closure or disconnect.
For example, RX groups circuit and TX group circuits are divided into two components drives row test into (by touch-control core to be measured
The signal output pin circuit of piece is named as TX group circuits, with the secondary signal end in grid capacitive plate 1
The correspondence such as sub- Tx0, Tx1, Tx2, Tx3, Tx4, inputs a signal into pin connection and is named as RX group circuits,
With corresponding with first signal terminal Rx0, Rx1, Rx2, Rx3, Rx4 in grid capacitive plate 1 etc.).
When TX groups are tested, in signal output and reception state, (K1 and K2 are closed all TX groups circuits together
Close, K3 disconnects), and the circuit in RX groups is controllable in ground connection or complete floating (K4 and K5
Disconnect, and K6 can be closed or disconnected as needed), now the self-capacitance in TX groups circuit depends on RX
The capacitance of the quantity of line-to-ground in group and single electric capacity, by the number for changing line-to-ground in RX groups
Amount can change the self-capacitance of TX group circuits, this can very well simulation self-capacitance touch screen by one's hands
Refer to the change for touching lower self-capacitance value.Due to signal output pin connection figure and signal input pin connection figure
Topological structure is the same, therefore the test of RX groups can use the method for testing as the test of TX groups.
As can be seen here, working method of the grid capacitive plate 1 when self-capacitance is tested and actual self-capacitance touch screen
The working method goodness of fit is also very high.
Test module 4 includes the first test submodule and the second test submodule, wherein, the first test submodule
Block is used to, when touch chip to be measured is mutual capacitance type touch control chip, judge to needing to survey on the grid capacitive plate
Whether the detection data for trying the electric capacity of position meet default first detection threshold value scope, if meeting, judge
The functional test of part corresponding with the test position is qualified in touch chip to be measured, otherwise judges and the test
The functional test of the corresponding part in position is unqualified.Second test submodule is used for when touch chip to be measured is certainly
During capacitive touch chip, judge be to the detection data that the electric capacity of test position is needed on the grid capacitive plate
It is no to meet default second detection threshold value scope, if meet, judge in touch chip to be measured with the test position
The functional test for putting corresponding part is qualified, otherwise judges the functional test of part corresponding with the test position
It is unqualified.
For example, the electric capacity at the row of matrix circuit plate i-th, jth row is in test mutual capacitance type touch control chip and certainly
Detection data during capacitive touch chip are respectively Dij1、Dij2, corresponding first detection threshold value of electric capacity at this
Respectively Dth1, the second detection threshold value be Dth2.Directly will detection data D during judgementij1With the first detection threshold value
Dth1Compare, data D will be detectedij2With the second detection threshold value Dth2Compare.
From above-described embodiment as can be seen that the touch chip provided in an embodiment of the present invention based on grid capacitive plate
Test system can realize mutual capacitance and the class testing of self-capacitance two simultaneously in grid capacitive plate 1, than simple progress
Mutual capacitance test improves test coverage, and device is simple, and under mutual capacitance test and self-capacitance test
Chip operation environment it is high with the real operating environments goodness of fit under capacitance plate, test accuracy is high.
Further, as described above, it is (logical by changing ground capacity when self-capacitance touch chip is tested
The 3rd switch K3, the 6th switch K6 closures is crossed to realize) quantity come simulate self-capacitance touch screen by
The change of lower self-capacitance value is touched to finger, so, the difference manufactured due to self-capacitance touch chip,
The influence for the magnitude offset that the deviation of testing tool is brought, the when each test selection diverse location the 3rd opens
When closing the switch K6 ground connection of K3 and the 6th, even if the quantity of ground capacity is identical every time, it is also possible to each
Test result is also different, and the accuracy on test has influenceed.To eliminate this influence, it is to avoid test
As a result influenceed by the self-capacitance link simulated, it is necessary to the self-capacitance link for determining whether to simulate it is steady
Fixed degree, to lift test accuracy.
Based on above-mentioned consideration, test module 4 also includes a stability judging submodule, for being touched to be measured
When control chip is repeatedly tested, multiple test result is divided at least two groups times, judged in each group time
The sum reciprocal of the detection data of the self-capacitance link simulated during each test and each test in other groups time
When the degree of closeness of the sums reciprocal of the detection data of self-capacitance link that simulates, if degree of closeness is default
Within the scope of, then judge that the degree of stability of the self-capacitance link of chip to be measured is qualified, otherwise chip to be measured
The degree of stability of self-capacitance link is unqualified；
Wherein, each group time includes multiple test result, and simulated when each time is tested in each group time
The capacitance sum of self-capacitance link and the electric capacity of the self-capacitance link simulated in other groups time during each test
It is worth sum identical.
Hereafter the principle that aforementioned stable degree is tested is illustrated.The principle is：Assimilated equations " identical gear
Several self-capacitances numerical value and in the case of identical, produced signal numerical quantity it is reciprocal and also identical "
Produced application process can assess the stability of self-capacitance circuit exactly, wherein, identical gear is to refer to
Described testing time above.The condition that the rule is set up only needs to build the self-capacitance numerical value of identical gear number
Summation it is identical, condition set up in the case of, you can observation self-capacitance change when actual circuit table
Now with the degree of being consistent of ideal circuit model.Using the application process produced by the rule, structure can not be spent
(this can eliminate self-capacitance value in the self-capacitance link simulated to the accurate capacitance of some specific gear self-capacitance
Deviation effects), attention signal can not also be spent occur circuit internal resistance and the influence of series resistor size,
Stability of a circuit asks when the bad assessment self-capacitance of method that pure control semaphore can thus be solved changes
Topic.
Now to rule " self-capacitance of identical gear number numerical value and identical in the case of, produced signal
Numerical quantity it is reciprocal and also identical " enter line justification.Reference picture 5, in the self-capacitance signal link shown in Fig. 5
In equivalent model, S1 represents source output signal, and R represents equivalent partial pressure and current-limiting resistance, and C represents chip
Bar line mutual-ground capacitor (i.e. self-capacitance), it can be changed as finger is pressed, and Buf represents that input is high
Impedance and export low-impedance drive circuit.The original value of self-capacitance is by depending on the size of S2 signals, and S2
Signal is in the case where S1 is determined by the reactance ratio depending on R and C.
Next deriving rule, " self-capacitance of identical gear number is produced in the case of numerical value with identical
Signal numerical quantity it is reciprocal and also identical ", as follows, the electric capacity provided with n gear, one of which
Capacitance be C1, C2 ... Cn, another group of capacitance is Cn+1, Cn+2 ... C2n, wherein C1+C2+ ...
+ Cn=Cn+1+Cn+2+ ...+C2n, according to capacity reactance formula：
Wherein, z represents reactance；J is imaginary unit, -1 square root；W represents the signal angular frequency by electric capacity；
C represents capacitance.It can obtain：
It is by the relation for scheming S1 and S2 knowable to (2) self-capacitance signal link equivalent model figure：
If C1, C2 ..., Cn, Cn+1, Cn+2 ..., C2n correspondences be in the signals of S2 nodes It can be obtained with reference to equation (2) and equation (3)：
Rule is proven.
For example, set the number of, lines of TX groups as M, the number of, lines of RX groups for N (actual touch-control IC's
M>4, N>4).Data and signal the S2 linear proportionate relationship of size are detected, and is named and is RawData,
Therefore RawData change can reflect S2 change.Following method is this paper emphasis, it is intended that
The influence of deviation of resistance R and electric capacity C itself is eliminated in appraisal procedure, while can be well reflected in from electricity again
The stability of whole self-capacitance circuit when holding C changes.
If the capacitance of single electric capacity is C in grid capacitive plate, it is considered to which the deviation for entering each electric capacity is entered, then
The numerical value of RX group ground capacities is set to C1, C2, C3...CN；If needing the capacitance variations tested
Gear number be k, in order to illustrate the method, without loss of generality, k=5 can be set.
In order to ensure the uniformity of gear distribution, the number of ground capacity can be set to：0、N/4、2N/4、
(N is RX group number of, lines, N by N-N/4, N>4, result of division is rounded), while being connect down to build
The method of testing come, also needs to add the test of 1 (N -2N/4) individual ground capacity.
Ground capacity allocative decision such as following table during specific self-capacitance test (is illustrated, TX groups with RX groups
Method it is the same)：
Table (1)
From above electric capacity allocative decision, Cg1+Cg2=Cg3+Cg4=Cg5+Cg6 (5), by advising
Rule " self-capacitance of identical gear number numerical value and in the case of identical, produced signal numerical quantity falls
It is several and also identical " following equation set can be obtained：
And because in Fig. 5 self-capacitance signal link equivalent model figures RawData (RawData is touch chip
The numerical value that signal intensity S2 according to receiving is calculated, the numerical value and signal intensity S2 are linear
Proportionate relationship, can be referred to as original value.) and the linear proportionate relationship of S2 signals, equation set (7) can be released
With equation set (8)：
If proportionality coefficient h1 and h2 are：
Ideally, h1=1, h2=1.
As can be seen here, the equation set (7) and equation set (8) built with ground capacity allocative decision is assessed certainly
The stability of whole circuit is unrelated with R and C concrete numerical value during capacitance variations, so as to eliminate chip-resistance
The deviation effects of R and external testing electric capacity C in itself.
Equation (9) can be obtained according to the number of ground capacity in ground capacity allocative decision：
RawData6>RawData1>RawData3>RawData2>RawData5 (9)
In actual applications, often first control (, it is necessary to whether be met according to test parameter in chip testing
The parameter whether it is up to specification judge whether chip passes through, this process is referred to as control) minimum value
Then RawData5 judges whether equation (9) is set up whether in the range of original value Spec, equation (9)
Invalid chip will directly be judged to NG pieces, then judge RawData6, RawData1, RawData3,
Whether the difference between RawData2, RawData5 is in the range of original value changes Spec controls, last root
Proportionality coefficient h1 and h2 are calculated according to equation set (8), observation h1 and h2 and the degree of closeness of ideal value 1 are come
The stability of self-capacitance link when rapidly and accurately assessing self-capacitance change.
As can be seen that whether meeting expected base by the semaphore change in the case where testing different self-capacitance gears
On plinth, by comparing the signal numerical quantity produced under different self-capacitance gears with containing in preferable self-capacitance model
Rule degree of being consistent, with assess self-capacitance change when self-capacitance drive circuit (signal source and internal resistance) it is steady
Fixed degree, this eliminates touch chip and manufactures difference, the shadow for the magnitude offset that testing tool deviation is brought
Ring, self-capacitance test is more accurate.
Fig. 6 shows the survey of the touch chip test system provided in an embodiment of the present invention based on grid capacitive plate
The implementation process of method for testing, details are as follows.
Step S61, the acquisition for acting as configuration file of this step：Obtain the type phase with touch chip to be measured
Corresponding configuration file.
On hardware, the test of touch chip needs the test link corresponding with the type of touch chip to be measured
To support, such as self-capacitance touch chip needs self-capacitance link, and mutual capacitance type touch control chip needs mutual capacitance
Link.On software, test program needs to load the configuration file corresponding with the type of touch chip to be measured,
The configuration file contains the relevant informations such as the type of touch chip to be measured.When hardware condition and software condition all
Possess, by corresponding test link operation be loaded with the test program of configuration file, you can start into
Row test.
As one embodiment of the present of invention, the configuration file corresponding with the type of touch chip to be measured can be with
Inputted before each test by tester, if what the touch chip type currently tested was tested with last time
Touch chip type is identical, then need not input configuration file again.
As another embodiment of the present invention, all types of configuration files can also be backed up in advance, are being entered
The configuration file that this is needed to use directly therefrom is selected by tester during row test, for example there is provided portion
Inventory comprising all profile informations is selected for tester, can be comprising " certainly in the configuration file inventory
The option such as capacity measurement configuration file ", " mutual capacitance test configuration file ", then according to tester
Profile option name selected by member calls corresponding configuration file content.
Step S62, the simulation for acting as testing link of this step：Controlled to treat according to the configuration file of acquisition
Touch chip and grid capacitive plate shape are surveyed into corresponding efficient circuit structure type so that grid capacitive plate and
Touch chip to be measured simulates the self-capacitance link or mutual capacitance link needed for test jointly.
As described above, configuration file contains the relevant informations such as the type of touch chip to be measured, therefore, can
Determine currently to need to form self-capacitance link or mutual capacitance chain with the relevant information in configuration file
Road is used for test.Wherein, the self-capacitance link or mutual capacitance link of formation need grid capacitive plate to be touched with to be measured
Control chip participates in completing jointly, and specifically as indicated above, here is omitted.
Step S63, the test acting as to touch chip of this step：The configuration text that test program loading is obtained
Part, is then loaded with the survey of configuration file on the self-capacitance link or mutual capacitance link simulated described in operation
Examination program is to test touch chip to be measured.
Further, step S62 is specifically included：Mutual capacitance link simulations step and self-capacitance link simulations step.
Wherein, mutual capacitance link simulations step is：Control needs the first switch in the output switching element tested to close
Close, second switch disconnects, the 3rd switches off, control needs the in the input switch unit tested the 4th to open
Shut-off is opened, the 5th switch is closed, the 6th switches off.Self-capacitance link simulations step is：In the first test
First switch closure in each output switching element of stage control, second switch are closed, the 3rd switches off,
Control the in each input switch unit the 4th to switch off, the 5th switch off, the 6th switch closure or disconnected
Open；The 4th switch in the second test phase controls each input switch unit is closed, the 5th switch is closed,
6th switches off, control the first switch in each output switching element to disconnect, second switch disconnects, the
Three switch closures disconnect；Wherein, the 3rd switch, the closure or disconnect of the 6th switch are simulated for decision
Self-capacitance link capacitance.
Further, step S62 also includes：Control without test output switching element in first switch,
Second switch, the 3rd switch disconnect；Control is without the 4th switch in the input switch unit of test, the
Five switches, the 6th switch disconnect.
Further, step S63 includes：When touch chip to be measured is mutual capacitance type touch control chip, judgement pair
Need whether the detection data of the electric capacity of test position meet default first detection threshold value on the grid capacitive plate
Scope, if meeting, judges that the functional test of part corresponding with the test position in touch chip to be measured is closed
Lattice, otherwise judge that the functional test of part corresponding with the test position is unqualified；When touch chip to be measured is
During self-capacitance touch chip, the detection data of the electric capacity to needing test position on the grid capacitive plate are judged
Whether meet default second detection threshold value scope, if meet, judge in touch chip to be measured with the test
The functional test of the corresponding part in position is qualified, otherwise judges that the function of part corresponding with the test position is surveyed
Examination is unqualified.
Further, step S53 also includes：To be many when repeatedly being tested touch chip to be measured
Secondary test result is divided at least two groups times, judges the self-capacitance chain simulated during each test in each group time
The sum reciprocal of the detection data on road and the detection of the self-capacitance link simulated in other groups time during each test
The degree of closeness of the sum reciprocal of data, if degree of closeness is within the scope of default, judges chip to be measured
Self-capacitance link degree of stability it is qualified, otherwise the degree of stability of the self-capacitance link of chip to be measured is unqualified；
Wherein, each group time includes multiple test result, and simulated in each group time during each test from electric
The capacitance of self-capacitance link simulated when holding the capacitance sum of link and each time being tested in other groups time it
With it is identical.
In summary, the touch chip test system provided in an embodiment of the present invention based on grid capacitive plate is in square
Mutual capacitance and the class testing of self-capacitance two, the matrix of raising can be realized in this simple device of battle array capacitor board simultaneously
Whether the test coverage of capacitor board, can also meet in the change of the semaphore under testing different self-capacitance gears
On the basis of expected, pass through signal numerical quantity and the preferable self-capacitance mould produced under relatively more different self-capacitance gears
The degree of being consistent of the rule contained in type, self-capacitance drive circuit during assessing self-capacitance change (signal source with it is interior
Resistance) stability, the magnitude offset that this eliminates chip production manufacturing variation, testing tool deviation is brought
Influence, self-capacitance test it is more accurate.
, can in several embodiments provided herein, it should be understood that disclosed system and method
To realize by another way.For example, system embodiment described above is only schematical, example
Such as, the division of the module, only a kind of division of logic function can have other draw when actually realizing
The mode of dividing, such as multiple module or components can combine or be desirably integrated into another system, or some spies
Levying to ignore, or does not perform.It is another, shown or discussed coupling or direct-coupling each other
Or communication connection can be by some interfaces, the INDIRECT COUPLING or communication connection of device or module, Ke Yishi
Electrically, machinery or other forms.
In addition, each functional module in each embodiment of the invention can be integrated in a processing module,
Can also be that modules are individually physically present, can also two or more modules be integrated in a module
In.Above-mentioned integrated module can both be realized in the form of hardware, it would however also be possible to employ software function module
Form is realized.
If the integrated module realized using in the form of software function module and as independent production marketing or
In use, can be stored in a computer read/write memory medium.Understood based on such, the present invention
The part that is substantially contributed in other words to prior art of technical scheme or the technical scheme whole or
Part can be embodied in the form of software product, and the computer software product is stored in a storage medium
In, including some instructions to cause a computer equipment (can be personal computer, server, or
Person's network equipment etc.) perform all or part of step of each of the invention embodiment methods described.And it is foregoing
Storage medium includes：USB flash disk, mobile hard disk, read-only storage (ROM, Read-Only Memory),
Random access memory (RAM, Random Access Memory), magnetic disc or CD etc. are various can be with
The medium of store program codes.
It should be noted that for foregoing each method embodiment, for simplicity description, therefore it is all stated
For a series of combination of actions, but those skilled in the art should know, the present invention is not by described
The limitation of sequence of movement, because according to the present invention, some steps can use other orders or carry out simultaneously.
Secondly, those skilled in the art should also know, embodiment described in this description belongs to be preferable to carry out
Example, necessary to involved action and module might not all be the present invention.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, without detailed in some embodiment
The part stated, may refer to the associated description of other embodiments.
It is based on the touch chip test system of grid capacitive plate and its test side to provided by the present invention above
The description of method, for those skilled in the art, according to the thought of the embodiment of the present invention, in specific embodiment party
It will change in formula and application, to sum up, this specification content should not be construed as to the present invention's
Limitation.
Claims (12)
1. a kind of touch chip test system based on grid capacitive plate, it is characterised in that the touch chip
Test system includes grid capacitive plate, configuration file acquisition module, test link simulations module and test mould
Block；
The grid capacitive plate is connected in test by control with touch chip to be measured；
The configuration file acquisition module is used to obtain the configuration file corresponding with the type of touch chip to be measured；
Include the type information of touch chip to be measured in the configuration file；
The test link simulations module is connected with touch chip to be measured, for according to the touch chip to be measured
Type information control to form corresponding efficient circuit structure type between touch chip to be measured and grid capacitive plate,
So that grid capacitive plate simulates self-capacitance link or the mutual capacitance needed for test with touch chip to be measured jointly
Link；
The test module is built-in with test program, for the configuration file to be loaded onto into the test program,
Then on the self-capacitance link or mutual capacitance link simulated operation be loaded with the test program of configuration file with
Touch chip to be measured is tested.
2. touch chip test system as claimed in claim 1, it is characterised in that：
The grid capacitive plate includes a pcb board, and the pcb board is provided with a capacitance matrix；The electricity
The every a line for holding matrix is respectively provided with the first signal terminal, and each row are respectively provided with secondary signal terminal；In the electricity
Hold in matrix, the first end of all electric capacity per a line is connected to the first signal terminal corresponding to the row,
Second end of all electric capacity of each row is connected to the secondary signal terminal corresponding to the row；Wherein, it is described
The signal input pin of first signal terminal and one in secondary signal terminal and touch chip to be measured is corresponding to be connected
Connect, another connection corresponding with the signal output pin of touch chip to be measured；
The touch chip to be measured includes the first signal generating circuit, secondary signal and occurs circuit, the first signal
If the signal output pin of receiving circuit, secondary signal receiving circuit and touch chip to be measured is one-to-one
Dry output switching element, the one-to-one some input switch lists of signal input pin with touch chip to be measured
Member；Wherein each output switching element includes first switch, second switch and the 3rd switch, each defeated
Entering switch element includes the 4th switch, the 5th switch and the 6th switch；
Wherein, first signal generating circuit connects corresponding signal output pin by each first switch,
First signal receiving circuit connects corresponding signal output pin, touch-control to be measured by each second switch
Each signal output pin of chip is also grounded by corresponding 3rd switch；Electricity occurs for the secondary signal
Road connects corresponding signal input pin by each 4th switch, and the secondary signal receiving circuit passes through every
Individual 5th switch connects corresponding signal input pin, and each signal input pin of touch chip to be measured also passes through
The corresponding 6th switch ground connection.
3. touch chip test system as claimed in claim 2, it is characterised in that：
When touch chip to be measured is mutual capacitance type touch control chip, the test link simulations module is used to control
The first switch in the output switching element of test is needed to close, second switch disconnects and the 3rd switches off,
Control needs the in the input switch unit tested the 4th to switch off, the 5th switch is closed and the 6th switch
Disconnect；
When touch chip to be measured is self-capacitance touch chip, the test link simulations module is used for the
One test phase controls the first switch in each output switching element to close, second switch closure and the 3rd
Switch off, control the in each input switch unit the 4th to switch off, the 5th switches off and the 6th
Switch closure disconnects；It is additionally operable to the 4th switch in the second test phase controls each input switch unit
Closure, the 5th switch closure and the 6th switch off, and control the first switch in each output switching element
Disconnect, second switch disconnects and the 3rd switch closure or disconnection；Wherein, the 3rd switch and the 6th switch
Closure or disconnect the capacitance of self-capacitance link for determining to simulate.
4. touch chip test system as claimed in claim 3, it is characterised in that when touch chip to be measured
During for mutual capacitance type touch control chip, the test link simulations module is additionally operable to control and opened without the output of test
The first switch in unit, second switch and the 3rd switch is closed to disconnect；Control is opened without the input of test
The in unit the 4th switch, the 5th switch and the 6th switch is closed to disconnect.
5. touch chip test system as claimed in claim 1, it is characterised in that：The test module bag
Include the first test submodule and the second test submodule；
The first test submodule is used for when touch chip to be measured is mutual capacitance type touch control chip, judgement pair
Need whether the detection data of the electric capacity of test position meet default first detection threshold value on the grid capacitive plate
Scope, if meeting, judges that the functional test of part corresponding with the test position in touch chip to be measured is closed
Lattice, otherwise judge that the functional test of part corresponding with the test position is unqualified.
The second test submodule is used for when touch chip to be measured is self-capacitance touch chip, judgement pair
Need whether the detection data of the electric capacity of test position meet default second detection threshold value on the grid capacitive plate
Scope, if meeting, judges that the functional test of part corresponding with the test position in touch chip to be measured is closed
Lattice, otherwise judge that the functional test of part corresponding with the test position is unqualified.
6. touch chip test system as claimed in claim 5, it is characterised in that the test module is also
Including a stability judging submodule, for when repeatedly being tested touch chip to be measured, will repeatedly survey
Test result is divided at least two groups times, the self-capacitance link for judging to simulate when each time is tested in each group time
Detect the sum reciprocal of data and the detection data of the self-capacitance link simulated in other groups time during each test
Sum reciprocal degree of closeness, if degree of closeness is within the scope of default, judge chip to be measured from
The degree of stability of capacitance link is qualified, and otherwise the degree of stability of the self-capacitance link of chip to be measured is unqualified；
Wherein, each group time includes multiple test result, and simulated when each time is tested in each group time
The capacitance sum of self-capacitance link and the electric capacity of the self-capacitance link simulated in other groups time during each test
It is worth sum identical.
7. a kind of method of testing of the touch chip test system based on grid capacitive plate, it is characterised in that institute
Grid capacitive plate is stated to be connected with touch chip to be measured by control in test；The method of testing includes following steps
Suddenly：
Configuration file obtaining step：Obtain the configuration file corresponding with the type of touch chip to be measured；It is described
Include the type information of touch chip to be measured in configuration file；
Test link simulations step：Touch chip to be measured is controlled according to the type information of the touch chip to be measured
Corresponding efficient circuit structure type is formed between grid capacitive plate, so that grid capacitive plate is touched with to be measured
Control chip simulates the self-capacitance link or mutual capacitance link needed for test jointly；
Testing procedure：The configuration file is loaded onto the test program, then in the self-capacitance simulated
It is loaded with the test program of configuration file to enter touch chip to be measured described in operation on link or mutual capacitance link
Row test.
8. method of testing as claimed in claim 7, it is characterised in that：
The grid capacitive plate includes a pcb board, and the pcb board is provided with a capacitance matrix；The electricity
The every a line for holding matrix is respectively provided with the first signal terminal, and each row are respectively provided with secondary signal terminal；In the electricity
Hold in matrix, the first end of all electric capacity per a line is connected to the first signal terminal corresponding to the row,
Second end of all electric capacity of each row is connected to the secondary signal terminal corresponding to the row；Wherein, it is described
The signal input pin of first signal terminal and one in secondary signal terminal and touch chip to be measured is corresponding to be connected
Connect, another connection corresponding with the signal output pin of touch chip to be measured；
The touch chip to be measured includes the first signal generating circuit, secondary signal and occurs circuit, the first signal
If the signal output pin of receiving circuit, secondary signal receiving circuit and touch chip to be measured is one-to-one
Dry output switching element, the one-to-one some input switch lists of signal input pin with touch chip to be measured
Member；Wherein each output switching element includes first switch, second switch and the 3rd switch, each defeated
Entering switch element includes the 4th switch, the 5th switch and the 6th switch；
Wherein, first signal generating circuit connects corresponding signal output pin by each first switch,
First signal receiving circuit connects corresponding signal output pin, touch-control to be measured by each second switch
Each signal output pin of chip is also grounded by corresponding 3rd switch；Electricity occurs for the secondary signal
Road connects corresponding signal input pin by each 4th switch, and the secondary signal receiving circuit passes through every
Individual 5th switch connects corresponding signal input pin, and each signal input pin of touch chip to be measured also passes through
The corresponding 6th switch ground connection.
9. method of testing as claimed in claim 8, it is characterised in that：
The test link simulations step is specifically included：
Mutual capacitance link simulations step：Control to need the first switch in the output switching element tested to close,
Second switch disconnects and the 3rd switches off, and control needs the in the input switch unit tested the 4th to switch
Disconnect, the 5th switch is closed and the 6th switches off；
Self-capacitance link simulations step：First in the first test phase controls each output switching element opens
Closing is closed, second switch is closed and the 3rd switches off, and controls the in each input switch unit the 4th to open
Shut-off is opened, the 5th switches off and the 6th switch closure or disconnection；Control each defeated in the second test phase
Enter the in switch element the 4th switch closure, the 5th switch is closed and the 6th switches off, and controls each defeated
The first switch gone out in switch element disconnects, second switch disconnects and the 3rd switch closure or disconnection；Wherein,
3rd switch and the 6th closure switched or the capacitance for disconnecting the self-capacitance link for determining to simulate.
10. method of testing as claimed in claim 9, it is characterised in that the mutual capacitance link simulations step
In, in addition to：Control is without the first switch in the output switching element of test, second switch and the 3rd
Switch disconnects；Control is without the 4th switch in the input switch unit of test, the 5th switch and the 6th
Switch disconnects.
11. method of testing as claimed in claim 7, it is characterised in that the testing procedure includes：
When touch chip to be measured is mutual capacitance type touch control chip, judge to needing test on the grid capacitive plate
Whether the detection data of the electric capacity of position meet default first detection threshold value scope, if meeting, judgement is treated
The functional test for surveying part corresponding with the test position in touch chip is qualified, otherwise judges and test position
The functional test for putting corresponding part is unqualified；
When touch chip to be measured is self-capacitance touch chip, judge to needing test on the grid capacitive plate
Whether the detection data of the electric capacity of position meet default second detection threshold value scope, if meeting, judgement is treated
The functional test for surveying part corresponding with the test position in touch chip is qualified, otherwise judges and test position
The functional test for putting corresponding part is unqualified.
12. method of testing as claimed in claim 11, it is characterised in that the testing procedure also includes：
When repeatedly being tested touch chip to be measured, multiple test result is divided at least two groups times,
Judge the sum reciprocal of the detection data of self-capacitance link that is simulated when each time is tested in each group time and other
The degree of closeness of the sum reciprocal of the detection data of the self-capacitance link simulated in group time during each test, if
Degree of closeness judges that the degree of stability of the self-capacitance link of chip to be measured is qualified within the scope of default, then,
Otherwise the degree of stability of the self-capacitance link of chip to be measured is unqualified；
Wherein, each group time includes multiple test result, and simulated when each time is tested in each group time
The capacitance sum of self-capacitance link and the electric capacity of the self-capacitance link simulated in other groups time during each test
It is worth sum identical.
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| CN110383226A (en) * | 2017-12-29 | 2019-10-25 | 深圳市汇顶科技股份有限公司 | The calibration method of node capacitor |
| CN112083309A (en) * | 2020-07-29 | 2020-12-15 | 中广核核电运营有限公司 | Intelligent testing system and method for memory board |
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