CN107234309B - Metallized ceramic structure for brazing, manufacturing method thereof and magnetron - Google Patents
Metallized ceramic structure for brazing, manufacturing method thereof and magnetron Download PDFInfo
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- CN107234309B CN107234309B CN201710271292.6A CN201710271292A CN107234309B CN 107234309 B CN107234309 B CN 107234309B CN 201710271292 A CN201710271292 A CN 201710271292A CN 107234309 B CN107234309 B CN 107234309B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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Abstract
The invention discloses a metalized ceramic structure for brazing, which comprises a body layer and a metalized layer, wherein the metalized layer covers the surface of the body layer, the metalized layer is tightly combined with the body layer, the metalized layer comprises a molybdenum-manganese layer, a nickel layer and a brazing filler metal layer, the molybdenum-manganese layer is connected with the body layer and the nickel layer, the nickel layer is connected with the molybdenum-manganese layer and the brazing filler metal layer, the nickel layer is tightly combined with the molybdenum-manganese layer, the nickel layer is tightly combined with the brazing filler metal layer, the molybdenum-manganese layer separates the body layer and the nickel layer, the nickel layer separates the molybdenum-manganese layer and the brazing filler metal layer, and the brazing filler metal layer is composed of alloy brazing filler metal with the melting point lower than. Therefore, when the metallized ceramic structure is brazed with the kovar alloy, brazing filler metal does not need to be placed manually, so that the metallized ceramic structure can be automatically assembled with the kovar alloy, and the influence of human factors in the assembling process can be reduced. In addition, the invention also discloses a method for manufacturing the metallized ceramic structure and a magnetron comprising the metallized ceramic structure.
Description
Technical Field
The invention relates to the field of ceramic and metal brazing, in particular to a metalized ceramic structure for brazing, a manufacturing method thereof and a magnetron.
Background
In the related art, the cathode and the output assembly of the magnetron are mainly formed by brazing the alumina ceramic and the kovar alloy, and brazing filler metal needs to be manually placed when the alumina ceramic and the kovar alloy are assembled, so that poor welding is easily caused by human factors.
Disclosure of Invention
The present invention has been made to solve at least one of the problems occurring in the related art. To this end, the present invention provides a metallized ceramic structure for brazing, a method of manufacturing the same, and a magnetron.
A method of manufacturing a metallized ceramic structure for brazing according to an embodiment of the present invention includes:
carrying out metallization treatment on the body layer to sequentially form a molybdenum-manganese layer and a nickel layer on the surface of the body layer;
coating an alloy brazing filler metal for brazing with the melting point lower than that of the molybdenum-manganese layer and the nickel layer on the surface of the nickel layer to form a pre-brazing filler metal layer;
drying the pre-brazing filler metal layer;
and sintering the pre-brazing filler metal layer to form a brazing filler metal layer.
In the metallized ceramic structure for brazing and the magnetron including the metallized ceramic structure for brazing manufactured by the manufacturing method of the embodiment of the invention, since the metallized layer includes the brazing filler metal layer, when the metallized ceramic structure and the kovar alloy are brazed, manual placement of the brazing filler metal is not required, so that automatic assembly of the metallized ceramic structure and the kovar alloy can be realized, thereby reducing the influence of human factors in the assembly process, improving the stability of the welding process, and reducing the welding defective rate.
In some embodiments, the manufacturing method further comprises, before the step of subjecting the bulk layer to a metallization treatment to form a molybdenum-manganese layer and a nickel layer on the surface of the bulk layer in this order: and placing the body layer into a tunnel furnace for sintering, wherein the sintering temperature of the body layer in the tunnel furnace is in the range of 1500-1650 ℃.
In some embodiments, the manufacturing method further includes, in the step of subjecting the bulk layer to a metallization treatment to form a molybdenum-manganese layer and a nickel layer on the surface of the bulk layer in this order: coating molybdenum-manganese paste on the surface of the body layer by a screen printing method to form a pre-molybdenum-manganese layer, then placing the pre-molybdenum-manganese layer into a furnace with a reducing atmosphere to be sintered to form the molybdenum-manganese layer, and then plating nickel on the surface of the molybdenum-manganese layer to form the nickel layer.
In certain embodiments, the manufacturing method further includes, in the step of applying an alloy filler for brazing having a melting point lower than the molybdenum-manganese layer and the nickel layer on the surface of the nickel layer to form a pre-solder layer, the steps of: and positioning the plurality of body layers by using a tool fixture, and coating the alloy brazing filler metal on the nickel layer by using a screen printing method to form the pre-brazing filler metal layer.
In some embodiments, the manufacturing method further includes, in the step of drying the pre-solder layer, the steps of: and placing the pre-brazing filler metal layer into a muffle furnace with a reducing atmosphere for drying, wherein the temperature range for drying the pre-brazing filler metal layer is 200-300 ℃.
In some embodiments, the manufacturing method further includes, in the step of sintering the pre-solder layer to form a solder layer, the steps of: and placing the pre-brazing filler metal layer into a muffle furnace protected by reducing gas for sintering, wherein the sintering temperature of the pre-brazing filler metal layer is within the range of 700-850 ℃.
In certain embodiments, the reducing gas comprises hydrogen, the temperature at which the pre-solder layer is sintered ranges from 750 ℃ to 800 ℃, and the time for sintering the pre-solder layer ranges from 20min to 30 min.
In certain embodiments, the alloy solder comprises a silver-copper alloy material, and the copper in the silver-copper alloy material accounts for 27-29% of the mass of the silver-copper alloy material.
In certain embodiments, the thickness of the braze layer ranges from 1um to 60 um.
The metallized ceramic structure for brazing comprises a body layer and a metallized layer, wherein the metallized layer covers the surface of the body layer, the metallized layer is tightly combined with the body layer, the metallized layer comprises a molybdenum-manganese layer, a nickel layer and a brazing filler metal layer, the molybdenum-manganese layer is connected with the body layer and the nickel layer, the nickel layer is connected with the molybdenum-manganese layer and the brazing filler metal layer, the nickel layer is tightly combined with the molybdenum-manganese layer, the nickel layer is tightly combined with the brazing filler metal layer, the molybdenum-manganese layer separates the body layer and the nickel layer, the nickel layer separates the molybdenum-manganese layer and the brazing filler metal layer, and the brazing filler metal layer is made of alloy brazing filler metal with the melting point lower than that of the molybdenum-manganese layer and the nickel layer for brazing.
In the metalized ceramic structure for brazing in the embodiment of the invention, the metalized layer comprises the brazing filler metal layer, so that when the metalized ceramic structure and the kovar alloy are brazed, the brazing filler metal does not need to be placed manually, and the automatic assembly of the metalized ceramic structure and the kovar alloy can be realized, thereby reducing the influence of human factors in the assembly process, improving the stability of the welding process and reducing the welding reject ratio.
In certain embodiments, the solder layer is uniformly dispersed on the surface of the nickel layer.
In certain embodiments, the alloy solder comprises a silver-copper alloy material, and the copper in the silver-copper alloy material accounts for 27-29% of the mass of the silver-copper alloy material.
In certain embodiments, the thickness of the braze layer ranges from 1um to 60 um.
A magnetron according to an embodiment of the invention comprises a metallized ceramic structure for brazing as described in any of the embodiments above.
In the magnetron of the embodiment of the invention, because the metallization layer comprises the brazing filler metal layer, when the metallized ceramic structure and the kovar alloy are brazed, the brazing filler metal does not need to be placed manually, so that the automated assembly of the metallized ceramic structure and the kovar alloy can be realized, the influence of human factors in the assembly process can be reduced, the stability of a welding process is improved, and the welding reject ratio is reduced.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic cross-sectional view of a metallized ceramic structure according to an embodiment of the present invention.
FIG. 2 is another schematic cross-sectional view of a metallized ceramic structure in accordance with an embodiment of the present invention.
Description of the main element symbols:
a metallized ceramic structure 10;
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1 and 2 together, the manufacturing method of the present invention can be used for manufacturing a metallized ceramic structure 10 for brazing, and the manufacturing method includes:
step S12: performing metallization treatment on the body layer 11 to sequentially form a molybdenum-manganese layer 121 and a nickel layer 122 on the surface 111 of the body layer 11;
step S14: coating an alloy solder for brazing having a melting point lower than that of the molybdenum-manganese layer 121 and the nickel layer 122 on the surface of the nickel layer 122 to form a pre-solder layer;
step S16: drying the pre-brazing filler metal layer;
step S18 sinters the pre-solder layer to form solder layer 123.
In the manufacturing method according to the embodiment of the present invention, the "metallization" refers to the formation of a metal layer, such as the molybdenum-manganese layer 121 and the nickel layer 122, on the body layer 11, which is tightly bonded to the body layer 11.
The metallized ceramic structure 10 for brazing according to the embodiment of the present invention can be manufactured by the manufacturing method according to the embodiment of the present invention, and includes a body layer 11 and a metallized layer 12. A metallization layer 12 overlies the surface of the body layer 11. The metallization layer 12 is tightly bonded to the body layer 11. Metallization layer 12 includes a molybdenum manganese layer 121, a nickel layer 122, and a solder layer 123. The molybdenum-manganese layer 121 connects the body layer 11 and the nickel layer 122. The nickel layer 122 connects the molybdenum-manganese layer 121 and the solder layer 123. The nickel layer 122 is tightly bonded to the molybdenum-manganese layer 121. The nickel layer 122 is tightly bonded to the solder layer 123. The molybdenum manganese layer 121 separates the body layer 11 and the nickel layer 122. Nickel layer 122 separates molybdenum manganese layer 121 and solder layer 123. The brazing filler metal layer 123 is made of an alloy brazing filler metal for brazing having a melting point lower than that of the molybdenum-manganese layer 121 and the nickel layer 122.
The metallized ceramic structure 10 for brazing of the present embodiment may be used in a magnetron. Alternatively, the magnetron includes a metallized ceramic structure 10. It is noted that the cathode and output components of the magnetron may be brazed from the metallized ceramic structure 10 to the kovar alloy, wherein the magnetron may be used in a household appliance, such as in one example, a microwave oven.
In the metallized ceramic structure 10 for brazing and the magnetron including the metallized ceramic structure 10 manufactured by the manufacturing method of the embodiment of the invention, since the metallized layer 12 includes the brazing filler metal layer 123, when the metallized ceramic structure 10 is brazed with the kovar alloy, manual placement of the brazing filler metal is not required, so that automatic assembly of the metallized ceramic structure 10 and the kovar alloy can be realized, thereby reducing the influence of human factors in the assembly process, improving the stability of the welding process, and reducing the welding defective rate.
It should be noted that the structure of the metallized ceramic structure 10 is not particularly limited, and may be set according to practical applications. In some examples, the metallized ceramic structure 10 has a cylindrical or rectangular parallelepiped shape. Of course, the shape of the metallized ceramic structure 10 is not limited to the shapes listed above.
Meanwhile, the body layer 11 is mainly composed of an alumina material. A stable chemical bond can be formed between the bulk layer 11 and the metallization layer 12, so that the bulk layer 11 and the metallization layer 12 are tightly bonded. Stable chemical bonds can be formed between the nickel layer 122 and the molybdenum-manganese layer 121, so that the interaction force between the nickel layer 122 and the molybdenum-manganese layer 121 is larger, namely the bonding is tighter. Stable chemical bonds can be formed between nickel layer 122 and solder layer 123, so that the interaction force between nickel layer 122 and solder layer 123 is larger, i.e. the bonding is tighter.
The metallization layer 12 may cover the entire surface 111 of the body layer 11, or may cover a portion of the surface 111 of the body layer 11. For example, in the example shown in fig. 2, the metallization layer 12 overlies opposite surfaces 111a of the body layer 11. In this manner, the surface area of the metallized ceramic structure 10 that can be brazed is increased, which increases the utilization of the metallized ceramic structure 10.
Further, the brazing filler metal layer 123 is composed of an alloy brazing filler metal for brazing, wherein the melting point of the alloy brazing filler metal is lower than those of the molybdenum-manganese layer 121 and the nickel layer 122. Because the melting point of the alloy solder is low, the solder layer 123 formed by the alloy solder is easy to braze, and meanwhile, when the metallized ceramic structure 10 is brazed with kovar alloy, the molybdenum-manganese layer 121 and the nickel layer 122 can be guaranteed not to be influenced by temperature.
In some examples, the alloy filler metal includes an alloy material having a melting point lower than the melting points of the molybdenum manganese layer 121 and the nickel layer 122. Because the alloy solder comprises the alloy material, the solder layer 123 formed by the alloy solder has a lower melting point and better fluidity, so that the device formed by the metalized ceramic structure 10 and the kovar alloy through brazing can be ensured to have better air tightness, and the device formed by the metalized ceramic structure 10 and the kovar alloy through brazing can be used in a higher vacuum environment.
In addition, the structure of the solder layer 123 is not particularly limited and may be set according to circumstances. Preferably, the solder layer 123 is a layered structure. Therefore, the solder layer 123 is flat, which is beneficial to soldering, and meanwhile, the solder layer 123 has a large specific surface area, which improves the utilization rate of the alloy solder.
In some embodiments, step S12 is preceded by the following steps:
step S11: and placing the body layer 11 into a tunnel furnace for sintering. The sintering temperature in the tunnel furnace is in the range of 1500-1650 ℃.
Thus, sintering body layer 11 at 1500-1650 ℃ can remove not only trace impurities (e.g., small amounts of gas and organic matter in body layer 11) on body layer 11, but also voids between particles in body layer 11, thereby improving the mechanical strength and wear resistance of body layer 11.
In some examples, the temperature at which the body layer 11 is sintered in the tunnel furnace is 1500 ℃, 1550 ℃, 1580 ℃, 1600 ℃ or 1650 ℃ in step S11. It should be noted that the temperature at which the body layer 11 is sintered in the tunnel furnace is not limited to the values listed in the above examples. Meanwhile, the time for sintering the body layer 11 in the tunnel furnace may be set according to circumstances.
In some embodiments, step S12 further includes the following sub-steps:
step S121: a molybdenum-manganese paste is coated on the surface 111 of the body layer 11 by a screen printing method to form a pre-molybdenum-manganese layer, and then the pre-molybdenum-manganese layer is placed in a furnace of a reducing atmosphere to be sintered to form a molybdenum-manganese layer 121, and then the surface of the molybdenum-manganese layer 121 is plated with nickel to form a nickel layer 122.
Thus, the coating method through the screen printing method enables the formed pre-molybdenum-manganese layer to be uniform. Meanwhile, the sintering in the furnace with reducing atmosphere can prevent the pre-molybdenum-manganese layer from being oxidized, thereby ensuring the purity of the formed molybdenum-manganese layer 121.
The reducing atmosphere in the "furnace with reducing atmosphere" may be achieved by using reducing hydrogen, for example, in one example, the pre-molybdenum-manganese layer may be placed in a muffle furnace, and then flowing reducing hydrogen may be passed through the muffle furnace to ensure that the pre-molybdenum-manganese layer is sintered in the reducing atmosphere.
Meanwhile, a method of plating nickel on the surface of the molybdenum-manganese layer 121 may be selected according to circumstances, and the nickel layer 122 may be formed on the surface of the molybdenum-manganese layer 121 by, for example, electroplating nickel or electroless nickel plating.
In some embodiments, in step S121, the pre-mo-mn layer is placed in a furnace with a reducing atmosphere and sintered at a temperature ranging from 1400 ℃ to 1500 ℃.
Thus, the pre-mo-mn layer is sintered at 1400-1500 ℃ to remove not only trace impurities (e.g., organic substances in the pre-mo-mn layer) on the pre-mo-mn layer, but also voids between particles in the pre-mo-mn layer, and form stable chemical bonds between the bulk layer 11 and the mo-mn layer 121, thereby improving the structural stability of the finally formed mo-mn layer 121.
In some examples, the pre-mo-mn layer is placed in the furnace of the reducing atmosphere at 1400 ℃, 1420 ℃, 1450 ℃, 1480 ℃ or 1500 ℃ for sintering in step S121. The temperature at which the pre-molybdenum-manganese layer is sintered in the furnace in a reducing atmosphere is not limited to the values listed in the above examples. Meanwhile, the time for sintering the pre-molybdenum-manganese layer in a furnace with reducing atmosphere can be set according to specific conditions.
The temperature at which the pre-molybdenum-manganese layer is sintered in the furnace in a reducing atmosphere is set to a value less than or equal to the temperature at which the bulk layer 11 is sintered in the tunnel furnace. Thus, the influence of the overhigh sintering temperature on the pre-molybdenum manganese layer in the furnace with the reducing atmosphere on the structural stability of the body layer 11 can be avoided.
In some embodiments, step S14 further includes the following sub-steps:
step S141: the plurality of body layers 11 are positioned by a tool fixture, and then the alloy solder is coated on the nickel layer 122 by a screen printing method to form a pre-solder layer.
So, utilize frock clamp to fix a position a plurality of body layers 11 and can guarantee that a plurality of body layers 11's position is comparatively fixed to can realize carrying out alloy solder coating to a plurality of body layers 11 simultaneously, improve operating efficiency like this. Meanwhile, the formed pre-solder layer is relatively uniform by coating through a screen printing method.
It should be noted that the main function of the "tooling fixture" is to position the body layer 11. In step S141, a corresponding tool holder may be selected according to specific situations, and only the function of positioning the body layer 11 is required. In the embodiment of the present invention, after the body layer 11 is metallized to form the molybdenum-manganese layer 121 and the nickel layer 122 in this order on the surface 111 of the body layer 11, the plurality of body layers 11 are positioned by a jig.
In some examples, the thickness of the pre-solder layer ranges from 1um to 60 um. In this manner, the thickness of the pre-solder layer is moderate, which ensures that the solder layer 123 formed by sintering the pre-solder layer has a sufficient thickness for brazing.
In some embodiments, step S16 further includes the following sub-steps:
step S161: and (3) placing the pre-brazing filler metal layer into a muffle furnace with a reducing atmosphere for drying, wherein the temperature range for drying the pre-brazing filler metal layer is 200-300 ℃.
Thus, the pre-brazing filler metal layer is dried at the temperature of 200-300 ℃, so that impurities (such as organic matters) in the pre-brazing filler metal layer can be removed, and the structural stability of the pre-brazing filler metal layer can be improved to a certain extent. Meanwhile, the reducing atmosphere can prevent the pre-brazing filler metal layer from being oxidized.
The reducing atmosphere in the "reducing atmosphere muffle furnace" may be achieved by using a reducing hydrogen gas, for example, in one example, the pre-solder layer may be placed in a muffle furnace, and then the flowing reducing hydrogen gas may be passed through the muffle furnace to ensure that the pre-solder layer is dried in the reducing atmosphere.
Meanwhile, the time for drying the pre-brazing filler metal layer in the muffle furnace can be set according to specific conditions. For example, in some examples, in step S161, the pre-solder layer is dried in the muffle furnace for a time ranging from 6h to 9 h. Of course, the time for drying the pre-solder layer in the muffle furnace is not limited to the time range in the above example.
In some embodiments, step S18 further includes the following sub-steps:
step S181: and placing the pre-brazing filler metal layer into a muffle furnace protected by reducing gas for sintering, wherein the sintering temperature of the pre-brazing filler metal layer is within the range of 700-850 ℃.
Thus, sintering the pre-solder layer at a temperature of 700 ℃ to 850 ℃ can not only further remove impurities (e.g., organic substances) in the pre-solder layer, but also remove voids between particles in the pre-solder layer, and can form stable chemical bonds between the pre-solder layer and the nickel layer 122, thereby finally forming the solder layer 123 with a stable structure. Meanwhile, the reducing gas protection can prevent the pre-brazing filler metal layer from being oxidized.
In some embodiments, in step S181, the reducing gas includes hydrogen, and the temperature at which the pre-solder layer is sintered ranges from 750 ℃ to 800 ℃. Thus, the reducing effect of the reducing gas is better. Meanwhile, the sintering temperature range of 750-800 ℃ is moderate, so that the brazing filler metal layer 123 with a stable structure can be formed, and the performance of the brazing filler metal layer 123 cannot be influenced due to overhigh sintering temperature, such as deformation of the finally formed brazing filler metal layer 123. Also, moderate sintering temperatures ensure that the finally formed solder layer 123 is more uniformly dispersed.
In some examples, the temperature at which the pre-solder layer is sintered in step S181 is 750 ℃, 760 ℃, 780 ℃, or 800 ℃. It should be noted that the temperature for sintering the pre-solder layer is not limited to the values listed in the above examples.
It should be noted that the temperature at which the pre-solder layer is dried is lower than the temperature at which the pre-solder layer is sintered. This prevents the temperature at which the pre-solder layer is dried from being too high and affecting the structural stability of the finally formed solder layer 123. Meanwhile, the value of the sintering temperature at which the pre-solder layer is placed in the muffle furnace protected by the reducing gas in step S161 is smaller than the value of the sintering temperature at which the pre-molybdenum-manganese layer is placed in the furnace in the reducing atmosphere in step S121. In this way, it is possible to avoid the influence of the sintering temperature on the pre-solder layer in the reducing gas-shielded muffle furnace on the structural stability of the molybdenum-manganese layer 121 or the nickel layer 122.
In some embodiments, the time for sintering the pre-solder layer ranges from 20min to 30min in step S18. Therefore, the time for sintering the pre-brazing filler metal layer is moderate, so that the brazing filler metal layer 123 with a compact and stable structure can be formed, and the service performance of the brazing filler metal layer 123 cannot be influenced due to overlong sintering time, for example, the finally formed brazing filler metal layer 123 is deformed.
In some examples, the time for sintering the pre-solder layer is 20min, 22min, 25min, 27min, or 30 min. The time for sintering the pre-solder layer is not limited to the values listed in the above examples.
In certain embodiments, the alloy solder comprises a silver copper alloy material. The copper in the silver-copper alloy material accounts for 27-29% of the silver-copper alloy material by mass. Thus, the alloy solder has a lower melting point and better fluidity, so that the solder layer 123 has better wettability and stability, and a device formed by brazing the metallized ceramic structure 10 and the kovar alloy can have better air tightness. Meanwhile, the solder layer 123 is manufactured at a low cost.
In one example, the copper in the silver-copper alloy material is 28% by mass of the silver-copper alloy material. In some embodiments, the thickness of the solder layer 123 ranges from 1um to 60 um. Thus, the thickness of the solder layer 123 is moderate, so that the effectiveness of soldering using the solder layer 123 can be sufficiently ensured, and the waste of the alloy solder can be prevented.
In some embodiments, the thickness of solder layer 123 ranges from 10um to 45 um. The solder layer 123 has a preferred thickness that ensures that the metallized ceramic structure 10 has better performance everywhere after brazing to the kovar alloy.
In some examples, the thickness of the solder layer 123 is 10um, 15um, 20um, 25um, 28um, 30um, 35um, 40um, or 45 um. Note that the thickness of the solder layer 123 is not limited to the above-listed values.
In certain embodiments, in the metallized ceramic structure 10, the solder layer 123 is uniformly dispersed on the surface 1221 of the nickel layer 122.
Therefore, the brazing filler metal layer 123 is uniformly dispersed, so that brazing is facilitated, the consistency of the performance of the metallized ceramic structure 10 and the performance of the brazed kovar alloy can be guaranteed, and meanwhile, the brazing filler metal layer 123 has a large specific surface area, so that the utilization rate of the alloy brazing filler metal is improved.
In an embodiment of the present invention, in manufacturing a metallized ceramic structure 10 for brazing using the manufacturing method of an embodiment of the present invention, a pre-solder layer having a uniform thickness may be formed on the surface 1221 of the nickel layer 122, and then the pre-solder layer may be sintered at a moderate sintering temperature to form the solder layer 123 uniformly dispersed on the surface 1221 of the nickel layer 122. Where a moderate sintering temperature for sintering the pre-solder layer is a necessary condition for forming a uniform solder layer 123, reference may be made to the value of the sintering temperature for sintering the pre-solder layer in other embodiments, for example, the sintering temperature for sintering the pre-solder layer may be 750 ℃.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
In the description of the present specification, reference to the description of the terms "one embodiment", "some embodiments", "an illustrative embodiment", "an example", "a specific example", or "some examples", etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A method of making a metallized ceramic structure for brazing, comprising:
carrying out metallization treatment on the body layer to sequentially form a molybdenum-manganese layer and a nickel layer on the surface of the body layer;
coating an alloy brazing filler metal for brazing with the melting point lower than that of the molybdenum-manganese layer and the nickel layer on the surface of the nickel layer to form a pre-brazing filler metal layer;
drying the pre-brazing filler metal layer;
sintering the pre-brazing filler metal layer to form a brazing filler metal layer;
the manufacturing method also comprises the following steps in the step of drying the pre-brazing filler metal layer:
placing the pre-brazing filler metal layer into a muffle furnace with a reducing atmosphere for drying, wherein the temperature for drying the pre-brazing filler metal layer ranges from 200 ℃ to 300 ℃, and the temperature for drying the pre-brazing filler metal layer is lower than the temperature for sintering the pre-brazing filler metal layer;
the manufacturing method comprises the following steps before the step of carrying out metallization treatment on the body layer so as to form the molybdenum-manganese layer and the nickel layer on the surface of the body layer in sequence:
placing the body layer into a tunnel furnace for sintering, wherein the sintering temperature of the body layer in the tunnel furnace is within the range of 1500-1650 ℃;
the manufacturing method comprises the following steps of carrying out metallization treatment on the body layer so as to form the molybdenum-manganese layer and the nickel layer on the surface of the body layer in sequence:
coating molybdenum-manganese paste on the surface of the body layer by a screen printing method to form a pre-molybdenum-manganese layer, then placing the pre-molybdenum-manganese layer into a furnace with a reducing atmosphere to be sintered to form the molybdenum-manganese layer, and then plating nickel on the surface of the molybdenum-manganese layer to form the nickel layer;
placing the pre-molybdenum-manganese layer into a furnace with a reducing atmosphere for sintering at a temperature less than or equal to the temperature for sintering the body layer;
the manufacturing method further includes, in the step of sintering the pre-solder layer to form a solder layer, the steps of:
placing the pre-brazing filler metal layer into a muffle furnace protected by reducing gas for sintering;
wherein the sintering temperature of the pre-brazing filler metal layer is within the range of 750-800 ℃, so that the brazing filler metal layer is uniformly dispersed on the surface of the nickel layer;
and placing the pre-brazing filler metal layer into a muffle furnace protected by reducing gas for sintering, wherein the value of the sintering temperature is smaller than that of the sintering temperature of the pre-molybdenum-manganese layer placed into a furnace in reducing atmosphere.
2. The method of manufacturing a metallized ceramic structure for brazing as claimed in claim 1, further comprising the steps of, in the step of applying an alloy filler metal for brazing having a melting point lower than the molybdenum manganese layer and the nickel layer on the surface of the nickel layer to form a pre-brazing filler metal layer:
and positioning the plurality of body layers by using a tool fixture, and coating the alloy brazing filler metal on the nickel layer by using a screen printing method to form the pre-brazing filler metal layer.
3. The method of claim 1, wherein the reducing gas comprises hydrogen and the pre-braze layer is sintered for a time in a range of 20min to 30 min.
4. The method of manufacturing a metallized ceramic structure for brazing according to claim 1, wherein said alloy filler metal comprises a silver-copper alloy material, and copper in said silver-copper alloy material accounts for 27% to 29% by mass of said silver-copper alloy material.
5. The method of manufacturing a metallized ceramic structure for brazing as claimed in claim 1, wherein a thickness of said brazing filler metal layer ranges from 1um to 60 um.
6. A metallized ceramic structure for brazing is characterized by comprising a body layer and a metallization layer, wherein the metallization layer covers the surface of the body layer, the metallization layer is tightly combined with the body layer, the metallization layer comprises a molybdenum-manganese layer, a nickel layer and a brazing filler metal layer, the molybdenum-manganese layer is connected with the body layer and the nickel layer, the nickel layer is connected with the molybdenum-manganese layer and the brazing filler metal layer, the nickel layer is tightly combined with the molybdenum-manganese layer, the molybdenum-manganese layer separates the body layer and the nickel layer, the nickel layer separates the molybdenum-manganese layer and the brazing filler metal layer, the brazing filler metal layer is composed of an alloy brazing filler metal with a melting point lower than that of the molybdenum-manganese layer and the nickel layer for brazing, the brazing filler metal layer is formed by placing the brazing filler metal layer into a muffle furnace in a reducing atmosphere for drying and then sintering the brazing filler metal layer, the temperature range for drying the pre-brazing filler metal layer is 200-300 ℃, and the temperature for drying the pre-brazing filler metal layer is lower than the temperature for sintering the pre-brazing filler metal layer;
the body layer is formed by sintering in a tunnel furnace, and the sintering temperature of the body layer in the tunnel furnace is in the range of 1500-1650 ℃;
the molybdenum-manganese layer is formed by coating molybdenum-manganese paste on the surface of the body layer by a screen printing method to form a pre-molybdenum-manganese layer, and then placing the pre-molybdenum-manganese layer into a furnace with a reducing atmosphere for sintering;
placing the pre-molybdenum-manganese layer into a furnace with a reducing atmosphere for sintering at a temperature less than or equal to the temperature for sintering the body layer;
the brazing filler metal layer is formed by placing the pre-brazing filler metal layer into a muffle furnace protected by reducing gas for sintering;
wherein the sintering temperature of the pre-brazing filler metal layer is within the range of 750-800 ℃, so that the brazing filler metal layer is uniformly dispersed on the surface of the nickel layer;
and placing the pre-brazing filler metal layer into a muffle furnace protected by reducing gas for sintering, wherein the value of the sintering temperature is smaller than that of the sintering temperature of the pre-molybdenum-manganese layer placed into a furnace in reducing atmosphere.
7. The metallized ceramic structure for brazing as claimed in claim 6, wherein said alloy filler metal comprises a silver copper alloy material, and copper in said silver copper alloy material is present in a mass percent of from 27% to 29% of said silver copper alloy material.
8. The metallized ceramic structure for brazing as claimed in claim 6, wherein a thickness of said brazing filler metal layer ranges from 1um to 60 um.
9. A magnetron for use in brazing comprising a metallized ceramic structure according to any one of claims 6 to 8.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1225049A (en) * | 1996-07-24 | 1999-08-04 | 欧文斯科尔宁格公司 | Vacuum insulation vessels and methods of making same |
| CN105081622A (en) * | 2015-09-14 | 2015-11-25 | 沈阳飞机工业（集团）有限公司 | Method for manufacturing and pre-installing brazing filler material ring |
| CN105171172A (en) * | 2015-09-14 | 2015-12-23 | 沈阳飞机工业（集团）有限公司 | Brazing filler metal presetting method for guide pipe brazing connection piece |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3682552B2 (en) * | 1997-03-12 | 2005-08-10 | 同和鉱業株式会社 | Method for producing metal-ceramic composite substrate |
| AU2002218256A1 (en) * | 2000-10-24 | 2002-05-06 | Nanogate Technologies Gmbh | Soldering method for producing a ceramic-metal joint |
| JP2004142971A (en) * | 2002-10-22 | 2004-05-20 | Tokyo Gas Co Ltd | Process for joining ceramic material to stainless steel |
| CN102009240A (en) * | 2010-10-20 | 2011-04-13 | 北京科技大学 | Method for connecting AlN (aluminum nitride) ceramics and SiC/Al composite material respectively plated with thin-film metal layer on surface |
| CN102476955A (en) * | 2010-11-30 | 2012-05-30 | 鸿富锦精密工业（深圳）有限公司 | Method for connecting stainless steel with silicon nitride ceramics as well as connection piece manufactured by using method |
| CN104741808B (en) * | 2013-12-25 | 2016-09-14 | 北京有色金属研究总院 | A kind of Wp/ Al composite and Al2o3the welding method of pottery |
| JP6480806B2 (en) * | 2014-05-23 | 2019-03-13 | ゼネラル・エレクトリック・カンパニイ | Method for bonding ceramic and metal and sealing structure thereof |
-
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- 2017-04-24 CN CN201710271292.6A patent/CN107234309B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1225049A (en) * | 1996-07-24 | 1999-08-04 | 欧文斯科尔宁格公司 | Vacuum insulation vessels and methods of making same |
| CN105081622A (en) * | 2015-09-14 | 2015-11-25 | 沈阳飞机工业（集团）有限公司 | Method for manufacturing and pre-installing brazing filler material ring |
| CN105171172A (en) * | 2015-09-14 | 2015-12-23 | 沈阳飞机工业（集团）有限公司 | Brazing filler metal presetting method for guide pipe brazing connection piece |
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