CN107222980A - A kind of method of use soldering connection sensor and printed circuit board - Google Patents
A kind of method of use soldering connection sensor and printed circuit board Download PDFInfo
- Publication number
- CN107222980A CN107222980A CN201710570839.2A CN201710570839A CN107222980A CN 107222980 A CN107222980 A CN 107222980A CN 201710570839 A CN201710570839 A CN 201710570839A CN 107222980 A CN107222980 A CN 107222980A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- sensor
- conductive adhesive
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses the method for a kind of use soldering connection sensor and printed circuit board, pad is distributed with the printed circuit board, the printed circuit board is connected using soldering in the position of the pad with the sensor and conducted, other non-conducting areas for removing the pad are attached using non-conductive adhesive, are comprised the following steps：1）Cut non-conductive adhesive；2）Paste mould release membrance；3）Pre- patch；4）Precompressed；5）Hot pressing；6）Soldering.The present invention a kind of use soldering connection sensor and printed circuit board method can on the premise of properties of product are not influenceed space-consuming it is smaller, more frivolous, it is particularly suitable for use in mobile phone, Pad etc. consumer electronic product, and this method is easily achieved, it can be mass.
Description
Technical field
The invention belongs to printed circuit technique field, and in particular to one kind connects sensor and printed circuit board using soldering
Method.
Background technology
With the continuous progress of science and technology, the consumer electronics industry such as product such as mobile phone, Pad is developed rapidly, light to device
The requirement of thinning also more and more higher, and the pertinent literature being connected in the prior art with printed circuit board on sensor is less.
Chinese Application No. 201320300361.9, a kind of entitled " company of pcb board and thin film capacitor type touch sensor
Binding structure ", including printed circuit board and thin film capacitor type touch sensor, in addition to frame is rigidly fixed, thin film capacitor type is touched
Sensor is touched to be located in printed circuit board and rigidly fix between frame.But the patent is only applicable to thin film capacitor type touch sensing
Device, and in addition to thin film capacitor type touch sensor and printed circuit board, in addition it is also necessary to outside fixing device, it is unfavorable for the light of device
Thinning, it is soft board also not apply to printed circuit board（Such as FPC）Situation, be only applicable to hardboard, production cost also add in addition.
The content of the invention
In view of this, in order to overcome the defect of prior art, connected and passed using soldering it is an object of the invention to provide one kind
The method of sensor and printed circuit board, can on the premise of properties of product are not influenceed space-consuming it is smaller, more frivolous, the party
Method is easily achieved, and can be mass.
In order to achieve the above object, the present invention uses following technical scheme：
Pad is distributed with a kind of method of use soldering connection sensor and printed circuit board, the printed circuit board, it is described
Printed circuit board is connected using soldering in the position of the pad with the sensor and conducted, and other remove the non-of the pad
Conductive region is attached using non-conductive adhesive, is comprised the following steps：
1）Cut non-conductive adhesive：The non-conductive adhesive is cut according to the profile of the sensor；
2）Paste mould release membrance：The non-conductive adhesive after cutting is attached on mould release membrance；
3）Pre- patch：The non-conductive adhesive is alignd with the printed circuit board, the non-conductive adhesive does not post the one side of mould release membrance
It is attached in advance on the printed circuit board；
4）Precompressed：Non-conductive adhesive described in precompressed, the printed circuit board and the non-conductive adhesive are pasted；
5）Hot pressing：After the completion of precompressed, the mould release membrance of tearing is attached to institute in advance after the sensor is alignd with the non-conductive adhesive
State on non-conductive adhesive, then carry out hot pressing；
6）Soldering：After the completion of hot pressing, soldering is carried out at the pad so that the sensor is connected with the printed circuit board
Conducting.
Preferably, step 1）In, the region that the non-conductive adhesive corresponds to the pad is cut away, is that the soldering is pre-
Spacing.
Preferably, step 2）The non-conductive adhesive is attached on mould release membrance by middle use automatic placement machine or manual method.
Preferably, step 4）Described in the technique of precompressed be：At 70-150 DEG C, the printing of the non-conductive adhesive will be posted
Circuit board is placed in hot press, with 2-50kgf/cm2 pressure precompressed 10-500s.
Preferably, step 5）Described in the technique of hot pressing be：At 100-200 DEG C, with 2-50kgf/cm2 pressure pressure
10-500s。
Preferably, described non-conductive adhesive is hot-setting adhesive or UV glue.
Preferably, the step 6）In soldering operation can using method points tin cream for dispensing glue, print solder paste or spray tin, so
After carry out Reflow Soldering；Also can be by the way of spot welding and thermocompression bonding.
It is further preferred that the step 6）In soldering operation tin material need to be extended into the biography in the position of the pad
The state of the parcel of side wall formation half of sensor turns on the sensor and the printed circuit board preferably to weld.Described tin
Expect for tin cream, tin bar or block tin.
Preferably, the step also includes 7）Surface-assembled：After the sensor is Nian Jie with the printed circuit board, in institute
State the assembling processing that chip is carried out on printed circuit board or welded encapsulation processing.
Present invention also offers the method for another use soldering connection sensor and printed circuit board, the printed circuit
Pad is distributed with plate, the printed circuit board is connected using soldering in the position of the pad with the sensor and conducted,
Other non-conducting areas for removing the pad are attached using pressure sensitive adhesive, are comprised the following steps：
1）Cut pressure sensitive adhesive：The pressure sensitive adhesive is cut according to the profile of the sensor；
2）Paste mould release membrance：The pressure sensitive adhesive after cutting is attached on mould release membrance；
3）Pre- patch：The pressure sensitive adhesive is alignd with the printed circuit board, the one side that the pressure sensitive adhesive does not post mould release membrance is pasted in advance
On the printed circuit board；
4）Paste again：After the completion of pre- patch, the mould release membrance of tearing is attached to described in advance after the sensor is alignd with the pressure sensitive adhesive
On pressure sensitive adhesive；
5）Soldering：After the completion of pasting again, soldering is carried out at the pad so that the sensor is connected with the printed circuit board
Conducting.
Compared with prior art, the beneficial effects of the invention are as follows：The a kind of of the present invention connects sensor and print using soldering
The method of circuit board processed can space-consuming be smaller, more frivolous on the premise of properties of product are not influenceed, and be particularly suitable for use in hand
In machine, Pad etc. consumer electronic product, and this method is easily achieved, and can be mass.
Brief description of the drawings
Fig. 1 is the Making programme figure for connecting sensor and printed circuit board method in embodiment one using soldering；
Fig. 2 is the top view of printed circuit board in the present invention；
Fig. 3 is the top view of sensor in the present invention；
Fig. 4 is the side view after use scolding tin and non-conductive adhesive the connection sensor and printed circuit board of the present invention；
Fig. 5 is the top view of non-conductive adhesive in the present invention；
Fig. 6 is the Making programme figure for connecting sensor and printed circuit board method in embodiment two using soldering；
Fig. 7 is the side view of non-conductive adhesive in embodiment two；
In accompanying drawing：Printed circuit board -1, sensor -2, induction zone -21, pad -3, circuit -4, scolding tin -5, non-conductive adhesive -6, from
Type paper -7, mould release membrance -8.
Embodiment
The preferred embodiment of the present invention is described in detail below in conjunction with the accompanying drawings.
Embodiment one
Refer to Fig. 1 to Fig. 5, the method for a kind of use soldering connection sensor 2 and printed circuit board 1 of the present embodiment, sensing
Have to be distributed with pad 3, printed circuit board 1 and sensor 2 on induction zone 21, printed circuit board 1 on device 2 and all there is circuit 4.
Printed circuit board 1 is connected using soldering in the position of pad 3 with sensor 2 and conducted, and the non-conducting areas for removing pad 3 is used
Non-conductive adhesive 6 is attached, and is comprised the following steps：
Step S1：Cut non-conductive adhesive
Non-conductive adhesive 6 is cut according to the profile of sensor 2, the region that non-conductive adhesive 6 corresponds to correspondence pad 3 is cut away, is
The headspace of scolding tin 5.The size of single pad 3 is that the length of pad is 0.1-10mm, and width is 0.1-10mm.In the present embodiment
To that should have four pads 3 on each sensor 2, i.e., by four pads on the non-conductive adhesive 6 that the profile with sensor 2 matches
Region corresponding to 3 is cut away.
Step S2：Paste mould release membrance
Non-conductive adhesive 6 is attached on mould release membrance 8 using automatic placement machine or manual method.
Step S3：Pre- patch
Non-conductive adhesive 6 aligns with printed circuit board 1, and the one side that non-conductive adhesive 6 is not posted into mould release membrance 8 is attached to printed circuit board in advance
On 1.
Step S4：Precompressed
Precompressed non-conductive adhesive 6, printed circuit board 1 is pasted with non-conductive adhesive 6.Pre-pressing process is：At 70-150 DEG C, it will post
The printed circuit board 1 of non-conductive adhesive 6 is placed in hot press, with 2-50kgf/cm2Pressure precompressed 10-500s.
Step S5：Hot pressing
After the completion of precompressed, mould release membrance 8 of tearing is attached on non-conductive adhesive 6 after sensor 2 is alignd with non-conductive adhesive 6, then carried out
Hot pressing.The technique of hot pressing is：At 100-200 DEG C, with 2-50kgf/cm2Pressure pressure 10-500s.After the completion of hot pressing, sensing
Device 2 is bonded together with printed circuit board 1 by non-conductive adhesive 6.
Step S6：Soldering
After the completion of hot pressing, soldering is carried out at pad 3 so that sensor 2 is connected conducting with printed circuit board 1.Soldering operation can
Using method points tin cream for dispensing glue, print solder paste or spray tin, Reflow Soldering is then carried out；Also the side of spot welding and thermocompression bonding can be used
Formula.
Soldering operation need to extend to tin material in the position of pad 3 state of the parcel of side wall formation half of sensor 2 with more
Conducting sensor 2 and printed circuit board 1 are welded well.Tin material can be tin cream, tin bar or block tin, and tin cream can be high temperature tin cream or low
Warm tin cream.The tin material of presently commercially available tin bar, tin cream or block tin has pure tin and tin alloy, and tin alloy is divided into again terne metal and nothing
Terne metal.The present embodiment preferably uses lead-free tin alloy.
Step S7：Surface-assembled
After sensor 2 is Nian Jie with printed circuit board 1, assembling processing or the welded encapsulation of chip can be carried out on printed circuit board 1
Processing, as surface installation technique（SMT）.
Soldering operation is not limited only to be welded using tin material, as long as conducting sensor 2 and printed circuit board 1 can be connected
Other modes and material.Species and use thickness, the size of pad 3 of non-conductive adhesive 6 can be according to actual uses
Situation is adjusted.The non-conductive adhesive 6 of the present embodiment is hot-setting adhesive or UV glue.The thickness of scolding tin 5 and non-conductive adhesive 6 is 5-100um.
Printed circuit board 1 can be flexible PCB FPC.The quantity of pad 3 is 1-100, is determined according to the quantity of pad 3 on sensor 2
Fixed, pad 3 is 4 on the preferred sensor 2 of the present embodiment.
Embodiment two
Refer to Fig. 1 to Fig. 6, the method for a kind of use scolding tin 5 connection sensor 2 and printed circuit board 1 of the present embodiment, sensing
Have to be distributed with pad 3, printed circuit board 1 and sensor 2 on induction zone 21, printed circuit board 1 on device 2 and all there is circuit 4.
Printed circuit board 1 is connected using scolding tin 5 in the position of pad 3 with sensor 2 and conducted, and is removed the non-conducting areas of pad 3 and is made
It is attached with non-conductive adhesive 6, the non-conductive adhesive 6 of the present embodiment is pressure sensitive adhesive 6, is comprised the following steps：
Step S1：Cut pressure sensitive adhesive
Pressure sensitive adhesive 6 is cut according to the profile of sensor 2, the region of correspondence pad 3 is cut away, is the headspace of scolding tin 5.It is single
The size of pad 3 is that the length of pad is 0.1-10mm, and width is 0.1-10mm.Correspondence on each sensor 2 in the present embodiment
There are four pads 3, i.e., cut the region corresponding to four pads 3 on the pressure sensitive adhesive 6 that the profile with sensor 2 matches
Fall.
Step S2：Paste mould release membrance
Pressure sensitive adhesive 6 is attached in release liners 7 using automatic placement machine or manual method, then sticked again in the outside of release liners 7
Mould release membrance 8.
Step S3：Pre- patch
Pressure sensitive adhesive 6 is alignd with printed circuit board 1, and the one side that pressure sensitive adhesive 6 is not posted into mould release membrance 8 is attached on printed circuit board 1 in advance.
Step S4：Paste again
After the completion of pre- patch, tear mould release membrance 8 and release liners 7 are attached to after sensor 2 is alignd with pressure sensitive adhesive 6 on pressure sensitive adhesive 6,
Sensor 2 is bonded together with printed circuit board 1 by pressure sensitive adhesive 6.
Step S5：Soldering
After the completion of pasting again, soldering is carried out at pad 3 so that sensor 2 is connected conducting with printed circuit board 1.Soldering operation can
Using method points tin cream for dispensing glue, print solder paste or spray tin, Reflow Soldering is then carried out；Also the side of spot welding and thermocompression bonding can be used
Formula.
Soldering operation need to extend to tin material in the position of pad 3 state of the parcel of side wall formation half of sensor 2 with more
Conducting sensor 2 and printed circuit board 1 are welded well.Tin material can be tin cream, tin bar or block tin, and tin cream can be high temperature tin cream or low
Warm tin cream.The tin material of presently commercially available tin bar, tin cream or block tin has pure tin and tin alloy, and tin alloy is divided into again terne metal and nothing
Terne metal.The present embodiment preferably uses lead-free tin alloy.
Step S6：Surface-assembled
Sensor 2 is connected with printed circuit board 1 after conducting, and the assembling processing of chip can be carried out on printed circuit board 1 or is encapsulated
Soldering, as surface installation technique（SMT）.
Soldering operation is not limited only to be welded using tin material, as long as conducting sensor 2 and printed circuit board 1 can be connected
Other modes and material.The use thickness of scolding tin 5 and pressure sensitive adhesive 6, the size of pad 3 can be according to actual use feelings
Condition is adjusted.The quantity of pad 3 is 1-100, is determined according to the quantity of pad 3 on sensor 2, the preferred sensor of the present embodiment
Pad 3 is 4 on 2, and the thickness of scolding tin 5 and pressure sensitive adhesive 6 is 5-100um.
Printed circuit board can be alternatively flexible PCB FPC for PCB hardboards.Sensor has many kinds, and the present invention is applied to
The flat sensor of electronics industry, the flat sensor of such as pressure sensor, further to reduce the sky shared by product
Between.Sensor of the invention and the attachment structure of printed circuit board can space-consuming be more on the premise of properties of product are not influenceed
It is small, more frivolous, in the mobile phone that is particularly suitable for use in, Pad etc. consumer electronic product.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention, all according to the present invention
The equivalent change or modification that Spirit Essence is made, should all be included within the scope of the present invention.
Claims (10)
1. pad is distributed with a kind of method of use soldering connection sensor and printed circuit board, the printed circuit board, its
It is characterised by, the printed circuit board is connected using soldering in the position of the pad with the sensor and conducted, except described
The non-conducting areas of pad is attached using non-conductive adhesive, is comprised the following steps：
1）Cut non-conductive adhesive：The non-conductive adhesive is cut according to the profile of the sensor；
2）Paste mould release membrance：The non-conductive adhesive after cutting is attached on mould release membrance；
3）Pre- patch：The non-conductive adhesive is alignd with the printed circuit board, the non-conductive adhesive does not post the one side of mould release membrance
It is attached in advance on the printed circuit board；
4）Precompressed：Non-conductive adhesive described in precompressed, the printed circuit board and the non-conductive adhesive are pasted；
5）Hot pressing：After the completion of precompressed, the mould release membrance of tearing is attached to institute in advance after the sensor is alignd with the non-conductive adhesive
State on non-conductive adhesive, then carry out hot pressing；
6）Soldering：After the completion of hot pressing, soldering is carried out at the pad so that the sensor is connected with the printed circuit board
Conducting.
2. the method for a kind of use soldering connection sensor according to claim 1 and printed circuit board, it is characterised in that
Step 1）In, the region that the non-conductive adhesive corresponds to the pad is cut away, is the soldering headspace.
3. the method for a kind of use soldering connection sensor according to claim 1 and printed circuit board, it is characterised in that
Step 2）The non-conductive adhesive is attached on mould release membrance by middle use automatic placement machine or manual method.
4. the method for a kind of use soldering connection sensor according to claim 1 and printed circuit board, it is characterised in that
Step 4）Described in the technique of precompressed be：At 70-150 DEG C, the printed circuit board for posting the non-conductive adhesive is placed on heat
In press, with 2-50kgf/cm2Pressure precompressed 10-500s.
5. the method for a kind of use soldering connection sensor according to claim 1 and printed circuit board, it is characterised in that
Step 5）Described in the technique of hot pressing be：At 100-200 DEG C, with 2-50kgf/cm2Pressure pressure 10-500s.
6. the method for a kind of use soldering connection sensor according to claim 1 and printed circuit board, it is characterised in that
Described non-conductive adhesive is hot-setting adhesive or UV glue.
7. the method for a kind of use soldering connection sensor according to claim 1 and printed circuit board, it is characterised in that
The step 6）In soldering operation can using method points tin cream for dispensing glue, print solder paste or spray tin, then carry out Reflow Soldering；
Can be by the way of spot welding and thermocompression bonding.
8. the method for a kind of use soldering connection sensor according to claim 7 and printed circuit board, it is characterised in that
The step 6）In soldering operation the side wall formation half that tin material extend to the sensor need to be wrapped in the position of the pad
The state wrapped up in turns on the sensor and the printed circuit board preferably to weld.
9. the method for a kind of use soldering connection sensor according to claim 1 and printed circuit board, it is characterised in that
The step also includes 7）Surface-assembled：After the sensor is Nian Jie with the printed circuit board, on the printed circuit board
Carry out the assembling processing or welded encapsulation processing of chip.
10. pad is distributed with a kind of method of use soldering connection sensor and printed circuit board, the printed circuit board, its
It is characterised by, the printed circuit board is connected using soldering in the position of the pad with the sensor and conducted, and other are removed
Go to the non-conducting areas of the pad to be attached using pressure sensitive adhesive, comprise the following steps：
1）Cut pressure sensitive adhesive：The pressure sensitive adhesive is cut according to the profile of the sensor；
2）Paste mould release membrance：The pressure sensitive adhesive after cutting is attached on mould release membrance；
3）Pre- patch：The pressure sensitive adhesive is alignd with the printed circuit board, the one side that the pressure sensitive adhesive does not post mould release membrance is pasted in advance
On the printed circuit board；
4）Paste again：After the completion of pre- patch, the mould release membrance of tearing is attached to described in advance after the sensor is alignd with the pressure sensitive adhesive
On pressure sensitive adhesive；
5）Soldering：After the completion of pasting again, soldering is carried out at the pad so that the sensor is connected with the printed circuit board
Conducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710570839.2A CN107222980B (en) | 2017-07-13 | 2017-07-13 | Method for connecting sensor and printed circuit board by using soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710570839.2A CN107222980B (en) | 2017-07-13 | 2017-07-13 | Method for connecting sensor and printed circuit board by using soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107222980A true CN107222980A (en) | 2017-09-29 |
| CN107222980B CN107222980B (en) | 2023-09-08 |
Family
ID=59952302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710570839.2A Active CN107222980B (en) | 2017-07-13 | 2017-07-13 | Method for connecting sensor and printed circuit board by using soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107222980B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101835346A (en) * | 2010-04-24 | 2010-09-15 | 汕头超声印制板公司 | Nickel-gold electroplating process of PCB |
| WO2014040423A1 (en) * | 2012-09-11 | 2014-03-20 | 厦门锐迅达电子有限公司 | Surface mounting process of dies |
| US20140118967A1 (en) * | 2012-10-30 | 2014-05-01 | Samsung Electro-Mechanics Co., Ltd. | Sensor package for touch panel and method of manufacturing the same |
| CN105142332A (en) * | 2015-09-18 | 2015-12-09 | 刘炜 | Flexible circuit board possessing conductive reinforcement structure and processing technology thereof |
-
2017
- 2017-07-13 CN CN201710570839.2A patent/CN107222980B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101835346A (en) * | 2010-04-24 | 2010-09-15 | 汕头超声印制板公司 | Nickel-gold electroplating process of PCB |
| WO2014040423A1 (en) * | 2012-09-11 | 2014-03-20 | 厦门锐迅达电子有限公司 | Surface mounting process of dies |
| US20140118967A1 (en) * | 2012-10-30 | 2014-05-01 | Samsung Electro-Mechanics Co., Ltd. | Sensor package for touch panel and method of manufacturing the same |
| CN105142332A (en) * | 2015-09-18 | 2015-12-09 | 刘炜 | Flexible circuit board possessing conductive reinforcement structure and processing technology thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107222980B (en) | 2023-09-08 |
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