CN107567179B - A kind of surface mount method, flexible circuit board component and mobile terminal - Google Patents
A kind of surface mount method, flexible circuit board component and mobile terminal Download PDFInfo
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- CN107567179B CN107567179B CN201710744928.4A CN201710744928A CN107567179B CN 107567179 B CN107567179 B CN 107567179B CN 201710744928 A CN201710744928 A CN 201710744928A CN 107567179 B CN107567179 B CN 107567179B
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Abstract
The present embodiments relate to field of circuit boards more particularly to a kind of surface mount methods, flexible circuit board component and mobile terminal.This method is applied to the flexible circuit board component in flexible printed circuit whole board；Flexible circuit board component includes surface mount area；Flexible printed circuit whole board further includes useless plate region；Useless plate region includes the useless plate join domain around surface mount area；Useless plate join domain includes the first typesetting dowel connecting with surface mount area；Useless plate region further includes the second typesetting dowel connecting with the part for removing surface mount area in flexible circuit board component；This method comprises: useless plate join domain and stiffening plate are glued on the another side of apparent surface's pasting area；It is hollow between surface mount area and stiffening plate；Component is mounted in surface mount area；Remove the first typesetting dowel and the second typesetting dowel；Solve the problems, such as that existing surface mount process can additionally increase the thickness of component regional structure of flexible circuit board component.
Description
Technical field
The present embodiments relate to field of circuit boards more particularly to a kind of surface mount method, flexible circuit board component and
Mobile terminal.
Background technique
With the development of mobile terminal, the design of mobile terminal from original enoughization, it is practical turn to best quality,
The aggregate of the industrial design of reinforcementization and various function high concentration.To realize various functions, a movement
Several or even tens kinds of function inductors are integrated in terminal, it is extremely difficult that so much component is accommodated in the confined space
, therefore functional component is thinned, dwindle into the emphasis for design.
In the functional component manufacturing process of flexible circuit board component, many components are required through SMT (Surface
Mount Technology, surface mounting technology) it is mounted on flexible circuit board component.It is soft before SMT shown in referring to Fig.1
Property circuit board full page schematic diagram, flexible printed circuit whole board 1 include at least one flexible circuit board component 2, useless plate region 3 and
Gap 4；Wherein, flexible circuit board component 2 includes surface mount area 21, and surface mount area 21 includes component pad 211,
Component pad is used for welding component；Useless plate region 3 includes that typesetting dowel 31 (be not limited to shown in FIG. 1 everywhere) is used for
Connect useless plate region 3 and flexible circuit board component 2；Gap 4 is for separating flexible circuit board component 2 and useless plate region 3.
Referring to the schematic diagram of the flexible printed circuit whole board shown in Fig. 2 for mounting stiffening plate in the prior art, because of flexible electrical
The easy deformation of road plate component 2 needs the back in the surface mount area of flexible circuit board component 2 21 to guarantee the stability of SMT
Face mounts stiffening plate 6 by glue-line 5；In order to avoid increasing the area of flexible circuit board component, the size of above-mentioned stiffening plate 6 is general
It is corresponding with above-mentioned surface mount area 21.Referring to the signal of the flexible printed circuit whole board after SMT in the prior art shown in Fig. 3
Figure is provided by the glue-line 5 and stiffening plate 6 at the back side and reinforces supporting role, component 7 is welded on surface mount area 21.
Therefore, referring to the schematic diagram of flexible circuit board component after Fig. 4 and SMT in the prior art shown in fig. 5, including member
Device 7, flexible circuit board component 2, glue-line 5 and stiffening plate 6；Wherein the thickness of stiffening plate 6 generallys use 0.15mm or more thickness
Material, and glue-line 5 and stiffening plate 6 are difficult to remove.Therefore the yield of SMT is although improved by mounting stiffening plate, but can increased
Add the thickness of the component regional structure of flexible circuit board component.
Summary of the invention
The embodiment of the present invention provides a kind of surface mount method, can additionally increase flexible electrical to solve existing SMT technique
The problem of thickness of the component regional structure of road plate component.
In order to solve the above-mentioned technical problem, the present invention is implemented as follows: a kind of surface mount method, is applied to flexible electrical
Flexible circuit board component in the plate full page of road；The flexible circuit board component includes surface mount area；The flexible circuit board
Full page further includes useless plate region；The useless plate region includes useless plate join domain；The useless plate join domain surrounds the surface
Pasting area；The useless plate join domain includes the first typesetting dowel connecting with the surface mount area；The useless plate
Region further includes the second typesetting dowel；Except the surface is pasted in the second typesetting dowel and the flexible circuit board component
Fill the part connection in region；The described method includes:
On the another side of the relatively described surface mount area, the useless plate join domain and stiffening plate are glued；It is described
It is hollow between surface mount area and the stiffening plate；
Component is mounted in the surface mount area；
Remove the first typesetting dowel and the second typesetting dowel.
The embodiment of the invention also provides a kind of flexible circuit board component, the flexible circuit board component uses such as above-mentioned power
The surface mount method preparation of flexible circuit board component described in any one of benefit requirement.
The embodiment of the present invention is additionally provided with a kind of mobile terminal, and the mobile terminal includes such as institute in the claims
The flexible circuit board component stated.
In embodiments of the present invention, by the another side of relatively above-mentioned surface mount area, flexible circuit board is whole
The part of above-mentioned surface mount area is surrounded in the useless plate region of version, i.e., useless plate join domain and stiffening plate are glued；And above-mentioned table
It is hollow between face pasting area and above-mentioned stiffening plate；Then after Surface Mount Component, remove in above-mentioned useless plate region with
All typesetting dowels of above-mentioned flexible circuit board component connection, i.e., above-mentioned first typesetting dowel and the second typesetting dowel,
While then obtaining flexible circuit board component, glue-line and stiffening plate are eliminated.
Meanwhile in Surface Mount Component, because glue-line is very thin, above-mentioned stiffening plate still is able to be supplied to above-mentioned surface
Booster action of the pasting area perpendicular to above-mentioned surface mount area direction；Above-mentioned stiffening plate indirectly by with above-mentioned stiffening plate glue
First typesetting dowel of the useless plate join domain connect provides above-mentioned surface mount area and is parallel to above-mentioned surface mount area
The booster action in direction.
Therefore, the embodiment of the present invention, which solves existing SMT technique, can additionally increase the component of flexible circuit board component
The problem of thickness of regional structure, provides surplus for the industrial design of mobile terminal and the layout of various functional components.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by institute in the description to the embodiment of the present invention
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without any creative labor, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the schematic diagram of the flexible printed circuit whole board before SMT；
Fig. 2 is the schematic diagram for mounting the flexible printed circuit whole board of stiffening plate in the prior art；
Fig. 3 is the schematic diagram of the flexible printed circuit whole board after SMT in the prior art；
Fig. 4 is the schematic diagram of flexible circuit board component after SMT in the prior art；
Fig. 5 is the side schematic view of flexible circuit board component after SMT in the prior art；
Fig. 6 is the schematic diagram of the flexible printed circuit whole board of the attachment stiffening plate of embodiment of the present invention method one；
Fig. 7 is a kind of flow chart of surface mount method and step of embodiment of the present invention method one；
Fig. 8 is the side schematic view of the flexible printed circuit whole board of the attachment stiffening plate of embodiment of the present invention method one；
Fig. 9 is the side schematic view of the flexible printed circuit whole board after the SMT of embodiment of the present invention method one；
Figure 10 is the schematic diagram of the flexible circuit board component after the SMT of embodiment of the present invention method one；
Figure 11 is a kind of process of the surface mount method and step of flexible circuit board component of embodiment of the present invention method two
Figure；
Figure 12 is the schematic diagram of the flexible printed circuit whole board of the attachment stiffening plate of embodiment of the present invention method two；
Figure 13 is the schematic diagram of the flexible printed circuit whole board after the SMT of embodiment of the present invention method two.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Embodiment of the method one
Referring to the schematic diagram for the flexible printed circuit whole board for mounting stiffening plate in the embodiment of the present invention shown in fig. 6, flexible electrical
Road plate full page 1 includes at least one flexible circuit board component 2, useless plate region 3 and gap 4；Wherein, flexible circuit board component 2
Including surface mount area 21, surface mount area 21 includes component pad 211, and component pad is used for welding component；
Useless plate region 3 includes useless plate join domain 30；Useless plate join domain 30 surrounds above-mentioned surface mount area 21；Useless plate join domain
30 include the first typesetting dowel 32 connecting with surface mount area 21；Useless plate region 3 further includes the second typesetting dowel 33；
Second typesetting dowel 33 is connect with the part for removing surface mount area 21 in flexible circuit board component 2；Gap 4 is used for will be flexible
Circuit board component 2 and useless plate region 3 separate.The embodiment of the present invention is not limited to the application scenarios of above-mentioned flexible circuit board component.
Referring to shown in Fig. 7, the embodiment of the invention provides a kind of surface mount methods, are applied in flexible printed circuit whole board
Flexible circuit board component；Above-mentioned flexible circuit board component includes surface mount area；Above-mentioned flexible printed circuit whole board further includes
Useless plate region；Above-mentioned useless plate region includes useless plate join domain；Above-mentioned useless plate join domain surrounds above-mentioned surface mount area；On
Stating useless plate join domain includes the first typesetting dowel connecting with above-mentioned surface mount area；Above-mentioned useless plate region further includes
Two typesetting dowels；The part of above-mentioned surface mount area is removed in above-mentioned second typesetting dowel and above-mentioned flexible circuit board component
Connection；The above method can specifically include step 701-703:
Step 701: on the another side of relatively above-mentioned surface mount area, by above-mentioned useless plate join domain and stiffening plate glue
It connects；It is hollow between above-mentioned surface mount area and above-mentioned stiffening plate.
In order to make full use of equipment and overhead cost, generally on one piece of flexible printed circuit whole board array distribution it is multiple
Flexible circuit board component is prepared with carrying out lot-size；Each flexible circuit board component is connected to flexibility by typesetting dowel
In circuit board full page, convenient for each flexible circuit board component disposed of in its entirety and transport etc..
Shown in referring to Fig.1 before SMT flexible printed circuit whole board schematic diagram, can deserve to be called and state surface mount area 21
One side be front, the another side of the surface mount area 21 of above-mentioned relative flexibility circuit board component 2 is the back side.Mount stiffening plate
Process carried out at the back side of above-mentioned flexible printed circuit whole board 1, and the process of Surface Mount Component is in above-mentioned flexible circuit board
The front of full page 1 carries out.
Referring to the schematic diagram for the flexible printed circuit whole board for mounting stiffening plate in the embodiment of the present invention shown in fig. 6, on surface
On the another side of pasting area 21, useless plate join domain 30 is glued with stiffening plate 6, in the back view of corresponding diagram 6 in stiffening plate 6
Dash area；And it is hollow between stiffening plate 6 and surface mount area 21, glue-line is not present.
Likewise it is possible to referring to the side for the flexible printed circuit whole board for mounting stiffening plate in the embodiment of the present invention shown in Fig. 8
Face schematic diagram is glued between a part and flexible printed circuit whole board 1 of stiffening plate 6 by glue-line 5, and another part and flexible electrical
Road plate full page 1 corresponds to then hollow between the part of surface mount area, formation bridge-like structure.
It is understood that the embodiment of the present invention be not required for the whole region of above-mentioned useless plate join domain 30 all with reinforcement
Plate 6 is glued.
In addition, referring to shown in Fig. 6, the useless plate join domain 30 in the useless plate region 3 of above-mentioned flexible printed circuit whole board 1 with it is above-mentioned
The first typesetting dowel 32 at least two that surface mount area 21 connects, this is also the design for meeting flexible printed circuit whole board
It is required that.Generally, above-mentioned first typesetting dowel 32 can more be evenly distributed in the surrounding of above-mentioned surface mount area 21,
Convenient for above-mentioned stiffening plate 6 indirectly by the useless plate join domain 30 being glued with above-mentioned stiffening plate 6, connected by above-mentioned first typesetting
Muscle 32 provides above-mentioned surface mount area 21 booster action for being parallel to above-mentioned surface mount area direction, so that pasting on surface
When filling component, above-mentioned surface mount area is able to maintain indeformable and planarization, improves the yield of SMT.
Optionally, above-mentioned stiffening plate 6 can be at least one of the following:
Polyimide plate, epoxy plate, stainless steel plate, aluminium sheet.
Wherein, epoxy plate is properly termed as epoxy glass fiber plate, has high machinery and dielectric properties, and preferable resistance to
Hot and moisture resistivity.Polyimide plate equally has that excellent in mechanical performance, good stability of the dimension, thermal expansion coefficient be small, high insulation
Etc. advantages.Because stiffening plate 6 needs to be that above-mentioned surface mount area 21 provides reinforcement during SMT in the embodiment of the present invention,
Therefore the features such as needing excellent in mechanical performance, be unlikely to deform；Because may relate to the high temperature such as drying, welding during SMT
Process, therefore requirement is equally existed to the high-temperature behavior of stiffening plate.
The thickness of above-mentioned stainless steel plate can be 0.15mm；The thickness of epoxy plate can be 0.20mm；Polyimide plate
Thickness can be 0.30mm.Certainly, the embodiment of the present invention is not limited to the thickness of above-mentioned stiffening plate.
Optionally, above-mentioned glue is thermosetting property double-sided adhesive.
Further, above-mentioned steps 701 may include: to attach thermosetting property on the another side of relatively useless plate join domain 30
Double-sided adhesive；By 6 hot pressing of useless plate join domain 30 and above-mentioned stiffening plate.Further, the mode of above-mentioned hot pressing can be heat
The mode of rolling.
Above-mentioned thermosetting property double-sided adhesive shows as the characteristic of softening flowing when being presented as initial heating, heat to a certain extent,
Chemical reaction is then generated, is hardened such as crosslinking curing；Therefore it needs to be glued by the way of hot pressing.In addition, because SMT
The pyroprocess that may relate in the process, above-mentioned thermosetting property double-sided adhesive heat again with after being heating and curing, are difficult to the stream that softens
Dynamic characteristic, therefore be suitable for as glue used in above-mentioned Bonding Process.
Step 702: mounting component in above-mentioned surface mount area.
Referring to the side schematic view of the flexible printed circuit whole board after SMT in the embodiment of the present invention shown in Fig. 9, in flexible electrical
The surface mount area of the flexible circuit board component of road plate full page 1 mounts component 7.
Optionally, referring to shown in Fig. 6, above-mentioned surface mount area 21 includes component pad 211, above-mentioned on above-mentioned surface
The step of attachment component of pasting area 21 includes: in above-mentioned surface mount area 21, by above-mentioned component and above-mentioned component
Pad 211 welds.
Generally, the surface mount area 21 that soldering paste is bitten flexible circuit board component 2 by screen printer can be first passed through
On component pad 211, prepare for the welding of component；Then component is mounted on by surface mount area by chip mounter
21；Above-mentioned soldering paste is dried by curing oven；Above-mentioned soldering paste is melted by welders such as reflow solderings again, so that above-mentioned member
Device and the component pad 211 of above-mentioned surface mount area 21 securely weld；The processes such as finally cleaned, detected.
There is largely location hole corresponding with each flexible circuit board component 2 on above-mentioned flexible printed circuit whole board 1, is used for surface
Positioning when attachment.
Further, above-mentioned the step of above-mentioned surface mount area 21 mounts component further include: to use gluing process
Above-mentioned component is fixed on above-mentioned surface mount area 21.In the embodiment of the present invention, it can lead to after above-mentioned detection process
It crosses dispenser and above-mentioned component is fixed on by above-mentioned surface mount area using gluing process, play the work of fixed encapsulation, insulation
With the reliability that raising component is connect with above-mentioned flexible circuit board component.
Step 703: the above-mentioned first typesetting dowel of removal and the second typesetting dowel.
In embodiments of the present invention, all rows connecting in above-mentioned useless plate region 3 with above-mentioned flexible circuit board component 2 are removed
Version dowel does not singly include the first typesetting dowel that above-mentioned useless plate join domain 30 is connect with above-mentioned surface mount area 21
32, it further include the second typesetting dowel 33.
Because above-mentioned flexible circuit board component 2 only by the first typesetting dowel 32 and the second typesetting dowel 33 with it is above-mentioned
Flexible printed circuit whole board 1 connects, and above-mentioned flexible circuit board component 2 and above-mentioned stiffening plate 6 are indirectly by above-mentioned useless plate and connect
The connection of region 30 is connect, there is no directly connect with above-mentioned stiffening plate 6；Above-mentioned flexible circuit board component 2 and above-mentioned useless plate simultaneously
Join domain 30 is connected by above-mentioned first typesetting dowel 32.Therefore referring to Fig.1 in the embodiment of the present invention shown in 0
The schematic diagram of flexible circuit board component after SMT, after above-mentioned steps 703, above-mentioned flexible circuit board component 2 just with it is above-mentioned soft
Property circuit board full page 1 be completely separated, while also there is no connections with above-mentioned stiffening plate 6, and glue-line 5 is also not present, therefore above-mentioned soft
Property circuit board component 2 increases only above-mentioned component 7, therefore the component region of above-mentioned flexible circuit board component 2 after SMT
There is no the additional thickness for increasing glue-line 5 and stiffening plate 6 on thickness for structure.
Therefore, the embodiment of the present invention, which solves existing SMT technique, can additionally increase the component of flexible circuit board component
The problem of thickness of regional structure, provides surplus for the industrial design of mobile terminal and the layout of various functional components.
Embodiment of the method two
Referring to Fig.1 shown in 1, the embodiment of the invention provides a kind of surface mount methods, are applied to flexible printed circuit whole board
In flexible circuit board component；Above-mentioned flexible circuit board component includes surface mount area；Above-mentioned flexible printed circuit whole board also wraps
Include useless plate region；Above-mentioned useless plate region includes useless plate join domain；Above-mentioned useless plate join domain surrounds above-mentioned surface mount area；
Above-mentioned useless plate join domain includes the first typesetting dowel connecting with above-mentioned surface mount area；Above-mentioned useless plate region further includes
Second typesetting dowel；The portion of above-mentioned surface mount area is removed in above-mentioned second typesetting dowel and above-mentioned flexible circuit board component
Divide connection；The above method can specifically include step 1101-1103:
Step 1101: on the another side of relatively above-mentioned surface mount area, by above-mentioned first typesetting dowel and reinforcement
Plate is glued；It is hollow between above-mentioned surface mount area and above-mentioned stiffening plate.
The schematic diagram for mounting the flexible printed circuit whole board of stiffening plate in the embodiment of the present invention shown in 2 referring to Fig.1, opposite
On the back side of the surface mount area 21 of flexible circuit board component 2, by above-mentioned useless plate region 3 with above-mentioned surface mount area 21
The the first typesetting dowel 32 and above-mentioned stiffening plate 6 of connection are glued；It is hollow between surface mount area 21 and stiffening plate 6.
It is understood that the glue-line 5 between stiffening plate 6 and flexible printed circuit whole board 1 exists only in stiffening plate 6 and first
Dash area between typesetting dowel 32, i.e., in the back view of corresponding diagram 12 in stiffening plate 6；And stiffening plate 6 and above-mentioned surface
It is hollow between pasting area 21, glue-line is not present.
Above-mentioned stiffening plate 6 is indirectly by the first typesetting dowel 32 being glued with above-mentioned stiffening plate 6, to above-mentioned surface mount
Region 21 provides the booster action for being parallel to above-mentioned surface mount area direction, so that in Surface Mount Component, above-mentioned table
Face pasting area is able to maintain indeformable and planarization, improves the yield of SMT.
Step 1102: mounting component in above-mentioned surface mount area.
The schematic diagram of flexible printed circuit whole board in the embodiment of the present invention shown in 3 after SMT referring to Fig.1, in flexible circuit
The surface mount area 21 of the flexible circuit board component 2 of plate full page 1 mounts component 7.
Step 1103: above-mentioned first typesetting dowel and the second typesetting dowel are punched using punch die.
It in embodiments of the present invention, can be by the mold that is mounted on press machine to useless in flexible printed circuit whole board 1
All typesetting dowels connecting in plate region 3 with above-mentioned flexible circuit board component 2 apply pressure, make itself and above-mentioned flexible circuit
Plate component 2 separates, to obtain the flexible circuit board component 2 isolated with above-mentioned flexible printed circuit whole board 1.
Optionally, the size of above-mentioned stiffening plate 6 is corresponding with reinforced region；Above-mentioned reinforced region is in above-mentioned useless plate region 3
The whole region that the first typesetting dowel 32 connecting with above-mentioned surface mount area 21 and above-mentioned surface mount area 21 are formed.
In embodiments of the present invention, because preventing from the deformation of surface mount area 21, it being made to keep smooth pulling force to be by upper
The offer of the first typesetting dowel 32 is stated, therefore in the case where no booster action for weakening stiffening plate 6, it is possible to reduce reinforce
The materials'use amount of plate 6；Meanwhile the first typesetting connecting in being punched useless plate region 3 with above-mentioned flexible circuit board component 2 connects
After connecing muscle 32 and the second typesetting dowel 33, convenient for obtaining the finished product of last flexible circuit board component；Further, it is also possible to improve
The reliability of SMT technique.
Further, there are etching lines 34 for above-mentioned stiffening plate 6；Above-mentioned first typesetting dowel 32 and above-mentioned surface mount area
The interconnecting piece in domain 21, it is corresponding with above-mentioned etching line 34.
Because compared with the prior art, being punched the first typesetting dowel 32 in the embodiment of the present invention to connect with the second typesetting
When muscle 33, while to be also punched part stiffening plate corresponding with the first typesetting dowel 32 in stiffening plate 6.Therefore add above-mentioned
Above-mentioned typesetting dowel 32 region corresponding with the interconnecting piece of above-mentioned surface mount area 21 in strong plate 6, passes through chemical attack, object
Etching line 34 is arranged in the modes such as reason punching press in advance, convenient for punching.It is understood that before above-mentioned steps 1101, it is above-mentioned to add
Strong plate 6 is already provided with above-mentioned etching line 34.
Therefore, the embodiment of the present invention, which solves existing SMT technique, can additionally increase the component of flexible circuit board component
The problem of thickness of regional structure, provides surplus for the industrial design of mobile terminal and the layout of various functional components；It protects simultaneously
The indeformable and planarization for having demonstrate,proved the above-mentioned surface mount area in Surface Mount Component, improves the good of surface mount process
Rate；Furthermore, it is possible to it is corresponding with above-mentioned reinforced region by the size that above-mentioned stiffening plate is arranged, reduce the use for reinforcing plate material
Convenient for obtaining the finished product of last flexible circuit board component, and the reliability of SMT technique can be improved in amount.
The embodiment of the invention also provides a kind of flexible circuit board component, above-mentioned flexible circuit board component is used as above-mentioned
It is prepared by the surface mount method of flexible circuit board component.Flexible circuit board component provided in an embodiment of the present invention is relative to existing
Flexible circuit board component, it is smaller in the thickness of component regional structure, it can be the industrial design and various functions of mobile terminal
The layout of component provides surplus.
The embodiment of the present invention is additionally provided with a kind of mobile terminal, and the mobile terminal includes such as above-mentioned flexible circuit board
Component.Mobile terminal provided in an embodiment of the present invention can accommodate more functional components, provide richer service content.
Those of ordinary skill in the art may be aware that the embodiment in conjunction with disclosed in the embodiment of the present invention describe it is each
Exemplary method and step can be realized with the combination of electronic hardware or computer software and electronic hardware.These functions are studied carefully
Unexpectedly it is implemented in hardware or software, the specific application and design constraint depending on technical solution.Professional technique people
Member can use different methods to achieve the described function each specific application, but this realization is it is not considered that super
The scope of the present invention out.
In embodiment provided herein, it should be understood that disclosed device and method can pass through others
Mode is realized.For example, embodiment of the method described above is only schematical.For embodiment of the method, in order to simply retouch
It states, therefore, it is stated as a series of action combinations, but those skilled in the art should understand that, the embodiment of the present invention is not
It is limited by described sequence of movement, because according to an embodiment of the present invention, certain steps can be sequentially or same using other
Shi Jinhang.Secondly, those skilled in the art should also know that, the embodiments described in the specification are all preferred embodiments,
The actions involved are not necessarily necessary for embodiments of the present invention.
It is above above-mentioned, only a specific embodiment of the invention, but scope of protection of the present invention is not limited thereto, and it is any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (9)
1. a kind of surface mount method, applied to the flexible circuit board component in flexible printed circuit whole board；The flexible circuit board
Component includes surface mount area；The flexible printed circuit whole board further includes useless plate region；The useless plate region includes that useless plate connects
Connect region；The useless plate join domain surrounds the surface mount area；The useless plate join domain includes pasting with the surface
Fill the first typesetting dowel of region connection；The useless plate region further includes the second typesetting dowel；The second typesetting connection
Muscle is connect with the part for removing the surface mount area in the flexible circuit board component；It is characterised by comprising:
On the another side of the relatively described surface mount area, the useless plate join domain and stiffening plate are glued；The surface
It is hollow between pasting area and the stiffening plate；
Component is mounted in the surface mount area；
Remove the first typesetting dowel and the second typesetting dowel.
2. the method according to claim 1, wherein the another side in the relatively described surface mount area
On, include: by the step of useless plate join domain and stiffening plate splicing
On the another side of the relatively described surface mount area, the first typesetting dowel and the stiffening plate are glued.
3. according to the method described in claim 2, it is characterized in that, the size of the stiffening plate is corresponding with reinforced region；It is described
Reinforced region is the first typesetting dowel and the whole region that the surface mount area is formed.
4. according to the method described in claim 3, it is characterized in that, the stiffening plate there are etching lines；First typesetting connects
The interconnecting piece for connecing muscle and the surface mount area, it is corresponding with the etching line.
5. according to claim 1 to any method in 4, which is characterized in that removal the first typesetting dowel
Include: with the step of the second typesetting dowel
The first typesetting dowel and the second typesetting dowel are punched using punch die.
6. the method according to claim 1, wherein the stiffening plate is at least one of the following:
Polyimide plate, epoxy plate, stainless steel plate, aluminium sheet.
7. described the method according to claim 1, wherein the surface mount area includes component pad
Include: in the step of surface mount area mounts component
In the surface mount area, by the component and the component pad solder.
8. a kind of flexible circuit board component, which is characterized in that the flexible circuit board component is used as any in claim 1-7
Surface mount method preparation described in.
9. a kind of mobile terminal, which is characterized in that the mobile terminal includes flexible circuit board portion as claimed in claim 8
Part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710744928.4A CN107567179B (en) | 2017-08-25 | 2017-08-25 | A kind of surface mount method, flexible circuit board component and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710744928.4A CN107567179B (en) | 2017-08-25 | 2017-08-25 | A kind of surface mount method, flexible circuit board component and mobile terminal |
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| Publication Number | Publication Date |
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| CN107567179A CN107567179A (en) | 2018-01-09 |
| CN107567179B true CN107567179B (en) | 2019-09-27 |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6464389A (en) * | 1987-09-04 | 1989-03-10 | Matsushita Electric Ind Co Ltd | Flexible printed-circuit board |
| JPH08153938A (en) * | 1994-11-29 | 1996-06-11 | Toshiba Corp | Flexible printed board |
| JP2006203118A (en) * | 2005-01-24 | 2006-08-03 | Sumitomo Bakelite Co Ltd | Flexible printed wiring board |
| TWM395328U (en) * | 2010-08-25 | 2010-12-21 | Flexium Interconnect Inc | Flexible printed circuit board capable of increasing utilization of surface mounting process |
| JP6003675B2 (en) * | 2013-01-25 | 2016-10-05 | 旭硝子株式会社 | Substrate peeling device and peeling method and manufacturing method of electronic device |
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2017
- 2017-08-25 CN CN201710744928.4A patent/CN107567179B/en active Active
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| CN107567179A (en) | 2018-01-09 |
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